JP7451588B2 - gaming machine - Google Patents

Description

The present invention relates to a gaming machine.

As a gaming machine, a pachinko gaming machine is known, which is equipped with a gaming area in which game balls (gaming value) move, a firing device that shoots the gaming balls into the gaming area, and the like. A pachinko game machine includes a starting hole provided in a gaming area, and when entry of a game ball into the starting hole is detected, a special symbol lottery is performed. If the result of the special symbol lottery is a jackpot, the game state shifts to a special game state, and a plurality of special games are executed in the special game state. In each special game, the grand prize opening provided in the game area operates in an open state, and the game ball is paid out based on the entry of the game ball into the grand prize opening.

Furthermore, as a gaming machine, a slot machine is known which is equipped with a plurality of reels having a plurality of symbols arranged on the outer peripheral surface, a start lever, a stop button, and the like. In a slot machine, the reels start rotating based on a game start operation, and an internal lottery is performed using a lottery table. When each reel stops, the symbol combination corresponding to the winning combination won in the internal lottery is displayed, and when the winning combination wins, for example, medals (gaming value) are paid out as a process corresponding to the won winning combination. A medal payout process, a replay process that allows the player to play the game again without consuming new medals, etc. are performed.

2. Description of the Related Art Some gaming machines, such as slot machines and pachinko gaming machines, include a board on which various electronic components are arranged and a board case that houses the board (for example, see Patent Document 1).

Japanese Patent Application Publication No. 2018-102495

By the way, in gaming machines, it is required to suppress damage to patterns on the board.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a gaming machine that can suppress damage to the pattern on the board.

In order to achieve the above object, the gaming machine of the present invention has the following features:
comprising a substrate and a connector disposed on a first surface of the substrate,
The connector includes a positioning pin,
The substrate includes a non-conductive through hole into which the positioning pin is inserted,
The thickness of the substrate is greater than the amount of insertion of the positioning pin into the non-conductive through hole,
An annular insulating region is formed around the non-conductive through hole on the second surface of the substrate,
A first area indicating a position where a first display is provided is provided on the first surface of the substrate,
A second area surrounding a second display is provided on a second surface of the substrate,
The first region is formed by silk printing,
The second region is formed by etching,
The second region is provided at a position corresponding to the back side of the first region,
The second display is formed in a size that fits inside the first area.
Since the thickness of the substrate is larger than the amount of insertion of the positioning pin into the non-conductive through hole, it is possible to prevent the positioning pin from protruding from the substrate and adhering solder to the positioning pin. Further, it is possible to prevent damage to the positioning pin due to force being applied thereto.
Furthermore, even if the positioning pin is formed long and protrudes from the second surface of the board, there is a possibility that the positioning pin and the pattern (copper foil) will come into contact with each other because the insulating area is provided. is extremely low and can prevent damage to the pattern.
Further, the second area is provided at a position corresponding to the back side of the first area, and the second display is formed in a size that fits inside the first area. The first area has the function of indicating the position where the first display is provided, and also has the function of indicating the position where the second display is provided. Since the second area (the second display) exists on the back side of the first area, it is possible to reduce the time required to look at the second surface side and search for the second display. This makes it possible to improve the efficiency of inspection work (confirmation work). Further, since the second region is made smaller than the first region and the area to be etched is reduced to ensure a solid ground portion, the noise resistance of the substrate can be improved.

Furthermore, in the configuration of the present invention,
comprising a substrate, a first connector and a second connector arranged on a first surface of the substrate, and a case accommodating the substrate,
The first connector includes a positioning pin,
The substrate includes a non-conductive through hole into which the positioning pin is inserted,
The thickness of the substrate is greater than the amount of insertion of the positioning pin into the non-conductive through hole,
An annular insulating region is formed around the non-conductive through hole on the second surface of the substrate,
The board includes a first conductive through hole into which a predetermined terminal of the second connector is inserted, and a second conductive through hole into which a terminal of a component is not inserted,
A wiring pattern connecting the first conductive through hole and the second conductive through hole is formed on the second surface of the substrate,
The second conductive through hole is covered by the second connector.
Since the thickness of the substrate is larger than the amount of insertion of the positioning pin into the non-conductive through hole, it is possible to prevent the positioning pin from protruding from the substrate and adhering solder to the positioning pin. Further, it is possible to prevent damage to the positioning pin due to force being applied thereto.
Furthermore, even if the positioning pin is formed long and protrudes from the second surface of the board, there is a possibility that the positioning pin and the pattern (copper foil) will come into contact with each other because the insulating area is provided. is extremely low and can prevent damage to the pattern.
Further, the second conductive through hole is covered with a connector. Therefore, it is possible to make access to the second conductive through hole difficult, and improve anti-fraud performance.
Furthermore, in the configuration of the present invention,
comprising a substrate, a first connector and a second connector arranged on a first surface of the substrate, and a case accommodating the substrate,
The first connector includes a positioning pin,
The substrate includes a non-conductive through hole into which the positioning pin is inserted,
The thickness of the substrate is greater than the amount of insertion of the positioning pin into the non-conductive through hole,
An annular insulating region is formed around the non-conductive through hole on the second surface of the substrate,
The board includes a first conductive through hole into which a predetermined terminal of the second connector is inserted, and a second conductive through hole into which a terminal of a component is not inserted,
A wiring pattern connecting the first conductive through hole and the second conductive through hole is formed on the second surface of the substrate,
The case includes a connector opening that exposes the second connector,
A predetermined gap is formed between the second connector and the connector opening,
The second conductive through hole is formed at a position that is visible through the predetermined gap.
Since the thickness of the substrate is larger than the amount of insertion of the positioning pin into the non-conductive through hole, it is possible to prevent the positioning pin from protruding from the substrate and adhering solder to the positioning pin. Further, it is possible to prevent damage to the positioning pin due to force being applied thereto.
Furthermore, even if the positioning pin is formed long and protrudes from the second surface of the board, there is a possibility that the positioning pin and the pattern (copper foil) will come into contact with each other because the insulating area is provided. is extremely low and can prevent damage to the pattern.
Furthermore, since the second conductive through hole is formed at a position that is visible through the predetermined gap, the heat dissipation effect can be improved.

According to the present invention, damage to a pattern on a substrate can be suppressed.

1 is a perspective view showing an external configuration of an example of a gaming machine according to an embodiment of the present invention; FIG. It is a front view showing the external structure of the same game board. It is a front view showing the external configuration of the status display section in the same case. It is a block diagram showing a schematic configuration of the same gaming machine. It is a state transition diagram of the game state. It is a perspective view of the payout control board unit seen from the front side. It is a perspective view of the payout control board unit seen from the front side. FIG. 3 is a diagram for explaining a seal pasting area in the same embodiment. FIG. 6 is a diagram for explaining a sticker attached to the board case in the same embodiment. FIG. 4 is a diagram for explaining a mounting section for unmounted components during mass production. It is a figure which shows the external appearance of the main IC of the gaming machine based on 2nd Embodiment, Comprising: (a) is a figure seen from the top surface side, (b) is a figure seen from the short direction. . 3 is a diagram showing the socket, in which (a) is a view seen from the top side, (b) is a view seen from the lateral direction, and (c) is a view seen from the bottom side. . 3A and 3B are diagrams showing socket terminals, in which (a) is a diagram showing a socket terminal with an odd number of pin numbers, (b) is a diagram showing a socket terminal with an even number of pin numbers, and (c) is a diagram showing a socket terminal with an even number of pin numbers. It is a figure which shows the positional relationship of the socket terminal Q shown in (a) and (b) in the state hold|maintained by the main body. FIG. 2 is a plan view showing a through hole to which a terminal of the socket is connected. FIG. 6 is a diagram showing the relationship between a solder fillet and a gap formed between the mounting surface and the bottom surface of the socket in the same embodiment. 2 is a diagram for explaining the gap formed between the socket and the main IC or board, in which (a) is a view of the socket viewed from the top side, and (b) is a view of the socket viewed from the bottom side. This is a diagram seen from. 2 is a diagram for explaining the relationship between the gap formed between the socket and the main IC or the board and the ground pattern, in which (a) shows the socket, the main IC, and the board viewed from the longitudinal direction. FIG. 3B is a diagram of the socket, main IC, and board viewed from the top side. In the same figure, (a) is a diagram showing a connector, and (b) is a diagram showing a through hole into which a positioning pin is inserted. It is a figure which shows the socket based on the modification, Comprising: (a) is a figure seen from the bottom surface side, (b) is a sectional view seen from the longitudinal direction. It is a figure which looked at the payout control board of the game machine concerning a 3rd embodiment from the front side. It is a figure which looked at the payout control board concerning a modification from the front side. It is a diagram of the gaming machine seen from the back side. It is an exploded perspective view showing a payout control board unit of a gaming machine according to a fourth embodiment of the present invention. It is a schematic diagram showing the first surface of the same substrate. It is a schematic diagram showing the first surface of the same substrate. FIG. 3 is a perspective view of the board case viewed from the back side. FIG. 3 is a schematic diagram showing the second side of the same board, in which (a) shows a state in which a screw is not inserted into a through hole, and (b) shows a state in which a screw is inserted into a through hole. It is. It is a perspective view showing the part in which the recessed part is provided in the board case. FIG. 2 is a partially enlarged view showing the periphery of a predetermined through hole in the same substrate. FIG. 2 is a schematic cross-sectional view showing a state in which the board is fixed to the board case. It shows the parts arranged on the board of the gaming machine according to the fifth embodiment of the present invention, in which (a) shows the state before forming, and (b) shows the state after forming. be. Moreover, (c) shows a state in which the tip of the lead is bent after being placed on the substrate. It is a schematic diagram of a part of the board seen from the side, (a) shows the state before the lead of the first component is bent, and (b) shows the state after the lead of the first component is bent. It indicates the condition. 2 is a schematic diagram of a part of the board viewed from the normal direction of the board surface, (a) shows the state before the lead of the first component is bent, and (b) shows the state where the lead of the first component is bent. This shows the state after the FIG. 2 is a schematic diagram of a part of the substrate seen from the side. It is a schematic sectional view showing a payout control board unit of a game machine concerning a 6th embodiment of the present invention. It is a figure which shows a part of 1st surface of the payout control board of the gaming machine based on the 8th Embodiment of this invention. FIG. 3 is a diagram showing a specific IC. It is a figure which shows a part of 2nd surface of a payout control board in the same same. It is a diagram showing a part of the payout control board, in which (a) is a diagram showing a silk screen corresponding to a predetermined component on the first side, and (b) is a diagram showing a silk display corresponding to a predetermined component mounting position (on the second side). This is a diagram looking at the side). It is a figure which shows a part of 1st surface of the payout control board of the gaming machine based on the 9th Embodiment of this invention. It is a figure which shows a part of 2nd surface of a payout control board in the same same. It is a figure for explaining a modification of the same, and is a figure showing a part of the first surface of a payout control board. It is a perspective view of a gaming machine according to a tenth embodiment of the present invention, viewed from the rear side. It is a perspective view of the same as seen from the rear side, and is a diagram showing a state in which the back cover is removed. It is a side view of the parts arranged on the rear side of the gaming machine as seen from the left side, (a) is a diagram showing a state in which the back cover is attached, and (b) is a diagram showing a state in which the back cover is removed. It is a diagram. FIG. 6 is a diagram for explaining the positional relationship of components in the front-rear direction. It is a figure for demonstrating the positional relationship of components in the front-back direction regarding the same modification. FIG. 6 is a diagram for explaining the distance between the board surface and the case surface. This is an exploded perspective view of a ball return prevention mechanism, showing an example of a gaming machine according to an eleventh embodiment of the present invention. It is a front view of the ball return prevention mechanism when the ball return prevention member is in the closed state. It is a front view of the ball return prevention mechanism when the ball return prevention member is in an open state. It is a diagram showing how a game ball that has entered the game area is about to return to the boundary area when the ball return prevention member is in a state between the closed state and the open state. 53 is an enlarged view of the area surrounded by dotted lines shown in FIG. 52. FIG. 53 is an enlarged view of the area surrounded by dotted lines shown in FIG. 52. FIG. It is a diagram showing a state in which the game ball that has returned from the game area to the boundary area is colliding with the ball return prevention member.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. In this embodiment, a Pachinko game machine, which is one of the gaming machines, will be described, but other gaming machines may be used. In the following explanation, "front and rear" basically means that when a player is on the front side of the gaming machine, the player side is the "front" and the gaming machine side is the "rear", and "up and down" means that the player is on the front side of the gaming machine. The top side of the machine means "top", the bottom side means "bottom", and "left and right" means that the left hand side of the player playing the game machine means "left", and the right hand side means "right".

FIG. 1 is a perspective view showing the external configuration of a gaming machine according to this embodiment. The game machine of this embodiment is used to play games using game balls (game media) lent from a game parlor, and includes an outer frame 2 forming the outer surface of the game machine, and a frame 2 provided inside the game machine. , a game board 6 that forms a game area 4 in which game balls move, an inner frame 7 that holds the game board 6, a glass unit 8 that makes the game board 6 visible and inaccessible to players, and a glass unit. 8 is attached to the front frame 10. The inner frame 7 is attached to the outer frame 2 via a hinge mechanism so that it can be opened and closed. Further, the front frame 10 is attached to the inner frame 7 via a hinge mechanism so as to be openable and closable. The inner frame 7 (and the front frame 10) can be opened and closed between a closed position (closed state) in which the opening of the outer frame 2 is closed and an open position (open state) in which the opening of the outer frame 2 is opened. It has become.

The part of the front frame 10 that surrounds the glass unit 8 is made of a semi-transparent material that transmits light, and inside the part made of the semi-transparent material, there are lighting lights etc. to enliven the game. A plurality of front frame lamps 12 are provided. Further, speakers 14 (sound device) are provided on the left and right sides of the upper part and the left and right parts of the lower part of the front frame 10, which output sound effects to enliven the game.

At the center of the lower part of the front frame 10, an upper tray 16 for storing game balls is provided, and on the left side of the inner side of the upper tray 16, there is a tray for dispensing game balls from the gaming machine to the player. A payout port 18 is provided. Further, a grip unit 20 is provided on the lower right side of the front frame 10, and when the player performs an operation to rotate the grip unit 20 clockwise toward the gaming machine, the illustration provided inside the gaming machine A firing device that does not operate is activated to fire game balls into the game area 4. The firing device of this embodiment can fire 99 game balls per minute (1.65 balls per second).

A supply port 22 for supplying game balls from the upper tray 16 to the firing device is provided on the right side of the inner side surface of the upper tray 16. Further, below the upper tray 16, a lower tray 24 is provided for storing surplus game balls when the upper tray 16 cannot store all the game balls.

Further, a performance button 26 (performance operation means) is provided on the near side of the edge of the upper tray 16, and when the player operates the performance button 26, the performance performed on the gaming machine changes.

FIG. 2 is a front view showing the external configuration of the game board 6 shown in FIG. 1. As shown in FIG. 2, the game board 6 is provided with a circular outer rail 28, and the area surrounded by the outer rail 28 is the game area 4 in which the game balls move. Further, at the left end of the game area 4, an inner rail 30 is provided in an arc shape along the outer rail 28, and the outer rail 28 and the inner rail 30 are arranged below the game board 6 (not shown). A game ball fired from a firing device is guided to a game area 4.

In the center of the game board 6, there is provided an effect unit 36 that includes a liquid crystal display 32 (effect display device) that displays effect images to enliven the game, and a display frame 34 formed to surround the liquid crystal display 32. It is being The display frame 34 is provided with a display frame lamp 38 above the center of the liquid crystal display 32 for outputting lighting for enhancing the game.

In this embodiment, the game ball cannot pass through the front side of the liquid crystal display 32, and the game ball fired from the firing device falls through either the left side game area 4a or the right side game area 4b of the liquid crystal display 32. It is supposed to be done. In addition, in the game area 4, a large number of game nails (not shown) are nailed to cross the surface of the game board 6, so that the moving direction of the game ball moving in the game area 4 changes randomly. There is.

Further, an opening 40 is formed on the left side of the display frame 34, through which a game ball falling through the game area 4a on the left side of the liquid crystal display 32 can pass. The liquid crystal display 32 is configured to pass through a passage 42 and fall onto a stage 44 provided below the liquid crystal display 32. The upper surface of this stage 44 is a smooth curved surface, and a gap is formed between the stage 44 and the glass unit 8 so that the game ball can fall downward from the stage 44, and fall onto the stage 44 from the passage 42. After the game ball moves back and forth from side to side on the stage 44, it falls downward from near the center of the stage 44.

A first starting opening 46 is provided below the center of the stage 44, into which a game ball that has fallen downward from near the center of the stage 44 can enter. Further, in the first starting port 46, a first starting port switch 100 (see FIG. 4) for detecting a game ball that has entered the first starting port 46 is disposed. When the first starting port switch 100 detects a game ball (entering the first starting port 46), it outputs a detection signal to the main control board 200. Further, the main control board 200 executes a first special symbol lottery as a special symbol lottery based on the input of the detection signal from the first starting port switch 100. Further, the main control board 200 causes the payout device 130 to pay out prize balls based on the input of the detection signal from the first starting port switch 100. Furthermore, the game balls that have entered the first starting port 46 are collected inside the gaming machine.

To the left of the first starting opening 46 in the gaming area 4, a plurality (three) of general winning openings 47 (upper left general winning opening 47a, middle left general winning opening 47b, and lower left general winning opening 47c) are provided. . In addition, the game board 6 is provided with a general winning port switch 101 (see FIG. 4) that detects game balls that have entered the upper left general winning port 47a, the middle left general winning port 47b, or the lower left general winning port 47c. There is. When the general winning hole switch 101 detects a game ball (entering the game ball into the upper left general winning hole 47a, the middle left general winning hole 47b, or the lower left general winning hole 47c), it sends a detection signal to the main control board 200. Output. Further, the main control board 200 causes the payout device 130 to execute the payout operation of prize balls based on the input of the detection signal from the general winning a prize opening switch 101. In addition, the general winning opening switch 101 may be provided one each for each of the upper left general winning opening 47a, the middle left general winning opening 47b, and the lower left general winning opening 47c. Only one may be provided for each. Further, in addition to the upper left general winning hole 47a, the middle left general winning hole 47b, and the lower left general winning hole 47c, a general winning hole 47 and a general winning hole switch corresponding to the general winning hole may be provided.

Further, in the game area 4b on the right side of the liquid crystal display 32, there is provided a passage gate 48 through which game balls pass through without being collected inside the game machine. Furthermore, a gate switch 102 (see FIG. 4) is disposed within the passage gate 48 to detect that a game ball has passed. The gate switch 102 outputs a detection signal to the main control board 200 when detecting a game ball (passage of the game ball through the passage gate 48). Further, the main control board 200 executes a normal symbol lottery to determine whether or not a normal hit is correct based on the input of the detection signal from the gate switch 102.

Further, in the game area 4b on the right side of the liquid crystal display 32, a second starting port 49 is provided below the passage gate 48. Further, in the second starting port 49, a second starting port switch 103 (see FIG. 4) for detecting a game ball that has entered the second starting port 49 is arranged. The second starting port switch 103 outputs a detection signal to the main control board 200 when detecting a game ball (entering the game ball into the second starting port 49). Further, the main control board 200 executes a second special symbol lottery as a special symbol lottery based on the input of the detection signal from the second starting port switch 103. Further, the main control board 200 causes the payout device 130 to pay out prize balls based on the input of the detection signal from the second starting port switch 103. Furthermore, the game balls that have entered the second starting port 49 are collected inside the gaming machine.

The second starting port 49 has a reduced state in which it is difficult for game balls to enter the second starting port 49 (a state in which entry is not assisted/non-assistant state) and an enlarged state in which a game ball is easy to enter (a state in which entry is assisted/auxiliary state). A common accessory 54 (auxiliary means) that can operate between the state and the state) is provided. The normal accessory 54 has a built-in driving device such as a solenoid, and is controlled to be in an enlarged state under predetermined conditions when a normal win is won in the normal symbol lottery.

In addition, a big prize opening 50 is provided in the gaming area 4b on the right side of the liquid crystal display 32. Further, a count switch 104 (see FIG. 4) for detecting game balls that have entered the big winning hole 50 is arranged in the big winning hole 50. The count switch 104 outputs a detection signal to the main control board 200 when detecting a game ball (entering the game ball into the big prize opening 50). Further, the main control board 200 causes the payout device 130 to perform a payout operation of prize balls based on the input of the detection signal from the count switch 104. Further, the main control board 200 counts the number of game balls that have entered the big prize opening 50 based on the input of the detection signal from the count switch 104. Furthermore, the game balls that have entered the big prize opening 50 are collected inside the gaming machine.

The grand prize opening 50 has two states: a closed state (second state, no entry state) in which the game ball cannot enter the big winning port 50 and an open state (first state, entry possible state) in which the game ball can enter. A special accessory 56 that can be operated between the two is provided. The special accessory 56 has a built-in drive device such as a solenoid, and is opened under predetermined conditions in a special game state that starts when a jackpot is won in a special symbol lottery (first special symbol lottery or second special symbol lottery). It is controlled to become the state.

Further, at the bottom of the gaming area 4, an out port 62 is provided to collect game balls that have fallen from the gaming area 4 without entering any of the winning holes 46, 47, 49, and 50 into the gaming machine. There is. Here, a discharge path (not shown) is provided inside the gaming machine, through which game balls collected (discharged) from the gaming area 4 pass. This gaming machine is configured so that all the game balls launched into the game area 4 (all the game balls collected from the game area 4) pass through the discharge path. That is, the game ball launched into the game area 4 is collected from the game area 4 and flows into the discharge path by entering the winning hole 46, 47, 49, 50 or passing through the out hole 62. Specifically, the game ball that entered each winning hole 46, 47, 49, 50 is guided to the discharge path after being detected by the switch 100, 101, 103, 104 arranged in the winning hole. . Moreover, the game balls collected from the out port 62 are guided to the discharge path. Further, an out switch 106 (see FIG. 4) is provided in the discharge path. The out switch 106 outputs a detection signal to the main control board 200 when detecting a game ball passing through the discharge path (discharge of the game ball from the game area 4). Further, the main control board 200 counts the number of game balls ejected from the game area 4 based on the input of the detection signal from the out switch 106.

The game ball launching device is configured so that the ejection force of the game ball is changed by adjusting the amount of rotation of the grip unit 20 shown in FIG. 1. When the amount of rotation of the grip unit 20 is small, the liquid crystal The game ball is fired so that it falls down the game area 4a on the left side of the display 32, and when the amount of rotation of the grip unit 20 is large, the game ball falls down the game area 4b on the right side of the liquid crystal display 32. A game ball is fired.

Therefore, the player adjusts the amount of rotation of the grip unit 20 according to the gaming situation, and allows the game ball to fall down the left side game area 4a or pass through the opening 40, passage 42 and stage 44 to the first starting opening. 46 to win a prize (left-handed hit), the game ball to fall down the right side game area 4b and pass through the passage gate 48, or the game ball to the second starting port 49. The game ball is fired so that the ball wins or the game ball enters the big prize opening 50 (right-handed hit).

In addition, in the game machine of this embodiment, when the game ball falls through the left side game area 4a, the game ball does not pass through the passage gate 48, and the game ball enters the second starting port 49 and the big winning port 50. The ball does not enter the ball (win). In addition, when the game ball falls down the right side game area 4b, the game ball will not win in the first starting port 46, the upper left general winning hole 47a, the middle left general winning hole 47b, and the lower left general winning hole 47c. It looks like this.

At the lower right portion of the game board 6 and outside the game area 4, a status display section 70 is provided that indicates various statuses of the game machine by lighting and extinguishing lamps or the like.

FIG. 3 is a front view showing the external configuration of the status display section 70. As shown in FIG. 3, the status display section 70 includes a normal symbol display section 72, a normal reservation display section 74, a first special symbol display section 76, a first special reservation display section 78, a second special symbol display section 80, and a first special symbol display section 78. 2, a special reservation display section 82 and a game status display section 84 are provided.

The normal symbol display section 72 is composed of two lamps, and when a normal symbol lottery is performed, the normal symbol is displayed in a variable manner by blinking the two lamps, and the normal symbol is displayed by lighting or extinguishing the two lamps. The display is stopped and the result of the normal symbol lottery is displayed.

The normal hold display section 74 is composed of two lamps, and is used to obtain random numbers for drawing normal symbols when the normal symbols are already being displayed in a variable or stopped manner at the time the game ball passes through the passage gate 48. If the random number value for the normal symbol lottery is suspended due to the inability to perform the regular symbol lottery even if the regular symbol lottery is not possible, the normal pending number corresponding to the number of the reserved random value for the regular symbol lottery is displayed. The number of normal reservations from 0 to 4 is displayed by a combination of turning on, turning off, or blinking two lamps.

The first special symbol display section 76 is composed of a 7-segment display, and when a first special symbol lottery is performed by a game ball entering the first starting port 46, the first special symbol display section 76 flashes the 7-segment display to display the first The special symbols are variably displayed, the 7-segment display is turned on in one of a plurality of modes, the first special symbol is stopped and displayed, and the result of the first special symbol lottery is displayed.

The first special reservation display section 78 is composed of two lamps, and when the game ball enters the first starting port 46, the first special symbol or the second special symbol is already in a variable display or a stopped display. etc., when the random number for the special symbol drawing is held as the first special random number because the special symbol drawing cannot be performed even if the random number for the special symbol drawing (lottery information) is obtained. The first special reservation number corresponding to the number of the first special random number is displayed, and the first special reservation number of 0 to 4 is displayed by a combination of lighting, extinguishing, or blinking two lamps. .

The second special symbol display unit 80 is composed of a 7-segment display, and when a second special symbol lottery is performed by a game ball entering the second starting port 49, the second special symbol display unit 80 blinks the 7-segment display to display the second The special symbols are variably displayed, the 7-segment display is turned on in one of a plurality of modes, the second special symbol is stopped and displayed, and the result of the second special symbol lottery is displayed.

The second special reservation display section 82 is composed of two lamps, and when the game ball enters the second starting port 49, the first special symbol or the second special symbol is already in a variable display or a stopped display. etc., when the random value for the special symbol lottery is held as the second special random value because the special symbol lottery cannot be performed even if the random value for the special symbol lottery is acquired, the suspended second special random value The second special reservation number corresponding to the number of numerical values is displayed, and the second special reservation number of 0 to 4 is displayed by a combination of lighting, extinguishing, or blinking two lamps.

The game state display section 84 is composed of six lamps, and displays the type of game state currently set by a combination of turning on, turning off, or blinking the six lamps. In this embodiment, there are a normal state (low probability state), a variable probability state (high probability state/special state) in which the probability of winning the jackpot is set higher than the normal state, and a state that starts when a jackpot is won in a special symbol lottery. Four types of gaming states can be set: a special gaming state, and a time-saving state (special state) that shortens the fluctuation time of the first special symbol or the second special symbol and frequently provides an opportunity to execute the special symbol lottery. Which gaming state is set is displayed by a combination of turning on, turning off, or blinking the six lamps.

FIG. 4 is a functional block diagram of the gaming machine of this embodiment. The gaming machine of this embodiment is controlled by a control board including a main control board 200 (main control means) and a sub-control board 202 (sub-control means). The functions of each board such as the main control board 200 and the sub-control board 202 are controlled by various processors (CPU, DSP, etc.), ASIC (gate array, etc.), ROM (an example of an information storage medium), or hardware such as RAM. This is realized by software consisting of a given program stored in advance in a ROM or the like.

The main control board 200 controls the progress of the game. The main control board 200 receives input signals from input means such as the first starting port switch 100, the general prize winning port switch 101, the gate switch 102, the second starting port switch 103, the count switch 104, or the out switch 106, and Various calculations are performed to perform the above operations, and based on the calculation results, the operation of output means such as the status display section 70, the ordinary accessory 54, the special accessory 56, or the payout device 130 is controlled.

The sub-control board 202 controls execution of the performance based on information transmitted from the main control board 200. The sub-control board 202 receives signals sent from the main control board 200 and input signals from the performance button switch 150 that detects the operation of the performance button 26, and executes a performance according to the progress of the game. Various calculations are performed, and based on the calculation results, the operation of performance devices such as the liquid crystal display 32, lighting device, speaker 14, performance drive device, etc. is controlled.

The main control board 200 includes a random number generation means 210, a normal symbol lottery means 220, a normal display control means 222, a normal accessory control means 224, a special symbol lottery means 230, a special display control means 240, a game state transition control means 250, and a special It is configured to include a game execution means 260, a payout instruction means 270, a communication control means 280, and a main memory 290.

The random number generation means 210 is a means for generating random numbers for lottery, and is realized by a random number generator that generates hardware random numbers or a program that generates software random numbers. The software random number can be generated, for example, based on the count value of an increment counter (a counter that counts numerical values so as to cycle through a predetermined count range). In addition, in this embodiment, "random value" includes not only a value that occurs randomly in a mathematical sense, but also a value that occurs regularly even if the generation itself is regular, because the timing of acquisition etc. is irregular. It also includes values that can function as random numbers.

The normal symbol lottery means 220 obtains a random number value for the normal symbol lottery from the random number generating means 210 based on the input of the detection signal from the gate switch 102 that detects game balls passing through the passage gate 48 one by one. A normal symbol lottery is performed to determine the propriety of a normal win, etc. with respect to the random numbers for the normal symbol lottery which are stored in the normal random number storage means 2912 of the main memory 290 and read from the normal random number storage means 2912. Specifically, the normal symbol lottery means 220 performs a normal winning determination process as a normal symbol lottery.

The normal win determination process is a process for determining whether or not the normal win is correct. In the normal winning determination process, the normal symbol lottery means 220 performs the random number determination process by referring to any of the plurality of normal symbol lottery tables stored in the lottery table storage means 2910 of the main memory 290. Choose whether to do so depending on the gaming state. Here, in each normal symbol lottery table, a normal win or a loss is associated with each of the 100 random numbers for the regular symbol lottery from 0 to 99. Then, the normal symbol lottery means 220 refers to the selected normal symbol lottery table and determines whether the one random number value for the normal symbol lottery read from the ordinary random number storage means 2912 is associated with a normal win. By doing so, it is determined whether or not the winning ticket has been won. Then, the normal symbol lottery means 220 sets the normal winning flag to ON in the flag storage means 2916 of the main memory 290 when the normal winning is won, and when the normal winning is won, the normal winning flag is set to ON state. The winning flag of is set to OFF state.

In addition, the normal symbol lottery table selected when the gaming state is variable probability state or time saving state is more likely to win a regular hit than the normal symbol lottery table selected when the gaming state is neither variable probability state nor time saving state. The probability is set high. In other words, a normal symbol lottery that is held when the gaming state is a variable probability state or a time saving state has a higher probability of winning a regular hit than a normal symbol lottery that is carried out when the gaming state is neither a variable probability state nor a time saving state. It has become.

The normal display control means 222 is a means for controlling the display of the status display section 70 based on the lottery result of the normal symbol lottery, and performs a normal symbol display control process and a normal pending display control process.

In the normal symbol display control process, the normal display control means 222 displays the normal symbols in a variable manner by blinking the two lamps of the normal symbol display section 72 until a predetermined variable time elapses, and in the normal win determination process, Depending on whether or not a hit has been won, the two lamps in the normal symbol display section 72 are turned on or off to stop displaying the normal symbols, thereby displaying the result of the normal symbol lottery on the normal symbol display section 72. .

Specifically, in this embodiment, if the gaming state at the time when the normal symbol lottery is performed is neither a fixed variable state nor a time saving state, the normal symbol variation time is set to 20 seconds, and the normal symbol lottery is performed. If the gaming state at the time of the change is a variable probability state or a time saving state, the fluctuation time of the normal symbol is set to 1 second, and if the gaming state is a variable probability state or a time saving state, it is better. , the opportunity to execute the regular symbol lottery has come frequently.

In the normal hold display control process, the normal display control means 222 turns on or off the two lamps of the normal hold display section 74 according to the number of random numbers for normal symbol lottery stored in the normal random number storage means 2912. Depending on the combination of blinking, a normal pending number of 0 to 4 is displayed.

The ordinary accessory control means 224 is a means for controlling the ordinary accessory 54 based on the lottery result of the ordinary symbol lottery. When the gaming state is neither a probability change state nor a time saving state, the normal accessory control means 224 is triggered by the fact that the normal symbols are stopped and displayed in a manner indicating a normal winning, and the normal accessory control means 224 controls the normal accessory control unit 224 to play the normal game until 0.1 seconds have elapsed. Control is performed to operate the normal accessory 54 so that the accessory 54 returns to the reduced state after being in the enlarged state. In addition, when the gaming state is a variable probability state or a time saving state, the normal accessory control means 224 controls the normal accessory until 20 seconds have elapsed when the normal symbols are stopped and displayed in a manner indicating a normal winning. Control is performed to operate the normal accessory 54 so that the accessory 54 returns to the reduced state after being in the enlarged state.

Therefore, in the case of a normal win in the normal symbol lottery, if the gaming state is neither a probability change state nor a time saving state, the normal accessory 54 is set so that the ease of entry of the game ball into the second starting port 49 will hardly increase. However, if the game state is a variable probability state or a time saving state, the normal accessory 54 operates so that the ease of entry of the game ball into the second starting port 49 increases.

The special symbol lottery means 230 selects a special symbol lottery from the random number generating means 210 based on a detection signal inputted from the first starting port switch 100 that detects game balls entering the first starting port 46 one by one. A random number value is obtained and stored in the special random number storage means 2914 of the main memory 290 as a first special random number value. Further, the special symbol lottery means 230 receives a special symbol from the random number generating means 210 based on a detection signal input from the second starting port switch 103 that detects game balls entering the second starting port 49 one by one. A random number value for lottery is acquired and stored in the special random number storage means 2914 as a second special random number value. Then, the special symbol lottery means 230 uses the first special random number value or the second special random value read from the special random number storage means 2914 to perform a special symbol lottery to determine whether the jackpot is a hit or not. Specifically, the special symbol lottery means 230 performs a jackpot determination process, a symbol determination process, etc. as a special symbol lottery.

The jackpot determining process is a process of reading out one jackpot deciding random number included in the first special random number or second special random number stored in the special random number storage means 2914 and deciding whether or not the jackpot is correct. Here, one jackpot determination random value is obtained from 65536 jackpot determination random values from 0 to 65535 based on a detection signal being input from the first starting port switch 100 or the second starting port switch 103. , which is stored in the special random number storage means 2914 as a first special random number value or a second special random number value.

In the jackpot determination process, the special symbol lottery means 230 determines which of the plurality of jackpot lottery tables stored in the lottery table storage means 2910 of the main memory 290 should be referred to in the random number determination process, depending on the gaming state. and select. Here, in each jackpot lottery table, a jackpot or a loss is associated with each of 65,536 jackpot determination random numbers from 0 to 65,535. Then, the special symbol lottery means 230 refers to the selected jackpot lottery table and determines whether or not the read one jackpot determination random value is associated with a jackpot, thereby determining whether or not a jackpot has been won. Determine. In addition, when the special symbol lottery means 230 wins the jackpot, it sets the jackpot winning flag in the flag storage means 2916 to the ON state, and when it is a loss, sets the jackpot winning flag to the OFF state. set

Furthermore, the jackpot lottery table that is selected when the gaming state is variable probability is set to have a higher probability of winning the jackpot than the jackpot lottery table that is selected when the gaming state is normal or time saving. There is. In other words, the jackpot determination process (special symbol lottery) performed when the gaming state is variable probability state has a higher probability of winning the jackpot than the jackpot determination processing (special symbol lottery) performed when the gaming state is normal or time saving state. The probability of winning is high.

The symbol determination process is a process that is performed when a jackpot is won in the jackpot determination process, and one symbol determination random number included in the first special random number value or the second special random number value stored in the special random number storage means 2914 is performed. This is a process of reading out a numerical value and deciding which of the 16 round probability variable symbols, 4 round probability variable symbols, 16 round regular symbols, and 4 round regular symbols to use as the jackpot symbol (type of jackpot). Here, one symbol determination random value is obtained from 100 symbol determination random values from 0 to 99 based on a detection signal being input from the first starting port switch 100 or the second starting port switch 103, This is stored in the special random number storage means 2914 as a first special random number value or a second special random number value.

In the symbol determination process, the special symbol lottery means 230 determines which of the plurality of symbol lottery tables stored in the lottery table storage means 2910 should be referred to in the random number determination process, using the read one symbol determination random number. The selection is made depending on whether the numerical value is stored as the first special random number or the second special random number. Here, in each symbol lottery table, for each of the 100 symbol determination random values from 0 to 99, one of the 16 round probability variable symbols, the 4 round probability variable symbols, the 16 round regular symbols, and the 4 round regular symbols corresponds. It was attached. Then, the special symbol lottery means 230 refers to the selected symbol lottery table and determines which of the plurality of types of jackpot symbols the read one symbol determination random value is associated with. It is determined which of the jackpot symbols has won. Further, the special symbol lottery means 230 sets the winning flag corresponding to the winning jackpot symbol to the ON state in the flag storage means 2916.

The special display control means 240 is a means for controlling the display of the status display section 70 based on the lottery result of the special symbol lottery, and includes a first special symbol display control process, a second special symbol display control process, and a first special reservation. Display control processing and second special hold display control processing are performed.

The first special symbol display control process is a process performed when the first special random number value is read from the special random number storage means 2914 and a special symbol lottery is performed, and the special display control means 240 controls the predetermined variation. After the first special symbol is variably displayed by blinking the 7-segment display of the first special symbol display section 76 until time elapses, the 7-segment display of the first special symbol display section 76 is turned on in a predetermined manner. By doing so, the first special symbol is stopped and displayed.

In this embodiment, the display mode of the 7-segment display is predetermined corresponding to each of the four types of jackpot symbols and the loss, and the special display control means 240 determines whether or not the jackpot has been won in the jackpot determination process. If the jackpot is won in the jackpot determination process, the 7-segment display of the first special symbol display section 76 is turned on in a manner that corresponds to the jackpot symbol determined in the symbol determination process. The special symbols are stopped and displayed, and the results of the special symbol lottery are displayed on the first special symbol display section 76.

The second special symbol display control process is a process that is performed when the second special random number value is read from the special random number storage means 2914 and a special symbol lottery is performed, and the special display control means 240 controls the predetermined variation. After the second special symbol is variably displayed by blinking the 7-segment display of the second special symbol display section 80 until the time elapses, the 7-segment display of the second special symbol display section 80 is turned on in a predetermined manner. By doing so, the second special symbol is stopped and displayed.

Then, the special display control means 240 displays a mode according to whether or not a jackpot has been won in the jackpot determination process, and a mode according to the jackpot symbol determined in the symbol determination process when a jackpot has been won in the jackpot determination process. Then, by lighting up the 7-segment display of the second special symbol display section 80, the second special symbol is stopped and displayed, and the result of the special symbol lottery is displayed on the second special symbol display section 80.

In the first special hold display control process, the special display control means 240 turns on the two lamps of the first special hold display section 78 according to the number of first special random numbers stored in the special random number storage means 2914. Alternatively, the first special reservation number of 0 to 4 is displayed by a combination of turning off or blinking.

In the second special hold display control process, the special display control means 240 turns on the two lamps of the second special hold display section 82 according to the number of second special random numbers stored in the special random number storage means 2914. Alternatively, a second special reservation number of 0 to 4 is displayed by a combination of turning off or blinking.

As shown in FIG. 5, the gaming state transition control means 250 performs a gaming state transition control process of shifting the gaming state between a normal state, a special gaming state, a variable probability state, and a time saving state based on the establishment of a predetermined transition condition. I do. As the gaming state transition condition, one condition or a plurality of conditions may be determined. If multiple conditions are defined, the gaming state is determined based on the fulfillment of one of the multiple predefined conditions, or the fulfillment of all of the multiple predefined conditions. It is possible to move to another gaming state.

The normal state is a gaming state corresponding to an initial state among a plurality of types of gaming states, and it is possible to shift from the normal state to a special gaming state. In the normal state, a normal symbol lottery is performed by referring to a regular symbol lottery table in which the probability of winning a regular hit is set to approximately 1/20, and a lottery table in which the probability of winning a jackpot is set to 1/319 is selected. With reference to this, a special symbol lottery is performed.

In the normal state, the probability of winning a normal win in the normal symbol lottery is as low as about 1/20, and the fluctuation time of the normal symbols is set to be long, so that the period during which the normal accessory 54 is in the enlarged state is 0. Since the time is as short as 1 second, it is difficult to enter the game ball into the second starting port 49.

The special game state is started based on winning a jackpot in the special symbol lottery in the normal state, variable probability state, or time saving state, and the special game is played for a predetermined number of rounds (number of executions) according to the type of jackpot symbol. Executes and exits.

Specifically, when the special game state is started based on the winning flag of the 16 round variable probability symbol being set to ON state in the special symbol lottery, the special game of 16 rounds from the 1st round to the 16th round is started. The special game state ends on condition that the game is executed.

In addition, when the special game state is started based on the winning flag of the 4-round probability variable symbol being set to ON state in the special symbol lottery, 4 rounds of special games from the 1st round to the 4th round are executed. On this condition, the special game state ends.

In addition, when the special game state is started based on the winning flag of the 16th round normal symbol being set to the ON state in the special symbol lottery, 16 rounds of special games from the 1st round to the 16th round are executed. On this condition, the special game state ends.

In addition, when the special game state is started based on the winning flag of the 4th round normal symbol being set to the ON state in the special symbol lottery, 4 rounds of special games from the 1st round to the 4th round are executed. On this condition, the special game state ends.

The variable probability state is triggered by the end of the special gaming state that was started based on the winning flag of the 16 round variable probability symbol or the 4 round variable probability symbol (probable variable symbol) being set to the ON state, and the variable probability state is started. It is possible to shift to a special gaming state or a normal state. In addition, in the variable probability state, a normal symbol lottery is performed with reference to a normal symbol lottery table in which the probability of winning a regular hit is set to approximately 19/20, and a jackpot lottery table in which the probability of winning a jackpot is set to 1/31. This is more advantageous to the player than in the normal state in that the special symbol lottery is carried out with reference to the drawings. Then, the variable probability state ends on the condition that the number of times the special symbol lottery is performed in the variable probability state reaches 9999 times, and the state is shifted to the normal state.

Specifically, when the special gaming state ends, the gaming state transition control means 250 writes a value (for example, 9999) corresponding to a predetermined number of games (for example, 9999 times) into the variable probability end determination counter 2930 of the main memory 290. Each time a special symbol lottery is performed in a variable probability state, a decrement update is performed to subtract a value (for example, 1) corresponding to the number of games played once from the stored value of the variable probability end determination counter 2930. Then, when the stored value of the variable probability end determination counter 2930 reaches a threshold value (for example, 0), the variable probability state is ended and the normal state is started. However, in the variable probability state, the probability of winning the jackpot in the special symbol drawing is set to 1/31, so the special gaming state will start before the number of special symbol drawings in the variable probability state reaches 9999, and There is almost no transition from the normal state to the normal state.

In addition, in the probability variable state, the probability of winning a normal win in the normal symbol lottery is as high as about 19/20, and the variation time of the normal symbol is as short as 1 second, and the period in which the normal accessory 54 is in the expanded state is 20 seconds. Since it is longer, it is advantageous for the player in that it is easier to enter the game ball into the second starting port 49 than in the normal state.

In addition, in the variable probability state, a shorter variation time is often set as the variation time of the first special symbol or the second special symbol regardless of the number of reservations, so the opportunity to execute the special symbol lottery is more frequent than in the normal state. It is expected to arrive in

The time saving state starts when the special gaming state that was started based on the winning flag of the 16th round normal symbol or the 4th round normal symbol being set to the ON state ends, and from the time saving state, the special gaming state Or it is possible to transition to normal state. In addition, in the time saving state, the normal symbol lottery is performed by referring to the normal symbol lottery table in which the probability of winning a normal hit is set to approximately 19/20, as in the variable probability state, but the probability of winning the jackpot is the same as in the normal state. This is more disadvantageous to the player than the variable probability state in that the special symbol lottery is performed with reference to a jackpot lottery table in which the ratio is set to about 1/319. Then, the time saving state ends on the condition that the number of times the special symbol lottery has been performed in the time saving state reaches 100, and the state shifts to the normal state.

Specifically, the gaming state transition control means 250, triggered by the gaming state being shifted to the time saving state, sets the time saving end determination counter 2932 in the main memory 290 to a value corresponding to a predetermined number of games (for example, 100 times). A value (for example, 100) is written, and a decrement update is performed in which a value (for example, 1) corresponding to one game count is subtracted from the stored value of the time-saving end determination counter 2932 every time a special symbol lottery is performed in the time-saving state. . When the stored value of the time-saving end determination counter 2932 reaches a threshold value (for example, 0), the time-saving state is ended.

In addition, in the short time state, as in the variable probability state, the probability of winning a normal win in the normal symbol lottery is as high as about 19/20, and the variation time of the normal symbol is as short as 1 second, and the normal accessory 54 is in the expanded state. Since the period during which the game occurs is as long as 20 seconds, it is advantageous for the player in that it is easier to enter the game ball into the second starting port 49 than in the normal state.

In addition, in the short time state, similar to the variable probability state, a shorter fluctuation time is often set as the fluctuation time of the first special symbol or the second special symbol regardless of the number of reservations, so the special symbol Opportunities to conduct a lottery are becoming more frequent.

The special game execution means 260 is means for executing a special game based on the lottery result of the special symbol lottery, and performs special game execution processing 1 to special game execution processing 4 and the like.

The special game execution process 1 is executed based on the fact that the 16-round variable probability symbol is won in the special symbol lottery, and the special game execution means 260 sets the predetermined number of rounds for the 16-round variable probability symbol as the upper limit of the round counter 2933. A value (for example, 16) corresponding to 16 times is set, and each time the special accessory 56 completes its operation in a predetermined manner in each round, the number of rounds for one round is added to the stored value of the round counter 2933. Incremental update is performed to add a value (for example, 1) corresponding to . Then, when the stored value of the round counter 2933 reaches the upper limit value (for example, 16), the special gaming state ends.

Specifically, in the special game execution process 1, in the special game of each round from the 1st round to the 16th round, the open timer 2934 counts 29 seconds after the special accessory 56 becomes open, or When the switch 104 detects the entry of one game ball, a value (for example, 1) corresponding to one game ball is added. When the value of the big winning number counter 2936 reaches the upper limit value (for example, 10) The drive control of the special accessory object 56 is performed so that the special accessory object 56 is in a closed state. Then, "1" is added to the value of the round counter 2933, assuming that the end condition for one round is satisfied.

The special game execution process 2 is executed based on the fact that the 4-round variable probability symbol is won in the special symbol lottery, and the special game execution means 260 sets the predetermined number of rounds for the 4-round variable probability symbol as the upper limit of the round counter 2933. A value (for example, 4) corresponding to four times is set, and each time the special accessory 56 completes its operation in a predetermined manner in each round, the number of rounds for one time is added to the stored value of the round counter 2933. Incremental update is performed to add a value (for example, 1) corresponding to . Then, when the stored value of the round counter 2933 reaches the upper limit value (for example, 4), the special gaming state ends.

Specifically, in the special game execution processing 2, in the special game of each round from the first round to the fourth round, the open timer 2934 counts 29 seconds after the special accessory 56 becomes open, or When the value of the winning number counter 2936 reaches the upper limit value (for example, 10), the drive control of the special accessory object 56 is performed so that the special accessory object 56 is in a closed state. Then, "1" is added to the value of the round counter 2933, assuming that the condition for ending one round is satisfied.

The special game execution process 3 is executed based on the fact that the 16th round normal symbol is won in the special symbol lottery, and the special game execution means 260 sets the predetermined number of rounds for the 16th round variable probability symbol as the upper limit of the round counter 2933. A value (for example, 16) corresponding to 16 times is set, and each time the special accessory 56 completes its operation in a predetermined manner in each round, the number of rounds for one round is added to the stored value of the round counter 2933. Incremental update is performed to add a value (for example, 1) corresponding to . Then, when the stored value of the round counter 2933 reaches the upper limit value (for example, 16), the special gaming state ends.

Specifically, in the special game execution process 3, in the special game of each round from the 1st round to the 16th round, the open timer 2934 counts 29 seconds after the special accessory 56 becomes open, or When the value of the winning number counter 2936 reaches the upper limit value (for example, 10), the drive control of the special accessory object 56 is performed so that the special accessory object 56 is in a closed state. Then, "1" is added to the value of the round counter 2933, assuming that the end condition for one round is satisfied.

The special game execution process 4 is executed based on the fact that the 4th round normal symbol is won in the special symbol lottery, and the special game execution means 260 sets the predetermined number of rounds for the 4th round regular symbol as the upper limit of the round counter 2933. A value (for example, 4) corresponding to four times is set, and each time the special accessory 56 completes its operation in a predetermined manner in each round, the number of rounds for one time is added to the stored value of the round counter 2933. Incremental update is performed to add a value (for example, 1) corresponding to . Then, when the stored value of the round counter 2933 reaches the upper limit value (for example, 4), the special gaming state ends.

Specifically, in the special game execution process 4, in the special game of each round from the first round to the fourth round, the open timer 2934 counts 29 seconds after the special accessory 56 becomes open, or When the value of the winning number counter 2936 reaches the upper limit value (for example, 10), the drive control of the special accessory object 56 is performed so that the special accessory object 56 is in a closed state. Then, "1" is added to the value of the round counter 2933, assuming that the end condition for one round is satisfied.

The payout instruction means 270 receives a detection signal from the first starting port switch 100, a detection signal from the general winning port switch 101, a detection signal from the second starting port switch 103, or a detection signal from the count switch 104. Based on this, control is performed to cause the payout device 130 to pay out a number of game balls corresponding to the number of prize balls predetermined for each detection signal. Specifically, the payout instruction means 270 transmits a payout command to the payout device 130, which instructs the payout device 130 to pay out a number of game balls corresponding to the number of prize balls determined for each input detection signal. The number of prize balls may be any number as long as it is one or more, and the number of prize balls paid out with each of the first starting opening switch 100, general winning opening switch 101, second starting opening switch 103, or count switch 104. may be set to be different, or may be set to the same number of prize balls.

The payout device 130 performs an operation of paying out the number of game balls instructed by the payout instruction means 270. The payout device 130 includes a payout control board 400, a game ball tank for storing game balls, a payout motor for paying out the game balls stored in the game ball tank as prize balls to the player, and a payout motor for paying out the game balls stored in the game ball tank to the player as prize balls. It is equipped with a payout counting switch that detects passage.

The payout control board 400 performs control related to payout of prize balls. The payout control board 400 includes a CPU, ROM, RAM, etc., and is connected to the main control board 200 so as to be able to communicate in both directions. Further, a payout motor is connected to the payout control board 400. Then, the payout control board 400 controls the payout motor based on the payout command transmitted from the main control board 200 and the detection signal from the payout counting switch, and pays out a predetermined prize ball to the player. Specifically, the payout control board 400 starts energizing the payout motor based on the payout command transmitted from the main control board 200. Then, while the payout motor is energized and rotating, game balls are paid out one by one. At this time, the payout counting switch detects passage of the paid out game ball and transmits a detection signal to the payout control board 400. The payout control board 400 grasps the number of game balls that have been paid out based on the detection signal, and when the number of game balls that correspond to the instruction from the main control board 200 has been paid out, the power supply to the payout motor is stopped. , ends the payout of game balls.

The communication control means 280 controls sending various commands generated according to various calculation results in the main control board 200 to the sub-control board 202, the payout control board 400, and the like. Note that in the gaming machine of this embodiment, only unidirectional communication from the main control board 200 to the sub control board 202 is possible between the main control board 200 and the sub control board 202; The main control board 200 is communicatively connected to the main control board 200 so that information cannot be transmitted thereto.

Next, the sub control board 202 will be explained. The sub-control board 202 is configured to include a production control means 300 and a sub-memory 310.

The effect control means 300 controls the liquid crystal display based on various commands sent from the main control board 200, input signals from the effect button switch 150, and effect data stored in the effect data storage means 3110 of the sub-memory 310. Displaying a production image on the display 32, lighting or blinking lighting devices such as the front frame lamp 12 and the display frame lamp 38, outputting production sound from the speaker 14, and driving the production product drive device to display the production. By controlling the performance device, such as operating the performance device, the performance device is made to execute a performance for enlivening the game or assisting the game.

FIG. 6 is a perspective view of the payout control board unit 401, which includes the payout control board 400 and the board case 402, viewed from the front side. In this embodiment, the payout control board 400 is arranged so that the front surface faces the back side (backward) of the gaming machine, and the back surface faces the front side (front) of the gaming machine.

In this embodiment, all components mounted on the payout control board 400 are mounted on the front side of the payout control board 400. Hereinafter, the surface (surface) of the payout control board 400 on which components are mounted may be referred to as a mounting surface. Note that there may be components mounted on the back side of the payout control board 400.

The dispensing control board 400 has an area (mounted components placement area during mass production (first component placement area) A: area outside the two-dot chain line in FIG. 6) where electronic components (mounted components during mass production) to be mounted during mass production are arranged. ), and an area where electronic components that are not mounted during mass production (unmounted components during mass production) are placed (unmounted component placement area during mass production (second component placement area) B: area inside the two-dot chain line in FIG. 6). have. Specifically, the unmounted parts placement area B during mass production is the range occupied by the unmounted parts during mass production when the unmounted parts during mass production are placed at a predetermined position on the dispensing control board 400 (unmounted parts during mass production). This can be said to be the range occupied by the mounting portion 405 (land, through hole, etc.) for attaching (soldering) mounted components, and the range occupied by the silk 406 related to unmounted components during mass production. Note that mass production refers to the time when a large quantity of products to be offered to the market is produced. In other words, in products (gaming machines) distributed in the market, basically no components (unmounted components during mass production) are placed in the unmounted component placement area B during mass production.
Note that a plurality of the mass-produced mounted component placement area A and the mass-produced unmounted component placement area B may be provided in plurality, or may be a single unified area.
Note that the electronic components include, for example, ICs (including main ICs), LEDs, passive elements (resistors, capacitors, inductors, etc.), switches, connectors, and the like.

Components not mounted during mass production include (1) development components that are used only during development and are not mounted during mass production (development connectors, development ICs, development passive elements, etc.), and (2) functions (specifications) in later models. Functional expansion parts (function expansion connectors, function expansion ICs, function expansion passive elements, etc.) that are installed when it is decided to add, etc., but are not implemented in mass production (in the current model) ), (3) There are test parts (test connectors, test ICs, test passive elements, etc.) that are used in predetermined tests conducted to bring gaming machines to the market and are not mounted during mass production. In this embodiment, the unmounted component placement area B during mass production is an area where development components as unmounted components during mass production are placed. In the unmounted component placement area B during mass production, a mounting portion 405 (land, through hole, etc.) for attaching (soldering) development components is provided.

The payout control board 400 is housed in a board case 402. The board case 402 has a front case 402a and a back case 402b. The front case 402a has a rectangular box shape with an open front side. Further, the back case 402b has a rectangular box shape with an open rear side. Further, the front case 402a and the back case 402b are made of transparent synthetic resin. The front case 402a and the back case 402b are combined to form a transparent box-shaped board case 402. Moreover, the payout control board 400 is housed inside the board case 402, with the front case 402a facing the front surface of the payout control board 400, and the back case 402b facing the back surface of the payout control board 400.

In this embodiment, among the surfaces of the board case 402, the surface facing the front surface of the payout control board 400 is called a top surface, and the surface facing the back surface of the payout control board 400 is called a bottom surface. That is, the top surface of the board case 402 is formed by the front case 402a, and the bottom surface of the board case 402 is formed by the back case 402b.

In addition, in this embodiment, the part of the board case 402 (the top surface of the board case 402) that faces the mounted component placement area A during mass production (the area outside the two-dot chain line in FIG. 6) is a case-side first area A. ', and the part facing the unmounted component arrangement area B during mass production (the area inside the two-dot chain line in FIG. 6) is the case-side second area B'.

In this embodiment, the case-side second area B' includes a visibility reducing part C (shaded area in FIG. 6) that reduces the visibility of the unmounted component placement area B during mass production. The reduced visibility portion C is a portion that overlaps with the unmounted component placement area B during mass production in the direction perpendicular to the board surface (surface) of the delivery control board 400, and is perpendicular to the board surface (surface) of the delivery control board 400. When the dispensing control board 400 (the surface of the dispensing control board 400) is viewed from the direction shown in FIG. In other words, the reduced visibility part C is a mounting part 405 (such as a land or a through hole) for mounting an unmounted component during mass production placed in the unmounted component placement area B during mass production when viewed from the direction. Alternatively, it is a part that reduces the visibility of at least a part of the silk 406 and the like related to unmounted components during mass production. Note that "reducing (obstructing) the visibility" means that when viewed from the relevant direction, the visibility reducing portion C reduces the visibility of the unmounted component placement area B during mass production (the visibility of the unmounted component placement area B during mass production Any part that overlaps with part C) (mounting part 405, silk 406, etc. related to unmounted components during mass production) may be made difficult to see, but "making it difficult to see" here includes a case where it becomes completely invisible. Further, the visibility reducing portion C may be one that reduces the visibility of at least a part of the unmounted component placement area B during mass production (mounting portion 405, silk 406, etc. related to unmounted components during mass production). It may also reduce the visibility of the entire unmounted component placement area B. In other words, all the mounting sections 405 provided on the dispensing control board 400 for mounting unmounted components during mass production may be located at positions that (at least partially) overlap with the visibility reduced section C. good. Note that the part whose visibility is lowered by the visibility lowering part C is a part of a specific mass-produced component placement area A (a specific area of the mass-produced component placement area A, for example, where the main IC 500 described later is placed). It can also be said that this is a part where visibility is lower than the area where LEDs are placed, the area where LEDs are placed, etc.

The reduced visibility portion C may be, for example, a portion (character portion) with predetermined characters attached thereto. That is, predetermined characters may be attached to the board case 402, and the characters may reduce the visibility of the unmounted component placement area B during mass production. Specifically, the reduced visibility portion C may be a portion provided with letters related to predetermined operation means (buttons, etc.) provided on the payout control board 400. More specifically, the reduced visibility portion C may be a portion to which are attached characters such as "RAM clear button" that explain the type of a predetermined operating means (function of the operating means). .
In addition, when the reduced visibility part C is a predetermined character part, the character part may be formed by printing characters on the board case 402, or by attaching a sticker or the like on which the characters are printed. It may be formed by the uneven shape of the board case 402.

Further, the reduced visibility portion C may be a portion attached with a sticker of a predetermined size. That is, a predetermined seal may be attached to the board case 402, and the seal may reduce the visibility of the unmounted component placement area B during mass production. Note that the seal may be partially transparent and partially colored, or may be entirely colored. In other words, for example, it may be a sticker with predetermined characters, figures (figures), etc. printed on a transparent sheet (film), or a sticker with predetermined letters, figures (figures), etc. printed on a white sheet (film). It may also be a printed sticker or the like. In the case of a sticker with a predetermined print on a transparent sheet, the visibility of the unmounted component placement area B during mass production is improved by the predetermined printed and colored part (printed part: colored part). descend.

Further, the visibility reducing portion C may be, for example, a portion in which a predetermined uneven shape is formed (an uneven portion). That is, the board case 402 may be formed with a predetermined uneven shape, and the visibility of the unmounted component placement area B during mass production may be reduced due to the uneven shape. Further, the uneven shape may have predetermined information (a predetermined character string, a date mark, a predetermined symbol, etc.), or may not have predetermined information such as a stepped shape. It's okay.

In this embodiment, the reduced visibility portion C is formed by a seal 410, as shown in FIG. Further, the seal 410 is attached to a seal attachment area 412 of the board case 402 (the top surface of the board case 402).

The sticker pasting area 412 is an area for pasting the sticker 410. In this embodiment, the seal pasting area 412 is an area indicated by the uneven shape (predetermined shape) formed on the board case 402. Specifically, as shown in FIGS. 7 and 8(a), the top surface of the board case 402 has a predetermined shaped part 413, which is a convex part that protrudes in the shape of a rectangular frame toward the inner surface (board side). is provided. A rectangular area surrounded by the convex part as the predetermined shaped part 413 is a seal pasting area 412. That is, in the present embodiment, the area partitioned by the predetermined shape portion 413 can be recognized as the sticker pasting area 412, and the operator (work device) pasting the sticker can identify the sticker pasting area 412. It looks like this. In this embodiment, the seal 410 is attached to the outer surface of the board case 402, but it may be attached to the inner surface.
Note that FIGS. 8(a) and 8(b) show cross sections of the dispensing control board unit 401 cut along a plane (horizontal plane) that is orthogonal to the dispensing control board 400 and extending in the left-right direction (and front-back direction). FIG. 3 is a schematic sectional view showing the case when viewed from above. Note that not only a cross section cut along a horizontal plane but also a cross section cut along a vertical plane (a plane extending in the vertical direction and the front-rear direction) is as shown in FIGS. 8(a) and 8(b).

In this embodiment, as shown in FIG. 8A, the uneven shape as the predetermined shape portion 413 is formed on the inner surface of the board case 402, and corresponds to the predetermined shape portion 413 on the outer surface of the board case 402. The part to be touched is flat. However, as shown in FIG. 8(b), as the predetermined shaped portion 413, a concave portion (groove) that is recessed in a rectangular frame shape from the outer surface side toward the inner surface side (a concave groove) that protrudes in a rectangular frame shape toward the inner surface side (along with a convex portion) may be formed. Further, the sticker application area 412 may be a region that is recessed from the outer surface toward the inner surface (projects toward the inner surface) compared to the peripheral portion of the sticker application region 412 . In other words, the predetermined shaped portion 413 does not have to be a rectangular frame shape, but may be a rectangular recessed portion. Furthermore, the predetermined shaped portion 413 may be a rectangular frame shape or a rectangular portion that protrudes outward. Further, the predetermined shaped portion 413 may be one or more L-shaped protrusions or recesses, and the corners of the seal application area 412 may be indicated by the L-shaped protrusions or recesses. In addition, when the L-shaped convex part or concave part is one, at least a part of the seal 410 exists within the range of a virtual triangle formed by connecting the three vertices (both ends and corners) of the L-shape. The area in which the sticker 410 is applied (and the area in which the sticker 410 does not straddle an L-shaped convex portion or concave portion) is defined as a sticker pasting area 412.

The seal 410 is a seal of a predetermined size. Further, the size (area) of the sticker pasting region 412 is larger than the size (area) of the sticker 410. That is, when viewing the board case 402 from a direction perpendicular to the board surface (surface) of the payout control board 400 (the top surface of the board case 402), the area of the sticker pasting area 412 is larger than the area of the sticker 410. ing. As a result, the accuracy required for the work of attaching the sticker 410 is relaxed. That is, since the operator (work device) only has to affix the sticker 410 at any position within the sticker affixing area 412, there is no need to completely align the center of the sticker affixing area 412 with the center of the sticker 410, and there is no need to It is allowed to place it in a shifted position.

Further, the payout control board 400 (the surface of the payout control board 400) has a seal pasting area facing area 420 (the area inside the two-dot chain line in FIG. 7) as a region facing the seal pasting area 412 of the board case 402. exist. Furthermore, the size (area) of the sticker affixing area facing area 420 and the size (area) of the sticker affixing area 412 are the same. In other words, when viewed from a direction perpendicular to the board surface (front surface) of the payout control board 400, the seal affixing area facing area 420 completely overlaps the seal affixing area 412. In other words, when viewed from this direction, the seal pasting area 412 does not protrude from the dispensing control board 400 and is located inside the outer edge of the dispensing control board 400.

Here, electronic components mounted on the dispensing control board 400 that are within the range of the seal pasting area facing area 420 without protruding from the range (the electronic components are entirely within the range) electronic components) are called specified electronic components. In this embodiment, no matter where the sticker 410 is pasted within the sticker pasting area 420, at least a portion of the specific electronic component faces the sticker 410. That is, in this embodiment, there are a plurality of specific electronic components, but no matter where the sticker 410 is pasted within the range of the sticker pasting area 412, a plurality of specific electronic components exist. Either of the parts is adapted to face seal 410. Note that there are one or more electronic components as the specified electronic components, and all of the specified electronic components are (all of the electronic components that are within the range of the seal pasting area facing area 420 without protruding from the range) , no matter where the sticker 410 is pasted within the range of the sticker pasting area 412, even if at least a portion thereof faces the sticker 410 and visibility is reduced by the sticker 410. good. Note that "even if the sticker 410 is pasted at any position within the range of the sticker pasting area 412" means that the sticker 410 protrudes from the range at any position within the range of the sticker pasting area 412. This means that it can be pasted without being pasted. Note that "within the range of the sticker pasting area 412" refers to the range that does not straddle (do not exceed) the outer edge of the predetermined shaped portion 413 (the range inside the dashed dotted line f in FIGS. 8(a) and 8(b)). It is. However, "within the range of the sticker pasting area 412" refers to the range that does not straddle (do not exceed) the inner edge of the predetermined shaped part 413 (the range inside the dashed line g in FIGS. 8(a) and 8(b)). You can also use it as The same applies to "within the range of the seal pasting area facing area 420".

That is, in this embodiment, the sticker 410 as the visibility reducing part C reduces the visibility of the unmounted component placement area B during mass production, and can be placed at any position (any position) within the range of the sticker pasting area 412. Even if it is pasted, it faces the specific electronic component and reduces the visibility of the specific electronic component. Further, even if the sticker 410 as the visibility reduced part C is pasted at any position (any position) within the range of the sticker pasting area 412, at least one part of the unmounted component placement area B during mass production is The visibility of the parts is reduced.
It should be noted that a configuration in which the unmounted component placement area B (mounting portion 405, silk 406, etc. related to unmounted components during mass production) during mass production does not exist within the range of the seal pasting area facing region 420 (position facing the sticker 410) may also be used. good.

Here, the reduction in visibility of the electronic component (specific electronic component) due to the seal 410 as the visibility reduction portion C will be described in more detail. In the present embodiment, the sticker 410 has a printed portion (colored portion) on which predetermined characters and figures are printed on a sticker body (transparent portion) as a transparent sheet.

In this embodiment, as shown in FIG. 9, the sticker 410 has a white rectangular shape as a printed part, the words "dispensing control board" printed in white, and a field for writing the name of the person who opened the board case 402. Enter the filled-in (printed) opener entry field, the words "opener" printed in white letters that are written alongside the opener entry field to indicate that this is an opener entry field, and the date the board case 402 was opened. The opening date entry column is filled in (printed) with a white rectangular shape as a column to fill in the opening date, and the "opening date" is printed in white letters to indicate that it is an opening date entry column. It has characters, a string of white characters as a description of information regarding the components mounted on the payout control board 400, and a white frame line that covers these various characters and fields. Then, in the direction perpendicular to the board surface (surface) of the dispensing control board 400, this printed portion overlaps with the specific electronic components and unmounted parts placement area B during mass production, thereby causing the placement of specific electronic components and unmounted parts during mass production. The visibility of area B is reduced. It should be noted that each print shown here as a printed part (colored part) is an example, and the seal 410 may include a part of each print shown here or other printing.
Note that "information regarding the components mounted on the payout control board 400" includes, for example, an explanation of the information indicated by the lighting state of the LED as the component (for example, what does it indicate when which LED is lit)? (e.g., the type of error indicated by the lighting state of the LED)), and the type (function of the operating means) of the operating means (button, etc.) as the part concerned. It may also be information (for example, an arrow symbol indicating the location) indicating the location of the part (operating means, etc.).

Note that the board case 402 may have a plurality of stickers 410 and a plurality of sticker pasting areas 412. In addition, when there are multiple stickers 410 and multiple sticker pasting areas 412, the multiple (all) stickers 410 have the characteristics related to the reduction in visibility of the specific electronic components and unmounted component placement area B during mass production described above. You may do so. Further, the predetermined seal 410 has each of the characteristics related to the aforementioned reduction in the visibility of the specific electronic component, and the other seals 410 have each of the characteristics related to the aforementioned reduction in the visibility of the unmounted component placement area B during mass production. may have. Further, for example, the predetermined seal 410 is a seal that includes information regarding parts mounted on the payout control board 400 (for example, a seal on which the type of error indicated by the lighting state of the LED is printed), and other seals Reference numeral 410 may be a seal related to opening of the board case 402 (a seal on which are printed the words "opener", "date of opening", an entry field for the opener, a field for entry of the opening date, etc.). Further, regarding the plurality of stickers 410 and sticker pasting areas 412, the size (area) of the stickers 410 and the size (area) of the sticker pasting areas 412 may be different. By making the sizes (areas) different, it is possible to prevent incorrect pasting of the sticker 410.

Note that the sticker 410 is not a transparent sheet with predetermined printing, but may be, for example, a white sheet with predetermined printing. In other words, the entirety of the seal 410 may be a colored portion, and the colored portion may reduce the visibility of the specific electronic component or the unmounted component placement area B during mass production.

(Modified example)
In the game machine of this modification, the payout control board 400 is equipped with a specific connector (development connector, function expansion connector, test connector, etc.) that is not mounted during mass production (soldering), as shown in FIG. A specific connector mounting section 430 is provided as a mounting section for (). The specific connector mounting section 430 is composed of a plurality of (4) through holes 430a each having a land, and the specific connector is mounted by inserting the terminal of the specific connector into the through hole 430a and joining with solder. It has become. Note that during mass production, although no specific connector is mounted on the specific connector mounting portion 430, all the through holes of the specific connector mounting portion 430 are filled with solder and do not penetrate.

Further, the specific connector mounting section 430 is covered by the board case 402 (front case 402a). Furthermore, an opening for exposing the specific connector to the outside of the board case 402 is not provided in a portion of the board case 402 that faces the specific connector mounting section 430 (specific connector mounting section facing area). In other words, when the specific connector is mounted, the board case 402 cannot be closed, and the payout control board 400 cannot be stored in the board case 402. Furthermore, no ventilation holes or the like are provided in the area facing the specific connector mounting portion. In other words, no through hole is provided in the area facing the specific connector mounting part. By not providing an opening, a vent, or the like to expose the specific connector in this way, it is possible to prevent unauthorized access through the specific connector mounting section 430. Moreover, since no opening is provided to expose the specific connector, it is easy to understand that there is no problem even if no connector is mounted on the specific connector mounting portion 430.

In addition, the specific connectors are arranged along a predetermined side (upper side) of the payout control board 400 in substantially a line with other connectors (here, "substantially in a line" includes cases in which they are completely in a line). It is set to be placed. Specifically, in this embodiment, a plurality of (4) connectors are prepared which are arranged at approximately equal intervals (here, "approximately equal intervals" includes completely equal intervals) from a specific connector. ing. The plurality of connectors are components mounted during mass production. Specifically, the plurality of connectors are connected to components mounted on the gaming machine such as a control device (main control board 200) and other boards (including control boards such as the main control board 200). This is a connector for connecting mounted components.
In addition, connectors other than the specific connector and the four mounted component connecting connectors (for example, other mounted component connecting connectors, etc.) are provided along the predetermined side (with an interval equal to or greater than the interval between these connectors). You can leave it there.

The board case 402 is provided with an opening 432 in a portion facing each of the four mounted component connecting connectors to expose each of the four mounted component connecting connectors to the outside. That is, a corresponding opening 432 is provided for each of the four mounted component connection connectors. Note that in FIG. 10, illustration of the mounted component connection connector is omitted. Moreover, one recessed part 434 is formed in the board case 402 (front case 402a), which is recessed from the outer surface side to the inner surface side. In the recess (bottom surface of the recess 434), four openings 432 corresponding to the four mounted component connecting connectors and a region facing the specific connector mounting part are arranged. In other words, the four openings 432 and the area facing the specific connector mounting part are within the range of the bottom surface of the recess 434 when viewed from the direction perpendicular to the plate surface (surface) of the dispensing control board 400. It fits in without sticking out. As described above, in the present embodiment, by arranging the mounted component connecting connector (opening 432 for exposing the mounted component connecting connector) and the specific connector mounting part facing area in one recess 434, the specific connector mounting part 430 can be This makes it easier to notice when incorrect parts are installed.
In addition, in this embodiment, the payout control board 400 has a mounted component connecting connector (not shown) in addition to the four mounted component connecting connectors arranged in the recess 434. In addition to the recess 434, the board case 402 is formed with a recess 438 in which an opening 436 for exposing the other mounted component connector is arranged.

Furthermore, the terminal of the specific connector (the through hole 430a into which the terminal is inserted) is larger than the terminal (through hole into which the terminal is inserted) of any of the four mounted component connecting connectors arranged in the recess 434. It is arranged inside (inside in the plane direction of the payout control board 400, that is, at a position away from the top side). Therefore, it is easy to understand that there is no problem even if a connector is not mounted on the specific connector mounting section 430.

Note that the specific connector (specific connector mounting portion 430) does not have to be arranged substantially in line with other connectors along a predetermined side (upper side) of the payout control board 400; It may be arranged at a position away from the peripheral edge, such as in the area. Further, the specific connector may be a surface mount component, and the specific connector mounting portion 430 may be configured by a land having no through hole.

The gaming machine of this embodiment is a gaming machine that includes a board 400 and a board case 402 that houses the board 400, and the area of the board 400 where electronic components are mounted during mass production is A mounted component placement area (first component placement area) A is defined as an area where electronic components that are not mounted during mass production can be mounted is defined as an unmounted component placement area during mass production (second component placement area) B. The area facing the mounted component placement area A during mass production is defined as a first area A', and the area facing the unmounted component placement area B during mass production is defined as a second area B'. There is a visibility reducing portion C that reduces the visibility of at least a portion of the unmounted component placement area B. According to such a configuration, the visibility reduced portion C overlaps with the unmounted component placement area B during mass production where no electronic components are mounted in a mass-produced product. Therefore, it is possible to reduce the area in the visibility reduced portion C that overlaps with the mounting component placement area A during mass production. Therefore, it is possible to prevent a decrease in visibility of the portion where electronic components are mounted.

Further, the gaming machine of this embodiment is a gaming machine that includes a board 400 and a board case 402 that houses the board 400, and the board case 402 has a sticker pasting area 412 to which a sticker 410 is pasted. , if the area of the substrate 400 facing the sticker pasting area 412 is the sticker pasting area facing area 320, the area of the sticker pasting area 412 is larger than the area of the sticker 410 and the same as the area of the sticker pasting area facing area 420. If the specified electronic component is an electronic component that falls within the range of the sticker-applied area facing area 420 without protruding from the range when viewed from the direction perpendicular to one surface of the board 400, then the sticker-applied Even if the sticker 410 is pasted at any position within the area 412, at least a portion of the specific electronic component faces the sticker 410. According to such a configuration, the electronic components for which there is no problem even if the visibility is reduced or the electronic components whose visibility is desired to be reduced are grouped together within the range of the seal affixing area facing area 420, thereby avoiding the reduction in visibility. It is possible to prevent a decrease in the visibility of electronic components that need to be viewed.

(Second embodiment)
Next, a second embodiment of the present invention will be described. Note that the gaming machine of this embodiment has the same configuration as the gaming machine of the first embodiment. Therefore, descriptions of configurations similar to those in the first embodiment will be omitted or simplified.

In this embodiment, all components mounted on the payout control board 400 are mounted on the front side of the payout control board 400. Below, the surface of the payout control board 400 on which components are mounted may be referred to as a mounting surface. Note that there may be components mounted on the back side of the payout control board 400.

In the following explanation, the longitudinal direction (long side) of a component mounted on a board basically means the longitudinal direction (long side) when viewed from the direction perpendicular to the mounting surface, and the short direction ( The term "short side" means the short side direction (short side) when viewed from the direction perpendicular to the mounting surface, and the height direction means the direction perpendicular to the mounting surface. Regarding components mounted on a board, the bottom surface refers to the surface facing the mounting surface, and the top surface refers to the surface facing away from the mounting surface.

A main IC 500 shown in FIG. 11 is mounted on the payout control board 400. The main IC 500 is an IC in which a CPU, ROM, RAM, etc. are integrated (one chip). Further, the main IC 500 controls various processes by the payout control board 400.

The main IC 500 is mounted on the payout control board 400 via a socket 502 shown in FIG. That is, a socket 502 is attached to the payout control board 400, and the main IC 500 is attached to the socket 502.

As shown in FIG. 11, the main IC 500 includes an IC main body 510 formed into a substantially rectangular plate shape with a built-in CPU, memory, etc., and a plurality of ICs electrically connected to the circuits built into the IC main body 510. It has a terminal P. The plurality of IC terminals P are arranged in two rows along the longitudinal direction of the IC body 510 and extend from the IC body 510 toward the mounting surface side. In other words, the plurality of IC terminals P are arranged along the longitudinal direction on both sides of the IC main body 510 in the transverse direction. In other words, the plurality of IC terminals P are arranged along each of two opposing sides (two long sides) of the IC main body 510. The package of the main IC 500 is a so-called DIP (Dual In-line Package).

In this embodiment, the main IC 500 has 71 IC terminals P1 to P71. Thirty-five IC terminals P1 to P35 are arranged in one of the two rows, and 36 IC terminals P36 to P71 are arranged in the other row. Note that the IC terminals P1 to P71 can be said to be the 1st pin (first terminal) to the 71st pin (71st terminal) of the main IC 500, or the pins (terminals) with pin numbers (terminal numbers) 1 to 71, respectively. .

The distance Px from IC terminal P1 to IC terminal P2 is 1 mm. Further, the distance Py from the IC terminal P2 to the IC terminal P3 is 1 mm. Further, the distance Pz from the IC terminal P1 to the IC terminal P3 is 2 mm. That is, the distance Px and the distance Py are equal. Further, the distance Pz is twice the distance Px and the distance Py. In addition, IC terminals P1 to P17 have equal intervals between adjacent IC terminals (1 mm), and IC terminals P18 to P35 have equal intervals between adjacent IC terminals (1 mm). ), IC terminals P36 to P53 have equal intervals between adjacent IC terminals (1 mm), and IC terminals P54 to P71 have equal intervals between adjacent IC terminals. (1mm). Further, the distance between the IC terminal P17 and the IC terminal P18 and the distance between the IC terminal P53 and the IC terminal P54 are longer than 1 mm. That is, in a continuous group of IC terminals P (IC terminals P1 to P17, IC terminals P18 to P35, IC terminals P36 to P53, or IC terminals P54 to P71), the intervals between adjacent IC terminals P are equal. Also, for a continuous group of IC terminals P (IC terminals P1 to P17, IC terminals P18 to P35, IC terminals P36 to P53, or IC terminals P54 to P71), the interval (2 mm) between every other IC terminal P is , is twice the distance (1 mm) between adjacent IC terminals P.
Note that the distance between the IC terminal P17 and the IC terminal P18 and the distance between the IC terminal P53 and the IC terminal P54 may be 1 mm.

As shown in FIG. 12, the socket 502 includes a plurality of socket terminals Q to which the IC terminals P of the main IC 500 are respectively connected, and a socket body (housing) that holds the plurality of socket terminals Q and on which the main IC 500 is placed. ) 515 and a plurality of legs 517. The socket body 515 is made of an insulating resin material and has a substantially rectangular parallelepiped shape. Further, the socket main body 515 is made of a transparent or semi-transparent resin material and has translucency. Here, "translucent" includes "transparent".

The top surface of the socket body 515 is the surface on which the main IC 500 is placed (attached). Note that the bottom surface of the main IC 500 does not need to be in contact with the top surface of the socket body 515, and the main IC 500 attached to the socket body 515 only needs to be located on the top surface side of the socket body 515. Further, one or more protrusions protruding toward the main IC 500 may be provided on the top surface of the socket body 515, and the protrusions may be in contact with the bottom surface of the main IC 500.

Further, the socket main body 515 is provided with a plurality of legs 517. The legs 517 protrude from the bottom surface of the socket body 515 toward the mounting surface side. In this embodiment, four legs 517 are provided at the four corners of the socket body 515, and two legs 517 are provided at the center of the socket body 515 in the longitudinal direction and spaced apart in the lateral direction. , a total of six legs 517 exist. Furthermore, although the legs 517 are integrally formed with the socket body 515 from the same material (insulating material) as the socket body 515, they may be formed from a different material.
Note that the legs 517 are preferably provided at least at the four corners of the socket 502, but the number of legs may be less than four, or may be four or more. Further, the height h of the leg 517 (the amount of protrusion from the bottom surface of the socket body 515) is 1 mm.

In this embodiment, the socket 502 has 71 socket terminals Q1 to Q71. Note that the socket terminals Q1 to Q71 can be said to be the 1st pin (first terminal) to the 71st pin (71st terminal) of the socket 502, or the pins (terminals) with pin numbers (terminal numbers) 1 to 71, respectively. . Furthermore, when the main IC 500 is attached to the socket 502, each socket terminal Q1 to Q71 is electrically connected to the IC terminal P1 to P71 of the corresponding pin number (same pin number). .

The socket terminal Q has an IC terminal contact portion 520 that contacts the IC terminal P on the side away from the mounting surface (top side), and a substrate that is joined to the payout control board 400 on the mounting surface side (bottom side). This is a joint portion 521. The upper end of the IC terminal contact portion 520 (socket terminal Q) is located closer to the mounting surface than the top surface of the socket body 515. Further, the IC terminal contact portion 520 has a shape into which the IC terminal P can be inserted. In other words, the socket body 515 has a plurality of holes 518 (71 holes) in which the socket terminals Q are respectively embedded, and by inserting each of the IC terminals P into each of the holes 518, the IC The main IC 500 is attached to the socket 502 with the terminal P and the IC terminal contact portion 520 in contact with each other. Further, the board joint portion 521 protrudes from the bottom surface of the socket body 515 toward the mounting surface side (board side). Further, the board joint portion 521 protrudes further toward the mounting surface side (board side) than the legs 517. Then, the socket 502 can be attached to the payout control board 400 by inserting the board joint portion 521 of each socket terminal Q into each through hole 504 of the payout control board 400, which will be described later, and joining by soldering. ing. Further, the IC terminal contact portion 520 and the substrate bonding portion 521 are integrally formed of conductive metal. The IC terminal P (main IC 500) and the through hole 504 (dispensing control board 400) are electrically connected by the socket terminal Q.

Note that each IC terminal contact portion 520 may have any shape as long as it can be connected to each IC terminal P of the main IC 500. Furthermore, each IC terminal contact portion 520 may have a shape that can prevent the main IC 500 attached to the socket 502 from coming off. In this embodiment, as shown in FIG. 13, the IC terminal contact portion 520 is formed by bending metal into an elastic shape, and is configured to sandwich the IC terminal P by elastic force. Note that the IC terminal contact portion 520 may have a hole into which the IC terminal P can be inserted, and the IC terminal P may be fitted into the hole.
Note that the board joint portion 521 is formed in a substantially straight line (here, "substantially straight" means completely straight) in a direction perpendicular to the mounting surface (height direction) so that it can be inserted into the through hole 504. (including).

In the socket 502, as shown in FIG. 12, a plurality of socket terminals Q are arranged in two rows along the longitudinal direction of the socket body 515. Regarding the plurality of socket terminals Q arranged in two rows, 35 terminals of socket terminals Q1 to Q35 are arranged in one row, and 36 terminals of socket terminals Q36 to Q71 are arranged in the other row. is located. In addition, the ends of the plurality of socket terminals Q on the main IC 500 side (top side of the socket body 515) are arranged in two rows along the longitudinal direction of the socket body 515, whereas The ends on the control board 400 side (bottom side of the socket body 515) are arranged in four rows along the longitudinal direction of the socket body 515. In other words, the IC terminal contact portions 520 are arranged in two rows along the longitudinal direction of the socket body 515. Further, the board joint portions 521 are arranged in four rows along the longitudinal direction of the socket body 515. In other words, the plurality of socket terminals Q are arranged in two rows along the longitudinal direction of the socket body 515, and the ends of the socket terminals Q on the main IC 500 side are arranged in a straight line. The end portions on the payout control board 400 side are arranged in a staggered manner.

As is clear from the fact that the plurality of socket terminals Q are arranged in two rows on the main IC 500 side and four rows on the payout control board 400 side, at least some of the plurality of socket terminals Q (for example, one row Regarding every other socket terminal Q among the socket terminals Q lined up in ), the positions of the IC terminal contact portion 520 and the board joint portion 521 in the short extension direction of the socket body 515 are different. In other words, at least some of the socket terminals Q are
A bent part 522 is provided between the IC terminal contact part 520 and the board joint part 521, which is bent so that the positions of the IC terminal contact part 520 and the board joint part 521 in the short extension direction are different.

The bent portion 522 in the socket terminal Q of this embodiment will be explained with reference to FIG. 13. Note that FIG. 13 is a diagram showing the shape of the socket terminal Q when viewed from the direction (longitudinal direction) perpendicular to the width direction and height direction of the socket body 515, and (a) shows the shape of the socket terminal Q when the pin number is an odd number. (b) is a diagram showing a socket terminal Q with an even number of pin numbers, and (c) is a diagram showing a socket terminal Q in a state where it is held in a socket body 515 in (a) and (b). It is a figure which shows the positional relationship of the socket terminal Q shown. Regarding the socket terminals Q arranged in two rows in the longitudinal direction, the socket terminals in one row are arranged in the orientation shown in FIG. 13, and the socket terminals in the other row are arranged in the orientation shown in FIG. placed in the same direction.

The bent portion 522 connects a first bent portion 523 located on the board joint portion 521 side, a second bent portion 524 located on the IC terminal contact portion 520 side, and the first bent portion 523 and the second bent portion 524. , and a substantially linear intermediate portion 525 (herein, “substantially linear” includes a completely linear case). The first curved portion 523 extends from the height direction in the lateral direction of the socket body 515 (in the surface direction of the dispensing control board 400) on the side (top surface side) of the board joint portion 521 extending in the height direction away from the mounting surface. This is the part that bends. Further, the first curved portion 523 has a bending angle α (angle formed between the substrate joint portion 521 and the intermediate portion 525) of 120 degrees. Further, the second curved portion 524 is a portion that is bent in the height direction from the lateral direction of the socket body 515 (the surface direction of the dispensing control board 400) on the side of the intermediate portion 525 away from the board joint portion 521. . Further, the bending angle β (the angle between the intermediate portion 525 and the portion on the IC terminal contact portion 520 side) of the second curved portion 524 is 120 degrees. Further, the intermediate portion 525 extends in the short extension direction of the socket body 515, specifically in the short extension direction and in a direction inclined at a predetermined angle with respect to the surface direction of the dispensing control board 400. That is, the bent portion 522 has a crank shape (here, "crank shape" includes a substantially crank shape) when viewed from the longitudinal direction of the socket body 515.

Then, the bending portion 522 determines the position in the short direction (perpendicular to the alignment direction and height direction of the socket terminals Q) of the board joint portion 521 between adjacent socket terminals Q among the plurality of socket terminals Q arranged in one row. By changing (shifting) the position in the direction, the number of rows is increased in the board bonding part 521 compared to the IC terminal contact part 520.

In this embodiment, socket terminals Q having a plurality of types (two types) of shapes are prepared, and for a plurality of socket terminals Q arranged in a row, adjacent socket terminals Q are made to have different shapes, Although every other socket terminal Q has the same shape, all socket terminals Q may have the same shape.

Further, in the present embodiment, the IC terminal contact portion 520, the board joint portion 521, and the bent portion 522 are integrally formed of a conductive metal, but the socket terminal Q is formed of a plurality of parts. You can leave it there. In other words, in each socket terminal Q, the IC terminal contact portion 520 and the board joint portion 521 need only be electrically connected in a state where the main IC 500 is attached to the socket 502.

The distance Qx from the board joint part 521 (lower end) of the socket terminal Q1 to the board joint part 521 (lower end) of the socket terminal Q2 is 2.5 mm (see FIG. 12). Moreover, the distance Qy from the board joint part 521 (lower end) of the socket terminal Q2 to the board joint part 521 (lower end) of the socket terminal Q3 is 2.5 mm. Moreover, the distance Qz from the board joint part 521 (lower end) of the socket terminal Q1 to the board joint part 521 (lower end) of the socket terminal Q3 is 2 mm. That is, the distance between the board joint portion 521 of the socket terminal Q1 and the board joint portion 521 of the socket terminal Q2 is longer than the distance between the board joint portion 521 of the socket terminal Q1 and the board joint portion 521 of the socket terminal Q3. . In other words, for a continuous group of socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the distance between the board joint parts 521 of adjacent socket terminals Q are equal (2.5 mm). In addition, for a continuous group of socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the distance between the board joint parts 521 of adjacent socket terminals Q ( 2.5 mm) is longer than the interval (2 mm) between the board joint portions 521 of every other socket terminal Q. In other words, the interval (2.5 mm) between the board joint parts 521 of adjacent socket terminals Q is longer than 1/2 of the interval (2 mm) between the board joint parts 521 of every other socket terminal Q. There is.

In addition, for a continuous group of socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the intervals between adjacent socket terminals Q are equal (1 mm). It becomes. Also, regarding a continuous group of socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the interval between the IC terminal contact portions 520 of adjacent socket terminals Q are equal (1 mm). In addition, for a continuous group of socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), every other socket terminal Q (IC terminal contact portion 520 The distance between adjacent socket terminals Q is twice (2 mm) the distance between adjacent socket terminals Q (IC terminal contact portions 520). Specifically, the distance from the IC terminal contact portion 520 (upper end) of the socket terminal Q1 to the IC terminal contact portion 520 (upper end) of the socket terminal Q2 is 1 mm, and the distance between the IC terminal contact portion 520 (upper end) of the socket terminal Q2 is 1 mm. The distance from the IC terminal contact portion 520 (upper end) of the socket terminal Q3 to the IC terminal contact portion 520 (upper end) of the socket terminal Q3 is 1 mm. The distance is 2mm. That is, the socket terminals Q1 to Q71 (IC terminal contact portions 520) are arranged at the same intervals as the IC terminals P1 to P71.

For a continuous group of socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the interval (1 mm) between adjacent socket terminals Q in each group The distance (2.5 mm) between the board joint portions 521 of adjacent socket terminals Q in each group is longer than that. Furthermore, the distance between the board joint portions 521 of adjacent socket terminals Q in each group is longer (2.5 mm) than the distance between the IC terminal contact portions 520 of adjacent socket terminals Q in each group (1 mm). It has become. In other words, the substrate connection of the socket terminal Q to which the adjacent IC terminals P are connected is smaller than the interval between adjacent IC terminals P of the main IC 500 (for example, the interval Px between IC terminal P1 and IC terminal P2: 1 mm). The distance between the parts 521 (for example, the distance Qx between the board joint part 521 of the socket terminal Q1 and the board joint part 521 of the socket terminal Q2: 2.5 mm) is longer. In this way, by widening the interval (distance Qx, Qy) between adjacent board joint parts 521, it is possible to prevent adjacent socket terminals Q from being short-circuited.

The payout control board 400 is provided with a plurality of through holes 504 (the same number as the socket terminals Q) into which the socket terminals Q are inserted. Further, the plurality of through holes 504 are arranged in four rows along the long side direction of the dispensing control board 400 so that the board joint portions 521 of each of the plurality of socket terminals Q can be inserted therethrough. Then, the board joint portion 521 of each socket terminal Q is inserted into each through hole 504 . Note that the arrangement of the through holes 504 is similar to the arrangement of the board joint portion 521 of the socket terminal Q. In other words, the distance between the through holes 504 is the same as the distance between the board joints 521 of the corresponding socket terminals Q.

Each through hole 504 has an annular land 526 on the front side and the back side of the dispensing control board 400, respectively. FIG. 14 shows the through hole 504 seen from the front side of the payout control board 400. The diameter (φ: outer diameter) of each land 526 is 1.5 mm. In other words, the radius of the land 526 (the length from the center (central axis) of the through hole 504 to the outer edge of the land 526) is 0.75 mm. Further, the width of the land 526 (the length from the outer edge of the through hole 504 to the outer edge of the land 526 in the board surface direction of the payout control board 400) is 0.35 mm. Further, the diameter of the through hole 504 is 0.8 mm.
Note that the diameter of the land 526 may be 1 mm or less. Further, the radius of the land 526 may be 0.5 mm or less. Further, the width of the land 526 may be 0.5 mm or less.

When attaching the socket 502 to the dispensing control board 400, each socket terminal Q (board joint part 521) is inserted into each through hole 504, and each through hole 504 and each socket terminal Q (board joint part 521) are soldered. joined by. Furthermore, when attaching the socket 502 to the dispensing control board 400, the legs 517 come into contact with the dispensing control board 400, thereby restricting further pushing of the socket 502. Therefore, the bottom surface of the socket main body 515 is As such, it is in a floating state from the payout control board 400. Therefore, when the socket 502 is attached to the payout control board 400, the legs 517 come into contact with (or come close to) the payout control board 400, and there is a gap between the bottom surface of the socket body 515 and the payout control board 400. Z is formed. That is, the legs 517 form a gap Z. In this embodiment, the height of the leg 517 is 1 mm, and the gap Z has a length (height) of 1 mm.
Note that the height (length) of the gap Z, in other words, the height of the leg 517 may be, for example, 1 mm or more.

Further, the gap Z has a length such that the solder fillet of the solder that joins each socket terminal Q and each through hole 504 does not come into contact with the bottom surface of the socket body 515. Here, the solder fillet formed around the socket terminal Q will be explained. In the soldering process of mounting the socket 502 on the dispensing control board 400, each socket terminal Q (board joint portion 521) is first inserted into each through hole 504. Then, the molten solder adheres to the socket terminal Q (substrate joint portion 521) and the through hole 504 and solidifies. Thereby, the socket 502 is fixed to the payout control board 400 in a state where the socket terminal Q and the through hole 504 (wiring pattern connected to the through hole 504) are electrically connected. At this time, if soldering is performed appropriately, a solder fillet of solidified solder is formed around the socket terminal Q (board joint portion 521).

The solder fillet formed on the front surface side of the dispensing control board 400 has a substantially conical shape, as shown in FIG. The shape of the solder fillet is preferably such that the contact angle θ (the angle formed by the tangent to the solder surface and the substrate surface at the point where the substrate surface and the solder surface intersect) is between 15 degrees and 45 degrees. In this embodiment, the height of the foot 517 is 1 mm, so that the solder fillet having such a good shape (contact angle θ of 15 degrees to 45 degrees) does not come into contact with the socket body 515. There is. Here, the diameter of the solder fillet is approximately equal to the diameter of the land 526. Therefore, when the height of the solder fillet (the length from the surface of the dispensing control board 400 to the apex of the solder fillet) is approximately equal to the radius of the land 526, the apex of the solder fillet and the outer edge of the solder fillet (the length between the solder fillet and the dispensing control board 400) are approximately equal to the radius of the land 526. The angle between the line segment connecting the outer edge of the contact portion with the board 400 and the line segment connecting the outer edge of the solder fillet and the center of the bottom surface of the solder fillet (the angle between the generatrix of the solder fillet and the payout control board 400) ) is approximately 45 degrees. Therefore, in order to prevent the solder fillet with a good shape (contact angle θ from 15 degrees to 45 degrees) from coming into contact with the socket body 515, it is preferable that the height of the foot 517 is greater than or equal to the radius of the land 526. , is preferably at least as wide as the land 526. Further, the height of the foot 517 may be set to be equal to or greater than the diameter of the land 526, or in other words, may be set to be equal to or greater than twice the width of the land 526.

Note that in this embodiment, soldering is performed from the back side of the payout control board 400. That is, in this embodiment, while soldering is performed from the back side, at least some of the socket terminals Q are soldered so that solder fillets are formed on the front side (and the back side). Note that solder fillets may be formed on the front surface of all the socket terminals Q.

In this embodiment, the socket body 515 is provided with a plurality of legs 517 and a gap Z is formed, so that the heat generated by the main IC 500 can be radiated through the gap Z, and the heat dissipation performance is improved. can be increased. In addition, in this embodiment, the gap Z is created in consideration of the shape of the solder fillet, so that it is possible to prevent a well-shaped solder fillet from coming into contact with the socket body 515.

Note that if the height of the gap Z is made too high, it may become easy to attach an unauthorized component to the socket terminal Q, so the height of the leg 517 should be less than twice the diameter of the land. It is preferable to set the diameter to 1.5 times or less than the diameter of the land, and more preferably to 1.5 times or less the diameter of the land.

Further, in this embodiment, at least a portion of the bent portion 522 is located within the gap Z. Specifically, the socket terminal Q has a portion (first bent portion 523) that is bent in the lateral direction of the socket body 515 (in the plane direction of the payout control board 400) on the side away from the mounting surface of the board joint portion 521. This part is located within the gap Z. Further, the socket terminal Q has a portion 527 (see FIG. 13) that projects in the height direction from the bottom surface of the socket body 515, and the second curved portion 524 is located within the gap Z. In other words, in this embodiment, the entire bent portion 522 is located within the gap Z. In other words, the socket 502 of this embodiment has adjacent socket terminals Q (for example, socket terminal Q1 and socket terminal Q2) has a bifurcated portion (point D portion shown in FIG. 13(c)), but this portion is located within the gap Z. In other words, when viewed from the long side direction of the socket body 515, there is a portion where adjacent socket terminals Q (for example, socket terminal Q1 and socket terminal Q2) are divided into two (point D portion shown in FIG. 13(c)). , a portion (a portion 527 protruding in the height direction from the bottom surface of the socket body 515) where the adjacent socket terminals Q overlap and one of the socket terminals is hidden is visible.
Note that the distance from the mounting surface to the bottom of the socket body 515 (height of gap Z) is 1.0 mm, but the distance from the mounting surface to the first curved portion 523 (height of first curved portion 523) is 1.0 mm. ) may be, for example, 0.8 mm, and the distance from the mounting surface to the second curved portion 524 (point D) (the height of the second curved portion 524 (point D)) may be, for example, 0.8 mm.

Further, in this embodiment, at least a portion of the bent portion 522 is located on a side farther from the mounting surface than the apex of the solder fillet of the socket terminal Q (board joint portion 521). Specifically, the second curved portion 524 is located on the side farther from the mounting surface than the apex of the solder fillet of the socket terminal Q (substrate joint portion 521). In other words, when viewed from the longitudinal direction of the socket body 515, the portion where adjacent socket terminals Q (for example, socket terminal Q1 and socket terminal Q2) are bifurcated is located on the side farther from the mounting surface than the apex of the solder fillet. positioned. That is, the second curved portion 524 is formed at a position where the solder (solder fillet) that joins the socket terminal Q and the through hole 504 does not touch. In order to prevent contact with the solder in this manner, the height of the second curved portion 524 is preferably greater than or equal to the radius of the land 526, and preferably at least greater than the width of the land 526. Furthermore, the height of the second curved portion 524 may be greater than or equal to the diameter of the land, or in other words, may be greater than or equal to twice the width of the land 526. Note that the first curved portion 523 may be arranged on a side farther from the mounting surface than the apex of the solder fillet of the socket terminal Q (board joint portion 521) (a position where the solder does not touch). In other words, the height of the first curved portion 523 may be greater than or equal to the radius of the land 526, or may be greater than or equal to the width of the land 526. Furthermore, the height of the first curved portion 523 may be greater than or equal to the diameter of the land, in other words, it may be greater than or equal to twice the width of the land 526. That is, the entire bent portion 522 may be located on the side farther from the mounting surface than the apex of the solder fillet of the socket terminal Q (board joint portion 521).

As shown in FIGS. 16 and 17, the socket 502 has a central part in the short side direction that is smaller in the long side direction than both ends in the short side direction (portions where socket terminals Q1 to Q35 or socket terminals Q36 to Q71 are lined up). The height is decreasing along the In other words, the top surface side of the socket main body 515 has a shape in which the center portion in the short side direction is recessed toward the mounting surface side along the long side direction. In other words, in the center of the top surface of the socket body 515 in the short side direction, there is a first groove (first recess) 540 that is recessed toward the mounting surface and extends along the long side. is formed. Further, the bottom side of the socket 502 has a shape in which the center portion in the short side direction is recessed toward the top side along the long side direction. In other words, a second groove (second recess) 542 is formed at the center of the bottom side of the socket main body 515 in the short side direction, which is recessed toward the top side and extends along the long side direction. has been done. That is, the approximately rectangular parallelepiped-shaped portion of the socket body 515 that holds the socket terminals Q1 to Q35 is referred to as a first holding portion 544, the approximately rectangular parallelepiped-shaped portion that retains the socket terminals Q36 to Q71 is referred to as a second holding portion 546, and the If the part connecting the holding part 544 and the second holding part 546 is a connecting part 548, the connecting part 548 is thinner than the first holding part 544 and the second holding part 546. In other words, the connecting portion 548 is located above the bottom surfaces of the first holding portion 544 and the second holding portion 546 and below the top surfaces of the first holding portion 544 and the second holding portion 546. . Furthermore, in the present embodiment, a plurality of (four) connecting parts 548 are arranged side by side along the long side direction of the socket main body 515, and between adjacent connecting parts 548, there are holes that penetrate in the height direction. However, a plurality of holes 549 are formed to connect the first groove 540 and the second groove 542.

A gap X is formed by a first groove 540 between the main IC 500 and the socket 502 (that is, on the top surface side of the socket main body 515). That is, a gap X is formed between the main IC 500 and the socket 502, passing through the socket 502 (main IC 500) in the long side direction. Further, a gap Y is formed by a second groove 542 between the surface (mounting surface) of the dispensing control board 400 and the socket 502 (ie, on the bottom side of the socket body 515). That is, a gap Y is formed between the surface (mounting surface) of the dispensing control board 400 and the socket 502, which penetrates in the long side direction of the socket 502 (main IC 500). In this embodiment, the gap Y exists integrally with the gap Z formed by the legs 517 of the socket 502, and the gap Y and the gap Z constitute one gap.

As shown in FIG. 17, the surface of the payout control board 400 has IC terminals P1 to P35 (socket terminals Q1 to Q35) and IC terminals P36 to P71 (socket terminals Q36 to Q35) of the main IC 500 when viewed in a direction perpendicular to the surface. Q71) and a ground pattern (first ground pattern 560: ground plane) that passes through the main IC 500 in the longitudinal direction. Also, on the back surface of the payout control board 400, a ground pattern (a second A ground pattern 561 (ground solid) is provided. That is, the first ground pattern 560 and the second ground pattern 561 are provided at positions overlapping with the main IC 500 when viewed in this direction. Further, the payout control board 400 is provided with a plurality of through holes (main IC back through holes 562) that electrically connect the first ground pattern 560 and the second ground pattern 561. Further, the plurality of main IC back through holes 562 are provided at positions overlapping with the main IC 500 when viewed in this direction, and a plurality of main IC back through holes 562 are provided along the longitudinal direction of the main IC 500. By providing the first ground pattern 560 and the second ground pattern 561, the noise resistance of the main IC 500 can be increased, and the heat dissipation performance can be improved.

In addition, the first ground pattern 560, the second ground pattern 561, and the main IC back through hole 562 are connected to the gap X formed between the main IC 500 and the socket 502 and the surface (mounting surface) of the dispensing control board 400, respectively. It is formed at a position corresponding to the gap Y formed between the socket 502 and the socket 502 . In other words, the first ground pattern 560, the second ground pattern 561, and the main IC back through hole 562 each have at least a portion of the gap X and the gap Y when viewed in a direction perpendicular to the surface of the payout control board 400. overlap with each other. By providing such gaps X and Y, heat dissipation can be improved.

In addition, on at least one of the front surface or the back surface of the payout control board 400, a first ground pattern 560 or a second ground pattern is provided from the outside in the lateral direction of the main IC 500 (socket 502) when viewed in a direction perpendicular to the front surface of the payout control board 400. 561 (for example, a ground pattern passing between IC terminals P17 and IC terminals P18 of main IC 500 and/or between IC terminals P53 and P54) may be formed. That is, on at least one of the front surface or the back surface of the payout control board 400, there is a wire that passes between the IC terminals P (socket terminals Q) that are lined up in a row in the longitudinal direction when viewed in this direction. A ground pattern that intersects with the first ground pattern 560 or the second ground pattern 561 may be formed.

As shown in FIG. 18(a), the payout control board 400 is provided with a connector 570 to which a harness used for connection with other boards is connected. Further, the connector 570 includes a housing 571 and a plurality of terminals 572. The housing 571 is made of an insulating resin material and has a substantially rectangular parallelepiped shape. Further, each terminal 572 is made of a conductive metal, and the payout control board 400 and other boards are electrically connected via the terminal 572. Furthermore, when attaching the connector 570 to the payout control board 400, each terminal 572 is inserted into each of the plurality of through holes provided in the payout control board 400, and each through hole and each terminal 572 are joined with solder. Ru. Thereby, the connector 570 is fixed to the payout control board 400 in a state where each terminal 572 and each through hole (wiring pattern connected to the through hole) are electrically connected.

Further, the housing 571 is provided with a positioning pin (protrusion for positioning) (leg) 574 that protrudes from the bottom surface of the housing 571 toward the mounting surface side, and the dispensing control board 400 has a positioning pin (protrusion for positioning) (leg) 574 that corresponds to the positioning pin 574. A through hole (hole) (non-through hole) 575 is provided. The through hole 575 is a through hole (with no copper foil (metal plating) provided on the inner peripheral surface (inside) and which does not electrically connect one surface (front surface) and the other surface (back surface) of the board. (non-conductive through-hole). When attaching the connector 570 to the dispensing control board 400, the positioning pin 574 is inserted into the corresponding through hole 575. In this embodiment, the connector 570 can be attached by inserting the terminal 572 into a through hole and soldering it. Therefore, the connector 570 can be attached to the dispensing control board 400 even without the positioning pin 574. It has become stable. However, by providing the positioning pin 574, it is possible to attach the connector 570 without making a mistake in the attachment direction. In other words, the positioning pin 574 functions as a positioner when attaching the connector 570.

Further, the length (height) of the positioning pin 574 is equal to or less than the thickness of the payout control board 400. Specifically, the length of the positioning pin 574 is more than half the thickness (plate thickness) of the payout control board 400, and less than half of the thickness (plate thickness). The thickness of the payout control board 400 is approximately 2 mm. Further, the insertion amount of the positioning pin 574 into the through hole 575 is approximately 1.2 mm. The thickness of the payout control board 400 is greater than the amount by which the positioning pin 574 is inserted into the through hole 575 (the thickness of the payout control board 400 is greater than the amount by which the positioning pin 574 is inserted into the through hole 575). In other words, the amount of insertion of the positioning pin 574 into the through hole 575 is less than the thickness of the payout control board 400. In a state where the connector 570 is attached to the payout control board 400, the positioning pin 574 does not protrude (do not pop out) from the back surface of the payout control board 400. Since the tip of the positioning pin 574 does not protrude from the back surface of the payout control board 400, adhesion of solder to the tip of the positioning pin 574 can be suppressed during soldering. That is, it is possible to prevent solder from adhering to locations where soldering should not be performed.
The amount of insertion of the positioning pin 574 into the through hole 575 (approximately 1.2 mm) is greater than half the thickness (approximately 1 mm) of the dispensing control board 400 (the amount of insertion of the positioning pin 574 into the through hole 575 is approximately 1.2 mm). (more than half the thickness of the substrate 400). If the insertion amount of the positioning pin 574 is small, there is a risk that the positioning pin 574 may not function as a positioner, but in this embodiment, the insertion amount is secured to be more than half of the thickness of the board, so it functions reliably as a positioner. This makes it possible to stabilize the attachment position (fixed position) of the connector 570 and achieve highly accurate work.
Moreover, if the positioning pin 574 is formed long and protrudes from the back surface of the payout control board 400, problems such as the positioning pin 574 being damaged during soldering may occur. Furthermore, when the dispensing control board 400 is assembled, some kind of impact may be applied to the positioning pin 574, which may cause problems such as damage to the positioning pin 574 or detachment of the connector 570 from the dispensing control board 400. In this embodiment, since the positioning pin 574 does not protrude from the back surface of the payout control board 400, the occurrence of such a problem can be suppressed.
FIG. 18(b) is a diagram showing the area around the through hole 575 on the back surface of the payout control board 400. A region in which no pattern is formed (insulating region NP) (insulating layer NP) (pattern-free region NP) is provided around the through hole 575. In other words, the insulating region NP is formed in an annular (circular shape) along the outer periphery of the through hole 575.
Here, the width of the ring (radial width) of the insulating region NP is defined as a first width, and the diameter (radial width) of the through hole 575 is defined as a second width. The first width is approximately 1 mm. The second width is approximately 1 mm. In other words, the first width and the second width are the same or substantially the same width. Substantially the same means that the difference between one and the other is within about 0.3 mm (within ±0.3 mm).
Even if the positioning pin 574 is formed long and protrudes from the back surface of the payout control board 400, there is a possibility that the positioning pin 574 and the pattern (copper foil) will come into contact with each other because the insulating region NP is provided. It is extremely low and can prevent pattern damage.
In addition, the first width and the second width are the same or substantially the same width, and the insulating region NP is a region of a suitable size that prevents damage to the pattern and does not easily interfere with the provision of other wiring patterns. It can be done.

Although the positioning pin 574 is integrally formed with the housing 571 from the same material (insulating material) as the housing 571, it may be formed from a different material. Further, in this embodiment, the connector 570 includes only one positioning pin 574, but may include a plurality of positioning pins 574.

The back case 402b (lower case) is slidable relative to the front case 402a (upper case). Specifically, as shown in FIG. 7, one of the front case 402a and the back case 402b is provided with an engagement protrusion, and the other is provided with a groove into which the engagement protrusion is inserted, and which extends in the left-right direction. A groove 580 extending in a direction parallel to the top and back surfaces of the board case 402 is provided, and when connecting the front case 402a and the back case 402b, an engaging protrusion is inserted into the groove 580, By sliding the back case 402b with respect to the front case 402a, movement of the back case 402b in the front-rear direction (as well as in the up-down direction and the back side in the insertion direction) with respect to the front case 402a is restricted. In this state, the front case 402a and the back case 402b are caulked together, thereby joining the front case 402a and the back case 402b. The back case 402b is slid and locked with respect to the front case 402a. In addition, the payout control board 400 is screwed (screwed) and fixed to the front case 402a.

Further, the back case 402b is provided with a plurality of ribs 581 that protrude toward the inner surface. The tips of the plurality of ribs 581 in the protruding direction are in contact with the back surface of the payout control board 400 housed between the back case 402b and the front case 402a. In other words, a predetermined space is formed between the surface of the back case 402b facing the payout control board 400 and the back surface of the payout control board 400 by the plurality of ribs 581. Further, the plurality of ribs 581 can come into contact with a solid ground portion (that is, a resist covering the solid ground) formed on the back surface of the payout control board 400, and are arranged so that the payout control board 400 can be placed between the back case 40b and the front case 402a. When the back case 402b is slid relative to the front case 402a with the control board 400 disposed, the ribs 581 can slide on a solid ground portion formed on the back surface of the payout control board 400. The rib 581 is configured to come into sliding contact with the back surface of the payout control board 400 when the back case 402b is slid relative to the front case 402a. Here, if the area on the back surface of the payout control board 400 where the rib 581 slides is defined as the sliding area (sliding area), the sliding area (sliding area) is formed only by solid ground (solid pattern), No through holes or wiring patterns are formed. In other words, the ribs 581 connect through holes provided in the payout control board 400, terminals (leads) of various electronic components protruding from the back side of the payout control board 400, and wiring pattern portions formed on the back side of the payout control board 400. It is designed not to slide. In other words, when the back case 402b is slid relative to the front case 402a, the ribs 581 are prevented from coming into contact with any through holes, terminals, or wiring patterns.
Note that the "wiring pattern" here excludes the ground pattern. That is, the "wiring pattern" here can also be rephrased as a wiring pattern (signal line) through which a signal passes.

(Modified example)
A modification of the second embodiment will be described. In this modification, the shape of the socket 502 is different from that described above.

In the socket 502 of this modification, the height h (the amount of protrusion from the bottom surface of the socket body 515) of the leg 517 is 0.5 mm. A gap Z is formed between the bottom surface of the socket body 515 and the dispensing control board 400 by the legs 517.

Further, the bottom surface of the socket body 515 has a concave shape around the socket terminal Q, as shown in FIG. In other words, a recess 550 is formed in the bottom surface of the socket main body 515 at a portion corresponding to the socket terminal Q, and is recessed toward the direction away from the mounting surface. In this modification, two rows of recesses (grooves) 550 are formed corresponding to the socket terminals Q arranged in two rows along the longitudinal direction of the socket body 515. Furthermore, each row of recesses 550 is separated by a foot 517 provided at the longitudinal center of the socket body 515, and a total of four recesses 550 are formed on the bottom surface of the socket body 515. .
Note that the recesses (concave grooves) 550 may be formed in four rows corresponding to the four rows of board bonding portions 521 arranged along the longitudinal direction of the socket body 515. Furthermore, one recess 550 may be provided for each socket terminal Q.

In this modification, the height of the portion of the gap Z corresponding to the socket terminal Q is increased due to the recess 550. That is, in this modification, the distance from the bottom surface of the socket body 515 to the dispensing control board 400 in the part where the recess 550 does not exist is 0.5 mm due to the feet 517. Further, in the portion corresponding to the recess 550, the distance from the dispensing control board 400 to the socket main body 515 is longer, and the distance is 1.0 mm.

Here, in this modification, the height of the foot 517 is 0.5 mm and the diameter of the land 526 is 1.5 mm, so if the recess 550 is not formed, a good shape (contact angle θ is 45 degrees) may come into contact with the socket body 515. However, in this modification, the height around the socket terminal Q in the gap Z is increased due to the recess 550, so it is possible to prevent the solder fillet from coming into contact with the socket body 515. That is, even if the distance from the bottom of the socket body 515 to the dispensing control board 400 is less than or equal to the radius of the land, contact between the solder fillet and the socket body 515 can be prevented by providing the recess 550. I can do it.

Further, in this modification, in the socket terminal Q, the bending angle α of the first curved portion 523 is 90 degrees, and the bending angle β of the second curved portion 524 is 90 degrees.

The bent portion 522 (the boundary between the bent portion 522 and the board joint portion 521) is located on the side farther away from the payout control board 400 (mounting surface) than the gap Z. In other words, the socket terminal Q has a bent portion 522 that is bent so that the positions of the IC terminal contact portion 520 and the board joint portion 521 in the short extension direction of the socket body 515 are different. is located on the side farther from the mounting surface than the bottom surface of the socket body 515 (in other words, on the inside of the socket body 515).

Moreover, in this modification, the distance Qx from the board joint part 521 (lower end) of the socket terminal Q1 to the board joint part 521 (lower end) of the socket terminal Q2 is 2.0 mm. Moreover, the distance Qy from the board joint part 521 (lower end) of the socket terminal Q2 to the board joint part 521 (lower end) of the socket terminal Q3 is 2.0 mm. Moreover, the distance Qz from the board joint part 521 (lower end) of the socket terminal Q1 to the board joint part 521 (lower end) of the socket terminal Q3 is 2.0 mm. That is, the distance between the board joint portion 521 of the socket terminal Q1 and the board joint portion 521 of the socket terminal Q2 is equal to the distance between the board joint portion 521 of the socket terminal Q1 and the board joint portion 521 of the socket terminal Q3. In other words, for a continuous group of socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the distance between the board joint parts 521 of adjacent socket terminals Q are equal (2.0 mm). In addition, for a continuous group of socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the distance between the board joint parts 521 of adjacent socket terminals Q ( 2.0 mm) is equal to the interval (2.0 mm) between the board joint portions 521 of every other socket terminal Q. Note that the arrangement of the through holes 504 is similar to the arrangement of the board joint portion 521 of the socket terminal Q. By arranging the board joint portion 521 (through hole 504) in this way, the socket 502 can be stably held in the through hole 504.
Note that in this embodiment, "equal" for each interval means that the designed lengths are equal, and there may be manufacturing errors. In other words, "equal" in this embodiment includes substantially equal cases.

The game machine of this embodiment is a game machine that includes a board 400 and a board case 402 that houses the board 400. 504, the through hole 504 has a land 526, the socket 502 has a plurality of socket terminals Q that electrically connect the IC terminal P and the through hole 504, and a socket body 515 that holds the socket terminals Q. and a plurality of legs 517 that support the socket body 515, and the plurality of legs 517 form a predetermined gap Z between the socket body 515 and the board surface (mounting surface) of the board 400. , the gap Z is such that the distance from the socket body 515 to the board surface (mounting surface) is greater than or equal to the width of the land 526, and the solder connecting the socket terminal Q and the through hole 504 is in contact with the socket body 515. do not have. According to such a configuration, the heat dissipation of the IC 500 can be improved by the gap Z formed between the socket body 515 and the mounting surface. In addition, the height of the gap Z at least in the portion corresponding to the socket terminal Q is greater than the width of the land 526, which prevents solder from coming into contact with the socket body 515, further improving heat dissipation. At the same time, damage to the socket 502 can be prevented. Moreover, by preventing the solder from coming into contact with the socket body 515 in this way, unexpected short circuits can be prevented.

In addition, in the gaming machine of this embodiment, the IC terminal P includes a first terminal (IC terminal P1), a second terminal (IC terminal P2), and a third terminal (IC terminal P3) which are arranged consecutively in a predetermined direction. ), and the socket terminal Q includes a first socket terminal (socket terminal Q1) to which the first terminal is connected, a second socket terminal (socket terminal Q2) to which the second terminal is connected, and a third terminal. A third socket terminal (socket terminal Q3) to which is connected is included, and if the part of each socket terminal Q that is soldered to the through hole 504 is the board joint part 521, from the first terminal P1 to the second terminal The distance to P2 and the distance from the second terminal P2 to the third terminal P3 are both equal in the first length, and from the board joint part 521 of the first socket terminal Q1 to the board joint part of the second socket terminal Q2. 521 and the distance from the board joint part 521 of the first socket terminal Q1 to the board joint part 521 of the third socket terminal Q3 are both equal to the second length, and the second length is equal to the distance from the board joint part 521 of the first socket terminal Q1 to the board joint part 521 of the third socket terminal Q3. It is longer than the length of 1. According to this configuration, the distance between the board joint parts of adjacent socket terminals Q can be made wider than the distance between adjacent terminals P of the IC, and the distance between the parts to be soldered can be made sufficient. can be ensured and short circuits can be prevented. Also, the distance from the board joint part 521 of the first socket terminal Q1 to the board joint part 521 of the second socket terminal Q2, and the distance from the board joint part 521 of the first socket terminal Q1 to the board joint part 521 of the third socket terminal Q3. By making the distances equal to each other, the socket 502 can be stably held in the through hole 504.

Further, in the game machine of this embodiment, a connector 570 is mounted on the board 400, the connector 570 has a positioning pin 574, and a hole 575 into which the positioning pin 574 is inserted is formed in the board 400. The length of the positioning pin 574 is equal to or less than the thickness of the substrate 400.

(Third embodiment)
Next, a third embodiment of the present invention will be described. Note that the gaming machine of this embodiment has the same configuration as the gaming machines of the first and second embodiments. Therefore, descriptions of configurations similar to those in the first and second embodiments will be omitted or simplified.

In this embodiment, the payout control board 400 has a rectangular plate shape that is long in the left-right direction. Further, in this embodiment, all the components mounted on the payout control board 400 are mounted on the front surface side of the payout control board 400. Hereinafter, the surface (surface) of the payout control board 400 on which components are mounted may be referred to as a mounting surface. Note that there may be components mounted on the back side of the payout control board 400.

In this embodiment, as shown in FIG. 20, when directly facing the payout control board 400 (the surface of the payout control board 400) (when the payout control board 400 is viewed from a direction perpendicular to the board surface (surface)), , when the payout control board 400 is divided by two straight lines that pass through the center of the payout control board 400 and are orthogonal to each other, the upper right area is the first area R1, the upper left area is the second area R2, and the lower left area is the second area. The third region R3 and the lower right region will be referred to as a fourth region R4. In other words, when directly facing the payout control board 400, the X axis is an imaginary straight line that passes through the center of the payout control board 400 and extends in the longitudinal direction (horizontal direction); The first quadrant corresponds to the first region R1, the second quadrant corresponds to the second region R2, and the third quadrant corresponds to the third region R3 in the XY plane whose Y axis is a virtual straight line extending in the direction). , the fourth quadrant corresponds to the fourth region R4. In addition, when directly facing the payout control board 400, the payout is made along a line (plane) that passes through the center of the payout control board 400 (center in the width direction) and parallel to a predetermined side (long side) of the payout control board 400. When the control board 400 is divided into two, one area will be referred to as a first specific area S1, and the other area will be referred to as a second specific area S2. In the present embodiment, the first specific region S1 is composed of a first region R1 and a second region R2, and the second specific region S2 is composed of a third region R3 and a fourth region R4. Note that, for example, the first specific region S1 may be composed of a first region R1 and a fourth region R4, and the second specific region S2 may be composed of a second region R2 and a third region R3. .
Note that the payout control board 400 may be shaped like a rectangular plate with a part cut off. In the case of such a shape, the straight line (virtual straight line) that separates each area described here and passes through the center of the payout control board 400 is a virtual rectangle (virtual straight line) along the outer edge of the payout control board 400. It can be interpreted as a straight line (virtual straight line) passing through the center of a virtual rectangle (assuming that the part is not missing) (see FIG. 21).

Further, in this embodiment, when directly facing the payout control board 400, the upper long side is called the first long side, the lower long side is called the second long side, and the right short side is called the first long side. This will be called a short side, and the short side on the left side will be called a second short side. That is, the first specific area (the first area and the second area) can also be said to be an area on the first long side, and the second specific area (the third area and the fourth area) can also be said to be an area on the second long side. I can say that. Furthermore, the first region and the fourth region can also be said to be regions on the first short side, and the second region and the third region can also be said to be regions on the second short side.

As shown in FIG. 20, the payout control board 400 includes parts ( A plurality of connectors (mounted component connection connectors) 600 used for connection with game machine mounted components are mounted. The payout control board 400 is electrically connected to gaming machine mounted components via each connector 600 and a harness connected to each connector 600. Note that the gaming machine mounted component may be a board or the like for connecting a device external to the gaming machine (for example, a so-called hall computer, a CR unit, etc.) and the gaming machine (payout control board 400). Furthermore, the components installed in the game machine may be, for example, various switches, sensors, motors, solenoids, and the like.

In this embodiment, a full tank switch detects that the lower tray (saucer) is full, a front frame open switch detects opening of the front frame 10, an inner frame open switch detects opening of the inner frame 7, A payout counting switch, a payout motor, a firing device, an external terminal board, etc., and a payout control board 400 are connected via a first predetermined board. A connector used for connection with a predetermined board is mounted. The external terminal board is a board for connecting the gaming machine to external electronic equipment (data display device, hall computer, etc.), and from this external terminal board, various external signals indicating the status of the gaming machine, etc. An information signal is output to external electronic equipment. Further, a firing lever volume that detects the amount of rotation of the handle, a firing stop switch that detects a firing stop operation that stops firing the game balls, etc., and the payout control board 400 are connected via a second predetermined board. A connector used for connection with the second predetermined board is mounted on the payout control board 400 as a connector 600. Moreover, a connector used for connection with the main control board 200 is mounted on the payout control board 400 as a connector 600.

A plurality of connectors 600 are arranged in the first specific area S1. Specifically, the connector 600 is arranged near the edge of the first specific area S1 that faces the boundary with the second specific area S2. In other words, the connector 600 is arranged on the first long side of the first specific region S1. Specifically, a plurality of connectors 600 are arranged along the edge (near the edge). Note that all the connectors 600 may be arranged along the edge (near the edge) (see FIG. 21). Further, all the connectors 600 may be arranged in the first region R1.

In the second specific area S2, the main IC 500 and the unmounted component placement area B during mass production (the area inside the two-dot chain line in FIG. 20) are arranged. Specifically, the main IC 500 and the unmounted component placement area B during mass production are placed in the third area R3. In this embodiment, the main IC 500 is mounted on the payout control board 400 via the socket 502, but it may be directly mounted (soldered) on the payout control board 400 without using the socket 502.

In this embodiment, the unmounted component arrangement area B during mass production is an area where test components (test connectors, test ICs, test passive elements, etc.) as unmounted components during mass production are arranged. In the unmounted component placement area B during mass production, a mounting portion 405 (land, through hole, etc.) for placing (soldering) test components and a silk 406 for test components are provided. That is, the test component can be mounted in the second specific area S2 (third area R3).
Note that the test component may be a component that is mounted during mass production (a component mounted during mass production).

Further, the connector 600 is not arranged in the third region R3. Specifically, the connector 600 is not arranged in the second specific area S2. That is, in this embodiment, when the payout control board 400 is divided into two in a predetermined direction (vertical direction), the connector 600 is arranged in one region (upper region: first specific region S1), and the connector 600 is arranged in the other region. When the area (lower area: second specific area S2) is further divided into two in a direction (horizontal direction) orthogonal to the predetermined direction, one side (left side when facing the payout control board 400: the first The main IC 500 and test components can be mounted in the third area R3). Moreover, the connector 600 is not arranged on the one side (third region R3), more specifically, on the other region (second specific region S2).

(Modified example)
As shown in FIG. 21, in the gaming machine of this embodiment, a main IC 500 and a verification terminal 602 may be arranged in the third region R3 (second specific region S2). In this case, the test component may or may not be able to be mounted in the third region R3 (second specific region S2).
Here, the verification terminal 602 is a connector (terminal) used for a predetermined test, a connector that can output predetermined information, and a connector that can be connected to a test terminal (test device). The verification terminal 602 is not normally connected to the test terminal, but is connected to the test terminal only during the test. By connecting an inspection terminal to the verification terminal, it is possible to inspect whether or not there has been any unauthorized modification to the payout control board 400. Here, the predetermined information outputted from the verification terminal 602 includes the ID of the payout control board 400 and the like.
In addition, in the gaming machine of this embodiment as a mass-produced product, the plurality of connectors 600 are all connected with wiring (harness), and the payout control board 400 has wiring (harness) other than the verification terminal 602. There are no unconnected connectors. However, for example, in addition to the verification terminal 602, there may be a connector to which no wiring (harness) is connected. For example, a test connector as a test component may be mounted in a mass-produced product, and the test connector It is also possible to use a connector with no wiring (harness) connected. Moreover, such a test connector may be arranged in the third region R3 (second specific region S2).

Main IC 500 and verification terminal 602 are connected via electronic components and wiring patterns. Specifically, the payout control board 400 has predetermined signal lines 604, 604 as a wiring pattern that connect the main IC 500 and the verification terminal 602, and the signal lines 604, 604 have predetermined electronic components. Resistors 606, 606 are provided. The resistor 606 is a lead linear resistor and has a resistor body and two leads (terminals: legs) extending from the resistor body. The resistor 606 is attached to the payout control board 400 by soldering, with two leads inserted into through holes provided in the payout control board 400.

The height of the resistor 606 is lower than the height of the main IC 500. Specifically, when mounted on the payout control board 400, the height of the resistor 606 is 1/2 or less of the height of the main IC 500. Further, the height of the resistor 606 is lower than the height of the verification terminal 602. Specifically, when mounted on the payout control board 400, the height of the resistor 606 is 1/2 or less of the height of the verification terminal 602.
Here, the "height" of each electronic component refers to the distance in the height direction from the mounting surface of the dispensing control board 400 to the tip of each electronic component in the protruding direction (the part furthest from the mounting surface). say.

Note that in this embodiment, there are two signal lines 604 that connect the main IC 500 and the verification terminal 602, and a resistor 606 is provided in each of the two signal lines 604. Further, other than the resistor 606, there are no electronic components provided on the signal line 604 that connects the main IC 500 and the verification terminal 602. In other words, in the payout control board 400, all the electronic components provided in the signal line 604 connecting the main IC 500 and the verification terminal 602 are lower in height than the main IC 500 and lower than the verification terminal 602. ing.
Note that in this embodiment, the verification terminal 602 has four terminals, two of which are connected to signal lines 604, 604, and the other two terminals are connected to a ground pattern. has been done.

In this embodiment, the payout control board 400 is attached in the arrangement shown in FIG. 22. FIG. 22 is a diagram of the gaming machine viewed from the back side (back side). As shown in FIG. 22, the payout control board 400 is arranged below the main control board 200. Further, the connector 600a used for connection with the main control board 200 is arranged on the top of the payout control board 400, and the payout control board 400 and the main control board 200 are electrically connected via the connector 600a. ing.

Further, no other board is arranged below the payout control board 400. In other words, the payout control board 400 is the lowest board among all the boards mounted on the gaming machine.
In addition, here, "no other board is arranged below (it is the lowest board arranged)" means that the upper ends of all other boards are lower than the lower end of the payout control board 400. However, the lower ends of all other boards should be above the lower end of the payout control board 400 (at least at the same position or higher in the vertical direction as the lower end of the payout control board 400). It may be located at the top (upper part).

Moreover, the payout control board 400 is arranged so as to overlap with other boards in the front-rear direction (direction perpendicular to the surface (board surface) of the payout control board 400). Specifically, in front of the payout control board 400, a power supply board 610 as the other board is arranged. Note that the power supply board 610 is a board connected to each board, and power is supplied to each board from a commercial power source via the power supply board. Furthermore, the payout control board 400 is arranged at the rearmost position among the plurality of boards arranged overlappingly in the front-rear direction. In other words, when the gaming machine is viewed from the back side (when the inner frame 7 is open and facing the payout control board 400), the payout control board 400 is the closest to the front among the overlapping boards in the front-rear direction. (on the observer's side). In other words, when viewing the mounting surface of the payout control board 400 from the back side of the gaming machine (when viewing the mounting surface of the payout control board 400 with the inner frame 7 in an open state), the view may be blocked by other boards. There is no such thing.

The gaming machine of this embodiment is a gaming machine including a board 400 on which electronic components are mounted, and when the board 400 is divided into two in a predetermined direction, one area (first specific area S1) has a A connector 600 used for electrical connection with components mounted on the is disposed, and one side when the other area (second specific area S2) is further divided into two in a direction orthogonal to the predetermined direction. On the side (third region R3), there is a control means (main IC 500) that controls processing on the board 400, and a mounting section 405 that can mount a predetermined electronic component, but on which the predetermined electronic component is not mounted. , and the connector 600 is not arranged. According to such a configuration, the control means 500 is arranged in one region (third region R3) when the board 400 is divided into four, and the control means 500 is arranged in one region (third region R3) when the board 400 is divided into four parts. Since the connector 600 used for regular connection is not arranged, it is possible to prevent the visibility of the control means 500 from being reduced due to a harness or the like connected to the connector 600. Further, by arranging the mounting portion 405 in which no electronic components are mounted in this area, the visibility of the control means 500 can be improved. Further, by arranging the mounting portion 405 in this area, the degree of freedom in arranging the connector 600 can be increased while ensuring the visibility of the control means 500.

The gaming machine of this embodiment is a gaming machine that includes a board 400 on which electronic components are mounted, and when the board 400 is divided into two in a predetermined direction, one area (first specific area S1) has a corresponding A connector 600 used for electrical connection with parts mounted on the gaming machine is arranged, and when the other area (second specific area S2) is further divided into two in a direction orthogonal to the predetermined direction. On one side (third region R3), a control means (main IC 500) that controls processing on the board 400 and an inspection terminal (verification terminal 602) used for a predetermined inspection are arranged, and Connector 600 is not arranged. According to such a configuration, the control means 500 is arranged in one region (third region R3) when the board is divided into four, and the control means 500 is arranged in one region (third region R3), and the electrical connection with the components mounted on the gaming machine is provided in this region. Since the connector 600 used for the connection is not arranged, it is possible to prevent the visibility of the control means 500 from being reduced due to a harness or the like connected to the connector 600. In addition, by arranging a test terminal 602 used for a predetermined test, that is, a connector to which a harness is not normally connected, in this area, visibility of the control means is ensured, and the other connectors 600 are The degree of freedom in arrangement can be increased.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described.
The gaming machine of this embodiment basically has the same configuration as the gaming machine of the first embodiment, so the description of the same configuration as the gaming machine of the first embodiment will be explained below. Omit or simplify. Although a description will be given below using a payout control board unit 700 including a payout control board 400 (hereinafter referred to as board 400), the present invention is applicable to other predetermined board units provided in a gaming machine.

FIG. 23 is an exploded perspective view of the payout control board unit 700. The payout control board unit 700 has a substantially square shape (substantially rectangular shape). Specifically, it is longer in the left-right direction and shorter in the up-down direction. The payout control board unit 700 mainly includes a board 400 (payout control board, payout control means), a board case 701 that accommodates (accommodates, encloses) the board 400, screws (not shown), and the like. ing.

The board case 701 includes a first case 710 that covers the front side (first surface side) of the board 400 and a second case 720 that covers the rear side (second surface side) of the board 400. The first case 710 and the second case 720 each have a top surface (bottom surface) and a predetermined side surface (side wall), and are substantially box-shaped. By assembling the first case 710 and the second case 720, a space is formed inside, and the board 400 is housed in the space. The board case 701 is made of transparent synthetic resin, and allows the board 400 placed inside to be visually recognized from the outside.

Here, the front side (front side) surface of the substrate 400 is referred to as the first surface (front surface), and the rear side (rear side) surface is referred to as the second surface (back surface). The first surface of the substrate 400 faces the top surface portion (first top surface) of the first case 710. The second surface of the substrate 400 faces the top surface portion (second top surface) of the second case 720. Note that the top surface of the first case 710 may be referred to as the top surface of the board case 701, and the top surface of the second case 720 may be referred to as the bottom surface of the board case 701.

FIG. 24 is a schematic diagram of the first surface of the substrate 400 viewed from the front side (front side). The substrate 400 has a rectangular plate shape, and is arranged so that the long side extends in the left-right direction, the short side extends in the up-down direction, and the normal direction of the substrate surface (thickness direction) is in the front-back direction. has been done. In the substrate 400, one of the long sides is located on the upper side, the other long side is located on the lower side, one of the short sides is located on the right side, and the other short side is located on the left side.

The substrate 400 includes a plurality of through holes 450 passing through the first surface and the second surface. In this embodiment, the through holes 450 are formed at each of the four corners of the substrate 400. Note that four or more through holes 450 may be provided. Further, the number of through holes 450 may be less than four, for example, two may be provided at each diagonal corner of the substrate 400. In this embodiment, the through holes 450 include those used for fixing to the board case 701 (first case 710) and those used for positioning the board 400 (described later).

Note that although illustration is simplified (omitted), a plurality of components (various electronic components) are mounted (arranged) on the first surface of the board 400. The plurality of components include connectors, ICs, resistors, capacitors, diodes, switches, and the like. Although not shown in the drawings, the board 400 includes identification information (identification codes) for identifying (specifying) each electronic component (enabling identification of each electronic component), indicating the placement position of each electronic component. Located nearby. The identification information is composed of predetermined characters or a predetermined string of characters (the string may include numbers and symbols), for example, in the case of a connector assigned the number "1", an alphabet representing the connector. "CN" and the number "1" are combined to form a character string "CN1." This identification information is formed (written) by silk printing, and is white in this embodiment. The identification information can also be referred to as silk letters. Further, in this embodiment, the substrate 400 is a green substrate. In other words, the resist color of the substrate 400 is green. Although not shown, the substrate 400 is provided with a plurality of through holes.

As shown in FIG. 23, the first case 710 includes two mounting holes 711 (board mounting portions). The mounting holes 711 are provided at positions corresponding to (opposed to) the through holes 450 provided at diagonal corners of the substrate 400, respectively. The board 400 is fixed to the first case 710 by passing a screw (not shown) through the through hole 450 from the second surface side (back side) of the board 400 and screwing (inserting) the screw into the mounting hole 711. It looks like this.

The first case 710 also includes two positioning pins 712. The positioning pins 712 are provided at positions corresponding to (opposed to) the through holes 450 provided at diagonal corners of the substrate 400, respectively. The positioning pin 712 projects a predetermined length from the front side toward the rear side, is formed in a cylindrical shape, and has a diameter that allows it to be inserted into the through hole 450. By inserting the positioning pin 712 into the through hole 450, rotation of the board 400 is restricted.

Here, another example of the board and the board case (fixing the board to the board case) will be shown using FIGS. 25 to 27. A substrate 400 shown in FIG. 25 includes five through holes 450. The through holes 450 are provided at the four corners and approximately at the center in the left-right direction on the lower side.

FIG. 26 is a diagram of the first case 710 corresponding to the board 400 shown in FIG. 25, viewed from the back side. The first case 710 includes five bosses 715 (board mounting portions). The boss 715 is provided at a position corresponding to (opposed to) the through hole 450 of the substrate 400. The boss 715 projects a predetermined length from the front side toward the rear side, and is formed in a columnar shape (cylindrical shape). The boss 715 is provided with a screw hole for inserting a screw (for tightening the screw). The diameter of this screw hole can also be called the inner diameter of the boss 715. The board 400 is fixed (fastened) to the first case 710 by passing screws through the five through holes 450 from the second surface side (back side) of the board 400 and further screwing (inserting) the screws into the screw holes of the boss 715. It is supposed to be done.

When the screw is screwed in and the screw is inserted into the screw hole by a predetermined amount (predetermined length), the tip end surface of the boss 715 contacts the first surface of the board 400, and the head of the screw contacts the first surface of the board 400. The two surfaces are in contact. That is, the board 400 is in a fixed state (fixed state), being sandwiched between the tip end surface of the boss 715 and the head of the screw. At this time, the screw is in a state where it does not rotate any further (the screw is tightened without loosening). This may be referred to as the maximum insertion state of the screw. When the substrate 400 is fixed, the heads of the screws protrude from the second surface of the substrate 400.

In this embodiment, a pattern made of copper foil is formed on the first and second surfaces of the substrate 400 (copper foil is attached). Note that the patterns include a wiring pattern through which a signal passes and a ground pattern (solid ground).

FIG. 27(a) is a diagram showing the second surface of the substrate 400 shown in FIG. 25. In this embodiment, a predetermined region (predetermined range) including at least the periphery of the through hole 450 is a region in which no pattern is formed (pattern-free region N: hatched area in the figure). In this embodiment, the periphery of each through hole 450 (5 locations) and the peripheral edge of the substrate 400 (the edge of each side) are pattern-free areas N (insulating areas). It is sufficient that the area around the hole 450 is a pattern-free area N. Each through hole 450 is provided in the pattern-free region N.

FIG. 27(b) shows a state in which the screws are inserted into the respective through holes 450 in FIG. 27(a) and the heads of the screws are brought into contact with the substrate 400. The non-pattern forming area N has a size such that at least the head of the screw does not protrude outside the non-pattern forming area N (a size that does not allow the head of the screw to enter the pattern forming area). In other words, the head of the screw is sized to fit inside the pattern-free area N. Specifically, the distance (shortest distance) between the end (outer periphery) of the screw head and the copper foil is, for example, approximately 1 mm to 2 mm. Therefore, when the screw is tightened, the area where the screw head comes into contact is the pattern-free area N, and the screw head does not come into contact with the pattern (copper foil). This can prevent the screw from being electrically connected to the pattern (solid ground, etc.) and causing a short circuit or the like, thereby preventing component damage (failure). Furthermore, damage to the pattern due to contact between the screw heads can be prevented.

Although not shown, in FIG. 27A, for example, a through hole 450 is provided in the center of the substrate 400, and a predetermined area around the through hole 450 becomes a pattern-free region N. You can leave it there. In other words, the predetermined pattern-free region N may be provided so as not to be continuous with other pattern-free regions N (isolated). Note that the pattern-free region N is a region in which no pattern is provided, but a resist is provided.

As the screw, a countersunk screw can be used in addition to a pot screw. Flat head screws have a conical bearing surface, so when using flat head screws, the distance (minimum distance) to the copper foil must be greater than when using pan head screws. can do. In other words, it can be made more difficult to come into contact with the copper foil.

Next, the first surface side will be explained. The tip surface of the boss 715 (FIG. 26) is designed to come into contact with the first surface of the board 400, but the boss 715 (board mounting part) is connected to the board support part (abutment surface, receiving surface) that supports the board. It also functions as The first case 710 may have a predetermined shape other than the boss 715 as the substrate support portion. Examples of the predetermined shape include a protrusion (protrusion) that stands up at a corner (a position opposite to the corner of the board), or a predetermined length extending inward from the side of the case (inner surface of the side wall). There are ribs (protrusions) etc. formed like this. For example, if a board support part (convex part) is provided at a position corresponding to the four corners of the board as well as at a position corresponding to approximately the center in the horizontal direction of the board, in addition to the four corners of the board, The portion will be supported from the first surface side. For this reason, when force is applied to the substrate from the second surface side, the substrate can be made less likely to bend (deflection of the substrate can be suppressed).

As shown in FIG. 25, in this embodiment, a pattern-free area N (shaded area) is also provided on the first surface of the substrate 400. The substrate support portion (boss 715) is configured to come into contact with the non-pattern formation area N. In other words, at least the portion of the first surface of the substrate 400 that comes into contact with the substrate support portion is the pattern-free region N. In other words, a predetermined range on the first surface of the substrate 400 including the range in contact with the substrate support section is the pattern-free region N. In this embodiment, when comparing the first surface and the second surface of the non-patterned region N around the predetermined through hole 450, the area of the first surface is larger. This is because, in this embodiment, the diameter of the boss 715 is larger than the diameter of the head of the screw. Note that the shortest distance between the outer periphery of the boss 715 and the copper foil on the first surface may be smaller than the shortest distance between the outer periphery of the screw head and the copper foil on the second surface. Furthermore, the pattern-free regions may be formed in the same way (in the same range) on the first surface and the second surface. Furthermore, predetermined information (such as the management number of the substrate) may be displayed in the pattern-free areas N on the first and second surfaces.

The shapes of the bosses, ribs, etc. that serve as the substrate support are made of resin, and will not be electrically conductive if they come into contact with the pattern (copper foil). However, when the pattern (copper foil) is contacted and pressed, there is a risk that the pattern may be damaged or disconnected. In this embodiment, since the substrate support part is in contact with the non-pattern forming area N, the pattern is not damaged or wire breaks due to pressure, and defects (damage to parts) are prevented. It can be suppressed.

Although not shown, pattern-free areas N are also provided on the first and second surfaces of the substrate 400 shown in FIG. ) and contact with the pattern is avoided.

At least one connector is arranged on the first surface of the board 400, and as shown in FIG. 28, a portion of the first case 710 corresponding to a predetermined connector (and its surroundings) 400 side) is a concave portion 718 (concave shape). This recess 718 is provided with an opening, through which the connector is exposed to the outside.

In this embodiment, the bottom of the recess 718 and the first surface of the substrate 400 (the area around the connector) are in surface contact with each other. (area to which copper foil is attached). In other words, a portion that can come into surface contact with a mating component (a portion where the contact area is relatively large), such as the bottom of the recess 718 in the board case 701 (first case 710), is a pattern-forming area rather than a non-pattern forming area N. It may be a region. The contact area is large, and the load (stress) is dispersed and difficult to concentrate in one place. On the other hand, such as the tip of the boss 715 (FIG. 26) in the board case 701, a place that can make point contact with a mating component (a place where the contact area is relatively small) is a non-pattern area N (where copper foil is attached). area). This is because the contact area is small and load (stress) tends to concentrate.

FIG. 29 is a partially enlarged view showing a predetermined through hole 450 and its surroundings on a predetermined surface of the substrate 400. In this embodiment, in the boundary part (boundary part) between the pattern formation area (the area to which copper foil is attached) and the non-pattern formation area N (the area to which copper foil is not attached), the edge of the pattern formation area is A plurality of ground through holes H are provided along (along) the portion. This strengthens the ground, improves the noise resistance of the board, and realizes stable operation of the board. A wiring pattern through which a signal passes is formed in the pattern formation area, and a ground through hole H is provided further outside of the wiring pattern located furthest outside (outer circumferential side) of the board among the wiring patterns. ing. Therefore, it is possible to reduce the influence of noise on the outermost wiring pattern. In addition, a plurality of ground through holes H are provided at the outer edge of the pattern forming area (multiple paths for current flow are provided) to strengthen the ground. Even if electricity (static electricity) flows in, the electricity can be released more reliably.
Note that the ground through hole H provided at this boundary has two types: one with solder inside (filled with solder), and one with no solder inside (not filled with solder). condition) and

In this embodiment, the board unit (payout control board unit 700) is arranged in the gaming machine so that the normal direction of the board surface is the front-back direction, but the normal direction of the board surface is the up-down direction. The player may be placed in the gaming machine so that the first side faces upward, for example.

FIG. 30 is a schematic cross-sectional view showing a state in which the board 400 is fixed to the first case 710 (boss 715). In addition, in FIG. 30, hatching indicating that it is a cross section is partially omitted. FIG. 30 shows a state (specific state, first state) in which the screw α is tightened without loosening and the board 400 is properly (suitably) fixed to the first case 710 (boss 715).

The first surface (front surface) of the substrate 400 and the top surface portion of the first case 710 (upper case) are opposed to each other (facing each other). The first surface of the substrate 400 can be visually recognized through the top surface of the first case 710. Specifically, various electronic components arranged on the first surface can be visually recognized. In FIG. 30, the lead component β and the connector γ can be visually recognized through the top surface of the first case 710. The connector γ is a connector (non-exposed connector) that is not exposed through the opening provided in the first case 710 but is covered by the top surface of the first case 710. Non-exposed connectors are, for example, those used only during development and not during mass production, and those used when it is decided to add functions (specifications) to later models, but not used during mass production of current models. There are those for functional expansion that are not used, and those for testing that are used in predetermined tests to provide gaming machines to the market but are not used during mass production.

The second surface (back surface) of the substrate 400 and the top surface portion of the second case 720 (lower case) are opposed to each other (facing each other). The second surface of the substrate 400 can be visually recognized through the top surface of the second case 720. In FIG. 30, the terminal of the lead component β and the head of the screw α can be visually recognized through the top surface of the second case 720.

Some electronic components disposed on the first surface of the substrate 400 include a main body and a lead terminal (terminal) extending from the main body (lead component β). Examples of lead components β (discrete components β) include diodes, ICs, capacitors, and resistors. The lead component β is fixed (mounted) to the substrate 400 by soldering with the lead terminal portion inserted into a through hole formed in the substrate 400. The lead terminal portion protrudes from the second surface of the substrate 400 by a predetermined length. Furthermore, assuming that the portion of the lead terminal portion opposite to the main body connection side is the tip end side of the lead terminal portion, in this embodiment, the tip end side of the lead terminal portion is bent. For example, in the case of a resistor having two leads, each terminal is bent so that its tip faces inward. Note that the electronic components arranged on the board 400 may include chip components (chip-type components) in addition to lead components.

As shown in FIG. 30, the height dimension of the boss 715 (board mounting portion) is defined as dimension L. The dimension L is the dimension from the top surface (inner surface) of the first case 710 to the tip of the boss 715 (the first surface of the substrate 400). Further, in the state shown in FIG. 30, the height dimension of the connector γ (non-exposed connector) from the first surface of the board 400 is defined as a dimension M. Note that when a plurality of non-exposed connectors such as the connector γ are arranged on the board 400, the height dimension of the one having the highest (largest) height from the first surface is defined as the dimension M. Further, in the state shown in FIG. 30, the dimension from the first surface of the substrate 400 to the tip of the screw α inserted into the boss 715 is defined as the dimension N. The tip of the screw α is the end opposite to the head of the screw α.

In this embodiment, the dimension L (sixth dimension) is larger than the dimension M (seventh dimension). When the screw α is tightened and the board 400 is attached to the first case 710 (boss 715), the connector γ does not come into contact with the top surface of the first case 710. This can prevent the connector γ from being damaged.
Further, the dimension N (eighth dimension) is smaller than the dimension M (seventh dimension). If the dimension N is larger than the dimension M, there is a high possibility that the connector γ will come into contact with the top surface of the first case 710 as the screw α is inserted deep into the boss 715. However, in this embodiment, , since the dimension N is set smaller than the dimension M, such a fear can be reduced.

Further, in the state shown in FIG. 30, the dimension from the second surface (back surface) of the substrate 400 to the tip (top) of the head of the screw α is defined as dimension B (second dimension). Further, in the state shown in FIG. 30, the dimension (protrusion amount) from the second surface (back surface) of the substrate 400 to the tip of the lead terminal portion of the lead component β is defined as dimension A (first dimension). When a plurality of lead components β (diodes, ICs, capacitors, resistors, etc.) are arranged on the board 400, dimension A is the protrusion amount of the largest lead terminal part from the second surface. shall be. Note that the plurality of lead components β may be configured so that all the dimensions A are the same. Further, in the state shown in FIG. 30, the dimension (distance) from the second surface (back surface) of the substrate 400 to the top surface (inner surface) of the second case 720 is defined as dimension C (third dimension).

In this embodiment, dimension B is larger than dimension A. In this embodiment, dimension C is larger than dimension B. When the board 400 is attached to the first case 710, the head of the screw α and the tip of the lead terminal of the lead component β do not come into contact with the top surface of the second case 720. Thereby, damage to the second case 720, lead components, etc. can be prevented.

Here, in the state shown in FIG. 30, the amount of insertion of the screw α into the boss 715 (the amount of screw engagement) is defined as a dimension E (fifth dimension). In other words, the length (dimension) of the screw α inserted into the screw hole of the boss 715 is defined as the dimension E. Further, in the state shown in FIG. 30, the distance (dimension) from the tip (top) of the head of the screw α to the top surface (inner surface) of the second case 720 is defined as dimension D (fourth dimension). Note that the dimension D can also be said to be the difference between the dimension C and the dimension B. In this embodiment, dimension E is larger than dimension D.

Here, consider a case where the tightening of the screw α becomes loose due to the influence of vibrations and the like, and the board 400 moves toward the second case 720 together with the screw α. If dimension E is smaller than dimension D (dimension D is larger than dimension E), dimension E becomes 0 before the head of screw α comes into contact with the top surface of second case 720, and screw α Falling off from boss 715. In this case, since the screw α is not present, the terminal of the lead component β may come into contact with the top surface of the second case 720, and the lead component β may come off (come off) from the board 400 or be damaged. There is.

In this embodiment, dimension E is larger than dimension D. Therefore, at the time when the head of the screw α contacts the top surface of the second case 720 (that is, when the dimension D=0), the dimension E>0 (the insertion amount of the screw α is ensured). ), the screw α does not fall off the boss 715. Therefore, even if the head of the screw α comes into contact with the top surface of the second case 720, the presence of the screw α prevents the terminal of the lead component β from coming into contact with the top surface of the second case 720 ( A gap is ensured between the terminal of the lead component β and the top surface of the second case 720). This prevents the terminal of the lead component β from coming into contact with the top surface of the second case 720 if the screw α is loosened, causing the lead component β to come off from the board 400 or being damaged. It can be prevented.

The gaming machine of this embodiment is
Comprising a board 400, a board case 701, and a screw,
The board case includes a first case 710 that covers a first surface of the board, and a second case 720 that covers a second surface of the board,
The board is fixed to the first case by inserting the screw from the second surface side and tightening the screw to the board mounting part of the first case,
Terminals of electronic components inserted from the first surface side of the board protrude from the second surface by a predetermined length,
The electronic component is visible through a top surface of the first case facing the first surface of the board,
The terminal of the electronic component and the head of the screw are visible through the top surface of the second case facing the second surface of the board,
In a state in which the screws are tightened without loosening and the board is fixed to the first case,
The dimension from the second surface of the substrate to the tip of the terminal of the electronic component is a first dimension,
A dimension from the second surface of the substrate to the tip of the head of the screw is a second dimension,
If the dimension from the second surface of the substrate to the top surface of the second case is defined as a third dimension,
the third dimension is larger than the second dimension,
The second dimension is larger than the first dimension.

When the screws are tightened without loosening and the board is fixed to the first case, the third dimension is larger than the second dimension, and the second dimension is larger than the first dimension. It's getting bigger. Therefore, the tip of the head of the screw or the tip of the terminal of the lead component does not come into contact with the top surface of the second case. Thereby, damage to the second case, the lead components, etc. can be prevented.

In addition, the gaming machine of this embodiment is
Comprising a board 400, a board case 701, and a screw,
The board case includes a first case 710 that covers a first surface of the board, and a second case 720 that covers a second surface of the board,
The board is fixed to the first case by inserting the screw from the second surface side and tightening the screw to the board mounting part (711, 715) of the first case,
Terminals of electronic components inserted from the first surface side of the board protrude from the second surface by a predetermined length,
The electronic component is visible through a top surface of the first case facing the first surface of the board,
The terminal of the electronic component and the head of the screw are visible through the top surface of the second case facing the second surface of the board,
In a state in which the screws are tightened without loosening and the board is fixed to the first case,
The dimension from the second surface of the board to the tip of the terminal of the lead component is a first dimension (dimension A),
The dimension from the second surface of the substrate to the tip of the head of the screw is a second dimension (dimension B),
The dimension from the second surface of the substrate to the top surface of the second case is a third dimension (dimension C),
The dimension from the tip of the head of the screw to the top surface of the second case is a fourth dimension (dimension D),
If the length of the screw inserted into the board mounting part is a fifth dimension (dimension E),
the third dimension is larger than the second dimension,
the second dimension is larger than the first dimension,
The fifth dimension is larger than the fourth dimension.

When the screws are tightened without loosening and the board is fixed to the first case, the third dimension is larger than the second dimension, and the second dimension is larger than the first dimension. It's getting bigger. Therefore, the tip of the head of the screw or the tip of the terminal of the lead component does not come into contact with the top surface of the second case. Thereby, damage to the second case, the lead components, etc. can be prevented. Further, since the fifth dimension is larger than the fourth dimension, if the tightening of the screw becomes loose and the screw moves toward the top side of the second case, the head of the screw Even if the fourth dimension is in contact with the top surface of the second case and the fourth dimension is equal to zero, the fifth dimension is greater than zero. Therefore, even if the head of the screw comes into contact with the top surface of the second case, the screw is inserted into the board mounting part by a predetermined amount, and the screw falls off from the board mounting part. There's nothing to do. Therefore, the terminal of the lead component does not come into contact with the top surface of the second case due to the screw falling off (due to the absence of the screw). This prevents the lead component from coming off from the board or being damaged due to the lead component coming into contact with the top surface of the second case when the screw is loosened. be able to.

Furthermore, in the gaming machine of this embodiment,
The dimension from the first surface of the substrate to the top surface of the first case is a sixth dimension (dimension L),
A height from the first surface of a connector placed on the first surface of the board and covered by the top surface of the first case is defined as a seventh dimension (dimension M);
If the dimension from the first surface of the board to the tip of the screw inserted into the board mounting portion is an eighth dimension (dimension N),
the sixth dimension is larger than the seventh dimension,
The eighth dimension is smaller than the seventh dimension.

Since the sixth dimension is larger than the seventh dimension, when the screws are tightened without loosening and the board is fixed to the first case, the connector is attached to the top surface of the first case. Never come into contact with. This can prevent the connector from being damaged. Furthermore, if the eighth dimension is larger than the seventh dimension, there is a risk that the connector will come into contact with the top surface of the first case because the screw is inserted deep into the board mounting section. However, in this embodiment, since the eighth dimension is set smaller than the seventh dimension, such a possibility can be reduced.

(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described. Hereinafter, descriptions of the same configurations as those of the gaming machine of the fourth embodiment described above will be omitted or simplified. Further, although the explanation will be made using the board 400 of the payout control board unit 700, the present invention is also applicable to other predetermined boards provided in the gaming machine.

FIG. 31A shows an electrolytic capacitor 810 (first component) which is one of the lead components arranged on the board 400. The electrolytic capacitor 810 includes a cylindrical body portion 811 and a lead terminal portion 812 extending from the bottom of the body portion 811 . The lead terminal portion 812 consists of two leads (a pair of leads). The two leads are provided with a predetermined interval α in (along) a predetermined direction (the interval between the leads is α).

Although not shown, the substrate 400 is provided with a through hole (hole) through which the lead terminal portion 812 of the electrolytic capacitor 810 can be inserted. Assuming that the interval (pitch) between the through holes is β, in this embodiment, the interval β is larger than the interval α. For this reason, as shown in FIG. 31(b), the lead terminal portion 812 of the electrolytic capacitor 810 is bent (formed) so that the interval on the tip side becomes β.

The electrolytic capacitor 810 is fixed to the substrate 400 by soldering with the lead terminal portion 812 inserted into a through hole of the substrate 400 . FIG. 31(c) is a diagram showing the second surface side of the substrate 400, and in a state where the electrolytic capacitor 810 is attached to the substrate 400, the tip side of the lead terminal portion 812 is bent. In this embodiment, the tips of each lead face outward (diagonally outward).

As shown in FIG. 32(a), a predetermined distance γ is secured between (the bottom of) the main body 811 and the surface (first surface, mounting surface) of the board 400 (a predetermined gap γ is formed). In other words, the electrolytic capacitor 810 (main body portion 811) is in a state floating by a predetermined distance γ from the surface (first surface) of the substrate 400. In the electrolytic capacitor 810, the lead terminal portion 812 is formed according to the pitch (interval β) of the holes, so the main body portion 811 does not touch the substrate 400 and floats a predetermined distance γ. It is placed on the substrate 400.
Although not shown, when the board 400 is housed in the board case 701 (see the fourth embodiment), there is a predetermined gap between the tip of the electrolytic capacitor 810 and the top surface of the first case 710. is ensured so that the electrolytic capacitor 810 does not come into contact with the top surface of the first case 710.

FIG. 33(a) is a diagram of the first surface of the substrate 400 viewed from the direction normal to the substrate surface. A plurality of holes (through holes) into which the leads of the electrolytic capacitor 810 are inserted are provided in the substrate 400 at predetermined intervals (at predetermined intervals) in (along) a predetermined direction. Here, a direction parallel to the substrate surface and along the predetermined direction is defined as a second direction. In FIG. 33(a), the second direction corresponds to the vertical direction of the figure. Further, the first direction is a direction parallel to the substrate surface and perpendicular to the second direction (direction perpendicular to the second direction). Note that "perpendicular" is not limited to 90 degrees but includes substantially perpendicular; for example, the angle between the first direction and the second direction may be about 75 degrees to about 105 degrees. The electrolytic capacitor 810 is a relatively tall component compared to other electronic components (for example, resistors, etc.) disposed on the board 400, and is less susceptible to force (external force) during assembly than other electronic components. ).

Here, consider two cases in which force is applied to electrolytic capacitor 810 (main body portion 811): a case in which force is applied along the first direction, and a case in which force is applied in the second direction. When a force is applied along the first direction (force toward the first direction), the electrolytic capacitor 810 (main body portion 811) is prone to fall down (the lead terminal portion 812 is easily bent). In other words, the electrolytic capacitor 810 is weak against external force along the first direction, and the lead terminal portion 812 is easily bent. On the other hand, the electrolytic capacitor 810 is strong against external force along the second direction, and the lead terminal portion 812 is less likely to bend than when subjected to an external force along the first direction.

As shown in FIG. 32(a), the distance (height) from the surface (first surface) of the substrate 400 to the tip of the electrolytic capacitor 810 is defined as a distance δ (specific distance). The distance δ can be said to be the distance corresponding to the height of the electrolytic capacitor 810 (from the first surface). Further, as shown in FIG. 33(a), the range inside a circle (virtual circle) centered on the placement position of the electrolytic capacitor 810 and having a distance δ as a radius is defined as a specific range ε. In this embodiment, the ceramic capacitor 820 (second component) is placed within the specific range ε and at a position in the first direction of the electrolytic capacitor 810 (a position adjacent to the electrolytic capacitor 810 in the first direction). has been done.

As shown in FIG. 32(b), when the electrolytic capacitor 810 falls toward the ceramic capacitor 820 due to an external force along the first direction (when the lead is bent), the electrolytic capacitor 810 and the ceramic capacitor 820 come into contact ( contact). In other words, electrolytic capacitor 810 stops falling down (no longer falls down) upon contact with ceramic capacitor 820. In other words, the ceramic capacitor 820 is placed at a position where it contacts (within a contactable range) the electrolytic capacitor 810 whose leads are bent by an external force in the first direction.

The ceramic capacitor 820 has two leads (a pair of leads) extending from the main body, and is soldered with the two leads inserted into the through hole (hole) of the board 400. and is fixed to the substrate 400. The distance between the main body of the ceramic capacitor 820 and the substrate 400 is smaller than the predetermined distance γ described above, and the ceramic capacitor 820 is less likely to fall than the electrolytic capacitor 810 (leads are less likely to bend). There is. Furthermore, in the ceramic capacitor 820, the direction in which the holes into which the leads are inserted (the direction in which the holes are spaced) is the same as the direction in which the holes into which the leads of the electrolytic capacitor 810 are inserted (as described above). (second direction). Therefore, the ceramic capacitor 820 is easy to fall down in the second direction described above, but is difficult to fall down in the first direction described above. Therefore, even if electrolytic capacitor 810 falls down and receives force (force acting in the first direction), ceramic capacitor 820 can support electrolytic capacitor 810 without falling down together with electrolytic capacitor 810.

As shown in FIG. 33A, identification information (silk letters) "C32" corresponding to the ceramic capacitor 820 is written on the substrate 400 near the ceramic capacitor 820. In this embodiment, the identification information “C32” is within the specific range ε and is written at a position of the electrolytic capacitor 810 in the first direction. Specifically, in the first direction, identification information "C32" is written at a position substantially opposite to the electrolytic capacitor 810 with the ceramic capacitor 820 interposed therebetween.
Note that the identification information "C32" is a character string that is a combination of the alphabet "C" representing a capacitor and the number "32" assigned to the capacitor. For example, if the capacitor is assigned the number "3", it will be "C3", and if the capacitor is assigned the number "108", it will be "C108".

As shown in FIG. 33(b), in this embodiment, when the electrolytic capacitor 810 is in a state where it is in contact with the ceramic capacitor 820 when it has fallen down (the leads are bent), the ceramic Even if the capacitor 820 is covered (hidden) and cannot be seen, the identification information "C32" of the ceramic capacitor 820 (contacted component) is not hidden (obstructed) and is visible (i.e. The visibility of the identification information “C32” is ensured). Note that "visible" does not mean that the entire part is visible, but even if the visibility of a part (for example, part of a number) is impaired (hidden). If the identification information "C32" can be identified by the worker, the identification information "C32" can be visually recognized.

The identification information "C32" is written in a position that is not covered by the electrolytic capacitor 810 that is in contact with the ceramic capacitor 820. In this embodiment, the leads of the electrolytic capacitor 810, which is placed floating on the substrate 400 by a predetermined distance γ, are bent when a force is applied in the first direction. This is within a range that does not obscure the identification information "C32".

Note that the identification information “C62” corresponding to the electrolytic capacitor 810 is provided in (one side of) the second direction where the main body portion 811 is difficult to fall down. Therefore, the identification information "C62" is visible even when the electrolytic capacitor 810 falls in the first direction and comes into contact with the ceramic capacitor 820.

Furthermore, in FIG. 33(a), it is assumed that the ceramic capacitor 820 is arranged on one side (left side) adjacent to the electrolytic capacitor 810 in the first direction; Ceramic capacitors 820 may be placed on both sides. In other words, no matter which side the electrolytic capacitor 810 falls on in the first direction, it may come into contact with the ceramic capacitor 820 and stop falling. In that case, even if the electrolytic capacitor 810 falls to any side in the first direction and comes into contact with the ceramic capacitor 820, the identification information of each ceramic capacitor 820 is visible when viewed from the normal direction of the substrate surface. It is now possible to do so.

In this embodiment, the electrolytic capacitor 810 is described as the first component, but the first component is not limited to the electrolytic capacitor 810, and may be another lead component. Specifically, it has a main body and a lead (lead terminal part) extending from the main body, and the main body is placed on the board 400 with the main body floating a predetermined distance, and the leads are bent and the main body Any lead component that can fall down may be used. Furthermore, the number of leads may be two or more, for example, three leads may be provided. In the case of three leads, three holes into which the leads of the first component are inserted are provided in the board 400 at predetermined intervals in a predetermined direction (at predetermined intervals).

Furthermore, in the present embodiment, the component that is within the specific range ε and is arranged in the first direction of the electrolytic capacitor 810 is the ceramic capacitor 820 (second component). It is not limited to 820, but may be other electronic components. However, it is assumed that the second component has a predetermined height from the substrate surface (first surface) and can come into contact with the first component with the lead bent.

Further, the electrolytic capacitor disposed on the substrate 400 may include an electrolytic capacitor 840 (second electrolytic capacitor) (fourth component) in addition to the above-described electrolytic capacitor 810 (first electrolytic capacitor). FIG. 34 is a diagram showing electrolytic capacitor 810 and electrolytic capacitor 840. The electrolytic capacitor 840 includes a cylindrical main body 841 and a lead terminal 842 extending from the bottom of the main body 841. The diameter of the main body 841 of the electrolytic capacitor 840 is larger (has a larger diameter) than the diameter of the main body 811 of the electrolytic capacitor 810. In other words, the size of the main body 841 of the electrolytic capacitor 840 is larger than the size of the main body 811 of the electrolytic capacitor 810.

As described above, the electrolytic capacitor 810 has a formed lead terminal portion 812 and is placed on the substrate 400 with a gap of a predetermined distance γ provided between the main body portion 811 and the substrate 400. On the other hand, in the electrolytic capacitor 840, the distance (gap) between the main body 841 and (the surface of) the substrate 400 is smaller than the predetermined distance γ (the distance between the main body 811 and the substrate 400 in the electrolytic capacitor 810). It has become. The state where the distance is smaller than the predetermined distance γ (a state where the distance is smaller than the predetermined distance γ) includes a state where there is no gap (the gap is 0). In this embodiment, the electrolytic capacitor 840 is arranged on the substrate 400 with no gap provided between the main body 841 and the surface of the substrate 400 (that is, with the main body 841 in contact with the substrate 400). There is. Although not shown, a minute gap (a gap smaller than the predetermined distance γ) may be provided between the main body portion 841 and the surface of the substrate 400. The smaller the gap between the main body 811 (main body 840) and the surface of the substrate 400, the more stable the electrolytic capacitor is when placed on the substrate 400.
When placed on the substrate 400, the electrolytic capacitor 810 is a taller component than the electrolytic capacitor 840.

The interval (pitch) between the holes in the substrate 400 into which the lead terminal portions 812 of the electrolytic capacitor 810 are inserted is β, and in this embodiment, the interval β is 5.5 mm. Further, the interval (pitch) between the holes into which the lead terminal portions 842 of the electrolytic capacitor 840 are inserted is also β (5.5 mm). In other words, the interval between the lead terminal portions 842 is β. Note that the lead terminal portion 842 is not formed. Electrolytic capacitor 810 and electrolytic capacitor 840 have the same pitch of mounting holes (the spacing between the leads of electrolytic capacitor 810 and the lead spacing of electrolytic capacitor 840 are the same). By aligning the pitches of the holes (by aligning the spacing between the leads), it is possible to enjoy the effect that pattern design is facilitated.

An electrolytic capacitor 810 arranged on the substrate 400 with a gap of a predetermined distance γ is an electrolytic capacitor 810 arranged on the substrate 400 with a gap smaller than the predetermined distance γ (including 0). Compared to 840, the leads are more easily bent. In this embodiment, regarding the electrolytic capacitor 810 (first electrolytic capacitor) whose lead is easily bent, even if the lead is bent and comes into contact with a predetermined component (adjacent component), the identification information of the predetermined component is It is designed to be visible.

As shown in FIG. 33(a), the ceramic capacitor 820 (second component) is placed within the specific range ε and at a position in the first direction of the electrolytic capacitor 810. This ceramic capacitor 820 is a component that is more resistant to heat (higher heat resistance) than the IC 830. Furthermore, the ceramic capacitor 820 is a component that generates less (smaller) heat than the IC 830.

The IC 830 (third component) includes a rectangular plate-shaped main body part 831 and a lead terminal part 832 extending from the main body part 831. A plurality of leads constituting the lead terminal section 832 are provided at predetermined intervals along each longitudinal side (each of a pair of long sides) of the main body section 831. The IC 830 is fixed to the substrate 400 by soldering with the lead terminal portion 832 inserted into a through hole of the substrate 400 . At least a portion of the IC 830 is located within the specific range ε and at a position in the second direction of the electrolytic capacitor 810. The IC 830 is a component that is more susceptible to heat (lower heat resistance) than the ceramic capacitor 820. Further, the IC 830 is a component that generates more (larger) heat than the ceramic capacitor 820. Note that in this embodiment, the IC 830 is a plastic packaged IC.
The IC830 is a motor driver, and although it depends on the frequency of use and the situation, it generates a larger amount of heat than the ceramic capacitor 820 when the game machine is played normally and the operation continues for a predetermined period of time. (surface temperature becomes high).

When the electrolytic capacitor 810 is used in a high temperature environment, deterioration is accelerated (deterioration speed is faster) than when used in a low temperature environment. In other words, the electrolytic capacitor 810 is designed to deteriorate more quickly in a high temperature environment.

In this embodiment, the IC 830 with low heat resistance is arranged in the second direction of the electrolytic capacitor 810, but the leads of the electrolytic capacitor 810 are difficult to bend in the second direction. In other words, the heat-sensitive component (IC 830) is placed in a position where it is difficult for the electrolytic capacitor 810 to come into contact with it. In other words, it is difficult for the electrolytic capacitor 810 to come into contact with the IC 830 (a heat-sensitive component). This can prevent the electrolytic capacitor 810 from coming into contact with the IC 830 and damaging the IC 830 due to heat.
Note that the component (ceramic capacitor 820) whose lead bends easily and is placed in a position where the electrolytic capacitor 810 is likely to come into contact with it is resistant to heat, so it is difficult to be damaged even if the electrolytic capacitor 810 comes into contact with it. .

Further, although the IC 830 that generates a large amount of heat is disposed in the second direction of the electrolytic capacitor 810, the leads of the electrolytic capacitor 810 are difficult to bend in the second direction. In other words, a component (IC 830) that generates a large amount of heat is placed in a position where it is difficult for electrolytic capacitor 810 to come into contact with it. In other words, it is difficult for the electrolytic capacitor 810 to come into contact with the IC 830. This can prevent electrolytic capacitor 810 from coming into contact with IC 830, causing electrolytic capacitor 810 to reach a high temperature, and promoting deterioration of electrolytic capacitor 810.
Note that a component (ceramic capacitor 820) whose lead is easily bent and placed in a position where electrolytic capacitor 810 is likely to come into contact with it (ceramic capacitor 820) generates a small amount of heat, so even if electrolytic capacitor 810 contacts ceramic capacitor 820, electrolytic Deterioration of the capacitor 810 is less likely to be accelerated.

The gaming machine of this embodiment is
A substrate 400;
A component arranged on the substrate,
The components include a first component (electrolytic capacitor 810) and a second component (ceramic capacitor 820),
The first component includes a main body part 811 and a lead terminal part 812 having a plurality of leads extending from the main body part,
The substrate includes a plurality of holes provided at predetermined intervals in a predetermined direction,
The first component is placed on the substrate with the plurality of leads inserted into the plurality of holes and a predetermined gap formed between the main body and the substrate,
A second direction is a direction parallel to the substrate surface and along the predetermined direction,
A first direction is a direction parallel to the substrate surface and perpendicular to the second direction,
If the distance from the substrate to the tip of the main body is a specific distance,
On the board, the second component is arranged within a circle having the position of the first component as the center and the specific distance as the radius, and identification information corresponding to the second component is written. and
The second component and the identification information are provided in the first direction of the first component,
When a force acting in the first direction is applied to the main body portion, the lead terminal portion is bent, and the main body portion is in contact with the second component, when viewed from the normal direction of the substrate surface, The identification information is visible.

When a force acting in the first direction is applied to the main body portion, the lead terminal portion is bent, and the main body portion is in contact with the second component, when viewed from the normal direction of the substrate surface, The identification information is visible. Therefore, even if at least a portion of the second component is covered by the abutment of the main body, making it difficult to visually recognize the second component, the identification information corresponding to the second component The second component can be identified (identified) via the second component. As a result, when the lead terminal portion of the first component is bent, it becomes difficult to identify the component covered by the first component (the second component), which makes it difficult to perform work (inspection work, etc.). Decrease in efficiency can be suppressed.

Furthermore, in the gaming machine of this embodiment,
The first component is configured such that when a force acting in the second direction is applied to the main body part, the lead terminal part is stronger than when a force acting in the first direction is applied to the main body part. is becoming difficult to bend,
Identification information corresponding to the first component is provided in the second direction of the first component.

Identification information corresponding to the first component is provided in the second direction in which the lead terminal portion is difficult to bend. Therefore, when the lead terminal portion is bent, it is possible to suppress the visibility of the identification information corresponding to the first component from being impaired.

Furthermore, in the gaming machine of this embodiment,
The component includes a third component (IC830) disposed on the substrate such that at least a portion thereof is included within the range of the circle and located in the second direction of the first component,
The third component has a larger calorific value than the second component disposed in the first direction of the first component,
The first component deteriorates more quickly in a high temperature environment,
The first component is configured such that when a force acting in the second direction is applied to the main body part, the lead terminal part is stronger than when a force acting in the first direction is applied to the main body part. is becoming difficult to bend.

The first component is a component whose deterioration is accelerated in a high temperature environment, and the third component having a large amount of heat is arranged in the second direction of the first component. The lead terminal portion is difficult to bend in the second direction. In this way, by arranging the third component that generates a large amount of heat on the side where the lead terminal portion is difficult to bend, the first component comes into contact with the third component, and the first component becomes high temperature and the third component generates a large amount of heat. Acceleration of deterioration of the first component can be suppressed.
Further, the second component, which is disposed on the side where the lead terminal portion is more likely to bend (the side where the first component is more likely to abut), is a component that generates less heat than the third component. Therefore, even if the first part comes into contact with the second part, the first part becomes high temperature under the influence of the ambient temperature, and the deterioration of the first part is prevented from being accelerated. can.

Furthermore, in the gaming machine of this embodiment,
The component includes a third component (IC830) disposed on the substrate such that at least a portion thereof is included within the range of the circle and located in the second direction of the first component,
The third component has lower heat resistance than the second component disposed in the first direction of the first component,
The first component is configured such that when a force acting in the second direction is applied to the main body part, the lead terminal part is stronger than when a force acting in the first direction is applied to the main body part. is becoming difficult to bend.

Although the third component having low heat resistance is arranged in the second direction of the first component, the lead terminal portion of the first component is difficult to bend in the second direction. In this way, by arranging the third component on the side where the lead terminal part is difficult to bend (the side where the first component is difficult to contact), the first component comes into contact with the third component, and the heat-resistant It is possible to suppress failure (deterioration) of the third component having a low temperature.
Note that by arranging the second component, which has higher heat resistance than the third component, on the side where the lead terminal part is likely to bend (the side where the first component is likely to come into contact), the first component can be brought into contact with the second component. It is possible to suppress failure of the second component when the second component comes into contact with the second component.

Furthermore, in the gaming machine of this embodiment,
The parts include a fourth part (electrolytic capacitor 840) which is the same type of part as the first part and whose main body is larger in size than the first part,
The first component and the fourth component have the same distance between the holes into which the lead terminal portions are inserted,
The fourth component is placed on the substrate such that a gap between the main body and the substrate is smaller than the predetermined gap in the first component.

The first component has a spacing between holes in the board into which the lead terminal portion is inserted (same as the spacing between holes into which the lead terminal portion of the fourth component is inserted, where the main body portion is larger than the first component). ), the lead terminal portion is bent. The first component is placed on the substrate with a predetermined gap formed between the main body (the main body of the first component) and the substrate. On the other hand, the fourth component is arranged on the substrate such that a gap between the main body (main body of the fourth component) and the substrate is smaller than the predetermined gap. The lead terminal portion of the first component is more easily bent than the fourth component.
In this embodiment, with respect to the first component different from the fourth component, a force acting in the first direction is applied to the main body portion (the main body portion of the first component), and the lead terminal portion (the first component Even if the lead terminal portion (of the lead terminal portion) is bent and the main body portion (the main body portion of the first component) is in contact with the second component, the identification information ( (identification information of the second part) is visible. As a result, when the lead terminal portion of the first component is bent, it becomes difficult to identify the component (the second component) covered by the first component, and the work (inspection work) becomes difficult. This can prevent the efficiency from decreasing.

In FIG. 31(c), in the case of the electrolytic capacitor 810, the tips of the terminals of the pair of leads are each directed outward (diagonally outward). On the other hand, in FIG. 30 according to the fourth embodiment, in the case of the lead component β, the tips of the terminals of the pair of leads are each directed inward. Here, the lead component β is a resistor. By bending the tip of the lead differently depending on the type of the lead component (by setting rules for how to bend the lead), it is possible to bend only the second surface of the board 400. You can identify (narrow down your search) what type of part it is by looking at it. This makes it possible to improve the efficiency of inspections and other tasks.

(Sixth embodiment)
Next, a sixth embodiment of the present invention will be described. Hereinafter, descriptions of the same configurations as those of the gaming machine of the fourth embodiment described above will be omitted or simplified. Further, although the explanation will be made using the board 400 of the payout control board unit 700, the present invention is also applicable to other predetermined boards provided in the gaming machine.

30 shows a case where the board 400 is fixed to the first case 710 (boss 715) using the screw α, and a pot screw is used as the screw α, but in this embodiment, as shown in FIG. A countersunk screw S is used as a screw (fixing member) for fixing 400 to the first case 710 (first member). The metal countersunk screw S has a flat upper surface (flat surface) and a conical seat surface. The countersunk screw S is a screw used when, for example, a counterbore is provided on the member to be tightened so that the head does not protrude, but in this embodiment, a counterbore is not provided in the board 400, which is the member to be tightened. flat head screws S are used. Here, the dimension of the board case 701 (case) in the same direction as the thickness direction of the board 400 is defined as "thickness of the board case 701". The board case 701 is required to be thinner (thinner) in order to secure mounting space for other components.

The countersunk screw S has a flat head top surface, so the height of the head is lower than that of the pan screw (the axial dimension B is smaller). A predetermined gap (dimension D) is secured between the head of the screw and the board case 701 (second case 720), but the countersunk screw S has a smaller dimension B than the pan screw. When using a pan screw, the second case 720 (second member) can be placed closer to the board 400 (the space inside the board case 701 can be made smaller) than when using a pot screw. . That is, when flat head screws S are used, the board case 701 can be formed thinner than when pan head screws are used, and miniaturization and space saving can be achieved.

Note that when the thickness of the board case 701 (the space inside the board case 701) is constant, the head of the screw and the second case are better when using flat head screws S than when using pan screws. 720 (dimension D) can be ensured. Therefore, the possibility that the head of the screw comes into contact with the second case 720 and the second case 720 is damaged can be reduced. Also, when comparing the contact area with the board 400 (flat board surface) (second surface) between the head of the countersunk screw S and the head of the pan screw, the head of the countersunk screw S is larger than the head of the pan screw. The contact area with the substrate 400 is smaller than that of the other parts. Therefore, when the screws are tightened, the range in which force is applied to the board can be reduced, and damage to the board can be suppressed.

As shown in FIG. 29 etc., a substantially circular pattern-free area N (area where no copper foil is provided) is provided around the through hole 450 (screw insertion hole) (screw hole) of the board 400. It is being The substantially circular shape includes a circular shape (an isolated circle), and also includes a case where a part of the circle is connected to another pattern-free region N and is not a perfect circle. The outer side (radially outer side) of the substantially circular pattern-free area N is an area where a pattern is formed (copper foil is provided).

Although not shown, the diameter of the non-patterned region N around the through hole 450 is larger than the diameter of the head of the countersunk screw S. For example, the diameter of the non-pattern forming area N is approximately 1 to 3 mm larger than the diameter of the head of the countersunk screw S. The non-pattern forming area N has a size that prevents the head of the countersunk screw S from protruding outward from the non-pattern forming area N when viewed from the normal direction of the substrate surface (second surface). The size of the area is such that the area can fit inside the non-patterned area N. Therefore, it is possible to prevent the screw and the copper foil from coming into contact and being electrically conductive, thereby preventing damage to the component. Moreover, damage to the copper foil due to contact with the screw can be prevented. Moreover, even if a screw with a large head diameter (different from the designed one) is used, the possibility that the head of the screw will come into contact with the copper foil can be reduced.

Here, the radially outer end of the head of the flatsunk screw S is defined as the outer end of the head of the flatsunk screw S. As shown in FIG. 35, when the countersunk screw S is tightened to the first case 710 (the board 400 is fixed by the countersunk screw S), the second surface of the board 400 and the head of the countersunk screw S are The gap between the outer end portion (the gap in the axial direction of the screw) is defined as a first gap.

Electronic components are mounted on the first surface of the board 400. Further, the head of the countersunk screw S is located on the second surface of the substrate 400. Here, among the spaces formed inside the board case 701, the space on the first surface side is referred to as a first space, and the space on the second surface side is referred to as a second space. In this embodiment, in a state where the substrate 400 is enclosed (housed) in the substrate case 701, a second gap is provided that communicates (connects) the first space and the second space. Air within the board case 701 can move between the first space and the second space via the second gap. The second gap is formed, for example, between a predetermined outer edge (outer end) of the substrate 400 and the inner surface (inner surface) of the substrate case 701.

The second gap is smaller than the size of the electronic component (component) placed on the first surface of the board 400. In other words, the electronic component placed on the first surface of the board 400 is larger than the second gap. The second gap has a size that does not allow electronic components placed on the first surface of the substrate 400 to pass (move) from the first space to the second space. In the case where "the second gap is smaller than the size of the electronic component arranged on the first surface of the board 400", the second gap is defined in each direction of the electronic component (vertical direction, horizontal direction, It means that it is smaller than the smallest width (dimension) of the widths (dimensions) in the radial direction, etc. For example, in the case of an elongated plate-shaped electronic component whose thickness dimension is smaller than its lateral dimension, the thickness dimension becomes the "smallest width." Even if an electronic component placed on the first surface of the board 400 comes off and moves, the electronic component cannot move from the first space to the second space via the second gap. . Therefore, it is possible to inspect only the first space side for the presence or absence of detached parts (dropped parts).

Part of the electronic component placed on the first surface of the board 400 may be chipped due to deterioration or the like. And it may happen that this missing part (fragment) is smaller than the second gap. In other words, the chipped part (fragment) may move from the first space to the second space via the second gap. If the chipped part moves to the second space, it is possible to check the presence or absence of the chipped part by checking the second space side, but if the chipped part remains stuck in the first gap. In this case, it becomes difficult to notice the presence of the missing part.

In this embodiment, the first gap is smaller than the second gap. Therefore, even if a chipped part (fragment) moves from the first space to the second space through the second gap, it is difficult for the part to get caught (enter) into the first gap. ing. In other words, there is a low possibility that the chipped component will be caught (entered) in the first gap. Thereby, even if a part is damaged and chipped, the possibility of finding the chipped part can be increased.

In this embodiment, in the payout control board unit 700, countersunk screws are used when fixing the board 400 to the board case 701, thereby reducing the size and saving space. However, in a predetermined board unit arranged in a place where space constraints are relatively less severe, pan screws or countersunk screws may be used when fixing the board to the board case. Moreover, pan screws or countersunk screws may be used when fixing predetermined members in design parts other than the board unit. In other words, countersunk screws can be used in board units that require space saving, and countersunk screws can be used in other locations as appropriate.

The gaming machine of this embodiment is
comprising a substrate (400), a case (701) that accommodates the substrate, and a fixing member that fixes the substrate to the case,
The board includes a screw hole,
The fixing member is a countersunk screw (S),
The countersunk screw is inserted into the screw hole from one side of the board and tightened to the case,
A first gap is formed between a radially outer end of the head of the countersunk screw and one surface of the substrate.

The head of the countersunk screw has a flat upper surface, and the height of the head is lower than that of a pan screw. Therefore, the case can be placed closer to the substrate than when pot screws are used. Therefore, the thickness of the case can be reduced. Therefore, it is possible to realize miniaturization and save space. Furthermore, the countersunk screw has a smaller contact area with the substrate than when using a pan screw. Therefore, the range in which force is applied to the substrate can be reduced, and damage to the substrate can be suppressed.

Furthermore, in the gaming machine of this embodiment,
The case includes a first member (first case 710) that covers a first surface of the substrate, and a second member (second case 720) that covers a second surface of the substrate,
The countersunk screw is inserted into the screw hole from the second surface side of the substrate and tightened to the first member,
A component is arranged on the first surface side of the substrate,
The head of the countersunk screw is arranged on the second surface side of the substrate,
A second gap is provided in the case to communicate the space on the first surface side and the space on the second surface side,
The second gap is smaller than the size of a component disposed on the first surface side of the substrate,
The first gap is smaller than the second gap.

Since the second gap is smaller than the size of the component disposed on the first surface side of the substrate, the component is removed from the space on the first surface side through the second gap. This can prevent it from moving into the space on the side. Furthermore, since the first gap is smaller than the second gap, if a part of the component disposed on the first surface side of the board is chipped, the chipped part (fragment) is transferred to the second gap. Even if the component moves from the space on the first surface side to the space on the second surface side through the gap, it is possible to prevent the component from being caught (entering) into the first gap. This increases the possibility of finding missing parts.

Furthermore, in the gaming machine of this embodiment,
The periphery of the screw hole on the second surface is a substantially circular area in which no copper foil is formed,
The diameter of the region is larger than the diameter of the head of the countersunk screw.

Since the diameter of the region is larger than the diameter of the head of the countersunk screw, it is possible to prevent the head of the countersunk screw from contacting the copper foil and electrically conducting, thereby preventing damage to the component. Moreover, damage to the copper foil due to the contact can be prevented. Moreover, even if a screw with a large diameter head is used, the possibility that the head of the screw will come into contact with the copper foil can be reduced.

(Seventh embodiment)
Next, a seventh embodiment of the present invention will be described. Hereinafter, descriptions of the same configurations as the gaming machine of the first embodiment described above will be omitted or simplified.

The front case 402a shown in FIG. 7 is a cover member placed on the rear side of the gaming machine, and is made of transparent resin. In this embodiment, ABS resin (a copolymer synthetic resin of acrylonitrile, butadiene, and styrene) is used as the resin. On the other hand, the back case 402b is a base member placed on the front side of the gaming machine, and is made of transparent resin. In this embodiment, PC (polycarbonate) resin is used as the resin. The front case 402a and the back case 402b are both made of transparent resin, but are made of different materials. As shown in FIG. 7, a seal (sticker 410) is pasted on the front case 402a. On the other hand, no sticker is attached to the back case 402b.

Parts that generate heat (heat generating parts) are provided around the payout control board 400 (board case 402) (payout control board unit 401). A payout control board 400 is arranged inside the board case 402, and various electronic parts are arranged on the payout control board 400, including parts that generate heat. Furthermore, parts that generate heat (heat-generating parts) are arranged around (near) the board case 402. The component is provided, for example, on the front side of the board case 402 (back case 402b: base member) that houses the payout control board 400 (the back side of the board case 402 when viewed from the rear of the gaming machine). Note that the component may be provided on the left side, right side, upper side, or lower side of the board case 402 (payout control board 400) when viewed from the rear of the gaming machine. The component includes, for example, a power supply board (power supply board unit). A plurality of components are arranged on the power supply board, and among the plurality of components, the coil and the power supply IC are components that generate a relatively large amount of heat. Furthermore, such components include, for example, a board on which components such as a motor, a motor driver (IC), and an LED driver (IC) are mounted. The number of heat-generating components arranged around the board case 402 is not limited to one, and a plurality of components may be provided. In order to save space within the housing, the component may be placed relatively close to the payout control board 400 (payout control board unit 401).

In an environment where temperature changes occur (for example, at high temperatures), gas may be generated from the surface of the case (member) made of PC resin. For this reason, when a sticker is pasted on the surface of the case, the generated gas is trapped inside the sticker, forming bubbles within the sticker (accumulation of air bubbles), and creating unevenness on the surface of the sticker (surface may become bumpy). As shown in FIG. 9, the seal 410 is provided with a field for writing in the person who opened the seal, a field for writing in the opening date, etc., and characters may be written thereon. The visibility of the characters decreases (it becomes difficult to see the characters). Further, when the unevenness is formed, it becomes difficult to write characters on the sticker 410. The seal 410 is made of a vinyl chloride film that has excellent heat resistance and weather resistance. Therefore, unlike paper stickers, they have low breathability and are difficult for air bubbles to pass through (difficult to escape to the outside). As a result, when gas is generated and unevenness is formed, it is difficult to eliminate the unevenness.

In an environment where temperature changes occur (for example, at high temperatures), a case made of ABS resin generates less gas than a case made of PC resin. Therefore, in this embodiment, the front case 402a to which the sticker 410 is attached is made of ABS resin, and the back case 402b to which the sticker is not attached is made of PC resin. By pasting the sticker 410 on the surface of the front case 402a made of ABS, formation of irregularities on the surface of the sticker 410 can be suppressed. This can prevent difficulty in visually recognizing the characters written on the sticker 410 or in writing the characters on the sticker 410.

Further, in this embodiment, the volume of the back case 402b (base member) is larger than that of the front case 402a (cover member). That is, the back case 402b, which has a larger volume than the front case 402a, is made of PC resin, and the front case 402a, which has a smaller volume than the back case 402b, is made of ABS resin. PC resin has higher strength than ABS resin. Further, the back case 402b is a component placed closer to the player than the front case 402a in the gaming machine. The anti-fraud performance can be improved by forming the back case 402b, which has a larger volume and is placed on the player side, from a stronger material (PC resin) than the front case 402a.

Further, the front case 402a and the back case 402b are caulked and combined. Therefore, the board case 402 cannot be opened unless the caulked portion is destroyed. In this embodiment, this caulking portion is formed of PC (a part of the back case 402b). In other words, a part of the back case 402b made of PC is caulked. By forming the caulked portion with a PC resin that has higher strength than ABS resin, it is possible to make the caulked portion more difficult to destroy. This makes it possible to improve anti-fraud performance.

The front case 402a includes a boss having a screw hole, and the dispensing control board 400 is screwed and fixed to the front case 402a. If the front case 402a were made of PC, its high strength would require a large force to tighten the screws, reducing workability. In this embodiment, since the front case 402a is made of ABS resin instead of PC resin, such a decrease in workability can be avoided.

The gaming machine of this embodiment is
comprising a substrate (400) and a case (402) accommodating the substrate,
The case includes a first member (front case 402a) that covers one side of the board, and a second member (back case 402b) that covers the other side of the board,
A sticker (410) on which predetermined information can be written is pasted on the first member,
The first member is made of ABS resin,
The second member is made of polycarbonate resin.

If the first member is made of polycarbonate resin and the seal is attached to the first member, bubbles will be formed in the seal due to the generation of gas, and unevenness will be formed on the surface of the seal. There are cases. In this case, it becomes difficult to write predetermined information on the seal, and when predetermined information is written on the seal, it becomes difficult to visually recognize the predetermined information. In this embodiment, since the first member to which the seal is attached is made of ABS resin, which is less likely to generate gas than polycarbonate resin, it is possible to suppress the formation of unevenness on the surface of the seal. This can prevent difficulty in writing predetermined information on the seal and visually recognizing predetermined information written on the seal. Further, by forming the second member not from ABS resin but from polycarbonate resin, which has higher strength than ABS resin, anti-fraud performance can be improved.

Furthermore, in the gaming machine of this embodiment,
A component that generates heat is provided around the case,
No sticker is attached to the second member,
The volume of the second member is larger than the volume of the first member.

Parts that generate heat are provided around the case, and the seal is attached to the first member made of ABS, and the second member made of PC has the seal attached. Not pasted. Therefore, it is possible to prevent unevenness from being formed on the surface of the seal. Further, the second member, which has a larger volume than the first member, is made of PC resin, which has higher strength than ABS resin. By forming the larger-volume member (the second member) from a material with high strength, anti-fraud performance can be improved.

(Eighth embodiment)
Next, an eighth embodiment of the present invention will be described. Hereinafter, descriptions of the same configurations as those of the gaming machine of the fourth embodiment described above will be omitted or simplified.

FIG. 36 is a diagram of a part of the mounting surface (front surface) (first surface) of the board 400 (dispensing control board 400) of this embodiment, viewed from a direction perpendicular to the mounting surface (direction normal to the first surface). It is. In this embodiment, an insertion-mount type main IC 900 (specific IC) (CPU) (specific integrated circuit) is mounted on the board 400. The main IC 900 controls various processes performed by the board 400. In this embodiment, a plurality of types of ICs are arranged on the substrate 400, and the main IC 900 is one of them, and the number of main ICs 900 arranged is one. The main IC 900 includes a main body part (package) 910 that is formed into a substantially rectangular plate shape and contains a CPU, memory, etc., and a plurality of IC terminals (lead pins) that are electrically connected to the circuit built in the main body part 910. It is equipped with T.

In this embodiment, a ZIP (Zigzag In-Line Package) type is used as the main IC 900, and the IC terminals T are arranged in a zigzag pattern alternately from one side (one side) of the main body 910 toward the mounting surface. It has been extended. Note that the main IC 900 may be of the SIP (Single In-Line Package) type, in which case the IC terminals T are arranged in a line from one side (one side) of the main body 910 toward the mounting surface. It will be extended.

FIG. 37 is a schematic diagram of a portion of the board 400 where the main IC 900 is arranged, viewed from the direction (side) directly facing the plate surface of the main body portion 910 of the main IC 900. Here, regarding the main body portion 910 having a substantially rectangular plate shape, the direction along the long side is defined as the "longitudinal direction", and the direction along the short side is defined as the "lateral direction". Further, the thickness direction of the main body portion 910 is referred to as the "thickness direction". The main IC 900 is arranged such that one side in the longitudinal direction of the main body 910 is located on the mounting surface side, and each side in the lateral direction of the main body 910 is approximately perpendicular (including perpendicular) to the mounting surface of the board 400. ing. Here, the surface of the main body section 910 that faces the mounting surface of the substrate 400 is defined as the bottom surface of the main body section 910. The bottom surface can be said to be one side surface of a pair of side surfaces facing each other in the lateral direction of the main body portion 910.

The plurality of IC terminals T extend from the bottom surface of the main body section 910 toward the mounting surface side, and are provided at predetermined intervals along the longitudinal direction of the main body section 910. In this embodiment, the plurality of IC terminals T are provided in an alternating zigzag pattern. In other words, the plurality of IC terminals T are provided in two alternating rows. In this embodiment, as the plurality of IC terminals T, 64 IC terminals T1 to T64 are provided. Each IC terminal T is made of conductive metal.

The substrate 400 is provided with 64 through holes corresponding to the IC terminals T1 to T64. The through hole can be said to be a through hole for mounting the main IC 900 (for the main IC 900). The main IC 900 is joined to the substrate 400 by inserting the IC terminals T1 to T64 into the respective through holes and soldering them. In other words, the main IC 900 is placed on the substrate 400 with each IC terminal T and each through hole (wiring pattern connected to the through hole) electrically connected.

A plurality of components (electronic components) are mounted on the board 400 in addition to the main IC 900. Note that the plurality of components may include not only lead components but also surface mount components. The board 400 is provided with a wiring pattern (signal line) that connects (connects) the main IC 900 and a predetermined component. In other words, the board 400 is provided with a wiring pattern (signal line) that connects the IC terminal T of the main IC 900 (through hole corresponding to) and the terminal of a predetermined component (through hole corresponding to). .

FIG. 38 is a diagram of a part of the back surface (second surface) of the substrate 400 (the back side of the mounting position of the main IC 900) as viewed from a direction perpendicular to the back surface (the normal direction of the second surface). In this embodiment, all the wiring patterns 920 connecting the main IC 900 and the components arranged on the board 400 have at least a portion on the main IC 900 side connected to the IC terminal T of the main IC 900 on the second surface of the board 400. has been done.

The wiring pattern 920 includes a wiring pattern 921 in which all routes are provided on the back surface (second surface) of the board 400, and a wiring pattern 921 in which all routes are provided on the back surface (second surface) of the board 400, and a portion (the part on the main IC 900 side) is provided on the back surface (second surface) of the board 400. There is a type of wiring pattern 922 that is provided on the surface (first surface) of the substrate 400 and a portion (the portion on the mating component side) is provided on the surface (first surface) of the substrate 400. Note that the black areas in the figure indicate that solder is attached.

The wiring pattern 922 is a wiring pattern (IC-side wiring pattern 922a) of a predetermined length including a connection portion with a predetermined IC terminal T (through hole corresponding to the main IC 900), and is formed on the back surface of the substrate 400. As shown in FIG. 36, a wiring pattern of a predetermined length (a mating wiring pattern 922b) including a connecting portion with a predetermined terminal (a corresponding through hole) of a mating component is formed on the surface of the board 400, and both They are connected via vias 923 (via holes) (through holes). In this embodiment, among the wiring patterns connecting a predetermined terminal T of the main IC 900 and a predetermined terminal of another component, a predetermined length of the wiring pattern including at least a connection portion with the terminal T is provided on the back side of the substrate 400. It is set in.

As shown in FIG. 36, on the surface (mounting surface) of the board 400, all the through holes for the main IC 900 (the through holes into which the IC terminals T are inserted) are provided. A surrounding ground pattern Y (ground pattern region Y) (solid ground portion Y) is provided. In other words, on the surface of the board 400, there is no wiring pattern (wiring pattern 920) connecting the main IC 900 and other components around all the through holes (all IC terminals T) for the main IC 900. , a ground pattern region Y is provided that is not separated by the wiring pattern.

Furthermore, a ground pattern area Z is provided on the back surface of the substrate 400 in a portion including the area around the through hole for the main IC 900. The ground pattern region Y (first ground pattern) and the ground pattern region Z (second ground pattern) are electrically connected via a ground through hole (ground through hole 960, etc.).

With this configuration, the noise resistance of the main IC 900 can be improved. Moreover, heat dissipation can be improved. In addition, on the surface of the board 400, a wiring pattern connecting to the IC terminal T is not provided around the IC terminal T, and the configuration is simple (solid ground portion), so that it is easy to detect if fraud is committed. can do. In other words, the anti-fraud performance can be improved.

Further, in the ground pattern area Y, a frame-shaped silk display 930 indicating the mounting position (mounting area) of the main IC 900 is provided. The silk display 930 (frame line) is formed by, for example, white silk printing. The main IC 900 is placed inside the silk display 930. Note that the size and shape of the silk display 930 will be described later.

In this embodiment, all the wiring patterns 920 connecting the main IC 900 and the components arranged on the board 400 have at least a portion on the main IC 900 side connected to the IC terminal T of the main IC 900 on the second surface of the board 400. has been done. Here, "at least the part on the main IC 900 side", that is, the IC side wiring pattern 922a will be explained. The mating wiring pattern 922b (FIG. 36) is connected to the IC wiring pattern 922a (FIG. 38) provided on the back surface of the board 400 via a predetermined via 923 provided on the outside of the silk display 930. ing. The mating wiring pattern 922b does not straddle the silk display 930. In other words, the mating wiring pattern 922b is formed so as not to go inside the silk display 930. On the back side of the board 400, the IC side wiring pattern 922a is formed with a predetermined length connecting a predetermined position (via 923) outside the silk display 930 on the front surface and a predetermined terminal T of the main IC 900. . The IC side wiring pattern 922a includes a connection portion with the terminal T and has a predetermined length extending at least to the outside of the silk display 930 on the front surface.

As shown in FIG. 36, predetermined IC terminals (pins) of the main IC 900 may be connected to each other by a wiring pattern J (excluding the ground pattern) on the surface (mounting surface) of the board 400. In other words, a wiring pattern (signal line) connecting a predetermined IC terminal and a predetermined IC terminal may be provided on the surface of the substrate 400. By allowing the formation of the wiring pattern on the surface, pattern design can be made more efficient.

Note that the main IC 900 is of the DIP (Dual In-Line Package) type in which terminals extend toward the mounting surface from both sides (each pair of opposing sides) of the main body, not from one side of the main body. Good too. In FIG. 17, for the main IC 500 in which IC terminals extend from both sides of the main body, a first ground pattern 560 and a second ground pattern 561 are installed between the IC terminals P1 to P35 and the IC terminals P36 to P71. A plurality of main IC back through holes 562 are provided as through holes for electrically connecting the first ground pattern 560 and the second ground pattern 561. Even if it is a DIP type main IC, all the wiring patterns 920 (at least the IC side wiring pattern 922a) are provided on one side and the ground pattern area Y is provided on the other side, as in this embodiment. good.

When the main IC 900 is a ZIP type, since the IC terminal T extends from one side (bottom surface) of the main body 910, the opposing area between the main body 910 and the mounting surface of the board 400 is smaller than that of the main IC 500. Furthermore, the interval between the IC terminals T arranged in two rows along the longitudinal direction of the main body portion 910 (the interval between the rows) is also reduced. For this reason, it is difficult to provide a ground pattern or a ground through hole on the surface of the board 400 at a location facing the bottom surface of the main body 910 (the area behind the main IC), and even if it is provided, , resulting in a ground pattern (solid ground portion) with a narrow width and small area.

Therefore, in this embodiment, all the wiring patterns 920 (at least the IC-side wiring patterns 922a) are provided on the back surface of the board 400, and at least the IC-side wiring patterns 922a are not provided on the front surface of the board 400. A ground pattern region Y surrounding the hole is formed. Thereby, even when using the ZIP type main IC 900, noise resistance can be improved. Moreover, heat dissipation can be improved.

Note that in this embodiment, all the wiring patterns 920 (at least the IC side wiring patterns 922a) are provided on the front surface (first surface) of the substrate 400, and the ground pattern area Y is provided on the back surface (second surface) of the substrate 400. It may be configured as follows. However, if the surface on which the main IC 900 is arranged and the surface on which the ground pattern area Y is formed are the same surface (FIG. 36), the surroundings of the main IC 900 will have a simple configuration, making it easier to prevent fraud in the event of fraud. can be found in.

In this embodiment, the substrate 400 is a two-layer substrate, but is not limited to this, and may be a multi-layer substrate. In the case of a multilayer board, the ground can be further strengthened by making a predetermined layer a ground-only layer. In this embodiment, even in the case of a two-layer board, all the wiring patterns 920 (at least the IC side wiring pattern 922a) are provided on one side of the board 400 as described above, and the ground pattern is provided on the other side. By providing the region Y, the noise resistance of the main IC 900 is realized.

Note that for other components other than the main IC 900, wiring patterns that connect other components (connecting terminals of other components) may be provided on the surface of the board 400; may be provided on the back surface of the substrate 400, or may be provided on the front and back surfaces of the substrate 400.

(Silk display)
A plurality of components including the main IC 900 are arranged on the mounting surface (front surface) (first surface) of the board 400. Further, on the mounting surface of the board 400, a silk screen (display) indicating the mounting area (mounting position) of each component is provided. The silk screen display is formed by, for example, white silk printing. A silk display 930 (first display) shown in FIG. 36 is a silk display showing the mounting area of the main IC 900. Note that the silk markings may be written to indicate the external shape of each component when viewed from the direction perpendicular to the mounting surface (according to the external shape of each component), and may be written to indicate the external shape of each component when viewed from the direction perpendicular to the mounting surface, and may differ from the external shape. It may be expressed in a shape (for example, a square frame).

In this embodiment, when viewed from the direction perpendicular to the mounting surface, the outer shape of the main IC 900 and the outer shape of the silk display 930 are different. Note that the silk display 930 may be formed to correspond to the outer shape of the main body section 910 when the main IC 900 is viewed from the direction (side) facing the plate surface of the main body section 910 (FIG. 37). .

Here, a predetermined component other than the main IC 900, which is a component arranged on the mounting surface of the board 400, is referred to as a "predetermined component 940." In other words, the components arranged on the mounting surface of the board 400 are divided into the main IC 900 and the predetermined component 940. At least one predetermined component 940 is provided. The predetermined components 940 include an IC (an IC different from the main IC 900), a resistor array (ladder resistor), a connector, an electrolytic capacitor, and the like.

A silk display 950 (second display) indicating a mounting area of a predetermined component 940 is provided on the mounting surface of the board 400. Here, the IC 941, which is one of the predetermined components 940, will be explained. IC941 is a different type of IC from main IC900. As shown in FIG. 36, in this embodiment, a plurality of ICs 941 are arranged on the mounting surface of the board 400. Further, as shown in FIG. 39(a), a silk display 951 as a silk display 950 corresponding to the IC 941 is provided on the mounting surface of the board 400. The silk display 951 is formed to correspond to the outer shape of (the main body of) the IC 941, and has a notch (recess) in the shape of a semicircular arc.

As shown in FIG. 36, one of the predetermined components 940 includes a resistor array 942. Furthermore, a silk display 952 as a silk display 950 corresponding to the resistor array 942 is provided on the mounting surface of the substrate 400. Further, although not shown, the predetermined component 940 includes a connector, and a silk marking 950 corresponding to the external shape of the connector is provided on the mounting surface of the board 400. Further, although not shown, the predetermined component 940 includes an electrolytic capacitor, and a silk marking 950 corresponding to the outer shape of the electrolytic capacitor is provided on the mounting surface of the board 400.

In this embodiment, the size of the silk display 930 relative to the size of the main IC 900 is larger than the size of the silk display 950 relative to the size of the predetermined component 940 when viewed from the direction perpendicular to the mounting surface. Regardless of whether the predetermined component 940 is an IC 941, a connector, an electrolytic capacitor, etc. (any component for which a silk label is formed along the outer shape), the size of the silk label 930 relative to the size of the main IC 900 is larger than the size of the silk display 950 relative to the size of the predetermined component 940. Here, the "size" refers to the area when viewed from the direction perpendicular to the mounting surface, but may also be the length of the outer periphery when viewed from the direction perpendicular to the mounting surface.

Note that the size of the silk display 950 relative to the size of the predetermined component 940 may be 1 or less. In other words, the predetermined component 940 and the silk display 950 may have the same size, or the size of the silk display 950 may be smaller than the size of the predetermined component 940 (eg, IC 941).

When the predetermined components 940 are all ICs (other ICs) other than the main IC 900 arranged on the board 400, in this embodiment, the size of the silk display 930 with respect to the size of the main IC 900 is different from that of any other IC. The size of the silk display 950 is larger than that of the IC. In other words, the size ratio of silk display 930 to main IC 900 is larger than the size ratio of silk display 950 to any other IC (any other predetermined IC).

The main IC 900 is a core component that controls various processes performed by the board 400. In this embodiment, when viewed from the direction perpendicular to the mounting surface, the area (first margin) of the portion outside (surrounding) the main IC 900 and inside the silk display 930 is the area of the predetermined component 940. The area is larger than the area (second margin) of the outside (periphery) and inside of the silk display 950. Since the main IC 900 has a relatively large first margin, it can be easily identified. This allows the main IC 900 to be quickly identified and confirmed when inspecting the board 400 for illicit activity. Therefore, the efficiency of inspection work can be improved.

The main IC 900 is a ZIP in which an IC terminal T is provided on one side (bottom surface) of the main body 910, and the opposing area between the main body 910 and the mounting surface of the board 400 is small, and The interval between the IC terminals T arranged in two rows along the line (the interval between the rows) is also small. Therefore, in the main IC 900, a ground through hole can be provided on the surface of the board 400 at a location facing the bottom surface of the main body section 910 (the area behind the main IC), that is, between the two rows of IC terminals T (on the inside). It has become difficult.

In this embodiment, at least one ground through hole 960 (specific ground through hole) is provided at a predetermined position near the arrangement position of the main IC 900 and outside the IC terminal T, and The ground pattern area Y (first ground pattern) and the ground pattern area Z (second ground pattern) on the back surface of the substrate 400 are connected to strengthen the ground. For example, if the distance between the main IC 900 and a component placed near the main IC 900 is the first distance, the ground through hole 960 is provided near the placement position of the main IC 900. It is assumed that the ground through hole 960 is provided at a position closer to the main IC 900 than the half distance position (the midpoint of the first distance).

In this embodiment, as shown in FIG. 36, four ground through holes 960 are provided. The silk display 930 is formed to include each ground through hole 960 inside. In other words, the silk display 930 is formed to surround both the main IC 900 and the ground through holes 960 (4 pieces). When using a ZIP type main IC 900, it is difficult to provide a ground through hole on the back of the main IC, so it is highly necessary (important) to provide a ground through hole 960 near (around) the main IC 900. It has become. That is, the ground through hole 960 has a highly important configuration from the viewpoint of ground reinforcement.

By providing the silk display 930 so that the ground through hole 960 is included inside, it becomes clear that the ground through hole 960 is an important component related to the main IC 900. For example, in the design stage, the ground through hole 960 It is possible to prevent the ground through hole 960 from being removed inadvertently or from moving the position of the ground through hole 960 away from the main IC 900.

The ZIP type main IC 900 is a component whose height from the mounting surface is relatively large. Therefore, when an impact or the like is applied to the main body part 910, the main body part 910 is relatively easy to fall down in the thickness direction (left-right direction in FIG. 36). Here, a posture in which the shorter side of the main body portion 910 is perpendicular to the mounting surface of the board 400 is defined as a reference position (inclination is 0 degrees). In this embodiment, even when the main IC 900 (main body part 910) is tilted by approximately 10 to 15 degrees with respect to the reference position, the main body part 910 displays a silk screen when viewed from the direction perpendicular to the mounting surface. It is designed so that it does not protrude outside of 930. If the main body portion 910 protrudes outside the silk display 930 when viewed from the direction perpendicular to the mounting surface, it may be determined that the main IC 900 is not placed in the correct position. In this embodiment, the range (size) of the silk screen display 930 is set in consideration of the inclination of the main body portion 910, so that the possibility of such a judgment can be reduced.

A DIP type IC 941 (FIG. 36) has a plurality of terminals extending along both sides (a pair of long sides) of the main body. The IC 941 is soldered to the substrate 400 with the plurality of terminals inserted into the plurality of through holes of the substrate 400 . In other words, each terminal and each through hole (wiring pattern connected to the through hole) are arranged on the substrate 400 in an electrically connected state.

FIG. 39(b) is a view of the location where a predetermined IC 941 is mounted, viewed from the back side (second surface side). The size (area) of the pad) is larger than the size (area) of the land corresponding to the terminal other than the four corners (through hole other than the four corners). In other words, the amount of solder (solder adhesion amount) at the locations where the terminals at the four corners are fixed is larger than the amount of solder (solder adhesion amount) at the locations where the terminals other than the four corners are fixed. For example, the lands corresponding to the terminals at the four corners have a substantially elliptical shape, and the lands corresponding to terminals other than the four corners have a substantially circular shape. Thereby, the bonding strength between the IC 941 and the substrate 400 can be improved. In other words, the IC 941 can be more firmly fixed to the substrate 400. Note that if the IC 941 is a surface-mounted component, for example, the land may be replaced with a pad.

Although a plurality of components are arranged on the board 400, in this embodiment, there is no component other than the IC 941 that has relatively large lands corresponding to the terminals at the four corners. Therefore, by looking only at the back side (second side) of the board 400, it is possible to specify the mounting position and number of ICs 941 to be mounted. Furthermore, when an IC of a different type than the IC 941 (for example, the main IC 900) is arranged on the board 400, it is possible to identify the IC 941 (a specific type of IC) by looking only at the second surface side of the board 400. . Thereby, the efficiency of inspection work can be improved.

On the mounting surface of the board 400, the distance (shortest distance) between the main IC 900 and the predetermined component 940 disposed closest to the main IC 900 is defined as a first distance. Further, for all the predetermined components 940 other than the main IC 900, the distance (shortest distance) between the predetermined component 940 and the predetermined component 940 disposed closest to the predetermined component 940 is defined as a second distance. In this embodiment, the first distance is set larger (longer) than the second distance. Since the main IC 900 has a relatively large distance from the predetermined component 940 (because it is arranged in an isolated state), it can be identified more easily.

In addition, on the mounting surface of the board 400, the distance (shortest distance) between the main IC 900 and an IC (different from the main IC 900) placed closest to the main IC 900 is defined as a first distance, and an IC other than the main IC 900 If the distance between the closest ICs is the second distance, the first distance is set larger (longer) than the second distance.

The gaming machine of this embodiment is
comprising a substrate (400) and a specific integrated circuit (900) disposed on the substrate;
The specific integrated circuit includes a rectangular plate-shaped main body (910) and a plurality of terminals (T) extending from the main body,
The board includes a plurality of through holes formed so that each of the plurality of terminals can be inserted therethrough,
The specific integrated circuit is arranged on the substrate with the plurality of terminals inserted through the plurality of through holes,
A ground pattern region (Y) surrounding the plurality of through holes is formed on one surface of the substrate,
All the wiring patterns (920) connecting the specific integrated circuit and the components arranged on the board have at least a portion (922a) on the specific integrated circuit side connected to the terminal on the other surface of the board. has been done.

All the wiring patterns connecting the specific integrated circuit and the components arranged on the board have at least a portion on the specific integrated circuit side connected to the terminal on the other surface of the board, and A ground pattern area surrounding the plurality of through holes is formed on one surface of the substrate. Therefore, the ground pattern region is a region formed without being separated by the wiring pattern, and by providing such a ground pattern region, the noise resistance of the specific integrated circuit is improved; Heat dissipation can be improved.

In addition, the gaming machine of this embodiment is
When one side surface of a pair of side surfaces facing each other in the lateral direction of the main body portion is defined as a bottom surface,
The plurality of terminals extend from the bottom surface and are provided along the longitudinal direction of the main body.

The specific integrated circuit is of a type in which the plurality of terminals extend from the bottom surface of the main body, and the plurality of terminals are provided along the longitudinal direction of the main body. In this case, it is difficult to form a ground pattern region on the substrate at a position facing the bottom surface of the specific integrated circuit (on the back side of the specific integrated circuit). In this embodiment, the ground pattern area is an area formed without being separated by the wiring pattern, and by providing such a ground pattern area, a ground pattern can be formed on the back side of the specific integrated circuit. Even if it is difficult to provide a region, it is possible to improve the noise resistance and heat dissipation of the specific integrated circuit.

In addition, the gaming machine of this embodiment is
comprising a substrate (400) and a plurality of components (900, 940) arranged on a first surface of the substrate,
An indication (930, 950) indicating a mounting area of each of the components is provided on the first surface of the board,
The plurality of components include a specific integrated circuit (900) and a predetermined component (940) other than the specific integrated circuit,
If the display corresponding to the specific integrated circuit is a first display (930), and the display corresponding to the predetermined component is a second display (950),
When viewed from a direction perpendicular to the first surface of the substrate, the size of the first indication with respect to the size of the specific integrated circuit is larger than the size of the second indication with respect to the size of the predetermined component. .

The size of the first indication with respect to the size of the specific integrated circuit is larger than the size of the second indication with respect to the size of the predetermined component. Therefore, the specific integrated circuit can be easily identified from among the plurality of components. Thereby, when inspecting the board for tampering, it is possible to quickly identify and confirm the specific integrated circuit. Therefore, the efficiency of inspection work can be improved.

In addition, the gaming machine of this embodiment is
The specific integrated circuit includes a rectangular plate-shaped main body (910) and a plurality of terminals (T) extending from the main body,
When one side surface of a pair of side surfaces facing each other in the lateral direction of the main body portion is defined as a bottom surface,
The plurality of terminals extend from the bottom surface and are provided along the longitudinal direction of the main body,
The board includes a plurality of through holes formed so that each of the plurality of terminals can be inserted therethrough,
The specific integrated circuit is arranged on the substrate with the plurality of terminals inserted through the plurality of through holes,
The substrate includes a specific ground through hole (960) formed in the vicinity of the specific integrated circuit,
The first display is formed to include the specific ground through hole inside.

The specific integrated circuit is of a type in which the plurality of terminals extend from the bottom surface of the main body, and the plurality of terminals are provided along the longitudinal direction of the main body. In this case, it becomes difficult to form a ground through hole in the substrate at a position facing the bottom surface of the specific integrated circuit (on the back side of the specific integrated circuit). Therefore, in this embodiment, the specific ground through hole is provided near the specific integrated circuit to strengthen the ground and improve the noise resistance of the specific integrated circuit. That is, the specific ground through hole has a highly important configuration. Therefore, by forming the first display so as to include the specific ground through hole inside, it becomes clear that the specific ground through hole is an important component related to the specific integrated circuit, and for example, at the design stage. In such cases, it is possible to prevent the specific ground through hole from being carelessly removed, or from moving the specific ground through hole to a position away from the specific integrated circuit.

(Ninth embodiment)
Next, a ninth embodiment of the present invention will be described. Hereinafter, descriptions of the same configurations as those of the gaming machine of the eighth embodiment described above will be omitted or simplified. Further, although the explanation will be made using the board 400 of the payout control board unit 700, the present invention is also applicable to other predetermined boards provided in the gaming machine.

As shown in FIG. 36, a first display 971 is provided on the first surface (front surface) of the substrate 400. Specifically, the first display 971 is a sticker having first information pasted on a predetermined position (predetermined area) on the first surface (mounting surface). The sticker having the first information has a rectangular shape, and the first information is printed in black on a white sheet (film). The first information is information indicating the manufacturing date of the board 400, the lot number of the board 400, etc., and is composed of a plurality of letters, numbers, symbols, and the like.

Further, on the first surface, a silk frame 972 (first frame) (first area) (first range) is provided that indicates the position where the first display 971 is provided (position where the sticker is pasted). The silk frame 972 is provided within the range of the solid ground portion on the first surface, has a larger size (range) than the seal, and is formed by, for example, white silk printing. In this embodiment, the silk frame 972 (frame line) is printed only on the four corner parts (L-shaped parts) of a square (rectangular shape), but the invention is not limited to this. (connected frames). Further, the silk frame 972 includes not only the frame portion but also the area inside the frame, and may be formed, for example, by being filled in a rectangular shape. The provision of this silk frame 972 serves as a guide when attaching the seal to the substrate 400, making the operation of attaching the seal easier.

As shown in FIG. 38, a second display 981 is provided on the second surface (back surface) of the substrate 400. Specifically, the second display 981 has second information formed as etched characters at a predetermined position on the second surface. In other words, in the second display 981, the second information is formed using copper foil characters. The second information is information indicating the manufacturer name of the board 400, the management number of the board 400, etc., and is composed of a plurality of letters, numbers, symbols, and the like. Since the second display 981 is formed of etched characters, it is difficult to tamper with it. In addition, around the etched characters (copper foil characters), there is an etched frame (etched area) 982 (second frame) (second area) (second area) from which the solid ground is removed (no copper foil is provided). range) is established. This etching frame 982 has a substantially square shape (substantially rectangular shape), and in this embodiment, it has a substantially rectangular shape with a notch in a part.

The first display 971 and the second display 981 have different characters printed on the sticker and etched characters, so the reflectance of light, the way they scatter, etc. are different, and they look different. . Further, the substrate 400 is a green substrate. The second display 981 is an etched character and is formed in the same manner as the wiring pattern of the substrate 400, and therefore has the same color as the wiring pattern, specifically, green. On the other hand, the first display 971 is a different color from the second display 981 (and the wiring pattern), specifically black (surrounded by white).

In the substrate 400, the silk frame 972 on the first surface and the etching frame 982 on the second surface are provided at corresponding positions. In other words, the etching frame 982 is provided at a position corresponding to the back side of the silk frame 972. The etching frame 982 (second display 981) is formed within the range of the silk frame 972. In other words, the etching frame 982 (second display 981) is smaller (has a smaller area) than the silk frame 972 and is formed in a size that fits inside the silk frame 972. When looking at the first surface of the substrate 400, an etching frame 982 is present on the back side of the silk frame 972. In other words, the silk frame 972 not only has the function of indicating the position where the first indication 971 is provided (the position where the sticker is pasted), but also has the function of indicating the position where the second indication 981 (etched characters) is provided. There is.

The second surface side is an etched frame 982 excluding the copper foil, while the opposite surface (first surface) is configured to have a sticker attached to it, ensuring a solid ground area (not etched). By securing a solid ground portion in this way, the noise resistance of the board 400 can be improved.

As shown in FIG. 40, a connector 990 to which a harness used for connection with another board is connected is provided at a predetermined position on the first surface of the board 400. Connector 990 has a housing and a plurality of terminals. The housing is made of an insulating resin material (for example, black) and is formed into a substantially rectangular parallelepiped shape. Further, each terminal is formed of a conductive metal, and the substrate 400 and other substrates are electrically connected via the terminal. When attaching the connector 900 to the board 400, each terminal is inserted into each of a plurality of through holes provided in the board 400, and each through hole and each terminal are joined with solder. As a result, the connector 990 is fixed (arranged) on the substrate 400 with each terminal and each through hole (wiring pattern connected to the through hole) electrically connected.

The connector 990 includes 30 terminals from the 1st pin to the 30th pin. Further, the substrate 400 is provided with through holes (first to 30th through holes) corresponding to the first to 30th pins (into which the first to 30th pins are inserted). The first to 30th pins are inserted into the first to 30th through holes. The through hole is provided with copper foil (metal plating) on the inner circumferential surface (inside), and is a conductive material that electrically connects one side (front side) and the other side (back side) of the board. This is a through hole (first conductive through hole) having a conductive through hole. Further, the substrate 400 is provided with a via hole as a second conductive through hole different from the through hole (first conductive through hole). A via hole is a conductive through hole that has copper foil (metal plating) on its inner peripheral surface (inside) and electrically connects one side (front side) of the board to the other side (back side). It is a hole. A via hole is a hole into which a terminal of a component is not inserted. Further, the via hole may have a smaller diameter than the through hole.

FIG. 41 is a diagram of the position where the connector 990 is arranged as viewed from the back side (second side) of the board 400. A wiring pattern 991 is provided on the second surface of the substrate 400 to connect through holes corresponding to predetermined terminals of the connector 990 and predetermined vias (via holes).
Specifically, a wiring pattern 991a connects the through hole corresponding to the 19th pin of the connector 990 and the first via 992a, and a wiring pattern connects the through hole corresponding to the 20th pin of the connector 990 and the second via 992b. 991b, a wiring pattern 991c connecting the through hole corresponding to the 21st pin of the connector 990 and the third via 992c, and a wiring pattern 991d connecting the through hole corresponding to the 22nd pin of the connector 990 and the fourth via 992d. , is equipped with.

The wiring pattern 991a is connected to a wiring pattern 993a (FIG. 40) on the front surface via a first via 992a. The wiring pattern 991b is connected to the wiring pattern 993b (FIG. 40) on the front surface via a second via 992b. The wiring pattern 991c is connected to the wiring pattern 993c (FIG. 40) on the front surface via a third via 992c. The wiring pattern 991d is connected to the front wiring pattern 993d (FIG. 40) via a fourth via 992d.

As shown in FIG. 41, wiring patterns 991a to 991d are provided on the second surface of the board 400 inside a range (referred to as range CA) corresponding to the connector 990 (housing) on the first surface side. There is. In other words, the wiring patterns 991a to 991d are provided on the back side of the connector 990 (housing). When looking at the first surface of the substrate 400 (planar view), the wiring patterns 991a to 991d are not visible.

The first via 992a to the fourth via 992d are provided inside the range CA corresponding to the connector 990 (housing). As shown in FIG. 40, when looking at the first surface of the substrate 400 (when viewed from a direction perpendicular to the first surface of the substrate 400 (first surface normal direction) (when viewed from above)), the first surface of the substrate 400 is The first via 992a to the fourth via 992d are covered (hidden) by the connector 990 (housing) and cannot be visually recognized. In other words, the first via 992a to the fourth via 992d are covered by the connector 990. The board 400 is housed in a board case 701 (FIG. 35), and the connector 990 is exposed through a connector opening 701A (FIG. 42) provided in the board case 701. When the connector 992d is covered by the connector 990 (housing) (FIG. 40), the first via 992a to the fourth via 992d cannot be visually recognized. Therefore, access to the via (wiring pattern: signal line) from outside the board case can be made difficult. This makes it possible to improve anti-fraud performance.

If a wiring pattern drawn out from a through hole corresponding to a predetermined terminal of the connector 990 is provided on the first surface side (only) of the board 400, which terminal does the wiring pattern correspond to? is relatively easy to identify. In this embodiment, as described above, the wiring patterns 991a to 991d are provided on the second surface of the board 400 (the back side of the connector 990), and the vias (first via 992a to fourth via 992d) are placed at positions covered by the connector 990. It is set up in Therefore, it is difficult to specify the correspondence between the terminals (pins) of the connector 990 and the wiring patterns.

Note that although this embodiment has been described using the connector 990, this configuration is also applicable to the connector 570 (a connector having positioning pins) shown in FIG. 18(a).

(Modification 1)
Although not shown, in Modification 1, the wiring patterns 991a to 991d are also provided on the second surface of the board 400 outside the range CA corresponding to the connector 990 (housing) on the first surface side. There is. In other words, the wiring patterns 991a to 991d are provided on the back side of the connector 990 (housing) and on the outside thereof. Further, the first via 992a to the fourth via 992d are provided outside the range CA corresponding to the connector 990 (housing), and the first via 992a to the fourth via 992d are provided outside the range CA corresponding to the connector 990 (housing). Not covered by 990 (housing). In other words, the first via 992a to the fourth via 992d are formed in a position not covered by the connector 990 (housing) (FIG. 42).

FIG. 42 is a view of the substrate 400 viewed from a direction perpendicular to the first surface. The board case 701 is provided with a connector opening 701A for exposing the connector 990. A predetermined gap SK is provided between (the inside of) the connector opening 701A and the connector 990 (housing). In this example, the connector 990 protrudes (extrudes) from the connector opening 701A, and the side surface (outer surface) of the connector 990 and the inner circumferential surface of the connector opening 701A face each other. Note that when the connector 990 does not protrude from the connector opening 701A, the gap between the connector opening 701A and a virtual plane in which the side surface of the connector 990 extends perpendicularly to the board toward the front in the paper is the predetermined gap SK. . In Modified Example 1, when looking at the first surface of the substrate 400 (when viewed from a direction perpendicular to the first surface of the substrate 400), the first via 992a to the fourth via 992d are spaced through a predetermined gap SK. It is formed in a position where it can be visually recognized. In other words, the first via 992a to the fourth via 992d are provided at positions corresponding to the predetermined gap SK. By providing the first via 992a to the fourth via 992d at a position that is not covered by the connector 990 (housing) and is visible through a predetermined gap SK, the heat dissipation effect can be enhanced.

(Modification 2)
Although not shown, in Modification 2, as in Modification 1, the wiring patterns 991a to 991d are located in the range CA on the second surface of the board 400 corresponding to the connector 990 (housing) on the first surface side. It is also located outside. In other words, the wiring patterns 991a to 991d are provided on the back side of the connector 990 (housing) and on the outside thereof. Further, as in the first modification, the first vias 992a to fourth vias 992d are provided outside the range CA corresponding to the connector 990 (housing), and the first vias 992a to 992d are provided on the first surface of the board 400. The fourth via 992d is not covered by the connector 990 (housing). In other words, the first via 992a to the fourth via 992d are formed at a position not covered by the connector 990 (housing). Furthermore, in Modification 1, when looking at the first surface of the substrate 400, the first via 992a to the fourth via 992d are formed at positions where they are visible through a predetermined gap SK. In Modification 2, when looking at the first surface of the substrate 400, the first vias 992a to the fourth vias 992d are not formed in positions where they are visible through the predetermined gap SK. In other words, the first via 992a to the fourth via 992d are not visible through the predetermined gap SK.

The gaming machine of this embodiment is
comprising a substrate (400) and a connector (570 in FIG. 18) disposed on a first surface of the substrate,
The connector includes a positioning pin (574),
The substrate includes a non-conductive through hole (575) into which the positioning pin is inserted,
The thickness of the substrate is greater than the amount of insertion of the positioning pin into the non-conductive through hole,
An annular insulating region (NP) is formed around the non-conductive through hole on the second surface of the substrate,
If the width of the ring of the insulating region is a first width, and the diameter of the non-conductive through hole is a second width,
The first width and the second width are the same or substantially the same width,
A first area (972) indicating a position where a first display is provided is provided on the first surface of the substrate,
A second region (982) surrounding a second display is provided on the second surface of the substrate,
The first region is formed by silk printing,
The second region is formed by etching,
The second region is provided at a position corresponding to the back side of the first region,
The second display is formed in a size that fits inside the first area.

Since the thickness of the substrate is larger than the amount of insertion of the positioning pin into the non-conductive through hole, it is possible to prevent the positioning pin from protruding from the substrate and adhering solder to the positioning pin. Further, it is possible to prevent damage to the positioning pin due to force being applied thereto.
Furthermore, even if the positioning pin is formed long and protrudes from the second surface of the board, there is a possibility that the positioning pin and the pattern (copper foil) will come into contact with each other because the insulating area is provided. is extremely low and can prevent damage to the pattern.
Further, the second area is provided at a position corresponding to the back side of the first area, and the second display is formed in a size that fits inside the first area. The first area has the function of indicating the position where the first display is provided, and also has the function of indicating the position where the second display is provided. Since the second area (the second display) exists on the back side of the first area, it is possible to reduce the time required to look at the second surface side and search for the second display. This makes it possible to improve the efficiency of inspection work (confirmation work). Further, since the second region is made smaller than the first region and the area to be etched is reduced to ensure a solid ground portion, the noise resistance of the substrate can be improved.

The gaming machine of this embodiment is
comprising a substrate (400), a first connector (570) and a second connector (990) arranged on a first surface of the substrate, and a case (701) that accommodates the substrate,
The first connector includes a positioning pin (574),
The substrate includes a non-conductive through hole (575) into which the positioning pin is inserted,
The thickness of the substrate is greater than the amount of insertion of the positioning pin into the non-conductive through hole,
An annular insulating region (NP) is formed around the non-conductive through hole on the second surface of the substrate,
The board includes a first conductive through hole (through hole) into which a predetermined terminal of the second connector is inserted, and a second conductive through hole (via) into which a component terminal is not inserted,
A wiring pattern (991) connecting the first conductive through hole and the second conductive through hole is formed on the second surface of the substrate,
The second conductive through hole is covered by the second connector.

Since the thickness of the substrate is larger than the amount of insertion of the positioning pin into the non-conductive through hole, it is possible to prevent the positioning pin from protruding from the substrate and adhering solder to the positioning pin. Further, it is possible to prevent damage to the positioning pin due to force being applied thereto.
Furthermore, even if the positioning pin is formed long and protrudes from the second surface of the board, there is a possibility that the positioning pin and the pattern (copper foil) will come into contact with each other because the insulating area is provided. is extremely low and can prevent damage to the pattern.
Further, the second conductive through hole is covered with a connector. Therefore, it is possible to make access to the second conductive through hole difficult, and improve anti-fraud performance.

The gaming machine of this embodiment is
A board (400), a first connector (570) and a second connector (990) arranged on a first surface of the board, and a case (701) that accommodates the board,
The first connector includes a positioning pin (574),
The substrate includes a non-conductive through hole (575) into which the positioning pin is inserted,
The thickness of the substrate is greater than the amount of insertion of the positioning pin into the non-conductive through hole,
An annular insulating region (NP) is formed around the non-conductive through hole on the second surface of the substrate,
The board includes a first conductive through hole (through hole) into which a predetermined terminal of the second connector is inserted, and a second conductive through hole (via) into which a component terminal is not inserted,
A wiring pattern (991) connecting the first conductive through hole and the second conductive through hole is formed on the second surface of the substrate,
The case includes a connector opening (701A) that exposes the second connector,
A predetermined gap (SK) is formed between the second connector and the connector opening,
The second conductive through hole is formed at a position that is visible through the predetermined gap.

Since the thickness of the substrate is larger than the amount of insertion of the positioning pin into the non-conductive through hole, it is possible to prevent the positioning pin from protruding from the substrate and adhering solder to the positioning pin. Further, it is possible to prevent damage to the positioning pin due to force being applied thereto.
Furthermore, even if the positioning pin is formed long and protrudes from the second surface of the board, there is a possibility that the positioning pin and the pattern (copper foil) will come into contact with each other because the insulating area is provided. is extremely low and can prevent damage to the pattern.
Furthermore, since the second conductive through hole is formed at a position that is visible through the predetermined gap, the heat dissipation effect can be improved.

(Tenth embodiment)
Next, a tenth embodiment of the present invention will be described. Hereinafter, descriptions of the same configurations as the gaming machine of the first embodiment described above will be omitted or simplified. FIG. 43 is a perspective view of the gaming machine seen from the back side. The gaming machine includes a back cover 1000 made of resin. In other words, the back cover 1000 is attached to the back of the gaming machine. The back cover 1000 has a function of protecting components placed inside it. Further, the back cover 1000 is provided with a plurality of heat radiation holes (elongated holes), and is formed to allow air to pass through and allow heat to escape.

FIG. 44 is a perspective view of the gaming machine viewed from the back side, showing a state with the back cover 1000 removed. Note that in FIG. 44, illustration of a part of the configuration of the gaming machine is omitted. The gaming machine is equipped with an inner frame 7 (body frame) (Fig. 1) that is provided to be openable and closable with respect to the outer frame 2 (Fig. 1), and the inner frame 7 (on the back side of the gaming machine) has a , a sub board unit (sub control board unit) 1200, a main board unit (main control board unit) 1100, and a payout board unit (payout control board unit) 401 are provided. The sub-board unit 1200 includes a sub-board (sub-control board) 202 that controls execution of the presentation, and a sub-board case (board case) 1210 that accommodates the sub-board 202. The main board unit 1100 includes a main board (main control board) 200 that controls the progress of the game, and a main board case (board case) 1110 that houses the main board 200. The payout board unit 401 includes a payout board (payout control board) 400 that controls payout, and a payout board case (board case) 402 that accommodates the payout board 400.

In this embodiment, the sub board unit 1200 (first board unit), the main board unit 1100 (second board unit), and the payout board unit 401 (third board unit) are arranged in this order from top to bottom. . The sub-board unit 1200 is arranged above (upper stage), the payout board unit 401 is arranged below (lower stage), and the main board unit 1100 is arranged between the sub-board unit 1200 and the payout board unit 401 in the vertical direction. It is placed between (center) (middle row). The sub board unit 1200 and the main board unit 1100 located on the upper side are covered by a back cover 1000 from the rear side. On the other hand, the payout board unit 401 located on the lower side is not covered by the back cover 1000 from the rear side.

FIG. 45(a) is a diagram of a part of the gaming machine viewed from the left side (left side view), and shows a state in which the back cover 1000 is attached. FIG. 45(b) is a diagram of a portion of the gaming machine seen from the left side (left side view), and shows a state in which the back cover 1000 is removed. FIG. 46 is a deformed version of FIG. 45(a), and is a schematic diagram for explaining the positional relationship in the front-rear direction of the back cover 1000, sub board unit 1200, main board unit 1100, and payout board unit 401. be. Here, regarding the sub-board unit 1200, the main board unit 1100, and the payout board unit 401, the surface on the rear side (rear side) of the gaming machine (the plane of the board case) is referred to as the "case surface." Further, regarding the cover 1000, the surface (plane) on the rear side (outside) of the gaming machine is referred to as the "cover surface".

In side view (left side view), the case surface (second case surface) of sub-board unit 1200 is located further back than the case surface (first case surface) of main board unit 1100, and the main board unit The dimension (distance in the front-rear direction) from the first case surface of the sub-board unit 1100 to the second case surface of the sub-board unit 1200 is the dimension A. Dimension A is approximately 2 mm. In other words, the dimension A is the dimensional difference between the first case surface of the main board unit 1100 and the second case surface of the sub-board unit 1200.

In a side view (left side view), the case surface (third case surface) of the dispensing board unit 401 is located further back than the case surface (second case surface) of the sub-board unit 1200, and the sub-board unit The dimension from the second case surface of 1200 to the third case surface of payout board unit 401 (distance in the front-rear direction) is dimension B (first dimension). Dimension B is approximately 5 mm. In other words, the dimension difference between the second case surface of the sub board unit 1200 and the third case surface of the payout board unit 401 is the dimension B.

In a side view (left side view), the case surface (third case surface) of the dispensing board unit 401 is located further back than the case surface (first case surface) of the main board unit 1100, and the main board unit The dimension from the first case surface of 1100 to the third case surface of payout board unit 401 (distance in the front-rear direction) is dimension C (second dimension). Dimension C is approximately 7 mm (2 mm + 5 mm). In other words, the dimension difference between the first case surface of the main board unit 1100 and the third case surface of the payout board unit 401 is the dimension C.

In a side view (left side view), the cover surface (outer surface) of the back cover 1000 is located further back than the third case surface of the dispensing board unit 401, and the third case surface of the dispensing board unit 401 The dimension from to the cover surface of the back cover 1000 (distance in the front-rear direction) is dimension D (third dimension). Dimension D is approximately 1 mm. In other words, the dimension D is the difference in dimension between the third case surface of the payout board unit 401 and the cover surface of the back cover 1000. Note that the dimension D may be 0 mm.

In this embodiment, dimension D is set smaller than dimension B and dimension C. In other words, the sub board unit 1200, the main board unit 1100, the payout board unit 401, and the back cover 1000 are arranged so that the dimension D is smaller than the dimensions B and C.

The gaming machine of this embodiment is
Comprising a control board unit and a back cover (1000),
The control board units include a main control board unit (1100) (second board unit), a sub-control board unit (1200) (first board unit), and a payout control board unit (401) (third board unit). , comprising:
The sub-control board unit is arranged above the main control board unit,
The main control board unit is arranged above the payout control board unit,
The main control board unit and the sub control board unit are covered by the back cover from the rear side,
The payout control board unit is not covered by the back cover from the rear side,
A rear surface of the payout control board unit and a rear surface of the back cover are formed to be flush or substantially flush.

In the front-rear direction, there are relatively large variations in the position (dimensions) of each case surface of the sub-board unit 1200, the main board unit 1100, and the payout board unit 401. 1100 is covered, the rear surface (cover surface) of the back cover 1000 and the rear surface (case surface) of the payout board unit 401 are formed to be flush or substantially flush. "Substantially flush" means that the difference in position in the front-rear direction is about 1 to 2 mm. Therefore, the back side of the gaming machine can be made flat (almost flat). As a result, it is possible to suppress the case from getting caught when carrying the case and improve work efficiency.
In addition, since the rear surface of the payout control board unit 401 and the rear surface of the back cover 1000 are formed to be flush or approximately flush, the gaming machine can be placed on the floor or the like with the back side and bottom. When placed on a horizontal surface, it can maintain a stable state without tilting. Further, in this embodiment, each control board unit (sub-control board unit 1200, main control board unit 1100, and payout control board unit 401) and back cover 1000 are made of resin members. Further, each control board unit and the back cover 1000 are attached to predetermined attachment portions (not shown) that are also made of resin. Each control board unit, back cover 1000, or mounting portion can be elastically deformed when a load is applied from the back side. When the gaming machine is placed on a horizontal surface such as the floor with the back side facing down, the aforementioned elastic deformation occurs due to its own weight, and the rear surface of the payout control board unit 401 and the rear surface of the back cover 1000 are flush with each other. Or, it is formed so as to be substantially flush with each other. Therefore, the gaming machine can be placed in a more stable state. Note that the rear surface of the payout control board unit 401 and the rear surface of the back cover 1000 are not flush or substantially flush before elastic deformation (before a load is applied), but after elastic deformation (before a load is applied) The rear surface of the payout control board unit 401 and the rear surface of the back cover 1000 may be formed to be flush or substantially flush.

Also,
The rear side surface of the main control board unit is a first case surface,
The rear side surface of the sub-control board unit is a second case surface,
The rear side surface of the payout control board unit is a third case surface,
If the rear side surface of the back cover is the cover surface,
The third case surface is located on the rear side of the first case surface and the second case surface,
The cover surface is located on the rear side of the third case surface,
The distance from the second case surface to the third case surface in the front-rear direction is a first dimension,
A distance from the first case surface to the third case surface in the front-rear direction is a second dimension,
If the distance from the third case surface to the cover surface in the front-rear direction is the third dimension,
The third dimension is smaller than the first dimension and the second dimension.

(Modification 1)
In the first modification, a sub board unit 1200, a main board unit 1100, and a payout board unit 401 are arranged in this order from the top to the bottom. In other words, the sub board unit 1200 is arranged above (upper stage), the payout board unit 401 is arranged below (lower stage), and the main board unit 1100 is arranged between the sub board unit 1200 and the payout board in the vertical direction. It is arranged between (center) (middle stage) with the unit 401. Sub board unit 1200 and main board unit 1100 are covered by back cover 1000 from the rear side. On the other hand, the payout board unit 401 is not covered by the back cover 1000 from the rear side.

As shown in FIG. 47, in a side view (left side view), the second case surface of the sub-board unit 1200 is located at the rear of the first case surface of the main board unit 1100, and the second case surface of the sub-board unit 1200 The dimension (distance in the front-rear direction) from the first case surface of the sub-board unit 1200 to the second case surface of the sub-board unit 1200 is the dimension A. Dimension A is approximately 3 mm. In other words, the dimension A is the dimensional difference between the first case surface of the main board unit 1100 and the second case surface of the sub-board unit 1200.

In a side view (left side view), the third case surface of the dispensing board unit 401 is located further back than the second case surface of the sub-board unit 1200, and from the second case surface of the sub-board unit 1200, The dimension (distance in the front-rear direction) of the payout board unit 401 to the third case surface is dimension B (first dimension). Dimension B is approximately 5 mm. In other words, the dimension difference between the second case surface of the sub board unit 1200 and the third case surface of the payout board unit 401 is the dimension B.

In a side view (left side view), the third case surface of the payout board unit 401 is located further back than the first case surface of the main board unit 1100, and from the first case surface of the main board unit 1100, The dimension (distance in the front-rear direction) of the payout board unit 401 to the third case surface is dimension C (second dimension). Dimension C is approximately 8 mm (3 mm + 5 mm). In other words, the dimension difference between the first case surface of the main board unit 1100 and the third case surface of the payout board unit 401 is the dimension C.

In a side view (left side view), the third case surface of the dispensing board unit 401 is located further back than the cover surface (outer surface) of the back cover 1000, and the dispensing The dimension (distance in the front-rear direction) of the board unit 401 to the third case surface is dimension D (third dimension). Dimension D is approximately 1 mm. In other words, the dimension difference between the third case surface of the payout board unit 401 and the cover surface of the back cover 1000 is the dimension D.
Note that when the third case surface of the dispensing board unit 401 is used as a reference (±0 mm), the dimension (front-back distance) from the third case surface of the dispensing board unit 401 to the cover surface of the back cover 1000 is the dimension D ( -1mm). Note that the dimension D may be 0 mm.

In Modification 1, dimension D is set smaller than dimension B and dimension C. In other words, the sub board unit 1200, the main board unit 1100, the payout board unit 401, and the back cover 1000 are arranged so that the dimension D is smaller than the dimensions B and C.

The gaming machine of modification example 1 is
Comprising a control board unit and a back cover (1000),
The control board units include a main control board unit (1100) (second board unit), a sub-control board unit (1200) (first board unit), and a payout control board unit (401) (third board unit). , comprising:
The sub-control board unit is arranged above the main control board unit,
The main control board unit is arranged above the payout control board unit,
The main control board unit and the sub control board unit are covered by the back cover from the rear side,
The payout control board unit is not covered by the back cover from the rear side,
A rear surface of the payout control board unit and a rear surface of the back cover are formed to be flush or substantially flush.

Also,
The rear side surface of the main control board unit is a first case surface,
The rear side surface of the sub-control board unit is a second case surface,
The rear side surface of the payout control board unit is a third case surface,
If the rear side surface of the back cover is the cover surface,
The third case surface is located on the rear side of the first case surface, the second case surface, and the cover surface,
The distance from the second case surface to the third case surface in the front-rear direction is a first dimension,
A distance from the first case surface to the third case surface in the front-rear direction is a second dimension,
If the distance from the cover surface to the third case surface in the front-rear direction is the third dimension,
The third dimension is smaller than the first dimension and the second dimension.

(Modification 2)
In modification example 2, a sub board unit (first board unit) 1200, a main board unit (second board unit) 1100, and a payout board unit (third board unit) 401 are arranged in this order from top to bottom. ing. A sub-control board (first board) 202 is housed in the sub-board unit 1200 . A main control board (second board) 200 is accommodated in the main board unit 1100. A payout board (third board) 400 is accommodated in the payout board unit 401 . The sub-board unit 1200 is arranged above (upper stage), the payout board unit 401 is arranged below (lower stage), and the main board unit 1100 is arranged between the sub-board unit 1200 and the payout board unit 401 in the vertical direction. It is placed between (center) (middle row). In modification 2, the sub board unit 1200, the main board unit 1100, and the payout board unit 401 are covered by the back cover 1000 from the rear side.

As shown in FIG. 44, a heat radiation hole (hole) H1 is provided on the case surface of the sub-board unit 1200. The heat radiation hole has a function of releasing heat generated inside (inside) each unit to the outside. Although not shown, heat radiation holes are similarly provided on each case surface of the main board unit 1100 and the payout board unit 401.

A plurality of heat radiation holes (holes) H1 are provided on the case surface (second case surface) of the sub-board unit 1200. The heat radiation hole H1 has a circular shape (substantially circular shape), and a diameter (dimension D1) (first size) of about 3 mm.
A plurality of heat radiation holes (holes) H2 are provided on the case surface (third case surface) of the payout board unit 401. The heat radiation hole H2 has a circular shape (substantially circular shape), and a diameter (dimension D2) (second size) of about 1.2 mm.
A plurality of heat radiation holes (holes) H3 are provided on the case surface (first case surface) of the main board unit 1100. The heat radiation hole H3 has a circular shape (substantially circular shape), and a diameter (dimension D3) (third size) of about 1 mm.
Comparing the sizes of the heat radiation holes, the dimension D1 is set larger than the dimension D2, and the dimension D2 is set larger than the dimension D3. In other words, dimension D1>dimension D2>dimension D3.

As shown in FIG. 48, in the board unit, a predetermined distance L is secured between the case surface (inner surface) and the board surface.
The second case surface (inner surface) of sub-board unit 1200 faces the board surface (sub-board surface) of sub-board 202 in the front-rear direction, and the second case surface (inner surface) of sub-board unit 1200 faces ) to the substrate surface of the sub-board 202 (distance in the front-rear direction) is the dimension L1. The dimension L1 (first distance) is approximately 15 mm.
The third case surface (inner surface) of the dispensing board unit 401 faces the board surface (dispensing board surface) of the dispensing board 400 in the front-rear direction. ) to the board surface of the payout board 400 (distance in the front-rear direction) is the dimension L2. The dimension L2 (second distance) is approximately 20 mm.
The first case surface (inner surface) of main board unit 1100 faces the board surface (main board surface) of main board 200 in the front-rear direction, and the first case surface (inner surface) of main board unit 1100 faces ) to the board surface of the main board 200 (distance in the front-rear direction) is the dimension L3. The dimension L3 (third distance) is approximately 25 mm.
Comparing the distances from the case surface to the board surface, the dimension L3 is set larger than the dimension L2, and the dimension L2 is set larger than the dimension L1. In other words, dimension L1<dimension L2<dimension L3.

Further, when comparing the number of heat dissipation holes (holes) provided on the case surface, the case surface of the sub-board unit 1200>the case surface of the payout board unit 401>the case surface of the main board unit 1100.
Further, when comparing the aperture ratio of the heat dissipation holes on the case surface, the case surface of the sub-board unit 1200 > the case surface of the dispensing board unit 401 > the case surface of the main board unit 1100. The aperture ratio is the ratio of the open portion of the case surface (to the case surface).

The gaming machine of modification example 2 is
A first board unit (sub control board unit) 1200 that accommodates the first board (sub control board 202), a second board unit (main control board unit) 1100 that accommodates the second board (main control board 200), Comprising a third board unit (dispensing control board unit) 401 that accommodates a third board (dispensing control board 400), and a back cover (1000),
the first substrate unit is arranged above the second substrate unit,
the second board unit is arranged above the third board unit,
The first board unit, the second board unit, and the third board unit are covered by the back cover from the rear side,
The first board unit, the second board unit, and the third board unit each include a heat radiation hole formed in a case surface that is a rear side surface of a case that accommodates the board,
The size of the heat radiation hole of the first board unit is a first size (D1),
The size of the heat radiation hole of the third board unit is a second size (D2),
Assuming that the size of the heat radiation hole of the second board unit is a third size (D3),
the third size is smaller than the second size, the second size is smaller than the first size,
In the first board unit, a distance between the case surface and a board surface of the first board facing the case surface is defined as a first distance (L1),
In the third board unit, a distance between the case surface and a board surface of the third board facing the case surface is defined as a second distance (L2),
If the distance between the case surface and the substrate surface of the second substrate facing the case surface in the second substrate unit is a third distance (L3),
The third distance is greater than the second distance, and the second distance is greater than the first distance.

The smaller the size of the heat radiation hole of a board unit, the larger the distance between the case surface and the board surface. The smaller the heat dissipation hole is, the more likely it is that heat will be trapped inside the case, but the smaller the heat dissipation hole is, the more the distance between the case surface and the board surface will be secured, which will reduce heat. By trapping the inside of the case, the temperature inside the case is suppressed. Thereby, damage to components placed inside the case can be suppressed.

The main board 200 that controls the progress of the game and the payout board 400 that controls the payout are the boards for the main control system (main system), but the board unit that houses the main control system board is designed to prevent fraud. Well, the size of the heat radiation hole in the case is made relatively smaller than that of the board unit housing other boards (for example, sub-system boards). However, the smaller the size of the heat radiation hole, the more likely heat will be trapped inside the case, which may cause component failure. Therefore, the distance from the case surface to the board surface of the board unit that houses the main control system board is made relatively larger than that of the board unit that houses other boards (for example, sub-system boards). (setting standards for a design philosophy that makes it relatively large). By increasing the distance, component failure due to heat can be suppressed. In other words, it is possible to improve anti-fraud performance and suppress component failure (damage) due to heat. In addition, product development can be efficiently carried out taking into consideration both improvements in anti-fraud performance and improvements in heat resistance (heat resistance performance).

(Modification 3)
In deformability 3, the first sub-board unit, the second sub-board unit, and the main board unit are covered with a back cover 1000. The first sub-board unit (first board unit) of the third modification is configured similarly to the sub-board unit 1200 of the second modification. That is, it is provided with a heat radiation hole H1 (dimension D1), and the distance between the case surface and the substrate surface is dimension L1. The second sub-board unit (second board unit) of the third modification is configured similarly to the main board unit 1100 of the second modification. That is, a heat dissipation hole H3 (dimension D3) is provided, and the distance between the case surface and the substrate surface is dimension L3. The main board unit (third board unit) of the third modification is configured similarly to the payout board unit 401 of the second modification. That is, a heat radiation hole H2 (dimension D2) is provided, and the distance between the case surface and the substrate surface is dimension L2.

(Eleventh embodiment)
Next, an eleventh embodiment of the present invention will be described. The gaming machine of the present embodiment basically has the same configuration as the gaming machine of the tenth embodiment, so the description of the same configuration as the gaming machine of the tenth embodiment will be omitted. Omit or simplify.

As shown in FIG. 50, the gaming machine (pachinko gaming machine) of this embodiment has an outer rail 27 and an inner rail 28. Further, a guide path (guidance area) 29 is formed between the outer rail 27 and the inner rail 28 for guiding the game ball fired from the firing device to the game area 4. Further, as shown in FIGS. 49 and 50, a ball return prevention mechanism 50 is provided at the upper end of the guide path 29 to prevent the game ball from returning from the game area 4 to the guide path 29 (on the firing device side). ing. Specifically, the ball return prevention mechanism 50 is provided at the upper end of the inner rail 28. In other words, the ball return prevention mechanism 50 is provided in a boundary area 700 as a boundary between the guide passage 29 and the gaming area 4.

The ball return prevention mechanism 50 includes a main body case 52, a cover 53, a ball return prevention member 54, and a support shaft 56.

The main body case 52 has a bottom part 52a on which the back side is in contact with the game board 6 and a front side on which the ball return prevention member 54 is placed, a wall part 52b that covers the part of the ball return prevention member 54 on the gaming area side 4, and a ball part 52b. It has a stopper wall 52c that restricts the rotation of the return prevention member 54 toward the game area 4 side. In this embodiment, the wall portion 52b and the stopper wall 52c (stopper portion) are integrally formed, and it can be said that the upper portion (upper end portion) of the wall portion 52b serves as the stopper wall 52c. Further, in this embodiment, the main body case 52 is formed integrally with the inner rail 28, but a gap is formed between the upper end of the inner rail 28 and the stopper wall 52c. The main body case 52 has a cutout S, which is a space surrounded by a bottom surface 52a and a wall 52b, and is a space in which a part of the ball return prevention member 54 (a weight 54c to be described later) can be accommodated. have. Further, from the upper surface side of the notch S, in other words, the gap between the upper end of the wall portion 52b (stopper wall 52c) and the upper end of the inner rail 28 (the upper surface opening of the notch S), a part of the ball return prevention member 54 is (An on-off valve 54b to be described later) protrudes.

The bottom surface portion 52a is formed with a first bearing portion 52d into which one end of the support shaft 56 can be inserted (supported), and a guide groove 52e into which an engaging pin of a ball return prevention member 54, which will be described later, can be inserted. There is. Further, the bottom portion 52a is provided with a boss having a screw hole 52f and projecting forward, and a positioning pin 52g that enables positioning of the cover 53.

The cover 53 has a substantially plate shape. The cover 53 also has a screw insertion hole 53a into which the screw 55 can be inserted, a pin insertion hole 53b into which the positioning pin 52g of the main body case 52 can be inserted, and a second hole into which the other end of the support shaft 56 can be inserted (supported). 2 bearing parts 53c. Then, the positioning pin 52g of the main body case 52 is inserted into the pin insertion hole 53b, and the screw inserted into the screw insertion hole 53a is screwed into the screw hole 52f of the main body case 52, so that the cover 53 is attached to the main body case 52. It looks like this. Moreover, the cover 53 covers the front side of the notch S when it is attached to the main body case 52.

The ball return prevention member 54 has a shaft hole 54a, an on-off valve 54b, and a weight portion 54c. The on-off valve 54b and the weight portion 54c are bent in a dogleg shape with the shaft hole 54a as a boundary. A support shaft 56 is inserted through the shaft hole 54a, and one end of the support shaft 56 is engaged with a first bearing portion 52d of the bottom portion 52a, and the other end is engaged with a second bearing portion 53c of the cover 53. It has been stopped. Thereby, the ball return prevention member 54 is rotatably supported by the main body case 52 and the cover 53.

The on-off valve 54b is formed into a substantially rectangular plate shape, and its length in the longitudinal direction (vertical direction) is long enough for a game ball returning from the game area 4 to the boundary area 700 to collide with it. There is. The on-off valve 54b has a first side surface portion 540b facing the guide passage 29, and a second side surface portion 541b opposite to the first side surface portion 540b and facing the gaming area 4 (left-hand playing area 4a). (See Figure 50). The first side surface portion 540b is a portion that collides with a game ball that is fired from the firing device and passes through the guide path 29. The second side surface portion 541b is a portion that collides with the game ball attempting to return to the guide path 29 from the game area 4.

The tip of the on-off valve 54b is tapered. Specifically, the vertical length of the first side surface portion 540b is longer than the vertical length of the second side surface portion 541b, and the distance from the tip of the first side surface portion 540b to the second side surface portion 541b is longer than that of the second side surface portion 541b. It slopes downward toward the tip. Furthermore, a protruding portion 541c that protrudes toward the gaming area 4 is formed in the center of the second side surface portion 541b.

The weight portion 54c is thicker and heavier than the on-off valve 54b. An engagement pin is provided protruding from the back side of the weight portion 54c, and this engagement pin is inserted into the guide groove 52e of the bottom surface portion 52a. As described above, the ball return prevention member 54 is rotatably supported by the main body case 52 and the cover 53, and is movable between the open state and the closed state. In the normal state, the ball return prevention member 54 is urged to rotate in one direction (counterclockwise) about the support shaft 56 by the weight of the weight portion 54c, and the engagement pin is in the guide groove 52e. It is in contact with one end. As a result, the ball return prevention member 54 cannot rotate any further and maintains the closed state. On the other hand, the ball return prevention member 54 is rotated in the other direction (clockwise) about the support shaft 56 by the contact force when it comes into contact with the game ball fired from the firing device, and the above-mentioned stopper When it comes into contact with the wall 52c, it becomes open. Note that the rotation of the ball return prevention member 54 toward the gaming area 4 side may not be restricted by the stopper wall 52c. That is, the stopper wall 52c only needs to be in contact with the ball return prevention member 54 in the open state, and the term "contacted" here means contact or proximity.

Next, with reference to FIGS. 50 and 51, the ball return prevention mechanism 50 when the ball return prevention member 54 is in the closed state (first state) and the ball return prevention mechanism 50 when the ball return prevention member 54 is in the open state (second state) The return prevention mechanism 50 will be explained. FIG. 50 is a front view of the ball return prevention mechanism 50 when the ball return prevention member 54 is in the closed state, and FIG. 51 is a front view of the ball return prevention mechanism 50 when the ball return prevention member 54 is in the open state.

As shown in FIG. 50, when the ball return prevention member 54 is in the closed state (first state), the on-off valve 54b protrudes from the upper surface opening of the notch S toward the exit of the boundary region 700 in a substantially vertical posture. There is. In this state, the distance (specific distance) from the tip of the ball return prevention member 54 (on-off valve 54b) to the outer rail 27 is shorter than the diameter of the game ball B and is the shortest. Note that this distance means the shortest distance from the tip of the on-off valve 54b (first side surface portion 540b) of the ball return prevention member 54 to the outer rail 27. Therefore, even if the game ball B that has once entered the game area 4 collides with the game nails 36 etc. arranged in the game area 4 and bounces back toward the boundary area 700, it will collide with the ball return prevention member 54. It turns out. In addition, the ball return prevention member 54 maintains the closed state even if it is collided with the game ball B, so it does not rotate counterclockwise. Therefore, the ball return prevention member 54 prevents the game ball B that has entered the game area 4 from returning to the guide path 29 when in the closed state.

When the game ball B fired from the firing device toward the game area 4 in the state shown in FIG. The prevention member 54 can be moved from the closed state to the open state. Then, as shown in FIG. 51, the ball return prevention member 54 rotates in the direction of opening the exit of the boundary area 700, and when it collides with the stopper wall 52c, further rotation is restricted and the ball returns to the open state. (second state). In this state, the distance (specific distance) from the tip of the on-off valve 54b (first side surface portion 540b) to the outer rail 27 is longer than the diameter of the game ball B and is the longest. Therefore, when the ball return prevention member 54 is in the open state, it allows the game ball fired by the firing device to enter the game area 4 from the boundary area 700. In addition, after the ball return prevention member 54 is displaced to the open state, it instantaneously rotates in the opposite direction (counterclockwise) under the urging force of the weight portion 54c and is again displaced to the closed state shown in FIG. 50. .

As described above, the ball return prevention mechanism 50 is configured to prevent the game ball that has entered the game area 4 from returning to the guide path 29 when the ball return prevention member 54 is in the closed state. In this embodiment, the ball return prevention member 54 can further prevent the game ball from returning to the guide path (guide area) 29 even in the state (third state) in the middle of being displaced from the closed state to the open state. There is.

FIG. 52 shows how a game ball that has entered the game area 4 (left-handed hitting area 4a) is about to return to the boundary area 700 while the ball return prevention member 54 is in the middle of being displaced from the closed state to the open state. The figures shown in FIG. 53 and FIG. 54 are enlarged views of the area surrounded by the dotted line shown in FIG. 52.

In FIG. 52, one game ball B1 fired from the firing device toward the game area 4 enters the boundary area 700 from the guide passage 29, and enters the ball return prevention member 54 (on-off valve 54b), the outer rail 27, and other parts. is in contact with game ball B2. In FIG. 53, the point of contact between one game ball B1 and the first side surface portion 540b of the on-off valve 54b is indicated by P1, the point of contact with the outer rail 27 is indicated by P2, and the point of contact with another game ball B2 is indicated by P3. There is.

Further, the other game ball B2 enters the boundary area 700 from the game area 4 and is in contact with the tip of the ball return prevention member 54, the outer rail 27, and the first game ball B1. In FIG. 53, the point of contact between the other game ball B2 and the tip of the on-off valve 54b is indicated by P4, the point of contact with the outer rail 27 is indicated by P5, and the lowest point of the other game ball B2 is indicated by P6.

In the state shown in FIG. 53, the distance (specific distance) from the tip of the ball return prevention member 54 to the outer rail 27 is longer than in the open state (see FIG. 51) than in the closed state (see FIG. 50). is also shorter. In other words, it is the distance between the closed state and the open state. Moreover, the distance H1 from the tip of the ball return prevention member 54 (on-off valve 54b) to the outer rail 27 is shorter than the distance H2 from the lowest point P6 of the other game balls B2 to the outer rail 27. In other words, the distance H1 from the contact point P4 between the other game ball B2 and the tip of the ball return prevention member 54 to the outer rail 27 is equal to the distance H2 from the lowest point P6 of the other game ball B2 to the outer rail 27. shorter than In other words, the length H1 of the perpendicular line L1 drawn from the tip of the ball return prevention member 54 to the outer rail 27 is longer than the length H2 of the perpendicular line L2 drawn from the lowest point P6 of the other game ball B2 to the outer rail 27. It's shorter.

In addition, as shown in FIG. 54, when the ball return prevention member 54 is in the above-mentioned intermediate state, other game balls are connected from the contact point P4 between the other game ball B2 and the tip of the ball return prevention member 54 (on-off valve 54b). The distance H3 from the contact point P3 between the game ball B2 and one game ball B1 is shorter than the distance H4 from the lowest point P6 of the other game ball to the contact point P3. That is, the length of the line segment L3 connecting the contact point P4 and the contact point P3 is shorter than the length of the line segment L4 connecting the lowest point P6 and the contact point P3.

Further, as shown in FIGS. 53 and 54, when the ball return prevention member 54 is in the above-mentioned intermediate state, the tip of the ball return prevention member 54 reaches the lowest point P6 of the other game ball B2. It doesn't rotate much. Specifically, the tip of the ball return prevention member 54 is located at a position higher than the lowest point P6 of the game ball B2 in the vertical direction, and to the left of the lowest point P6 of the game ball B2 in the horizontal direction (guide path 29 side). That is, the tip of the ball return prevention member 54 is located at the upper left with respect to the lowest point P6.

Even if the game ball B2 tries to return to the guide passage 29 after the collision between the game ball B1 and the game ball B2 as described above, it will come into contact with the tip of the ball return prevention member 54 (on-off valve 54b) from the game area 4 side. I will do it. Therefore, there is a high possibility that the ball return prevention member 54 will be subjected to a contact force from the game area 4 side toward the guide path 29 side and rotate counterclockwise. Therefore, the ball return prevention member 54 blocks the exit of the boundary area 700 more than when the game ball B1 and the game ball B2 collide, and it becomes difficult for the game ball B2 to return to the guide path 29. As a result, even when the game ball B1 and the game ball B2 collide as shown in FIG. 52, the game ball B2 can be prevented from returning to the guide path 29. In other words, it is possible to prevent two game balls from returning to the guide path 29 in succession.

In addition, at the time of collision between the game ball B1 and the game ball B2 as shown in FIG. 52, the distance (specific distance) H1 from the tip of the ball return prevention member 54 (on-off valve 54b) to the outer rail 27 If the distance H2 from the lowest point P6 of the game ball B2 to the outer rail 27 is longer than the distance H2, the game ball B2 may enter between the tip of the ball return prevention member 54 and the outer rail 27 after the collision. becomes possible. Then, the game ball B2 can come into contact with the tip of the ball return prevention member 54 from above, so the ball return prevention member 54 is more likely to rotate clockwise. Therefore, the ball return prevention member 54 opens the exit of the boundary area 700 more than when the game ball B1 and the game ball B2 collide, and cannot prevent the game ball B2 from returning to the guide path 29.

As described above, the pachinko game machine according to the present embodiment is sufficiently improved in preventing the game balls that have entered the game area 4 from returning to the guide path (guide area) 29, compared to the conventional pachinko game machine. However, as described below, the ball return prevention mechanism 50 is prevented from getting caught with the game ball, thereby further improving the return prevention. Therefore, with reference to FIG. 55, prevention of catching between the ball return prevention mechanism 50 and game balls will be explained. FIG. 55 is a diagram showing a state in which the game ball B that has returned from the game area 4 to the boundary area 700 collides with the ball return prevention member 54.

As shown in FIG. 55, the game ball B returns from the game area 4 to the boundary area 700 and is in contact with the on-off valve 54b of the ball return prevention member 54 and the main body case 52. Specifically, the game ball B is in contact with the protruding portion 541c of the on-off valve 54b in the closed state, and is also in contact with the upper end portion (stopper wall 52c) of the main body case 52. In FIG. 55, the point of contact between the game ball B and the protrusion 541c of the on-off valve 54b is indicated by P7, the point of contact with the upper end of the main body case 52 is indicated by P8, and the leftmost point of the game ball B is indicated by P9. .

In such a state, the contact point P7 between the game ball B and the protrusion 541c of the on-off valve 54b is located below the leftmost point P9 of the game ball B in the vertical direction. In addition, the contact point P8 between the game ball B and the upper end of the main body case 52 is located to the left of the lowest point P6 of the game ball B in the horizontal direction, and is located to the left of the lowest point P6 of the game ball B in the vertical direction. is also located above. That is, the contact point P8 is located at the upper left with respect to the lowest point P6. The distance (first distance) H5 from the contact point P7 to the contact point P8 is shorter than the distance (second distance) H6 from the leftmost point P9 to the lowest point P6 of the game ball B. Therefore, the game ball B has an opening on the upper surface side facing the boundary area 700 in the main body case 52 (see FIG. 49), and a portion on the proximal end side of the protruding portion 541c in the second side surface portion 541b of the on-off valve 54b. It is so designed that it cannot enter the gap area SP between . Moreover, as shown by the dotted line arrow in FIG. By applying a force diagonally upward to the right, it bounces back to the game area 4. Therefore, it is possible to prevent the game ball B from entering the gap region SP and being caught between the on-off valve 54b of the ball return prevention mechanism 50 and the main body case 52. Therefore, the return prevention of the ball return prevention mechanism 50 due to such a catch of the game ball B is not impaired. Therefore, since the return prevention of the ball return prevention mechanism 50 can be stably ensured, it is possible to further improve the prevention of the game balls that have entered the game area 4 from returning to the guide path (guide area) 29.
Note that the protrusion 541c may not be provided on the on-off valve 54b. In that case, the point of contact between the game ball B and the second side surface portion 541b of the on-off valve 54b is designated by P7. A contact point P7 between the game ball B and the second side surface portion 541b is located below the leftmost point P9 of the game ball B in the vertical direction. The distance (first distance) H5 from the contact point P7 to the contact point P8 is shorter than the distance (second distance) H6 from the leftmost point P9 to the lowest point P6 of the game ball B. Therefore, it is possible to prevent the game ball B from entering the gap area SP and being caught between the on-off valve 54b of the ball return prevention mechanism 50 and the main body case 52. Therefore, the return prevention of the ball return prevention mechanism 50 due to such a catch of the game ball B is not impaired. Therefore, since the return prevention of the ball return prevention mechanism 50 can be stably ensured, it is possible to further improve the prevention of the game balls that have entered the game area 4 from returning to the guide path (guide area) 29.

According to the pachinko game machine according to the present embodiment configured as described above, the following effects can be achieved.

The ball return prevention mechanism 50 not only prevents a game ball that has entered the gaming area 4 from returning when the ball return prevention member 54 is in the closed state, but also prevents the ball return prevention member 54 from being displaced from the closed state to the open state. Even during the game, the game balls that have entered the game area 4 can be prevented from returning to the guide path 29. Therefore, it is possible to improve prevention of return of the game ball that has entered the game area 4 to the guide path (guide area) 29.

The pachinko game machine according to the present embodiment also includes a guide path (guidance area) 29, which is an area between the outer rail 27 and the inner rail 28, and which guides the launched game balls to the game area 4, and A ball return prevention mechanism 50 that prevents the ball from returning from the gaming area 4 to the guide path 29, and the ball return prevention mechanism 50 has a closed state (first state), an open state (second state), The on-off valve 54b has an on-off valve (displacement member) 54b that can be displaced to a position where the on-off valve 54b can be displaced, and a main body case (holding member) 52 that can hold the on-off valve 54b. part) 541b and a tip on the tip side of the second side surface portion 541b, and if the distance from the tip to the outer rail 27 is a specific distance, the closed state is a state where the specific distance is shorter than the open state. In the open state, the specific distance is longer than in the closed state, and the main body case 52 has a stopper wall (contacting part) 52c that comes into contact with the second side surface part 541b of the on-off valve 54b in the open state. , when the game ball is in contact with the main body case (holding member) 52 (specifically, the stopper wall 52c of the main body case 52) and the second side surface portion 541b (the protrusion 541c) in the closed state. The distance from the contact point P8 of the main body case 52 (stopper wall 52c) to the contact point P7 between the game ball and the second side surface portion 541b (the protruding portion 541c) is defined as a first distance H5, and the distance from the lowest point P6 of the game ball to the leftmost point If the distance to P9 is a second distance H6, the first distance H5 is characterized in that it is shorter than the second distance H6. Therefore, it is possible to further improve the prevention of the game balls that have entered the game area 4 from returning to the guide path (guide area) 29.

The gaming machine of this embodiment is
a guide area (29) that is an area between the outer rail (27) and the inner rail (28) and guides the launched game ball to the game area;
a ball return prevention mechanism (50) that prevents the game ball from returning from the game area to the guide area;
a first substrate unit (1200) that accommodates a first substrate;
a second board unit (1100) that accommodates a second board;
a third board unit (401) that accommodates a third board;
Comprising a back cover (1000),
The ball return prevention mechanism includes a displacement member (54b) that can be displaced between a first state and a second state, and a holding member (52) that can hold the displacement member,
The displacement member includes a side surface portion (541b) facing the game area, and a tip portion on the tip side of the side surface portion,
If the distance from the tip to the outer rail is a specific distance,
The first state is a state in which the specific distance is shorter than the second state,
The second state is a state in which the specific distance is longer than the first state,
The holding member includes a contact portion (52c) that contacts the side surface portion of the displacement member in the second state,
In a state where the displacement member is in the first state and the game ball is in contact with the contact portion and the side surface portion,
The distance from the contact point (P8) between the game ball and the contact portion to the contact point (P7) between the game ball and the side surface portion is defined as a first distance (H5), and the distance from the lowest point (P6) of the game ball to the contact point (P7) between the game ball and the side surface portion is defined as the first distance (H5). If the distance to the leftmost point (P9) is a second distance (H6), the first distance is shorter than the second distance,
the first substrate unit is arranged above the second substrate unit,
the second board unit is arranged above the third board unit,
The first board unit and the second board unit are covered by the back cover from the rear side,
The third board unit is not covered by the back cover from the rear side,
The rear surface of the third board unit and the rear surface of the back cover are formed to be flush or substantially flush.

The first distance is shorter than the second distance. Therefore, the return prevention of the ball return prevention mechanism is not impaired due to the game ball being caught. Thereby, it is possible to stably ensure the return prevention of the ball return prevention mechanism, so it is possible to improve the prevention of the return of the game ball that has entered the game area to the guide area.
Further, the rear surface of the third board unit and the rear surface of the back cover are formed to be flush or substantially flush. In other words, the back side of the gaming machine has a flat (almost flat) configuration. Thereby, it is possible to suppress the case from getting caught when carrying the case, and to improve work efficiency.

In addition, the gaming machine of this embodiment is
a guide area (29) that is an area between the outer rail (27) and the inner rail (28) and guides the launched game ball to the game area;
a ball return prevention mechanism (50) that prevents the game ball from returning from the game area to the guide area;
a first substrate unit accommodating a first substrate;
a second board unit accommodating a second board;
a third board unit that accommodates a third board;
Comprising a back cover (1000),
The ball return prevention mechanism includes a displacement member (54b) that can be displaced between a first state and a second state, and a holding member (52) that can hold the displacement member,
The displacement member includes a side surface portion (541b) facing the game area, and a tip portion on the tip side of the side surface portion,
If the distance from the tip to the outer rail is a specific distance,
The first state is a state in which the specific distance is shorter than the second state,
The second state is a state in which the specific distance is longer than the first state,
The holding member includes a contact portion (52c) that contacts the side surface portion of the displacement member in the second state,
In a state where the displacement member is in the first state and the game ball is in contact with the contact portion and the side surface portion,
The distance from the contact point (P8) between the game ball and the contact portion to the contact point (P7) between the game ball and the side surface portion is defined as a first distance (H5), and the distance from the lowest point (P6) of the game ball to the contact point (P7) between the game ball and the side surface portion is defined as the first distance (H5). If the distance to the leftmost point (P9) is a second distance (H6), the first distance is shorter than the second distance,
the first substrate unit is arranged above the second substrate unit,
the second board unit is arranged above the third board unit,
The first board unit, the second board unit, and the third board unit are covered by the back cover from the rear side,
The first board unit, the second board unit, and the third board unit each include a heat radiation hole formed in a case surface that is a rear side surface of a case that accommodates the board,
The size of the heat radiation hole of the first board unit is a first size (D1),
The size of the heat radiation hole of the third board unit is a second size (D2),
If the size of the heat radiation hole of the second board unit is a third size (D3),
the third size is smaller than the second size, the second size is smaller than the first size,
In the first board unit, a distance between the case surface and a board surface of the first board facing the case surface is defined as a first distance (L1),
In the third board unit, a distance between the case surface and a board surface of the third board facing the case surface is defined as a second distance (L2),
In the second board unit, if the distance between the case surface and the board surface of the second board facing the case surface is a third distance (L3),
The third distance is greater than the second distance, and the second distance is greater than the first distance.

The first distance is shorter than the second distance. Therefore, the return prevention of the ball return prevention mechanism is not impaired due to the game ball being caught. Since the return prevention of the ball return prevention mechanism can be stably ensured, it is possible to further improve the prevention of the game balls that have entered the game area from returning to the guide area.
Further, the third size is smaller than the second size, the second size is smaller than the first size, the third distance is larger than the second distance, and the second size is smaller than the second size. The distance is greater than the first distance. That is, the smaller the size of the heat radiation hole, the greater the distance between the case surface and the substrate surface. The smaller the heat dissipation hole, the more likely it is that heat will be trapped inside the case, but by making the distance between the case surface and the board surface relatively large, heat will be trapped and the inside of the case will become hotter. This suppresses the occurrence of This can prevent damage to components placed inside the case.

(Application to other boards)
In each of the above embodiments, an example in which the present invention is applied to a payout control board has been described, but the present invention may be applied to a board other than the payout control board. In other words, each configuration related to the payout control board described above is included in a predetermined board other than the payout control board (for example, a main control board, a sub-control board, etc.) and members related to the predetermined board. Good too.

(Application to slot machines)
In each of the above embodiments, an example has been described in which the present invention is applied to a pachinko game machine that uses game balls as a game value. Applicable to slot machines (including medalless gaming machines) where the reels are rotated by an operation, the rotating reels are stopped by a stop button operation, and wins can be generated depending on the type of symbol or combination of symbols when the reel stops. You may. For example, a predetermined board (for example, a main control board, a sub-control board, etc.) in a slot machine and members related to the predetermined board may have configurations related to the above-described payout control board.

Note that within the scope of the present invention, each component of each embodiment can be freely combined, each component can be arbitrarily modified, or each component can be omitted. Furthermore, the present invention is not limited to pachinko gaming machines, but can also be applied to other gaming machines such as slot machines.

400 Board 570 Connector (first connector)
574 Positioning pin 575 Through hole (non-conductive through hole)
701 Case 701A Connector opening 972 Silk frame (first area)
982 Etching frame (second area)
990 connector (second connector)
991 Wiring patterns 992a, 992b, 992c, 992d Via (second conductive through hole)
NP Insulation area SK Predetermined gap

Claims (3)

comprising a substrate and a connector disposed on a first surface of the substrate,
The connector includes a positioning pin,
The substrate includes a non-conductive through hole into which the positioning pin is inserted,
The thickness of the substrate is greater than the amount of insertion of the positioning pin into the non-conductive through hole,
An annular insulating region is formed around the non-conductive through hole on the second surface of the substrate,
A first area indicating a position where a first display is provided is provided on the first surface of the substrate,
A second area surrounding a second display is provided on a second surface of the substrate,
The first region is formed by silk printing,
The second region is formed by etching,
The second region is provided at a position corresponding to the back side of the first region,
The gaming machine characterized in that the second display is formed in a size that fits inside the first area. comprising a substrate, a first connector and a second connector arranged on a first surface of the substrate, and a case accommodating the substrate,
The first connector includes a positioning pin,
The substrate includes a non-conductive through hole into which the positioning pin is inserted,
The thickness of the substrate is greater than the amount of insertion of the positioning pin into the non-conductive through hole,
An annular insulating region is formed on the second surface of the substrate around the non-conductive through hole,
The board includes a first conductive through hole into which a predetermined terminal of the second connector is inserted, and a second conductive through hole into which a component terminal is not inserted,
A wiring pattern connecting the first conductive through hole and the second conductive through hole is formed on the second surface of the substrate,
A gaming machine, wherein the second conductive through hole is covered by the second connector. comprising a substrate, a first connector and a second connector arranged on a first surface of the substrate, and a case accommodating the substrate,
The first connector includes a positioning pin,
The substrate includes a non-conductive through hole into which the positioning pin is inserted,
The thickness of the substrate is greater than the amount of insertion of the positioning pin into the non-conductive through hole,
An annular insulating region is formed on the second surface of the substrate around the non-conductive through hole,
The board includes a first conductive through hole into which a predetermined terminal of the second connector is inserted, and a second conductive through hole into which a terminal of a component is not inserted,
A wiring pattern connecting the first conductive through hole and the second conductive through hole is formed on the second surface of the substrate,
The case includes a connector opening that exposes the second connector,
A predetermined gap is formed between the second connector and the connector opening,
A gaming machine characterized in that the second conductive through hole is formed at a position that is visible through the predetermined gap.

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