JP2008135387A - バックライティングに使用するための薄型で高効率の照明装置 - Google Patents
バックライティングに使用するための薄型で高効率の照明装置 Download PDFInfo
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/18—Edge-illuminated signs
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
- G02B6/0031—Reflecting element, sheet or layer
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/18—Edge-illuminated signs
- G09F2013/1872—Casing
- G09F2013/1877—Stand-like
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
- G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
- G09F2013/222—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent with LEDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
- Led Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Liquid Crystal (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
【解決手段】フレキシブル基板(23)、及びLEDを有する複数のダイ(21)を有する光源。光源(20)は、光源(20)を適切なライトパイプ(210)に結合することにより分散光源(20)を提供するために都合良く利用され得る。基板は、第1及び第2の領域に分割される。ダイ(21)は、第1の領域において基板に付着される。第2の領域における基板の表面部分(29,30)は反射性である。基板は、有用でない方向に放出された光をより有用な方向に反射する反射器を、第2の領域(29,30)が形成するように曲げられる。基板は、3つの層のフレキシブルな回路支持体から構成されることができ、この場合、ダイ(21)で生成された熱に対する改善された熱経路を提供するように、ダイ(21)が下側金属層に実装される。
【選択図】図3
Description
21 ダイ
22 カプセル材料
23 フレキシブル基板
25 コネクタ
29、30 側部領域
91-93、267-269 トレース
210 ライトパイプ
212-214 平面状剛性セクション
222-224 剛性セクション
Claims (10)
- 光源(20)であって、
上側金属層と下側金属層との間に挟まれた誘電体層を有し、第1及び第2の領域に分割されたフレキシブル基板(23)と、
前記第1の領域において前記下側金属層に付着された複数のダイ(21)とを含み、
各ダイ(21)が光を放出する半導体発光デバイスからなり、前記第1の領域が、前記第1の領域における前記下側金属層に対する法線により特徴付けられ、前記上側金属層と下側金属層の少なくとも一方が、前記光源(20)の外部にある回路に前記ダイ(21)を接続するための複数の電気トレース(91-93、267-269)を含み、
前記基板の前記上側金属層が前記第2の領域(29、30)において反射性であり、前記基板は、前記第1の領域が前記第2の領域(29、30)に対して或る角度をなし、前記法線に対して0より大きい最初の角度で前記ダイ(21)から放出された光の一部が前記第2の領域(29、30)に当たって、前記最初の角度より小さい、前記法線に対する角度を有する方向に前記第2の領域から反射されるように曲げられる、光源(20) - 前記フレキシブル基板(23)が600μm未満の厚みを有する、請求項1に記載の光源(20)。
- 前記第2の領域(29、30)が、前記上側金属層に付着された反射層を含む、請求項1に記載の光源(20)。
- 前記ダイ(21)が、前記第1の領域においてカプセル材料(22)の層によって覆われている、請求項1に記載の光源(20)。
- 前記基板が、前記第1の領域の外側にあり、且つ前記トレース(91-93、267-269)に接続された複数の電気コンタクト有するコネクタ領域(25)を含み、前記コネクタ領域(25)が、前記光源(20)の外部にあるコネクタに嵌合するように構成されている、請求項1に記載の光源(20)
- 前記下側金属層に付着された剛性部材(212-214、222-224)を更に含む、請求項1に記載の光源(20)。
- 分散光源(20)であって、
ダイの実装領域、並びに第1及び第2の取付領域(29、30)に分割されたフレキシブル基板(23)を含む光源(20)と、
前記ダイの実装領域において前記基板に付着され、それぞれが光を放出する半導体発光デバイスからなる複数のダイ(21)と、
上面と底面、及び第1のエッジ表面を有する透明な材料の薄板からなるライトパイプ(210)とを含み、
前記光源(20)は、前記第1の取付領域の一部が前記上面に付着され、且つ前記第2の取付領域の一部が前記底面に付着されるように、前記薄板に取付けられており、前記ダイの実装領域は、前記ダイ(21)からの光が前記第1のエッジ表面を通じて前記薄板に入射するように、前記第1のエッジ表面と向かい合って配置されている、分散光源(20)。 - 前記第1及び第2の取付領域(29、30)の一部が、前記フレキシブル基板(23)の外面上に反射性コーティングを含み、前記反射性コーティングが前記ダイ(21)から放出された前記光の一部を反射するように配置されている、請求項7に記載の分散光源(20)。
- 前記フレキシブル基板(23)が上面と底面を含み、前記分散光源(20)の上面が前記第1のエッジ表面と向かい合っており、前記分散光源(20)が、前記ダイの実装領域において前記フレキシブル基板(23)の前記底面に付着された剛性部材(212-214、222-224)を更に含む、請求項7に記載の分散光源(20)。
- 前記フレキシブル基板(23)が、前記ダイの実装領域の外側にあり、且つ前記ダイの実装領域内の電気トレース(91-93、267-269)に接続された複数の電気コンタクト有するコネクタ領域(25)を含み、前記コネクタ領域(25)が、前記光源(20)の外部にあるコネクタに嵌合するように構成されており、前記電気トレース(91-93、267-269)が前記ダイ(21)に接続されるトレースを含む、請求項9に記載の分散光源(20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US11/605,984 US7607815B2 (en) | 2006-11-27 | 2006-11-27 | Low profile and high efficiency lighting device for backlighting applications |
US11/605,984 | 2006-11-27 |
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JP2008135387A true JP2008135387A (ja) | 2008-06-12 |
JP4709819B2 JP4709819B2 (ja) | 2011-06-29 |
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Cited By (12)
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JP2012013723A (ja) * | 2010-06-29 | 2012-01-19 | Funai Electric Co Ltd | 液晶モジュール |
CN101625464B (zh) * | 2008-07-08 | 2012-11-14 | 乐金显示有限公司 | 液晶显示器件 |
JP2012529140A (ja) * | 2009-06-02 | 2012-11-15 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 空間を区切るための装置及びシステム |
JP2013004808A (ja) * | 2011-06-17 | 2013-01-07 | Citizen Electronics Co Ltd | 発光装置 |
JP2013535764A (ja) * | 2010-07-13 | 2013-09-12 | コーニンクレッカ フィリップス エヌ ヴェ | Tlレトロフィット管におけるledの安価なマウンティング |
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JP2016152304A (ja) * | 2015-02-17 | 2016-08-22 | 三菱電機株式会社 | 光源モジュールおよび発光装置 |
JP2017120792A (ja) * | 2017-03-28 | 2017-07-06 | 株式会社nittoh | 照明装置 |
US9711491B2 (en) | 2012-08-31 | 2017-07-18 | Nichia Corporation | Light-emitting device and method of manufacturing the same |
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JP2003090993A (ja) * | 2001-09-19 | 2003-03-28 | Kawaguchiko Seimitsu Co Ltd | 液晶表示装置用バックライト構造 |
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CN101625464B (zh) * | 2008-07-08 | 2012-11-14 | 乐金显示有限公司 | 液晶显示器件 |
KR101274709B1 (ko) * | 2008-07-08 | 2013-06-12 | 엘지디스플레이 주식회사 | 액정 표시 장치 |
JP2012529140A (ja) * | 2009-06-02 | 2012-11-15 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 空間を区切るための装置及びシステム |
US9116276B2 (en) | 2009-06-02 | 2015-08-25 | Koninklijke Philips N.V. | Room divider with illuminated light guide blind blade |
JP2011228602A (ja) * | 2010-04-23 | 2011-11-10 | Toray Ind Inc | Led発光装置およびその製造方法 |
JP2012013723A (ja) * | 2010-06-29 | 2012-01-19 | Funai Electric Co Ltd | 液晶モジュール |
JP2013535764A (ja) * | 2010-07-13 | 2013-09-12 | コーニンクレッカ フィリップス エヌ ヴェ | Tlレトロフィット管におけるledの安価なマウンティング |
JP2013004808A (ja) * | 2011-06-17 | 2013-01-07 | Citizen Electronics Co Ltd | 発光装置 |
JP2014029969A (ja) * | 2012-07-31 | 2014-02-13 | Nichia Chem Ind Ltd | 発光装置の製造方法 |
US9711491B2 (en) | 2012-08-31 | 2017-07-18 | Nichia Corporation | Light-emitting device and method of manufacturing the same |
US10083943B2 (en) | 2012-08-31 | 2018-09-25 | Nichia Corporation | Light-emitting device and method of manufacturing the same |
JP2018200899A (ja) * | 2014-05-15 | 2018-12-20 | ロヒンニ リミテッド ライアビリティ カンパニー | 光発生源を用いた光拡散 |
JP2016152304A (ja) * | 2015-02-17 | 2016-08-22 | 三菱電機株式会社 | 光源モジュールおよび発光装置 |
JP2017120792A (ja) * | 2017-03-28 | 2017-07-06 | 株式会社nittoh | 照明装置 |
JP2019110139A (ja) * | 2019-03-28 | 2019-07-04 | 三菱電機株式会社 | 光源モジュールおよび発光装置 |
Also Published As
Publication number | Publication date |
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JP4709819B2 (ja) | 2011-06-29 |
US20100002437A1 (en) | 2010-01-07 |
US7607815B2 (en) | 2009-10-27 |
US20080284308A1 (en) | 2008-11-20 |
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