JP2008124339A5 - - Google Patents

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Publication number
JP2008124339A5
JP2008124339A5 JP2006308322A JP2006308322A JP2008124339A5 JP 2008124339 A5 JP2008124339 A5 JP 2008124339A5 JP 2006308322 A JP2006308322 A JP 2006308322A JP 2006308322 A JP2006308322 A JP 2006308322A JP 2008124339 A5 JP2008124339 A5 JP 2008124339A5
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JP
Japan
Prior art keywords
layer
wiring
forming
wiring layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006308322A
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English (en)
Japanese (ja)
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JP2008124339A (ja
JP5069449B2 (ja
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Priority to JP2006308322A priority Critical patent/JP5069449B2/ja
Priority claimed from JP2006308322A external-priority patent/JP5069449B2/ja
Publication of JP2008124339A publication Critical patent/JP2008124339A/ja
Publication of JP2008124339A5 publication Critical patent/JP2008124339A5/ja
Application granted granted Critical
Publication of JP5069449B2 publication Critical patent/JP5069449B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006308322A 2006-11-14 2006-11-14 配線基板及びその製造方法 Active JP5069449B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006308322A JP5069449B2 (ja) 2006-11-14 2006-11-14 配線基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006308322A JP5069449B2 (ja) 2006-11-14 2006-11-14 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2008124339A JP2008124339A (ja) 2008-05-29
JP2008124339A5 true JP2008124339A5 (zh) 2009-11-05
JP5069449B2 JP5069449B2 (ja) 2012-11-07

Family

ID=39508751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006308322A Active JP5069449B2 (ja) 2006-11-14 2006-11-14 配線基板及びその製造方法

Country Status (1)

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JP (1) JP5069449B2 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110038521A (ko) * 2009-10-08 2011-04-14 엘지이노텍 주식회사 인쇄회로기판 및 그 제조방법
KR20180037238A (ko) * 2015-08-28 2018-04-11 히타치가세이가부시끼가이샤 반도체 장치 및 그 제조 방법
CN110915307B (zh) * 2017-05-19 2023-02-03 佐佐木贝慈 电子部件搭载用基板及其制造方法
TWI705747B (zh) * 2019-08-30 2020-09-21 嘉聯益科技股份有限公司 多層軟性電路板及其製造方法
TWI831123B (zh) * 2022-01-28 2024-02-01 巨擘科技股份有限公司 多層基板表面處理層結構
CN115190701B (zh) * 2022-05-13 2023-06-02 广州广芯封装基板有限公司 一种埋入式线路封装基板及其加工方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03253091A (ja) * 1990-03-02 1991-11-12 Tokuyama Soda Co Ltd プリント配線板の製造方法
JPH11126974A (ja) * 1997-10-24 1999-05-11 Asahi Chem Res Lab Ltd 多層配線板の製造方法
JP2002299779A (ja) * 2001-03-30 2002-10-11 Hitachi Metals Ltd 配線形成用帯材及びそれを用いたバンプ付き配線を有する配線板並びに配線形成用帯材を用いた転写配線板の製造方法
JP2003008228A (ja) * 2001-06-22 2003-01-10 Ibiden Co Ltd 多層プリント配線板およびその製造方法
JP2004095972A (ja) * 2002-09-03 2004-03-25 Sumitomo Metal Electronics Devices Inc プラスチックパッケージの製造方法
JP2005166910A (ja) * 2003-12-02 2005-06-23 Fujikura Ltd プリント配線板およびその製造方法

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