JP2008168465A - Minute molding mold and its manufacturing method - Google Patents

Minute molding mold and its manufacturing method Download PDF

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JP2008168465A
JP2008168465A JP2007001826A JP2007001826A JP2008168465A JP 2008168465 A JP2008168465 A JP 2008168465A JP 2007001826 A JP2007001826 A JP 2007001826A JP 2007001826 A JP2007001826 A JP 2007001826A JP 2008168465 A JP2008168465 A JP 2008168465A
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light
surface
substrate
shielding
molding
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Atsuo Hattori
敦夫 服部
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Yamaha Corp
ヤマハ株式会社
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Abstract

Disclosed are a highly durable fine mold and a method for manufacturing the same.
A translucent substrate that forms part of a molding surface that is in close contact with a photosensitive molding target film and a convex portion of the molding surface, and a bonding surface with the translucent substrate is the molding surface. And a light-shielding convex portion 103 located at a depth equal to or greater than the bottom portion of the molding surface closest to the back surface. The light-shielding convex portion 103 is preferably selected from a material having a higher hardness than the light-transmitting substrate 100.
[Selection] Figure 1

Description

  The present invention relates to a fine mold and a method for manufacturing the same.

Conventionally, an imprint technique and a hot embossing technique using a photocurable resin as a film to be molded are known. When the film to be formed is exposed and cured from the back surface of the mold, a translucent material is selected for the mold. In the imprint technique, the shape of the molding surface of the mold is transferred to the molding target film by curing the molding target film in a state where the molding surface of the mold is pressure-bonded to the molding target film formed on the surface of the substrate. In order to mold an object having a through hole, a step of penetrating the concave portion of the molding target film to the substrate by etching the molding target film after releasing is necessary. In Patent Document 1, a light-shielding film is formed on the surface layer of the convex portion of the mold, and the concave region formed by pressure bonding of the mold is not exposed to the molding target film made of a photocurable resin, and molding is performed without etching. A method is described that can penetrate the recesses of the target film. The thickness of the light shielding film is about 100 nm to 5000 nm with respect to the convex portion having a height of 2 μm.
JP 2004-304097 A

  However, according to the method described in Patent Document 1, when a hard foreign matter enters the surface or inside of the film to be molded, the convex portion of the mold is deformed, the thin light-shielding film is damaged, and light is emitted from the damaged region. There is a problem that the shape of the molded product changes due to leakage.

  This invention is made | formed in view of the said problem, Comprising: It aims at providing a highly durable fine mold and its manufacturing method.

(1) A fine molding mold for achieving the above object comprises a translucent substrate that constitutes a part of a molding surface that is in close contact with a photosensitive molding target film, and a convex portion of the molding surface. The light-shielding convex part located in the depth more than the bottom part of the said molding surface nearest to the surface on the back side of the said molding surface is provided.
In the present specification, the front and back surfaces indicate a relative positional relationship, and the term “back surface” means the surface on the back side of the surface called “front surface”. The depth is a distance measured from the reference surface toward the back surface. Further, the translucency means a property of transmitting light having a wavelength used for exposure of the photosensitive molding target film, and the light shielding property means a property of shielding light having a wavelength used for exposure of the photosensitive molded body serosa. .

  According to this micro-molding mold, the light-shielding convex portion is not a thin film with respect to the convex portion like a conventional light-shielding film, but is in a bulk shape. Light does not leak easily from inside the pattern. That is, this fine mold has high durability and can reduce the rate of occurrence of defective molding.

(2) In the fine mold for achieving the above object, the joining surface may be located at a deeper depth than the bottom of the molding surface.
When the joint surface between the light-transmitting substrate and the light-shielding convex portion is at a deeper position of the light-transmissive substrate than the depth of the bottom of the molding surface, the light-shielding portion is joined to the surface of the flat substrate, or the convex portion Compared to the case where the light-shielding convex portion and the light-transmitting substrate are joined to each other, the joint area between the light-shielding convex portion and the light-transmitting substrate is increased.
By adopting this structure, the strength of the fine mold can be increased, and the breakage rate of the fine mold can be reduced. As a result, it is possible to reduce the amount of discarded fine molds to be discarded, thereby reducing the environmental load. Further, the manufacturing cost can be reduced.

(3) In the fine molding mold for achieving the above object, it is desirable that the light-shielding convex portion has a higher hardness than the light-transmitting substrate.
In the transfer molding process, the convex portion of the molding surface that is in close contact with the photosensitive molding target film is more easily damaged than the concave portion. For example, a case where foreign matter exists in the photosensitive forming target film will be described. Since the gap between the concave portion and the substrate on which the photosensitive molding target film is formed is wider than the gap between the convex portion and the substrate on which the photosensitive molding target film is formed, the foreign matter should be large enough to fit between the gaps. If this is the case, the recess is less likely to break. On the other hand, since the distance between the convex portion and the substrate is narrower than the distance between the concave portion and the concave portion, the convex portion is more likely to be damaged by foreign matter than the concave portion. Therefore, when the light-shielding convex portion that is the light-shielding convex portion constituting the convex portion of the molding surface is higher in hardness than the light-transmissive substrate constituting the concave bottom surface of the molding surface, the entire molding surface is the same translucent substrate. The durability of the molding surface is improved as compared with the case of forming.

  (4) In the fine molding mold for achieving the above object, the light-shielding convex portion may be made of any one of a metal, a metal compound, and ceramics.

  (5) In the fine mold for achieving the above object, the translucent substrate may be made of any one of glass, crystallized glass, quartz, translucent ceramics, alumina, and sapphire. Other members having translucency may be used.

(6) A method for manufacturing a fine mold for achieving the above object includes forming a concave / convex region on a surface of a light-transmitting substrate and depositing a light-shielding film on the concave / convex region, thereby forming a concave portion in the concave / convex region. The surface layer of the light-shielding film is ground and polished until the translucent substrate is exposed, and at least one of polishing is performed, from the surface of the translucent substrate to a position at a depth below the bottom of the uneven region Forming the light-shielding convex part which consists of the film | membrane which has the said light-shielding property by selectively removing the said translucent board | substrate.
By adopting this manufacturing method, it is possible to manufacture a fine molding mold in which the light-shielding convex portions protruding from the translucent substrate are not easily damaged. The “position at a depth below the bottom of the concave and convex area” means a position that is the same depth as the lowest part of the concave part of the concave and convex area or shallower than the lowest part of the concave part.

(7) In the method of manufacturing a fine mold for achieving the above object, a resist mask whose thickness changes gently on the surface of the translucent substrate exposed by removing the light-shielding film. A smooth curved surface may be formed on the surface of the translucent substrate by forming and etching the translucent substrate together with the resist mask.
By adopting this manufacturing method, a fine molding mold having a convex curved surface for molding the photosensitive molding target film into a concave curved surface shape, or a concave curved surface for molding the photosensitive molding target film into a convex curved shape. A fine mold can be manufactured.

(8) A method for manufacturing a fine mold for achieving the above object is to form a concavo-convex region on the surface of a sacrificial substrate and fill a concave portion in the concavo-convex region by depositing a light-shielding film on the concavo-convex region. The surface of the sacrificial substrate and the surface of the film having a light-shielding property are planarized by grinding or polishing at least one of the surface layer of the film having the light-shielding property until the sacrificial substrate is exposed. The light-shielding film is bonded to the transparent substrate, and the sacrificial substrate is selectively removed from the back surface of the sacrificial substrate to a position deeper than the bottom of the uneven region and below the top of the uneven region. Forming a light-shielding convex portion made of
By adopting this manufacturing method, it is possible to manufacture a fine molding mold in which the light-shielding convex portions protruding from the translucent substrate are not easily damaged. Note that “the position of the depth deeper than the bottom of the concavo-convex region and below the top of the concavo-convex region” indicates the depth based on the back surface of the sacrificial substrate. That is, it means a position that is deeper than the bottom of the concave portion of the concave and convex region and the same position as the top of the convex portion or shallower than that.

(9) A method for producing a fine mold for achieving the above object includes forming a concavo-convex region on the surface of a light-shielding substrate, and press-bonding the transmissive substrate in a softened state to the concavo-convex region. The concave portion of the concavo-convex region is filled, the light-shielding substrate is removed from the back surface of the light-shielding substrate until the light-transmissive substrate is exposed, and the light-transmissive substrate is selectively removed by removing the light-shielding substrate. Forming a light-shielding convex portion made of the film having the light-shielding property by removing to a position at a depth below the top of the concave-convex region.
By adopting this manufacturing method, it is possible to manufacture a fine molding mold in which the light-shielding convex portions protruding from the translucent substrate are not easily damaged. Note that “the position of the depth below the top of the uneven region” indicates the depth based on the surface exposed by removing the light-shielding substrate. That is, it means a position deeper than the surface of the light-transmitting substrate exposed by removing the light-shielding substrate and the same position as the top of the convex portion of the concavo-convex region or shallower than that.

  (10) In the transfer molding method using the fine molding mold according to any one of (1) to (5) above, a photosensitive molding target film is formed on the surface of a substrate, and the fine molding is performed on the photosensitive molding target film. Pressure bonding the molding surface of the mold, exposing the photosensitive molding target film from the back side of the molding surface of the fine molding mold, releasing the fine molding mold from the exposed photosensitive molding target film, Developing the photosensitive molding target film.

  In the claims, “to the top” means both “without an intermediate on the top” and “with an intermediate on the top” unless there is a technical impediment. To do. Further, the order of the operations described in the claims is not limited to the order of description as long as there is no technical obstruction factor, and may be executed at the same time, may be executed in the reverse order of the description order, or may be continuous. It does not have to be executed in order.

Embodiments of the present invention will be described below with reference to the accompanying drawings. In a plurality of embodiments, the same element is denoted by the same reference numeral, and redundant description is omitted.
(First embodiment)
FIG. 1 shows a first embodiment of a fine mold according to the present invention and a transfer molding method using the same.

-Configuration of Micromolding Mold The micromolding mold 1 includes a translucent substrate 100 and a light-shielding convex portion 103. The molding surface of the fine mold 1 is constituted by the translucent substrate 100 and the light-shielding convex portion 103. The bottom 104 of the uneven area constituting the molding surface of the fine mold 1 is constituted by the translucent substrate 100. The light-shielding convex portion 103 is bonded to the flat surface of the translucent substrate 100. Specifically, the light-shielding convex portion 103 includes a plating layer 102 and a seed layer 101, and the plating layer 102 is bonded to the translucent substrate 100 via the seed layer 101. In the fine mold 1, the joint surface 120 between the light-shielding convex portion 103 and the translucent substrate 100 is at the same depth as the bottom portion 104.

The translucent substrate 100 is made of any one of quartz, glass, crystallized glass, translucent ceramics, sapphire, alumina, and the like. The translucent board | substrate 100 may be comprised with the other member which has translucency.
The plating layer 102 is made of NiW. The plating layer 102 may be made of another material having a light shielding property, and may be any of a metal, a metal compound, and ceramics. For example, alloys such as NiMo, NiFe, CoMo, NiCo, Cr, etc. may be used. The seed layer 101 is made of Ti or Ni. As the hardness of the light-shielding convex portion 103, it is desirable to select a material whose surface hardness of the light-shielding convex portion 103 is higher than the surface hardness of the translucent substrate 100. Thereby, since the surface hardness of the convex part which is easy to damage a molding surface becomes high, a highly durable fine molding mold can be realized.

-Transfer molding method A transfer molding method using the fine mold 1 will be described.
First, as shown in FIG. 1A, a photosensitive resin film 106 as a photosensitive molding target film is formed on the surface of a substrate 107 made of a silicon wafer or the like by spin coating or the like. FIG. 1A shows a state in which a foreign material 105 having a hardness higher than that of the translucent substrate 100 is applied in the resin film 106 at that time. The material for the photosensitive molding target film may be a photoresist material whose dissolution characteristics change by a photochemical reaction, but in the present embodiment, a resin curable by a photochemical reaction, such as a negative resist material, a negative photosensitive material, or the like. A form using polyimide or the like will be described below. The film thickness of the photosensitive resin film 106 is, for example, about 70 μm.

  Next, as shown in FIG. 1B, the fine mold 1 is pressure-bonded to the resin film 106 formed on the substrate 107. When the hardness of the light-shielding convex portion 103 is higher than the hardness of the light-transmitting substrate 100, the resin between the tip surface of the light-shielding convex portion 103 forming the convex portion of the molding surface of the fine mold 1 and the substrate 107 Even if the foreign substance 105 exists in the film 106, the frequency of occurrence of deformation or breakage of the convex part of the molding surface due to the foreign substance 105 as compared with the case where the convex part of the molding surface is constituted by the translucent substrate 100. Is low. In addition, when the foreign material 105 exists in the photosensitive area | region 110, since the possibility that the foreign material 105 will contact the micromolding mold 1 is low, possibility that the light-shielding convex part 103 will be damaged is low. In other words, the distance between the concave portion of the fine mold 1 and the substrate 107 is wider than the distance between the convex portion and the substrate 107. Less than the part.

Next, light such as ultraviolet rays is irradiated from the back surface of the translucent substrate 100. At this time, the physical property does not change in the unexposed region 111 because it is shielded by the light-shielding convex portion 103, and the exposed photosensitive region 110 is cured by a photochemical reaction.
Next, as shown in FIG. 1C, the fine mold 1 is released from the resin film 106.

  Finally, as shown in FIG. 1D, the resin in the unexposed area 111 is removed by development. Specifically, for example, the unexposed region 111 is removed by immersing in an organic alkali aqueous solution such as a TMAH (tetra-methyl-ammonium hydro-oxide) aqueous solution at room temperature for 3 to 5 minutes and rinsing with pure water. If the foreign material 105 exists only in the unexposed area 111, there is a high possibility that it can be removed during this development. When the foreign material 105 exists in the photosensitive region 110, the photosensitive region 110 can be removed from the substrate 107 with a solvent or the like, and the process of applying the resin film 106 can be performed again.

-Manufacturing method An example of the manufacturing method of the fine mold 1 is shown in FIG.
First, as shown in FIG. 2A, a seed layer 101 for bonding a light-shielding convex portion constituting a part of the molding surface is formed on a light-transmitting substrate 100. Specifically, for example, Ti and Ni are formed on the light-transmitting substrate 100 by sputtering, vapor deposition, or the like. Next, a photoresist is applied on the seed layer 101 to form a pattern of the photoresist mask 130. Specifically, the photoresist film is exposed using a stepper or aligner, developed, and rinsed to form a photoresist mask 130 to which the photomask pattern is transferred. The pattern of the photoresist mask 130 is set according to the shape of the molding surface of the fine mold 1. For example, the film thickness of the photoresist mask 130 is 100 μm, the line width of the resist pattern is 15 μm, the line-to-line space is 25 μm, and the pitch is about 40 μm.

Next, as shown in FIG. 2B, electrolytic plating is performed to form a plating layer 102. As a result, the plating layer 102 constituting the convex portion of the molding surface is formed on the seed layer 101 exposed from the opening of the photoresist mask 130.
Next, as shown in FIG. 2C, the photoresist mask 130 is removed. Specifically, for example, it is removed with an organic solvent such as NMP (N-methyl-2.pyrrolidone) or acetone. O 2 plasma or amine stripping solution may be used.
Finally, as shown in FIG. 2D, the seed layer 101 in the region not covered with the plating layer 102 is etched by ion milling or the like, and the bottom surface of the concave portion of the molding surface is formed among the surfaces of the translucent substrate 100. Expose part. By manufacturing by the method as described above, the fine molding mold 1 in which the entire convex portion 103 protruding from the flat surface of the translucent substrate 100 is composed of the light-shielding seed layer 101 and the plating layer 102 is obtained. Can be manufactured.

(Second Embodiment)
Configuration of Fine Molding Mold FIG. 3D, FIG. 3E and FIG. 3F show a second embodiment of a fine molding mold according to the present invention. In the fine mold shown in FIG. 3D and FIG. 3E, the side surface of the light-shielding convex portion 103 is constituted by the seed layer 101. In the fine mold shown in FIG. 3F, the side surface and the front end surface of the light-shielding convex portion 103 are constituted by the seed layer 101.
The example illustrated in FIGS. 3E and 3F is a configuration in which the bonding strength between the light-shielding convex portion 103 and the translucent substrate 100 is increased. That is, the light-shielding convex portion 103 is bonded to the entire portion constituting the concave portion on the surface of the translucent substrate 100. In this case, the joint surface 120 between the light-shielding convex portion 103 made of the plating layer 102 and the seed layer 101 and the translucent substrate 100 is a light-shielding film that forms the convex portion of the molding surface on the surface of the flat translucent substrate. Compared to the case where the light shielding film is bonded, or the case where the light shielding film is bonded to the tip end surface of the convex portion of the translucent substrate. Therefore, in the configuration in which the light-shielding convex portion 103 is joined to the entire portion constituting the concave portion on the surface of the translucent substrate 100, the joint area between the light-shielding convex portion 103 and the translucent substrate 100 is increased, so that the light shielding is performed. The conductive convex portion 103 is difficult to peel off from the translucent substrate 100.

Manufacturing Method First, as shown in FIG. 3A, a recess 201 is formed in the light-transmitting substrate 100 by performing RIE using the photoresist mask 130 formed on the surface of the light-transmitting substrate 100 as a protective film. As a result, the uneven region 200 is formed on the surface of the translucent substrate 100.

  Next, as shown in FIG. 3B, the seed layer 101 is deposited on the concavo-convex region 200, and the plating layer 102 is deposited thereon to fill the concave portion 201. The seed layer 101 is made of, for example, TiN, TiOxNy, Ti, TaN, or the like. The plating layer 102 is made of a metal such as W, Cr, Ni, Ta, Ti, Mo and Cu, a metal non-metallic compound such as TiN, TaN and MoN, a metal metal compound such as NiW, NiCo, NiFe, NiMn and NiMo, WSi, You may select suitably from materials, such as silicide compounds, such as MoSi and TiSi, and nonmetals, such as SiN and SiC. The plating method may be appropriately selected from methods such as CVD, electrolytic plating, and non-electrolytic plating.

Next, as shown in FIG. 3C, the surface layer of the plating layer 102 and the seed layer 101 are removed by at least one of grinding and polishing until the translucent substrate 100 is exposed.
Next, as shown in FIG. 3D or FIG. 3E, the surface layer of the translucent substrate 100 is selectively removed. Specifically, for example, the translucent substrate 100 is etched by RIE using CF 4 gas. If the end point of etching is controlled so that the surface of the translucent substrate 100 becomes flat, the translucent substrate 100 of the fine mold 2 shown in FIG. 3D can be molded. If the etching end point is controlled so that a part of the recess 201 remains on the surface of the translucent substrate, the translucent substrate 100 of the fine mold 21 shown in FIG. 3E can be molded. If the back surface of the translucent substrate 100 shown in FIG. 3C is ground and / or polished and then etched, a fine mold 22 as shown in FIG. 3F can be manufactured.

(Third embodiment)
FIG. 4 shows a third embodiment of a fine mold according to the present invention and a transfer molding method using the same.
Structure of Micro Molding Mold In the micro molding mold 3 shown in FIG. 4A, a gentle convex curved surface portion of the molding surface is formed by the convex curved surface portion of the surface of the translucent substrate 100. A joint surface 120 between the light-shielding convex portion 103 and the translucent substrate 100 is a flat portion on the surface of the translucent substrate 100.

Transfer Molding Method A case where the foreign material 105 is coated in the resin film 106 as shown in FIG. 4A will be described. When the light-shielding convex portion 103 is higher in hardness than the translucent substrate 100, the light-shielding convex portion 103 is less likely to be damaged when the fine mold 3 is pressed and irradiated with light as shown in FIG. 4B. When the foreign material 105 exists in the unexposed area 111, the foreign material 105 can be removed (see FIG. 4D) when the development and rinsing are performed after the fine mold 3 is peeled off (see FIG. 4C). When the foreign matter 105 remains in the photosensitive region 110, the photosensitive region 110 can be removed using a solvent or the like, and the process can be repeated from the application of the resin film 106 again. Thus, the breakage rate of the fine mold 3 can be reduced in the transfer molding process. A concave mirror can be formed by forming a metal film 300 of Al, Cr, Ni, Au, Pt or the like on the surface of the photosensitive region 110 and the substrate 107 in the state of FIG. 4D.

-Manufacturing method The manufacturing method of the fine mold 3 is shown in FIG. First, when the process up to the process of FIG. 3C in the manufacturing process of the fine mold according to the second embodiment is performed, the state shown in FIG. 5A is obtained. Next, as shown in FIG. 5B, a pattern of a photoresist mask 130 is formed on the translucent substrate 100 exposed by polishing and grinding. Next, as shown in FIG. 5C, baking is performed by an oven or a hot plate, and the photoresist mask 130 is fluidized to form a convex curved surface shape. The convex curved surface shape may be formed by resin injection molding. Next, as shown in FIG. 5D, the surface layer of the transparent substrate 100 including the photoresist mask 130 is removed by RIE. For example, a mixed gas of CF 4 and O 2 is used as the etchant. The surface shape of the photoresist mask 130 can be transferred to the translucent substrate 100 as it is by controlling the O 2 flow rate so as to approach the selectivity ratio 1 between the photoresist mask 130 and the translucent substrate 100.

  When a concave curved surface shape is formed on the light transmitting substrate 100 as shown in FIG. 6B, a concave curved surface portion may be formed on the surface of the photoresist mask 130 as shown in FIG. 6A. In order to form the concave curved surface portion, a transmissive mask called a gray mask (multi-tone mask) in which the light transmittance is continuously changed is used as a photomask for patterning the photoresist mask 130. In addition, the concave curved surface portion can be formed by an imprint method.

(Fourth embodiment)
7D, FIG. 7E, FIG. 8B, and FIG. 8C show a fine mold according to a fourth embodiment of the fine mold according to the present invention.
-Configuration of Micromolding Mold The micromolding mold according to the fourth embodiment is different from the other embodiments in that the light-shielding convex portion 103 has two plating layers. By manufacturing with the manufacturing method described below, the adhesion of the two plating layers can be improved, the deformation of the light-shielding convex portion 103 can be suppressed, and the durability can be improved.

Manufacturing Method First, as shown in FIG. 7A, the first plating layer 102 is formed on the seed layer 101, and the second plating layer 402 is formed thereon. The process up to that point is the same as the process corresponding to FIG. 3A of the second embodiment. The first plating layer 102 is formed with a thickness of 2 μm by, for example, CVD using WF 6 gas. Fine irregularities are formed on the surface of the W film formed by CVD due to the growth of the polycrystalline W (see FIG. 7B), and as a result, the adhesion with the second plating layer 402 is improved. Note that electroplating or electroless plating may be used instead of CVD. In that case, it is desirable to adjust the current density, metal concentration, bath composition, bath temperature, and additives so that fine irregularities are formed on the surface. Further, after forming the first plating layer 102, the surface may be etched to form fine irregularities. For example, if the NiFe is electroplated and then wet etched with a ferric chloride aqueous solution, fine irregularities can be formed on the surface of the first plating layer 102. The second plating layer 402 is formed, for example, by depositing 200 μm of Cu or the like by electroless plating.

  Next, as shown in FIG. 7C, the surface layers of the second plating layer 402, the first plating layer 102, and the seed layer 101 are removed by grinding, polishing, or the like until the translucent substrate 100 is exposed. Next, as shown in FIG. 7D or 7E, the translucent substrate 100 is selectively removed from the surface of the translucent substrate 100 to a position deeper than the bottom 104 of the molding surface. By controlling the etching end point, FIG. 7D or FIG. 7E can be formed. Note that a reinforcing substrate (not shown) may be bonded to the back surface of the translucent substrate 100 to reinforce the strength of the fine mold.

  The fine molds 42 and 43 shown in FIGS. 8B and 8C can be formed by the following method. FIG. 8A shows a state in which the second translucent substrate 400 is bonded to the surface where the translucent substrate 100, the second plating layer 402, the first plating layer 102, and the seed layer 101 are exposed in FIG. 7C. ing. Joining is performed by, for example, thermocompression bonding of low-melting glass. In addition, in order to improve the adhesive force between the second translucent substrate 400 and the exposed surface, the surface of the translucent substrate 100 and the second plating layer 402 are formed before thermocompression bonding of the translucent substrate 400. The surface of the substrate may be etched. Finally, by selectively removing the translucent substrate 100 from the back surface to a position below the top of the convex portion 202, the light-shielding convex portion 103 as shown in FIG. 8B or FIG. 8C can be formed. .

(Fifth embodiment)
FIG. 9 shows a fifth embodiment of a fine mold according to the present invention and a manufacturing method thereof.
FIG. 9E and FIG. 9F show a fine mold according to the fifth embodiment. In the micro-molding mold of the fifth embodiment, the portion where the light-shielding convex portion 103 is exposed is covered with the seed layer 101, and the light-shielding convex portion 103 is interposed via the translucent adhesive layer 501. The light-transmitting substrate 500 is joined.

Manufacturing Method In the manufacturing process of the fine molding mold 5 of the fifth embodiment, the processes shown in FIGS. 9A, 9B, and 9C are the same as FIGS. 3A, 3B, and 3C in the manufacturing process of the second embodiment. . In the fifth embodiment, the translucent substrate 100 corresponds to the sacrificial substrate described in the claims. As shown in FIG. 9D, a translucent adhesive layer 501 is applied to the surface after being ground and polished as shown in FIG. 9C, and the second translucent substrate 500 is adhered thereon. For the light-transmitting adhesive layer 501, for example, low-melting glass, coated glass material, or the like is used. Finally, by selectively removing the translucent substrate 100 from the back surface of the translucent substrate 100 to a position below the height of the top surface of the convex portion 202, the light-shielding convex portion 103 shown in FIG. 9E or FIG. 9F. Is molded. Note that as shown in FIG. 9E, in the case where the light-transmitting substrate 100 as a sacrificial substrate is all removed, the substrate used as the sacrificial substrate may not have light-transmitting properties.

(Sixth embodiment)
FIG. 10 shows a sixth embodiment of a fine mold according to the present invention and a transfer molding method using the same. The micromolding mold 6 shown in FIG. 10A is different from the fifth embodiment in that the light-shielding convex portion 103 has a convex curved surface shape.
Transfer Molding Method First, as shown in FIG. 10A, a resin film 106 as a photosensitive molding target film is applied to the surface of the substrate 107. Reference numeral 105 denotes a foreign substance having a hardness higher than that of the second translucent substrate 600 coated in the resin film 106. The resin film 106 used for transfer molding using the fine mold 6 of the sixth embodiment is a photodegradable photosensitive resin. For example, positive photosensitive polyimide can be used for the resin film 106.

  Next, as shown in FIG. 10B, the fine mold 6 is pressed against the resin film 106 applied to the substrate 107 and irradiated with light. When the hardness of the light-shielding convex portion 103 is higher than the hardness of the translucent substrate 100, the resin film 106 between the light-shielding convex portion 103 and the substrate 107 forming the convex portion of the fine mold 6 at this time Even if the foreign matter 105 exists in the (unexposed area 111), the frequency of occurrence of deformation or breakage of the light-shielding convex portion 103 by the foreign matter 105 is low.

Next, as shown in FIG. 10C, the fine mold 6 is peeled from the resin film 106. The fine mold 6 that has not been damaged by the foreign material 105 can be used again for the next molding.
Finally, as shown in FIG. 10D, the resin in the photosensitive region 110 is removed by development.

Manufacturing Method The concave curved surface forming step shown in FIGS. 11A and 11B may employ a method common to the method for manufacturing the fine mold according to the third embodiment (FIGS. 6A and 6B). 11C, FIG. 11D, FIG. 11E, and FIG. 11F may employ a method corresponding to FIG. 9B, FIG. 9C, FIG. 9D, and FIG. 9E of the fifth embodiment.

(Seventh embodiment)
FIG. 12 shows a seventh embodiment of a fine mold according to the present invention and a manufacturing method thereof.
-Configuration of the micro-molding mold As shown in FIGS. 12E and 12F, the micro-molding mold according to the seventh embodiment is a configuration in which the light-shielding convex portion 103 is not formed by plating, so that no seed layer is interposed. It differs from the form. By adopting a hard material such as SiN or SiC as the material constituting the light-shielding convex portion 103, the strength of the light-shielding convex portion 103 is improved.

Manufacturing Method First, as shown in FIG. 12A, a pattern of the photoresist mask 130 is formed on the light-shielding substrate 700, and the light-shielding substrate 700 is etched as shown in FIG. 12B. Specifically, for example, anisotropic etching by RIE using CF 4 gas is performed. Thereafter, the photoresist mask 130 is removed with NMP, acetone, O 2 plasma, an amine organic solvent, or the like. Next, as shown in FIG. 12C, the light-transmitting substrate 100 is bonded onto the uneven region 200 formed on the light-shielding substrate 700. Specifically, for example, thermocompression bonding is performed at 380 ° C. using low melting point glass. Pyrex glass (registered trademark) may be used instead of the low melting point glass. Next, as shown in FIG. 12D, the light-shielding substrate 700 is ground and polished from the back surface until the light-transmissive substrate 100 is exposed. Finally, as shown in FIG. 12E or FIG. 12F, the light-shielding convex portion 103 is formed by selectively removing the translucent substrate 100 to a position below the height of the convex portion 202.

The configuration shown in FIG. 12E can also be formed by the following manufacturing method.
First, as shown in FIG. 13A, a light-shielding layer is formed on a light-transmitting substrate 100. Specifically, for example, SiN is deposited to a thickness of 100 μm by CVD. The light-shielding substrate 700 may be bonded to the light-transmitting substrate 100. Next, as shown in FIG. 13B, a pattern of a photoresist mask 130 is formed on the light-shielding substrate 700. Finally, as shown in FIG. 13C, the light-shielding convex portion 103 is formed by etching the light-shielding substrate 700 by the height of H 0 using the photoresist mask 130 as a mask.

(Eighth embodiment)
FIG. 14 shows an eighth embodiment of a fine mold according to the present invention and a manufacturing method thereof.
Configuration of Micromolding Mold The micromolding mold 8 of the eighth embodiment shown in FIG. 14B is provided with a protective layer 805 on the surface of the light shielding layer 800 that faces the joint surface with the translucent substrate 100. This is different from the other embodiments. The material constituting the light shielding layer 800 is, for example, Ti, Cr or the like. Since the light shielding layer 800 is not at the tip of the convex portion 810, the possibility of chipping or deformation of the light shielding layer 800 is reduced. The protective layer 805 is made of, for example, SiN or SiC. When ceramics such as SiN and SiC are thin, the light shielding property is poor. However, by laminating with a metal of 0.1 μm or more, almost 100% light shielding property can be secured. In the case where the protective layer 805 has a light shielding property in combination with the light shielding layer 800, the convex portion 810 made up of the protective layer 805 and the light shielding layer 800 corresponds to the light shielding convex portion described in the claims. When the protective layer 805 does not have light shielding properties, the light shielding layer 800 corresponds to the light shielding convex portions described in the claims.

Manufacturing Method As shown in FIG. 14A, Ti as a light shielding layer 800 is formed on a light-transmitting substrate 100 by sputtering to a thickness of 0.5 μm, and SiN is formed thereon as a protective layer 805 by plasma CVD. A 10 μm film is formed. Instead of SiN, SiO 2 , PSG, BPSG or the like may be formed by plasma CVD. Low melting glass may be welded. A pattern of a photoresist mask 130 is formed on the protective layer 805, and the convex portion 810 is formed by etching the protective layer 805 by a height H 0 using the photoresist mask 130 as a mask. For example, the protective layer 805 made of SiN is anisotropically etched by RIE using CF 4 gas, and the light shielding layer 800 made of Ti is etched by RIE using Cl 2 gas.

(Ninth embodiment)
15F and 16D show a ninth embodiment of a fine mold according to the present invention.
Configuration of Fine Molding Mold In the fine molding mold shown in FIGS. 15F and 16D, the side surface and the tip surface of the plating layer 904 constituting the light-shielding convex portion 103 are covered with the seed layer 101.

Manufacturing Method First, the first seed layer 901 is formed on the first sacrificial substrate 902, and the second sacrificial substrate 900 is formed thereon. The material of the first sacrificial substrate 902 is, for example, single crystal Si, quartz, glass, crystallized glass, or the like. The material of the first seed layer 901 is, for example, Cr, Cu or the like. The material of the second sacrificial substrate 900 is, for example, Cu.
Next, a pattern of a photoresist mask 130 is formed on the first sacrificial substrate 902, and the first sacrificial substrate 902 is etched using the photoresist mask 130 as a mask as shown in FIG. 15A.
Next, the photoresist mask 130 is removed, and as shown in FIG. 15B, a second seed layer 903 is formed on the concavo-convex region 200 formed by etching. The second seed layer 903 is, for example, NiW.
Next, a plating layer 904 is deposited thereon to fill the recess 201. The plating layer 904 is made of, for example, NiW, NiMo, NiW, NiFe, CoMo, NiCo, Cr, or the like.

Next, as shown in FIG. 15C, the plated layer 904 and the second seed layer 903 are planarized by grinding or polishing, and the first sacrificial substrate 902 is exposed.
Next, as shown in FIG. 15D, a light-transmitting substrate 100 is bonded to the planarized surface. For example, a low melting point glass as the translucent substrate 100 is thermocompression bonded. As a material of the light-transmitting substrate 100, a thermosetting resin, a thermoplastic resin, quartz, silicon rubber, or the like may be used. The translucent substrate 100 may be formed by CIM (Ceramic Injection Molding).
Next, as shown in FIG. 15E, the second sacrificial substrate 900 and the first seed layer 901 are removed by etching. For example, for etching the second sacrificial substrate 900, Enstrip C manufactured by Elmex Corporation is used, and for etching the first seed layer 901, cerium / ammonium nitrate is used.
Finally, as shown in FIG. 15F, when the first sacrificial substrate 902 is removed, the fine mold 9 in which the light-shielding convex portions are joined to the flat translucent substrate is completed. For example, etching is performed by RIE containing any of CF 4 gas, CH 2 F 2 , and CH 3 F as a component.

  After the step of FIG. 15C, when the first sacrificial substrate 902 is etched halfway as shown in FIG. 16A, a fine mold 91 in which the base of the light-shielding convex portion is buried in the concave portion of the translucent substrate is completed. The processes shown in FIGS. 16B, 16C, and 16D correspond to the processes of FIGS. 15D, 15E, and 15F described above.

(10th Embodiment)
FIG. 18F shows a tenth embodiment of a fine mold according to the present invention.
-Configuration of Micromolding Mold The micromolding mold 10 of the tenth embodiment has a light-shielding convex portion formed of two layers of light-shielding films having a bonding interface in the direction in which the light-shielding convex portion 103 projects.
Manufacturing Method First, as shown in FIG. 17A, a light-shielding film 1001 is formed on the sacrificial substrate 1000. The sacrificial substrate 1000 is, for example, single crystal Si, SiN, SiO 2 , amorphous Si, polycrystalline Si, or the like. As the light shielding film 1001, for example, TiN x is formed to a thickness of 0.5 μm by reactive sputtering or the like. Next, a photoresist mask 130 is formed on the surface of the light shielding film 1001.
Next, a first sacrificial film 1002 is formed on the light-shielding film 1001 exposed from the opening of the photoresist mask 130, and the photoresist mask 130 is removed as shown in FIG. 17B. The first sacrificial film 1002 is formed, for example, by depositing 200 μm of Cu by electrolytic plating. Tin or solder may be plated instead of Cu. Instead of electrolytic plating, electroless plating, sputtering, vapor deposition, CVD, or MIM (Metal Injection Molding) may be used. Further, after the first sacrificial film 1002 is formed, at least one of grinding and polishing may be performed to make the film thickness uniform.

Next, as shown in FIG. 17C, a light-shielding film 1001 serving as a light-shielding convex portion is formed. For example, a TiNx film having a thickness of 0.5 μm is formed. The film thickness l of the light-shielding film 1001 is set to satisfy 2l <L, where L is the space width between the first sacrificial films 1002 formed on the light-transmitting substrate 1000.
Next, as illustrated in FIG. 17D, a light shielding film 1003 is formed over the light shielding film 1001. For example, a 20 μm thick W film is formed by CVD using WF 6 gas.
Next, as shown in FIG. 17E, a second sacrificial film 1004 is formed on the light-shielding film 1003, and the concave portion on the surface of the light-shielding film 1003 is filled with the second sacrificial film 1004.

Next, as shown in FIG. 18A, the second sacrificial film 1004, the light-shielding film 1003, and the light-shielding film 1001 are removed by grinding, polishing, or the like until the first sacrificial film 1002 is exposed.
Next, as shown in FIG. 18B, the surface layers of the first sacrificial film 1002 and the second sacrificial film 1004 are selectively removed by etching until the translucent substrate 100 is exposed. Etching of the first sacrificial film 1002 and the second sacrificial film 1004 made of Cu uses a mixed solution of ammonium persulfate and ammonia water.
Next, as shown in FIG. 18C, the translucent substrate 100 is bonded. For example, low melting glass is thermocompression bonded.

Next, as shown in FIG. 18D, the sacrificial substrate 1000 is removed by etching or the like. The sacrificial substrate 1000 may be removed by grinding and polishing, or may be peeled off.
Next, as shown in FIG. 18E, the first sacrificial film 1002, the light-shielding film 1001, and the light-shielding film until the second sacrificial film 1004 is exposed from the region where the parts 1001 and 1003 are divided and 1003 and 1003 are divided. The surface layer with 1003 is removed by grinding and polishing.
Finally, as shown in FIG. 18F, the light-shielding convex portion 103 is formed by selectively removing the first sacrificial film 1002 and the second sacrificial film 1004 in the same manner as in the process of FIG. 18B. When the resolution limit of microfabrication by photolithography is L 0 , a fine mold 10 having a pattern width L 1 finer than L 0 can be manufactured by adopting this manufacturing method.

  It should be noted that the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the gist of the present invention.

(1A), (1B), (1C) and (1D) are sectional views according to the first embodiment. (2A), (2B), (2C) and (2D) are sectional views according to the first embodiment. (3A), (3B), (3C), (3D), (3E) and (3F) are sectional views according to the second embodiment. (4A), (4B), (4C), (4D) and (4E) are sectional views according to the third embodiment. (5A), (5B), (5C) and (5D) are sectional views according to the third embodiment. (6A) and (6B) are sectional views according to the third embodiment. (7A), (7B), (7C), (7D) and (7E) are sectional views according to the fourth embodiment. (8A), (8B) and (8C) are sectional views according to the fourth embodiment. (9A), (9B), (9C), (9D), (9E) and (9F) are sectional views according to the fifth embodiment. (10A), (10B), (10C) and (10D) are sectional views according to the sixth embodiment. (11A), (11B), (11C), (11D), (11E) and (11F) are sectional views according to the sixth embodiment. (12A), (12B), (12C), (12D), (12E) and (12F) are sectional views according to the seventh embodiment. (13A), (13B) and (13C) are cross-sectional views according to the seventh embodiment. (14A) And (14B) is sectional drawing concerning 8th Embodiment. (15A), (15B), (15C), (15D), (15E), and (15F) are sectional views according to the ninth embodiment. (16A), (16B), (16C) and (16D) are sectional views according to the ninth embodiment. (17A), (17B), (17C), (17D) and (17E) are cross-sectional views according to the tenth embodiment. (18A), (18B), (18C), (18D), (18E) and (18F) are cross-sectional views according to the tenth embodiment.

Explanation of symbols

  1: fine mold, 2: fine mold, 3: fine mold, 4: fine mold, 5: fine mold, 6: fine mold, 7: fine mold, 8: fine mold, 9: Fine mold, 10: Fine mold, 100: Translucent substrate, 101: Seed layer, 102: Plating layer, 103: Light-shielding convex part, 104: Bottom part, 106: Resin film, 107: Substrate, 110: Photosensitive Area: 111: unexposed area, 120: bonding surface, 130: photoresist mask, 200: concavo-convex area, 201: concave part, 202: convex part, 400: translucent substrate, 402: second plating layer, 500: Translucent substrate, 501: Translucent adhesive layer, 600: Translucent substrate, 700: Light-shielding substrate, 800: Light-shielding layer, 805: Protective layer, 810: Projection, 900: Second sacrifice Substrate, 901: seed layer, 902: first sacrificial substrate, 903: seed layer, 904: plating layer, 1000: sacrificial substrate, 1001: seed layer, 1002: sacrificial film, 1003: plating layer, 1004: sacrificial film

Claims (10)

  1. A translucent substrate that constitutes a part of the molding surface in close contact with the photosensitive molding target film;
    The light-shielding convex part which comprises the convex part of the above-mentioned molding surface, and is located in the depth more than the bottom part of the above-mentioned molding surface where the joint surface with the above-mentioned translucent substrate is closest to the back side surface of the above-mentioned molding surface,
    A fine molding mold comprising:
  2. The joint surface is located at a deeper depth than the bottom of the molding surface;
    The fine mold according to claim 1.
  3. The light-shielding convex portion has a higher hardness than the translucent substrate,
    The fine mold according to claim 1 or 2.
  4. The light-shielding convex portion is composed of any one of a metal, a metal compound, and ceramics.
    The fine mold according to any one of claims 1 to 3.
  5. The translucent substrate is composed of any of glass, crystallized glass, quartz, translucent ceramics, alumina, and sapphire.
    The fine mold according to any one of claims 1 to 4.
  6. Form an uneven area on the surface of the translucent substrate,
    By filling a film having a light-shielding property in the uneven region, filling the concave portion of the uneven region,
    Grinding and polishing at least one of the surface layers of the light-shielding film until the translucent substrate is exposed,
    Forming a light-shielding convex portion made of the light-shielding film by selectively removing the light-transmissive substrate from the surface of the light-transmissive substrate to a position at a depth equal to or lower than the bottom of the uneven region;
    The manufacturing method of the fine mold which contains this.
  7. Forming a resist mask whose thickness changes gently on the surface of the translucent substrate exposed by removing the light-shielding film;
    A gentle curved surface is formed on the surface of the translucent substrate by etching the translucent substrate with the resist mask.
    The manufacturing method of the fine mold according to claim 6.
  8. Form an uneven area on the surface of the sacrificial substrate,
    By filling a film having a light-shielding property in the uneven region, filling the concave portion of the uneven region,
    Grinding and polishing at least one of the surface layers of the light-shielding film until the sacrificial substrate is exposed,
    Bonding a translucent substrate to the surface of the sacrificial substrate flattened by grinding or polishing and the surface of the light-shielding film;
    The sacrificial substrate is selectively removed from the back surface of the sacrificial substrate to a position deeper than the bottom of the concavo-convex region and below the top of the concavo-convex region, thereby forming a light-shielding convex portion made of the light-shielding film. ,
    The manufacturing method of the fine mold which contains this.
  9. An uneven area is formed on the surface of the light-shielding substrate,
    By pressing the translucent substrate in a softened state on the uneven region, the concave portion of the uneven region is filled,
    Removing the light blocking substrate from the back surface of the light blocking substrate until the light transmitting substrate is exposed;
    The light-transmitting substrate exposed by removing the light-shielding substrate is selectively removed to a depth below the top of the uneven region to form a light-shielding convex portion made of the light-shielding film. ,
    The manufacturing method of the fine mold which contains this.
  10. Form a photosensitive molding target film on the surface of the substrate,
    Pressure bonding the molding surface of the fine molding mold to the photosensitive molding target film;
    Exposing the photosensitive molding target film from the back side of the molding surface of the fine molding mold,
    The fine mold is released from the exposed photosensitive molding target film,
    Developing the photosensitive molding target film;
    The transfer molding method using the fine mold according to any one of claims 1 to 5.
JP2007001826A 2007-01-09 2007-01-09 Minute molding mold and its manufacturing method Withdrawn JP2008168465A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008226877A (en) * 2007-03-08 2008-09-25 Seiko Epson Corp Process for fabricating electronic device
JP2011230362A (en) * 2010-04-27 2011-11-17 Toshiba Corp Method of manufacturing stamper
JP2011249004A (en) * 2011-09-01 2011-12-08 Toshiba Corp Stamper
JP2012243777A (en) * 2011-05-13 2012-12-10 Fujikura Ltd Circuit board, imprint mold, and manufacturing method thereof
JP2013135107A (en) * 2011-12-27 2013-07-08 Toshiba Mach Co Ltd Mold and method for molding article to be molded
CN104768336A (en) * 2014-12-17 2015-07-08 安捷利电子科技(苏州)有限公司 Interlayer interconnection process

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008226877A (en) * 2007-03-08 2008-09-25 Seiko Epson Corp Process for fabricating electronic device
JP2011230362A (en) * 2010-04-27 2011-11-17 Toshiba Corp Method of manufacturing stamper
US8778162B2 (en) 2010-04-27 2014-07-15 Kabushiki Kaisha Toshiba Stamper and method of manufacturing the same
JP2012243777A (en) * 2011-05-13 2012-12-10 Fujikura Ltd Circuit board, imprint mold, and manufacturing method thereof
JP2011249004A (en) * 2011-09-01 2011-12-08 Toshiba Corp Stamper
JP2013135107A (en) * 2011-12-27 2013-07-08 Toshiba Mach Co Ltd Mold and method for molding article to be molded
CN104768336A (en) * 2014-12-17 2015-07-08 安捷利电子科技(苏州)有限公司 Interlayer interconnection process
CN104768336B (en) * 2014-12-17 2016-08-31 安捷利电子科技(苏州)有限公司 A kind of interlayer interconnection process

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