CN100452452C - Light emitting device with LED flipped side-structure - Google Patents
Light emitting device with LED flipped side-structure Download PDFInfo
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- CN100452452C CN100452452C CNB2005100728908A CN200510072890A CN100452452C CN 100452452 C CN100452452 C CN 100452452C CN B2005100728908 A CNB2005100728908 A CN B2005100728908A CN 200510072890 A CN200510072890 A CN 200510072890A CN 100452452 C CN100452452 C CN 100452452C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The present invention relates to a light emitting device with an LED flipped side-structure, which allows the traveling of emitted light to be in parallel with an adhering surface of the emitted light. One or a plurality of LED crystal grains face the surface of a substrate by a side surface, and the LED crystal grains are arranged on the substrate; the light emitting device can be combined with an optical protrusion on the substrate to form a light emitting module, which is used for reflecting and combining light emitted by the LED crystal grains. The light emitting device does not need a traditional program of throwing and jointing; a package structure of the light emitting device solves the problem of the heat dissipation of the LED; if demand is needed, an electrostatic protection circuit can be contained in the light emitting module. The present invention causes combined light to have favorable uniformity, high intensity and desired chromaticity.
Description
Technical field
(light emitting diode, device LED) is especially about a kind of light-emitting device that has the upset side structure (flipped side-structure) of light-emitting diode to the present invention relates to light-emitting diode.
Background technology
The light source that has the illumination information source is often to be required in many application.Particularly (liquid crystal display's LCD LCD) becomes more and more popular in many electronic mediums.LCD often is used in application miscellaneous, such as desktop PC, display monitor, image camera, ATM display, TV and aviation display etc.Usually the LCD information that need throw light on and desire to be shown with backlight module.Being used in backlight module has light source miscellaneous, as fluorescent lamp and light-emitting diode.Fluorescent lamp price is cheap and do not need complicated control circuit.But, be not suitable for long some of some chromaticity that need get well and bulb life sometimes and use.Light-emitting diode is suggested the light source of being used as liquid crystal display backlight module many reasons.Compared to fluorescent bulb, the advantage of LED source comprises the long life-span, substitutes easy, sane mechanical property and preferable chromaticity.The honorable degree (chromaticity) that some application (as the aviation class) need be launched from liquid crystal display backlight module is clear and definite.Yet the obtainable light-emitting diode of most of commercializations, the selection of its chroma are limited and chroma can change in time.
Figure 1 shows that a kind of LED source that is exposed in the high formula of support (raised) light-emitting diode 100 of the 6th, 666, No. 567 patents of the U.S., be used for improving the chroma of combined light (combined light).This supports high formula light-emitting diode 100 and comprises a light-emitting diode 101.This light-emitting diode 101 wraps in 102 li of LED package.This LED package 102 is supported on optical cavity plate (floor ofoptical cavities) 103 tops.This supports high formula framework and allows that light goes out from led based bottom emission.In addition, tool reflectivity protrusion can place this below of supportting high formula light-emitting diode, assists correcting light to navigate on track.A kind of framework that is become by fluorescent bulb and light emitting diode combined also is suggested, to form a kind of hybrid light source (hybrid light source).Yet all these technology have increased the complexity and the cost of light source.
As shown in Figures 2 and 3, the LCD 200 that is exposed in the 6th, 608, No. 614 patents of the U.S. comprises first light emitting diode matrix 201 and second light emitting diode matrix 202 that light second chroma is provided that light first chroma is provided.The light of launching from light emitting diode matrix 201 and 202 passes light combine component 301 (for example, waveguide), then towards 302 projections of LCD storehouse.The common near vertical of light of LED crystal particle emission is in the direction of grain surface.The direction of light of launching from light emitting diode matrix 201 and 202 is close to vertical separately and is parallel to surfaces of mirror plate.This light source needs combine component 301 separately.The adjustment of the chroma of combined light only can change second light emitting diode matrix, 202 chromas by passing a control, and therefore, the adjustment of chroma is flexible restriction.
Disclose according to another prior art, as shown in Figure 4, be that a kind of Luxeon of tool encapsulation LED crystal grain is side-mounted-reflector (side-emitter).Luxeon is side-mounted-and reflector can provide combined light the good uniformity, but luminous intensity is relatively poor.In addition, the encapsulation LED grainiess accounts for bigger area and volume than the naked grainiess of the present invention usually.
Well known, great majority from its direct of travel of light of LED crystal particle emission near perpendicular to grain surface.Therefore, LED crystal particle needs to be adjusted to a certain extent, makes light from the LED crystal particle emission before arriving display screen, has an opportunity to make up and be mixed into the chroma of wanting.
Figure 5 shows that a kind of traditional package structure for LED, a LED crystal particle 500 is attached on the package substrates 511.This LED crystal particle comprises a negative electrode (negative electrode) or joint sheet (bonding pad) 501, one N type coating layer (cladding layer) 503, one active layer (activelayer) 504, a P type coating layer 505, semiconductor basalis (for example, GaAs or gallium nitride) 506 and one positive bonding electrodes (joint sheet) 502.The negative electrode 501 of this LED crystal particle 500 is connected to negative joint sheet 513 on the package substrates 511 via a gold thread or aluminum steel 512, and positive 502 of bonding electrodes are welded in the positive joint sheet 514 on the package substrates 511.This LED crystal particle 500 and gold thread 512 can cover with transparent resin 515, with isolated external environment condition.For power supply connection, only exposing metal pad or connecting pin (connection pin) 513 and 514.The shortcoming of this light emitting diode construction be luminous intensity a little less than, this is because the metal gasket 501 and 502 of nontransparent (non-transparent) has stopped emission light part and parcel.In addition, traditional routing engages complexity, encapsulated space and the cost that (wire bonding) program need increase program.
Summary of the invention
The objective of the invention is to overcome the shortcoming of conventional light source and a kind of light-emitting device that has the upset side structure of light-emitting diode is provided, it saves the program of traditional routing joint and the needs of encapsulation LED crystal grain (LED chip), thereby reduces cost and the space.Because therefore high packaging density of light-emitting diode (packaging density) and suitable mixing emission light also can reach high luminous intensity and the chroma of wanting can be arranged.
For achieving the above object, the invention provides a kind of light-emitting device that has the upset side structure of light-emitting diode, include:
One substrate, this substrate comprises at least one N type electronic pads, at least one P type electronic pads and a substrate surface, wherein, this at least one N type electronic pads and this at least one P type electronic pads are arranged in this substrate, and adjacent N type electronic pads and P type electronic pads are separated by dielectric material; One or more LED crystal particle are bonded in this substrate, and wherein each this LED crystal particle has a N type joint sheet and a P type joint sheet; A joint sheet in this N type joint sheet and this P type joint sheet places the front surface of this LED crystal particle, only takies this crystal grain one small part area; And wherein another joint sheet places the rear surface of this LED crystal particle, contains the whole rear surface of this LED crystal particle; This LED crystal particle, is bonded in this substrate towards this substrate surface with its side surface, and this N type joint sheet of this LED crystal particle is connected to its corresponding this intrabasement N type electronic pads and P type electronic pads respectively with this P type joint sheet.
Use two these LED crystal particle, adhere to back-to-back, and be bonded in this substrate towards this substrate surface with its side surface.
Each this LED crystal particle has a metallic reflector, and is formed between this joint sheet and this LED crystal particle remainder on this LED crystal particle rear surface.
For each this LED crystal particle, place the edge of this joint sheet of its front surface and arbitrary edge of this LED crystal particle to paste neat.
A plurality of N type electronic padses and P type electronic pads are patterned, so that the light-emitting diode of an array links together with the serial or parallel connection formula.
Each this LED crystal particle is a naked crystal grain and encapsulates with a transparent material.
This light-emitting device also comprises electrostatic discharge protective circuit.
For each this LED crystal particle, this joint sheet that places its front surface is the edge center that places this LED crystal particle.
For each this LED crystal particle, one side place the extend to another side of this joint sheet of its front surface from this LED crystal particle.
This transparent material is to select from the group of epoxides and silicon-oxygen polymer.
This light-emitting device also comprises at least one this suprabasil optical protrusion that places, and to form an optical module, is used for reflecting and making up the light of launching from this LED crystal particle.
The shape of this optical protrusion comprises pyramid, taper shape, parabola shaped and hemisphere face shape.
Form a control circuit in this substrate, the honorable degree after this LED power source being provided, controlling this light-emitting diode luminance, this light-emitting diode electrostatic protection is provided and adjusts combination is to meet application demand.
This LED crystal particle is bonded to this substrate, and the surface of this crystal grain is towards this optical protrusion.
This control circuit is printed in this substrate.
This control circuit is stacked in this substrate.
This light-emitting device is incorporated in the backlight module that a LCD uses.
A plurality of these light-emitting devices are incorporated in the backlight module that a LCD uses.
Between two these light-emitting devices is to be electrically insulated.
This light-emitting device is incorporated in the light source.
This light source is a light emitting diode bulb, and this light emitting diode bulb by this light-emitting device in conjunction with a reverberation bowl or do not formed in conjunction with a reverberation bowl.
According to the present invention, each LED crystal particle has a N type joint sheet and a p type joint sheet, and one of them joint sheet of LED crystal particle is to be positioned at front surface, and another joint sheet is to be positioned at the rear surface.The all configurable front surface of one of them of N type joint sheet and P type joint sheet, and occupation crystal particle one small part area only in LED crystal particle.Another joint sheet includes the whole rear surface of crystal grain then with a metal level that is disposed between back joint sheet and the LED crystal particle remainder.
In first embodiment of the invention, this light-emitting device that has the light-emitting diode of upset side structure comprises two LED crystal particle and a substrate.These two LED crystal particle are adhered to (back-to-back) back-to-back, and with the side surface (side surface) of these two light-emitting diodes set surface (mounting surface) towards substrate, set (mount on) is in this substrate.The N type joint sheet of LED crystal particle and P type joint sheet are connected to N type and P type electronic pads in the substrate respectively.
In second embodiment of the invention, this light-emitting device that has the light-emitting diode of upset side structure comprises a LED crystal particle and a substrate.The side surface of this light-emitting diode anchors in this substrate towards the set surface of substrate.The N type joint sheet of LED crystal particle and P type joint sheet are connected to N type and P type electronic pads in the substrate respectively.
In third embodiment of the invention, this light-emitting device that has the upset side structure of light-emitting diode can be again in conjunction with optical protrusion (optical protrusion) in substrate, to form a light emitting module, be used for reflecting and mixing the light of launching from LED crystal particle.LED crystal particle is forming a luminous diode illuminating light source (luminance source) in the substrate of optical protrusion.Therefore have an opportunity to be reflected and to make up at close substrate surface from the light of different LED crystal particle emissions, to reach the chroma of wanting.
If needed; can in substrate, form control circuit; LED power source is provided, controls light-emitting diode luminance, provides the light-emitting diode electrostatic protection (electrostatic discharge protection), and the honorable degree after the adjustment combination, to meet application demand.
The invention enables the light after the combination that the preferable uniformity and high strength are arranged, and the chroma of wanting can be arranged.
The detailed description and the claim that now cooperate following accompanying drawing, embodiment, will on address other purpose of the present invention and advantage and be specified in after.
Description of drawings
Fig. 1 is the high formula light emitting diode construction of known support figure.
Fig. 2 be another known be the LCD backlight structure chart of substrate with the light-emitting diode.
Fig. 3 is the front view of LCD backlight texture edge among Fig. 2.
Fig. 4 is the side-mounted reflector of a Luxeon.
Fig. 5 is a sectional structure chart of conventional package LED crystal particle.
Fig. 6 A is a side view of LED crystal particle.
Fig. 6 B be according to the present invention in joint sheet extend to a vertical view of another side from one side of LED crystal particle.
Fig. 6 C be according to the present invention in bond pad arrangement in the vertical view of the edge center of LED crystal particle.
Fig. 7 A is according to first embodiment of the invention, has the side view of light-emitting device of the upset side structure of light-emitting diode.
Fig. 7 B is according to first embodiment of the invention, has the vertical view of light-emitting device of the upset side structure of light-emitting diode.
Fig. 8 second executes example according to the present invention, has the side view of light-emitting device of the upset side structure of light-emitting diode.
Fig. 9 is according to third embodiment of the invention, has the structure chart of light-emitting device of the upset side structure of light-emitting diode, and wherein this light-emitting device is the application examples of a led lighting strap.
Figure 10 A and Figure 10 B are shown in led lighting strap light among Fig. 9 advance a side view and a vertical view of track.
Figure 11 is the application examples of a led lighting panel that is formed by led lighting strap among a plurality of Fig. 9.
Figure 12 A and Figure 12 B are respectively according to third embodiment of the invention, and light emitting diode bulb does not have and have the application examples of a reverberation bowl.
Figure 12 C is a front view that has the light emitting diode bulb of a reverberation bowl among Figure 12 B.
Figure 13 A and Figure 13 B are put in order the led lighting strap in the backlight module that LCD is used and the application examples of led lighting panel respectively.
Embodiment
Fig. 6 A is depicted as the side view of LED crystal particle, and each LED crystal particle has a N type joint sheet and a P type joint sheet.With reference to figure 6A, LED crystal particle 600 has two joint sheets 601 and 602, is called P type joint sheet and N type joint sheet.This two joint sheet 601 and 602 lays respectively at the front surface and the rear surface of LED crystal particle 600, joint sheet 601 and 602 also is positioned at the opposite side (opposite sides of the surfaces) on the surface of epitaxial loayer (epitaxial layers) 604 and 605, one epitaxial loayer refers to P type epitaxial loayer, and another epitaxial loayer is a N type epitaxial loayer.One of them of N type joint sheet and P type joint sheet is all configurable in the front surface of LED crystal particle 600, and occupation crystal particle one small part area only.In this LED crystal particle, joint sheet 602 comprises LED crystal particle 600 whole rear surfaces, and joint sheet 601 then only comprises LED crystal particle 600 1 small part areas.The edge of preceding joint sheet 601 is with the edge-lit of LED crystal particle 600; The edge of preceding joint sheet can paste neat with arbitrary edge of this LED crystal particle.This LED crystal particle 600 has a luminescent layer 606 to be disposed between epitaxial loayer 604 and 605, has a metallic reflector 603 to be disposed between epitaxial loayer 604 and the joint sheet 602.
In addition, the configuration of preceding joint sheet 601 can extend to another side (extended from edge to edge) from one side of LED crystal particle 600, shown in Fig. 6 B, or be disposed at the edge center (edge center) of LED crystal particle 600, shown in Fig. 6 C.602 of another joint sheets are contained the whole rear surface of LED crystal particle 600.
Fig. 7 A is according in the first embodiment of the invention, has the side view of light-emitting device of the upset side structure of light-emitting diode.In first embodiment of the invention, this light-emitting device that has the upset side structure of light-emitting diode comprises one or more LED crystal particle and a substrate, and this substrate comprises at least one N type electronic pads, at least one P type electronic pads and has a substrate surface.Be without loss of generality, two LED crystal particle, N type electronic pads and two P type electronic padses are used to be used as the example of embodiment among Fig. 7 A.
With reference to figure 7A, two LED crystal particle 600 are to adhere to back-to-back, and with the set surface of its side surface towards substrate, anchor in the substrate 701, shown in Fig. 7 A, the N type joint sheet 602 of LED crystal particle 600 and P type joint sheet 601 are connected to N type electronic pads 704 and the P type electronic pads 705 in the substrate 701 respectively.The program that present embodiment does not need traditional routing to engage.N type electronic pads 704 and P type electronic pads 705 are separated by a dielectric material (dielectric material) 706.If needed, electrostatic discharge protective circuit 707 can be included among this light-emitting device.In addition, if needed, substrate 701 also can comprise time set joint sheet (submount bonding surface) 702 and 703, as Fig. 7 A institute not.
Fig. 7 B is according in the first embodiment of the invention, has the vertical view of light-emitting device of the upset side structure of light-emitting diode.Be without loss of generality, can be with a plurality of N type electronic padses and P type electronic pads patterning (patterned), so that the light-emitting diode of an array links together in the mode of series connection (serial) or in parallel (parallel), encapsulating structure of the present invention also can solve the heat dissipation problem of light-emitting diode.
Because this has the light-emitting device of the upset side structure of light-emitting diode, therefore the direct of travel of the light that is launched out can be parallel to the set surface.This saves the program of traditional routing joint and the encapsulation of LED crystal particle, so reduced cost and space.This light-emitting device that has the upset side structure of light-emitting diode can be again in conjunction with optical protrusion in substrate, to form an optical module, be used for reflecting and mixing the light of launching from LED crystal particle, to meet the application of wanting.Because therefore high packaging density of light-emitting diode and suitable mixing emission light can reach high luminous intensity and the chroma of wanting can be arranged.
Fig. 8 is according in the second embodiment of the invention, has the side view of light-emitting device of the upset side structure of light-emitting diode.Execute in the example shown in Figure 8 second, this light-emitting device that has the upset side structure of light-emitting diode comprises a LED crystal particle 600 and a substrate 701, LED crystal particle 600 is bonded in the substrate 701 with the set surface of its side surface towards substrate.N type joint sheet 602 and P type joint sheet 601 are connected to suprabasil N type electronic pads 702 and P type electronic pads 703 respectively.
LED crystal particle can be sealed with transparent material, to avoid and air reaction.Moreover, suitably select the refractive index of transparent material can avoid total reflection (total reflection).Transparent material can be selected in the group of epoxides (epoxy) and silicon-oxygen polymer (silicone), but is not limited only to this type of group.
Fig. 9 is according in the third embodiment of the invention, have the structure chart of light-emitting device of the upset side structure of light-emitting diode, wherein this light-emitting device is the application examples (application example) of a led lighting strap (LEDluminance strip).Among this 3rd embodiment, have light-emitting diode upset side structure light-emitting device 900 also in substrate 904 in conjunction with optical protrusion 902, to form an optical module, be used for reflecting and mixing the light of launching from LED crystal particle.And light-emitting diodes can be launched the difference or the light of same color, the upset side structure light-emitting device 901 that wherein has light-emitting diode is to be selected from that the present invention first executes example or the present invention second executes example, has N type electronic pads 904a and P type electronic pads 904b in the substrate 904.
According to the application of wanting, optical protrusion 902 can and reach shape in any suitable manner with any suitable material and form.The shape of optical protrusion 902 can be (but without limits) pyramid (pyramidal) or conical (conic) or parabola shaped (parabolic) or hemisphere face shape (semispherical).Figure 10 A and Figure 10 B are shown in led lighting strap light among Fig. 9 advance a side view and a vertical view of track.The wide majority of led lighting strap emission is parallel to the set surface and towards optical protrusion, light therefore with the light combination of other light emitted.
If necessary, can form control circuit 903 (as shown in Figure 9) in substrate, the honorable degree after LED power source being provided, controlling light-emitting diode luminance, the light-emitting diode electrostatic protection is provided and adjusts combination is to meet application demand.Control circuit 903 can be stacking-type (stacked) or be printed on substrate surface.
Figure 11 is the application examples of a led lighting panel that is formed by led lighting strap among a plurality of Fig. 9 (LED luminance panel) 1100.Between two led lighting straps be electrically insulated (electrical insulation).
Light-emitting device of the present invention can be incorporated in the light source, as light emitting diode bulb (LEDlamp), Figure 12 A and Figure 12 B are respectively according to third embodiment of the invention, and light emitting diode bulb does not have and have the application examples of a reverberation bowl (reflective bowl).
With reference to the application examples among figure 9, Figure 11 and Figure 12 A, LED crystal particle is forming a luminous diode illuminating light source in the substrate of optical protrusion.So have an opportunity to be reflected and to make up at close substrate surface from the light of different LED crystal particle emissions, to reach the chroma of wanting.Figure 12 B is the application examples of Figure 12 A in conjunction with a reverberation bowl 1201.Figure 12 C is a front view that has the light emitting diode bulb of a reverberation bowl among Figure 12 B.
The invention enables the light after the combination that the preferable uniformity and high strength are arranged, and the chroma of wanting can be arranged.The combined light of launching from different light emitting modules can be led to diffuser (light diffuser) or waveguide (wave guide) further.The size of panel of LCD no matter, the light-emitting device that has the upset side structure of light-emitting diode of the present invention can be incorporated in the backlight module that LCD uses.Figure 13 A and Figure 13 B are put in order the led lighting strap in the backlight module that LCD is used and the application examples of led lighting panel respectively.
The above only is preferred embodiment of the present invention, when not limiting scope of the invention process with this.All equalizations of doing according to claim of the present invention change and modify, and all should still belong in the scope that the present patent application patent contains.
Claims (19)
1. light-emitting device that has the upset side structure of light-emitting diode includes:
One substrate, this substrate comprises at least one N type electronic pads, at least one P type electronic pads and a substrate surface, wherein, this at least one N type electronic pads and this at least one P type electronic pads are arranged in this substrate, and adjacent N type electronic pads and P type electronic pads are separated by dielectric material;
One or more LED crystal particle are bonded in this substrate, and wherein each this LED crystal particle has a N type joint sheet and a P type joint sheet; A joint sheet in this N type joint sheet and this P type joint sheet places the front surface of this LED crystal particle, only takies this crystal grain one small part area; And wherein another joint sheet places the rear surface of this LED crystal particle, contains the whole rear surface of this LED crystal particle; This LED crystal particle, is bonded in this substrate towards this substrate surface with its side surface, and this N type joint sheet of this LED crystal particle and this P type joint sheet are connected to N type electronic pads and P type electronic pads in its corresponding this substrate respectively;
One metallic reflector is formed between this joint sheet and this LED crystal particle remainder on each LED crystal particle rear surface; And
For each this LED crystal particle, place the edge of this joint sheet of its front surface and arbitrary edge of this LED crystal particle to paste neat.
2. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 1 is characterized in that using two these LED crystal particle, adheres to back-to-back, and is bonded in this substrate towards this substrate surface with its side surface.
3. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 1 is characterized in that a plurality of N type electronic padses and P type electronic pads are patterned, so that the light-emitting diode of an array links together with the serial or parallel connection formula.
4. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 1 is characterized in that each this LED crystal particle is a naked crystal grain and encapsulates with a transparent material.
5. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 1 is characterized in that this light-emitting device also comprises electrostatic discharge protective circuit.
6. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 1 is characterized in that for each this LED crystal particle, this joint sheet that places its front surface is the edge center that places this LED crystal particle.
7. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 1 is characterized in that for each this LED crystal particle, one side place the extend to another side of this joint sheet of its front surface from this LED crystal particle.
8. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 4 is characterized in that this transparent material is to select from the group of epoxides and silicon-oxygen polymer.
9. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 1, it is characterized in that this light-emitting device also comprises at least one this suprabasil optical protrusion that places, to form an optical module, be used for reflecting and making up the light of launching from this LED crystal particle.
10. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 9 is characterized in that the shape of this optical protrusion comprises pyramid, taper shape, parabola shaped and hemisphere face shape.
11. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 9; it is characterized in that forming in this substrate a control circuit; honorable degree after this LED power source being provided, controlling this light-emitting diode luminance, this light-emitting diode electrostatic protection is provided and adjusts combination is to meet application demand.
12. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 9 it is characterized in that this LED crystal particle is bonded to this substrate, and the surface of this crystal grain is towards this optical protrusion.
13. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 11 is characterized in that this control circuit is printed in this substrate.
14. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 11 is characterized in that this control circuit is stacked in this substrate.
15. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 9 is characterized in that this light-emitting device is incorporated in the backlight module that a LCD uses.
16. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 9 is characterized in that a plurality of these light-emitting devices are incorporated in the backlight module that a LCD uses.
17. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 16 is characterized in that between two these light-emitting devices be to be electrically insulated.
18. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 9 is characterized in that this light-emitting device is incorporated in the light source.
19. the light-emitting device that has the upset side structure of light-emitting diode as claimed in claim 18, it is characterized in that this light source is a light emitting diode bulb, and this light emitting diode bulb by this light-emitting device in conjunction with a reverberation bowl or do not formed in conjunction with a reverberation bowl.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100728908A CN100452452C (en) | 2005-05-17 | 2005-05-17 | Light emitting device with LED flipped side-structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100728908A CN100452452C (en) | 2005-05-17 | 2005-05-17 | Light emitting device with LED flipped side-structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1866551A CN1866551A (en) | 2006-11-22 |
| CN100452452C true CN100452452C (en) | 2009-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100728908A Expired - Fee Related CN100452452C (en) | 2005-05-17 | 2005-05-17 | Light emitting device with LED flipped side-structure |
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| Country | Link |
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| CN (1) | CN100452452C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7847306B2 (en) * | 2006-10-23 | 2010-12-07 | Hong Kong Applied Science and Technology Research Insitute Company, Ltd. | Light emitting diode device, method of fabrication and use thereof |
| CN107895756A (en) * | 2017-10-17 | 2018-04-10 | 丽智电子(昆山)有限公司 | A kind of LED device |
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| US5475241A (en) * | 1992-08-20 | 1995-12-12 | Hewlett-Packard Company | Light source and technique for mounting light emitting diodes |
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| US4709253A (en) * | 1986-05-02 | 1987-11-24 | Amp Incorporated | Surface mountable diode |
| US5475241A (en) * | 1992-08-20 | 1995-12-12 | Hewlett-Packard Company | Light source and technique for mounting light emitting diodes |
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|---|---|
| CN1866551A (en) | 2006-11-22 |
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