JP2008041910A - Wiring substrate and multicavity wiring substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring substrate or the like which has a heat radiator the side surface of which is reliably plated with a metal and has favorable positioning accuracy in junction between a main body of the substrate and the heat radiator. <P>SOLUTION: A wiring substrate 1a comprises a substrate main body 2 having a front surface 3 and a rear surface 4, and also having a through-hole 5 passed through the main body between the surfaces 3 and 4, and a heat radiator 10a having a column 11 and a base 17. The column 11 is inserted in the through-hole 5 of the substrate main body 2, and has an element mount a on an upper surface 12. The base 17 contacts with the rear surface 4 of the substrate main body 2 with an Ag brazing material (joining material) 20 provided therebetween. The side face 13 of the column 11 of the heat radiator 10a is spaced from the inner wall of the through-hole 5 of the substrate main body 2 to be wider than the inner wall on the side of the front surface 3 of the main body 2, and to be closer thereto on the side of the rear surface 4 of the main body 2. That is, a gap (s) is formed to be wider on the side of the front surface 3 of the main body 2, and to be narrower on the side of the rear surface 4 between the side face 13 of the column 11 of the heat radiator 10a and the inner wall of the through-hole 5 of the main body 2. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a wiring board comprising: a heat dissipating member for mounting an electronic component such as a light emitting element or an IC chip on an element mounting portion on the upper surface of a pillar portion; and a substrate body for inserting and fixing the pillar portion of the heat dissipating member. And a multi-cavity wiring board in which a plurality of such wiring boards are arranged.

  When the upper part of the metal heat dissipating member is inserted into the through hole of the package body made of ceramic and the package body and the heat dissipating member are fixed, the space between the upper part of the heat dissipating member and the inner surface of the through hole is An electronic component package has been proposed in which gaps of two sizes are formed to facilitate the circulation of the cleaning liquid and prevent the plating liquid from remaining (for example, see Patent Document 1).

Japanese Patent Laid-Open No. 10-29687 (pages 1 to 7, FIGS. 1 and 2)

  However, in the electronic component package, the lower step portion on the side surface of the heat radiating member and the inner side surface of the through hole are parallel to each other and a narrow gap is located on the entire circumference. , The circulation of the plating solution becomes insufficient. As a result, there is a problem that the side surface of the heat dissipation member may be discolored or corroded. Furthermore, there is a risk of causing a positioning error between the package body and the heat radiating member.

  The present invention solves the problems described in the background art, a wiring board in which metal plating is securely applied to the side surface of the heat dissipation member, and the bonding between the substrate body and the heat dissipation member is performed with high positioning accuracy, and It is an object to provide a multi-piece wiring board in which a plurality of such wiring boards are arranged.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-mentioned problems, the present invention has been conceived by forming a gap between the substrate main body and the pillar portion of the heat dissipation member so that the opening side is wide and the back side is narrow.
That is, the wiring board according to the present invention (Claim 1) includes a substrate body having a front surface, a back surface, and a through-hole penetrating between the front surface and the back surface, and a through-hole of the substrate body and the upper surface. And a heat radiating member comprising a base portion that is in contact with a back surface of the substrate main body or a concave groove opening in the back surface through a bonding material, and the side surface of the column portion of the heat radiating member is formed on the substrate. The front surface side of the substrate body is separated from the inner wall of the through hole of the main body and the back surface side of the substrate body is close to the inner wall of the through hole of the main body. Is characterized in that a gap is formed in which the front side of the substrate body is wide and the back side is narrow.

  According to this, the gap formed between the inner wall of the through hole of the substrate body and the side surface of the column portion of the heat dissipation member is wide on the front surface side and narrowed on the back surface side of the substrate body, After the bonding is performed via the bonding material, the plating solution is easily recirculated in the gap. For this reason, for example, the Au plating layer can be reliably formed with a required thickness on the side surface of the column portion of the heat dissipation member via the Ni plating layer, so that discoloration and corrosion of the heat dissipation member can be reliably prevented. . In addition, since the front surface side of the substrate body is wide and the back surface side is narrow, the column portion of the heat dissipation member can be easily inserted into the through hole of the substrate body, and the side surface and the base portion of the column portion of the heat dissipation member The substrate body and the heat dissipating member can be accurately positioned by the corner portion formed between the upper surface and the opening edge (corner portion) on the back surface side of the through hole of the substrate body. For this reason, even when the bonding material is heated (reflowed) and melted, it is possible to bond without deviation between the two.

The substrate body is made of an insulating material such as a high-temperature fired ceramic such as alumina, a low-temperature fired ceramic such as glass-ceramic, or an epoxy resin.
Further, the heat radiating member is made of Cu, Al having high thermal conductivity, or an alloy based on these, and has a form in which the column portion is erected from a central portion on the upper surface of the base portion.
Further, the bonding (adhering) between the substrate body and the heat radiating member is performed between the back surface of the substrate body and the upper surface of the base portion of the heat radiating member, or the ceiling surface of the concave groove opened on the back surface of the substrate body and the upper surface of the base portion. Or between the ceiling surface and side surface of the concave groove and the upper surface and side surface of the base portion, for example, by brazing.
In addition, for example, a light emitting element such as a light emitting diode element or an electronic component such as an IC chip is mounted on the element mounting portion located on the upper surface of the pillar portion of the heat radiating member, and the heat generated by these elements is transmitted through the heat radiating member. Heat dissipation to the outside.
Further, the gap is formed substantially uniformly along the entire circumference between the inner wall of the through hole of the substrate body and the side surface of the column portion of the heat radiating member.

According to the present invention, the side surface of the column portion of the heat dissipation member is a tapered surface or a curved surface whose width is narrowed in a side view from the base portion side toward the upper surface (Claim 2). Is also included.
According to this, the clearance gap formed between the inner wall of the through-hole of a board | substrate body and the side surface of the pillar part of a heat radiating member becomes large continuously on the surface side of a board | substrate body, and becomes narrow continuously toward the back surface side. For this reason, after joining the substrate body and the heat radiating member, the plating solution can be easily recirculated in the gap, and discoloration and corrosion of the heat radiating member can be more reliably prevented. In addition, the substrate body and the heat dissipation member can be joined with high positioning accuracy.
The column part of the heat radiating member has a substantially quadrangular pyramid shape and four side surfaces that are tapered surfaces or curved surfaces, as well as a substantially conical shape and the entire circumferential side surface is a tapered surface or curved surface. The form etc. which are are included.

Furthermore, the present invention includes a bonding material that joins the substrate body and the heat radiating member to the back surface side of the substrate body in the gap, and projects along the side surface of the column portion of the heat radiating member. A wiring board (claim 3) is also included.
According to this, since the clearance gap formed between the inner wall of the through-hole of a board | substrate body and the side surface of the pillar part of a heat radiating member becomes a form which has the rounded surface formed with a joining material in the back surface side of a board | substrate body. In this gap, the plating solution can be circulated more easily, and discoloration and corrosion of the heat dissipation member can be reliably prevented.
Note that the bonding material is, for example, Ag brazing, and is formed as a form (fillet) protruding along the side surface of the column portion due to wettability with respect to the side surface of the column portion in the heat radiating member. Also included is a form (fillet) that stands up and overhangs along the inner wall and has a recessed central part.

In addition, the present invention includes a product region in which a plurality of the wiring boards are arranged vertically and horizontally,
A multi-cavity wiring board (Claim 4) is also included, which is provided around the product region and includes ears made of the insulating material.
According to this, since the wiring board having the board body and the heat radiating member fixed with the gap interposed therebetween is a multi-piece wiring board having both vertical and horizontal plane directions, A large number of wiring boards can be provided efficiently by cutting along the planned cutting planes or slits that divide the gap and between the wiring boards and the ears. The ear portion includes a form adjacent to only one side or two sides around the product area.

In the following, the best mode for carrying out the present invention will be described.
1 is a plan view showing a wiring board 1a according to an embodiment of the present invention, FIG. 2 is a vertical sectional view taken along the line XX in FIG. 1, and FIG. 3 is a point in FIG. FIG. 4 is a perspective view of a heat dissipation member 10a used in the wiring board 1a.
As shown in FIGS. 1 and 2, the wiring board 1 a includes a substrate body 2 having a front surface 3, a back surface 4, and a through hole 5 penetrating between the center portions of the front surface 3 and the back surface 4, and the through hole 5. The base 11 is inserted into the base 11 and is connected to the lower side of the post 11 and has a base 17 that is brazed (joined) to the back surface 4 of the substrate body 2 via an Ag brazing (joining material) 20 described later. (Heat sink) 10a.
As shown in FIGS. 1 and 2, the substrate body 2 is formed by integrally laminating a plurality of ceramic layers (not shown) made of alumina (insulating material), for example, and has a substantially square shape in plan view. The through-hole 5 has a square shape in plan view and an inner wall that is a vertical surface.
A wiring layer having a predetermined pattern is formed between the ceramic layers. These wiring layers are electrically connected to each other through via conductors penetrating the ceramic layer, and are formed on the front surface 3 and the back surface 4 of the substrate body 2. The pad (not shown) is electrically connected. Such wiring layers, via conductors, and pads are made of W or Mo.

Further, the heat radiating member 10a is made of a Cu alloy, and as shown in FIGS. 1, 2, and 4, a substantially quadrangular pyramid-shaped column portion 11 having a top surface 12 and four side surfaces 13 that are square in plan view. The base portion 17 having a square shape in plan view connected to the lower side of each side surface 13 of the column portion 11 is formed. In addition, between each side surface 13 of the column part 11 and the upper surface 18 of the base part 17, the linear corner part 14 which these cross | intersect and form is located.
The upper surface 12 of the column part 11 has an element mounting part a having a square plan view as indicated by a dashed-dotted phantom line. Further, as shown in FIG. 4, the side surface 13 of the column portion 11 is a tapered surface whose width w becomes narrower in a side view from the base portion 17 side toward the upper surface 12. Further, the upper surface 12 and the side surface 13 of the column part 11 and the bottom surface 19 and the outer surface excluding the upper surface 18 of the base part 17 have a Ni plating layer having a thickness of about 1 to 20 μm and a thickness of about 0.1 to 6 μm. Au plating layers (both not shown) are respectively coated.

As shown in FIG. 2, between the side surface 13 of the column portion 11 of the heat radiating member 10a and the inner wall of the through hole 5 of the substrate body 2, the front surface 3 side of the substrate body 2 is wide and the back surface 4 (base portion 17) side is A gap s having a substantially triangular cross section that gradually narrows is formed along the entire circumference.
Incidentally, the width (distance) at the opening (upper end) of the gap s is about 30 μm to 200 μm, and the elevation angle (angle with respect to the horizontal plane) of the gap s is about 45 to 80 degrees.
As shown in FIGS. 1 and 2, when the heat radiation member 10 a is inserted into the through hole 5 of the substrate body 2, the corner portion 14 and the opening edge on the back surface 4 side of the through hole 5 (corner) Part) is positioned with respect to the substrate body 2. In this state, as shown in FIG. 3, by heating and melting Ag brazing 20 (bonding material) disposed in advance between the upper surface 18 of the base portion 17 and the back surface 4 of the substrate body 2, The substrate body 2 is brazed (joined) with high positioning accuracy.

The Ag row 20 projects so as to rise along the side surface 13 of the column part 11 and has a rounded surface (Ag row projecting part) 21, the outer surface of the base part 17, and the back surface 4 of the substrate body 2. And fillets 22 and 23 having a rounded surface. In the gap s, the fillet 21 having a rounded surface on the Ag solder 20 is located at the innermost part. For this reason, when performing electrolytic Ni plating and electrolytic Au plating on each side surface 13 of the column portion 11 of the heat radiation member 10a exposed after brazing, each plating solution is easily circulated.
Therefore, according to the wiring substrate 1a as described above, the substrate body 2 and the heat radiating member 10a are brazed (joined) with high accuracy, and the Ni and Au plating layers are surely provided on the side surface 13 of the heat radiating member 10a. Therefore, discoloration and corrosion can be prevented.
For example, when a light emitting diode element (hereinafter referred to as an LED) C is mounted on the element mounting portion a of the heat radiating member 10a via a solder such as an Au—Sn alloy, the LED: C is connected via a bonding wire. It is connected to the pad formed on the surface 3 of the substrate body 2 and is sealed with a sealing resin formed in a substantially hemispherical shape on the surface 3 in this state.

FIG. 5 is a vertical sectional view similar to FIG. 2 showing a wiring board 1b which is a modification of the wiring board 1a, and FIG. 6 is a partial sectional view enlarging a one-dot chain line portion Z in FIG.
As shown in FIG. 5, the wiring substrate 1 b includes a substrate body 2 having the same through-hole 5 and a column portion 11 inserted into the through-hole 5, and the upper surface 18 of the base portion 17 is connected to the back surface 4 of the substrate body 2. And a heat dissipating member 10b brazed (joined) via an Ag brazing (joining material) 20 to be described later.
The wiring board 1b is different from the wiring board 1a in that the side surface 15 of the column portion 11 of the heat radiating member 10b is a curved surface whose width w is narrowed from the base portion 17 side toward the upper surface 12 in side view. It is that you are. The upper surface 12 and each side surface 15 of the column part 11 and the bottom surface 19 and the outer surface excluding the upper surface 18 of the base part 17 are coated with the same Ni plating layer and Au plating layer, respectively.

As shown in FIG. 5, between the side surface 15 of the column portion 11 of the heat radiating member 10b and the inner wall of the through hole 5 of the substrate body 2, the front surface 3 side of the substrate body 2 is wide and the back surface 4 (base portion 17) side is A gap s having an elliptical shape of approximately a quarter of the entire cross section that is curved and narrowed is formed substantially uniformly along the entire circumference.
As shown in FIG. 5, when the column portion 11 of the heat radiating member 10 b is inserted into the through hole 5 of the substrate body 2, the substrate body is formed by the corner portion 14 and the opening edge (corner portion) on the back surface 4 side of the through hole 5. 2 and the heat radiating member 10b are positioned. In this state, as shown in FIG. 6, the substrate body 2 and the heat radiating member 10 b are positioned by heating the Ag solder 20 disposed in advance between the upper surface 18 of the base portion 17 and the back surface 4 of the substrate body 2. It is brazed with high accuracy.

As shown in FIG. 6, the Ag solder 20 has a fillet 21 that protrudes and rises along a side surface 15 that is a curved surface of the column portion 11 and has a rounded surface, and an outer surface of the base portion 17. Further, it has fillets (Ag wax projecting portions) 22 and 23 that project from the back surface 4 of the substrate body 2 and have a rounded surface.
Since the fillet 21 having a rounded surface on the Ag braze 20 is located at the innermost part, electrolytic Ni plating is applied to the gap s with respect to each side surface 15 of the column portion 11 of the heat radiation member 10b exposed after the brazing. In addition, when performing electrolytic Au plating, each plating solution is more easily circulated.
Therefore, even with the wiring board 1b as described above, the substrate body 2 and the heat radiating member 10b are brazed with high positioning accuracy, and the Ni and Au plating layers are also reliably formed on the side surface 15 of the heat radiating member 10a. Therefore, discoloration and corrosion can be prevented.

FIG. 7 is a vertical sectional view similar to FIGS. 2 and 5 showing a wiring board 1c having a different modification. As shown in FIG. 5, the wiring substrate 1 c includes a substrate body 2 having the same through-hole 5 and a column portion 11 inserted into the through-hole 5, and the upper surface 18 of the base portion 17 is connected to the back surface 4 of the substrate body 2. And a heat dissipating member 10c brazed via the same Ag brazing.
The wiring board 1c is different from the wiring board 1a in that the side surface 16 of the pillar portion 11 of the heat radiating member 10c has a lower tapered surface 16t whose width w is narrowed in a side view from the base portion 17 side toward the upper surface 12. The upper vertical surface (16). The upper surface 12 and the side surfaces 16 and 16t of the column portion 11 and the bottom surface 19 and the outer surface excluding the upper surface 18 of the base portion 17 are covered with the same Ni plating layer and Au plating layer, respectively.

As shown in FIG. 7, the front surface 3 side of the substrate body 2 is wide and the back surface 4 (base portion 17) between the side surfaces 16 and 16 t of the column portion 11 of the heat radiating member 10 c and the inner wall of the through hole 5 of the substrate body 2. The entire cross section whose side is narrower is formed with a half trapezoidal gap s along the entire circumference.
As shown in FIG. 7, when the column portion 11 of the heat radiating member 10 c is inserted into the through hole 5 of the substrate main body 2, the substrate main body 2 and the heat radiating member are formed by the entering corner 14 and the opening edge on the back surface 4 side of the through hole 5. Positioning with 10c is performed. In this state, similarly to the above, by heating the Ag brazing (not shown) arranged in advance between the upper surface 18 of the base portion 17 and the back surface 4 of the substrate body 2, the substrate body 2 and the heat radiating member 10c Is brazed with good positioning accuracy.

The Ag solder projects so as to rise along the side surface 16t, which is the tapered surface of the column part 11, and has a rounded surface fillet, and projects from the outer surface of the base part 17 and the back surface 4 of the substrate body 2, and the surface is curved. Has a face fillet. Since the fillet having a rounded surface in the Ag brazing is located at the innermost part, electrolytic Ni plating is applied to the gaps s on the side surfaces 16 and 16t of the column portion 11 of the heat radiation member 10c exposed after the brazing. In addition, when performing electrolytic Au plating, each plating solution is easily circulated.
Therefore, even with the wiring board 1c as described above, the substrate body 2 and the heat radiating member 10c are brazed with high positioning accuracy, and the Ni and Au plating layers are reliably formed on the side surfaces 16 and 16t of the heat radiating member 10c. Therefore, discoloration and corrosion can be prevented.

  FIG. 8 is a partial enlarged cross-sectional view of the wiring board 1a showing the vicinity of an Ag row 20a having a fillet 24 of a different form. In the same manner as described above, the heat radiating member 10a and the substrate body 2 are brazed with high positioning accuracy by heating and melting the Ag solder 20a disposed between the upper surface 18 of the base portion 17 and the back surface 4 of the substrate body 2 in advance. Is done. The Ag row 20a projects so as to rise along the side surface 13 of the column portion 11 and the inner wall of the through hole 5 of the substrate body 2, and has a fillet 24 having a rounded surface R and a substantially triangular cross section. It has fillets 22 and 23 that project from the outer side surface and the back surface 4 of the substrate body 2 and whose surface is a rounded surface. The fillet 24 can be formed by, for example, supplementing Ag solder from the gap s side.

As shown in FIG. 8, in the gap s between the side surface 13 of the heat radiating member 10 a and the inner wall of the through hole 5, the fillet 24 having a rounded surface R on the surface of the Ag solder 20 a is located at the innermost part. For this reason, when performing electrolytic Ni plating and electrolytic Au plating on each side surface 13 of the column portion 11 of the heat radiation member 10a exposed after the brazing, each plating solution is easily circulated through the entire gap s. ing.
Note that the Ag solder 20a including the fillet 24 having a rounded surface R and a substantially triangular cross section can be applied to the wiring boards 1b and 1c.

FIG. 9 is a vertical sectional view similar to FIG. 2 and the like showing a wiring board 1d having a substrate body 2a of a different form. The substrate body 2a includes a through hole 5 penetrating between the front surface 3 and the back surface 4, and a concave groove 6 communicating with the through hole 5 on the back surface 4 side and opening in the back surface 4 in a square view. ing.
As shown in FIG. 9, when the column portion 11 of the heat radiating member 10a is inserted into the through hole 5 of the substrate main body 2a, the substrate main body 2a and the heat radiating member are formed by the entrance corner 14 and the opening edge on the back surface 4 side of the through hole 5. Positioning with 10a is performed. At the same time, the base portion 17 of the heat radiating member 10a is inserted into the concave groove 6 of the substrate body 2a.

In this state, similarly to the above, by heating the same Ag solder previously disposed between the upper surface 18 and the outer surface of the base portion 17 and the ceiling surface and the side surface of the groove 6 in the substrate body 2a, 2a and the heat radiating member 10a are brazed with high positioning accuracy. At this time, in the gap s between the inner wall of the through hole 5 of the substrate main body 2a and the side surface 13 of the heat radiating member 10a, the fillet having a rounded surface is the innermost surface of the Ag brazing. When performing electrolytic Ni plating and electrolytic Au plating on each side surface 13 of the column portion 11 of the heat radiation member 10a exposed later, each plating solution is easily circulated.
In addition, instead of the substrate body 2, the substrate body 2 a having the through holes 5 and the recessed grooves 6 can be applied to the wiring boards 1 b and 1 c.

Here, a method of manufacturing the wiring board 1a will be described.
A ceramic slurry was prepared by mixing raw materials composed of alumina powder particles, a resin binder, a plasticizer, a solvent, and the like in advance. The ceramic blade was subjected to a doctor blade method to form a green sheet having a square shape in plan view and a rectangular shape in plan view for a plurality of large plates having different thicknesses.
Next, each green sheet was punched with punches and die receiving holes to form a plurality of through-holes having a square cross section.
Next, the required number of via holes are drilled around each through-hole in the green sheet for large plates in which the through-holes are formed, and a conductive paste containing W or Mo powder is filled therein. A via conductor was formed on each of them.

Further, conductive paste was screen-printed with a predetermined pattern on at least one of the front and back surfaces of each of the plurality of green sheets to form wiring layers and pads following the predetermined pattern.
A plurality of green sheets having the through-holes were laminated and pressure-bonded so that the through-holes communicated concentrically to form a green sheet laminate. The green sheet laminate was heated and fired at a predetermined temperature range.
As a result, a large ceramic laminate having a product region A composed of a plurality of sets of substrate bodies 2 composed of a plurality of ceramic layers and having the front surface 3, the back surface 4, and the through holes 5, and an ear portion m surrounding the periphery. The body was obtained.

On the other hand, a plate-shaped material made of a Cu alloy is pressed by a male / female die, whereby the base portion 17 having a square shape in plan view and the upper surface 12 having a square shape in plan view and an inclined upper surface 12 are formed. A plurality of heat dissipating members 10a each having a substantially quadrangular pyramidal column portion 11 having two side surfaces 13 are formed.
Next, the column portions 11 of the plurality of heat radiating members 10a in which a sheet of Ag solder 20 (not shown) is arranged on the upper surface 18 of the base portion 16 are inserted into the through holes 5 for each substrate body 2 in the product region A in the ceramic laminate. did. As a result, a gap s was formed between the inner wall of the through-hole 5 of each substrate body 2 and the side surface 13 of the column portion 11 of the heat radiating member 10a and the surface 3 side was wide and the back surface 4 side was narrow.
In this state, the Ag brazing 20 set on the upper surface 18 of the base portion 17 of each heat radiating member 10a is heated to about 700 to 900 ° C., and the Ag brazing 20 is melted, and each substrate body 2 and each heat radiating member 10a Were joined by brazing.

Further, Ni and Au electrolytic plating were sequentially applied to the upper surface 12 and the side surface 13 of the column portion 11 and the bottom surface 19 of the base portion 17 in the heat radiating member 10 a fixed to each substrate body 2. At this time, the plating solution for each electrolytic plating was sufficiently circulated through the gap s on each side surface 13 of the column portion 11 of each heat radiating member 10. The Au plating film could be reliably coated with the above thickness.
As a result, as shown in the plan view of FIG. 10 and the cross-sectional view of FIG. 11, a product region A in which a plurality of wiring boards 1a are arranged vertically and horizontally, and an ear m made of a ceramic layer around the product region A. A multi-piece wiring board K1 provided with In addition, as shown with the broken line in FIG. 10, 11, it divides between the adjacent wiring boards 1a and 1a and between the wiring board 1a and the ear | edge part m by the virtual cutting plan surface c.
FIG. 11 is a vertical sectional view taken along the line VV in FIG.

Then, the multi-cavity wiring board K1 is cut and divided in the thickness direction by a cutter (not shown) along the planned cutting surface c, thereby dividing the wiring board 1a shown in FIGS. Were obtained.
According to the method for manufacturing the wiring board 1a as described above, the positioning and brazing (joining) of the board body 2 and the heat dissipation member 10a in the planar direction are performed with high accuracy. Moreover, since the gap s is formed between the inner wall of the through-hole 5 and the side surface 13 of the column portion 11 of the heat radiating member 10a, the side surface 13 of the column portion 11 is also plated with Ni and Au via the gap s. The membrane is securely coated. Therefore, it was possible to reliably manufacture the wiring board 1a that has high dimensional accuracy and is difficult to corrode the heat radiating member 10a.

In addition, after mounting LED on the element mounting part a of the conductor part 10a in the obtained wiring board 1a and connecting the LED: C and the pad on the surface 3 of the board body 2 with bonding wires, A sealing resin before solidification is formed on the surface 3 so as to be wrapped.
Further, through the above-described steps, the wiring boards 1b and 1c were taken in large numbers to produce a wiring board, and then cut and divided in the same manner as described above, so that it could be easily produced.
Further, among the plurality of large plate green sheets, a relatively thick green sheet as a lowermost layer is formed with a through hole that is larger in length and breadth than the through hole, and then each step (printing, lamination, As shown in the vertical sectional view of FIG. 12, a product region A in which a plurality of wiring boards 1d are arranged vertically and horizontally and an ear portion made of a ceramic layer around the product region A and a multi-piece wiring board K2 provided with m. Then, by dividing the multi-piece wiring board K2 along the planned cutting surface c by cutting in the same manner as described above, the wiring board 1d provided with the board body 2a and the heat radiating member 10a shown in FIG. Were obtained.
At this time, by using the heat radiating members 10b and 10c instead of the heat radiating member 10a, it is possible to efficiently manufacture the wiring boards 1b and 1c shown in FIGS. .

The present invention is not limited to the embodiments described above.
The insulating material forming the substrate body may be a ceramic such as aluminum nitride or mullite, a glass-ceramic which is a kind of low-temperature fired ceramic, or various resins including epoxy.
Further, the substrate body is not limited to a flat surface, and may have a cavity opened on the surface, and the through hole may be formed between the bottom surface and the back surface of the cavity. When the LED (C) is mounted on the upper surface having the element mounting portion of the heat dissipating member that is substantially flush with the bottom surface of the cavity, the light is reflected to the side surface of the cavity and emitted to the outside. In this case, it is desirable that the side surface of the cavity has a substantially conical shape, a long conical shape, a long elliptical shape, or the like inclined so as to spread toward the surface side of the substrate body.

Further, the element mounted on the element mounting portion on the upper surface of the pillar portion of the heat radiating member includes an electronic component such as an IC chip.
Further, Ni, Au, and an Ag plating film may be sequentially coated on the side surface of the column portion and the side surface of the base portion of the heat dissipation member.
In addition, the multi-cavity wiring board is in a form as it is or divided into several parts, and LEDs are mounted on the element mounting portions of the respective conductors in each of the plurality of wiring boards, so that a relatively large light emitting device It is also possible to utilize it.

The top view which shows the wiring board which is 1 form of this invention. FIG. 2 is a vertical sectional view taken along line XX in FIG. 1. The expanded sectional view of the dashed-dotted line part Y in FIG. The perspective view which shows the heat radiating member used for the said wiring board. The vertical sectional view which shows the wiring board which is a deformation | transformation form of the said wiring board. The expanded sectional view of the dashed-dotted line part Z in FIG. The vertical sectional view which shows the wiring board of a different deformation | transformation form. The expanded sectional view which shows the vicinity of the brazing part of a different form. The vertical sectional view which shows the wiring board of a different form. The top view which shows the multi-piece wiring board which arranged the said wiring board in multiple numbers. FIG. 11 is a vertical sectional view taken along the line VV in FIG. 10. The vertical sectional view which shows the multi-piece wiring board of a different form.

Explanation of symbols

1a to 1d …………………………………… Wiring board 2, 2a …………………………………… Board body 3 ……………………………… …………… Front 4 …………………………………………… Back 5 …………………………………………… Through hole 6 ………… ………………………………… Concave groove 7, 27 …………………………………… Side 10a-10d …………………………… Heat dissipation member 11 ………………………………………… Pillar 12 ………………………………………… Top surface 13, 15, 16, 16t ……………… Side 17 ………………………………………… Base part 20, 20a ……………………………… Ag brazing (bonding material)
21, 23, 24 ………………………… Fillet (Ag wax overhang)
C ……………………………………………… Light-emitting diode element (light-emitting element)
a ……………………………………………… Element mounting part w …………………………………………… Width K1, K2 ………………… ……………… Manufacturing circuit board A …………………………………………… Product area m …………………………………………… Ear Part

Claims (4)

A substrate body having a front surface, a back surface, and a through-hole penetrating between the front surface and the back surface;
A heat dissipation member comprising a pillar portion inserted into the through hole of the substrate body and having an element mounting portion on the upper surface and a base portion contacting the back surface of the substrate body or a concave groove opening in the back surface via a bonding material,
The side surface of the column part of the heat radiating member is separated from the inner wall of the through hole of the substrate body, while the surface side of the substrate body is separated and the back side of the substrate body is approached,
Between the side surface of the column part of the heat radiating member and the inner wall of the through hole of the substrate body, a gap is formed where the front surface side of the substrate body is wide and the back surface side is narrow,
A wiring board characterized by that. The side surface of the column part of the heat dissipation member is a tapered surface or a curved surface whose width is narrowed in a side view from the base part side toward the upper surface.
The wiring board according to claim 1. On the back surface side of the substrate body in the gap, the substrate body and the heat radiating member are joined, and a bonding material that protrudes along the side surface of the column portion in the heat radiating member is provided.
The wiring board according to claim 1 or 2, wherein A product region in which a plurality of the wiring boards according to any one of claims 1 to 3 are arranged vertically and horizontally;
Located around the product area, and comprising ears made of the insulating material,
A multi-piece wiring board characterized by that.

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