JP2008141058A - 電子装置 - Google Patents
電子装置 Download PDFInfo
- Publication number
- JP2008141058A JP2008141058A JP2006327296A JP2006327296A JP2008141058A JP 2008141058 A JP2008141058 A JP 2008141058A JP 2006327296 A JP2006327296 A JP 2006327296A JP 2006327296 A JP2006327296 A JP 2006327296A JP 2008141058 A JP2008141058 A JP 2008141058A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- lead frame
- frame connector
- component
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
- H05K2201/10318—Surface mounted metallic pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10856—Divided leads, e.g. by slot in length direction of lead, or by branching of the lead
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10924—Leads formed from a punched metal foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
【解決手段】樹脂基板19の電極とアルミベース27表面に絶縁層29を形成してなる金属基板の電極37をリードフレームコネクタで接続するに当たり、リードフレームコネクタピン31の金属基板への接合部分を本体部分に対し両側に形成した接合部分で接続し、接合強度を向上させた電子装置。
【選択図】図7
Description
また、はんだを用いない接合方法として、リードフレームコネクタとパッドを超音波で接合する方法がある。基板がLTCCやSiCなどのセラミック系の基板の場合、基板の剛性が十分なため、超音波のパワーが効率良く接合部に伝わり、接合強度は十分高くすることができるがコストが高くなるという課題がある。この課題を解決するため、絶縁層に樹脂を用いた金属ベース基板を用いる場合があるが、超音波のパワーを樹脂絶縁層が吸収してしまい、接合強度が弱くなってしまうために接合部が片側だけであると十分な接合強度が得られなくなる。
Claims (8)
- 第一の部品を搭載した第一の基板と、第二の部品を搭載した第二の基板と、本体部分と前記本体部分との境界位置に前記本体部分に対し互いに反対方向にほぼ直角に突き出した形状に形成された第一の接合部を一端にかつ他端に第二の接合部を有し前記第一の基板と前記第二の基板とを接続するリードフレームコネクタとを備え、前記リードフレームコネクタの前記第一の接合部を前記第一の基板に設けられた電極パッドに接合し前記リードフレームコネクタの前記第二の接合部を前記第二の基板に設けられた電極に接合して前記第一の基板と前記第二の基板とを接続したことを特徴とする電子装置。
- 第一の部品を搭載した第一の基板と、第二の部品を搭載した第二の基板と、一端をT形状に形成され前記第一の基板と前記第二の基板とを接続するリードフレームコネクタとを備え、前記T形状に形成された一端を前記第一の基板に設けられた電極パッドに接合し他端を前記第二の基板に設けられた電極に接合して前記リードフレームコネクタにより前記第一の基板と前記第二の基板とを接続したことを特徴とする電子装置。
- 前記第一の部品が高発熱な部品であり、前記第二の部品が低発熱な部品であることを特徴とする請求項1又は請求項2に記載の電子装置。
- 前記第一の基板と前記第二の基板とが、それぞれ部品が搭載された面が向き合うように対向させて配置されていることを特徴とする請求項1又は請求項2に記載の電子装置。
- 前記第一の基板が金属ベース基板であり、前記第二の基板が樹脂基板であることを特徴とする請求項1又は請求項2に記載の電子装置。
- 前記第一の接合部は複数に分割されて形成されていることを特徴とする請求項1に記載の電子装置。
- 前記リードフレームコネクタの接合部と前記電極パッドとの間に、アルミの箔を挟んで超音波接合されていることを特徴とする請求項1又は請求項2に記載の電子装置。
- 前記リードフレームコネクタと前記電極パッドの素材が銅であることを特徴とする請求項7記載の電子装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006327296A JP4537370B2 (ja) | 2006-12-04 | 2006-12-04 | 電子装置 |
EP07023165.9A EP1931183B1 (en) | 2006-12-04 | 2007-11-29 | Electronic device |
CNB2007101960978A CN100539308C (zh) | 2006-12-04 | 2007-12-03 | 电子装置 |
US11/949,849 US20080142571A1 (en) | 2006-12-04 | 2007-12-04 | Electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006327296A JP4537370B2 (ja) | 2006-12-04 | 2006-12-04 | 電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008141058A true JP2008141058A (ja) | 2008-06-19 |
JP4537370B2 JP4537370B2 (ja) | 2010-09-01 |
Family
ID=39186973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006327296A Expired - Fee Related JP4537370B2 (ja) | 2006-12-04 | 2006-12-04 | 電子装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20080142571A1 (ja) |
EP (1) | EP1931183B1 (ja) |
JP (1) | JP4537370B2 (ja) |
CN (1) | CN100539308C (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014132424A1 (ja) * | 2013-02-28 | 2014-09-04 | 新電元工業株式会社 | 電子モジュールおよびその製造方法 |
WO2014132425A1 (ja) * | 2013-02-28 | 2014-09-04 | 新電元工業株式会社 | 電子モジュールおよびその製造方法 |
US9991184B2 (en) | 2013-05-13 | 2018-06-05 | Shindengen Electric Manufacturing Co., Ltd. | Electronic module and method of manufacturing the same |
JP2018190930A (ja) * | 2017-05-11 | 2018-11-29 | 三菱電機株式会社 | パワー半導体モジュール及びその製造方法並びに電力変換装置 |
JP2019160851A (ja) * | 2018-03-08 | 2019-09-19 | 日本特殊陶業株式会社 | 配線基板およびその製造方法 |
JP2022159012A (ja) * | 2021-03-31 | 2022-10-17 | ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト | 半導体パワーモジュールのための金属基板構造および金属基板構造の製造方法ならびに半導体パワーモジュール |
WO2023286531A1 (ja) * | 2021-07-13 | 2023-01-19 | ローム株式会社 | 半導体装置、および半導体装置の製造方法 |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090272577A1 (en) * | 2006-04-27 | 2009-11-05 | Neomax Materials Co., Ltd. | Clad material for wiring connection and wiring connection member processed from the clad material |
US20100248029A1 (en) * | 2009-01-07 | 2010-09-30 | A123 Systems, Inc. | Methods of welding battery terminals |
EP2538761B1 (en) | 2011-06-20 | 2014-01-29 | STMicroelectronics Srl | Intelligent Power Module and related assembling method |
JP2014216123A (ja) * | 2013-04-24 | 2014-11-17 | タイコエレクトロニクスジャパン合同会社 | 電気コネクタ組立体及びその実装構造 |
JP6366723B2 (ja) | 2014-08-28 | 2018-08-01 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
US9613246B1 (en) * | 2014-09-16 | 2017-04-04 | Apple Inc. | Multiple scan element array ultrasonic biometric scanner |
US9952095B1 (en) | 2014-09-29 | 2018-04-24 | Apple Inc. | Methods and systems for modulation and demodulation of optical signals |
US9904836B2 (en) | 2014-09-30 | 2018-02-27 | Apple Inc. | Reducing edge effects within segmented acoustic imaging systems |
US9747488B2 (en) | 2014-09-30 | 2017-08-29 | Apple Inc. | Active sensing element for acoustic imaging systems |
US9984271B1 (en) | 2014-09-30 | 2018-05-29 | Apple Inc. | Ultrasonic fingerprint sensor in display bezel |
US9979955B1 (en) | 2014-09-30 | 2018-05-22 | Apple Inc. | Calibration methods for near-field acoustic imaging systems |
US10133904B2 (en) | 2014-09-30 | 2018-11-20 | Apple Inc. | Fully-addressable sensor array for acoustic imaging systems |
US9607203B1 (en) | 2014-09-30 | 2017-03-28 | Apple Inc. | Biometric sensing device with discrete ultrasonic transducers |
US9824254B1 (en) | 2014-09-30 | 2017-11-21 | Apple Inc. | Biometric sensing device with discrete ultrasonic transducers |
CN104772541B (zh) * | 2015-04-10 | 2016-09-28 | 安徽铜峰电子股份有限公司 | 可增加电容器喷金端面与引线连接强度的焊接方法 |
US11048902B2 (en) | 2015-08-20 | 2021-06-29 | Appple Inc. | Acoustic imaging system architecture |
US10325136B1 (en) | 2015-09-29 | 2019-06-18 | Apple Inc. | Acoustic imaging of user input surfaces |
EP3297409B1 (en) * | 2016-09-16 | 2022-10-12 | OSRAM GmbH | A method of connecting lighting modules and corresponding device |
JP6673268B2 (ja) * | 2017-03-14 | 2020-03-25 | オムロン株式会社 | 管理装置、管理装置の制御方法、情報処理プログラム、および記録媒体 |
US10802651B2 (en) | 2018-01-30 | 2020-10-13 | Apple Inc. | Ultrasonic touch detection through display |
US20190291204A1 (en) | 2018-03-20 | 2019-09-26 | Texas Instruments Incorporated | Ribbon wire bond |
US10862232B2 (en) * | 2018-08-02 | 2020-12-08 | Dell Products L.P. | Circuit board pad connector system |
CN109346449B (zh) * | 2018-11-13 | 2024-04-16 | 北方电子研究院安徽有限公司 | 一种大功率高电压ltcc模块散热封装 |
JP7036045B2 (ja) | 2019-01-15 | 2022-03-15 | 三菱電機株式会社 | 半導体装置の製造方法 |
US11950512B2 (en) | 2020-03-23 | 2024-04-02 | Apple Inc. | Thin-film acoustic imaging system for imaging through an exterior surface of an electronic device housing |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0268452U (ja) * | 1988-11-15 | 1990-05-24 | ||
JPH03112074A (ja) * | 1989-09-27 | 1991-05-13 | Toshiba Lighting & Technol Corp | 回路基板用リードピン |
JPH06216505A (ja) * | 1993-01-14 | 1994-08-05 | Matsushita Electric Works Ltd | プリント配線板への端子の接続方法 |
JPH11330690A (ja) * | 1998-05-14 | 1999-11-30 | Oki Electric Ind Co Ltd | 基板の実装方法、基板の実装構造、半導体装置及び実装基板 |
JP2002141645A (ja) * | 2000-10-31 | 2002-05-17 | Fujikura Ltd | 可撓性プリント基板と接続端子との接合構造及び接合方法 |
JP2004207565A (ja) * | 2002-12-26 | 2004-07-22 | Shindengen Electric Mfg Co Ltd | 基板接続構造及びそれを用いた電源装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5403785A (en) * | 1991-03-03 | 1995-04-04 | Matsushita Electric Works, Ltd. | Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby |
JP2850606B2 (ja) * | 1991-11-25 | 1999-01-27 | 富士電機株式会社 | トランジスタモジュール |
JP2854757B2 (ja) * | 1992-06-17 | 1999-02-03 | 三菱電機株式会社 | 半導体パワーモジュール |
JP2973799B2 (ja) * | 1993-04-23 | 1999-11-08 | 富士電機株式会社 | パワートランジスタモジュール |
DE19645636C1 (de) * | 1996-11-06 | 1998-03-12 | Telefunken Microelectron | Leistungsmodul zur Ansteuerung von Elektromotoren |
US6101094A (en) * | 1998-12-18 | 2000-08-08 | Sun Microsystems, Inc. | Printed circuit board with integrated cooling mechanism |
JP4479083B2 (ja) * | 2000-10-03 | 2010-06-09 | パナソニック株式会社 | 誘電体フィルタ及び端子 |
US6747875B2 (en) * | 2001-06-19 | 2004-06-08 | Innoveta Technologies | Surface mount power supplies for standard assembly process |
JP2006179312A (ja) | 2004-12-22 | 2006-07-06 | Matsushita Electric Works Ltd | モジュール用コネクタ |
-
2006
- 2006-12-04 JP JP2006327296A patent/JP4537370B2/ja not_active Expired - Fee Related
-
2007
- 2007-11-29 EP EP07023165.9A patent/EP1931183B1/en not_active Expired - Fee Related
- 2007-12-03 CN CNB2007101960978A patent/CN100539308C/zh not_active Expired - Fee Related
- 2007-12-04 US US11/949,849 patent/US20080142571A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0268452U (ja) * | 1988-11-15 | 1990-05-24 | ||
JPH03112074A (ja) * | 1989-09-27 | 1991-05-13 | Toshiba Lighting & Technol Corp | 回路基板用リードピン |
JPH06216505A (ja) * | 1993-01-14 | 1994-08-05 | Matsushita Electric Works Ltd | プリント配線板への端子の接続方法 |
JPH11330690A (ja) * | 1998-05-14 | 1999-11-30 | Oki Electric Ind Co Ltd | 基板の実装方法、基板の実装構造、半導体装置及び実装基板 |
JP2002141645A (ja) * | 2000-10-31 | 2002-05-17 | Fujikura Ltd | 可撓性プリント基板と接続端子との接合構造及び接合方法 |
JP2004207565A (ja) * | 2002-12-26 | 2004-07-22 | Shindengen Electric Mfg Co Ltd | 基板接続構造及びそれを用いた電源装置 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014132424A1 (ja) * | 2013-02-28 | 2014-09-04 | 新電元工業株式会社 | 電子モジュールおよびその製造方法 |
WO2014132425A1 (ja) * | 2013-02-28 | 2014-09-04 | 新電元工業株式会社 | 電子モジュールおよびその製造方法 |
US9991184B2 (en) | 2013-05-13 | 2018-06-05 | Shindengen Electric Manufacturing Co., Ltd. | Electronic module and method of manufacturing the same |
JP2018190930A (ja) * | 2017-05-11 | 2018-11-29 | 三菱電機株式会社 | パワー半導体モジュール及びその製造方法並びに電力変換装置 |
JP7026451B2 (ja) | 2017-05-11 | 2022-02-28 | 三菱電機株式会社 | パワー半導体モジュール及びその製造方法並びに電力変換装置 |
JP2019160851A (ja) * | 2018-03-08 | 2019-09-19 | 日本特殊陶業株式会社 | 配線基板およびその製造方法 |
JP2022159012A (ja) * | 2021-03-31 | 2022-10-17 | ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト | 半導体パワーモジュールのための金属基板構造および金属基板構造の製造方法ならびに半導体パワーモジュール |
JP7237214B2 (ja) | 2021-03-31 | 2023-03-10 | ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト | 半導体パワーモジュールのための金属基板構造および金属基板構造の製造方法ならびに半導体パワーモジュール |
WO2023286531A1 (ja) * | 2021-07-13 | 2023-01-19 | ローム株式会社 | 半導体装置、および半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1931183B1 (en) | 2013-11-06 |
US20080142571A1 (en) | 2008-06-19 |
CN101197472A (zh) | 2008-06-11 |
CN100539308C (zh) | 2009-09-09 |
EP1931183A2 (en) | 2008-06-11 |
EP1931183A3 (en) | 2009-09-30 |
JP4537370B2 (ja) | 2010-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4537370B2 (ja) | 電子装置 | |
US7791888B2 (en) | Electronic control apparatus | |
US20080278918A1 (en) | Electronic control apparatus | |
CN108370142B (zh) | 电路结构体及电气接线盒 | |
KR20090049522A (ko) | 전자 제어 장치 및 전자 제어 장치의 제조 방법 | |
JPH09330996A (ja) | 電子パッケージ | |
JP4218434B2 (ja) | 電子装置 | |
JP2007234781A (ja) | 半導体装置及び放熱部材 | |
EP1571706B1 (en) | Electronic device | |
US20110085314A1 (en) | Electrical circuit system and method for producing an electrical circuit system | |
JP5169800B2 (ja) | 電子装置 | |
JP4407067B2 (ja) | 電子装置 | |
JPH05121644A (ja) | 電子回路デバイス | |
JPH08111568A (ja) | ヒートシンク付プリント配線基板 | |
JPWO2010070779A1 (ja) | 異方性導電樹脂、基板接続構造及び電子機器 | |
JP2007035843A (ja) | 電子回路装置 | |
JP4100685B2 (ja) | 半導体装置 | |
JP2010073972A (ja) | 接合シート及び電子回路装置並びに製造方法 | |
CN112056011A (zh) | 电路结构体及电连接箱 | |
JP2010082668A (ja) | 接合構造及びその製造方法 | |
JP2010040569A (ja) | 電子部品モジュール | |
JP3988629B2 (ja) | 電子装置 | |
US11387210B2 (en) | Semiconductor module and manufacturing method therefor | |
KR101096320B1 (ko) | 회로기판 조립체 및 그 제조 방법 | |
JP4300087B2 (ja) | 電子部品の基板実装構造及び電子部品の基板実装方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080715 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20081128 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081209 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090209 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090804 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091002 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20100108 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20100108 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100330 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100506 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100601 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100617 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130625 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |