JP2012243777A - Circuit board, imprint mold, and manufacturing method thereof - Google Patents

Circuit board, imprint mold, and manufacturing method thereof Download PDF

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JP2012243777A
JP2012243777A JP2011108728A JP2011108728A JP2012243777A JP 2012243777 A JP2012243777 A JP 2012243777A JP 2011108728 A JP2011108728 A JP 2011108728A JP 2011108728 A JP2011108728 A JP 2011108728A JP 2012243777 A JP2012243777 A JP 2012243777A
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portion
height dimension
imprint mold
convex portion
filling
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JP2011108728A
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JP5656735B2 (en
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Koji Munakata
浩次 宗像
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Fujikura Ltd
株式会社フジクラ
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Abstract

An imprint mold that can be manufactured without increasing the number of man-hours even when the types of patterns having different top positions are increased, and a method for manufacturing the same.
A recess forming step S12 for forming a recess 12 having a predetermined depth on the surface of a support plate 11;
A resin patterning step S15 for patterning and forming the resin coating 16B opening on the recess and the support plate surface;
Filling portion forming step S16 for filling the opening 16b to form the filling portion 18;
A resin peeling step S17 for removing the resin coating;
Have
A convex portion having a plurality of different height dimensions based on the bottom surface 12a of the concave portion is formed by combining the depth dimension h1 of the concave portion and the height dimension h2 of the filling portion.
[Selection] Figure 1

Description

  The present invention relates to a circuit board, an imprint mold, and a manufacturing method thereof, and relates to a technique suitable for use in improving wiring height setting diversity in manufacturing an electronic component and a wiring board for mounting the electronic component or a package wiring board. .

  As electronic devices become smaller, thinner, and more functional, electronic components (components) built into such devices are also becoming smaller and the wiring of printed wiring boards on which the components are mounted has become finer. . Conventionally, photolithography technology has been used to form wiring as a printed wiring board (wiring board). However, when a wiring board is produced by photolithography, it is difficult to make a wiring width of 10 μm or less, and a finer wiring width. There has been a demand for a method of easily forming the film. One method is an imprint method. In the imprint method, an imprint mold (mold) on which a pattern is formed is pressed against a resin, and a pattern inverted from the mold pattern is transferred to the resin. Pattern formation methods by transfer include nanoimprint (NIL), injection molding, hot embossing, and the like. In injection molding and hot embossing, since the resin is thick, the force applied to the mold is transmitted only to the resin. On the other hand, NIL usually puts a resin with a thickness of several tens of nanometers to several μm on a substrate and presses the mold against it, so that the mold is almost in contact with the substrate (the resin is almost penetrated or the resin remains thin) State). Thus, NIL is more technically difficult than other forming methods in that it is transferred to a thin resin.

  When you want to form a layer structure in NIL, the imprint mold (mold) with multi-step shape can transfer the layer structure such as a specific fine three-dimensional structure pattern at a time, so alignment is not necessary In addition, since the joint surface of the material is eliminated, it is expected that the yield and the reliability are improved, and it is also possible to reduce the cost because a plurality of processes are performed once.

JP 2004-071587 A JP 2009-072956 A

Patent Document 1 proposes a stamper (mold) in which two or more kinds of materials are laminated. In this manufacturing method, two or more kinds of materials are formed on the entire surface of a substrate, and a convex portion is formed by etching.
According to Patent Document 2, a multistage mold is formed by etching a substrate material a plurality of times.

  However, according to the technique described in Patent Document 1, since the height of the protrusions is a combination of the heights of the deposited materials, the thicknesses of the protrusions of the same layer are equal. If the height is necessary, a plurality of corresponding layers must be formed, and there is a problem that the process becomes complicated and the manufacturing cost increases. In addition, since the material deposited on the substrate is etched and used for the convex portion of the stamper, there is a problem that the material used in terms of adhesion to the substrate, deposition rate, etching processability, and the like is limited.

  In the technique described in Patent Document 2, a two-stage mold is formed by etching the substrate material twice. However, since the convex thickness of the same layer is the same, the height of the convex mold is the same in this method. There are problems that only two types can be designed, and man-hours are increased due to the use of an electron beam drawing apparatus, resulting in an increase in manufacturing cost.

  Furthermore, in these techniques, conventionally, when producing a mold having a plurality of types of patterns with different top positions, the same number of times as the number of patterns must be patterned. There was a problem that the man-hour increased.

  The present invention has been made in view of the above circumstances, and intends to achieve an object of providing an imprint mold that can be manufactured without increasing the number of man-hours even when the types of patterns having different top positions are increased, and a method for manufacturing the same. To do.

The method for producing an imprint mold according to claim 1 of the present invention includes:
A method for producing an imprint mold having a convex portion having a predetermined height on the surface of a support plate,
Forming a recess having a predetermined depth on the surface of the support plate, and
A resin patterning step of patterning and forming a resin coating opening on the recess and the support plate surface;
A filling portion forming step of filling the opening to form a filling portion; and
A removing step of removing the resin coating;
Have
A convex portion having a plurality of different height dimensions based on the bottom surface of the concave portion is formed by combining the depth dimension of the concave portion and the height dimension of the filling portion.
In the imprint mold manufacturing method according to claim 2 of the present invention, in the imprint mold manufacturing method according to claim 1, the concave portion is formed in a multistage shape having a plurality of depth dimensions. And
In the imprint mold manufacturing method according to claim 3 of the present invention, the height of the convex portion is a set current value, a set voltage value, or a resistance value of the portion in the circuit formed by the imprint mold. It is set based on at least 1 or more of these, The manufacturing method of the imprint mold of Claim 1 or 2 characterized by the above-mentioned.
The imprint mold according to claim 4 of the present invention is manufactured by the method for manufacturing an imprint mold according to claim 1,
The convex portion has a first type convex portion having a height dimension equal to the depth dimension of the concave portion, a second type convex portion having a height dimension equal to the height dimension of the filling portion, and the depth of the concave portion. An imprint mold characterized by comprising a third type convex portion having a height dimension equal to the sum of the height dimension and the height dimension of the filling portion.
The imprint mold according to claim 5 of the present invention is manufactured by the method for manufacturing an imprint mold according to claim 2,
A first type convex portion having a height dimension equal to a plurality of depth dimensions of the concave portion, a second type convex portion having a height dimension equal to the height dimension of the filling portion, and It is an imprint mold characterized by having at least a third type convex portion having a height dimension equal to the sum of a plurality of depth dimensions of the concave portion and the height of the filling portion.
A circuit board according to a sixth aspect of the present invention is manufactured by the imprint mold manufacturing method according to any one of the first to third aspects, or the imprint mold according to the fourth or fifth aspect. Pattern transfer.

  According to this invention, after forming a convex part with the same material as a support plate body, by forming a pattern using a convex part, there exists an effect of reducing the man-hour of pattern formation.

FIG. 1 is a schematic cross-sectional view showing the steps of the manufacturing method in the first embodiment of the imprint mold according to the present invention. FIG. 2 is a schematic cross-sectional view showing the steps of the manufacturing method in the first embodiment of the imprint mold according to the present invention. FIG. 3 is a flowchart showing a manufacturing method in the first embodiment of the imprint mold according to the present invention. FIG. 4 is a schematic cross-sectional view showing a second embodiment of an imprint mold according to the present invention.

Hereinafter, a first embodiment of a circuit board, an imprint mold, and a manufacturing method thereof according to the present invention will be described with reference to the drawings.
1 and 2 are schematic cross-sectional views showing the steps of the imprint mold manufacturing method in the present embodiment, and FIG. 3 is a flowchart showing the imprint mold manufacturing method in the present embodiment. In the figure, reference numeral 10 denotes an imprint mold.

  As shown in FIG. 1G, the imprint mold 10 of the present embodiment includes a substrate (support plate body) 11 and convex portions having three kinds of height dimensions formed on the surface of the substrate 11. A first convex portion (first type convex portion) 13 having a height (height dimension) h1, a second convex portion (second type convex portion) 14 having a height (height dimension) h2, and a height As shown in FIG. 2 (j) and FIG. 2 (k), it has a pattern shape composed of third convex portions (third type convex portions) 15 having (height dimension) h3 and pressed against a resin or the like. A pattern-transferred resin having three kinds of depth (height) dimensions, such as a recess 53 having a height dimension h1, a recess 54 having a height dimension h2, and a recess 55 having a height dimension h3. The layer 50 and the like are formed. In FIG. 2 (j) and FIG. 2 (k), the deepest portion of the formed recess 55 penetrates downward, but it is possible that this does not penetrate. The mold may not be formed with the second convex portion 14 but may be constituted by the first convex portion 13 and the third convex portion 15.

  The substrate 11 is made of silicon, metal, hard resin, or the like, and is not particularly limited as long as it has strength necessary for pattern transfer. However, metals such as Cu, Cr, Ni, and alloys thereof, hard resin substrates One selected from glass, silicon, and ceramic can be used.

The first convex portion (first type convex portion) 13 is made of the same material as that of the substrate 11 and has a height dimension h1 from the bottom surface of the concave portion 12 provided on the surface of the substrate 11 as shown in FIG. It has a tip surface that is equal to the depth dimension of the recess 12 and substantially parallel to the surface of the substrate 11.
The 2nd convex part (2nd type convex part) 14 consists of a different kind of material from the board | substrate 11, and as shown in FIG.1 (g), the height dimension h2 from the bottom face of the recessed part 12 provided in the board | substrate 11 surface. Has a front end surface 14a which is larger than the depth of the recess 12 and substantially parallel to the surface of the substrate 11.

The third convex portion (third type convex portion) 15 is a base end portion 15d made of the same kind of material as that of the substrate 11, and a tip end portion having a diameter smaller than that of the base end portion 15d and made of the same kind of material as the second convex portion. 15c, and has a tip surface 15a and a step surface 15b that are substantially parallel to the surface of the substrate 11. Alternatively, the step surface 15b can be omitted.
As shown in FIG. 1G, the third convex portion (third type convex portion) 15 has a height dimension h3 from the bottom surface of the concave portion 12 provided on the surface of the substrate 11, and a depth dimension h1 of the concave portion 12. And it becomes substantially equal to the sum of the height dimension h2 of the 2nd convex part. The height dimension h3 of the third protrusion can be made slightly smaller than the sum of the height dimension h1 of the first protrusion and the height dimension h2 of the second protrusion. The height dimension h1 of the first convex part, the height dimension h2 of the second convex part, and the height dimension h3 of the third convex part are all the heights from the bottom surface 12a of the concave part 12.

  As shown in FIG. 3, the imprint mold manufacturing method of the present embodiment includes a resin patterning step S11 in which a resin coating 16A is applied to the surface 11a of the substrate 11 and a pattern is formed by photolithography, and the recesses 12 and the first protrusions. On the power supply layer 17, an etching (recess formation) step S12 for forming the portion 13, a resin removal step S13 for removing the resin coating 16A, a power supply layer forming step S14 for forming the power supply layer 17 for plating, and It includes a resin patterning step S15 for patterning the resist (resin coating) 16B, a plating (filling portion forming) step S16 for forming the filling portion 18 by plating, and a resin peeling step S17 for removing the resist. The

    In the imprint mold manufacturing method of the present embodiment, as shown in FIG. 1A, the resin coating 16A, which is a photosensitive resin, is applied as a resin patterning step S11 shown in FIG. 3 by spin coating, casting, or dispensing. For example, it is applied to the surface 11a of the substrate 11 which is a silicon wafer. Alternatively, a film-like resin may be laminated on the surface 11a of the substrate 11 that is a silicon wafer. Next, as shown in FIG. 1B, a pattern of the opening 16a is formed by photolithography. The pattern of the opening 16 a corresponds to the arrangement of the concave portion 12 and the first convex portion 13. The pattern of the opening 16a may be formed by printing or imprinting. In this case, the resin coating 16A does not need to be a photosensitive resin.

  Next, as an etching (recess formation) step S12 shown in FIG. 3, as shown in FIG. 1C, the substrate 11 is dry-etched to form the recess 12 to a depth h1. At this time, if the patterned resin coating 16A is not resistant to silicon etching, for example, an oxide film is formed in advance, a resin is formed, a resist pattern is formed, and after the resin patterning, the oxide film is formed by wet etching or the like. Patterning may be performed as an etching mask. The first convex portion 13 and the base end portion 15d of the third convex portion 15 are formed together with the concave portion 12 by the etching (concave portion forming) step S12.

Next, as a resin removal step S13 shown in FIG. 3, after removing the resin coating 16A, as shown in FIG. 1D, a power supply layer 17 for plating is formed as a power supply layer formation step S14 shown in FIG. The power feeding layer 17 is formed on the surface 11 a of the substrate 11, that is, the bottom surface of the concave portion 12, the upper surface 13 a of the first convex portion 13, and the upper surface (step surface) 15 b of the base end portion 15 d of the third convex portion 15. .
The power feeding layer 17 can be formed by sputtering, vapor deposition, coating, chemical vapor deposition (CVD), electroless plating, or the like. The power feeding layer 17 can be formed of Cu, Cr, Al, Ti, TiW, Au, or the like. Further, in order to increase the adhesion, Cr, Ni, Ti, TiW or the like may be similarly formed as an adhesion layer between the power feeding layer 17 and the substrate 11.

  Next, as a resin patterning step S15 shown in FIG. 3, as shown in FIG. 1E, a resist (resin coating) 16B is formed on the power feeding layer 17 by patterning. The resin coating 16B has an opening 16b, and this pattern corresponds to the arrangement of the distal end portions 15c of the second convex portion 14 and the third convex portion 15. The resin coating 16B can be a resist layer, but any material can be applied as long as it has an insulating property and is not subjected to electrolytic plating in the filling portion forming step S16. The opening 16b of the resin coating 16B can be formed by photolithography, printing, imprinting, or the like. The thickness for forming the resin coating 16 </ b> B is set corresponding to the height dimension of the distal end portion 15 c of the second convex portion 14 and the third convex portion 15.

Next, as a plating (filling portion forming) step S16 shown in FIG. 3, as shown in FIG. 1 (f), the exposed portion inside the opening 16b of the power feeding layer 17 is used as a cathode, and the power feeding layer 17 is used. Electrolytic plating is performed using an anode (not shown) opposed to the conductive material, thereby forming a conductive filling portion 18 inside the opening 16b. The arrangement of the filling portion 18 is restricted by the opening portion 16b, and the distal end portion 15c of the second convex portion 14 and the third convex portion 15 is formed. The thickness of the filling portion is h2, the height dimension of the second convex portion 14 is h2 from the bottom surface 12a of the concave portion 12, and the height dimension of the tip portion 15c of the third convex portion 15 is h2 from the step surface 15b. Formed as follows.
The filling portion 18 can be made of a metal selected from Cu, Ag, Au, Ni, Cr, and Al, and alloys thereof.
Instead of plating, a conductive paste may be printed and fired to form the filling portion 18. In this case, the filling portion 18 can be made of Cu, Au, carbon, or the like. At this time, the power feeding layer forming step S14 can be omitted.

  Next, by removing and removing the resin coating 16B as the resin peeling step S17 shown in FIG. 3, the protrusions 13, 14, and 15 having different heights h1, h2, and h3 are formed as shown in FIG. An imprint mold 10 having the same is obtained.

Further, as shown in FIG. 2 (h), a resin 51 is prepared. As shown in FIG. 2 (i), the imprint mold 10 is pressed against the resin 51 to deform the resin 51, and FIG. As shown, the reversal pattern of the mold convex portion is transferred by releasing the imprint mold 10. Thereafter, as shown in FIG. 2 (k), by filling the recesses 53, 54, and 55 having height dimensions h1, h2, and h3 with plating or conductive paste, the circuit 52a having a height dimension h1, A circuit board 50 having a circuit 52b having a height dimension h2 and a circuit 52c having a height dimension h3 is completed. When plating the recesses 53, 54, and 55, the height dimension of the protrusion is set based on at least one of a current value, a voltage value, and a resistance value.
Here, the third protrusion 15 penetrates the resin 51 by setting the thickness dimension of the resin 51 to be substantially equal to the height dimension h3 of the third protrusion. As a result, the circuit 52c having the highest height h3 can have the tip 52d as a via connected to the adjacent layer substrate by the tip 52e.

  In the present embodiment, the convex portions 13, 14, and 15 of the mold 10 have three types of heights: h1 by silicon etching, for example, h2 by Cu plating, and h3 that is a combination of these h1 and h2. Here, it is possible to provide a mold with h3≈h1 + h2 in consideration of the height dimension of h3 = h1 + h2 and actually the variation in plating height.

Hereinafter, 2nd Embodiment of the imprint mold which concerns on this invention, and its manufacturing method is described based on drawing.
FIG. 4 is a schematic cross-sectional view showing the imprint mold in the present embodiment. In the figure, reference numeral 20 denotes an imprint mold.
In the present embodiment, the difference from the first embodiment described above is that the concave portion is composed of the first-level concave portion 12A and the second-level concave portion 12B, so that the reference of the height dimension of the convex portion is the second level. It becomes a bottom surface of the recess 12B, and is a portion in which the height dimension is different. Corresponding components other than the above are denoted by the same reference numerals and description thereof is omitted.

  In the imprint mold 20 of the present embodiment, as shown in FIG. 4, the substrate 21 is formed with a recess 12A having a depth h11 corresponding to the depth h1 in FIG. A recess 12B having h12 is formed. The bottom surface 12b of the concave portion 12B is the deepest position and serves as a reference surface for the height dimension of each convex portion.

For this reason, the height dimension of the 1st convex part 13 is set to h13 = h11 + h12, and the height dimension of the 3rd high convex part (3rd type convex part) 15 is set to h16 = h13 + h2 = h11 + h12 + h2.
Also, a third low convex portion (third type convex portion) 15A located inside the concave portion 12A and a second convex portion (second type convex portion) 14 located inside the concave portion 12B are provided, and the third low convex portion is provided. The height dimension of the part 15A is h15 = h12 + h2, and the height dimension of the second convex part 14 is h2.

  The imprint mold manufacturing method of this embodiment is the same as that shown in FIG. 3 after forming the recess 12A by the resin patterning step S11, the etching (recess formation) step S12, and the resin removal step S13 in FIG. By repeating these steps, the concave portion 12B is formed, and then the second convex portion 14 and the third low convex portion are formed by the power feeding layer forming step S14, the resin patterning step S15, the plating (filling portion forming) step S16, and the resin peeling step S17. The part 15A and the third high convex part 15 are formed.

  In the present embodiment, the recesses are configured in multiple stages to combine the depth dimensions h11 and h12 of the recesses with h2 which is the height dimension of the second protrusions 14 and have various height dimensions. The print mold 20 can be obtained.

In addition, the filling part 18 can also be formed in a multilayer by making the recessed part 12 into one step.
In this case, as the imprint mold manufacturing method, in FIG. 3 shown in the first embodiment, the recess 12 is formed after the resin patterning step S11, the etching (recess formation) step S12, and the resin removal step S13. Thereafter, the first filling portion is formed by the power feeding layer forming step S14, the resin patterning step S15, the plating (filling portion forming) step S16, and the resin peeling step S17. Thereafter, the second layer filling portion can be formed by repeating the power feeding layer forming step S14, the resin patterning step S15, the plating (filling portion forming) step S16, and the resin peeling step S17. Thereby, combining the depth dimension h1 of a recessed part and the height dimension of a some filling part, the imprint mold 20 which has various height dimensions similarly can be obtained.

  Furthermore, it is possible to set various height dimensions by forming the recesses in multiple stages and forming the filling parts in multiple layers.

  The present invention can be applied to forming a circuit board having wirings with different heights using an imprint mold. For example, in a SiP (System in Package) that consolidates main LSIs mounted in a magnetic sensor or individual package products into a single package, the base end 15d of the third protrusion 15 shown in FIG. The two convex portions 14 can be a power supply circuit having a high set voltage.

  Furthermore, the tip 15c of the third convex portion 15 can be used as a shield by arranging it at the outermost periphery as a via in the multilayer substrate.

DESCRIPTION OF SYMBOLS 10,20 ... Imprint mold, 11 ... Board | substrate, 12 ... Concave part, 12a ... Bottom surface, 13 ... 1st convex part, 14 ... 2nd convex part, 15 ... 3rd convex part

Claims (6)

  1. A method for producing an imprint mold having a convex portion having a predetermined height on the surface of a support plate,
    Forming a recess having a predetermined depth on the surface of the support plate, and
    A resin patterning step of patterning and forming a resin coating opening on the recess and the support plate surface;
    A filling portion forming step of filling the opening to form a filling portion; and
    A removing step of removing the resin coating;
    Have
    Producing convex portions having a plurality of different height dimensions based on the bottom surface of the concave portion by combining the depth dimension of the concave portion and the height dimension of the filling portion. Method.
  2.   2. The method of manufacturing an imprint mold according to claim 1, wherein the concave portion is formed in a multistage shape having a plurality of depth dimensions.
  3.   The height dimension of the convex portion is set based on at least one of a set current value, a set voltage value, and a resistance value of the portion in the circuit formed by the imprint mold. Item 3. A method for producing an imprint mold according to Item 1 or 2.
  4. It is manufactured by the method for manufacturing an imprint mold according to claim 1,
    The convex portion has a first type convex portion having a height dimension equal to the depth dimension of the concave portion, a second type convex portion having a height dimension equal to the height dimension of the filling portion, and the depth of the concave portion. An imprint mold comprising: a third type convex portion having a height dimension equal to a sum of a height dimension and a height dimension of the filling portion.
  5. It is manufactured by the method for manufacturing an imprint mold according to claim 2,
    A first type convex portion having a height dimension equal to a plurality of depth dimensions of the concave portion, a second type convex portion having a height dimension equal to the height dimension of the filling portion, and An imprint mold comprising at least a third type convex portion having a height dimension equal to a sum of a plurality of depth dimensions of the concave portion and a height of the filling portion.
  6.   A circuit board manufactured by the method of manufacturing an imprint mold according to any one of claims 1 to 3, or having a pattern transferred using the imprint mold according to claim 4 or 5. .
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014130969A (en) * 2012-12-28 2014-07-10 Fujikura Ltd Wiring board and method of manufacturing the same
US10423066B2 (en) 2017-02-03 2019-09-24 Toshiba Memory Corporation Template, imprint device, and manufacturing method of semiconductor device

Citations (6)

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Publication number Priority date Publication date Assignee Title
JP2004071587A (en) * 2002-08-01 2004-03-04 Hitachi Ltd Stamper, method of transferring pattern using it, and method of forming structure by transferring pattern
JP2005353164A (en) * 2004-06-10 2005-12-22 Tdk Corp Stamper, imprint method and manufacturing method of information recording medium
JP2006339365A (en) * 2005-06-01 2006-12-14 Mitsui Mining & Smelting Co Ltd Wiring board, its manufacturing method, manufacturing method of multilayer laminated wiring board and forming method of via hole
JP2007320246A (en) * 2006-06-02 2007-12-13 Dainippon Printing Co Ltd Mold and manufacturing method of mold
JP2008168465A (en) * 2007-01-09 2008-07-24 Yamaha Corp Minute molding mold and its manufacturing method
JP2010245130A (en) * 2009-04-01 2010-10-28 Jsr Corp Stamper and optical imprint lithography method using the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004071587A (en) * 2002-08-01 2004-03-04 Hitachi Ltd Stamper, method of transferring pattern using it, and method of forming structure by transferring pattern
JP2005353164A (en) * 2004-06-10 2005-12-22 Tdk Corp Stamper, imprint method and manufacturing method of information recording medium
JP2006339365A (en) * 2005-06-01 2006-12-14 Mitsui Mining & Smelting Co Ltd Wiring board, its manufacturing method, manufacturing method of multilayer laminated wiring board and forming method of via hole
JP2007320246A (en) * 2006-06-02 2007-12-13 Dainippon Printing Co Ltd Mold and manufacturing method of mold
JP2008168465A (en) * 2007-01-09 2008-07-24 Yamaha Corp Minute molding mold and its manufacturing method
JP2010245130A (en) * 2009-04-01 2010-10-28 Jsr Corp Stamper and optical imprint lithography method using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014130969A (en) * 2012-12-28 2014-07-10 Fujikura Ltd Wiring board and method of manufacturing the same
US10423066B2 (en) 2017-02-03 2019-09-24 Toshiba Memory Corporation Template, imprint device, and manufacturing method of semiconductor device

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