JPH11300755A - Manufacture of resin plate manufacturing pattern and manufacture of resin plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the resolution and dimensional accuracy of the uneven shape of a pattern even under the condition that a resist layer having a necessary film thickness is used by a method wherein a mask layer is etched by employing the patterned resist layer as a mask and a board is etched by employing the etched mask layer as a mask. SOLUTION: By developing an exposed resist layer 3, a resist pattern 4 is formed. By the way, this resist pattern 4 is the reversed pattern of an uneven shape to be formed on the surface of an optical disc intending to obtain. Next, a mask layer 2 is etched by employing the resist pattern 4 as a mask so as to form a mask pattern 5. Next, the resist pattern 4 left on the formed mask pattern 5 is removed. Further, when no trouble develops in the etching of a silicon board even under the existence of the resist layer 4, the above-mentioned process may well be omitted. Next, a silicon board 1 is etched by employing the obtained mask pattern 5 as a mask.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a mold for manufacturing a resin plate, and more particularly to a method of manufacturing a mold for manufacturing a resin plate having an uneven surface formed on the surface based on predetermined information. About. The present invention also relates to a method for producing a resin plate using the resin plate production mold.

[0002]

2. Description of the Related Art Conventionally, when forming a resin plate such as an optical disk having an uneven shape formed on the surface based on predetermined information, a resin plate having an uneven pattern corresponding to the uneven shape is formed. In general, a method of performing injection molding using a production mold (a so-called stamper) as a matrix and transferring the uneven pattern to the surface of the resin plate is generally performed.

The unevenness formed on the resin plate requires high dimensional accuracy, but in order to increase the dimensional accuracy of the unevenness, the resolution and size of the unevenness pattern formed on the mold are required. Need to increase accuracy.

In this mold, a resist layer is formed on a substrate, a desired patterning is performed on the resist layer, and the substrate is etched using the patterned resist layer as a mask, thereby forming the irregularities. ing.

As one of the effective methods for improving the resolution and dimensional accuracy of the concave and convex shape of the mold produced by this method (an inverted pattern of the concave and convex shape to be formed on the resin plate), the film thickness of the resist layer is used. Is formed thinly.

[0006]

However, when manufacturing the mold, the resist layer must secure a film thickness necessary for etching the substrate.
There is a limit to reducing the film thickness. For this reason, there has been a problem that the resolution and dimensional accuracy of the uneven shape of the mold cannot be sufficiently improved.

An object of the present invention is to solve such a conventional problem. Even if a resist layer having a film thickness necessary for etching a substrate is used, the unevenness of the mold can be reduced. An object of the present invention is to provide a method for manufacturing a resin plate manufacturing mold and a method for manufacturing a resin plate, which are capable of improving resolution and dimensional accuracy.

[0008]

In order to achieve this object, the present invention relates to a method of manufacturing a mold for manufacturing a resin plate for transferring an uneven shape formed on a substrate based on predetermined information to a resin plate. A first step of forming a mask layer on the substrate, a second step of forming a resist layer on the mask layer, a third step of patterning the resist layer, and the patterned resist layer And a fifth step of etching the substrate using the etched mask layer as a mask, and a fifth step of etching the substrate using the etched mask layer as a mask. .

In this manufacturing method, a resist layer for forming a pattern for forming the irregularities on a mold and a mask layer for etching the substrate are individually formed. In addition, the thickness can be reduced, and the film thickness required for etching can be secured.

[0010] The mask layer can be obtained by oxidizing the surface of the substrate. Further, the mask layer may be made of a metal or a compound containing a metal. The metals are Al, Ti, Cr, Ni, C
u, Ru, Ag, W, Ir, Pt, or Au can be selected. Furthermore, the mask layer can be made of resin.

Further, the substrate can be made of silicon.

Further, the resist layer can be made of a resin containing silicon.

[0013] The present invention also relates to a method of manufacturing a mold for manufacturing a resin plate for transferring an uneven shape onto a resin plate on a substrate, wherein the resin according to any one of claims 1 to 7 is provided. A first step of forming a conductive layer on a mold obtained by a method of manufacturing a plate manufacturing mold, a second step of forming a metal layer on the conductive layer, and peeling the metal layer from the mold And a third step of forming a metal master on which the concavo-convex shape formed on the mold is copied, and a method for manufacturing a mold for manufacturing a resin plate.

Further, the present invention relates to a method for manufacturing a resin plate having an uneven shape formed on a substrate based on predetermined information, wherein the resin plate according to any one of claims 1 to 7 is provided. The method includes a step of providing a resin plate forming material on the uneven surface of the mold obtained by the method for manufacturing a plate manufacturing mold, and after the forming material is solidified, separating the solidified resin plate from the uneven surface of the mold. A method for manufacturing a resin plate is provided.

[0015]

Next, an embodiment according to the present invention will be described with reference to the drawings.

(Embodiment 1) FIG. 1 is a cross-sectional view showing a process for manufacturing a resin plate manufacturing mold (hereinafter, referred to as a "stamper") according to Embodiment 1 of the present invention.

The stamper according to the first embodiment is used for manufacturing an optical disk, and is manufactured by the steps shown in FIG.

That is, in the step shown in FIG. 1A, a mask layer 2 made of Ti (titanium) is formed on a silicon substrate 1.
Is formed in a thickness of 50 to 1000 °.

Next, in the step shown in FIG.
On the mask layer 2 formed in the step shown in (1), a resist layer 3 obtained by blending a diazonaphthoquinone derivative as a photosensitizing agent with a cresol novolak-based resin,
It is formed with a thickness of 000 mm. Here, this resist layer 3
Is effective if the material is formed of a material having a selectivity to the silicon substrate 1 smaller than that of the mask layer 2.

Next, in the step shown in FIG.
Exposure for transferring a desired pattern to the resist layer 3 formed in the step shown in (2) is performed.

Next, in the step shown in FIG.
Developing the resist layer 3 exposed in the step shown in (3),
A resist pattern 4 is formed. The resist pattern 4 is a reverse pattern of the concavo-convex shape formed on the surface of the optical disk to be obtained.

Next, in the step shown in FIG.
The mask layer 2 is etched using the resist pattern 4 formed in the step (4) as a mask to form a mask pattern 5.

Next, in the step shown in FIG.
The resist pattern 4 remaining on the mask pattern 5 formed in the step shown in (4) is removed. Note that even if the resist pattern 4 exists, this step may be omitted if there is no problem in the etching of the silicon substrate 1 performed in the step shown in FIG.

Next, in the step shown in FIG.
Using the mask pattern 5 obtained in the step shown in (6) as a mask, the silicon substrate 1 is etched.

Next, in the step shown in FIG. 1 (8), the mask pattern 5 remaining on the silicon substrate 1 is removed to obtain a stamper. This step may be omitted if the function as a stamper is satisfied even when the mask pattern 5 exists.

As described above, according to the present invention, the resist pattern 4 only needs to be suitably used as a mask for etching the mask layer 2, and the etching of the silicon substrate 1 is performed using the mask pattern 5 as a mask. Is adopted. Therefore, as compared with the conventional method of etching a silicon substrate using a resist pattern as a mask, favorable etching can be performed even when the thickness of the resist layer is reduced. As a result, the resolution of the resist layer can be improved, and the dimensional accuracy of the concavo-convex shape formed on the stamper can be improved.

In the first embodiment, the case where the silicon substrate 1 is used as the material of the stamper has been described. However, the present invention is not limited to this. Quartz, glass, metal, ceramic, resin, etc. Of course, other materials can be used if possible.

In the first embodiment, the case where Ti is used as the material for forming the mask layer 2 has been described. However, the present invention is not limited to this, and the material for forming the mask layer 2 may be Al (aluminum), Cr (chromium), Ni (nickel), Cu (copper), Ru (ruthenium), Ag
(Silver), W (tungsten), Ir (iridium), P
Metals such as t (platinum) and Au (gold), or compounds containing these metals can be suitably used.

In the first embodiment, the case where a material obtained by blending a diazonaphthoquinone derivative as a photosensitive agent with a cresol novolak resin is used as a material for forming the resist layer 3 has been described. The material for forming the resist layer 3 is not limited as long as the material has a selectivity with respect to the silicon substrate 1 smaller than that of the mask layer 2. Etc. can be suitably used.

(Embodiment 2) Next, a method of manufacturing a stamper according to Embodiment 2 of the present invention will be described with reference to the drawings. In the second embodiment, the same members as those in the first embodiment are denoted by the same reference numerals, and a detailed description thereof will be omitted.

FIG. 2 is a sectional view showing a stamper manufacturing process according to the second embodiment. The stamper according to the second embodiment is also used for manufacturing an optical disc, and is manufactured by the steps shown in FIG.

That is, in the step shown in FIG. 2A, a mask layer 2 made of a silicon oxide film is formed on a silicon substrate 1.
Is formed in a thickness of 50 to 1000 ° by thermal oxidation.

Next, in the step shown in FIG.
On the mask layer 2 formed in the step shown in (1), a resist layer 3 obtained by blending a diazonaphthoquinone derivative as a photosensitizing agent with a cresol novolak-based resin,
It is formed with a thickness of 000 mm. Here, this resist layer 3
Is effective if the material is formed of a material having a selectivity to the silicon substrate 1 smaller than that of the mask layer 2.

Next, in the steps shown in FIGS. 2 (3) to (6), the same steps as those shown in FIGS. 1 (3) to 1 (6) according to the first embodiment are performed, Then, a mask pattern 5 is formed.

Next, in the step shown in FIG.
Using the mask pattern 5 obtained in the step shown in (6) as a mask, the silicon substrate 1 is etched. Here, in the second embodiment, since an oxide film formed on the silicon substrate 1 by thermal oxidation is used as the mask pattern 5, the substrate and the mask pattern are firmly integrated. Therefore, there is no need to remove the mask pattern 5 if there is no problem in the shape, durability, etc. of the uneven pattern after etching. Thus, a stamper is obtained.

As described above, in the manufacturing method according to the second embodiment, similarly to the first embodiment, the resist pattern 4
Any method can be used as long as it can be suitably used as a mask for etching the mask layer 2, and a method of etching the silicon substrate 1 using the mask pattern 5 as a mask is employed. Therefore, as compared with the conventional method of etching a silicon substrate using a resist pattern as a mask, favorable etching can be performed even when the thickness of the resist layer is reduced. As a result, the resolution of the resist layer can be improved, and the dimensional accuracy of the concavo-convex shape formed on the stamper can be improved. Further, since it is not necessary to remove the mask pattern 5, the manufacturing process can be simplified.

In the second embodiment, since the mask pattern 5 is made of a silicon oxide film, the silicon substrate 1
There is an effect that there is no need to remove the mask pattern 5 after the etching of the silicon nitride film. Such a material includes a silicon nitride film in addition to a silicon oxide film.

In addition to the thermal oxidation, the silicon oxide film
It may be formed by another method such as a VD method or a sputtering method.

(Embodiment 3) Next, a method of manufacturing a stamper according to Embodiment 3 of the present invention will be described with reference to the drawings. In the third embodiment, the same members as those in the first embodiment are denoted by the same reference numerals, and a detailed description thereof will be omitted.

FIG. 3 is a sectional view showing a stamper manufacturing process according to the third embodiment. The stamper according to the third embodiment is also used for manufacturing an optical disc, and is manufactured by the steps shown in FIG.

That is, in the step shown in FIG. 3A, a mask layer 2 made of resin is
It is formed with a thickness of 0 to 20000 °.

The resin can easily transfer the pattern of the resist layer 3 by etching performed in a step shown in FIG. 3 (5) which will be described in detail later.
There is no particular limitation as long as it functions as a mask for etching the substrate 1, but for example, a novolak resin can be suitably used.

Next, in the step shown in FIG.
On the mask layer 2 formed in the step shown in (1), a resist layer 3 made of a resin containing silicon
It is formed to a thickness of 00 °, that is, a thickness smaller than the mask layer 2. Here, the resist layer 3 is formed on the silicon substrate 1
Was formed from a material having a higher selectivity than the mask layer 2 and a lower etching rate.

Next, in the steps shown in FIGS. 3 (3) to (8), the same steps as those shown in FIGS. 1 (3) to 1 (8) according to the first embodiment are performed to obtain a stamper.

As described above, according to the present invention, since the resist layer 3 can be formed thinner than in the first and second embodiments, the resolution of the resist layer 3 can be further improved, and the unevenness formed on the stamper can be improved. Dimensional accuracy can be improved.

In the third embodiment, the case where the silicon substrate 1 is used as the material for forming the stamper has been described. However, the present invention is not limited to this. Quartz, glass, metal, ceramic, resin, etc. are usually used as the stamper. Of course, other materials can be used if possible.

(Embodiment 4) Next, a method of manufacturing a resin plate manufacturing mold according to Embodiment 4 of the present invention will be described with reference to the drawings.

FIG. 4 is a sectional view showing a manufacturing process of a metal master according to the fourth embodiment. In the fourth embodiment,
The same members as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

The metal master according to the fourth embodiment is also used for manufacturing an optical disk, and is manufactured by the steps shown in FIG.

That is, in the step shown in FIG. 4A, for example, Ni is deposited on the stamper 10 obtained in the first embodiment.
Is formed to a thickness of 100 to 1000 °.

Next, in the step shown in FIG.
A metal layer 12 made of nickel is formed on the conductive layer 11 obtained in the step (1) by electroforming.

Next, in a step shown in FIG. 4C, the metal layer 12 and the conductive layer 11 are integrally separated from the stamper 10. Further, the conductive layer 11 may be separated from the metal layer 12 as necessary. In this way, the stamper 10
To obtain a metal master on which the concavo-convex shape formed on the substrate is copied.

In the fourth embodiment, the case where the stamper 10 obtained in the first embodiment is used has been described.
The present invention is not limited to this, and the stamper obtained in the second or third embodiment may be used.

In the fourth embodiment, the case where the conductive layer 11 is made of Ni has been described. However, the present invention is not limited to this, and the conductive layer 11 may be made of Al, Ti, Cr, Cu, Ag,
It can also be formed of W, Pt, Au or the like.

In order to manufacture a resin plate using the stamper obtained in Embodiments 1 to 3 or the metal master obtained in Embodiment 4, for example, the resin plate is formed on a stamper (or metal master). A forming material such as an acrylic resin may be provided on the uneven surface, and after the forming material has solidified, the solidified resin plate may be peeled off from the uneven surface of the stamper (or metal master).

[0056]

As described above, according to the method of manufacturing a mold for manufacturing a resin plate according to the present invention, a resist layer for forming a pattern for forming a concavo-convex shape on a mold and a resist layer for etching the substrate are provided. Since the mask layers are separately formed, the thickness of each layer can be reduced as compared with the related art. Therefore, the resolution required for the resist layer can be improved while securing the film thickness necessary for etching. As a result, a resin plate manufacturing mold having high accuracy can be manufactured.

According to the resin plate manufacturing method of the present invention, since the resin plate is manufactured using a resin plate manufacturing mold having high precision, a highly reliable resin plate having excellent dimensional accuracy is provided. Can be manufactured.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a step of manufacturing a stamper according to Embodiment 1 of the present invention.

FIG. 2 is a cross-sectional view showing a step of manufacturing a stamper according to Embodiment 2 of the present invention.

FIG. 3 is a cross-sectional view showing a step of manufacturing a stamper according to Embodiment 3 of the present invention.

FIG. 4 is a cross-sectional view showing a manufacturing process of a metal master according to Embodiment 4 of the present invention.

[Explanation of symbols]

 Reference Signs List 1 silicon substrate 2 resist layer 3 mask layer 4 resist pattern 5 mask pattern 10 stamper 11 conductive layer 12 metal layer

Claims (9)

[Claims] 1. A method of manufacturing a mold for manufacturing a resin plate for transferring an uneven shape formed on a substrate based on predetermined information to a resin plate, the method comprising: forming a mask layer on the substrate; A step of forming a resist layer on the mask layer, a third step of patterning the resist layer, a fourth step of etching the mask layer using the patterned resist layer as a mask, And a fifth step of etching the substrate using the etched mask layer as a mask. 2. The method according to claim 1, wherein the mask layer is obtained by oxidizing a surface of the substrate. 3. The method according to claim 2, wherein the substrate is made of silicon. 4. The method according to claim 1, wherein the mask layer is made of a metal or a compound containing a metal. 5. The method according to claim 1, wherein the metal is Al, Ti, Cr, Ni,
The method for producing a mold for producing a resin plate according to claim 4, wherein the mold is any one of Cu, Ru, Ag, W, Ir, Pt, and Au. 6. The method according to claim 1, wherein the mask layer is made of a resin. 7. The method according to claim 1, wherein the resist layer is made of a resin containing silicon. 8. A method for manufacturing a resin plate manufacturing mold for transferring an uneven shape onto a resin plate on a substrate, wherein the resin plate manufacturing mold according to any one of claims 1 to 7. A first step of forming a conductive layer on the mold obtained by the method of manufacturing, a second step of forming a metal layer on the conductive layer, and peeling the metal layer from the mold, A third step of forming a metal master on which the concave and convex shapes formed on the mold are copied. 9. A method for manufacturing a resin plate having a concave-convex shape formed on a substrate based on predetermined information, the method according to claim 1, further comprising: On the uneven surface of the mold obtained by the manufacturing method,
A resin plate forming material is provided, and after the forming material has solidified,
A method of manufacturing a resin plate, comprising a step of peeling the solidified resin plate from the uneven surface of the mold.