JP2008091560A - Wiring board, multilayer wiring board, and electronic device, and manufacturing method of these - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board and a multilayer wiring board which suppress the possibilities of corrosion of electrode interconnections formed on the surface of an insulation substrate and of short circuits between the electrode interconnections, and also to provide a manufacturing method of the multilayer wiring board and an electronic device having a high reliability. <P>SOLUTION: The wiring board includes a plurality of electrode interconnections 2 on the surface of the insulation substrate 1. The electrode interconnections 2 include a metal interconnection layer 2a formed on the surface of the insulation substrate 1. The wiring board also includes an insulation portion 4 for covering the metal interconnection layer 2a over the width direction of that layer 2a. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a wiring board, a multilayer wiring board and an electronic device for mounting an electronic component such as a semiconductor element or a crystal resonator, and a method for manufacturing them.

  Conventionally, wiring boards for mounting electronic components such as semiconductor elements and crystal resonators are made of metal powder metallization such as tungsten and molybdenum on the surface of an insulating substrate made of an electrically insulating material such as an aluminum oxide sintered body. It is comprised by arrange | positioning the wiring conductor which consists of.

  Such a wiring board is obtained by applying a metallized paste for a wiring conductor to some of the ceramic green sheets for an insulating substrate by printing means such as a screen printing method, and then laminating a plurality of these ceramic green sheets, It is formed by firing at a high temperature.

  And such a wiring board mounts an electronic component, and electrically connects each electrode of the electronic component to each wiring conductor corresponding to each electrode through an electrical connection means such as solder or a bonding wire. Thus, an electronic device is formed. In the electronic device, the electronic component is covered and sealed with a lid made of metal, ceramics, glass, or the like, or a potting resin as necessary.

  In addition, the wiring board effectively prevents the wiring conductor from being oxidatively corroded, and also joins the wiring conductor and the electronic component, and electrically connects the wiring conductor and gold (Au) wire or solder bump, and the wiring conductor. For the purpose of strengthening the bonding between the circuit board and the external circuit board, a portion exposed to the outer surface of the insulating substrate of the wiring conductor is usually coated with a metal layer having excellent corrosion resistance, for example, As such a metal layer, a plating layer made of a nickel plating layer, a gold plating layer, or the like is sequentially deposited on the exposed surface of the wiring conductor.

  In order to efficiently deposit the plating layer on the surface of the wiring conductor, a plating conduction pattern for electrically connecting the plurality of wiring conductors is formed on the surface of the insulating substrate, and the plurality of wiring conductors are formed by electrolytic plating. A plating layer is applied to the exposed surface of the film. Then, after depositing the plating layer on the exposed surface of the plurality of wiring conductors, by cutting and cutting so as to divide a part of the plating conduction pattern by cutting using a cutting device or the like, The wiring conductors are electrically independent from each other (see Patent Document 1).

Japanese Patent Laid-Open No. 7-122838

  However, when the plating conduction pattern is cut and removed so as to be divided, the metallized layer, the nickel plating layer, and the gold plating layer are exposed in contact with the cutting surface. There was a problem that corrosion occurred on the surface.

  In addition, with the recent increase in the density of electronic devices, wiring conductors are formed at a high density in a wiring board. When the plating conduction pattern is removed by cutting or the like, the cutting device The nickel plating layer and the gold plating layer are drawn in the cutting direction by the cutting blades of the metal, forming needle-like protrusions, which may cause short circuit between adjacent wiring conductors. It was.

  The present invention has been devised in view of the above-described problems of the prior art, and its purpose is to suppress the possibility that the electrode wiring formed on the surface of the insulating substrate corrodes and the possibility that the electrode wirings are short-circuited. An object of the present invention is to provide a wiring board, a multilayer wiring board, and a method for manufacturing the multilayer wiring board. Another object is to provide an electronic device with excellent reliability.

  The wiring board of the present invention is a wiring board having a plurality of electrode wirings on the surface of the insulating substrate, wherein the electrode wiring includes a metal wiring layer formed on the surface of the insulating substrate, and extends across the width direction of the metal wiring layer. And an insulating portion covering the metal wiring layer.

  Preferably, the insulating portion includes a pair of insulating portions, and the pair of insulating portions are provided at predetermined intervals in the extending direction of the metal wiring layer.

  In the multilayer wiring board of the present invention, a metal coating layer is formed on the metal wiring layer of the wiring board of the present invention and in a region adjacent to the insulating portion, and the metal wiring layer is covered with the insulating portion. The region is cut together with the insulating portion within the region.

  In the multilayer wiring board of the present invention, a metal coating layer is formed on the metal wiring layer of the wiring board of the present invention and in a region adjacent to each of the pair of insulating portions. It cut | disconnects in the area | region between insulation parts, It is characterized by the above-mentioned.

  Preferably, the plurality of metal wiring layers are made of a metallized layer, and the metal coating layer contains gold.

  Preferably, the color tone of the insulating part is different from that of the insulating substrate.

  The electronic device of the present invention is characterized in that an electronic component is mounted on the surface of the multilayer wiring board of the present invention, and the mounted electronic component is electrically connected to the electrode wiring.

  The method for manufacturing a multilayer wiring board according to the present invention is a method for manufacturing a multilayer wiring board having a plurality of electrode wirings on the surface of an insulating substrate, wherein a metal wiring layer is formed on the surface of the insulating substrate, and the metal wiring layer is formed Forming an insulating portion covering the metal wiring layer over the width direction of the metal wiring layer, forming a metal coating layer on the metal wiring layer and in a region adjacent to the insulating portion by electrolytic plating, and The wiring layer is cut together with the insulating portion in a region covered with the insulating portion.

  Preferably, the insulating portion includes a pair of insulating portions, and the pair of insulating portions are provided with a predetermined interval in the extending direction of the metal wiring layer, and the metal wiring layer includes: It cut | disconnects in the area | region between said pair of insulation parts.

  In the wiring board of the present invention, the electrode wiring includes a metal wiring layer formed on the surface of the insulating substrate, and has an insulating portion that covers the metal wiring layer in the width direction of the metal wiring layer. When the metal coating layer is applied to the exposed surface of the metal wiring layer, the metal coating layer is not covered in the region covered with the insulating portion.

  Therefore, when the metal wiring layer is cut and removed along the insulating portion by cutting or the like, the insulating substrate, the metal wiring layer, and the insulating portion are exposed adjacent to each other on the cutting surface of the metal wiring layer, and the metallized layer, nickel Different metal layers such as a plating layer and a gold plating layer are not exposed in an adjacent state, and it is possible to suppress the possibility of corrosion due to local cell action between different metals on the cutting surface.

  In addition, when the insulating portion and the metal wiring layer are removed by cutting, a metal coating layer such as a nickel plating layer or a gold plating layer is not formed on the region covered with the insulating portion. There is no occurrence of needle-like protrusions due to spreading of the metal coating layer due to cutting or the like, and the possibility of short-circuiting between adjacent electrode wirings due to the needle-like protrusions can be suppressed.

  Preferably, the insulating portion includes a pair of insulating portions, and the pair of insulating portions are provided at predetermined intervals in the extending direction of the metal wiring layer, so that the metal wiring layer is exposed by an electrolytic plating method. When the metal coating layer is deposited on the surface, the metal coating layer is deposited on the exposed region of the metal wiring layer between the pair of insulating portions.

  Therefore, when the metal wiring layer is cut and removed along the insulating portion by cutting or the like, the position of the metal wiring layer and the insulating portion can be well recognized through the pair of insulating portions. The wiring layer and the insulating portion can be satisfactorily cut and removed, and the plurality of electrode wirings coated with the metal coating layer can be efficiently and electrically independent.

  In the multilayer wiring board of the present invention, a metal coating layer is formed in a region adjacent to the insulating portion on the metal wiring layer of the wiring substrate, and the insulating portion is formed in the region where the metal wiring layer is covered by the insulating portion. In addition, there is no area where the different metal of the metal wiring layer or metal coating layer is adjacently exposed on the cutting surface, and needle-like protrusions are generated due to the extension of the metal coating layer by cutting or the like. Therefore, the possibility of the corrosion of the electrode wiring and the short circuit between the electrode wirings can be suppressed, and the multilayer wiring board having excellent reliability can be obtained.

  In the multilayer wiring board of the present invention, a metal coating layer is formed on a metal wiring layer and in a region adjacent to each of the pair of insulating portions, and the metal wiring layer is cut at a region between the pair of insulating portions. Therefore, in the cutting surface of the electrode wiring, there is no region where the metal of the metal wiring layer or the metal coating layer is adjacent, and there is no needle-like protrusion due to the extension of the metal coating layer by cutting or the like. The possibility of the corrosion of the electrode wiring and the short circuit between the electrode wirings can be suppressed, and a multilayer wiring board having excellent reliability can be obtained.

  Preferably, the plurality of metal wiring layers are formed of a metallized layer, and the metal coating layer contains gold. It is possible to suppress the occurrence of needle-like protrusions due to the spread of gold during the cutting process, and to suppress a short circuit between the electrode wires.

  Preferably, since the color tone of the insulating part and the insulating substrate is different, when the metal wiring layer and the insulating part are removed by cutting, the cutting depth depends on the color tone of the insulating substrate, the metal wiring layer, and the insulating part. The thickness can be easily recognized by visual observation or an image recognition device, the metal wiring layer can be cut and removed well, and a plurality of electrode wirings can be efficiently and electrically independent.

  In the electronic device of the present invention, an electronic component is mounted on the surface of the multilayer wiring board of the present invention, and the mounted electronic component is electrically connected to the electrode wiring. Since the possibility of corrosion or short circuit is suppressed, an electronic device with excellent reliability can be obtained.

The method for manufacturing a multilayer wiring board of the present invention is a method for manufacturing a multilayer wiring board comprising a plurality of electrode wirings on the surface of an insulating substrate, wherein a metal wiring layer is formed on the surface of the insulating substrate, and on the formed metal wiring layer, An insulating part that covers the metal wiring layer is formed over the width direction of the metal wiring layer, and the metal coating layer is formed by electrolytic plating on the metal wiring layer and in a region adjacent to the insulating part. Since the formed metal wiring layer is cut together with the insulating portion in the region covered with the insulating portion, the region where the metal covering layer is not deposited by the electrolytic plating method on the insulating portion is formed on the metal wiring layer. Therefore, when the insulating part and the metal wiring layer are cut and removed, there is no area where the different metal layer contacts and is exposed on the cut surface, and the occurrence of needle-like protrusions due to the extension of the metal coating layer is suppressed. Preferably, the insulating portion includes a pair of insulating portions, and the pair of insulating portions is an extension of the metal wiring layer. Since the metal wiring layer is cut at the region between the pair of insulating portions, the metal wiring layer between the pair of insulating portions is exposed in the exposed region. Metal coating Since the layer is deposited, when the metal wiring layer is cut and removed along the insulating part by cutting or the like, the position of the metal wiring layer and the insulating part can be recognized well between the pair of insulating parts. The metal wiring layer and the insulating portion can be satisfactorily cut and removed by cutting or the like, and a plurality of electrode wirings coated with the metal coating layer can be efficiently and electrically separated to provide a multilayer wiring board. it can.

  Embodiments of the present invention are described in detail below. FIG. 1 is a plan view showing a multilayer wiring board according to an embodiment of the present invention, and FIG. 2A is a cross-sectional view taken along line AA ′ of the multilayer wiring board of FIG. 2 (b) is an enlarged cross-sectional view of a main part in a B part in FIG. 2 (a). As shown in these drawings, the multilayer wiring board includes an insulating substrate 1, an electrode wiring 2, a metal wiring layer 2a, metal coating layers 2b and 2c, a conductive conductor 3, and an insulating portion 4.

  The wiring board of the present invention includes a plurality of electrode wirings 2 on the surface of the insulating substrate 1, and the electrode wiring 2 includes a metal wiring layer 2 a formed on the surface of the insulating substrate 1. An insulating portion 4 that covers the metal wiring layer 2a is provided across the width direction of the metal wiring layer 2a.

  As shown in FIGS. 1 and 2, the multilayer wiring board is shown in a state where the metal coating layers 2b and 2c are deposited on the metal wiring layer 2a. That is, a state in which the metal coating layers 2b and 2c are not deposited on the metal wiring layer 2a is a wiring substrate, and a state in which the metal coating layers 2b and 2c are deposited on the metal wiring layer 2a is a multilayer wiring substrate.

The insulating substrate 1 of the present invention is made of ceramics, and is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, or a silicon carbide sintered body. When the insulating substrate 1 is made of an aluminum oxide sintered body, an organic solvent suitable for a raw material powder such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO), A solvent is added and mixed to make a mud-like shape, and a ceramic green sheet (ceramic green sheet) is obtained by forming the sheet into a sheet shape by using a conventionally known doctor blade method or calendar roll method. The sheet is manufactured by performing an appropriate punching process, stacking a plurality of sheets as necessary, and firing at a high temperature (about 1500 to 1800 ° C.).

  The electrode wiring 2 is a conductive path for electrically connecting an electronic component to the outside. For example, as shown in FIG. 2, metal coating layers 2 b and 2 c are deposited on the exposed portion of the metal wiring layer 2 a on the outer surface of the insulating substrate 1. The metal wiring layer 2a is made of metal powder metallization such as tungsten, molybdenum, copper, silver, etc., and a metallized paste for the metal wiring layer 2a is printed on the ceramic green sheet for the insulating substrate 1 by printing means such as a screen printing method. Then, it is deposited on a predetermined region by simultaneous firing with the ceramic green sheet for the insulating substrate 1. The metallized paste for the metal wiring layer 2a is mixed and kneaded by kneading means such as a ball mill, a three-roll mill, a planetary mixer, etc. with an organic binder, an organic solvent and, if necessary, a dispersant added to the main component metal powder. It is manufactured by. Glass or ceramic powder may be added to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the laminated substrate after sintering.

  Moreover, the metal wiring layer 2a formed on the surface and inside of the insulating substrate 1 is electrically connected by a through conductor 5 that penetrates the insulating substrate 1 in the thickness direction as necessary. Such a through conductor 5 penetrates a ceramic green sheet for the insulating substrate 1 by a punching method using a die or punching or a processing method such as laser processing prior to printing and application of a metallized paste for forming the metal wiring layer 2a. A through-hole for the conductor is formed, and the metallized paste for the through-conductor 5 is filled in the through-hole for the through-conductor by a printing means such as a screen printing method and simultaneously with the ceramic green sheet for the insulating substrate 1. Formed in each region by firing. The metallized paste for the through conductor is prepared in the same manner as the metallized paste for the metal wiring layer 2a, but is prepared to have a viscosity suitable for filling depending on the amount of the organic binder or organic solvent.

  The metal coating layers 2b and 2c are formed of a metal having excellent corrosion resistance such as nickel (Ni), gold (Au), silver (Ag), etc. on the exposed portion of the metal wiring layer 2a on the outer surface of the insulating substrate 1. It is formed by depositing with a thickness of about 20 μm. The metal coating layers 2b and 2c can effectively prevent the metal wiring layer 2a from being oxidatively corroded, and the electrode wiring 2 can be fixed to the electronic component, or the electrode wiring 2 can be electrically connected to the bonding wire or the solder bump. The connection between the wiring 2 and the wiring conductor of the external electric circuit board can be strengthened. For example, a Ni plating layer having a thickness of about 1 to 10 μm is deposited as the metal wiring layer 2b on the exposed surface of the metal wiring layer 2a, and the metal wiring layer 2c has a thickness of 0.1 as the metal wiring layer 2b. An Au plating layer of about 3 μm is sequentially deposited.

  The metal coating layers 2b and 2c are not limited to two layers, and may be composed of one or three or more metal coating layers. For example, a multilayer wiring board in which a Ni plating layer, a Pd plating layer, and an Au plating layer are sequentially deposited on a portion of the metal wiring layer 2a exposed on the outer surface of the insulating substrate 1, a Ni plating layer and a Pd plating layer It may be a multilayer wiring board in which a Cu plating layer is sequentially deposited, or a multilayer wiring board in which a Ni plating layer, an Au plating layer, and an Ag plating layer are sequentially deposited, on the exposed surface of the metal wiring layer 2a. It may be a multilayer wiring board on which a metal coating layer made of another metal is applied.

  The conducting conductor 3 is provided on the surface of the insulating substrate 1 in order to electrically connect the plurality of electrode wirings 2. The conductive conductor 3 serves as a conductive path to electrically connect the plurality of electrode wirings 2, so that a metal coating is formed on a portion of the metal wiring layer 2 a exposed on the outer surface of the insulating substrate 1 by electrolytic plating. Layers 2b and 2c can be applied. The conductive conductor 3 can be deposited on a predetermined region of the surface of the insulating substrate 1 by a method similar to that of the metal wiring layer 2a described above.

  Since the electrode wiring 2 is formed in a state of being electrically short-circuited on the surface of the insulating substrate 1 by the conductive conductor 3, the insulating substrate 1 of the metal wiring layer 2a is formed by electrolytic plating after the wiring substrate is immersed in a plating bath. The metal coating layers 2b and 2c can be deposited on the exposed portion of the outer surface of the metal substrate, and the electrode wiring 2 is formed by laminating the metal wiring layer 2a and the metal coating layers 2b and 2c on the surface of the insulating substrate 1. Can be formed.

  Further, the conductive conductor 3 is disposed for depositing and forming the metal coating layers 2b and 2c on the electrode wiring 2 by electrolytic plating, but all the metal coating layers 2b and 2c of the electrode wiring 2 are electrolyzed. It is not necessary to deposit the metal coating layers 2b and 2c by a plating method. For example, when it is desired to form the metal coating layers 2b and 2c thinly, some of the metal coating layers sequentially deposited on the metal wiring layer 2a as necessary. It may be deposited by an electroless plating method or the like. For example, the metal coating layer 2b may be deposited on the metal wiring layer 2a by the electrolytic plating method, and then the metal coating layer 2c may be deposited on the metal coating layer 2b by the electroless plating method.

  The insulating portion 4 is provided so as to cover the surface of the conductive conductor 3 of the metal wiring layer 2 a over the width direction of the conductive conductor 3. Here, the width direction of the conducting conductor 3 is a direction intersecting with a direction in which the conducting conductor 3 extends between the electrode wirings 2 (hereinafter referred to as an extending direction). This is the direction of the width of the conductive conductor 3 disposed between them. That is, it has shown that it has the area | region where the conductor 3 for conduction | electrical_connection is not exposed over the width direction by being coat | covered with the insulating part 4. FIG. Further, the extending direction length of the insulating part 4 may be provided so as to be longer than the extending direction length of the cutting region N when the conductive conductor 3 and the insulating part 4 described later are cut and removed. For example, what is necessary is just to set so that it may become wider than the width | variety of the cutting blade etc. at the time of cutting and removing the conductor 3 for conduction | electrical_connection and the insulation part 4 by cutting. Here, the cutting region N is a region indicated by a one-dot chain line in FIGS. 1 and 2, and is a region in which the conductive conductor 3 and the insulating portion 4 are cut and removed later.

  The insulating portion 4 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, or a silicon carbide sintered body, and is printed on a ceramic green sheet for the insulating substrate 1. The ceramic paste for the insulating portion 4 is printed and applied by a printing means such as a screen printing method so that the metallized paste for the conductive conductor 3 is covered in the width direction, and the ceramic paste is applied to the ceramic for the insulating substrate 1. It is applied to a predetermined area by simultaneous firing with the green sheet.

  The ceramic paste for the insulating part 4 is mixed and kneaded by kneading means such as a ball mill, a three-roll mill, a planetary mixer, etc., with an organic binder, an organic solvent, and a dispersant as necessary added to the ceramic powder of the main component. Will be produced.

  The insulating portion 4 is preferably formed by firing together with the insulating substrate 1, so that it is preferably made of substantially the same component as the insulating substrate 1. That is, when the insulating substrate 1 is made of an aluminum oxide sintered body, the insulating substrate 1 is made of an aluminum oxide sintered body, and when the insulating substrate 1 is made of an aluminum nitride sintered body, the insulating portion 4 is nitrided. It is preferably made of an aluminum sintered body.

  Thus, when the wiring board is immersed in a plating bath and the metal coating layers 2b and 2c are deposited on the exposed surface of the metal wiring layer 2a by electrolytic plating to form a multilayer wiring board, the insulating portion of the conductive conductor 3 is obtained. In the region covered with 4, the metal coating layers 2 b and 2 c are not deposited, and the insulating portion 4, the conductive conductor 3 and the insulating substrate 1 are arranged adjacent to each other in the thickness direction. This means that there is no region where different metal layers are adjacent to each other. Then, in the cutting region N shorter than the length in the extending direction of the region covered with the insulating portion 4, the conductive conductor 3 and the insulating portion 4 are cut and removed, whereby the plurality of electrode wirings 2 are electrically independent. It will be.

  3 and 4 are diagrams showing the multilayer wiring board in a state in which the conductive conductor 3 and the insulating portion 4 are cut and removed in the cutting region N shown in FIGS. 1 and 2. FIG. 3 is a plan view showing the multilayer wiring board in a state where the conductive conductor 3 and the insulating portion 4 are removed by cutting. 4A is a cross-sectional view taken along the section line C-C ′ of FIG. 3, and FIG. 4B is an enlarged cross-sectional view of a main part in a D portion of FIG. 4A. As shown in FIG. 4, when the conductive conductor 3 and the insulating portion 4 are cut and removed, a part of the surface layer of the insulating substrate 1 may be cut and removed.

  As a result, when the conductive conductor 3 is removed by cutting along the insulating portion 4 in the multilayer wiring board, the insulating substrate 1, the conductive conductor 3, and the insulating portion 4 are exposed in a state of being sequentially laminated on the cut surface. Thus, different metal layers of the metal wiring layer 2a or the metal coating layers 2b and 2c are not exposed adjacently, and it is possible to suppress the possibility of corrosion due to the different metal layer on the cutting surface.

  Further, when the conductive conductor 3 and the insulating portion 4 are removed by cutting, the metal coating layers 2b and 2c are not formed in the cutting region N, so that the metal coating layers 2b and 2c are spread on the cutting surface by cutting or the like. Therefore, the possibility that the adjacent electrode wirings 2 are short-circuited can be suppressed. In other words, the insulating portion 4 is not provided with the metal coating layers 2b and 2c made of gold or the like, which is likely to be stretched, and the conductive portion made of the metallized layer disposed in the region covered with the insulating portion 4. Since the common conductor 3 does not easily stretch due to cutting or the like, it is possible to suppress the possibility that the adjacent electrode wirings 2 are short-circuited by cutting. Therefore, it is possible to suppress the possibility that corrosion or a short circuit occurs in the multilayer wiring board. Note that the method of cutting and removing the conductive conductor 3 and the insulating portion 4 is not limited to the method of cutting and removing by grinding or cutting, and other methods may be used.

  Next, another embodiment of the present invention will be described. This embodiment is different from the wiring board and the multilayer wiring board shown in FIG. 1 in particular in the configuration of the insulating portion 4, and a detailed description of the common configuration is omitted.

  In the present embodiment, the insulating part 4 includes at least a pair of insulating parts 4, and the pair of insulating parts 4 may be provided with a predetermined interval in the extending direction of the conducting conductor 3. FIG. 5 is a plan view showing the multilayer wiring board of the present embodiment, FIG. 6A is a cross-sectional view taken along the cutting plane line EE ′ of the wiring board of FIG. 5, and FIG. FIG. 6 is an enlarged cross-sectional view of a main part in an F part in FIG. Also in this case, as described above, the state in which the metal coating layers 2b and 2c are not deposited on the metal wiring layer 2a is used as the wiring board, and the metal coating layers 2b and 2c are deposited on the metal wiring layer 2a. The state is a multilayer wiring board.

  5 and 6, a predetermined interval in the extending direction of the conductive conductor 3 of the pair of insulating portions 4 is set to be shorter than the extending direction length of the cutting region N. In other words, the predetermined interval in the extending direction of the conducting conductor 3 should be set to be shorter than the width of the cutting blade or the like when the conducting conductor 3 and the insulating portion 4 are removed by cutting. good. The total length of the pair of insulating portions 4 (the total of the lengths of the pair of insulating portions 4 in the extending direction and the interval predetermined in the extending direction of the conducting conductor 3 of the pair of insulating portions 4) May be provided so as to be longer than the length in the extending direction of the cutting region N when the conductive conductor 3 and the insulating portion 4 are removed by cutting.

  Thus, when the wiring board is immersed in a plating bath and the metal coating layers 2b and 2c are deposited on the exposed surface of the metal wiring layer 2a by electrolytic plating to form a multilayer wiring board, the insulating portion of the conductive conductor 3 is obtained. In the region covered with 4, the metal coating layers 2 b and 2 c are not deposited, and the insulating portion 4, the conductive conductor 3 and the insulating substrate 1 are arranged adjacent to each other in the thickness direction. This means that there is no region where different metal layers are adjacent to each other. In addition, between the pair of insulating portions 4 of the conductive conductor 3, the metal coating layers 2b and 2c are attached to the exposed portions.

  FIGS. 7 and 8 are views showing the multilayer wiring board in a state in which the conductive conductor 3 and the insulating portion 4 in the cutting region N shown in FIGS. 5 and 6 are cut and removed. FIG. 7 is a plan view showing a state in which the conductive conductor 3 and the insulating portion 4 are removed by cutting. FIG. 8A is a cross-sectional view taken along a cutting plane line G-G ′ in FIG. 7, and FIG. 8B is an enlarged cross-sectional view of a main part in the H portion in FIG. When the conductor 3 for conduction is cut and removed along the insulating portion 4 in the multilayer wiring board, the insulating substrate 1, the conductor 3 for conduction, and the insulating portion 4 are exposed in a state of being sequentially laminated on the cut surface. Different metal layers are not exposed adjacently. Since the metal layer different from the metal wiring layer 2a or the metal coating layers 2b and 2c is not exposed on the cutting surface, the possibility that the cutting surface is corroded by the different metal layer can be suppressed. .

  Further, the conductive conductor 3 and the insulating portion 4 may be removed by cutting, and the metal coating layers 2b and 2c are not formed on the cutting surface. Therefore, the needle shape is formed by extending the metal coating layer on the cutting surface by cutting or the like. Therefore, the possibility that the adjacent electrode wirings 2 are short-circuited can be suppressed.

  In addition, when the electroplating method is performed on the insulating substrate 1, the metal coating layers 2 b and 2 c are deposited in the region between the pair of insulating portions 4. The position to be cut can be recognized well, the conductive conductor 3 can be cut and removed well by cutting or the like, and the plurality of electrode wirings 2 to which the metal coating layers 2b and 2c are deposited can be efficiently electrically connected. Can be made independent. Therefore, it is possible to suppress the possibility that corrosion or a short circuit occurs in the multilayer wiring board.

  Moreover, it is preferable to form so that the color tone of the insulation part 4 and the insulated substrate 1 may differ. Accordingly, when the conductive conductor 3 and the insulating portion 4 are removed by cutting, the cutting depth can be easily recognized by visual observation or an image recognition device due to the color difference between the insulating substrate 1 and the insulating portion 4. The conductor 3 can be satisfactorily cut and removed, and the plurality of electrode wirings can be made electrically independent efficiently. That is, the cutting depth does not reach the conducting conductor 3, and the conducting conductor 3 cannot be completely removed by cutting (a state in which the plurality of electrode wirings 2 are electrically connected). Alternatively, by cutting too deeply, the metal wiring layer 2a formed inside the insulating substrate 1 can be removed by cutting, and the electrode wiring 2 can be prevented from being electrically short-circuited.

  The insulating portion 4 having a color tone different from that of the insulating substrate 1 is added with a pigment having a color tone different from that of the pigment added to the insulating substrate 1 to the insulating portion 4 or a pigment added to the insulating substrate 1. Do not add it. For example, when the insulating substrate 1 is white, by adding a powder such as chromium to the ceramic paste for the insulating portion 4, when the insulating substrate 1 is fired together with the ceramic green sheet for the insulating substrate 1, A dark insulating portion 4 can be formed on the surface. It should be noted that the contrast ratio between the insulating substrate 1 and the insulating portion 4 is preferably 20% or more so that the insulating substrate 1 and the insulating portion 4 can be recognized well by visual observation or an image recognition device.

  Further, as another embodiment of the present invention, as shown in FIGS. 9A and 9B, a configuration in which the conducting conductors 3 are electrically connected to each other by a connecting portion 6 may be used. FIG. 9A (a) is a plan view showing a multilayer wiring board according to another embodiment of the present invention, and FIG. 9A (b) does not show the insulating portion 4 in the multilayer wiring board shown in FIG. 9A (a). It is a top view of a state. The connecting portion 6 is a part of the conducting conductor 3 and is formed in the same manner as the conducting conductor 3. By connecting the conductive conductor 3 via the connecting portion 6, variation in current applied to the plurality of metal wiring layers 2 a and the conductive conductor 3 is reduced, and the metal coating layers 2 b and 2 c of the electrode wiring 2 are reduced. Variation in thickness can be reduced. FIG. 9B (c) is a plan view showing the multilayer wiring board in a state in which the conductive conductor 3, the insulating portion 4, and the connecting portion 6 are cut and removed from the multilayer wiring board of FIG. 9A (a) in the cutting region N. . By cutting and removing, it is possible to suppress the possibility that the multilayer wiring board is corroded or short-circuited. Further, as shown in FIG. 9A (a), together with the conductive conductor 3, an insulating portion 4 is formed on the surface of the connecting portion 6, and the connecting portion 6 and the insulating portion 4 are formed on the same line. Thus, since the conductive conductor 3, the connecting portion 6, and the insulating portion 4 can be cut and removed in a single stroke, the plurality of electrode wirings 2 can be made electrically independent efficiently. In FIG. 9A (b), the width of the connecting portion 6 is narrower than the length in the extending direction of the cutting region N in order to satisfactorily electrically isolate the plurality of electrode wirings 2 and is, for example, guided by cutting. The common conductor 3 and the insulating portion 4 are made narrower than the width of a cutting blade or the like when cutting and removing.

  In an electronic device according to still another embodiment of the present invention, an electronic component is mounted on the surface of the multilayer wiring board described above, and the mounted electronic component is electrically connected to the electrode wiring 2. As a result, the multilayer wiring board suppresses the possibility of corrosion or short-circuiting on the cut surface, so that an electronic device with excellent reliability can be obtained.

  As electronic components, semiconductor elements such as IC (Integrated Circuit) chips and LSI (Large Scale Integrated Circuit) chips, piezoelectric elements such as crystal oscillators and piezoelectric vibrators, various sensors, and the like are mounted. When the electronic component is a flip-chip type semiconductor device, the electrodes and electrode wiring of the semiconductor device are connected via solder bumps, gold bumps, or conductive resin (anisotropic conductive resin, etc.). 2 is electrically connected. When the electronic component is a wire bonding type semiconductor element, the semiconductor element is fixed to the surface of the multilayer wiring board with a bonding material such as glass, resin, or brazing material, and then the electrode of the semiconductor element is connected via the bonding wire. This is performed by electrically connecting the electrode wiring 2. When the electronic component is a piezoelectric element such as a crystal resonator, the piezoelectric element is fixed and the electrode of the piezoelectric element and the electrode wiring 2 are electrically connected by a conductive resin.

  And an electronic component is sealed as needed. Sealing is performed by covering the electronic component with a potting resin such as epoxy resin, or a lid made of resin, metal, ceramics, etc. placed so as to cover the electronic component, and an adhesive such as glass, resin, brazing material, etc. By attaching to the wiring board.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, the insulating substrate 1 may have a shape other than a flat plate shape. For example, the insulating substrate 1 may have a recess (cavity) for housing electronic components on the upper surface or the lower surface of the insulating substrate 1. . 1 to 9, the electrode wiring 2 is formed on one main surface and the other main surface of the insulating substrate 1, but may be formed on the side surface of the insulating substrate 1. Further, the wiring board may be provided with the electrode wiring 2 in which a plurality of types of metal coating layers 2b and 2c are attached to one wiring board. For example, a wiring board has a plurality of electrode wirings 2 in which a Ni plating layer and an Au plating layer are sequentially deposited on the metal wiring layer 2a, and a Ni plating layer and an Ag plating layer are sequentially deposited on the metal wiring layer 2a. The plurality of electrode wirings 2 may be provided. Such a wiring board electrically connects the first plurality of conductive conductors that electrically connect some of the plurality of electrode wirings 2 to which the same metal coating layer is applied and the remaining plurality of electrode wirings 2. The second conductive conductors may be formed in advance, and the insulating portions 4 that cover the respective conductive conductors in the width direction may be formed. Thereby, the metal coating layers 2b and 2c of the electrode wiring 2 electrically connected to the first conductive conductor and the metal coating layers 2b and 2c of the electrode wiring 2 electrically connected to the second conductive conductor. Can be configured in different types. Further, the present invention is not limited to the electrode wiring 2, and after the metal coating layers 2b and 2c are deposited on the metallized layer such as the metal wiring layer 2a deposited on the surface of the insulating substrate 1 by electrolytic plating, It can be used when making them independent.

It is a top view which shows the multilayer wiring board which is embodiment of this invention (A) It is sectional drawing in cutting plane line A-A 'of the multilayer wiring board of FIG. 1, (b) It is a principal part expanded sectional view in the B section of Fig.2 (a). FIG. 3 is a plan view showing a multilayer wiring board in a state in which a conducting conductor 3 and an insulating portion 4 are cut and removed in a cutting region N. (A) It is sectional drawing in the cutting plane line C-C 'of the multilayer wiring board of FIG. 3, (b) It is a principal part expanded sectional view in the D section of Fig.4 (a). It is a top view which shows the multilayer wiring board of other embodiment. (A) It is sectional drawing in the cutting plane line E-E 'of the multilayer wiring board of FIG. 5, (b) It is a principal part expanded sectional view in the F section of Fig.6 (a). FIG. 3 is a plan view showing a multilayer wiring board in a state in which a conducting conductor 3 and an insulating portion 4 are cut and removed in a cutting region N. (A) It is sectional drawing in the cutting plane line G-G 'of the multilayer wiring board of FIG. 7, (b) It is a principal part expanded sectional view in the H section of Fig.8 (a). (A) It is a top view which shows the multilayer wiring board which is other embodiment of this invention, (b) It is a top view of the state which does not show the insulation part 4 in the wiring board shown to FIG. 9A (a). FIG. 9C is a plan view showing the wiring board in a state in which the conductive conductor 3, the insulating part 4 and the connecting part 6 are cut and removed from the multilayer wiring board of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Insulation board | substrate 2 Electrode wiring 2a Metal wiring layer 2b, 2c Metal coating layer 3 Conductor for conduction | electrical_connection 4 Insulation part 5 Penetration conductor 6 Connection part N Cutting area

Claims (9)

In a wiring board having a plurality of electrode wirings on the surface of an insulating substrate
The electrode wiring includes a metal wiring layer formed on the surface of the insulating substrate,
A wiring board comprising an insulating portion covering the metal wiring layer over the width direction of the metal wiring layer. The wiring board according to claim 1, wherein the insulating portion includes a pair of insulating portions, and the pair of insulating portions are provided at predetermined intervals in the extending direction of the metal wiring layer. A metal coating layer is formed on the metal wiring layer of the wiring board according to claim 1 and in a region adjacent to the insulating portion,
The multilayer wiring board, wherein the metal wiring layer is cut together with the insulating portion in a region covered with the insulating portion. A metal coating layer is formed on the metal wiring layer of the wiring board according to claim 2 and in a region adjacent to each of the pair of insulating portions,
The multilayer wiring board, wherein the metal wiring layer is cut in a region between the pair of insulating portions. 5. The multilayer wiring board according to claim 3, wherein the plurality of metal wiring layers are made of a metallized layer, and the metal coating layer contains gold. The multilayer wiring board according to claim 3, wherein the color tone of the insulating portion and that of the insulating substrate are different. An electronic device, wherein an electronic component is mounted on a surface of the multilayer wiring board according to any one of claims 3 to 6, and the mounted electronic component is electrically connected to the electrode wiring. . In the manufacturing method of the multilayer wiring board provided with a plurality of electrode wirings on the surface of the insulating substrate,
Forming a metal wiring layer on the surface of the insulating substrate;
On the formed metal wiring layer, an insulating portion that covers the metal wiring layer is formed over the width direction of the metal wiring layer,
Forming a metal coating layer by electrolytic plating on the metal wiring layer and in a region adjacent to the insulating portion;
A method for manufacturing a multilayer wiring board, comprising cutting the metal wiring layer together with the insulating portion in a region covered with the insulating portion. The insulating portion includes a pair of insulating portions, and the pair of insulating portions are provided at predetermined intervals in the extending direction of the metal wiring layer,
The method for manufacturing a multilayer wiring board according to claim 8, wherein the metal wiring layer is cut at a region between the pair of insulating portions.

Images