JP2008047604A5 - - Google Patents
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- Publication number
- JP2008047604A5 JP2008047604A5 JP2006219533A JP2006219533A JP2008047604A5 JP 2008047604 A5 JP2008047604 A5 JP 2008047604A5 JP 2006219533 A JP2006219533 A JP 2006219533A JP 2006219533 A JP2006219533 A JP 2006219533A JP 2008047604 A5 JP2008047604 A5 JP 2008047604A5
- Authority
- JP
- Japan
- Prior art keywords
- active metal
- aluminum electrode
- layer
- metal layer
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 23
- 229910052751 metal Inorganic materials 0.000 claims 18
- 239000002184 metal Substances 0.000 claims 18
- 229910052782 aluminium Inorganic materials 0.000 claims 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 14
- 230000004888 barrier function Effects 0.000 claims 10
- 229910000679 solder Inorganic materials 0.000 claims 8
- 239000000919 ceramic Substances 0.000 claims 7
- 238000005530 etching Methods 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 150000002739 metals Chemical class 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 229910017052 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052735 hafnium Inorganic materials 0.000 claims 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims 1
- 230000000873 masking effect Effects 0.000 claims 1
- 238000001465 metallisation Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006219533A JP5122098B2 (ja) | 2006-08-11 | 2006-08-11 | メタライズ基板、半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006219533A JP5122098B2 (ja) | 2006-08-11 | 2006-08-11 | メタライズ基板、半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008047604A JP2008047604A (ja) | 2008-02-28 |
| JP2008047604A5 true JP2008047604A5 (enrdf_load_stackoverflow) | 2010-09-24 |
| JP5122098B2 JP5122098B2 (ja) | 2013-01-16 |
Family
ID=39181080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006219533A Expired - Fee Related JP5122098B2 (ja) | 2006-08-11 | 2006-08-11 | メタライズ基板、半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5122098B2 (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI403004B (en) * | 2009-09-04 | 2013-07-21 | Led package structure for increasing heat-dissipating effect and light-emitting efficiency and method for making the same | |
| JP5515822B2 (ja) * | 2010-02-12 | 2014-06-11 | 東芝ライテック株式会社 | 発光装置及び照明装置 |
| US8616732B2 (en) | 2010-02-12 | 2013-12-31 | Toshiba Lighting & Technology Corporation | Light-emitting device and illumination device |
| WO2018143470A1 (ja) * | 2017-02-06 | 2018-08-09 | 三菱マテリアル株式会社 | セラミックス／アルミニウム接合体、絶縁回路基板、ｌｅｄモジュール、セラミックス部材、セラミックス／アルミニウム接合体の製造方法、絶縁回路基板の製造方法 |
| JP7052374B2 (ja) | 2017-02-06 | 2022-04-12 | 三菱マテリアル株式会社 | セラミックス／アルミニウム接合体の製造方法、絶縁回路基板の製造方法 |
| JP7366551B2 (ja) | 2019-02-05 | 2023-10-23 | 新光電気工業株式会社 | 複合グリーンシート、セラミック部材、複合グリーンシートの製造方法及びセラミック部材の製造方法 |
| JP7707132B2 (ja) * | 2022-06-28 | 2025-07-14 | 株式会社東芝 | セラミックス薄膜メタライズ基板の製造方法、チップオンサブマウントの製造方法、および、半導体モジュールの製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3284055B2 (ja) * | 1996-06-26 | 2002-05-20 | 株式会社東芝 | 半導体素子、半導体装置、および半導体装置の検査方法 |
| JP2000133669A (ja) * | 1998-10-26 | 2000-05-12 | Sony Corp | 半導体装置の製造方法 |
| JP3509809B2 (ja) * | 2002-04-30 | 2004-03-22 | 住友電気工業株式会社 | サブマウントおよび半導体装置 |
| JP3661695B2 (ja) * | 2003-07-11 | 2005-06-15 | 株式会社デンソー | 半導体装置 |
| JP2005259848A (ja) * | 2004-03-10 | 2005-09-22 | Toshiba Corp | 半導体装置及びその製造方法 |
| JP4228303B2 (ja) * | 2004-04-12 | 2009-02-25 | 住友電気工業株式会社 | 半導体発光素子搭載部材と、それを用いた半導体発光装置 |
| JP2006286944A (ja) * | 2005-03-31 | 2006-10-19 | Dowa Mining Co Ltd | サブマウント及びその製造方法 |
| JP2007294899A (ja) * | 2006-03-31 | 2007-11-08 | Dowa Electronics Materials Co Ltd | 半田層及びそれを用いた電子デバイス接合用基板並びに電子デバイス接合用サブマウント |
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2006
- 2006-08-11 JP JP2006219533A patent/JP5122098B2/ja not_active Expired - Fee Related