JP2008104909A5 - - Google Patents
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- Publication number
- JP2008104909A5 JP2008104909A5 JP2006287881A JP2006287881A JP2008104909A5 JP 2008104909 A5 JP2008104909 A5 JP 2008104909A5 JP 2006287881 A JP2006287881 A JP 2006287881A JP 2006287881 A JP2006287881 A JP 2006287881A JP 2008104909 A5 JP2008104909 A5 JP 2008104909A5
- Authority
- JP
- Japan
- Prior art keywords
- precursor
- functional group
- plating catalyst
- substrate
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000642 polymer Polymers 0.000 claims description 67
- 238000007747 plating Methods 0.000 claims description 60
- 239000003054 catalyst Substances 0.000 claims description 47
- 239000002243 precursor Substances 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 43
- 239000002184 metal Substances 0.000 claims description 40
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 125000000524 functional group Chemical group 0.000 claims description 37
- 238000004519 manufacturing process Methods 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 20
- 230000003993 interaction Effects 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 11
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- -1 palladium ions Chemical class 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 239000011593 sulfur Substances 0.000 claims description 3
- 230000002452 interceptive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006287881A JP4903528B2 (ja) | 2006-10-23 | 2006-10-23 | 金属膜付基板の作製方法、金属膜付基板、金属パターン材料の作製方法、金属パターン材料 |
| PCT/JP2007/070133 WO2008050631A1 (fr) | 2006-10-23 | 2007-10-16 | Procédé de production d'un substrat revêtu d'un film métallique, substrat revêtu d'un film métallique, procédé de production d'un matériau à motif métallique, et matériau à motif métallique |
| KR1020097008785A KR20090079913A (ko) | 2006-10-23 | 2007-10-16 | 금속막이 부착된 기판의 제작 방법, 금속막이 부착된 기판, 금속 패턴 재료의 제작 방법, 금속 패턴 재료 |
| US12/446,545 US20100323174A1 (en) | 2006-10-23 | 2007-10-16 | Methods for preparing metal film-carrying substrates, metal film-carrying substrates, methods for preparing metal pattern materials, and metal pattern materials |
| EP07829867A EP2087942A1 (en) | 2006-10-23 | 2007-10-16 | Process for producing metal-film-coated substrate, metal-film-coated substrate, process for producing metallic-pattern material, and metallic-pattern material |
| CNA2007800394552A CN101547751A (zh) | 2006-10-23 | 2007-10-16 | 带金属膜的基板的制造方法、带金属膜的基板、金属图形材料的制造方法以及金属图形材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006287881A JP4903528B2 (ja) | 2006-10-23 | 2006-10-23 | 金属膜付基板の作製方法、金属膜付基板、金属パターン材料の作製方法、金属パターン材料 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008104909A JP2008104909A (ja) | 2008-05-08 |
| JP2008104909A5 true JP2008104909A5 (enrdf_load_stackoverflow) | 2011-09-29 |
| JP4903528B2 JP4903528B2 (ja) | 2012-03-28 |
Family
ID=39438725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006287881A Expired - Fee Related JP4903528B2 (ja) | 2006-10-23 | 2006-10-23 | 金属膜付基板の作製方法、金属膜付基板、金属パターン材料の作製方法、金属パターン材料 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4903528B2 (enrdf_load_stackoverflow) |
| CN (1) | CN101547751A (enrdf_load_stackoverflow) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008181976A (ja) * | 2007-01-23 | 2008-08-07 | Fujitsu Ltd | 回路基板およびその製造方法 |
| JP5258489B2 (ja) * | 2008-09-30 | 2013-08-07 | 富士フイルム株式会社 | 金属膜形成方法 |
| JP5360963B2 (ja) * | 2008-12-27 | 2013-12-04 | 国立大学法人大阪大学 | 誘電体基材表面の触媒フリー金属化方法及び金属膜付き誘電体基材 |
| JP5721254B2 (ja) * | 2010-09-17 | 2015-05-20 | 国立大学法人大阪大学 | 誘電体基材表面の触媒フリー金属化方法及び金属膜付き誘電体基材 |
| JP5409575B2 (ja) * | 2010-09-29 | 2014-02-05 | 富士フイルム株式会社 | 金属膜材料の製造方法、及びそれを用いた金属膜材料 |
| CN104937404A (zh) * | 2013-01-17 | 2015-09-23 | 田中贵金属工业株式会社 | 生物传感器及其制造方法 |
| JP6551391B2 (ja) * | 2014-02-28 | 2019-07-31 | 国立大学法人大阪大学 | 誘電体基材表面の金属化方法及び金属膜付き誘電体基材 |
| EP3137649B1 (en) * | 2014-04-28 | 2024-02-21 | Cuptronic Technology Ltd. | Metalization of surfaces |
| KR20210071973A (ko) | 2018-10-03 | 2021-06-16 | 제이에스알 가부시끼가이샤 | 기판의 제조 방법, 조성물 및 중합체 |
| WO2024214601A1 (ja) * | 2023-04-12 | 2024-10-17 | 東京エレクトロン株式会社 | 成膜方法 |
| CN117528971B (zh) * | 2023-07-03 | 2025-03-21 | 荣耀终端股份有限公司 | 摄像头装饰件、摄像头装饰件的制备方法和电子设备 |
| CN117457261A (zh) * | 2023-10-26 | 2024-01-26 | 深圳金美新材料科技有限公司 | 一种复合柔性导电膜及其制备方法和制膜设备 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005228879A (ja) * | 2004-02-12 | 2005-08-25 | Fuji Photo Film Co Ltd | 電磁波シールド材料の作製方法 |
| JP4544913B2 (ja) * | 2004-03-24 | 2010-09-15 | 富士フイルム株式会社 | 表面グラフト形成方法、導電性膜の形成方法、金属パターン形成方法、多層配線板の形成方法、表面グラフト材料、及び導電性材料 |
| JP4606899B2 (ja) * | 2005-02-17 | 2011-01-05 | 富士フイルム株式会社 | 金属パターン形成方法、金属パターン及びそれを用いたプリント配線板並びにｔｆｔ配線回路 |
| JP4712420B2 (ja) * | 2005-03-31 | 2011-06-29 | 富士フイルム株式会社 | 表面グラフト材料、導電性材料およびその製造方法 |
| JP4606924B2 (ja) * | 2005-03-31 | 2011-01-05 | 富士フイルム株式会社 | グラフトパターン材料、導電性パターン材料およびその製造方法 |
-
2006
- 2006-10-23 JP JP2006287881A patent/JP4903528B2/ja not_active Expired - Fee Related
-
2007
- 2007-10-16 CN CNA2007800394552A patent/CN101547751A/zh active Pending
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