JP2013135107A - Mold and method for molding article to be molded - Google Patents

Mold and method for molding article to be molded Download PDF

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JP2013135107A
JP2013135107A JP2011284936A JP2011284936A JP2013135107A JP 2013135107 A JP2013135107 A JP 2013135107A JP 2011284936 A JP2011284936 A JP 2011284936A JP 2011284936 A JP2011284936 A JP 2011284936A JP 2013135107 A JP2013135107 A JP 2013135107A
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mold
molding material
uncured
substrate
molding
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Yuki Hashimoto
有紀 橋本
Hiroaki Omagari
啓明 大曲
Hidetoshi Shinohara
秀敏 篠原
Mitsunori Kokubo
光典 小久保
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Shibaura Machine Co Ltd
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Toshiba Machine Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To facilitate removal of a residual film in a method for molding an article to be molded in which a photosetting material is molded by transferring a fine transfer pattern formed on a mold to the photosetting material.SOLUTION: A method for molding an article to be molded comprises the steps of: providing an uncured molding material 17 on a base material 11; installing a mold 1 having a substrate 3 composed of a light transmissive material and a plurality of fine recesses 7 composed of a light-shielding material so that a transfer pattern 5 of the mold 1 adheres tightly to the uncured molding material 17; curing a part 17B of the molding material 17 by irradiating the molding material 17 with light through the substrate 3 of the mold 1; separating the mold 1 from the molding material 17; and removing an uncured molding material 17A.

Description

本発明は、型および被成形品の成形方法に係り、たとえば、型を用いて紫外線硬化樹脂の微細なパターンを成形するものに関する。   The present invention relates to a mold and a molding method of a molded article, and for example, relates to a mold for forming a fine pattern of an ultraviolet curable resin using a mold.

従来、基板の一方の面に未硬化の紫外線硬化樹脂を薄く膜状に設け、この紫外線硬化樹脂に型の微細な転写パターンを転写することで、紫外線硬化樹脂を成形する成形方法(転写方法)が知られている(たとえば特許文献1参照)。   Conventionally, a molding method (transfer method) for forming an ultraviolet curable resin by providing a thin film of uncured ultraviolet curable resin on one surface of a substrate and transferring a fine transfer pattern of the mold onto the ultraviolet curable resin. Is known (see, for example, Patent Document 1).

特開2009−208316号公報JP 2009-208316 A

しかし、従来の成形方式では、紫外線硬化樹脂を硬化させた後、紫外線硬化樹脂から型を離すと、上記基板に薄い残膜が残ってしまう。この残膜をOアッシング等で除去するとなると、除去に多くの時間を要してしまうという問題がある。 However, in the conventional molding method, if the mold is removed from the ultraviolet curable resin after the ultraviolet curable resin is cured, a thin residual film remains on the substrate. If this residual film is removed by O 2 ashing or the like, there is a problem that a long time is required for the removal.

なお、残膜は、硬化した紫外線硬化樹脂で構成されており、転写して形成された微細な各凸部(硬化した紫外線硬化樹脂)の間に形成されて、上記基板をごく薄く覆っているのである。   The remaining film is composed of a cured ultraviolet curable resin, and is formed between each fine convex portion (cured ultraviolet curable resin) formed by transfer, and covers the substrate very thinly. It is.

本発明は、上記問題点に鑑みてなされたものであり、型に形成された微細な転写パターンを光硬化性材料に転写することで上記光硬化性材料を成形する被成形品の成形方法および型において、残膜の除去が容易であるものを提供することを目的とする。   The present invention has been made in view of the above problems, and a molding method for a molded product for molding the photocurable material by transferring a fine transfer pattern formed on a mold onto the photocurable material, and An object of the present invention is to provide a mold in which the remaining film can be easily removed.

請求項1に記載の発明は、光が透過する材料で構成された基板と、光を遮断する材料で構成され、前記基板の厚さ方向の一方の面にお互いが離れて設けられた複数の微細な凸部で形成された転写パターンとを有する型である。   The invention according to claim 1 is a plurality of substrates that are made of a material that transmits light and a material that blocks light, and are provided on one surface in the thickness direction of the substrate so as to be separated from each other. A mold having a transfer pattern formed with fine convex portions.

請求項2に記載の発明は、基材に、光の照射によって硬化する未硬化の被成形材料を設ける未硬化被成形材料設置工程と、光が透過する材料で構成された基板と、光を遮断する材料で構成され前記基板の厚さ方向の一方の面にお互いが離れて設けられた複数の微細な凸部で形成された転写パターンとを有する型の前記転写パターンが、前記未硬化被成形材料設置工程で設置された未硬化の被成形材料に密着するように、前記型を前記被成形材料に設置する型設置工程と、前記型設置工程で前記型を前記被成形材料に設置した後、前記型の基板を通して前記被成形材料に光を照射し前記被成形材料の一部を硬化させる被成形材料硬化工程と、前記被成形材料硬化工程で前記被成形材料の一部を硬化した後、前記型を前記被成形材料から離す型離反工程と、前記型離反工程で前記被成形材料から前記型を離した後、未硬化の被成形材料を除去する未硬化被成形材料除去工程とを有する被成形品の成形方法である。   The invention described in claim 2 is an uncured molding material installation step in which a base material is provided with an uncured molding material that is cured by light irradiation, a substrate made of a material that transmits light, and light. The transfer pattern of a mold having a transfer pattern formed of a plurality of fine protrusions formed of a material to be shielded and formed on one surface in the thickness direction of the substrate so as to be separated from each other is provided. A mold installation process for installing the mold on the molding material so as to be in close contact with the uncured molding material installed in the molding material installation process, and the mold is installed on the molding material in the mold installation process. Thereafter, the molding material is cured by irradiating the molding material with light through the substrate of the mold to cure a part of the molding material, and a part of the molding material is cured in the molding material curing process. Thereafter, the mold is separated from the molding material. A step, after releasing the mold from the object molding material in the mold separating process, a molding method of the molded article having an uncured the molded material removal step of removing the object to be molded uncured material.

本発明によれば、型に形成された微細な転写パターンを光硬化性材料に転写することで上記光硬化性材料を成形する被成形品の成形方法および型において、残膜の除去が容易であるという効果を奏する。   According to the present invention, in the molding method and mold of a molded product for molding the photocurable material by transferring the fine transfer pattern formed on the mold to the photocurable material, it is easy to remove the remaining film. There is an effect that there is.

型の概略構成を示す図である。It is a figure which shows schematic structure of a type | mold. 型を被成形体に設置し紫外線を照射している状態を示す図である。It is a figure which shows the state which has installed the type | mold to the to-be-molded body and has irradiated the ultraviolet-ray. 紫外線硬化樹脂の一部を硬化した後、型を被成形体から離した状態を示す図である。It is a figure which shows the state which isolate | separated the type | mold from the to-be-molded body, after hardening a part of ultraviolet curable resin. 未硬化の紫外線硬化樹脂を除去して得られた被成形品を示す図である。It is a figure which shows the to-be-molded product obtained by removing uncured ultraviolet curing resin.

本発明の実施形態に係る型1は、図1で示すように、基板(基材)3と転写パターン5とを備えて構成されている。基板3は、光が透過する材料で構成され板状に形成されている。たとえば、基板3は、紫外線が透過する石英ガラスで構成され矩形な平板状になっている。   A mold 1 according to an embodiment of the present invention includes a substrate (base material) 3 and a transfer pattern 5 as shown in FIG. The substrate 3 is made of a material that transmits light and is formed in a plate shape. For example, the substrate 3 is made of quartz glass that transmits ultraviolet light and has a rectangular flat plate shape.

転写パターン5は、複数の微細な凸部7で形成されている。各凸部7は、基板3の厚さ方向の一方の面にお互いが僅かに離れて一体的に設けられている。また、凸部7は、光(たとえば紫外線)を遮断する(光が透過しない)材料で構成されている。   The transfer pattern 5 is formed by a plurality of fine convex portions 7. The convex portions 7 are integrally provided on one surface in the thickness direction of the substrate 3 with a slight distance from each other. Moreover, the convex part 7 is comprised with the material which interrupts | blocks light (for example, ultraviolet-ray) (light does not permeate | transmit).

凸部7は微細な直方体状に形成されている。凸部7の高さ(図1の上下方向の寸法)、横方向の寸法(図1の左右方向の寸法)、縦方向(図1の紙面に直交する方向の寸法)の寸法、および、お互いが隣接している各凸部7間の距離(図1の左右方向の寸法)は、たとえば、可視光線の波長と同程度の大きさになっている。また、凸部7の高さ寸法は、凸部7の横方向の寸法や縦方向の寸法よりも大きくなっている。   The convex part 7 is formed in a fine rectangular parallelepiped shape. The height of the convex portion 7 (the vertical dimension in FIG. 1), the horizontal dimension (the horizontal dimension in FIG. 1), the vertical dimension (the dimension in the direction perpendicular to the plane of FIG. 1), and each other The distance between the convex portions 7 adjacent to each other (the dimension in the left-right direction in FIG. 1) is, for example, the same size as the wavelength of visible light. Moreover, the height dimension of the convex part 7 is larger than the horizontal dimension or the vertical dimension of the convex part 7.

これによって、基板3の厚さ方向の一方の面(図1では基板3の上面)には、ドット&スペースの形態で複数の柱状の凸部7(転写パターン5)が形成されていることになる。なお、各凸部7がライン&スペースの形態で形成されていてもよい。また、凸部7が設けられていないところ(お互いが隣接している各凸部7の間)では、基板3が剥き出しになって露出している。すなわち、型1では、図1で示すような残膜8が除去されて非存在の状態になっている。   As a result, a plurality of columnar convex portions 7 (transfer patterns 5) are formed in the form of dots and spaces on one surface in the thickness direction of the substrate 3 (the upper surface of the substrate 3 in FIG. 1). Become. In addition, each convex part 7 may be formed in the form of a line & space. Moreover, the board | substrate 3 is exposed and exposed in the place where the convex part 7 is not provided (between each convex part 7 which mutually adjoins). That is, in the mold 1, the remaining film 8 as shown in FIG.

転写パターン5は、図1では、基板3の全面に設けられているが、転写パターン5が、基板3の一部に設けられている構成であってもよい。たとえば、転写パターン5が、基板3の厚さ方向の一方の面の中央部のみに設けられている構成であってもよいし、基板3の厚さ方向の一方の面の周辺部のみに設けられている構成であってもよい。   In FIG. 1, the transfer pattern 5 is provided on the entire surface of the substrate 3, but the transfer pattern 5 may be provided on a part of the substrate 3. For example, the transfer pattern 5 may be provided only at the center of one surface of the substrate 3 in the thickness direction, or may be provided only at the periphery of one surface of the substrate 3 in the thickness direction. It may be configured as described above.

各凸部7の生成は、マスクレスリゾグラフィ(maskless lithography)によってなされるのであるが、上記特許文献1(特開2009−208316号公報)に記載されているような転写で生成してもよいし、フォトリソグラフィとエッチングとで生成されてもよい。   Each projection 7 is generated by maskless lithography, but may be generated by transfer as described in Patent Document 1 (Japanese Patent Laid-Open No. 2009-208316). However, it may be generated by photolithography and etching.

また、凸部7を構成している光を遮断する材料として、不透明な合成樹脂(たとえば黒インクを混ぜた紫外線硬化樹脂)等が採用されている。   Further, an opaque synthetic resin (for example, an ultraviolet curable resin mixed with black ink) or the like is employed as a material that blocks light constituting the convex portion 7.

型1において、転写で各凸部7として、紫外線硬化樹脂に代えて、熱硬化性樹脂や熱可塑性樹脂を採用してもよい。そして、常温よりも高い温度もしくは常温で各凸部7を生成してもよい。   In the mold 1, instead of the ultraviolet curable resin, a thermosetting resin or a thermoplastic resin may be adopted as each convex portion 7 by transfer. And each convex part 7 may be produced | generated at temperature higher than normal temperature, or normal temperature.

被成形品9は、図4で示すように、基材(基板)11と被成形体13とを備えて構成されている。基材11は、たとえば、PETフィルム(ポリエチレンテレフタレートで矩形な平板状に形成された材料)で構成されている。   As illustrated in FIG. 4, the molded product 9 includes a base material (substrate) 11 and a molded body 13. The substrate 11 is made of, for example, a PET film (a material formed into a rectangular flat plate shape using polyethylene terephthalate).

被成形体13は、硬化した光硬化性樹脂(たとえば紫外線硬化樹脂)で構成されている。また、被成形体13は、複数の微細な凸部15で形成されている。各凸部15は、基材11の厚さ方向の一方の面にお互いが離れて一体的に設けられている。   The to-be-molded body 13 is comprised with the hardened photocurable resin (for example, ultraviolet curable resin). The molded body 13 is formed with a plurality of fine convex portions 15. The protrusions 15 are integrally provided on one surface in the thickness direction of the substrate 11 so as to be separated from each other.

なお、詳しくは後述するが、被成形体13は、型1の転写パターン5を転写することで形成されている。   Although described in detail later, the molded body 13 is formed by transferring the transfer pattern 5 of the mold 1.

したがって、被成形体13の凸部15は、微細な直方体状に形成されている。凸部15の高さ(図4の上下方向の寸法)、横方向の寸法(図4の左右方向の寸法)、縦方向(図4の紙面に直交する方向の寸法)の寸法、および、お互いが隣接している各凸部15間の距離(図4の左右方向の寸法)も、図1に示す各凸部7と同様に、たとえば、可視光線の波長と同程度の大きさになっている。   Therefore, the convex portion 15 of the molded body 13 is formed in a fine rectangular parallelepiped shape. The height of the convex portion 15 (the vertical dimension in FIG. 4), the horizontal dimension (the horizontal dimension in FIG. 4), the vertical dimension (the dimension in the direction perpendicular to the plane of FIG. 4), and each other The distance between the convex portions 15 adjacent to each other (dimension in the left-right direction in FIG. 4) is, for example, the same size as the wavelength of visible light, similarly to each convex portion 7 shown in FIG. Yes.

また、凸部15が設けられていないところ(お互いが隣接している各凸部15の間)では、基材11が剥き出しになって露出している。   Moreover, in the place where the convex part 15 is not provided (between each convex part 15 which mutually adjoins), the base material 11 is exposed and exposed.

被成形体13は、図4では、基材11の全面に設けられているが、型1の場合と同様にして、被成形体13が、基材11の一部に設けられている構成であってもよい。   In FIG. 4, the molded body 13 is provided on the entire surface of the base material 11, but in the same manner as in the case of the mold 1, the molded body 13 is provided on a part of the base material 11. There may be.

ここで、被成形品9の成形方法について説明する。   Here, a method for forming the product 9 will be described.

被成形品9は、たとえば、未硬化被成形材料設置工程と型設置工程と被成形材料硬化工程と型離反工程と未硬化被成形材料除去工程とを経て生成されるようになっている。   The molded product 9 is generated through, for example, an uncured molded material installation process, a mold installation process, a molded material curing process, a mold separation process, and an uncured molded material removal process.

未硬化被成形材料設置工程は、基材11の厚さ方向の一方の面に、光の照射によって硬化する未硬化の被成形材料(レジン(resin);たとえば紫外線硬化樹脂等の光硬化性材料)を設ける工程である(図示せず)。未硬化被成形材料設置工程で設置された未硬化の被成形材料は、平板状の基材11の厚さ方向の一方の面で薄い膜状になっている。   In the uncured molding material installation step, an uncured molding material (resin; for example, a photocurable material such as an ultraviolet curable resin) is cured on one surface in the thickness direction of the base material 11 by light irradiation. ) Is provided (not shown). The uncured molding material installed in the uncured molding material installation step has a thin film shape on one surface in the thickness direction of the flat substrate 11.

型設置工程は、図2で示すように、型1の転写パターン5が未硬化被成形材料設置工程で設置された未硬化の紫外線硬化樹脂17に密着するように、型1を紫外線硬化樹脂17に設置する工程である。   In the mold installation step, as shown in FIG. 2, the mold 1 is placed on the ultraviolet curable resin 17 so that the transfer pattern 5 of the mold 1 is in close contact with the uncured ultraviolet curable resin 17 installed in the uncured molding material installation step. It is the process of installing in.

型設置工程で型1が設置された状態についてさらに説明すると、型1の基板3の厚さ方向と被成品の基材11の厚さ方向とがお互いに一致しており、基板3と基材11とが、転写パターン5の凸部7の高さの値よりもごく僅かに大きい距離を隔て、お互いに対向している。   The state in which the mold 1 is installed in the mold installation process will be further described. The thickness direction of the substrate 3 of the mold 1 and the thickness direction of the base material 11 of the finished product match each other. 11 are opposed to each other with a distance slightly larger than the height value of the convex portion 7 of the transfer pattern 5.

また、図2に示す状態では、たとえば、型1が下方に付勢されている。これにより、型と基材11とで、未硬化の紫外線硬化樹脂17が挟まれて所定の力で押圧されていることになる。   In the state shown in FIG. 2, for example, the mold 1 is biased downward. Thereby, the uncured ultraviolet curable resin 17 is sandwiched between the mold and the substrate 11 and pressed with a predetermined force.

上記押圧がなされているにもかかわらず、図2に示す状態では、型1の凸部7の先端(図2では下端)と基材11との間に、未硬化の紫外線硬化樹脂17のごく薄い部位17Aが存在している。この部位17Aは、従来の転写で残膜になる部位である。   In spite of the above pressing, in the state shown in FIG. 2, an uncured UV curable resin 17 is very small between the tip (the lower end in FIG. 2) of the mold 1 and the substrate 11. A thin portion 17A exists. This portion 17A is a portion that becomes a remaining film by conventional transfer.

被成形材料硬化工程は、図2で示すように、型設置工程で型1を紫外線硬化樹脂17(紫外線硬化樹脂17が設けられた基材11)に設置した後、型1の基板3を通して被成形材料17に光(たとえば紫外線)を照射し、紫外線硬化樹脂17の一部(光が照射された部位)17Bを硬化する工程である。   In the molding material curing step, as shown in FIG. 2, the mold 1 is placed on the ultraviolet curable resin 17 (the base material 11 provided with the ultraviolet curable resin 17) in the mold installation step, and then passed through the substrate 3 of the mold 1. This is a step of irradiating the molding material 17 with light (for example, ultraviolet rays) to cure a part (part irradiated with light) 17B of the ultraviolet curable resin 17.

紫外線は、型1の上方に設置された紫外線発生装置19によって生成される。紫外線発生装置19が発した紫外線(たとえば平行光線)は、型1の基板3を通って、紫外線硬化樹脂17に照射される。ただし、紫外線が紫外線硬化樹脂17の総ての部位に照射されるわけではない。すなわち、型1に設けられている凸部7が紫外線を遮断するので、紫外線発生装置19が発した紫外線は、各凸部7の間に存在している部位(たとえば直方体状の部位)17Bには照射されるが、前述した部位17Aには照射されない。   Ultraviolet rays are generated by an ultraviolet ray generator 19 installed above the mold 1. Ultraviolet rays (for example, parallel rays) emitted from the ultraviolet ray generator 19 pass through the substrate 3 of the mold 1 and are applied to the ultraviolet curable resin 17. However, not all the portions of the ultraviolet curable resin 17 are irradiated with ultraviolet rays. That is, since the convex portion 7 provided in the mold 1 blocks the ultraviolet rays, the ultraviolet rays emitted by the ultraviolet ray generator 19 are applied to the portions (for example, a rectangular parallelepiped portion) 17B existing between the convex portions 7. Is irradiated, but the aforementioned portion 17A is not irradiated.

これによって、被成形材料硬化工程では、紫外線硬化樹脂17の部位17Bが硬化し、部位17Aは硬化しない。   Thereby, in the molding material curing step, the portion 17B of the ultraviolet curable resin 17 is cured, and the portion 17A is not cured.

型離反工程は、被成形材料硬化工程で紫外線硬化樹脂の一部17Bを硬化した後、型1を被成形材料17から離す工程である。型離反工程で、型1を被成形材料17から離すと、図3で示すようになる。図3では、基材11の厚さ方向の一方の面に、被成形体13(各凸部15;硬化した紫外線硬化樹脂17B)が形成されている。また、各凸部15の間であって各凸部15の底部(基端)には、ごく薄い未硬化の紫外線硬化樹脂17Aが存在している。   The mold separation process is a process of separating the mold 1 from the molding material 17 after curing a part 17B of the ultraviolet curable resin in the molding material curing process. When the mold 1 is separated from the material to be molded 17 in the mold separation process, it is as shown in FIG. In FIG. 3, a molded body 13 (each convex portion 15; a cured ultraviolet curable resin 17 </ b> B) is formed on one surface in the thickness direction of the base material 11. Further, a very thin uncured ultraviolet curable resin 17A exists between the convex portions 15 and at the bottom (base end) of each convex portion 15.

未硬化被成形材料除去工程は、型離反工程で紫外線硬化樹脂17から型1を離した後、未硬化の紫外線硬化樹脂17Aを除去する工程である。未硬化の紫外線硬化樹脂17Aの除去は、未硬化の紫外線硬化樹脂17Aをたとえば溶剤(硬化した紫外線硬化樹脂17Bは溶かさない溶剤)に溶かすことでなされる。   The uncured molding material removing step is a step of removing the uncured ultraviolet curable resin 17A after releasing the mold 1 from the ultraviolet curable resin 17 in the mold separation step. The uncured ultraviolet curable resin 17A is removed by dissolving the uncured ultraviolet curable resin 17A in, for example, a solvent (a solvent that does not dissolve the cured ultraviolet curable resin 17B).

被成形品の成形方法によれば、被成形品9に残っている残膜17Aが未硬化になっているので、残膜の除去が容易になる。また、未硬化の残膜17Aを除去するので、従来のように硬化している残膜をアッシング(Oアッシング)等で除去する場合に比べて、本来除去されてはならない部位17B(光硬化性材料で硬化している凸部15)の損傷や欠落をほぼ無くすことができる。 According to the molding method of the molded product, the residual film 17A remaining on the molded product 9 is uncured, so that the residual film can be easily removed. Further, since the uncured residual film 17A is removed, the portion 17B that should not be removed originally (photocuring) compared to the case where the cured residual film is removed by ashing (O 2 ashing) or the like as in the prior art. It is possible to substantially eliminate the damage and omission of the convex portion 15) hardened with the functional material.

1 型
3 基板
5 転写パターン
7 凸部
9 被成形品
11 基材
17 未硬化の被成形材料
17A 硬化しない被成形材料の部位
17B 硬化する被成形材料の部位
DESCRIPTION OF SYMBOLS 1 type | mold 3 board | substrate 5 transfer pattern 7 convex part 9 molded product 11 base material 17 uncured molding material 17A site | part of the molding material which does not harden 17B site | part of the molding material which hardens | cures

Claims (2)

光が透過する材料で構成された基板と、
光を遮断する材料で構成され、前記基板の厚さ方向の一方の面にお互いが離れて設けられた複数の微細な凸部で形成された転写パターンと、
を有することを特徴とする型。
A substrate made of a material that transmits light;
A transfer pattern formed of a plurality of fine convex portions that are made of a material that blocks light and are provided apart from each other on one surface in the thickness direction of the substrate;
A mold characterized by having.
基材に、光の照射によって硬化する未硬化の被成形材料を設ける未硬化被成形材料設置工程と、
光が透過する材料で構成された基板と、光を遮断する材料で構成され前記基板の厚さ方向の一方の面にお互いが離れて設けられた複数の微細な凸部で形成された転写パターンとを有する型の前記転写パターンが、前記未硬化被成形材料設置工程で設置された未硬化の被成形材料に密着するように、前記型を前記被成形材料に設置する型設置工程と、
前記型設置工程で前記型を前記被成形材料に設置した後、前記型の基板を通して前記被成形材料に光を照射し前記被成形材料の一部を硬化させる被成形材料硬化工程と、
前記被成形材料硬化工程で前記被成形材料の一部を硬化した後、前記型を前記被成形材料から離す型離反工程と、
前記型離反工程で前記被成形材料から前記型を離した後、未硬化の被成形材料を除去する未硬化被成形材料除去工程と、
を有することを特徴とする被成形品の成形方法。
An uncured molding material installation step for providing a base material with an uncured molding material that is cured by light irradiation;
A transfer pattern formed of a substrate made of a material that transmits light, and a plurality of fine protrusions that are made of a material that blocks light and are provided apart from each other on one surface in the thickness direction of the substrate. A mold installation step of installing the mold on the molding material such that the transfer pattern of the mold has a close contact with the uncured molding material installed in the uncured molding material installation step;
A molding material curing step of irradiating the molding material with light through a substrate of the mold and curing a part of the molding material after the mold is installed in the molding material in the mold installation step;
A mold separation step of separating the mold from the molding material after curing a part of the molding material in the molding material curing process;
An uncured molding material removing step of removing the uncured molding material after separating the mold from the molding material in the mold separation step;
A method for forming a molded article, comprising:
JP2011284936A 2011-12-27 2011-12-27 Mold and method for molding article to be molded Pending JP2013135107A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108650794A (en) * 2018-06-04 2018-10-12 上海量子绘景电子股份有限公司 A kind of preparation method of wiring board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008168465A (en) * 2007-01-09 2008-07-24 Yamaha Corp Minute molding mold and its manufacturing method
JP2010158805A (en) * 2009-01-07 2010-07-22 Murata Mfg Co Ltd Method of manufacturing mold for photo imprinting
JP2010245130A (en) * 2009-04-01 2010-10-28 Jsr Corp Stamper and optical imprint lithography method using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008168465A (en) * 2007-01-09 2008-07-24 Yamaha Corp Minute molding mold and its manufacturing method
JP2010158805A (en) * 2009-01-07 2010-07-22 Murata Mfg Co Ltd Method of manufacturing mold for photo imprinting
JP2010245130A (en) * 2009-04-01 2010-10-28 Jsr Corp Stamper and optical imprint lithography method using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108650794A (en) * 2018-06-04 2018-10-12 上海量子绘景电子股份有限公司 A kind of preparation method of wiring board

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