JP6535941B2 - Gaming machine - Google Patents

Description

The present invention relates to Yu technique machine.

  The gaming machine is provided with various substrates such as a main circuit substrate and a peripheral control substrate. Among these substrates, there are those in which circular lands (conductor patterns) are provided in a region where components are soldered (see, for example, Patent Document 1).

JP, 2010-12058, A

  However, in the case of the above-mentioned substrate, when the flow type soldering is performed, there is a possibility that the breakage of the solder is bad and a short circuit may occur between adjacent pins.

Therefore, it is an object of the present invention is to solve is to provide a Yu technique machine that can prevent a short circuit caused by solder.

(1) substrate according to an embodiment of the present invention has been made to solve the problems described above, a gaming machine having a substrate which components are soldered, Keru Contact to the board the Conductor patterns (for example, lands 600A to 600D) are provided in a region to which components are soldered, and there are a plurality of moving directions of the substrate in soldering by the flow method, and the conductor patterns are in the moving direction of the plurality of substrates. Provided in a shape extending in the direction between (for example, 600D), the substrate is accommodated in a sealed substrate case, a surface ground for the surface is formed on the surface of the substrate, and the substrate is provided on the back surface of the substrate Is formed on the surface of the substrate where the solid surface for the back surface is formed and the information on the substrate is described in the region where the surface for the surface ground is not formed, A back surface information area in which information is written is provided in an area on the back surface of the substrate where the back surface solid ground is not formed, and the front surface solid ground is formed on the back surface of the back surface information area. The solid ground is formed on the back surface of the surface information area, and the surface information area and the back surface information area are provided so as not to overlap and be adjacent to each other in the positional relationship in the front and back direction.

  According to such a substrate, a short circuit due to solder can be prevented.

(2) In the substrate of (1),
There are multiple movement directions of the board during soldering by flow method,
The conductor pattern may be provided in a shape extending in a direction between a plurality of movement directions (for example, land 600D).

  According to such a substrate, it is possible to prevent a short circuit due to the solder corresponding to a plurality of moving directions of the substrate.

(3) In the substrate according to any one of the above (1) to (2),
A solid ground for the front surface (for example, solid ground for the front surface 500G) is formed on the front surface of the substrate, and a solid ground for the rear surface (for example, solid ground for the rear surface 501G) is formed on the back surface.
The surface includes an information describing area (for example, an information describing area 500S) in which information on a substrate is described,
The information describing area is provided in an area where the surface solid ground is not formed on the surface,
The back surface solid ground is formed on the back surface of the information described area.

  According to such a substrate, identification information on the substrate can be easily recognized.

(4) In the substrate of any one of (1) to (3) above,
Solid ground (for example, covered with a resist 53) on one surface (for example, the back surface of the main substrate 11 or solder surface) while having pin holes (for example, normal pin holes 51A, ground pin holes 51B, etc.) (For example, the main substrate 11, the effect control substrate 12, the voice control substrate 13, the lamp control substrate 14, the relay substrate 15, the power supply substrate, the payout control substrate, etc.)
The pin hole has a first pin hole (for example, a normal pin hole 51A or the like),
The first pin hole is in the vicinity of the first pin hole on the one surface (for example, in a range up to a distance 1 cm longer than the clinch length of the pin 54A). Clinching direction (for example, the direction (position) where the pin 54A is to be clinched) for clinching a pin inserted from another surface (for example, the surface or mounting surface of the main substrate 11) Etc. (eg, the first solid ground non-forming range 61 to the eighth solid ground non-forming range 68, the left direction range of the first normal pin hole 51A1 to the third normal pin hole 51A3, the fourth normal pin hole 51A4 In the rightward range of the sixth normal pin hole 51A6, the leftward range of the seventh normal pin hole 51A7, the eighth normal pin hole 51A8, etc.), there is a pin hole in which no solid ground is formed. And features.

  According to such a substrate, since the solid ground is not formed in the clinching direction of the pin in the vicinity of the pin hole, a short circuit between the electronic component and the ground can be suppressed.

(5) In the substrate of (4) above,
A second pin hole (for example, ground pin hole 51B or the like) in which a solid ground is formed in the range (for example, a range corresponding to the first solid ground non-formation range 61 to the eighth solid ground non-formation range 68) For example, a solid ground may be formed in the vicinity of the ground pin hole 51B.

  According to such a substrate, it is possible to limit the places where the solid ground is not formed only to the places necessary for clinching the pins, so it is possible to suppress the problem due to the area of the solid ground being reduced.

(6) In the substrate of (4) or (5) above,
A third pin hole (eg, ground pin hole 51B etc.) having no solid ground formed around the pin hole;
The range in which the solid ground is not formed around the third pin hole (for example, the annular solid ground non-forming range 71 etc.) is the range of the first pin hole (for example, the first solid ground non-forming range) For example, the area of the annular solid ground non-formation range 71 is smaller than the respective areas of the first solid ground non-formation range 61 to the eighth solid ground non-formation range 68. It may be made smaller than that).

  According to such a substrate, heat is less likely to be dissipated by the range in which the solid ground formed around the third pin hole is not formed, and soldering can be facilitated.

(7) In the substrate of any one of (4) to (6) above,
At least one of the second pin hole in which the solid ground is formed in the range and the third pin hole is a pin hole (e.g., a ground pin hole 51B etc.) into which the ground pin is inserted. You may

  According to such a substrate, since a short circuit between the ground pin and the solid ground does not cause a problem around the ground pin, it is possible to suppress a defect due to a reduction in the area of the solid ground.

(8) In the substrate of any one of (4) to (7) above,
The surface member (for example, the wiring pattern 52, the resist 53, and the pins) including the wiring (for example, the wiring pattern 52 or the like) and the resist (for example, the resist 53 or the like) Hole 51 etc) is provided,
The clinching direction of the pin divides the angle around the normal pin hole 51A into four in the front, rear, left, and right, for example, in the direction in which the density of the surface members (for example, the ratio of the surface member per unit area) is low. The density of the surface members may be compared in each direction within a predetermined distance from the pin hole 51A, and the density may be the lowest density, etc.).

  According to such a substrate, the work of providing a solid ground, in particular, the work of ground removal can be facilitated.

(9) In the substrate of any one of (4) to (8) above,
The portion where the solid ground is formed is distinguishable from the portion where the solid ground is not formed (for example, the printed board 50 is black, the wiring pattern 52 is yellowish green, the resist 53 is green, the solid ground is It may be red, etc.).

  According to such a substrate, it is possible to easily determine the portion where the solid ground is not formed.

(10) In the substrate according to any one of (4) to (9) above,
It may be a substrate on which a pin of an electronic component (for example, a resistor, a capacitor, a transistor, other components, etc.) is inserted into the pin hole and the electronic component is mounted.

  According to such a substrate, a short circuit between the electronic component and the ground can be suppressed.

(11) A game machine (for example, the game machine 1 or the like) including the substrate of any one of the above (1) to (10) may be used.

  According to such a gaming machine, a short circuit between the electronic component and the ground on the substrate can be suppressed.

It is a front view which illustrates a pachinko game machine by one mode of the present invention. It is a block diagram which illustrates the various control boards etc. which were carried in the pachinko game machine. It is an external view of the back side of a main board. FIG. 4 is an enlarged view of part A of FIG. 3; FIG. 4 is an enlarged view of a portion A of FIG. 3 in the main substrate on which the electronic component is mounted. It is an outline view of a substrate in a modification.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In this embodiment, after the gaming machine of the present invention is described, the structure of a substrate provided in the gaming machine will be described.
First, the layout of the main members of a pachinko gaming machine (game machine) will be described with reference to FIG. FIG. 1 is a front view illustrating a pachinko gaming machine according to an embodiment of the present invention.

  In FIG. 1, the gaming machine 1 includes a gaming board 2, a gaming machine frame 3, a first special symbol display device 4A, a second special symbol display device 4B, an image display device 5, an ordinary winning ball device 6A, an ordinary variable winning ball Device 6B, special variable winning ball device 7, speaker 8 (including speakers 8UL, 8UR, 8LL and 8LR), lamp 9 (including light emitting members 9CC, 9CL, 9CR, 9U, 9SL and 9SR), normal symbol display 20 , A first hold indicator 25A, a second hold indicator 25B, a general drawing reserve indicator 25C, a stick controller 31A, a push button 31B, and a passing gate 41.

In the game board 2, a substantially circular game area surrounded by guide rails is formed. In this game area, a game ball as a game medium is shot and shot from a predetermined ball striking device.
The first special symbol display device 4A and the second special symbol display device 4B variably display (variable display) special symbols (also referred to as "special figures") that are plural types of identification information that can identify each. The special view variably displayed in the first special symbol display device 4A is referred to as "first special view", and the special view variably displayed in the second special symbol display device 4B is referred to as "second special view".

  The image display device 5 forms a display area for displaying various images. In the display area of the image display device 5, decorative symbol display areas 5L, 5C, 5R, a first start winning storage display area 5HL and a second starting winning storage display area 5HR are arranged. The decorative symbol display areas 5L, 5C, and 5R variably display decorative symbols that are plural types of identification information that can identify each. The image display device 5 is a variable display game (first special view game) using the first special view executed by the first special symbol display device 4A, or the second special view executed by the second special symbol display device 4B. In the decorative symbol display areas 5L, 5C, and 5R, variable display of the decorative symbol is executed corresponding to the used variable display game (second special view game). The image display device 5 is configured of, for example, an LCD (Liquid Crystal Display Device) or the like.

  Further, in the display area of the image display device 5, a first start winning storage display area 5HL and a second start winning storage display area 5HR are arranged.

  The first starting winning a prize storage display area 5HL displays the first special view reserve storage number so as to be identifiable (first reserve display), similarly to the first reserve indicator 25A described later. The first special map reservation storage number is the storage number (the number of reservations) of the first special view reservation information. In the first special view reservation information, although the first starting condition is satisfied by the game ball winning in the first starting winning opening formed in the normal winning ball device 6A (first starting winning), the first starting winning concerned It is the information regarding the variable display corresponding to the said 1st start winning combination in which the 1st start conditions which accept | permit the start of the variable display game by are not satisfied. Therefore, each time the first start condition is satisfied, the first special map reservation information is stored (held) one by one, and the number of first special map storages is added one by one. Further, each time the first start condition is satisfied, the hold of the first special view hold information is erased (digested) one by one, and the number of first special view hold storages is decremented one by one.

  The second start winning storage display area 5HR displays the second special view reserve storage number in a specifiable manner (second reserve display), as in the second reserve display 25B described later. The second special map reservation storage number is the number of storages of the second special view reservation information (the number of reservations). The second special conditions reserve information is established that the second starting condition is satisfied by the game ball winning in the second starting winning opening formed in the normally variable winning ball device 6B (second starting winning), but the second starting condition It is the information regarding the variable display corresponding to the 2nd starting winning combination in which the 2nd start condition which permits the start of the variable display game by winning is not satisfied. Therefore, every time the second start condition is satisfied, the second special map hold information is stored (held) one by one, and the number of the second special map hold memories is added one by one. Further, each time the second start condition is satisfied, the hold of the second special view hold information is erased (digested) one by one, and the number of second special view hold memories is decremented one by one.

  Further, in the display area of the image display device 5, an active display area AHA for displaying an active display (also referred to as a display at the time of digestion, a display at this time, etc.) corresponding to the change is arranged.

The regular winning ball device 6A forms a first starting winning opening as a starting area (first starting area).
The normally variable winning ball device 6B includes an electric tulip type character (normal electric character) having a pair of movable wing pieces, and forms a second starting winning opening as a starting area (second starting area).

  The special variable winning prize ball device 7 includes, for example, a special winning opening door driven to open and close by a solenoid 82 for a special winning opening door shown in FIG. Change the state).

  The speaker 8 outputs an effect sound and a warning sound according to the state of the gaming machine 1. The lamp 9 performs a light emitting operation (lighting operation, blinking operation, extinguishing operation) according to the state of the gaming machine 1.

  The normal symbol display 20 variably displays an ordinary symbol (also referred to as a “common figure” or “ordinary drawing”) which is a plurality of types of identification information different from the special symbol. A variable display game using an ordinary symbol executed by the ordinary symbol display 20 is referred to as a common drawing game (or “ordinary drawing game”).

  The first hold indicator 25A displays the number of first special view hold memories in an identifiable manner. In addition, the second hold indicator 25B displays the second special view hold storage number in an identifiable manner.

  The common drawing hold display 25C displays the number of common drawing holding memories based on the holding data (general drawing hold information). The common drawing reserve memory number is the number of common drawing games that are not executed immediately but are suspended for execution when the gaming ball that has passed the passage gate 41 is detected.

  The stick controller 31A and the push button 31B are detection means for detecting an operation by the player, which is an example of the operation of the player. The stick controller 31A has an operating rod and a trigger button held by the player. The stick controller 31A detects the tilting operation of the operating rod by the player and the pushing and pulling operation of the trigger button. The push button 31B detects a pressing operation by the player.

Next, the hardware configuration of the gaming machine 1 will be described with reference to FIG. FIG. 2 is a configuration diagram illustrating various control boards and the like mounted on the game machine.
In FIG. 2, the gaming machine 1 has a main board 11, an effect control board 12, an audio control board 13, a lamp control board 14, and a relay board 15.

The main substrate 11 is a control substrate on the main side. The main board 11 mainly has a setting function of random numbers used in the special view game, acquisition of a signal from a switch or the like disposed at a predetermined position, transmission of a control command to a sub-side control board such as the effect control board 12 or the like. Output of various information to the management computer of the hole not shown in FIG. 2, the first special symbol display device 4A, the second special symbol display device 4B, and the variable display of predetermined identification information by turning on / off the normal symbol display 20 Control is performed, and display control of the first hold indicator 25A, the second hold indicator 25B, and the common view hold indicator 25C is performed.
The main substrate 11 has a game control microcomputer 100, a switch circuit 110, and a solenoid circuit 111.

  The game control microcomputer 100 controls the progress of the game in the gaming machine 1. The game control microcomputer 100 includes a ROM (Read Only Memory) 101 for storing game control programs and fixed data, a RAM (Random Access Memory) 102 for providing a work area for game control, and a program for game control. And a random number circuit 104 for updating numerical data representing a random number independently of the CPU 103, and an I / O (Input / Output port) 105.

  The switch circuit 110 mediates detection signals inputted from the gate switch 21, the first start opening switch 22 A, the second start opening switch 22 B, and the count switch 23 to the game control microcomputer 100.

  The gate switch 21 detects the gaming ball having passed through the passing gate 41 and outputs a detection signal. The first starting opening switch 22A detects the gaming ball having passed the first starting winning opening and outputs a detection signal. The second starting opening switch 22B detects the gaming ball having passed through the second starting winning opening and outputs a detection signal. Further, the count switch 23 detects the gaming ball that has passed through the opened special winning opening and outputs a detection signal.

  The solenoid circuit 111 outputs a solenoid drive signal acquired from the game control microcomputer 100 to the solenoid 81 for opening and closing the movable wing piece of the second start winning opening and the solenoid 82 for opening and closing the big winning opening door.

  The relay board 15 relays various control signals transmitted between the main board 11 and the effect control board 12.

  The effect control board 12 is a sub-side control board that is independent of the main board 11 and performs control (effect control) of effects to be executed in the gaming machine 1. The effect control board 12 performs a control operation according to a program, a effect control CPU 120, a ROM 121 for storing effect control programs and fixed data, a RAM 122 for providing a work area for the effect control CPU 120, and a display of the image display device 5. It has a display control unit 123 to control, a random number circuit 124 for updating numerical data indicating a random number independently of the CPU 120 for effect control, and an I / O 125.

  The display control unit 123 receives an instruction from the effect control CPU 120, reads out image data to be displayed on the image display device 5 from an image data memory such as a CGROM (Character Generator ROM), and develops it in a VRAM (Video RAM). Temporarily memorize. Further, the display control unit 123 enlarges, reduces, or rotates an image displayed on the image display device 5 (rotation on the parallel surface of the display screen of the image display device 5, rotation of the display screen in the depth direction, etc.) (Such as repeating normal rotation and reverse rotation on the parallel surface of the display screen of the image display 5, repeating normal rotation and reverse rotation in the depth direction of the display screen, etc.), bending (folding an image at a predetermined position), etc. May be processed. For example, a VDP (Video Display Processor) can be used as the display control unit 123.

The image display device 5 displays various images based on the image data output from the effect control board 12. The image data output from the effect control board 12 may be display-controlled by the display control unit 123.
The voice control board 13 receives a command from the effect control CPU 120 and controls voice data to be output to the speaker 8. The voice control board 13 may read voice data from a voice data ROM or the like, expand it on a voice RAM or the like, and temporarily store the voice data.
The lamp control board 14 controls the display of the lamp 9 in response to an instruction from the effect control CPU 120. The image display device 5, the speaker 8, the lamp 9, and the like are effect devices that receive an instruction from the effect control CPU 120 and execute effects. The effect device may include a movable character or the like (not shown).

  The controller sensor unit 35A outputs the player's operation on the stick controller 31A detected by the stick controller 31A to the effect control board 12 as an information signal (operation detection signal) indicating that the operation has been detected. For example, the controller sensor unit 35A detects the tilt direction and tilt angle by the tilt operation of the operating stick of the stick controller 31A by the player, and outputs an information signal indicating the detected tilt direction and tilt angle to the effect control board 12 . Further, the controller sensor unit 35A detects the pushing operation of the trigger button by the player detected by the stick controller 31A, and outputs an information signal indicating the detected pushing operation to the effect control board 12. The controller sensor unit 35A may be integrally formed with the stick controller 31A.

  The push sensor 35B outputs the player's operation on the push button 31B detected by the push button 31B to the effect control board 12 as an information signal (operation detection signal) indicating that the operation has been detected. The push sensor 35B may be integrally formed with the push button 31B.

  Next, the structure of the substrate provided in the gaming machine 1 of the present invention will be described. Here, an example of the structure of the main substrate 11 will be described. In the following description, the surface of the main substrate 11 on which the electronic component is mounted is referred to as the “surface”. The surface on the back side where the electronic component is not mounted is referred to as the "back side". Further, an electronic component is mounted on the front surface of the main substrate 11, and on the back surface of the main substrate 11, an electronic component is not mounted, but a pin provided in the electronic component is soldered. Therefore, the surface of the main substrate 11 is also referred to as a "component surface", and the back surface of the main substrate 11 is also referred to as a "solder surface".

  FIG. 3 is an external view of the back surface of the main substrate. FIG. 4 is an enlarged view of a portion A of FIG. FIG. 5 is an enlarged view of a portion A of FIG. 3 in the main substrate on which the electronic component is mounted. As shown in FIG. 3, the main board 11 includes a printed board 50. The printed board 50 is made of an insulator. Further, as shown in FIGS. 3 and 4, the main board 11 has a plurality of pin holes (through holes) 51 formed in the printed board 50. The pin holes 51 are formed through the front and back surfaces of the printed board 50.

  On the back surface side of the main substrate 11, a wiring pattern 52 made of a conductor is formed. The wiring pattern 52 is disposed at a position where the pin holes 51 are appropriately connected. A plurality of wiring patterns 52 are wired on the back side of the main substrate 11. Furthermore, a resist 53 made of an insulator is formed on the back surface side of the main substrate 11 at a position avoiding the pin holes 51 and the wiring pattern 52. The resist 53 is formed to cover a wide range on the back surface of the printed board 50. Further, both the pin hole 51 and the resist 53 and the wiring pattern 52 and the resist 53 are separated from each other. Therefore, neither the pin hole 51 and the resist 53 nor the wiring pattern 52 and the resist 53 are in contact with each other.

  A solid ground (not shown) is formed on the back surface of the main substrate 11. The resist 53 is formed on the back surface side of the main substrate 11 so as to cover the entire surface of the solid ground. The surface of the solid surface is protected by the resist 53. In addition, the resist 53 is formed to cover the entire surface of the solid ground, so that the solid ground has a structure in which there is almost no exposed portion on the back surface side of the main substrate 11. The solid ground is a ground formed over the entire surface or almost the entire surface of the main substrate 11. The solid ground is formed, for example, by removing the ground. As a procedure for forming a solid, first, a solid material is applied to the entire surface of the back surface of the main substrate 11, and the applied solid material is removed from the area where solid is not formed. Ground removal is an operation to remove the material of the beta ground at this time. Betaground may be formed by other procedures.

  On the back side of the main substrate 11, the solid ground is entirely covered with a resist 53. Therefore, the solid ground is not formed in the range other than the range covered by the resist 53. In other words, the whole of the resist 53 covers the solid ground, and the range in which the resist 53 is formed matches the range in which the solid ground is formed. However, the whole of the resist 53 does not cover solid ground, and the range of the resist 53 may be wider than the solid ground range. In the following description, a range in which the solid ground is not formed is referred to as a solid non-formation range.

  As shown in FIG. 4, the main substrate 11 has normal pin holes 51A (first normal pin holes 51A1 to eighth normal pin holes 51A8) and ground pin holes 51B as the plurality of pin holes 51. As shown in FIG. 5, the pins 54A (first pin 54A1 to eighth pin 54A8) of the electronic component are respectively inserted into the normal pin holes 51A. The pins 54A inserted into the normal pin holes 51A are clinched on the back side of the main substrate 11, respectively. By clinching the pins 54A on the back surface side of the main substrate 11, it is usually prevented that the pins 54A come out of the pin holes 51A and the electronic components are detached from the main substrate 11. The electronic components include electronic components used for ordinary substrates such as resistors, capacitors, transistors and other components.

  The ground pin hole 51B is a pin hole into which a ground pin (not shown) connected to a solid ground is inserted. Four lands 55 are provided around the ground pin hole 51B. The main substrate 11 has a plurality of ground pin holes 51B. In the main substrate 11, the ground pin holes 51B are also provided at positions other than the positions shown in FIG.

  Further, the normal pin holes 51A are all in the vicinity of the normal pin holes 51A on the back surface of the main substrate 11, and in the clinch direction in which the pins 54A inserted from the surface of the main substrate 11 into the normal pin holes 51A are clinched. Is a pin hole in which a solid ground is not formed. The vicinity of the normal pin hole 51A is determined according to the clinch length when the pin 54A inserted into the normal pin hole 51A is clinched. For example, the vicinity of the normal pin hole 51A can be in the range of 1 cm longer than the maximum clinch length of the pin 54A. The maximum clinch length here is, for example, the longest length among the lengths that can be the length from the position where the pin 54A intersects the pin hole 51A normally to the tip of the pin 54A. Further, the range in the vicinity of the normal pin hole 51A may be determined without considering the clinch length of the pin 54A. Alternatively, in the vicinity of the pin hole 51A, the length may be longer than the clinch length of the pin 54A to a long distance other than 1 cm. Usually, the vicinity of the pin hole 51A may be a range not including the position of a distance longer than the maximum clinch length of the pin 54A. However, it is preferable that the vicinity of the pin hole 51A is generally in a range including a position at a distance longer than the maximum clinch length of the pin 54A.

  The clinching direction of the pin 54A refers to a direction of a range in which the predetermined angle α (see FIG. 5) is taken as a ± predetermined angle with respect to the direction in which the pin 54A is clinched. For example, the predetermined angle can be arbitrarily set from an angle in a range of, for example, 5 °, 10 °, 15 °, or more that is greater than 0 ° and 45 ° or less. As described above, the area in the clinching direction in the vicinity of the normal pin hole 51A in the present embodiment and in which the pin 54A inserted into the normal pin hole 51A is clinched is fan-shaped. The predetermined position (the central position related to the predetermined angle) is, for example, the pin 54A in the printed board 50 before the pin 54A is inserted and the pin 54A is clinched among the positions which are the end of the normal pin hole 51A. This is a position that intersects with the direction to be inserted and clinched (usually one position that is the end on the clinch side of the pin hole 51A). However, the predetermined position (the central position related to the predetermined angle) may not be one position which is the end of the pin hole 51A on the clinch side. For example, the predetermined position (the center position of the predetermined angle) may be the center position of the circle of the opening of the normal pin hole 51A, or one position that is the end of the normal pin hole 51A on the clinch side; It may be one position on a line connecting the center of the circle of the opening of the normal pin hole 51A. The pin 54A is normally clinched in the direction to be clinched in the pin hole 51A.

  First solid ground non-forming area 61 including the whole sector in the clinching direction which is adjacent to normal pin hole 51A and clinchs pin 54A inserted in normal pin hole 51A around normal pin hole 51A An eighth solid ground non-forming range 68 is provided. In the first solid ground non-forming range 61 to the eighth solid ground non-forming range 68 around the normal pin hole 51A, the area in the clinch direction of the pin 54A inserted into the normal pin hole 51A is larger than the area in the other direction It has a wide oval shape. Further, the first solid ground non-forming range 61 to the eighth solid ground non-forming range 68 in the clinching direction of the pin 54A are formed to such a range that the tip of the clinched pin 54A can not reach. The shapes of the first solid ground non-forming range 61 to the eighth solid ground non-forming range 68 may be shapes other than an oval. For example, the shapes of the first solid ground non-forming range 61 to the eighth solid ground non-forming range 68 may be elliptical or rectangular such as rectangular or square. The first solid ground non-forming range 61 to the eighth solid ground non-forming range 68 may have other shapes.

The clinching direction of the pin 54A is usually predetermined before the pin 54A is inserted into the pin hole 51A. Specifically, in the example shown in FIG. 4, the clinching direction of the first pin 54A1 to the third pin 54A3 in the first normal pin hole 51A1 to the third normal pin hole 51A3 arranged on the left side of the drawing is the left direction. The first solid ground unformed range 61 to third solid ground non-formation range 63 around the first normal pin hole 51A1~ third normal pin holes 51A3 is the first normal pin hole 51A 1 ~ third normal pin holes 51A3 a first normal pin hole 51A 1 ~ third left direction normal pin holes 51A3 in the vicinity.

  The clinching direction of the fourth pin 54A4 to the sixth pin 54A6 in the fourth normal pin hole 51A4 to the sixth normal pin hole 51A6 arranged at the center of the drawing is the right direction. The fourth solid ground non-forming range 64 to the sixth solid ground non-forming range 66 around the fourth normal pin hole 51A4 to the sixth normal pin hole 51A6 are in the vicinity of the fourth normal pin hole 51A4 to the sixth normal pin hole 51A6 In the right direction of the fourth normal pin hole 51A4 to the sixth normal pin hole 51A6.

  The clinching direction of the seventh pin 54A7 and the eighth pin 54A8 in the seventh normal pin hole 51A7 and the eighth normal pin hole 51A8 arranged on the right side of the drawing is the left direction. The seventh solid pin non-forming range 67 and the eighth solid ground non-forming range 68 around the seventh normal pin hole 51A7 and the eighth normal pin hole 51A8 are in the vicinity of the seventh normal pin hole 51A7 and the eighth normal pin hole 51A8 In the left direction of the seventh normal pin hole 51A7 and the eighth normal pin hole 51A8.

  The clinching directions of these pins 54A are all set in the direction in which the density of the surface members is the lowest. Here, the surface member includes the wiring pattern 52 provided on the surface of the printed board 50, the resist 53, and the other pin holes 51 adjacent or close to the normal pin holes 51A. Moreover, the density of the surface member means the ratio occupied by the surface member per unit area.

  In the direction of low density, the angle around the pin hole 51A is usually divided into four in the front, back, left, and right, and the density of surface members in each direction within a predetermined distance from the pin hole 51A is compared. Set to The predetermined distance is determined in consideration of the clinch length of the pin 54A. For example, the distance may be 2 cm longer than the clinch length of the pin 54A. Further, the predetermined distance may be determined without considering the clinch length of the pin 54A, or the length longer than the clinch length of the pin 54A may be a length other than 2 cm. However, it is preferable that the predetermined distance be longer than the clinch length of the pin 54A.

  The low density direction is determined in comparison with other directions. For example, in the case of the first normal pin hole 51A1, the wiring pattern 52 is formed in the upper direction and the right direction of FIG. 4, and the second normal pin hole 51A2 is formed in the lower direction. Further, no surface member is formed in the right direction of the first normal pin hole 51A1. Therefore, the rightward direction of the first normal pin hole 51A1 is a direction in which the density of the surface members is low.

  In setting the direction in which the density is low, the angle around the pin hole 51A is usually divided into four in the front, rear, left, and right, and one of the directions is the direction in which the density is low. However, the density can also be determined by dividing the circumference of the pin hole 51A into two or eight. Alternatively, the density may be set by dividing by another number.

  Further, the clinching direction of the pins 54A may be set in the direction in which the density of the surface members is the lowest, or in the direction in which the density is relatively low. In the direction in which the density is relatively low, in addition to the direction in which the density is lowest, there is the direction in which the density is the second lowest and the direction in which the density is the third lowest. The point is that the direction in which the density is relatively low is any direction other than the direction in which the density is the highest.

  Around the ground pin hole 51B, a solid ground is formed in a range corresponding to a first solid ground non-forming range 61 to an eighth solid ground non-forming range 68 which are usually formed around the pin hole 51A. The ground pin holes 51B are pin holes in which a solid ground is formed in a range corresponding to the first solid ground non-formation range 61 to the eighth solid ground non-formation range 68 which are usually formed around the pin holes 51A.

  However, the annular solid ground non-formation range 71 is provided around the ground pin hole 51B. The annular solid ground non-forming area 71 around the ground pin hole 51B has a shape in which a thickness range is added to a quadrant and arranged in an arc. The thick-walled portions of these quadrants are separated from each other and disposed between adjacent lands 55. The area of the annular solid ground non-forming range 71 is the first solid ground non-forming range 61 to 1st formed around the first pin 54A1 to the eighth pin 54A8 in the first normal pin hole 51A1 to the eighth normal pin hole 51A8. The area is made smaller than the area of each of the eight solid ground non-forming areas 68.

  The printed board 50, the wiring pattern 52, the resist 53, and the solid ground all have different colors. For example, the printed board 50 is black, the wiring pattern 52 is yellowish green, the resist 53 is green, and the solid ground is red. The pin holes 51 are formed through the printed board 50 and are black. As described above, the printed board 50, the wiring pattern 52, the resist 53, and the solid ground all have mutually different colors, so that the portion where the solid ground is formed is a portion where the solid ground is not formed. It is supposed to be identifiable.

  The first normal solder portion 91 to the normal eighth solder portion 98 are provided at positions corresponding to the normal pin holes 51A. The normal side first solder portion 91 to the normal side eighth solder portion 98 are normally soldered between the pin hole 51A and the pin 54A after the pin 54A is inserted into the pin hole 51A and clinched. It is formed by The normal side first solder portion 91 to the normal side eighth solder portion 98 formed by soldering are formed extending from the back surface of the main substrate 11 to the inside of the normal pin holes 51A. The normal side first solder portion 91 to the normal side eighth solder portion 98 are in contact with the pins 54A provided in the normal pin holes 51A and the wiring pattern 52 provided on the back surface of the main substrate 11. The normal side first solder portion 91 to the normal side eighth solder portion 98 allow the pin 54A and the wiring pattern 52 to be energized.

  A ground pin side solder portion 99 is provided at a position corresponding to the ground pin hole 51B. The ground pin side solder portion 99 is formed by soldering between the solid ground and the ground pin after the ground pin is inserted into the ground pin hole 51B. The ground pin side solder portion 99 is provided from the inside of the ground pin hole 51B to the back surface of the main substrate 11, and contacts the solid ground covered with the resist 53 and the ground pin inside the ground pin hole 51B. . The ground pin side solder portion 99 allows the solid ground and the ground pin to be energized. The ground pins are electrically connected to the electronic components on the surface of the main substrate 11.

  The ground pins are accommodated in the ground pin holes 51 B and do not protrude from the back surface side of the main substrate 11. However, although the ground pin protrudes from the back surface side of the main substrate 11, the protruding portion of the ground pin may be included in the ground pin side solder portion 99. Further, although the ground pin protrudes from the back surface side of the main substrate 11 and also protrudes from the ground pin side solder portion 99, the protruding amount may be small and the ground pin may not be clinched.

  Next, the operation and effect of the main substrate 11 according to the present embodiment will be described. In the main substrate 11 according to the present embodiment. The normal pin hole 51A is a pin hole in which a solid ground is not formed in the vicinity of the normal pin hole 51A and in the range of the clinch direction of the pin 54A inserted into the normal pin hole 51A. For this reason, the pin 54A inserted and clinched into the normal pin hole 51A is prevented from reaching the portion of the resist 53 which covers the solid ground. Therefore, it is possible to suppress damage to the resist 53 covering the solid ground by the pin tip of the clinched pin 54A. Therefore, a short circuit between the electronic component and the solid ground due to the conduction between the pin 54A and the solid ground due to the damage of the resist 53 can be suppressed.

  In the main substrate 11 according to the present embodiment, the solid ground non-forming range is usually limited to the clinching direction of the pin 54A inserted into the pin hole 51A around the pin hole 51A. The direction other than the clinching direction of the pin 54A inserted into the normal pin hole 51A is a region where the risk of damaging the resist 53 at the pin tip of the pin 54A is small, and the region where the necessity for forming a solid ground is low is low. . Therefore, it is possible not to extend the beta ground non-formation range to a region where the need for reducing the beta ground area is low.

  In the present embodiment, in the main substrate 11, a range corresponding to the first solid ground non-forming range 61 to the eighth solid ground non-forming range 68, which is usually formed around the pin hole 51A, around the ground pin hole 51B. , Beta ground is formed. The ground pins inserted into the ground pin holes 51 </ b> B are configured not to protrude to the back surface side of the main substrate 11. For this reason, the ground pin inserted in the ground pin hole 51B does not damage the resist 53 around the ground pin hole 51B. Therefore, the area around the ground pin hole 51B is a low area where it is not necessary to reduce the area of the solid ground, so the solid ground non-formation range is not extended to a area where the need to reduce the area of the solid ground is low. be able to.

  In the main substrate 11 according to the present embodiment, the annular solid ground non-formation range 71 is provided around the ground pin hole 51B. By providing the annular solid ground non-formation range 71, the soldering in the ground pin hole 51B can be favorably performed when the soldering is performed. The area of the annular solid ground non-forming range 71 is the first solid ground non-forming range 61 to 1st formed around the first pin 54A1 to the eighth pin 54A8 in the first normal pin hole 51A1 to the eighth normal pin hole 51A8. The area is made smaller than the area of each of the eight solid ground non-forming areas 68. For this reason, since it becomes difficult to escape the heat at the time of performing soldering in grand pin hole 51B, soldering in grand pin hole 51B can be performed satisfactorily. Furthermore, it is possible to narrow the area in which beta ground is not formed in the area where the need for reducing the area of beta ground is low.

  The ground pin inserted into the ground pin hole 51B is a pin connected to a solid ground. Therefore, a short circuit between the ground pin and the solid ground does not cause a problem. Therefore, by providing the solid ground around the ground pin hole 51B, it is possible to prevent the solid ground non-formation range from being extended to a region where the necessity for reducing the area of the solid ground is low.

  In addition, since a short circuit between the ground pin and the solid ground does not cause a problem, even when the ground pin inserted into the ground pin hole 51B is clinched on the back surface side of the main substrate 11, the periphery of the ground pin hole 51B is A beta ground may be provided. In this case, it is possible to prevent the area of non-solid ground formation from being extended to a region where the need to reduce the area of solid ground is low.

  Furthermore, the pin 54A may be accommodated in the pin hole 51A normally, and may not protrude from the back surface side of the main substrate 11. Further, although the pin 54A protrudes from the back surface side of the main substrate 11, the protruding portion of the pin 54A may be included in the normal first solder portion 91 to the normal eighth solder portion 98. Also, although the pin 54A protrudes from the back surface side of the main substrate 11 and also protrudes from the normal side first solder portion 91 to the normal side eighth solder portion 98, the amount of projection is small and the pin 54A is not clinched You may do so. In these cases, the area around the pin hole 51A is usually an area where the risk of damaging the resist 53 is small at the pin tip of the pin 54A, and the area where the need for a solid ground non-forming area is low is low. Therefore, in this case, a solid ground may be generally provided around the pin holes 51A. In this case, it is possible not to extend the beta ground non-formation range to a region where it is less necessary to reduce the beta ground area.

  In the main substrate 11 according to the above embodiment, the clinching direction of the pins 54A is a direction in which the density of the surface members is low. For this reason, since the surface member in the solid ground non-formation range decreases, when the ground cutting operation is performed when providing the solid ground, the ground cutting operation can be facilitated. Further, even if the solid ground non-forming range is provided, the ratio of the solid ground non-forming range on the main substrate 11 and the area on which the surface members are provided can be equalized. Therefore, the solid ground non-formation range and the surface member can be provided by effectively utilizing the back surface of the main substrate 11.

  In the main substrate 11 according to the above-described embodiment, the printed board 50, the wiring pattern 52, the resist 53, and the solid ground all have mutually different colors, so that the portion where the solid ground is formed is a solid ground. Is made distinguishable from the part which is not formed. For this reason, the part in which the solid ground is not formed can be discriminate | determined easily.

  In addition, the aspect in which the portion in which the beta ground is formed can be distinguished from the portion in which the beta ground is not formed may be another aspect. For example, only the printed board 50 and the resist 53 may have different colors. Further, as long as the colors of the printed board 50 and the resist 53 are different, any color arrangement of other materials may be used. When the resist 53 has a region not covering the solid ground, the color may be changed between the portion covering the solid ground and the portion not covering the solid ground. Further, the aspect in which the portion where the solid ground is formed can be distinguished from the portion where the solid ground is not formed may be an aspect other than changing the color of each member. For example, the outer frame of the area where the solid ground is formed may be illustrated by a line.

  The area where the beta ground is formed may be three-dimensionally distinguished. For example, the area where the solid ground is formed may be raised more than the area where the solid ground is not formed, or the area where the solid ground is not formed may be raised than the area where the solid ground is formed. The material on the surface of the area in which the beta ground is formed and the surface of the area in which the beta ground is not formed may be different, and the touch of the two may be different.

  The main substrate 11 according to the above embodiment is provided in the game machine 1. The main substrate 11 provided in the gaming machine 1 is housed, for example, in a substrate case tightly sealed by ultrasonic welding. Therefore, in the gaming machine 1 installed in the game arcade, repair of the main substrate 11 is physically very difficult or impossible. In addition, in order to repair the gaming machine 1 installed in the game arcade, permission by the jurisdictional organization is usually required. For this reason, there is a reason that it is difficult to repair the gaming machine 1 other than physical reasons. Therefore, in the gaming machine 1 provided with the main substrate 11 according to the above-described embodiment, under the environment where the repair is difficult or impossible, the damage to the resist 53 causes the pin 54A and the solid ground to conduct electricity. Short circuit with beta ground can be suppressed.

  As described above, the gaming machine 1 including the main substrate 11 is provided with a plurality of substrates such as the effect control substrate 12, the sound control substrate 13, the lamp control substrate 14, and the relay substrate 15 in addition to the main substrate 11. . Therefore, the possibility of shorting between the electronic component and the solid ground is increased accordingly. In the gaming machine 1 provided with the main substrate 11 according to the above-described embodiment, in the case where the possibility of shorting between the electronic component and the solid ground is increased, the pin 54A and the solid ground are energized when the resist 53 is damaged. Short circuit between the electronic component and the solid ground due to

  In the above embodiment, the main substrate 11 has been described as an example of the substrate of the present invention. On the other hand, the substrate of the present invention may be any of the substrates other than the main substrate 11, the effect control substrate 12, the sound control substrate 13, the lamp control substrate 14, and the relay substrate 15. In addition, when the gaming machine 1 is provided with other substrates, for example, a power supply substrate for controlling a power supply, and a payout control substrate for controlling payout of gaming balls, the substrate of the present invention is used as these power substrate and payout control substrate. It is also good.

  Also, the substrate of the present invention may be a plurality of or a whole of these substrates. In the above embodiment, these substrates are provided independently, but some or all of these substrates may be integrated into one substrate. In particular, the effect control board 12, the sound control board 13 and the lamp control board 14 may be integrated into one as a circuit for controlling the effect device. In this case, the aggregated substrate may be used as the substrate of the present invention.

  Further, in the above embodiment, the range in the clinching direction in which the pin 54A inserted in the normal pin hole 51A is clinched in the vicinity of the normal pin hole 51A is fan-shaped. On the other hand, the range of the clinching direction in which the pin 54A inserted into the normal pin hole 51A is clinched in the vicinity of the normal pin hole 51A may have a shape other than the fan shape. For example, with the predetermined position α (see FIG. 5) as the central position, the side along the direction orthogonal to the clinch direction of the pin 54A is the horizontal side, and the length of the vertical side extending from the end of this horizontal side is the maximum clinch length It may be a rectangular shape.

  In addition, in the substrate according to the above embodiment, information such as a company name, a substrate name, and a management number may be written on the substrate. In FIG. 6, 500S is an example of the information describing area on the front surface of the substrate, and 501S is an example of the information describing area on the back side (back side information describing area). 500T denotes the upper side of the substrate, 500B the lower side of the substrate, and 500T the left side of the substrate (in the back surface, the vertical relation between 500T and 500B is reversed because the upper and lower sides are reversed). The components may be mounted on both the front and back surfaces, or may be mounted on only one of the surfaces.

  In the substrate shown in FIG. 6, solid grounds are provided on both the front and back surfaces. Reference numeral 500G denotes a solid ground on the front surface (solid ground on the front surface), and reference numeral 501G denotes a solid ground on the rear surface (solid ground on the rear surface). Incidentally, the front-side solid ground 500G and the rear-side solid ground 501G are covered with the resist as described above.

  The information (ABC) described in the information describing area and the back side information describing area of FIG. 6 is formed by etching characters (copper foil characters). Therefore, information can be formed three-dimensionally and made to stand out. Since the information is formed by the etched characters, the solid ground is removed in the information describing area and the back side information describing area. The black part in FIG. 6 shows the part from which the solid ground was removed.

Here, on the front surface, the front surface ground surface 500G in the information entry region 500S is removed, but in the surface 500S 'corresponding to the back surface of the information entry region 500S, the back surface ground edge 501G is not removed. Similarly, on the back surface, the back surface solid ground 501G in the back surface information described area 501S is removed, but the surface front ground 500G is not removed on the 501S 'corresponding to the back side of the back surface information described area 501S.

  The substrate is mainly made of resin, so it has translucency, and light is transmitted in a region where solid ground is not formed. As described above, the solid ground is removed in the information describing area 500S and the back side information describing area 501S in which the etched character is formed, so that light may be easily transmitted and the information may be difficult to recognize. However, since the back surface solid ground 501G is formed on the back (500S ') of the information writing area 500S, and the surface front ground 500G is formed on the back (501S') of the back surface information recording area 501S, light is transmitted. To prevent information from being recognized easily.

  Further, since the information entry area 500S and the back side information entry area 501S are not overlapped and provided adjacent to each other in the front and back direction, it is easy to grasp the position where the information is described on any surface.

  Although FIG. 6 shows an example in which the information is written on both the front and back surfaces, the surface on which the information is written may be only one of them. Further, the method of describing the information is not limited to the etching characters, and may be another method such as printing with ink.

  Further, in the substrate according to the above-described embodiment, the lands (conductor patterns) provided in the region to which the component is soldered may be provided in a shape extending in the moving direction of the substrate in soldering by the flow method. Good. The flow method is generally used as a method of soldering, and is a method of soldering by immersing the front surface (or the back surface) of the substrate in the surface layer of the solder melted in the solder bath. In the flow method, while the substrate is moved, it is immersed in the solder instantaneously, but since the solder is viscous, breakage from the land once attached becomes worse. Especially in the place where a plurality of lands are provided side by side as shown in FIG. 6A, the solder breakage of the lands at the end becomes particularly bad, and the solder attached to the lands excessively trails and straddles the adjacent lands. And may cause a short circuit.

  Therefore, in the substrate shown in FIG. 6A, the lands 600A and 600B corresponding to the end portion in the moving direction (left and right direction in FIG. 6) of the substrate in soldering by the flow method are extended in the moving direction of the substrate. It is designed to be provided in the following shape. In this way, for example, even if the solder adheres excessively to the land of 600 B, the solder adhering to the excess is guided to the extended portion of the land (the right side portion of 600 B), and the adjacent 600 C lands. It is possible to prevent the occurrence of short circuiting.

  Although the example which is a horizontal direction is shown as a movement direction of a substrate at the time of soldering by a flow method, a vertical direction etc. are considered as a movement direction, for example. Therefore, as shown in 600D, the shape of the land is extended in a direction (diagonal direction) between a plurality of moving directions so as to exert an effect even if the moving direction is horizontal or vertical. It is also good.

  Although FIG. 6 shows that the shape of the land provided in the pin hole portion to which the component is soldered is provided in a shape extending in the moving direction of the substrate, the pad used when the component is surface mounted (conductor pattern ) May be extended in the moving direction of the substrate.

  Although FIG. 6 shows that the lands are provided in a shape extending in the moving direction of the substrate, the lands are not limited to being provided in the extending shape, but may be provided slightly apart in the moving direction of the substrate. You may Parts will not be soldered to the land provided separately, but it is possible to prevent the solder from straddling the land to which the part is attached by short circuited by induction of the excessively attached solder. Can be prevented.

  In the above embodiment, a pachinko machine has been described as an example of a gaming machine provided with a substrate, but the gaming machine may be a gaming machine other than a pachinko machine, and other gaming machines such as pachislot machines (slot machines) and parrots. It can also be done. The slot machine is a gaming machine that plays a predetermined game using a medal or the like as a game medium, and can give a predetermined game value based on the game result. The slot machine has a plurality of reels on which a plurality of symbols are drawn, and is configured to be provided with a start lever for rotating these reels and a stop button for stopping the rotation of the reels. A pay line is defined on a plurality of reels, and a game value to be awarded is determined in accordance with a combination of symbols displayed on the pay line.

  The slot machine further includes display means for determining a symbol combination that can be displayed on the pay line according to a predetermined determination, and displaying an effect according to the symbol combination that can be displayed. The slot machine has a main board for controlling the rotation and stopping of the reels, an effect control board for controlling the effects to be displayed on the display means, a voice control board, and a lamp control board. There is. The slot machine also includes a power supply board for controlling the power supply of the slot machine, and a payout control board for controlling the payout of medals. The substrates according to the present invention can also be applied to these substrates in slot machines.

  A parrot is a gaming machine that uses gaming balls instead of medals as gaming value in a slot machine. The parrot is equipped with a main board similar to the slot machine, an effect control board, an audio control board, and a lamp control board. The substrates according to the invention can also be applied to these substrates in parrots. In addition, the gaming machine of the present invention is not limited to a payout type gaming machine that pays out a predetermined number of gaming media as a prize based on the occurrence of a prize, and is based on the occurrence of winning balls by sealing the gaming media. The present invention can also be applied to an enclosed type gaming machine that gives a score.

DESCRIPTION OF SYMBOLS 1 ... game machine 2 ... game board 3 ... frame 4A, 4B for game machine ... special symbol display device 5 ... image display device 5L ... decoration symbol display area 5C ... decoration symbol display area 5R ... decoration symbol display area 6A ... ordinary winning ball Device 6B: Normal variable winning ball device 11: Main substrate 12: Effect control substrate 50: Printed board 51: Pin hole 51A: Normal pin hole 51B: Ground pin hole 52: Wiring pattern 53: Resist 54A: Pin 55: Land 61 to 61 68 ... Beta ground non-forming range 71 ... Annular beta ground non-forming range 100 ... Micro computer 101 for game control ... ROM
102 ... RAM
103 ... CPU

Claims (1)

A gaming machine comprising a substrate to which components are soldered,
Conductor pattern is provided in a region where you Keru the component is soldered to the base plate,
There are multiple movement directions of the board during soldering by flow method,
The conductor pattern is provided in a shape extending in a direction between movement directions of a plurality of substrates,
The substrate is housed in a sealed substrate case ,
A solid surface for the surface is formed on the surface of the substrate,
A back surface solid ground is formed on the back surface of the substrate,
A surface information area in which information about a substrate is described is provided in an area of the surface of the substrate where the surface ground is not formed.
A back surface information area in which information on a substrate is described is provided in an area on the back surface of the substrate where the back surface solid ground is not formed,
The front surface solid ground is formed on the back surface of the back surface information area,
The back surface solid ground is formed on the back surface of the surface information area,
The front surface information area and the back surface information area are provided so as not to overlap and be adjacent to each other in the positional relationship in the front and back direction.
A game machine characterized by