JP2008022888A - Game machine and method of manufacturing control board thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To secure the escapement of air in a through-hole of a control board when applying solder in a molten state. <P>SOLUTION: The game machine comprises: the control board 100 where a control means for controlling the execution of a game is mounted; and a main body frame 12 provided with the control board 100 in the inside. The control board 100 comprises: a mounting surface 106 provided with mounting components as the control means; a solder surface 107 where the lead 109 of the mounting components provided on the mounting surface 106 is soldered; the through-hole 108 to which the lead 109 of the mounting component is inserted from the mounting surface 106 to the solder surface 107; and a spacer 3a provided on the mounting surface 106 for forming a clearance between the mounting component and the mounting surface 106 by being allowed to abut on the mounting component. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a game machine such as a pachinko machine and a method for manufacturing a control board thereof.

  Conventionally, a predetermined wiring pattern is formed on a control board used in a gaming machine such as a pachinko machine, and different types of electronic components are soldered at predetermined positions. A pin insertion type electronic component having a main body molded with resin and having a semiconductor element inside and a plurality of pins protruding from the main body is inserted into a through hole provided in the control board, and the control board It is mounted by applying a molten solder paste to the pin that penetrates the back side of the substrate. At this time, the mounting surface of the main body of the electronic component and the control board are in close contact with each other. Therefore, when molten solder is applied, there is no air escape in the through hole of the control board, and bubbles are generated in the solder. And soldering defects are likely to occur.

  In Patent Document 1, after solder paste on the control board is reflowed to form solder bumps, the conductive connection pins of the electronic components attached to the control board are brought into contact with the solder bumps, and then reflowed and attached. Bubbles formed in the paste can be extracted. However, in the case of soldering by inserting a conductive connection pin of an electronic component into the through hole of the control board and applying a molten solder paste to the through hole on the back side of the control board, reflow is repeated in this way. However, there is a problem that the method of extracting bubbles in the solder paste cannot be adopted.

JP 2001-223462 A

  Accordingly, an object of the present invention is to provide a game machine such as a pachinko that supplies an air escape space in a through hole of a control board when a molten solder is applied, and a method for manufacturing the control board.

Means and effects for solving the problems

  In order to achieve the above object, the present invention comprises a control board on which a control means for controlling the execution of a game is mounted, and a gaming machine frame provided with the control board inside, and the control board serves as a control means. A mounting surface on which the mounting component is provided, a solder surface to which the connection pin of the mounting component provided on the mounting surface is soldered, a through hole in which the connection pin of the mounting component is inserted from the mounting surface to the solder surface, and the mounting surface And a spacer that forms a gap between the mounting component and the mounting surface by contacting the mounting component.

  According to the above configuration, when the connection pins of the mounting component are soldered on the solder surface, if the air existing between the mounting surface and the mounting component is thermally expanded, the thermally expanded air is formed by the spacer. Escape from the gap between the mounted component and the mounting surface. Thereby, since the control board which can prevent the soldering failure by the expanded air flowing through a through hole can be provided, it becomes possible to obtain a highly reliable gaming machine.

  Moreover, the spacer in this invention may be formed with the ink printed by silk printing.

  According to said structure, since a spacer can be formed in a typical silk printing process as one process of the manufacturing process of a printed circuit board, the cost increase by the increase in a process can be prevented.

  Furthermore, the present invention provides a spacer on the mounting surface of the control board on which the mounting component is provided, forms a gap between the mounting component and the mounting surface by contact between the spacer and the mounting component, and then solders from the mounting surface. The mounting component is attached to the mounting surface by inserting the connecting pin of the mounting component through the through-hole penetrating the surface and soldering the connecting pin on the solder surface.

  According to the above method, when the air existing between the mounting surface and the mounting component is thermally expanded when the connecting pins of the mounting component are soldered on the solder surface, the thermally expanded air is formed by the spacer. Escape from the gap between the mounted component and the mounting surface. Thereby, the soldering defect by the expanded air flowing through a through hole can be prevented.

  Hereinafter, preferred embodiments of the present invention will be described. In the embodiments described below, a case where the present invention is applied to a first type pachinko gaming machine (also referred to as “digital pachi”) is shown as a preferred embodiment for a gaming machine according to the present invention.

(Control board)
First, the control board 100 mounted on the gaming machine of the present embodiment will be described. As shown in FIG. 6, the control board 100 is a flexible printed circuit board 101 (hereinafter referred to as FPC) on which surface mount components including an IC chip 102, a capacitor 103, a resistor 104, a connector 105, and the like are mounted. The FPC 101 is made of a flexible substrate made of a resin film such as polyimide having heat resistance and flexibility by a casting method, a plating method, a thermoplastic polyimide method, etc., and copper or a copper alloy provided so as to cover the surface thereof. And a conductor. The FPC 101 has a mounting surface 106 on which one of the components is mounted, and a solder surface 107 on which the wiring pattern is formed on the other surface. Note that the wiring pattern may be formed on both surfaces of the FPC 101.

  Further, a so-called through hole 108 (not shown in FIG. 6) is formed in the FPC 101. A lead 109, which is a connection pin of a surface mount component, is inserted into the through hole 108, the surface mount component is arranged on the FPC 101, and the lead 109 of the surface mount component and the FPC 101 are soldered by the solder surface 107, The surface mount component can be mounted on the FPC 101 by electrically connecting the lead 109 and the wiring pattern. Further, as will be described in detail later, in this embodiment, as shown in FIGS. 3 and 4, the spacer 3 a is silk-printed between the through holes 108 of the FPC 101, and between the surface-mounted component and the mounting surface 106, A gap is formed to allow air to escape to the outside. Thereby, poor soldering due to the expanded air flowing through the through hole 108 can be prevented. It is not necessary to silk print the spacer 3a between all the through holes 108 and 108.

(Spacer printing device)
Next, the spacer printing apparatus 1 will be described. FIG. 1 is a schematic view showing a part of the spacer printing apparatus 1. As shown in FIG. 1, the spacer printing apparatus 1 includes a scanning mechanism 2, a print head 3, a print control device 4, and an operation panel 5.

  The scanning device 2 has a print head 3 to be described later, and the print head 3 is parallel to the mounting surface 106 to be printed and has a distance that allows printing by ejecting silk printing ink 3b. Scan. The scanning device 2 is communicably connected to a scanning mechanism drive unit 41 of the print control device 4 described later, and moves the print head 3 to a designated position by receiving a position signal from the print control device 4.

  The print head 3 has an ink storage container (not shown) and stores silk printing ink 3b forming a spacer. Note that the print head 3 is communicably connected to a print head drive unit 42 of the print control device 4 to be described later. Upon receiving a command signal from the print control device 4, the ink 3b is ejected to form the spacer 3a. .

  The print control device 4 controls the scanning mechanism 2 and the print head 3 based on an input from the operation panel 5 and the like. The print control apparatus 4 includes a scanning mechanism drive unit 41, a print head drive unit 42, a calculation unit 43, a storage unit 44, and an input / output unit 45.

  The scanning mechanism drive unit 41 controls driving of the scanning mechanism 2. That is, based on the position signal from the scanning mechanism drive unit 41, the scanning mechanism 2 is scanned to a designated position. The scanning mechanism drive unit 41 is controlled by a calculation unit 43 described later, and controls the scanning mechanism 2 based on a spacer formation table.

  The print head drive unit 42 drives and controls the print head 3. That is, based on the command signal from the print head drive unit 42, the print head 3 is made to eject the ink 3b. The print head drive unit 42 is also controlled by the calculation unit 43 in the same manner as the scanning mechanism drive unit 41.

  The calculation unit 43 executes various programs such as a spacer formation routine stored in the storage unit 44, and controls the scanning mechanism drive unit 41 and the print head drive unit 42. The storage unit 44 stores various programs executed by the calculation unit 43 and various data tables such as a spacer formation table described later. The input / output unit 45 is connected to the operation panel 5 and converts the signal into a signal suitable for information processing.

  The operation panel 5 is a panel on which an operator operates, and has a key input unit 51 for inputting characters and numbers, a start button 52 for starting spacer printing, and a completion lamp 53 for notifying that spacer printing has been completed. is doing.

  In addition to the above, the spacer printing apparatus 1 detects the location of the through hole 108, a fixing mechanism that fixes the control board 100, a board type determination mechanism that acquires the board type from the fixed control board 100, and the like. It has a mechanism to do.

(Spacer printing device: Spacer forming table)
Here, with reference to FIG. 2, the spacer formation table memorize | stored in the memory | storage part 44 of the printing control apparatus 4 is demonstrated. The spacer formation table is selected in a spacer formation routine described later to form the spacer 3a.

  The spacer formation table has a base type column, a mounted component column, a through-hole position column, and a spacer determination column. The board type column stores the mounted component used by the board and the type of board depending on the position of the mounted component, and the mounted component column stores the used mounted part for each board type. The through hole position column stores the coordinates of the through hole 108 used by the lead 109 of the mounted component, and the spacer determination column indicates the thickness when forming the spacer 3a in the coordinates of the through hole 108 (0 Does not form).

(Mechanical structure of gaming machine)
Next, a gaming machine having the control board 100 will be described with reference to FIGS. FIG. 7 is a perspective view showing an overview of the pachinko gaming machine 10 in the present embodiment. FIG. 8 is a back view of the pachinko gaming machine 10 shown in FIG.

  As shown in FIG. 7, the pachinko gaming machine 10 includes a main body frame 12 having an opening on the front surface, various components disposed inside the main body frame 12, and a shaft that can be opened and closed in front of the main body frame 12. It is composed of a worn door 11. This door 11 is for closing an opening from the front, and a game is normally performed in the closed state. Further, on the front surface of the main body frame 12, an upper plate 13a, a lower plate 13b, and a firing handle 14 for storing game balls are arranged.

  A protective plate 19 having transparency is disposed on the door 11. The protection plate 19 is disposed so as to face the front surface of a game board (not shown) in a state where the door 11 is closed.

  The firing handle 14 is provided so as to be rotatable with respect to the main body frame 12. On the back side of the firing handle 14, a firing solenoid (not shown) as a driving device is provided. Further, a touch sensor (not shown) is provided on the peripheral edge of the firing handle 14. When the touch sensor is touched by the player, it is detected that the firing handle 14 is gripped by the player. When the firing handle 14 is gripped by the player and is rotated clockwise, power is supplied to the firing solenoid, and the game balls stored in the upper plate 13a are sequentially fired onto the game board. The game board is provided with a winning opening and the like, and a game is advanced by entering a game ball into the winning opening.

  In addition, an effect image related to the game is displayed on a liquid crystal display device (not shown) arranged behind the game board (on the back side). For example, for each of a plurality of symbol strings (three columns in the present embodiment), symbols (which are also identification information for production. For example, numbers from “0” to “9”) are displayed in a variable manner. The

  Further, as shown in FIG. 8, a prize ball tank 70 for temporarily storing game balls is provided on the back surface of the pachinko gaming machine 10, and the control board 100 described above is attached. The control board 100 includes, for example, an external connection terminal board 100A that electrically connects a prepaid card unit (not shown) that processes information related to the prepaid card outside the pachinko gaming machine 10 and the main body of the pachinko gaming machine 10, and a prize opening. It includes a CR prize ball payout control board 100B and the like on which a circuit that causes a predetermined number of prize balls to be paid out by a prize ball payout mechanism (not shown) according to the type of the winning ball is mounted.

(Control board manufacturing process)
Next, a manufacturing process of the control board 100 included in the gaming machine will be described. On the control board 100, a wiring pattern is printed on the FPC 101 and a through hole 108 is formed by an apparatus (not shown). Then, the FPC 101 is transported to the spacer printing apparatus 1 of FIG. 1, and after the spacer 3 a is formed on the FPC 101 by silk printing, the surface mount component is soldered to the FPC 101.

(Operation of the spacer printing apparatus 1)
Next, the operation of the spacer printing apparatus 1 will be described with reference to the flowchart of the spacer formation routine shown in FIG. First, when the control board 100 is fixed to the spacer printing apparatus 1 and the start button 52 of the operation panel 5 is pressed, the board type of the fixed control board 100 is acquired by a board type determination mechanism (not shown) (S1). ). The computing unit 43 refers to the spacer formation table and selects one of the mounted components used for the acquired board type (S2). Further, one of the coordinates of the through hole 108 through which the lead 109 of the mounting component selected from the spacer formation table is inserted is selected (S3), the corresponding spacer determination is obtained, and the through hole is an object for forming the spacer. It is determined whether there is (S4). When the object is a spacer (S4: YES), the coordinate information of the through hole and the thickness information of the spacer are temporarily stored in the storage unit 44 (S5). If it is not a spacer target (S4: NO), the process proceeds to S6. Then, it is determined whether the selection of the coordinates of all the through holes has been completed (S6). If the selection has not been completed (S6: NO), the processes from S3 to S5 are repeated. If the selection of all through-hole coordinates has been completed (S6: YES), the spacer formation position is specified from the all-through-hole coordinate information for the spacer used by the mounting component stored in the storage unit 44. (S7). Further, the spacer forming position and the printing thickness corresponding to the spacer forming position are stored in the storage unit 44 as silk printing information (S8). Then, it is determined whether selection of all mounted parts is completed (S9). If not completed (S9: NO), the processes from S2 to S8 are repeated. If selection of all the mounted components has been completed (S9: YES), all spacer formation position information for the board type and print thickness information corresponding to the spacer formation position are stored in the storage unit 44 as silk print information. Is done.

  Next, silk printing is started based on the silk printing information stored in the storage unit 44. The calculation unit 43 acquires one of the spacer formation positions from the silk print information in the storage unit 44 (S10), and transmits the acquired spacer formation position information to the scanning mechanism drive unit 41 (S11). The scanning mechanism drive unit 41 scans the scanning mechanism up to the received spacer formation position (S12). At this time, accurate scanning is performed by a mechanism for sensing the location of the through hole 108 (not shown). Further, the calculation unit 43 acquires the print thickness corresponding to the spacer formation position received from the silk print information in the storage unit 44 (S13), and transmits the acquired print thickness information to the print head drive unit 42 (S14). The print head drive unit 42 performs silk printing of the spacer 3a at the spacer formation position based on the received print thickness information (S15). Then, it is determined whether selection of all spacer formation positions is completed (S16). If not completed (S16: NO), the processes from S10 to S15 are repeated. When selection of all spacer formation positions has been completed (S16: YES), a completion signal is transmitted to the input / output unit, and the completion lamp 53 is turned on (S17).

(Outline of this embodiment)
As described above, the pachinko gaming machine 10 according to the present embodiment includes the control board 100 in which the control means for controlling the execution of the game is mounted, and the main body frame 12 in which the control board 100 is provided. A mounting surface 106 on which mounting components (IC chip 102 and capacitor 103, resistor 104, connector 105, etc.) as control means are provided, and a solder surface on which leads 109 of the mounting components provided on the mounting surface 106 are soldered 107, a through-hole 108 through which the lead 109 of the mounting component is inserted from the mounting surface 106 to the solder surface 107, and the mounting surface 106 are provided between the mounting component and the mounting surface 106 by contacting the mounting component 106. And a spacer 3a that forms a gap.

  In addition, in this embodiment, although demonstrated using the pachinko gaming machine 10 as an example of a gaming machine, it is not limited to this, For example, a pachislot machine and an amusement machine may be used.

  According to the above configuration, when the lead 109 of the mounting component (IC chip 102 and capacitor 103, resistor 104, connector 105, etc.) is soldered by the solder surface 107, it exists between the mounting surface 106 and the mounting component. When the air to be expanded is thermally expanded, the thermally expanded air escapes to the outside from the gap between the mounting component formed by the spacer 3 a and the mounting surface 106. As a result, it is possible to provide the control base 100 capable of preventing poor soldering due to the inflated air flowing through the through hole 108, so that it is possible to obtain a highly reliable pachinko gaming machine 10. Become.

  Further, the pachinko gaming machine 10 of the present embodiment is configured such that the spacer 3a is formed by ink 3b printed by silk printing.

  According to said structure, since the spacer 3a can be formed in the typical silk printing process as one process of the manufacturing process of a printed circuit board, the cost increase by the increase in a process can be prevented.

  Further, in the present embodiment, a spacer 3a is provided on the mounting surface 106 of the control board 100 on which mounting components (IC chip 102 and capacitor 103, resistor 104, connector 105, etc.) are provided, and the spacer 3a and the mounting component are matched. After forming a gap between the mounting component and the mounting surface 106 by contact, the lead 109 of the mounting component is inserted into the through hole 108 penetrating from the mounting surface 106 to the solder surface 107, and the lead 109 is connected to the solder surface 107. In this method, a mounting component is attached to the mounting surface 106 by soldering.

  According to the above method, when the lead 109 of the mounting component (IC chip 102 and capacitor 103, resistor 104, connector 105, etc.) is soldered by the solder surface 107, it exists between the mounting surface 106 and the mounting component. When the air to be expanded is thermally expanded, the thermally expanded air escapes to the outside from the gap between the mounting component formed by the spacer 3 a and the mounting surface 106. Thereby, poor soldering due to the expanded air flowing through the through hole 108 can be prevented.

(Modification)
Moreover, although this invention was demonstrated based on suitable embodiment, this invention can be changed in the range which does not exceed the meaning. That is, in the present embodiment, the process of forming the spacer as the spacer printing apparatus 1 is made independent. However, in the other silk printing process for the control board, for example, the process of silk printing the name and product number of the mounted component on the base The spacer may be formed at the same time. In this case, since the spacer can be formed without increasing the number of steps, an increase in cost can be prevented.

  In this embodiment, the spacer is determined for each through-hole used by the mounting component, and then the spacer position is specified, but the spacer position for each mounting component is stored in the spacer formation table in advance. It may be left.

  Although the present invention has been described in the preferred embodiments above, the present invention is not so limited. It will be understood that various other embodiments may be made without departing from the spirit and scope of the invention. Furthermore, in this embodiment, although the effect | action and effect by the structure of this invention are described, these effect | actions and effects are examples and do not limit this invention.

In this embodiment, the schematic which represents the spacer printing apparatus 1 which forms a spacer between a mounting component and a mounting surface in the mounting surface of a control board. The figure which shows a spacer formation table. The figure which showed before and after inserting the reel of a mounting component in the control board in which the spacer was formed. The figure which shows the flow of the air when the reel of a mounting component is inserted in the control board in which the spacer was formed, and was soldered. The figure which shows the flowchart of a spacer formation routine. The perspective view of a control board. The perspective view of a pachinko machine. The perspective view of the back surface of a pachinko gaming machine.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Spacer printing apparatus 3a Spacer 3b Ink 10 Pachinko machine 12 Main body frame 102 IC chip 103 Capacitor 104 Resistor 105 Connector 106 Mounting surface 107 Solder surface 108 Through hole 109 Lead

Claims (3)

A control board mounted with control means for controlling the execution of the game;
A gaming machine frame with a control board inside,
The control board has a mounting surface on which mounting parts as the control means are provided;
A solder surface on which the connection pins of the mounting component provided on the mounting surface are soldered;
A through hole through which the connection pin of the mounting component is inserted from the mounting surface to the solder surface;
A gaming machine comprising: a spacer provided on the mounting surface and forming a gap between the mounting component and the mounting surface by contacting the mounting component.   The gaming machine according to claim 1, wherein the spacer is formed of ink printed by silk printing. A spacer is provided on the mounting surface of the control board on which the mounting component is provided, and a gap is formed between the mounting component and the mounting surface by contact between the spacer and the mounting component. A control board manufacturing method comprising: mounting a mounting component on the mounting surface by inserting a connecting pin of the mounting component into a through-hole penetrating through and soldering the connecting pin on the solder surface.

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