JP2008091637A5 - - Google Patents

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Publication number
JP2008091637A5
JP2008091637A5 JP2006271072A JP2006271072A JP2008091637A5 JP 2008091637 A5 JP2008091637 A5 JP 2008091637A5 JP 2006271072 A JP2006271072 A JP 2006271072A JP 2006271072 A JP2006271072 A JP 2006271072A JP 2008091637 A5 JP2008091637 A5 JP 2008091637A5
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JP
Japan
Prior art keywords
substrate
nozzle
cleaning
cleaning liquid
cleaning method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006271072A
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English (en)
Japanese (ja)
Other versions
JP4921913B2 (ja
JP2008091637A (ja
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Publication date
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Priority to JP2006271072A priority Critical patent/JP4921913B2/ja
Priority claimed from JP2006271072A external-priority patent/JP4921913B2/ja
Priority to US11/865,901 priority patent/US20080078427A1/en
Publication of JP2008091637A publication Critical patent/JP2008091637A/ja
Publication of JP2008091637A5 publication Critical patent/JP2008091637A5/ja
Application granted granted Critical
Publication of JP4921913B2 publication Critical patent/JP4921913B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006271072A 2006-10-02 2006-10-02 基板洗浄方法 Expired - Fee Related JP4921913B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006271072A JP4921913B2 (ja) 2006-10-02 2006-10-02 基板洗浄方法
US11/865,901 US20080078427A1 (en) 2006-10-02 2007-10-02 Substrate cleaning method and semiconductor device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006271072A JP4921913B2 (ja) 2006-10-02 2006-10-02 基板洗浄方法

Publications (3)

Publication Number Publication Date
JP2008091637A JP2008091637A (ja) 2008-04-17
JP2008091637A5 true JP2008091637A5 (https=) 2009-10-08
JP4921913B2 JP4921913B2 (ja) 2012-04-25

Family

ID=39259935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006271072A Expired - Fee Related JP4921913B2 (ja) 2006-10-02 2006-10-02 基板洗浄方法

Country Status (2)

Country Link
US (1) US20080078427A1 (https=)
JP (1) JP4921913B2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4926678B2 (ja) * 2006-12-04 2012-05-09 東京エレクトロン株式会社 液浸露光用洗浄装置および洗浄方法、ならびにコンピュータプログラムおよび記憶媒体
JP2009111186A (ja) * 2007-10-30 2009-05-21 Toshiba Corp 基板処理方法、基板搬送方法および基板搬送装置
JP5159738B2 (ja) * 2009-09-24 2013-03-13 株式会社東芝 半導体基板の洗浄方法および半導体基板の洗浄装置
US9698062B2 (en) * 2013-02-28 2017-07-04 Veeco Precision Surface Processing Llc System and method for performing a wet etching process
US9870928B2 (en) 2014-10-31 2018-01-16 Veeco Precision Surface Processing Llc System and method for updating an arm scan profile through a graphical user interface
CN107258011A (zh) 2014-10-31 2017-10-17 维克精密表面处理有限责任公司 执行湿蚀刻工艺的系统和方法
TWI738757B (zh) 2016-04-05 2021-09-11 美商維克儀器公司 經由化學的適應性峰化來控制蝕刻速率的裝置和方法
CN106057710B (zh) * 2016-08-02 2019-02-19 北京七星华创电子股份有限公司 改善气液两相雾化清洗均匀性的装置和方法
EP3590128A1 (en) 2017-03-03 2020-01-08 Veeco Precision Surface Processing LLC An apparatus and method for wafer thinning in advanced packaging applications

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002239434A (ja) * 2001-02-14 2002-08-27 Tokyo Electron Ltd 塗布膜形成装置および塗布膜形成方法
JP3655576B2 (ja) * 2001-07-26 2005-06-02 株式会社東芝 液膜形成方法及び半導体装置の製造方法
US20030192570A1 (en) * 2002-04-11 2003-10-16 Applied Materials, Inc. Method and apparatus for wafer cleaning
JP2004335542A (ja) * 2003-04-30 2004-11-25 Toshiba Corp 基板洗浄方法及び基板乾燥方法
JP2006024715A (ja) * 2004-07-07 2006-01-26 Toshiba Corp リソグラフィー装置およびパターン形成方法
JP4324527B2 (ja) * 2004-09-09 2009-09-02 東京エレクトロン株式会社 基板洗浄方法及び現像装置
JP4459774B2 (ja) * 2004-10-12 2010-04-28 東京エレクトロン株式会社 基板処理方法、基板処理装置およびコンピュータプログラム
US7476616B2 (en) * 2004-12-13 2009-01-13 Fsi International, Inc. Reagent activator for electroless plating

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