JP2008105157A5 - - Google Patents
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- Publication number
- JP2008105157A5 JP2008105157A5 JP2006292189A JP2006292189A JP2008105157A5 JP 2008105157 A5 JP2008105157 A5 JP 2008105157A5 JP 2006292189 A JP2006292189 A JP 2006292189A JP 2006292189 A JP2006292189 A JP 2006292189A JP 2008105157 A5 JP2008105157 A5 JP 2008105157A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- mems
- layer
- mems structure
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 21
- 239000002131 composite material Substances 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 8
- 238000000034 method Methods 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 239000012535 impurity Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 1
- 229910021332 silicide Inorganic materials 0.000 claims 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006292189A JP5145688B2 (ja) | 2006-10-27 | 2006-10-27 | Ｍｅｍｓ・半導体複合回路の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006292189A JP5145688B2 (ja) | 2006-10-27 | 2006-10-27 | Ｍｅｍｓ・半導体複合回路の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008253517A Division JP5332463B2 (ja) | 2008-09-30 | 2008-09-30 | Ｍｅｍｓ・半導体複合素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008105157A JP2008105157A (ja) | 2008-05-08 |
| JP2008105157A5 true JP2008105157A5 (enrdf_load_stackoverflow) | 2009-12-10 |
| JP5145688B2 JP5145688B2 (ja) | 2013-02-20 |
Family
ID=39438946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006292189A Expired - Fee Related JP5145688B2 (ja) | 2006-10-27 | 2006-10-27 | Ｍｅｍｓ・半導体複合回路の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5145688B2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010030020A (ja) * | 2008-07-31 | 2010-02-12 | Seiko Epson Corp | 電子装置 |
| CA2852197A1 (en) * | 2011-10-24 | 2013-05-02 | Teijin Limited | Spun-dyed meta-type wholly aromatic polyamide fiber |
| CN104891425A (zh) * | 2015-06-12 | 2015-09-09 | 武汉飞恩微电子有限公司 | 基于石墨烯的流量传感器芯片及其制备方法 |
| CN111170266B (zh) * | 2019-12-31 | 2023-07-21 | 杭州士兰集成电路有限公司 | 半导体器件及其制造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07163158A (ja) * | 1993-11-30 | 1995-06-23 | Sony Corp | マイクロマシンの製造方法 |
| JP2766174B2 (ja) * | 1993-12-28 | 1998-06-18 | 日本電気株式会社 | 電界放出冷陰極とこれを用いた電子管 |
| JP3603347B2 (ja) * | 1994-10-12 | 2004-12-22 | 株式会社デンソー | 半導体センサの製造方法 |
| JP3450758B2 (ja) * | 1999-09-29 | 2003-09-29 | 株式会社東芝 | 電界効果トランジスタの製造方法 |
| JP2001264677A (ja) * | 2000-03-15 | 2001-09-26 | Olympus Optical Co Ltd | 走査ミラー |
| JP4772302B2 (ja) * | 2003-09-29 | 2011-09-14 | パナソニック株式会社 | 微小電気機械システムおよびその製造方法 |
| JP2006255856A (ja) * | 2005-03-18 | 2006-09-28 | Seiko Epson Corp | 電気機械素子の製造方法 |
| JP4558655B2 (ja) * | 2006-01-25 | 2010-10-06 | 株式会社デンソー | 半導体力学量センサ |
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2006
- 2006-10-27 JP JP2006292189A patent/JP5145688B2/ja not_active Expired - Fee Related