JP2008042176A - 窒化物半導体の選択成長方法、窒化物発光素子及びその製造方法 - Google Patents
窒化物半導体の選択成長方法、窒化物発光素子及びその製造方法 Download PDFInfo
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- 150000004767 nitrides Chemical class 0.000 title claims abstract description 156
- 239000004065 semiconductor Substances 0.000 title claims abstract description 146
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000013078 crystal Substances 0.000 claims abstract description 153
- 230000012010 growth Effects 0.000 claims description 149
- 238000002955 isolation Methods 0.000 claims description 41
- 230000008569 process Effects 0.000 claims description 17
- 238000000926 separation method Methods 0.000 abstract description 28
- 230000000694 effects Effects 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- 239000012535 impurity Substances 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 1
- 229910010093 LiAlO Inorganic materials 0.000 description 1
- 229910020068 MgAl Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- -1 nitride compound Chemical class 0.000 description 1
- 230000034655 secondary growth Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
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Abstract
【解決手段】窒化物半導体の選択成長方法は、窒化物半導体層33上に開口部を有するマスクを形成する段階と、上記マスクの開口部に露出された上記窒化物半導体層領域に上記窒化物半導体層の上面に対して傾斜した結晶面を有する六角ピラミッド構造窒化物半導体結晶34を選択的に成長させる段階とを含み、上記六角ピラミッド構造の窒化物半導体結晶は、その上下部に位置した結晶面の傾斜角より大きい傾斜角の結晶面を有する少なくとも一つの中間分離領域を含む。また、上記の窒化物半導体の選択成長方法を用いて製造できる窒化物発光素子と、その製造方法を提供する。
【選択図】 図3
Description
32、42 バッファ層
33 窒化物半導体層
34 六角ピラミッド窒化物半導体結晶
34a 下部領域
34b 中間分離領域
34c 上部領域
43 第1導電型窒化物基底層
44 六角ピラミッド第1導電型窒化物半導体結晶
45 活性層
46 第2導電型窒化物半導体層
47 透明電極
48 第1電極
49 第2電極
Claims (26)
- 窒化物半導体層上に開口部を有するマスクを形成する段階と、
前記マスクの開口部に露出された前記窒化物半導体層領域に、前記窒化物半導体層の上面に対して傾斜した結晶面を有する六角ピラミッド構造の窒化物半導体結晶を選択的に成長させる段階と、を含み、
前記六角ピラミッド構造の窒化物半導体結晶は、その上下部に位置した結晶面の傾斜角より大きい傾斜角の結晶面を有する少なくとも一つの中間分離領域を含む窒化物半導体の選択成長方法。 - 前記窒化物半導体結晶の選択成長段階は、
六角ピラミッド構造のための成長モードを満足する第1成長速度で窒化物半導体結晶の第1成長工程を行う段階と、
前記中間分離領域が形成されるように前記第1成長速度より高い第2成長速度で窒化物半導体結晶の第2成長工程を行う段階と、
六角ピラミッド構造のための成長モードを満足する第3成長速度であって、前記第3成長速度は前記第2成長速度より低い第3成長速度で窒化物半導体結晶の第3成長工程を行う段階と、を含むことを特徴とする請求項1に記載の窒化物半導体の選択成長方法。 - 前記窒化物半導体結晶の選択成長段階は、前記第2成長工程を行う段階と、前記第3成長工程を行う段階とを少なくとも1回繰り返す段階を含むことを特徴とする請求項2に記載の窒化物半導体の選択成長方法。
- 前記第1及び第3成長速度は、同じ成長速度を有することを特徴とする請求項2に記載の窒化物半導体の選択成長方法。
- 前記第2成長速度は、前記第1成長速度より20%以上高い速度であることを特徴とする請求項2に記載の窒化物半導体の選択成長方法。
- 前記第1及び第3成長速度は7〜9μm/時間の範囲で、前記第2成長速度は10μm/時間以上であることを特徴とする請求項2に記載の窒化物半導体の選択成長方法。
- 前記窒化物半導体結晶の選択成長段階における成長速度は、III族ソースガスの流量を用いて制御することを特徴とする請求項2に記載の窒化物半導体の選択成長方法。
- 前記少なくとも一つの中間分離領域は、各々0.1〜2μmの厚さを有することを特徴とする請求項1に記載の窒化物半導体の選択成長方法。
- 前記中間分離領域を除いた前記六角ピラミッド構造の窒化物半導体結晶の結晶面はS面で、前記中間分離領域の結晶面は非S面であることを特徴とする請求項1に記載の窒化物半導体の選択成長方法。
- 前記中間分離領域を除いた前記六角ピラミッド構造の窒化物半導体結晶の結晶面の傾斜角は60〜65°で、前記中間分離領域の結晶面の傾斜角は80〜150°であることを特徴とする請求項1に記載の窒化物半導体の選択成長方法。
- 上面に、その上面に対して傾斜した結晶面を有する少なくとも一つの六角ピラミッド結晶構造が形成され、前記六角ピラミッド結晶構造は、その上下部に位置した結晶面の傾斜角より大きい傾斜角の結晶面を有する少なくとも一つの中間分離領域を含む第1導電型窒化物半導体層と、
前記少なくとも一つの六角ピラミッド結晶構造の結晶面上に順次に形成された活性層及び第2導電型窒化物半導体層と、
を含む窒化物半導体発光素子。 - 前記六角ピラミッドの結晶構造は、相互離隔され位置した複数の中間分離領域を有することを特徴とする請求項11に記載の窒化物半導体発光素子。
- 前記中間分離領域の上下部に位置した結晶面は、同じ傾斜角を有することを特徴とする請求項11に記載の窒化物半導体発光素子。
- 前記少なくとも一つの中間分離領域は、各々0.1〜2μmの厚さを有することを特徴とする請求項11に記載の窒化物半導体発光素子。
- 前記中間分離領域を除いた前記六角ピラミッド構造の窒化物半導体結晶の結晶面はS面で、前記中間分離領域の結晶面は非S面であることを特徴とする請求項11に記載の窒化物半導体発光素子。
- 前記中間分離領域を除いた前記六角ピラミッド構造の窒化物半導体結晶の結晶面の傾斜角は60〜65°で、前記中間分離領域の結晶面の傾斜角は80〜150°であることを特徴とする請求項11に記載の窒化物半導体発光素子。
- 第1導電型窒化物半導体からなる基底層の上面に少なくとも一つの開口部を有するマスクを形成する段階と、
前記マスクの開口部に露出された前記基底層領域各々に、前記基底層の上面に対して傾斜した結晶面を有する六角ピラミッド構造の第1導電型窒化物半導体結晶を選択的に成長させる段階と、
前記第1導電型窒化物半導体結晶の表面に活性層及び第2導電型窒化物半導体層を順次に成長させる段階と、を含み、
前記六角ピラミッド構造の第1導電型窒化物半導体結晶は、その上下部に位置した結晶面の傾斜角より大きい傾斜角の結晶面を有する少なくとも一つの中間分離領域を含む窒化物半導体発光素子の製造方法。 - 前記第1導電型窒化物半導体結晶の選択成長段階は、
六角ピラミッド構造のための成長モードを満足する第1成長速度で第1導電型窒化物半導体結晶の第1成長工程を行う段階と、
前記中間分離領域が形成されるように前記第1成長速度より高い第2成長速度で第1導電型窒化物半導体結晶の第2成長工程を行う段階と、
六角ピラミッド構造のための成長モードを満足する第3成長速度であって、前記第3成長速度は前記第2成長速度より低い第3成長速度で第1導電型窒化物半導体結晶の第3成長工程を行う段階と、
を含むことを特徴とする請求項17に記載の窒化物半導体発光素子の製造方法。 - 前記第1導電型窒化物半導体結晶の選択成長段階は、前記第2成長工程を行う段階と前記第3成長工程を行う段階とを少なくとも1回繰り返す段階を含むことを特徴とする請求項18に記載の窒化物半導体発光素子の製造方法。
- 前記第1及び第3成長速度は、同じ成長速度を有することを特徴とする請求項18に記載の窒化物半導体発光素子の製造方法。
- 前記第2成長速度は、前記第1成長速度より20%以上速い速度であることを特徴とする請求項18に記載の窒化物半導体発光素子の製造方法。
- 前記第1及び第3成長速度は7〜9μm/時間の範囲で、前記第2成長速度は10μm/時間以上であることを特徴とする請求項18に記載の窒化物半導体発光素子の製造方法。
- 前記第1導電型窒化物半導体結晶の選択成長段階における成長速度は、III族ソースガスの流量を用いて制御することを特徴とする請求項18に記載の窒化物半導体発光素子の製造方法。
- 前記少なくとも一つの中間分離領域は、各々0.1〜2μmの厚さを有することを特徴とする請求項18に記載の窒化物半導体発光素子の製造方法。
- 前記中間分離領域を除いた前記六角ピラミッド構造の第1導電型窒化物半導体結晶の結晶面はS面で、前記中間分離領域の結晶面は非S面であることを特徴とする請求項17に記載の窒化物半導体発光素子の製造方法。
- 前記中間分離領域を除いた前記六角ピラミッド構造の第1導電型窒化物半導体結晶の結晶面の傾斜角は60〜65°で、前記中間分離領域の結晶面の傾斜角は80〜150°であることを特徴とする請求項17に記載の窒化物半導体発光素子の製造方法。
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WO2014193069A1 (ko) * | 2013-05-28 | 2014-12-04 | 부경대학교 산학협력단 | 백색 led와 그 제조방법 |
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KR101019134B1 (ko) * | 2008-03-25 | 2011-03-03 | 우리엘에스티 주식회사 | 발광소자 및 이의 제조방법 |
KR101136882B1 (ko) * | 2011-03-15 | 2012-04-20 | 광주과학기술원 | 질화물 반도체 기반의 태양전지 및 그 제조방법 |
RU2015132897A (ru) * | 2013-01-08 | 2017-02-14 | Конинклейке Филипс Н.В. | Светоизлучающее диодное устройство специальной формы для улучшенной эффективности испускания света |
TWI548113B (zh) * | 2014-03-11 | 2016-09-01 | 國立臺灣大學 | 半導體發光元件及其製造方法 |
US11271143B2 (en) * | 2019-01-29 | 2022-03-08 | Osram Opto Semiconductors Gmbh | μ-LED, μ-LED device, display and method for the same |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001284724A (ja) * | 2000-03-31 | 2001-10-12 | Seiko Epson Corp | 面発光型半導体レーザおよびその製造方法 |
JP2002100805A (ja) * | 2000-07-18 | 2002-04-05 | Sony Corp | 半導体発光素子および半導体発光素子の製造方法 |
JP2002261380A (ja) * | 2000-12-27 | 2002-09-13 | Furukawa Electric Co Ltd:The | 半導体装置およびその製造方法 |
JP2002313742A (ja) * | 2001-04-19 | 2002-10-25 | Sony Corp | 窒化物半導体の気相成長方法及び窒化物半導体素子 |
JP2004288799A (ja) * | 2003-03-20 | 2004-10-14 | Sony Corp | 半導体発光素子およびその製造方法、集積型半導体発光装置およびその製造方法、画像表示装置およびその製造方法ならびに照明装置およびその製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5418395A (en) * | 1992-04-07 | 1995-05-23 | Nippon Sheet Glass Co., Ltd. | Semiconductor light emitting device |
JP4083866B2 (ja) * | 1998-04-28 | 2008-04-30 | シャープ株式会社 | 半導体レーザ素子 |
JP3912117B2 (ja) * | 2002-01-17 | 2007-05-09 | ソニー株式会社 | 結晶成長方法、半導体発光素子及びその製造方法 |
JP3899936B2 (ja) | 2002-01-18 | 2007-03-28 | ソニー株式会社 | 半導体発光素子及びその製造方法 |
JP4123828B2 (ja) * | 2002-05-27 | 2008-07-23 | 豊田合成株式会社 | 半導体発光素子 |
JP3864222B2 (ja) * | 2002-09-26 | 2006-12-27 | 国立大学法人名古屋大学 | 半導体素子構造、電子エミッタ及び半導体素子構造の製造方法 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001284724A (ja) * | 2000-03-31 | 2001-10-12 | Seiko Epson Corp | 面発光型半導体レーザおよびその製造方法 |
JP2002100805A (ja) * | 2000-07-18 | 2002-04-05 | Sony Corp | 半導体発光素子および半導体発光素子の製造方法 |
JP2002261380A (ja) * | 2000-12-27 | 2002-09-13 | Furukawa Electric Co Ltd:The | 半導体装置およびその製造方法 |
JP2002313742A (ja) * | 2001-04-19 | 2002-10-25 | Sony Corp | 窒化物半導体の気相成長方法及び窒化物半導体素子 |
JP2004288799A (ja) * | 2003-03-20 | 2004-10-14 | Sony Corp | 半導体発光素子およびその製造方法、集積型半導体発光装置およびその製造方法、画像表示装置およびその製造方法ならびに照明装置およびその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014193069A1 (ko) * | 2013-05-28 | 2014-12-04 | 부경대학교 산학협력단 | 백색 led와 그 제조방법 |
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US20080035951A1 (en) | 2008-02-14 |
US8536026B2 (en) | 2013-09-17 |
JP4574648B2 (ja) | 2010-11-04 |
KR100826389B1 (ko) | 2008-05-02 |
DE102007027658A1 (de) | 2008-02-14 |
KR20080013636A (ko) | 2008-02-13 |
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