JP2008098654A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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Abstract
【解決手段】入力側板状リード部5上に制御用パワーMOSFETチップ2が配置され、このチップの裏面にはドレイン端子DT1が形成されており、一方、主面には、ソース端子ST1およびゲート端子GT1が形成され、このソース端子ST1とソース用板状リード部12とが接続されており、また、出力側板状リード部6上に同期用パワーMOSFETチップ3が配置されており、このチップの裏面にはドレイン端子DT2が形成され、このドレイン端子DT2に出力側板状リード部6が接続され、さらに、同期用パワーMOSFETチップ3の主面には、ソース端子ST2およびゲート端子GT2が形成されており、このソース端子ST2とソース用板状リード部13とが接続され、ソース用板状リード部12,13が露出していることにより、MCM1の放熱性を高めることができる。
【選択図】図1
Description
図1は本発明の実施の形態1の半導体装置(非絶縁型DC/DCコンバータ用マルチチップモジュール)の構造の一例を封止体を透過して示す平面図、図17は図1に示す半導体装置の内部を透過して示す斜視図、図2は図1に示すA−A線に沿って切断した断面の構造を示す断面図、図3は図1に示す半導体装置の構造を示す裏面図、図4は図1に示す半導体装置の構造を示す外観斜視図、図5〜図7はそれぞれ本発明の実施の形態1の変形例の半導体装置の構造を示す断面図、図8は図1に示す半導体装置(非絶縁型DC/DCコンバータ)における実装時の等価回路の一例を示す回路図、図16は比較例の電源用マルチチップモジュールの構造を封止体を透過して示す平面図である。
図9は本発明の実施の形態2の半導体装置(非絶縁型DC/DCコンバータ用マルチチップモジュール)の構造の一例を封止体を透過して示す平面図、図10は図9に示すB−B線に沿って切断した断面の構造を示す断面図、図11は図9に示す半導体装置の構造を示す裏面図、図12は図9に示す半導体装置の構造を示す外観斜視図である。
図13は本発明の実施の形態3の半導体装置(非絶縁型DC/DCコンバータ用マルチチップモジュール)の構造の一例を示す断面図、図14は本発明の実施の形態3の変形例の半導体装置の構造を示す断面図である。
図15は本発明の実施の形態4の半導体装置(非絶縁型DC/DCコンバータ用マルチチップモジュール)の構造の一例を封止体を透過して示す平面図である。
2 制御用パワーMOSFETチップ(第1の半導体チップ)
2a 主面
2b 裏面
3 同期用パワーMOSFETチップ(第2の半導体チップ)
3a 主面
3b 裏面
4 ドライバICチップ(第3の半導体チップ)
4a 主面
5 入力側板状リード部(第1の板状導体部材)
6 出力側板状リード部(第3の板状導体部材)
7 接地側板状リード部
8 ドライバ側板状リード部
9 端子
10 ワイヤ
11 外部接続端子
12,12a ソース用板状リード部(第2の板状導体部材)
13,13a ソース用板状リード部(第4の板状導体部材)
14 銀ペースト
15 金バンプ
16 導体
17 封止体(封止用絶縁樹脂)
17a 表面
17b 裏面
18 はんだ
19 非絶縁型DC/DCコンバータ回路
20 コイル
21 入力電源
22,23 コンデンサ
24 負荷
25 ワイヤ
26 金属板
27 放熱フィン(放熱部材)
28 絶縁シート
29 金属板(他の板状導体部材)
ST1 制御用パワーMOSFETのソース端子
DT1 制御用パワーMOSFETのドレイン端子
GT1 制御用パワーMOSFETのゲート端子
ST2 同期用パワーMOSFETのソース端子
DT2 同期用パワーMOSFETのドレイン端子
GT2 同期用パワーMOSFETのゲート端子
Claims (20)
- それぞれの主面に端子が形成された複数の半導体チップと、
前記複数の半導体チップのうちの少なくとも2つの半導体チップの端子と電気的に接続する板状導体部材と、
前記複数の半導体チップを封止する封止体と、
前記複数の半導体チップそれぞれに電気的に接続する複数の外部接続端子とを有し、
前記板状導体部材によって接続された前記少なくとも2つの半導体チップがそれぞれにトランジスタ回路を有しており、前記板状導体部材が前記封止体から露出していることを特徴とする半導体装置。 - 請求項1記載の半導体装置において、前記複数の半導体チップのうち、第1の半導体チップと第2の半導体チップがそれぞれ電源用のトランジスタ回路を有しており、さらに、 前記第1の半導体チップのドレイン端子に接続する第1の板状導体部材と、
前記第1の半導体チップのソース端子に接続する第2の板状導体部材と、
前記第2の半導体チップのドレイン端子に接続する第3の板状導体部材と、
前記第2の半導体チップのソース端子に接続する第4の板状導体部材とを有しており、
前記第2の板状導体部材と前記第3の板状導体部材とが電気的に接続され、前記第2および第3の板状導体部材それぞれの少なくとも一部が前記封止体から露出していることを特徴とする半導体装置。 - 請求項2記載の半導体装置において、前記第2の板状導体部材と前記第3の板状導体部材とが一体に形成されていることを特徴とする半導体装置。
- 請求項1記載の半導体装置において、前記複数の半導体チップのうち、第1の半導体チップと第2の半導体チップがそれぞれ電源用のトランジスタ回路を有しており、第3の半導体チップが、前記第1および第2の半導体チップを制御するドライバ回路を有していることを特徴とする半導体装置。
- 請求項2記載の半導体装置において、前記第2および第4の板状導体部材それぞれの一部が前記封止体の表裏面の何れか一方に露出し、前記第1および第3の板状導体部材それぞれの一部が前記封止体の表裏面の何れか他方に露出していることを特徴とする半導体装置。
- 請求項5記載の半導体装置において、前記第2の板状導体部材と前記第3の板状導体部材とが一体に形成されていることを特徴とする半導体装置。
- 請求項1記載の半導体装置において、前記複数の半導体チップのうち少なくとも1つの半導体チップが、他の半導体チップと表裏面反対の向きで搭載されていることを特徴とする半導体装置。
- 請求項2記載の半導体装置において、前記第2の半導体チップが前記第1の半導体チップと表裏面反対の向きで搭載されており、前記第2および第3の板状導体部材それぞれの一部が前記封止体の表裏面の何れか一方に露出し、前記第1および第4の板状導体部材それぞれの一部が前記封止体の表裏面の何れか他方に露出していることを特徴とする半導体装置。
- 請求項8記載の半導体装置において、前記第2の板状導体部材と前記第3の板状導体部材とが一体に形成されていることを特徴とする半導体装置。
- 請求項1記載の半導体装置において、前記板状導体部材の前記封止体から露出した箇所に放熱部材が取り付けられていることを特徴とする半導体装置。
- それぞれの主面に端子が形成された複数の半導体チップと、
前記複数の半導体チップのうちの少なくとも2つの半導体チップの端子と電気的に接続する板状導体部材と、
前記複数の半導体チップを樹脂封止する封止体と、
前記複数の半導体チップそれぞれに電気的に接続する複数の外部接続端子とを有し、
前記板状導体部材が前記封止体から露出しており、前記板状導体部材における一方の半導体チップとの接続箇所と、他方の半導体チップとの接続箇所とが前記封止体の表裏面のうちの何れか一方、もしくは前記封止体の内部のそれぞれの半導体チップの外側で連結していることを特徴とする半導体装置。 - 請求項11記載の半導体装置において、前記複数の半導体チップのうち、第1の半導体チップと第2の半導体チップがそれぞれ電源用のトランジスタ回路を有しており、第3の半導体チップが、前記第1および第2の半導体チップを制御するドライバ回路を有していることを特徴とする半導体装置。
- 請求項11記載の半導体装置において、前記板状導体部材の前記封止体から露出した箇所に放熱部材が取り付けられていることを特徴とする半導体装置。
- 請求項11記載の半導体装置において、前記板状導体部材とこれに電気的に接続する半導体チップとが複数の金バンプを介して電気的に接続されていることを特徴とする半導体装置。
- 請求項12記載の半導体装置において、前記第1の半導体チップの端子と前記第3の半導体チップの端子とが前記板状導体部材によって電気的に接続されているとともに、前記第2の半導体チップの端子と前記第3の半導体チップの端子とが他の板状導体部材によって電気的に接続されていることを特徴とする半導体装置。
- それぞれの主面に端子が形成された複数の半導体チップと、
前記複数の半導体チップのうちの少なくとも2つの半導体チップの端子と電気的に接続する板状導体部材と、
前記複数の半導体チップを樹脂封止する封止体と、
前記複数の半導体チップそれぞれに電気的に接続し、前記封止体の裏面の周縁部に配置された複数の外部接続端子とを有し、
前記板状導体部材が前記封止体の表裏面のうちの少なくとも何れか一方に露出していることを特徴とする半導体装置。 - 請求項16記載の半導体装置において、前記複数の半導体チップのうち、第1の半導体チップと第2の半導体チップがそれぞれ電源用のトランジスタ回路を有しており、第3の半導体チップが、前記第1および第2の半導体チップを制御するドライバ回路を有していることを特徴とする半導体装置。
- 請求項16記載の半導体装置において、前記板状導体部材の前記封止体から露出した箇所に放熱部材が取り付けられていることを特徴とする半導体装置。
- 請求項16記載の半導体装置において、前記板状導体部材とこれに電気的に接続する半導体チップとが複数の金バンプを介して電気的に接続されていることを特徴とする半導体装置。
- 請求項16記載の半導体装置において、前記複数の半導体チップのうち、第1の半導体チップと第2の半導体チップがそれぞれ電源用のトランジスタ回路を有しているとともに、前記第2の半導体チップが前記第1の半導体チップと表裏面反対の向きで搭載されており、さらに、
前記第1の半導体チップのドレイン端子に接続する第1の板状導体部材と、
前記第1の半導体チップのソース端子に接続する第2の板状導体部材と、
前記第2の半導体チップのドレイン端子に接続する第3の板状導体部材と、
前記第2の半導体チップのソース端子に接続する第4の板状導体部材とを有しており、
前記第2および第3の板状導体部材それぞれの一部が前記封止体の表裏面の何れか一方に露出し、前記第1および第4の板状導体部材それぞれの一部が前記封止体の表裏面の何れか他方に露出していることを特徴とする半導体装置。
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JP2009283656A (ja) * | 2008-05-22 | 2009-12-03 | Denso Corp | 半導体装置およびその製造方法 |
JP2010161188A (ja) * | 2009-01-08 | 2010-07-22 | Mitsubishi Electric Corp | パワーモジュール及びパワー半導体装置 |
JP2012015453A (ja) * | 2010-07-05 | 2012-01-19 | Denso Corp | 半導体モジュールおよびその製造方法 |
JP2018129414A (ja) * | 2017-02-09 | 2018-08-16 | 株式会社東芝 | 半導体モジュール |
CN109427705A (zh) * | 2017-08-31 | 2019-03-05 | 瑞萨电子株式会社 | 电子装置 |
CN111886787A (zh) * | 2018-03-19 | 2020-11-03 | 株式会社村田制作所 | 控制电路模块、电子部件的连接构造以及电力变换装置 |
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Cited By (10)
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JP2009283656A (ja) * | 2008-05-22 | 2009-12-03 | Denso Corp | 半導体装置およびその製造方法 |
US8278747B2 (en) | 2008-05-22 | 2012-10-02 | Denso Corporation | Semiconductor apparatus having a two-side heat radiation structure |
JP2010161188A (ja) * | 2009-01-08 | 2010-07-22 | Mitsubishi Electric Corp | パワーモジュール及びパワー半導体装置 |
JP2012015453A (ja) * | 2010-07-05 | 2012-01-19 | Denso Corp | 半導体モジュールおよびその製造方法 |
JP2018129414A (ja) * | 2017-02-09 | 2018-08-16 | 株式会社東芝 | 半導体モジュール |
CN109427705A (zh) * | 2017-08-31 | 2019-03-05 | 瑞萨电子株式会社 | 电子装置 |
CN109427705B (zh) * | 2017-08-31 | 2023-05-09 | 瑞萨电子株式会社 | 电子装置 |
CN111886787A (zh) * | 2018-03-19 | 2020-11-03 | 株式会社村田制作所 | 控制电路模块、电子部件的连接构造以及电力变换装置 |
CN116825768A (zh) * | 2020-10-14 | 2023-09-29 | 罗姆股份有限公司 | 半导体模块 |
CN116825768B (zh) * | 2020-10-14 | 2024-02-23 | 罗姆股份有限公司 | 半导体模块 |
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