JP6496950B2 - Game machine - Google Patents

Description

The present invention relates to Yu technique machine.

  The gaming machine is provided with various substrates such as a main circuit substrate and a peripheral control substrate. Some of these substrates have an identification character (such as a company name) written in a region where a ground is not formed (for example, see Patent Document 1).

JP 2010-12058 A

  However, in the substrate described above, light is transmitted in a region where the ground is not formed, and there is a possibility that the written information may be difficult to recognize.

Therefore, an object of the present invention is to provide is to provide a Yu technique machine that can be easily recognized the information on the substrate.

(1) A substrate according to an embodiment of the present invention is made in order to solve the above-described problems. A surface solid ground (for example, a surface solid ground 500G) is formed on the surface, and a back surface is formed on the back surface. A gaming machine including a board on which a solid ground for use (for example, a backside solid ground 501G) is formed, and the front surface includes an information description area (for example, an information description area 500S) in which information about the board is written. The back surface includes a back surface information description region where information about the substrate is written, the front surface information description region is provided in a region where the front solid ground is not formed on the front surface, and the back surface information description region is the rear surface solid ground provided in a region not formed, solid ground the back on the back is of formation of the surface information description region in the back The solid ground said surface is formed on the back surface of the back information description region, and the surface information description region and the back surface information description region is provided adjacent with no overlap in the positional relationship between the front and back direction, the substrate Are housed in a sealed substrate case.

  According to such a substrate, information on the substrate can be easily recognized.

(2) In the substrate of (1) above,
The back surface includes a back surface information description region (for example, a back surface information description region 501S) where information about the substrate is written,
The back surface information describing region is provided in a region where the back surface solid ground is not formed on the back surface,
The front surface solid ground may be formed on the back surface of the back surface information description area.

  According to such a substrate, information on the substrate can be easily recognized even on the back surface.

(3) In the substrate of (2) above,
The information description area and the back surface information description area may not be overlapped in the front-back direction and may be provided adjacent to each other.

  According to such a substrate, information on the substrate can be easily recognized, and by being provided adjacent to each other, it is possible to easily grasp the position where the information is written on any surface.

(4) In the substrate according to any one of (1) to (3) above,
It has a pin hole (for example, a normal pin hole 51A, a ground pin hole 51B, etc.) and a solid ground (for example, covered with a resist 53) on one surface (for example, the back surface of the main board 11 or a solder surface). (For example, main board 11, production control board 12, voice control board 13, lamp control board 14, relay board 15, power supply board, payout control board, etc.)
As said pin hole, it has the 1st pin hole (for example, normal pin hole 51A etc.),
The first pin hole is in the vicinity of the first pin hole on the one surface (for example, a range up to a distance 1 cm longer than the clinch length of the pin 54A), and the first pin hole A direction within a range of ± predetermined angle from a clinch direction (for example, a direction (position) where the pin 54A is to be clinched) that clinch a pin inserted from another surface (for example, the surface of the main substrate 11 or a mounting surface). Etc.) (for example, the first solid ground non-formation range 61 to the eighth solid ground non-formation range 68, the first normal pin hole 51A1 to the third normal pin hole 51A3 in the left direction range, the fourth normal pin hole 51A4 The right range in the sixth normal pin hole 51A6, the left normal range in the seventh normal pin hole 51A7, and the eighth normal pin hole 51A8) are pin holes in which no solid ground is formed. And features.

  According to such a substrate, since a solid ground is not formed in the pin clinching direction in the vicinity of the pin hole, a short circuit between the electronic component and the ground can be suppressed.

(5) In the substrate of (4) above,
A second pin hole (for example, a ground pin hole 51B) in which a solid ground is formed in the above range (for example, a range corresponding to the first solid ground non-formation range 61 to the eighth solid ground non-formation range 68). (For example, a solid ground is formed in the vicinity of the ground pin hole 51B).

  According to such a substrate, it is possible to limit a portion where the solid ground is not formed only in a portion necessary for clinching the pin, and thus it is possible to suppress problems due to a decrease in the area of the solid ground.

(6) In the substrate of (4) or (5) above,
There is a third pin hole (for example, a ground pin hole 51B etc.) in which no solid ground is formed around the pin hole,
The range in which the solid ground around the third pin hole is not formed (for example, the annular solid ground non-formation range 71) is the range of the first pin hole (for example, the first solid ground non-formation range). (For example, the area of the annular solid ground non-formation range 71 is the area of each of the first solid ground non-formation range 61 to the eighth solid ground non-formation range 68). It may be made smaller).

  According to such a substrate, heat is less likely to escape due to the area where the solid ground formed around the third pin hole is not formed, and soldering can be facilitated.

(7) In the substrate according to any one of (4) to (6) above,
At least one of the second pin hole in which the solid ground is formed in the range and the third pin hole is a pin hole into which the ground pin is inserted (for example, the ground pin hole 51B). It may be.

  According to such a substrate, since a short circuit between the ground pin and the solid ground does not cause a problem around the ground pin, it is possible to suppress a problem caused by a decrease in the area of the solid ground.

(8) In the substrate according to any one of (4) to (7) above,
On the one surface (for example, the back surface or the solder surface), a surface member (for example, the wiring pattern 52, the resist 53, and the like) including wiring (for example, the wiring pattern 52) and a resist (for example, the resist 53) is provided. Holes 51 etc.) are provided,
The pin clinch direction is a direction in which the density of the surface members (for example, the ratio of the surface members per unit area, etc.) is low (for example, the angle around the normal pin hole 51A is divided into four directions, front, rear, left, and right. The density of the surface members in each direction within a predetermined distance from the pin hole 51A may be compared, and the density may be set such that the density is the lowest.

  According to such a substrate, the work of providing a solid ground, particularly the work of removing the ground can be facilitated.

(9) In the substrate according to any one of (4) to (8) above,
The portion where the solid ground is formed is distinguishable from the portion where the solid ground is not formed (for example, the printed board 50 is black, the wiring pattern 52 is yellow-green, the resist 53 is green, the solid ground is It may be made red).

  According to such a substrate, it is possible to easily determine a portion where no solid ground is formed.

(10) In the substrate according to any one of (4) to (9) above,
A board on which the electronic component (for example, a resistor, a capacitor, a transistor, or another component) is mounted by inserting pins of the electronic component into the pin hole may be used.

  According to such a substrate, a short circuit between the electronic component and the ground can be suppressed.

(11) A gaming machine (for example, gaming machine 1 or the like) including any one of the substrates (1) to (10) may be used.

  According to such a gaming machine, a short circuit between the electronic component and the ground on the board can be suppressed.

1 is a front view illustrating a pachinko gaming machine according to one embodiment of the present invention. It is a block diagram which illustrates the various control boards etc. which were mounted in the pachinko game machine. It is an external view of the back side of the main board. FIG. 4 is an enlarged view of part A of FIG. 3. FIG. 4 is an enlarged view of part A of FIG. 3 on a main board on which electronic components are mounted. It is an external view of the board | substrate in a modification.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In this embodiment, after describing the gaming machine of the present invention, the structure of the board provided in the gaming machine will be described.
First, an arrangement layout of main members of a pachinko gaming machine (game machine) will be described with reference to FIG. FIG. 1 is a front view illustrating a pachinko gaming machine according to an embodiment of the present invention.

  In FIG. 1, a gaming machine 1 includes a gaming board 2, a gaming machine frame 3, a first special symbol display device 4A, a second special symbol display device 4B, an image display device 5, an ordinary winning ball device 6A, and an ordinary variable winning ball. Device 6B, special variable winning ball device 7, speaker 8 (including speakers 8UL, 8UR, 8LL and 8LR), lamp 9 (including light emitting members 9CC, 9CL, 9CR, 9U, 9SL and 9SR), normal symbol display 20 , A first hold indicator 25A, a second hold indicator 25B, a universal hold indicator 25C, a stick controller 31A, a push button 31B, and a passing gate 41.

The game board 2 is formed with a substantially circular game area surrounded by guide rails. In this game area, a game ball as a game medium is launched from a predetermined hitting ball launching device and driven.
The first special symbol display device 4A and the second special symbol display device 4B display (variably display) a special symbol (also referred to as “special symbol”), which is a plurality of types of identification information that can be identified. The special figure variably displayed on the first special symbol display device 4A is referred to as "first special figure", and the special figure variably displayed on the second special symbol display device 4B is referred to as "second special figure".

  The image display device 5 forms a display area for displaying various images. In the display area of the image display device 5, there are arranged decorative symbol display areas 5L, 5C, 5R, a first start prize storage display area 5HL, and a second start prize storage display area 5HR. The decorative symbol display areas 5L, 5C, and 5R variably display decorative symbols that are a plurality of types of identification information that can be identified. The image display device 5 displays a variable display game (first special game) using the first special symbol executed by the first special symbol display device 4A or a second special symbol executed by the second special symbol display device 4B. Corresponding to the used variable display game (second special game), variable display of decorative symbols is executed in the decorative symbol display areas 5L, 5C, and 5R. The image display device 5 is composed of, for example, an LCD (liquid crystal display device) or the like.

  Further, in the display area of the image display device 5, a first start prize storage display area 5HL and a second start prize storage display area 5HR are arranged.

  The first start winning memory display area 5HL displays the first special figure reserved memory number so that it can be specified (first hold display), similarly to the first hold indicator 25A described later. The number of first special figure hold memory is the number of stored first special figure hold information (hold number). The first special figure hold information is that the first start condition is established by the game ball winning in the first start winning opening formed in the normal winning ball apparatus 6A (first start winning), but the first start winning Is information relating to the variable display corresponding to the first start winning when the first start condition permitting the start of the variable display game is not satisfied. Therefore, each time the first start condition is satisfied, the first special figure hold information is stored (held) one by one, and the first special figure hold number is added one by one. Each time the first start condition is satisfied, the hold of the first special figure hold information is deleted (digested) one by one, and the first special figure hold storage number is subtracted one by one.

  The second start winning memory display area 5HR displays the second special figure reserved memory number so that it can be specified (second hold display), similarly to the second hold indicator 25B described later. The number of second special figure hold memory is the number of stored second special figure hold information (the number of hold). The second special figure hold information indicates that the second start condition is established when the game ball wins the second start winning opening formed in the normal variable winning ball apparatus 6B (second start winning), but the second start This is information relating to variable display corresponding to the second start winning when the second start condition for allowing the start of the variable display game by winning is not satisfied. Therefore, every time the second start condition is satisfied, the second special figure hold information is stored (hold) one by one, and the second special figure hold storage number is added one by one. Each time the second start condition is satisfied, the hold of the second special figure hold information is deleted (digested) one by one, and the second special figure hold storage number is subtracted one by one.

  Further, in the display area of the image display device 5, an active display area AHA for displaying an active display (also referred to as a digestion display or a current display) corresponding to the change is arranged.

The normal winning ball device 6A forms a first start winning opening as a start area (first start area).
The normal variable winning ball apparatus 6B includes an electric tulip-shaped accessory (ordinary electric accessory) having a pair of movable wing pieces, and forms a second start winning opening as a start area (second start area).

  The special variable winning ball apparatus 7 includes, for example, a grand prize opening door that is opened and closed by a solenoid 82 for the big prize opening door shown in FIG. 2, and the state of the big prize opening (open state, closed) is opened and closed. Change state).

  The speaker 8 outputs a production sound and a warning sound according to the state of the gaming machine 1. The lamp 9 performs a light emission operation (lighting operation, flashing operation, and extinguishing operation) according to the state of the gaming machine 1.

  The normal symbol display 20 variably displays normal symbols (also referred to as “ordinary symbols” or “ordinary symbols”), which are a plurality of types of identification information different from the special symbols. The variable display game using the normal symbols executed by the normal symbol display 20 is referred to as a normal game (or “normal game”).

  The first hold indicator 25A displays the first special figure hold memory number so that it can be specified. Further, the second hold indicator 25B displays the second special figure hold memory number so that it can be specified.

  The general-purpose hold display unit 25C displays the general-purpose hold storage number based on the hold data (the general-purpose hold information). The number of usual-pending memories is the number of usual-type games that are not executed immediately but are suspended when a game ball that has passed through the passage gate 41 is detected.

  The stick controller 31A and the push button 31B are detection means for detecting an operation by the player, which is an example of the player's operation. The stick controller 31A has an operation rod and a trigger button that are held by the player. The stick controller 31A detects the tilting operation of the operation rod and the push / pull operation of the trigger button by the player. The push button 31B detects a pressing operation by the player.

Next, the hardware configuration of the gaming machine 1 will be described with reference to FIG. FIG. 2 is a configuration diagram illustrating various control boards and the like mounted on the gaming machine.
In FIG. 2, the gaming machine 1 includes a main board 11, an effect control board 12, an audio control board 13, a lamp control board 14, and a relay board 15.

The main board 11 is a main control board. The main board 11 mainly has a random number setting function used in a special game, acquisition of a signal from a switch or the like disposed at a predetermined position, transmission of a control command to a sub-side control board such as the effect control board 12, Output of various information to a hall management computer not shown in FIG. 2, variable display of predetermined identification information by turning on / off the first special symbol display device 4A, the second special symbol display device 4B, and the normal symbol display device 20 Control and display control of the first hold indicator 25A, the second hold indicator 25B, and the general-purpose hold indicator 25C are performed.
The main board 11 includes a game control microcomputer 100, a switch circuit 110, and a solenoid circuit 111.

  The game control microcomputer 100 controls the progress of the game in the gaming machine 1. The game control microcomputer 100 includes a ROM (Read Only Memory) 101 for storing a game control program and fixed data, a RAM (Random Access Memory) 102 for providing a game control work area, and a game control program. A CPU (Central Processing Unit) 103, a random number circuit 104 for updating numerical data indicating a random number value independently of the CPU 103, and an I / O (Input / Output port) 105.

  The switch circuit 110 mediates detection signals input from the gate switch 21, the first start port switch 22 </ b> A, the second start port switch 22 </ b> B, and the count switch 23 to the game control microcomputer 100.

  The gate switch 21 detects a game ball that has passed through the passage gate 41 and outputs a detection signal. The first start port switch 22A detects a game ball that has passed through the first start winning port and outputs a detection signal. The second start port switch 22B detects a game ball that has passed through the second start winning port and outputs a detection signal. In addition, the count switch 23 detects a game ball that has passed through the large winning opening that has been opened, and outputs a detection signal.

  The solenoid circuit 111 outputs the solenoid drive signal acquired from the game control microcomputer 100 to the solenoid 81 that opens and closes the movable wing piece of the second start winning opening and the solenoid 82 that opens and closes the grand prize opening door.

  The relay board 15 relays various control signals transmitted between the main board 11 and the effect control board 12.

  The effect control board 12 is a sub-side control board independent of the main board 11, and controls the effect (effect control) executed in the gaming machine 1. The effect control board 12 displays an effect control CPU 120 that performs a control operation in accordance with a program, a ROM 121 that stores an effect control program, fixed data, and the like, a RAM 122 that provides a work area for the effect control CPU 120, and the display of the image display device 5. The display control unit 123 to be controlled, a random number circuit 124 for updating numerical data indicating a random number value, and an I / O 125 are provided independently of the CPU 120 for effect control.

  The display control unit 123 receives an instruction from the effect control CPU 120, reads image data to be displayed on the image display device 5 from an image data memory such as a CGROM (Character Generator ROM), and develops the image data in a VRAM (Video RAM). Temporary storage. Further, the display control unit 123 enlarges, reduces, and rotates an image to be displayed on the image display device 5 (rotation of the display screen of the image display device 5 on a parallel plane, rotation of the display screen in the depth direction, etc.), swinging. (Repeating normal rotation and reverse rotation on the parallel plane of the display screen of the image display device 5, repeating normal rotation and reverse rotation in the depth direction of the display screen, etc.), bending (folding an image at a predetermined position), etc. It is also possible to perform the following process. For the display control unit 123, for example, a VDP (Video Display Processor) can be used.

The image display device 5 displays various images based on the image data output from the effect control board 12. The image data output from the effect control board 12 may be display-controlled by the display control unit 123.
The sound control board 13 receives sound commands from the effect control CPU 120 and controls sound data output to the speaker 8. The voice control board 13 may read voice data from a voice data ROM or the like, expand it in a voice RAM or the like, and temporarily store it.
The lamp control board 14 receives a command from the effect control CPU 120 and controls the display of the lamp 9. The image display device 5, the speaker 8, the lamp 9, and the like are effect devices that execute an effect in response to a command from the effect control CPU 120. The rendering device may include a movable accessory (not shown).

  The controller sensor unit 35A outputs the player's operation on the stick controller 31A detected by the stick controller 31A to the effect control board 12 as an information signal (operation detection signal) indicating that the operation has been detected. For example, the controller sensor unit 35A detects the tilt direction and tilt angle by the tilting operation of the operation stick of the stick controller 31A by the player, and outputs an information signal indicating the detected tilt direction and tilt angle to the effect control board 12. . In addition, the controller sensor unit 35A detects the push / pull operation of the trigger button by the player detected by the stick controller 31A, and outputs an information signal indicating the detected push / pull operation to the effect control board 12. The controller sensor unit 35A may be formed integrally with the stick controller 31A.

  The push sensor 35B outputs the player's operation on the push button 31B detected by the push button 31B to the effect control board 12 as an information signal (operation detection signal) indicating that the operation has been detected. The push sensor 35B may be formed integrally with the push button 31B.

  Next, the structure of the board provided in the gaming machine 1 of the present invention will be described. Here, an example of the structure of the main substrate 11 will be described. In the following description, the surface of the main board 11 on which electronic components are mounted is referred to as “surface”. The surface on the back side where no electronic component is mounted is referred to as a “back surface”. Also, electronic components are mounted on the front surface of the main board 11, and electronic components are not mounted on the back surface of the main board 11, but pins included in the electronic components are soldered. For this reason, the surface of the main substrate 11 is also referred to as a “component surface”, and the back surface of the main substrate 11 is also referred to as a “solder surface”.

  FIG. 3 is an external view of the back surface of the main board. FIG. 4 is an enlarged view of a portion A in FIG. FIG. 5 is an enlarged view of part A of FIG. 3 on the main board on which electronic components are mounted. As shown in FIG. 3, the main board 11 includes a printed board 50. The printed board 50 is made of an insulator. Moreover, the main board 11 has a plurality of pin holes (through holes) 51 formed in the printed board 50 as shown in FIGS. 3 and 4. The pin hole 51 is formed through the front surface and the back surface of the printed board 50.

  A wiring pattern 52 made of a conductor is formed on the back side of the main substrate 11. The wiring pattern 52 is disposed at a position where the pin holes 51 are appropriately connected. A plurality of wiring patterns 52 are wired on the back side of the main substrate 11. Further, a resist 53 made of an insulator is formed at a position avoiding the pin hole 51 and the wiring pattern 52 on the back surface side of the main substrate 11. The resist 53 is formed so as to cover a wide range on the back surface of the printed board 50. Further, the pin hole 51 and the resist 53 and the wiring pattern 52 and the resist 53 are all separated from each other. Therefore, the pin hole 51 and the resist 53, and the wiring pattern 52 and the resist 53 are not in contact with each other.

  A solid ground (not shown) is formed on the back surface of the main substrate 11. The resist 53 is formed on the back side of the main substrate 11 so as to cover the entire surface of the solid ground. The solid ground surface is protected by the resist 53. Further, since the resist 53 is formed so as to cover the entire surface of the solid ground, the solid ground has a structure in which there is almost no exposed portion on the back surface side of the main substrate 11. The solid ground is a ground formed over the entire surface or almost the entire surface of the main substrate 11. The solid ground is formed by, for example, removing the ground. As a procedure for forming a solid ground, first, a solid ground material is applied on the entire back surface side of the main substrate 11, and the applied solid ground material is removed from a region where the solid ground is not formed. The ground removal is an operation to remove the solid ground material at this time. The solid ground may be formed by other procedures.

  On the back side of the main substrate 11, the solid ground is entirely covered with the resist 53. For this reason, the solid ground is not formed in a range other than the range covered with the resist 53. In other words, the resist 53 as a whole covers the solid ground, and the range in which the resist 53 is formed coincides with the range in which the solid ground is formed. However, the resist 53 as a whole does not cover the solid ground, and the resist 53 may be wider than the solid ground. In the following description, a range in which no solid ground is formed is referred to as a solid ground non-formation range.

  As shown in FIG. 4, the main board 11 has normal pin holes 51 </ b> A (first normal pin holes 51 </ b> A <b> 1 to eighth normal pin holes 51 </ b> A <b> 8) and ground pin holes 51 </ b> B as a plurality of pin holes 51. As shown in FIG. 5, the electronic component pins 54A (first pin 54A1 to eighth pin 54A8) are inserted into the normal pin holes 51A, respectively. The pins 54A inserted into the normal pin holes 51A are each clinched on the back side of the main board 11. By clinching the pin 54A on the back side of the main board 11, it is possible to prevent the pin 54A from coming out of the normal pin hole 51A and dropping the electronic component from the main board 11. Electronic components include electronic components used for ordinary substrates such as resistors, capacitors, transistors, and other components.

  The ground pin hole 51B is a pin hole into which a ground pin (not shown) connected to the solid ground is inserted. Four lands 55 are provided around the ground pin hole 51B. The main board 11 has a plurality of ground pin holes 51B. In the main board 11, the ground pin holes 51B are also provided at positions other than the positions shown in FIG.

  Further, the normal pin holes 51A are in the vicinity of the normal pin holes 51A on the back surface of the main board 11, and are in the clinch direction range in which the pins 54A inserted from the surface of the main board 11 into the normal pin holes 51A are clinched. Is a pin hole in which no solid ground is formed. The vicinity of the normal pin hole 51A is determined according to the clinch length when the pin 54A inserted into the normal pin hole 51A is clinched. For example, the vicinity of the normal pin hole 51A can be a range up to a distance that is 1 cm longer than the maximum clinch length of the pin 54A. The maximum clinch length here is, for example, the longest length among the lengths that can be the length from the position where the pin 54A intersects the normal pin hole 51A to the tip of the pin 54A. Further, the range near the normal pin hole 51A may be determined without considering the clinch length of the pin 54A. Alternatively, the vicinity of the normal pin hole 51A may be a range up to a distance that is longer than the clinch length of the pin 54A by a length other than 1 cm. The vicinity of the normal pin hole 51A may be a range that does not include a position that is longer than the maximum clinch length of the pin 54A. However, it is preferable that the vicinity of the normal pin hole 51A be a range including a position having a distance longer than the maximum clinch length of the pin 54A.

  The clinching direction of the pin 54A refers to a direction within a range of ± predetermined angle with respect to a direction in which the pin 54A is clinched around a predetermined position α (see FIG. 5). For example, the predetermined angle can be arbitrarily set from an angle in the range of more than 0 ° and not more than 45 °, such as 5 °, 10 °, and 15 °. Thus, the range in the clinch direction in the vicinity of the normal pin hole 51A in this embodiment and clinching the pin 54A inserted into the normal pin hole 51A is a fan shape. In addition, the predetermined position (center position according to a predetermined angle) is, for example, the pin 54A on the printed board 50 before the pin 54A is clinched by inserting the pin 54A among the positions that are the end portions of the normal pin hole 51A. It is a position that intersects the direction to be inserted and clinched (usually one position that becomes the end of the pin hole 51A on the clinch side). However, the predetermined position (the center position related to the predetermined angle) may not be one position that is the end of the pin hole 51A on the clinching side. For example, the predetermined position (center position of a predetermined angle) may be the position of the center of the circle of the opening of the normal pin hole 51A, or one position serving as the end of the normal pin hole 51A on the clinching side, It may be one position on a line segment connecting the position of the center of the circle of the opening of the normal pin hole 51A. The pin 54A is actually clinched in the normal pin hole 51A in the direction to be clinched.

  Around the normal pin hole 51A, there is a first solid ground non-formation range 61 that includes the entire fan shape in the clinch direction in the vicinity of the normal pin hole 51A and clinching the pin 54A inserted into the normal pin hole 51A. An eighth solid ground non-forming range 68 is provided. In the first solid ground non-forming range 61 to the eighth solid ground non-forming range 68 around the normal pin hole 51A, the area in the clinch direction of the pin 54A inserted into the normal pin hole 51A is larger than the area in the other direction. It has a wide oval shape. Further, the first solid ground non-formation range 61 to the eighth solid ground non-formation range 68 in the clinch direction of the pin 54A are formed to a range where the tip of the pinned pin 54A does not reach. The shape of the first solid ground non-formation range 61 to the eighth solid ground non-formation range 68 may be a shape other than an ellipse. For example, the shape of the first solid ground non-formation range 61 to the eighth solid ground non-formation range 68 may be an ellipse, or a rectangle such as a rectangle or a square. The shapes of the first solid ground non-formation range 61 to the eighth solid ground non-formation range 68 may be other shapes.

The clinch direction of the pin 54A is determined in advance before inserting the pin 54A into the normal pin hole 51A. Specifically, in the example shown in FIG. 4, the clinching direction of the first pin 54A1 to the third pin 54A3 in the first normal pin hole 51A1 to the third normal pin hole 51A3 arranged on the left side of the drawing is the left direction. The first solid ground unformed range 61 to third solid ground non-formation range 63 around the first normal pin hole 51A1~ third normal pin holes 51A3 is the first normal pin hole 51A 1 ~ third normal pin holes 51A3 It is the left direction of 1st normal pin hole 51A1-3rd normal pin hole 51A3 in the vicinity.

  The clinching direction of the fourth pin 54A4 to the sixth pin 54A6 in the fourth normal pin hole 51A4 to the sixth normal pin hole 51A6 arranged in the center of the drawing is the right direction. The fourth solid ground non-forming range 64 to the sixth solid ground non-forming range 66 around the fourth normal pin hole 51A4 to the sixth normal pin hole 51A6 are in the vicinity of the fourth normal pin hole 51A4 to the sixth normal pin hole 51A6. In the right direction of the fourth normal pin hole 51A4 to the sixth normal pin hole 51A6.

  The clinching direction of the seventh pin 54A7 and the eighth pin 54A8 in the seventh normal pin hole 51A7 and the eighth normal pin hole 51A8 arranged on the right side of the drawing is the left direction. The seventh solid ground non-forming range 67 and the eighth solid ground non-forming range 68 around the seventh normal pin hole 51A7 and the eighth normal pin hole 51A8 are in the vicinity of the seventh normal pin hole 51A7 and the eighth normal pin hole 51A8. In the left direction of the seventh normal pin hole 51A7 and the eighth normal pin hole 51A8.

  The clinch direction of these pins 54A is set to the direction where the density of the surface members is the lowest. Here, the surface member includes the wiring pattern 52 provided on the surface of the printed board 50, the resist 53, and other pin holes 51 adjacent to or close to the normal pin holes 51A. The density of the surface members refers to the proportion of the surface members per unit area.

  In the direction where the density is low, the angle around the normal pin hole 51A is divided into four parts, front, rear, left and right, and the density of the surface members in each direction within a predetermined distance from the normal pin hole 51A is compared. Set to The predetermined distance is determined in consideration of the clinch length of the pin 54A. For example, the distance can be 2 cm longer than the clinch length of the pin 54A. Further, the predetermined distance may be determined without considering the clinch length of the pin 54A, or a length longer than the clinch length of the pin 54A may be a length other than 2 cm. However, the predetermined distance is preferably longer than the clinch length of the pin 54A.

  The direction in which the density is low is determined in comparison with other directions. For example, in the case of the first normal pin hole 51A1, the wiring pattern 52 is formed in the upper direction and the right direction in FIG. 4, and the second normal pin hole 51A2 is formed in the lower direction. Further, no surface member is formed in the right direction of the first normal pin hole 51A1. For this reason, the right direction of the first normal pin hole 51A1 is the direction in which the density of the surface members is low.

  In setting the direction with low density, the angle around the pin hole 51A is usually divided into four parts, front, rear, left, and right, and either direction is set as the direction with low density. However, the density can be determined by dividing the periphery of the normal pin hole 51A into two or eight. Alternatively, the density can be set by dividing by another number.

  In addition, the clinch direction of the pins 54A may be set in a direction where the density of the surface members is the lowest, or may be set in a direction where the density is relatively low. The direction with relatively low density includes the direction with the lowest density, the direction with the second lowest density, and the third direction with the lowest density. In short, the direction with relatively low density is any direction other than the direction with the highest density.

  Around the ground pin hole 51B, a solid ground is formed in a range corresponding to the first solid ground non-formation range 61 to the eighth solid ground non-formation range 68 formed around the normal pin hole 51A. The ground pin hole 51B is a pin hole in which a solid ground is formed in a range corresponding to the first solid ground non-formation range 61 to the eighth solid ground non-formation range 68 formed around the normal pin hole 51A.

  However, an annular solid ground non-formation range 71 is provided around the ground pin hole 51B. The annular solid ground non-formation range 71 around the ground pin hole 51B has a shape in which a range of a shape obtained by adding thickness to a quadrant is arranged on an arc. These quadrants with thickened portions are separated from each other and are arranged between adjacent lands 55. The area of the annular solid ground non-formation range 71 is as follows. The first solid ground non-formation range 61 to the first solid ground formation range 61A1 to the eighth normal pin hole 51A8 are formed around the first pin 54A1 to the eighth pin 54A8. Each area of the 8-solid ground non-formation range 68 is made smaller.

  Also, the printed board 50, the wiring pattern 52, the resist 53, and the solid ground all have different colors. For example, the printed board 50 is black, the wiring pattern 52 is yellow-green, the resist 53 is green, and the solid ground is red. The pin hole 51 is formed through the printed board 50 and is black. As described above, the printed board 50, the wiring pattern 52, the resist 53, and the solid ground all have different colors, so that the portion where the solid ground is formed is the portion where the solid ground is not formed. It can be identified.

  Moreover, the normal side 1st solder part 91-the normal side 8th solder part 98 are provided in the position corresponded to the normal pin hole 51A. The normal side first solder part 91 to the normal side eighth solder part 98 are to be soldered between the normal pin hole 51A and the pin 54A after the pin 54A is inserted into the normal pin hole 51A and clinched. Formed with. The normal side first solder part 91 to the normal side eighth solder part 98 formed by soldering are formed from the back surface of the main board 11 to the inside of the normal pin hole 51A. The normal side first solder part 91 to the normal side eighth solder part 98 are in contact with the pin 54A provided in the normal pin hole 51A and the wiring pattern 52 provided on the back surface of the main board 11. The normal side first solder part 91 to the normal side eighth solder part 98 allow the pin 54A and the wiring pattern 52 to be energized.

  A ground pin side solder portion 99 is provided at a position corresponding to the ground pin hole 51B. The ground pin-side solder portion 99 is formed by soldering between the solid ground and the ground pin after the ground pin is inserted into the ground pin hole 51B. The ground pin-side solder portion 99 is provided from the inside of the ground pin hole 51B to the back surface of the main substrate 11, and is in contact with the solid ground and the ground pin covered with the resist 53 inside the ground pin hole 51B. . The solid pin and the ground pin can be energized by the ground pin side solder portion 99. The ground pin is electrically connected to the electronic component on the surface of the main board 11.

  The ground pin is housed in the ground pin hole 51 </ b> B and does not protrude from the back surface side of the main substrate 11. However, although the ground pin protrudes from the back surface side of the main substrate 11, the protruding portion of the ground pin may be included in the ground pin-side solder portion 99. Further, although the ground pin protrudes from the back surface side of the main substrate 11 and also protrudes from the ground pin-side solder portion 99, the protruding amount may be small and the ground pin may not be clinched.

  Next, the effect of the main board | substrate 11 which concerns on this embodiment is demonstrated. In the main substrate 11 according to the present embodiment. The normal pin hole 51A is a pin hole in which no solid ground is formed in the vicinity of the normal pin hole 51A and in the clinch direction range of the pin 54A inserted into the normal pin hole 51A. For this reason, the pin 54 </ b> A inserted into the normal pin hole 51 </ b> A and clinched does not reach the portion of the resist 53 that covers the solid ground. Therefore, it is possible to prevent the resist 53 covering the solid ground from being damaged by the pin tip of the clinched pin 54A. Therefore, a short circuit between the electronic component and the solid ground due to the energization of the pin 54A and the solid ground due to the damage of the resist 53 can be suppressed.

  In the main substrate 11 according to the present embodiment, the solid ground non-formation range around the normal pin hole 51A is limited to the clinching direction of the pin 54A inserted into the normal pin hole 51A. In a direction other than the clinch direction of the pin 54A that is normally inserted into the pin hole 51A, there is a small risk of damaging the resist 53 at the pin tip of the pin 54A, and there is a low need for a solid ground non-formation range. . Therefore, it is possible to prevent the solid ground non-formation range from being expanded to a region where the necessity of reducing the area of the solid ground is low.

  In the main substrate 11 according to the present embodiment, the range corresponding to the first solid ground non-formation range 61 to the eighth solid ground non-formation range 68 formed around the normal pin hole 51A is around the ground pin hole 51B. A solid ground is formed. The ground pin inserted into the ground pin hole 51 </ b> B is prevented from projecting to the back side of the main substrate 11. For this reason, the ground pin inserted into the ground pin hole 51B is prevented from damaging the resist 53 around the ground pin hole 51B. Accordingly, since the area around the ground pin hole 51B is a region where it is not necessary to reduce the area of the solid ground, the solid ground non-formation range should not be expanded to a region where the need to reduce the area of the solid ground is low. be able to.

  In the main board 11 according to the present embodiment, an annular solid ground non-formation range 71 is provided around the ground pin hole 51B. Since the annular solid ground non-formation range 71 is provided, the soldering in the ground pin hole 51B can be favorably performed when soldering. The area of the annular solid ground non-formation range 71 is as follows. The first solid ground non-formation range 61 to the first solid ground formation range 61A1 to the eighth normal pin hole 51A8 are formed around the first pin 54A1 to the eighth pin 54A8. Each area of the 8-solid ground non-formation range 68 is made smaller. For this reason, since heat at the time of soldering in the ground pin hole 51B is difficult to escape, the soldering in the ground pin hole 51B can be performed satisfactorily. Furthermore, the solid ground non-formation range in the region where the necessity of reducing the area of the solid ground is low can be contained within a narrow range.

  The ground pin inserted into the ground pin hole 51B is a pin connected to the solid ground. For this reason, a short circuit between the ground pin and the solid ground does not cause a problem. Therefore, since the solid ground is provided around the ground pin hole 51B, the solid ground non-formation range can be prevented from being expanded to a region where the necessity of reducing the area of the solid ground is low.

  In addition, since a short circuit between the ground pin and the solid ground does not cause a problem, even when the ground pin inserted into the ground pin hole 51B is clinched on the back surface side of the main substrate 11, the ground pin hole 51B is surrounded by the ground pin hole 51B. A solid ground may be provided. In this case, it is possible to prevent the solid ground non-formation range from being expanded to a region where the necessity of reducing the area of the solid ground is low.

  Further, the pins 54A are usually accommodated in the pin holes 51A and may not protrude from the back side of the main board 11. Further, although the pins 54A protrude from the back surface side of the main substrate 11, the protruding portions of the pins 54A may be included in the normal side first solder part 91 to the normal side eighth solder part 98. Further, the pin 54A protrudes from the back surface side of the main substrate 11 and also protrudes from the normal side first solder portion 91 to the normal side eighth solder portion 98, but the protrusion amount is slight and the pin 54A is not clinched. You may do it. In these cases, the periphery of the normal pin hole 51A is a region where there is little risk of damaging the resist 53 at the pin tip of the pin 54A, and is a region that is less likely to be a solid ground non-formation range. Therefore, in this case, a solid ground may be provided around the normal pin hole 51A. In this case, it is possible to prevent the solid ground non-formation range from being expanded to a region where the necessity of reducing the area of the solid ground is low.

  In the main board 11 according to the above embodiment, the clinch direction of the pins 54A is a direction in which the density of the surface members is low. For this reason, the number of surface members in the area where the solid ground is not formed is reduced. Therefore, when the work for removing the ground is performed when the solid ground is provided, the work for removing the ground can be facilitated. Even if the solid ground non-formation range is provided, the ratio of the areas where the solid ground non-formation range and the surface member are provided on the main substrate 11 can be equalized. Accordingly, the solid ground non-formation range and the surface member can be provided by effectively utilizing the back surface of the main substrate 11.

  In the main board 11 according to the above-described embodiment, the printed board 50, the wiring pattern 52, the resist 53, and the solid ground all have different colors. It is possible to distinguish from the part where no is formed. For this reason, it is possible to easily determine a portion where the solid ground is not formed.

  Further, the aspect in which the portion where the solid ground is formed can be distinguished from the portion where the solid ground is not formed may be another aspect. For example, only the printed board 50 and the resist 53 may be different colors. Further, as long as the colors of the printed board 50 and the resist 53 are different, any color may be used for the other materials. If the resist 53 has a region that does not cover the solid ground, the color may be changed between a portion of the resist 53 that covers the solid ground and a portion that does not cover the solid ground. Moreover, the aspect which makes it possible to distinguish the part in which the solid ground is formed from the part in which the solid ground is not formed may be an aspect other than changing the color of each member. For example, the outer frame of the area where the solid ground is formed may be illustrated with lines.

  You may distinguish the area | region in which the solid ground was formed in three dimensions. For example, the area where the solid ground is formed may be raised more than the area where the solid ground is not formed, or the area where the solid ground is not formed may be raised than the area where the solid ground is formed. The material of the surface of the area where the solid ground is formed and the area where the solid ground is not formed may be different, and the touch of both may be different.

  The main board 11 according to the above embodiment is provided in the gaming machine 1. The main board 11 provided in the gaming machine 1 is housed in a board case that is firmly sealed by, for example, ultrasonic welding. For this reason, in the gaming machine 1 installed in the game store, the repair of the main board 11 is physically very difficult or impossible. In addition, the repair of the gaming machine 1 installed in the amusement store usually requires permission from the competent group. For this reason, there are reasons why it is difficult to repair the gaming machine 1 other than physical reasons. Therefore, the gaming machine 1 including the main board 11 according to the above embodiment is an electronic component in which the pin 54A and the solid ground are energized due to damage to the resist 53 in an environment where repair is difficult or impossible. Short circuit with solid ground can be suppressed.

  As described above, the gaming machine 1 including the main board 11 is provided with a plurality of boards such as the effect control board 12, the sound control board 13, the lamp control board 14, and the relay board 15 in addition to the main board 11. . Therefore, the possibility of a short circuit between the electronic component and the solid ground increases accordingly. In the gaming machine 1 including the main board 11 according to the above-described embodiment, the pin 54A and the solid ground are energized due to the damage of the resist 53 in the case where the possibility of short circuit between the electronic component and the solid ground is increased. It is possible to suppress a short circuit between the electronic component and the solid ground.

  In the above embodiment, the main substrate 11 has been described as an example of the substrate of the present invention. On the other hand, the board of the present invention may be any one of the board other than the main board 11, the effect control board 12, the sound control board 13, the lamp control board 14, and the relay board 15. Further, when the gaming machine 1 is provided with other boards, for example, a power board for controlling the power supply and a payout control board for controlling the payout of the game ball, the board of the present invention is used as these power supply board and payout control board. Also good.

  In addition, the substrate of the present invention may be plural or all of these substrates. In the above embodiment, these substrates are provided independently, but a part or all of these substrates may be integrated into one substrate. In particular, the effect control board 12, the sound control board 13, and the lamp control board 14 may be integrated into one as a circuit for controlling the effect device. In this case, the aggregated substrate may be the substrate of the present invention.

  Further, in the above-described embodiment, the range in the clinch direction in which the pin 54A inserted in the normal pin hole 51A and in the vicinity of the normal pin hole 51A is a fan shape. On the other hand, the range in the clinch direction in the vicinity of the normal pin hole 51A and clinching the pin 54A inserted into the normal pin hole 51A may be a shape other than the sector shape. For example, the predetermined position α (see FIG. 5) is the central position, the side along the direction orthogonal to the clinch direction of the pin 54A is the horizontal side, and the length of the vertical side extending from the end of the horizontal side is the maximum clinch length. It may be a rectangular shape.

  In the substrate according to the above embodiment, information such as a company name, a substrate name, and a management number may be written on the substrate. In FIG. 6, 500S is an example of an information description area on the front surface of the substrate, and 501S is an example of an information description area (back surface information description area) on the back surface. 500T indicates the upper side of the substrate, the lower side of the 500B substrate, and 500T indicates the left side of the substrate (the vertical relationship between 500T and 500B is switched on the back surface because the top and bottom are inverted). Note that components may be mounted on both the front surface and the back surface, or components may be mounted only on one of the surfaces.

  In the substrate shown in FIG. 6, solid grounds are provided on both the front surface and the back surface. 500G is a solid ground on the front surface (front solid ground), and 501G is a solid ground on the back surface (solid ground on the back surface). The front solid ground 500G and the back solid ground 501G are covered with the resist as described above.

  Information (ABC) described in the information description area and the back surface information description area in FIG. 6 is formed by etching characters (copper foil characters). Therefore, information is formed in three dimensions and can be made conspicuous. Since the information is formed by etching characters, the solid ground is removed in the information description area and the back surface information description area. The black part in FIG. 6 shows the part from which the solid ground has been removed.

  Here, the surface tagunrad 500G in the information description area 500S is removed on the front surface, but the back surface solid ground 501G is not removed in 500S ′ corresponding to the back of the information description area 500S. Similarly, the back surface solid ground 501G in the back surface information description area 501S is removed on the back surface, but the front surface solid ground 500G is not removed in 501S ′ corresponding to the back surface of the back surface information description area 501S.

  Since the substrate is mainly formed of resin, it has translucency, and light is transmitted in a region where no solid ground is formed. As described above, since the solid ground is removed in the information description area 500S and the back surface information description area 501S where etching characters are formed, there is a possibility that light is easily transmitted and information is difficult to recognize. However, since the back surface solid ground 501G is formed on the back side (500S ′) of the information description area 500S and the front surface solid ground 500G is formed on the back side (501S ′) of the back surface information description area 501S, light is transmitted. To prevent information from being recognized.

  Further, since the information description area 500S and the back surface information description area 501S do not overlap in the front and back direction and are provided adjacent to each other, it is easy to grasp the position where the information is written on any surface.

  6 shows an example in which information is written on both the front surface and the back surface, the surface on which information is written may be only one of the surfaces. Also, the method of describing information is not limited to etching characters, and may be another method such as printing with ink.

  Further, in the substrate according to the above-described embodiment, the land (conductor pattern) provided in the region where the component is soldered may be provided in a shape extending in the moving direction of the substrate at the time of soldering by the flow method. Good. The flow method is generally used as a soldering method, and is a method of soldering by immersing the front surface (or back surface) of a substrate in the surface layer of solder dissolved in a solder bath. In the flow method, the substrate is instantaneously immersed in the solder while moving the substrate. However, since the solder is viscous, the disconnection from the land once attached becomes worse. In particular, in a place where a plurality of lands are provided side by side as shown in FIG. 6A, the soldering of the lands at the end portions is particularly bad, and the excessively adhered solder has a tail and straddles the adjacent lands. May adhere and cause a short circuit.

  Therefore, in the board shown in FIG. 6A, the lands 600A and 600B corresponding to the ends of the board moving direction (left and right in FIG. 6) at the time of soldering by the flow method are extended in the board moving direction. The shape is provided. By doing so, for example, even when the solder adheres excessively to the 600B land, the excessively adhered solder is guided to the extended portion of the land (the right side portion of the 600B), and the adjacent 600C land. It is possible to prevent a short circuit from occurring.

  Although an example in which the movement direction of the substrate during the soldering by the flow method is the left-right direction has been shown, the movement direction may be, for example, the vertical direction. Therefore, as shown in 600D, the shape of the land is extended in a direction between a plurality of moving directions (oblique direction) so that the effect is exerted regardless of whether the moving direction is the left-right direction or the up-down direction. Also good.

  FIG. 6 shows that the land provided in the pin hole portion to which the component is soldered is provided with a shape extending in the moving direction of the substrate. However, the pad (conductor pattern) used when the component is surface-mounted. ) May be provided in a shape extending in the moving direction of the substrate.

  Further, FIG. 6 shows that the land shape is provided in a shape extending in the moving direction of the substrate. However, the land is not limited to be provided in the extended shape, and the lands are provided slightly apart in the moving direction of the substrate. It may be. Parts are not soldered to the lands that are spaced apart from each other, but excessive solder can be induced to prevent the solder from straddling the lands to which the parts are attached. Can be prevented.

  In the above embodiment, a pachinko machine has been described as an example of a gaming machine provided with a substrate, but the gaming machine may be a gaming machine other than a pachinko machine, and other gaming machines such as a pachislot machine (slot machine) or a parrot It can also be. The slot machine is a gaming machine that performs a predetermined game using a medal or the like as a game medium and that can give a predetermined game value based on the game result. The slot machine includes a plurality of reels on which a plurality of symbols are drawn, and is provided with a start lever for rotating the reels and a stop button for stopping the rotation of the reels. A winning line is defined for a plurality of reels, and a game value to be given is determined according to a combination of symbols displayed on the winning line.

  Further, the slot machine includes display means for determining a symbol combination that can be displayed on the winning line by a predetermined determination, and displaying an effect according to the symbol combination that can be displayed. The slot machine has a main board for controlling the rotation and stop of the reels, an effect control board for controlling the effects displayed on the display means, a sound control board, and a lamp control board. Yes. Further, a power supply board for controlling the power supply of the slot machine and a payout control board for controlling the payout of medals are provided. The substrate according to the present invention can also be applied to these substrates in a slot machine.

  The parrot is a gaming machine that uses a game ball instead of a medal as a gaming value in the slot machine. The parrot includes a main board, an effect control board, an audio control board, and a lamp control board similar to the slot machine. The substrate according to the present invention can also be applied to these substrates in a parrot. In addition, the gaming machine of the present invention is not limited to a payout type gaming machine that pays out a predetermined number of gaming media as prizes based on the occurrence of winnings, but based on the occurrence of winning balls enclosing gaming media The present invention can also be applied to an enclosed game machine that gives a score.

DESCRIPTION OF SYMBOLS 1 ... Game machine 2 ... Game board 3 ... Gaming machine frame 4A, 4B ... Special symbol display device 5 ... Image display device 5L ... Decoration symbol display area 5C ... Decoration symbol display area 5R ... Decoration symbol display area 6A ... Ordinary winning ball Device 6B ... Normal variable winning ball device 11 ... Main board 12 ... Production control board 50 ... Print board 51 ... Pin hole 51A ... Normal pin hole 51B ... Ground pin hole 52 ... Wiring pattern 53 ... Resist 54A ... Pin 55 ... Land 61- 68: Solid ground non-formation range 71: Annular solid ground non-formation range

Claims (1)

A gaming machine comprising a substrate having a front surface solid ground formed on the front surface and a back surface solid ground formed on the back surface,
The surface includes a surface information description region in which information about the substrate is written,
The back surface includes a back surface information description area in which information about the substrate is written,
The surface information description region is provided in a region where the surface solid ground is not formed on the surface,
The back surface information describing region is provided in a region where the back surface solid ground is not formed on the back surface,
The back surface solid ground is formed on the back surface of the surface information description region ,
The solid ground for the front surface is formed on the back surface of the back surface information description area,
The front surface information describing region and the back surface information describing region are provided adjacent to each other in a positional relationship in the front and back direction,
The substrate is housed in a sealed substrate case,
A gaming machine characterized by that.