1246785 九、發明說明： 【發明所屬之技術領域】 本發明係有關於發光二極體(light emitting diode，LED) 之裝置，尤其是關於一種備有發光二極體之翻轉側置結構 (flipped side-structure)的發光裝置。 【先前技術】 備有照明資訊源的光源在許多應用上是常被需要。特 別是液晶顯示器(liquid crystal display，LCD)在許多電子媒 體已越來越流行。液晶顯示器常被用在各式各樣的應用， 諸如桌上型電腦、顯示監視|§、影像相機、自動概員機顯 示器、電視以及航空顯示器等。通常液晶顯示器需要用背 光模組來照明欲被顯示的資訊。用在背光模組有各式各樣 的光源，如日光燈及發光二極體。日光燈價錢低廉且不需 要複雜的控制電路。惟，有時不適合某些需要好的色彩品 質及燈泡壽命長的某些應用上。發光二極體被提出來當作 液晶顯示器背光模組的光源有許多原因。相較於日光燈 泡，發光二極體光源的優點包括較長的壽命、替代容易、 穩健的機械特性、和較佳的色彩品質。某些應用（如航空 類）需要從液晶顯示器背光模組發射出的光彩度 (chromaticity)是明確的。然而大多數商用可取得的發光二 極體，其彩度的選擇是有限的且彩度會隨時間改變。 5 第一圖所示為一種揭露於美國第6,666,567號專利的 撐高式(raised)發光二極體100的發光二極體光源，用來 改進組合光(combined light)的彩度。此撐高式發光二極體 100包括一發光二極體101。此發光二極體101包在發光 二極體封裝102裡。此發光二極體封裝102被支撐在光學 共振腔板(floor of optical cavities) 103上方。此撐高式架構 容許光從發光二極體基底部發射出。此外，具反射性突出 物可置於此撐高式發光二極體的下方，來協助導正光行進 於執道。一種由日光燈泡及發光二極體組合成的架構也被 k出來，以形成一種混合式光源(hybrid light source)。然 而所有這些技術增加了光源的複雜度和成本。 如第二圖和第三圖所示，揭露於美國第6,6〇8,614號 專利的液晶顯示器200包含一個提供光第一彩度的第一 發光二極體陣列201及一個提供光第二彩度的第二發光 二極體陣列202。從發光二極體陣列2〇1和202發射出的 光穿過光組合元件301(例如，波導管），然後朝向液晶顯 示器堆疊302投射。發光二極體晶粒發射的光通常近乎 垂直於晶粒表面的方向。從發光二極體陣列2〇1及2〇2 發射出的光的方向近乎各自垂直及平行於鏡板表面。此光 源需要各自的組合元件301。組合光之彩度的調整僅能藉 由穿過一個控制系來改變第二發光二極體陣列2〇2彩 度’因此，彩度的調整是有彈性限制的。 根據另一先前技術所揭露者，如第四圖所示，是一種 具封裝發光二極體晶粒的Luxeon側置式-發射器 (side-emitter)。Luxeon側置式-發射器可提供組合光好的 均勻度，但光強度較差。另外，封裝發光二極體晶粒結構 通常比本發明裸晶粒結構佔較大的面積與體積。 眾所皆知，大多數從發光二極體晶粒發射的光其行進 方向近乎於垂直於晶粒表面。因此，發光二極體晶粒在某 種程度上需要被調整，使得從發光二極體晶粒發射的光在 到達顯示螢幕前，有機會組合及混合成想要的彩度。 第五圖所示為一種傳統發光二極體封裝結構，一發光 二極體晶粒500附著在一封裝基底511上。此發光二極體 晶粒包含一負電極(negative electrode)或接合墊(bonding pad)501、一 N 型包覆層(cladding layer)503、一主動層 (active layer)504、一 P型包覆層505、一半導體基底層(例 如，砷化鎵或氮化鎵)506和一正接合電極(接合墊)5〇2。 此發光二極體晶粒500的負電極501經由一金線或鋁線 512連接至封裝基底511上的負接合墊513，正接合電極 502則焊接於封裝基底511上的正接合墊514。此發光二 1246785 極體晶粒500和金線512可用透明樹脂515覆蓋起來，以 隔絕外部環境。為了電源連接，僅暴露金屬墊或連接腳 (connectionpin)513和514。此發光二極體結構的缺點是光 強度較弱，乃由於非透明(non-transparent)的金屬塾501和 • 502阻擋了發射光重要的部分。此外，傳統打線接合(wire bonding)程序需要增加程序的複雜度、封裝空間及成本。 • 【發明内容】 本發明克服傳統光源的缺點，其省掉傳統打線接合的 程序和封裝發光二極體晶粒(LED chip)的需要，因而降低成 本及空間。由於發光二極體高封裝密度(packaging density) 和適當的混合發射光，因此也可達到高的光強度且可有想 要的彩度。 • 根據本發明，每一發光二極體晶粒有-N型接合塾和 一 P型接合塾，發光二極體晶粒之其中一個接合塾係位於 引表面而另接合塾係位於後表面。n型接合塾和p型 接。塾之其中之一皆可配置在發光二極體晶粒之前表面， 且僅佔用晶粒一少部分面積。而另-接合墊則以-配置於 後接。整與發光二極體晶粒剩餘部分之間的金屬層，涵括 晶粒的整個後表面。 1246785 在本發明第一實施例中，此備有翻轉側置結構的發光 二極體的發光裝置包含二發光二極體晶粒和一基底。此二 發光二極體晶粒以背靠背(back-to-back)附著，並以此二發 光二極體之側表面（side surface)面向基底的固著表面 (mounting surface)，固著(mount on)在此基底上。發光二極 體晶粒之N型接合墊和P型接合墊分別連接至基底上n型 和P型電極墊。 » 在本發明第二實施例中，此備有翻轉側置結構的發光 二極體的發光裝置包含一發光二極體晶粒和一基底。該發 光二極體之側表面面向基底的固著表面，固著在此基底 上。發光二極體晶粒之N型接合墊和P型接合墊分別連接 至基底上N型和P型電極墊。 φ 在本發明第三實施例中，此備有發光二極體之翻轉側 置結構的的發光裝置可再結合光學突出物（〇ptical protrusion)於基底上，以形成一發光模組，用來反射和混合 從發光一極體晶粒發射出的光。發光二極體晶粒在面向光 學犬出物的基底上形成一發光二極體照明光源(luminance source)。因此從不同發光二極體晶粒發射的光在靠近基底 表面有機會被反射和組合，以達到想要的彩度。 9 1246785 如有需要，可於基底上形成控制電路，來提供發光二 極體電源、控制發光二極體亮度、提供發光二極體靜電保 護(electrostatic discharge protection)，以及調整組合後的光 彩度，以符合應用需求。 本發明使得組合後的光有較佳均勻度及高強度，且可 有想要的彩度。1246785 IX. Description of the Invention: [Technical Field] The present invention relates to a device for a light emitting diode (LED), and more particularly to a flipped side structure provided with a light emitting diode (flipped side) -structure) illuminating device. [Prior Art] A light source provided with a lighting information source is often required in many applications. In particular, liquid crystal displays (LCDs) have become increasingly popular in many electronic media. LCD monitors are often used in a wide variety of applications, such as desktop computers, display monitors, §, video cameras, auto attendant displays, televisions, and aeronautical displays. Usually, the liquid crystal display needs to use a backlight module to illuminate the information to be displayed. Used in backlight modules, there are a variety of light sources, such as fluorescent lamps and light-emitting diodes. Fluorescent lamps are inexpensive and do not require complex control circuitry. However, it is sometimes not suitable for certain applications that require good color quality and long lamp life. There are many reasons why a light-emitting diode has been proposed as a light source for a liquid crystal display backlight module. The advantages of a light-emitting diode source compared to fluorescent bulbs include long life, easy replacement, robust mechanical properties, and better color quality. The chromaticity that some applications (such as aerospace) need to emit from a liquid crystal display backlight module is clear. However, for most commercially available light-emitting diodes, the choice of chroma is limited and the chroma will change over time. 5 The first figure shows a light-emitting diode source of a raised light-emitting diode 100 disclosed in U.S. Patent No. 6,666,567, which is incorporated herein by reference. The elevated light emitting diode 100 includes a light emitting diode 101. The light emitting diode 101 is enclosed in a light emitting diode package 102. The light emitting diode package 102 is supported above the floor of optical cavities 103. This elevated structure allows light to be emitted from the base of the light-emitting diode. In addition, a reflective protrusion can be placed underneath the elevated light-emitting diode to assist in guiding the light to travel. A combination of a daylight bulb and a light-emitting diode is also k-exposed to form a hybrid light source. However, all of these technologies increase the complexity and cost of the light source. As shown in the second and third figures, the liquid crystal display 200 disclosed in U.S. Patent No. 6,6,8,614 includes a first LED array 201 that provides a first color of light and a second LED array. Second light emitting diode array 202. Light emitted from the LED arrays 2〇1 and 202 passes through the light combining element 301 (e.g., a waveguide) and is then projected toward the liquid crystal display stack 302. The light emitted by the light-emitting diode grains is generally nearly perpendicular to the direction of the grain surface. The directions of light emitted from the LED arrays 2〇1 and 2〇2 are approximately perpendicular to each other and parallel to the surface of the mirror plate. This light source requires a respective combination element 301. The adjustment of the chroma of the combined light can only change the second illuminating diode array 2 〇 2 chroma by passing through a control system. Therefore, the adjustment of the chroma is elastically limited. According to another prior art, as shown in the fourth figure, is a Luxeon side-emitter having a packaged LED die. The luxeon side-mounted transmitter provides good uniformity of combined light but poor light intensity. In addition, the encapsulated light-emitting diode grain structure generally occupies a larger area and volume than the bare grain structure of the present invention. It is well known that most of the light emitted from the luminescent diode grains travels approximately perpendicular to the grain surface. Therefore, the light-emitting diode grains need to be adjusted to some extent so that the light emitted from the light-emitting diode grains has a chance to be combined and mixed into a desired chroma before reaching the display screen. The fifth figure shows a conventional light emitting diode package structure in which a light emitting diode die 500 is attached to a package substrate 511. The light-emitting diode die includes a negative electrode or bonding pad 501, an N-type cladding layer 503, an active layer 504, and a P-type cladding. A layer 505, a semiconductor substrate layer (e.g., gallium arsenide or gallium nitride) 506, and a positive junction electrode (bond pad) 5〇2. The negative electrode 501 of the LED die 500 is connected to the negative bond pad 513 on the package substrate 511 via a gold or aluminum wire 512, and the positive bond electrode 502 is soldered to the positive bond pad 514 on the package substrate 511. The light-emitting diode 1246785 polar body grain 500 and gold wire 512 may be covered with a transparent resin 515 to isolate the external environment. For power connections, only metal pads or connection pins 513 and 514 are exposed. A disadvantage of this light-emitting diode structure is that the light intensity is weak because the non-transparent metal defects 501 and 502 block the important portion of the emitted light. In addition, traditional wire bonding procedures require increased program complexity, packaging space, and cost. • SUMMARY OF THE INVENTION The present invention overcomes the shortcomings of conventional light sources, which eliminates the need for conventional wire bonding procedures and the need to package LED chips, thereby reducing cost and space. Due to the high packing density of the light-emitting diodes and the proper mixed emission, high light intensity can also be achieved with the desired chroma. • According to the present invention, each of the light-emitting diode crystal grains has an -N-type joint and a P-type joint, and one of the light-emitting diode grains is located on the lead surface and the other joint is on the rear surface. N-type joints and p-type joints. One of the crucibles can be disposed on the front surface of the light-emitting diode die and occupy only a small portion of the area of the die. The other-bonding pad is then configured with a -. The metal layer between the entire and the remaining portions of the light-emitting diode grains encompasses the entire back surface of the grains. 1246785 In the first embodiment of the present invention, the light-emitting device of the light-emitting diode having the inverted side structure includes two light-emitting diode crystal grains and a substrate. The two light-emitting diode dies are attached back-to-back, and the side surfaces of the two light-emitting diodes face the mounting surface of the substrate, and are mounted on the mount surface. ) on this substrate. The N-type bond pads and the P-type bond pads of the light-emitting diode die are respectively connected to the n-type and P-type electrode pads on the substrate. In the second embodiment of the present invention, the light-emitting device of the light-emitting diode having the inverted side structure includes a light-emitting diode die and a substrate. The side surface of the light-emitting diode faces the fixing surface of the substrate and is fixed to the substrate. The N-type bond pads and the P-type bond pads of the light-emitting diode die are respectively connected to the N-type and P-type electrode pads on the substrate. In the third embodiment of the present invention, the light-emitting device provided with the inverted side structure of the light-emitting diode can be combined with the optical protrusion on the substrate to form a light-emitting module for Reflecting and mixing light emitted from the illuminating monopole grains. The light-emitting diode grains form a light-emitting diode illumination source on a substrate facing the optical dog. Thus light emitted from different luminescent diode dies has the opportunity to be reflected and combined near the surface of the substrate to achieve the desired chroma. 9 1246785 If necessary, a control circuit can be formed on the substrate to provide a light-emitting diode power supply, control the brightness of the light-emitting diode, provide electrostatic discharge protection, and adjust the combined brilliance. To meet the needs of the application. The present invention provides better uniformity and intensity for the combined light and can have the desired chroma.
茲配合下列圖示、實施例之詳細說明及申請專利範 圍，將上述及本發明之其他目的與優點詳述於後。 【實施方式】 第6A圖所示為發光二極體晶粒之側面圖，每一發光 二極體晶粒有一 N型接合墊和一 P型接合墊。參考第6A 圖，發光二極體晶粒600有二接合墊601及602，分別稱 之P型接合墊和N型接合墊。此二接合墊601及602分別 位於發光二極體晶粒600的前表面及後表面，接合墊601 及602也位於蟲晶層(expitaxial layers) 604及605之表面的 對邊(opposite sides of the surfaces)，一蠢晶層指的是 P 型蟲 晶層，而另一磊晶層是N型磊晶層。N型接合墊和P型接 合墊之其中之一均可配置於發光二極體晶粒600之前表 面，且僅佔用晶粒一少部分面積。此發光二極體晶粒中， 10 接合墊602涵括發光二極體晶粒600整個後表面，而接合 墊601則僅涵括發光二極體晶粒600 —少部分面積。前接 合墊601的邊緣以發光二極體晶粒600的邊緣發光。此發 光二極體晶粒600有一發光層606配置於磊晶層604及605 之間，有一金屬反射層603配置於磊晶層604及接合墊602 之間。 此外，前接合墊601的配置可從發光二極體晶粒6〇〇The above and other objects and advantages of the present invention will be described in detail with reference to the accompanying drawings. [Embodiment] FIG. 6A is a side view of a light-emitting diode die, each light-emitting diode die having an N-type bonding pad and a P-type bonding pad. Referring to Figure 6A, the LED die 600 has two bond pads 601 and 602, referred to as P-type bond pads and N-type bond pads, respectively. The two bonding pads 601 and 602 are respectively located on the front and rear surfaces of the LED body 600, and the bonding pads 601 and 602 are also located on opposite sides of the surface of the expitaxial layers 604 and 605. Surface), a staggered layer refers to the P-type insect layer, and the other epitaxial layer is the N-type epitaxial layer. One of the N-type bond pads and the P-type bond pads can be disposed on the front surface of the LED body 600 and occupy only a small portion of the area of the die. In the light-emitting diode crystal grain, 10 bonding pads 602 cover the entire rear surface of the light-emitting diode die 600, and the bonding pad 601 covers only a small portion of the light-emitting diode die 600. The edge of the front bonding pad 601 emits light at the edge of the light emitting diode die 600. The light-emitting diode die 600 has a light-emitting layer 606 disposed between the epitaxial layers 604 and 605, and a metal reflective layer 603 disposed between the epitaxial layer 604 and the bond pad 602. In addition, the front bonding pad 601 can be configured from the light emitting diode die 6〇〇
的一邊延伸至另一邊(extended from edge to edge)，如第 6B 圖所示，或配置於發光二極體晶粒600的邊緣中心(edge center)，如第6C圖所示。另一接合墊602則涵蓋發光二極 體晶粒600的整個後表面。 第七A圖係根據本發明第一實施例中，備有發光二極 體之翻轉側置結構的發光裝置之一側面圖。在本發明第一 實施例中，此備有發光二極體之翻轉側置結構的發光裝置 包含一或多個發光二極體晶粒和一基底，此基底包括至少 一N型電極墊、至少一p型電極墊和備有一基底表面。不 失般性，一個發光二極體晶粒、一個n型電極塾和二個 P型電極墊被用來當作第七A圖中實施例的例子。 參考第7A圖，二發光二極體晶粒600以背靠背附著， 1246785One side extends from the edge to the edge, as shown in FIG. 6B, or is disposed at the edge center of the LED die 600, as shown in FIG. 6C. Another bond pad 602 covers the entire back surface of the LED die 600. Fig. 7A is a side elevational view of a light-emitting device provided with an inverted side structure of a light-emitting diode according to a first embodiment of the present invention. In the first embodiment of the present invention, the light-emitting device provided with the inverted side structure of the light-emitting diode includes one or more light-emitting diode crystal grains and a substrate, and the substrate includes at least one N-type electrode pad, at least A p-type electrode pad and a substrate surface. Without loss of generality, one light-emitting diode die, one n-type electrode 塾 and two P-type electrode pads are used as an example of the embodiment in Figure 7A. Referring to FIG. 7A, the two LED dipoles 600 are attached back to back, 1246785
並以其側表面面向基底的固著表面，固著在基底7〇1上， 如第7A圖所示，發光二極體晶粒6〇〇的n型接合墊602 和P型接合墊601分別連接至基底701上的N型電極墊7〇4 和P型電極墊705。本實施例不需傳統打線接合的程序。N • 型電極墊704和P型電極墊705被一介電材質(dielectric matenal)706隔開。如有需要，可將靜電保護電路7〇7包括 在此發光裝置之中。此外，如有需要，基底7〇1也可包括 ⑩ 次固著接合墊(subm_t bonding surface)702和703，如第 7A圖所示。 • 第七B圖係根據本發明第一實施例中，備有發光二極 體之翻轉側置結構的發光裝置之一俯視圖。不失一般性， 可將多數個N型電極墊和p型電極墊圖案化^姐6]1^(1)， 以使一陣列的發光二極體以串聯(serial)或並聯⑦紅心峋的 • 方式連接在一起，本發明的封裝結構也可解決發光二極體 的散熱問題。 • 由於此備有發光二極體之翻轉側置結構的發光裝 置，因此被發射出的光之行進方向可平行於固著表面。此 省掉傳統的打線接合的程序和發光二極體晶粒的封裝，所 以降低了成本和空間。此備有發光二極體之翻轉側置結構 的發光裝置可再結合光學突出物於基底上，以形成一光學 12 1246785 模組，用來反射和混合從發光二極體晶粒發射出的光，以 符合想要的應用。由於發光二極體高封裝密度和適當的混 合發射光，因此可達到高的光強度且可有想要的彩度。 垂 ^ 第八圖係根據本發明第二實施例中，備有發光二極體 之翻轉側置結構的發光裝置之一側面圖。在第八圖所示之 第二施例中，此備有發光二極體之翻轉側置結構的發光裝 φ 置包含一發光二極體晶粒600和一基底701，發光二極體 晶粒600以其側表面面向基底的固著表面，固著於基底70 i 上。N型接合墊602和P型接合墊601分別連接至基底上 的N型電極墊702和P型電極墊703。 發光二極體晶粒可用透明材料封起來，以避免和空氣 反應。再者，適當選擇透明材料的折射率可以避免全反射 • (total reflection)。透明材料可以從環氧化物(ep0Xy)及矽氧 聚合物(silicone)之族群裡選擇，但不僅限於此類族群。 第九圖係根據本發明第三實施例中，備有發光二極體 之翻轉側置結構的發光裝置之一結構圖，其中該發光裝置 是一發光二極體照明帶片(LED luminance strip)的應用例 (application example)。此第三實施例中，備有發光二極體 之翻轉側置結構的發光裝置900更結合光學突出物902於 13 1246785 基底904上，以形成一光學模組’用來反射和混合從發光 二極體晶粒發射出的光。而發光二極體901可發射不同或 是相同顏色的光，其中備有發光二極體之翻轉側置結構發 光裝置901係選自本發明第一施例或本發明第二施例，基 底904有N型電極墊904a和P型電極墊904b在其上。 根據想要的應用，光學突出物902可用任何適合的材 • 料製作，和以任何適合的方式及形狀來形成。光學突出物 902的形狀可以是(但沒有限制)金字塔型(pyramidal)或圓錐 形（conic)或拋物線形（parabolic)或半球面形 (semispherical)。第十A圖及第十B圖分別是示於第九圖中 之發光二極體照明帶片光行進轨道之一側面圖和一俯視 圖。發光二極體照明帶片發射的光大多數平行於固著表面 並朝向光學突出物，光因此與其他光源發射的光組合。 若有需要，可於基底上形成控制電路9〇3(如第九圖所 . 不），來提供發光二極體電源、控制發光二極體亮度、提供 _ 發光—減靜電倾、和調整組合後的絲度，以符合應 用需求。控制電路9〇3可以是堆疊式(stacked)或是印製於 基底表面。 第十一圖是—個由多數個第九圖中發光二極體照明 14 1246785 帶片形成之發光二極體照明面板（LED luminanee panel)1100之應用例。兩個發光二極體照明帶片之間係電 性絕緣(electrical insulation) 〇 本發明之發光裝置可以被整合在一光源裡，如發光二 極體燈泡(LED lamp)，第十二A圖及第十二B圖分別是根 據本發明第三實施例，發光二極體燈泡未備有及備有一反 射碗(reflective bowl)的應用例。 參考第九圖、第十一圖及第十二A圖中的應用例，發 光二極體晶粒在面向光學突出物的基底上形成一發光二極 體照明光源。所以從不同發光二極體晶粒發射的光在靠近 基底表面有機會被反射和組合，以達到想要的彩度。第十 二B圖是第十二A圖結合一反射碗1201的應用例。第十 二C圖是第十二B圖中具有一反射碗的發光二極體燈泡之 一前視圖。 本發明使得組合後的光有較佳均勻度及高強度，且可 有想要的彩度。從不同發光模組發射出的組合光可進一步 地被導引至散光器卬或〖(^1!1^1*)或波導管&3¥6 81^(1€)。無 論液晶顯示器面板的大小’本發明之備有發光二極體之翻 轉側置結構的發光裝置都可以被整合在液晶顯示器用的背 15 1246785 光模組裡。第十三A圖及第十三B圖分別是被整入於液晶 顯示器用的背光模組裡的發光二極體照明帶片與發光二極 體照明面板的應用例。 惟’以上所述者，僅為本發明之較佳實施例而已，當 不能以此限定本發明實施之範圍。即大凡依本發明申請專And the fixing surface of the side surface facing the substrate is fixed on the substrate 7〇1. As shown in FIG. 7A, the n-type bonding pad 602 and the P-type bonding pad 601 of the LED die 6〇〇 are respectively respectively. The N-type electrode pad 7〇4 and the P-type electrode pad 705 are connected to the substrate 701. This embodiment does not require a conventional wire bonding process. The N-type electrode pad 704 and the P-type electrode pad 705 are separated by a dielectric 706. The electrostatic protection circuit 7〇7 can be included in the light-emitting device if necessary. Further, the substrate 7〇1 may also include 10 subm_t bonding surfaces 702 and 703 as shown in Fig. 7A, if necessary. • Fig. 7B is a plan view of a light-emitting device provided with an inverted side structure of a light-emitting diode according to a first embodiment of the present invention. Without loss of generality, a plurality of N-type electrode pads and p-type electrode pads can be patterned to form a light-emitting diode in series or in parallel with 7 red hearts. • The modes are connected together, and the package structure of the present invention can also solve the heat dissipation problem of the light-emitting diode. • Since the light-emitting device having the inverted side structure of the light-emitting diode is provided, the traveling direction of the emitted light can be parallel to the fixing surface. This eliminates the traditional wire bonding process and the package of the LED die, which reduces cost and space. The light-emitting device with the inverted side structure of the light-emitting diode can be combined with the optical protrusion on the substrate to form an optical 12 1246785 module for reflecting and mixing the light emitted from the light-emitting diode die. To match the desired application. Due to the high packing density of the light-emitting diodes and the proper mixing of the emitted light, a high light intensity can be achieved and the desired chroma can be achieved. The eighth figure is a side view of a light-emitting device provided with an inverted side structure of a light-emitting diode according to a second embodiment of the present invention. In the second embodiment shown in the eighth embodiment, the light-emitting device φ having the inverted side structure of the light-emitting diode comprises a light-emitting diode die 600 and a substrate 701, and the light-emitting diode die The 600 is fixed to the substrate 70 i with a fixing surface whose side surface faces the substrate. The N-type bonding pad 602 and the P-type bonding pad 601 are respectively connected to the N-type electrode pad 702 and the P-type electrode pad 703 on the substrate. The light-emitting diode dies can be sealed with a transparent material to avoid reaction with air. Furthermore, proper selection of the refractive index of the transparent material avoids total reflection. Transparent materials can be selected from the group of epoxides (ep0Xy) and silicone polymers, but are not limited to such groups. FIG. 9 is a structural diagram of a light-emitting device provided with an inverted side structure of a light-emitting diode according to a third embodiment of the present invention, wherein the light-emitting device is a LED luminance strip. Application example. In the third embodiment, the light-emitting device 900 provided with the inverted side structure of the light-emitting diode is further combined with the optical protrusion 902 on the 13 1246785 substrate 904 to form an optical module 'for reflection and mixing from the light-emitting two. The light emitted by the polar body grains. The light emitting diode 901 can emit light of different or the same color, wherein the flip side structure light emitting device 901 provided with the light emitting diode is selected from the first embodiment of the present invention or the second embodiment of the present invention, the substrate 904 There are N-type electrode pads 904a and P-type electrode pads 904b thereon. Depending on the desired application, optical protrusions 902 can be fabricated from any suitable material and formed in any suitable manner and shape. The shape of the optical protrusion 902 can be, but is not limited to, a pyramidal or conic or parabolic or semispherical. Figs. 10A and 10B are respectively a side view and a plan view of the light traveling track of the light-emitting diode illumination strip shown in the ninth diagram. The light emitted by the LED illuminating strip is mostly parallel to the affixing surface and towards the optical projections, which are thus combined with the light emitted by other sources. If necessary, a control circuit 9〇3 (as shown in the ninth figure) can be formed on the substrate to provide a light-emitting diode power supply, control the brightness of the light-emitting diode, provide _light-reduction, static tilt, and adjust the combination. After the silkness to meet the application needs. The control circuit 9〇3 can be stacked or printed on the surface of the substrate. The eleventh figure is an application example of an LED luminanee panel 1100 formed by a plurality of illuminating diodes 14 1246785. Electrically insulated between two light-emitting diode illumination strips. The illumination device of the present invention can be integrated into a light source, such as a LED lamp, Figure 12A and Fig. 12B is an application example in which a light-emitting diode bulb is not provided and provided with a reflective bowl according to a third embodiment of the present invention. Referring to the application examples in the ninth, eleventh and twelfth A, the light-emitting diode dies form a light-emitting diode illumination source on the substrate facing the optical protrusion. Therefore, light emitted from different luminescent diode dies has a chance to be reflected and combined near the surface of the substrate to achieve the desired chroma. The Twelfth Bth drawing is an application example of the twelfth A drawing in combination with a reflecting bowl 1201. The Twelfth C-C is a front view of the light-emitting diode bulb having a reflecting bowl in the twelfth B-th. The present invention provides better uniformity and intensity for the combined light and can have the desired chroma. The combined light emitted from the different lighting modules can be further directed to the diffuser or (^1!1^1*) or the waveguide & 3¥6 81^(1€). Regardless of the size of the liquid crystal display panel, the light-emitting device of the present invention having the flip-up side structure of the light-emitting diode can be integrated in the optical module of the back 15 1246785 for liquid crystal display. Figs. 13A and 13B are application examples of the light-emitting diode illumination strip and the light-emitting diode illumination panel incorporated in the backlight module for a liquid crystal display, respectively. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto. That is, the application of the invention according to the invention
利範圍所作之均等變化與修飾，皆應仍屬本發明申請專利 涵蓋之範圍内。Equivalent changes and modifications made by the scope of the application are still within the scope of the patent application of the present invention.
16 1246785 【圖式簡單說明】 第一圖係一習知撐高式發光二極體結構圖。 第二圖係另一習知以發光二極體為基底的液晶顯示器背光 結構圖。 第三圖係第二圖中液晶顯示器背光結構側面之正視圖。 第四圖係一 Luxeon側置式發射器。 第五圖係傳統封裝發光二極體晶粒的一剖面結構圖。 第六A圖係發光二極體晶粒之一側面圖。 第六B圖係根據本發明中接合塾從發光二極體晶粒的一邊 延伸至另一邊之一俯視圖。 第六C圖係根據本發明中接合墊配置於發光二極體晶粒的 邊緣中心之俯視圖。 第七A圖係根據本發明第一實施例，備有發光二極體之翻 轉側置結構的發光裝置之一側面圖。 第七B圖係根據本發明第一實施例’備有發光二極體之翻 轉側置結構的發光裝置之一俯視圖。 第八圖係係根據本發明第二施例，備有發光二極體之翻轉 側置結構的發光裝置之一側面圖。 第九圖係根據本發明第三實施例，備有發光二極體之翻轉 側置結構的發光裝置之一結構圖，其中該發光裝置是一發 光二極體照明帶片的應用例。 第十A圖及第十B圖分別是示於第九圖中之發光二極體照 17 明帶片光行進軌道之一側面圖和一俯視圖。 第十一圖是一個由多數個第九圖中發光二極體照明帶片形 成之發光二極體照明面板的應用例。 第十二A圖及第十二B圖分別是根據本發明第三實施例， 發光二極體燈泡未備有及備有一反射碗的應用例。 第十二C圖是第十二B圖中具有一反射碗之發光二極體燈 泡的一前視圖。 第十三A圖及第十三B圖分別是被整入於液晶顯示器用的 背光模組裡的發光二極體照明帶片與發光二極體照明面板 的應用例。 【主要元件符號說明】 100撐高式發光二極體 101發光二極體 102發光二極體封裝 200液晶顯示器 103光學共振腔板 201第一發光二極體陣列 202第二發光二極體陣列 301光組合元件 302液晶顯示器堆疊 500發光二極體晶粒 501負電極 502正接合電極 503 N型包覆層 504作用層 505 P型包覆層 506半導體基底層 511封裝基底 512金線或鋁線 513負接合墊 514正接合墊 515透明樹脂 600發光二極體晶粒 601 P型接合墊 602 N型接合聲 603金屬反射層 1246785 604 P型磊晶層 605 N型磊晶層 606發光層 701基底 702次黏著接合墊(N型電極墊） 703次黏著接合墊(P型電極墊） 704 N型電極墊 705 P型電極墊 706介電材質 707靜電保護電路 900備有發光二極體之翻轉側置結構的發光裝置 901第一施例或第二施例之備有發光二極體之翻轉側置結構 的發光裝置 902光學突出物 903控制電路 904a N型電極墊 904b P型電極墊 904基底 1100發光二極體照明面板 1201反射碗16 1246785 [Simple description of the diagram] The first figure is a structure diagram of a conventional elevated light-emitting diode. The second figure is another conventional backlight structure diagram of a liquid crystal display based on a light-emitting diode. The third figure is a front view of the side of the backlight structure of the liquid crystal display in the second figure. The fourth picture is a Luxeon side-mounted transmitter. The fifth figure is a cross-sectional structural view of a conventional package of light-emitting diode crystal grains. Figure 6A is a side view of one of the luminescent diode dies. Fig. 6B is a plan view showing a state in which the bonding defects extend from one side of the light-emitting diode die to the other side in accordance with the present invention. The sixth C is a plan view of the bonding pad disposed at the center of the edge of the light-emitting diode die according to the present invention. Fig. 7A is a side elevational view of a light-emitting device provided with a flip-up side structure of a light-emitting diode according to a first embodiment of the present invention. Fig. 7B is a plan view showing a light-emitting device having a flip-up side structure of a light-emitting diode according to a first embodiment of the present invention. Figure 8 is a side elevational view of a light-emitting device provided with an inverted side structure of a light-emitting diode according to a second embodiment of the present invention. The ninth drawing is a structural view of a light-emitting device provided with an inverted side structure of a light-emitting diode according to a third embodiment of the present invention, wherein the light-emitting device is an application example of a light-emitting diode illumination strip. 10A and 10B are respectively a side view and a plan view of the light-emitting diode slides shown in the ninth diagram. The eleventh figure is an application example of a light-emitting diode lighting panel formed by a plurality of illuminating diode illuminating strips in the ninth drawing. 12A and 12B are respectively an application example in which a light-emitting diode bulb is not provided and provided with a reflecting bowl according to a third embodiment of the present invention. Fig. 12C is a front view of the light-emitting diode bulb having a reflecting bowl in the twelfth B-th. The thirteenth Ath and thirteenth Bth drawings are respectively an application example of the light emitting diode lighting strip and the light emitting diode lighting panel which are integrated into the backlight module for the liquid crystal display. [Main component symbol description] 100-high light-emitting diode 101 light-emitting diode 102 light-emitting diode package 200 liquid crystal display 103 optical resonant cavity plate 201 first light-emitting diode array 202 second light-emitting diode array 301 Light combining element 302 liquid crystal display stack 500 light emitting diode die 501 negative electrode 502 positive bonding electrode 503 N-type cladding layer 504 active layer 505 P-type cladding layer 506 semiconductor base layer 511 package substrate 512 gold wire or aluminum wire 513 Negative bond pad 514 positive bond pad 515 transparent resin 600 light emitting diode die 601 P type bond pad 602 N type bond sound 603 metal reflective layer 1246875 604 P type epitaxial layer 605 N type epitaxial layer 606 light emitting layer 701 substrate 702 Secondary adhesive bond pad (N-type electrode pad) 703 adhesive bond pad (P-type electrode pad) 704 N-type electrode pad 705 P-type electrode pad 706 Dielectric material 707 Electrostatic protection circuit 900 is equipped with the flip side of the light-emitting diode The light-emitting device 902 of the first embodiment or the second embodiment of the structure is provided with an inverted side structure of the light-emitting diode. The optical protrusion 903 controls the circuit 904a. The N-type electrode pad 904b The P-type electrode pad 904 Substrate 1100 light-emitting diode lighting panel 1201 reflective bowl
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