JP2008027958A - Method of mounting electronic part to printed board, device of printing solder to printed board, and game machine provided with printed board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily establish high-quality soldering by adjusting the application amount of cream solder. <P>SOLUTION: A metal mask 101a is overlaid on an FPC 101 wherein surface mounting parts with different lead spacings are mixed and surface-mounted, and a surface mounting part is mounted to the FPC 101 to which a cream solder H is printed at the application amount corresponding to the kind of surface mounting parts, in a through-hole 110 of the FPC 101 through the drilled hole 101b of the metal mask 101a. In this case, it is determined on the basis of the kind of the surface mounting parts whether or not a spacing for adjusting the application amount between each of the through-holes 110 and the through-hole 101b of the metal mask 101a is required, and a spacer 2a is stuck to the vicinity of the drilled hole 101b of the metal mask 101a that is determined to require spacing, and then the metal mask 101a is used to overlay the surface mounting part on the FPC 101. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for mounting an electronic component on a printed circuit board, a printing apparatus for soldering to the printed circuit board, and a gaming machine having the printed circuit board.

  A predetermined wiring pattern is formed on a control board used in a gaming machine such as a pachinko machine, and different types of electronic components are soldered at predetermined positions. More specifically, a plate-like mask (for example, a metal mask) is stacked on the printed circuit board, and a squeegee is slid on the upper surface of the plate-like mask to apply cream solder or the like on the upper surface of the plate-like mask. This plate mask is provided with a through hole. The through hole is provided corresponding to the through hole that inserts the terminal of the electronic component and electrically connects the electronic component to the wiring pattern. The cream solder applied to the upper surface of the plate-shaped mask flows into the through hole and the through hole. After the cream solder flowing into the through hole and the through hole is solidified, the cream solder is transferred to the substrate when the plate mask is removed from the substrate. An electronic component is placed on the transferred cream solder, and the solidified cream solder is dissolved and solidified, so that the electronic component is solder-connected.

  The amount of cream solder that flows into the through hole when cream solder is applied to the plate mask is determined by the dimension of the through hole of the plate mask, and this through hole corresponds to the lead pitch (terminal spacing) of the electronic component. Depending on the diameter. When the width of the through hole of the plate-shaped mask approaches the plate thickness of the plate-shaped mask, the printing accuracy of the cream solder decreases. For this reason, a plate-like mask having a partially different plate thickness according to the size of the through hole is used. However, in this case, there is a problem that the printing accuracy of the cream solder deteriorates in the vicinity where there is a difference in plate thickness.

  Moreover, in order to avoid the deterioration of the printing accuracy of the cream solder caused by the step difference in the plate thickness of the plate mask, it is necessary to mount each component with a predetermined distance from the step portion. If the plate thickness step is small, the predetermined distance may be small. However, if the plate thickness is large, the predetermined distance is also large, and the mounting density of electronic components on the printed wiring board is lowered. Therefore, Patent Document 1 discloses a solder printing method that does not reduce the mounting density of the printed circuit board when the plate thickness partially uses a plate-like mask.

  According to this Patent Document 1, when electronic components with different pin pitches are mixed and surface-mounted on a printed wiring board, an electronic component with a small pin pitch is adjacent to the destination of the squeegee from the electronic component with a large pin pitch (terminal spacing). Do not let it. As a result, a large step difference in plate thickness between the large pin pitch electronic component and the small pin pitch electronic component can be eliminated, and the area where the cream solder can flow due to the step difference in plate thickness of the plate mask can be reduced. can do.

JP 07-254778 A

  The plate-like mask having partially different plate thicknesses as in Patent Document 1 has a flat bottom surface and a different top surface (surface) to which cream solder is applied. Therefore, when cream solder is printed with a squeegee or the like, it is difficult to adjust the amount of cream solder applied according to the electronic component to be mounted. Then, if the amount of cream solder applied is small, the electronic component and the wiring pattern cannot be sufficiently electrically connected, resulting in poor contact and the like, resulting in a problem that high quality soldering cannot be performed. End up.

  Accordingly, an object of the present invention is to provide an electronic component mounting method on a printed circuit board that can easily realize high-quality soldering by adjusting the amount of cream solder applied, a printing apparatus for soldering on the printed circuit board, and It is to provide a gaming machine having the printed circuit board.

Means and effects for solving the problems

  In order to achieve the above object, the present invention is a method of mounting an electronic component on a printed circuit board, in which surface-mount type electronic components having different pin pitches are mixed and a plate-like mask is superimposed on the printed circuit board. Then, in the method of mounting the electronic component on the printed circuit board, the cream solder is printed on the land portion of the printed circuit board through the opening of the plate-shaped mask at a coating amount corresponding to the type of the surface mounted electronic component. Based on the type of mounting-type electronic component, it is determined whether a gap for adjusting the coating amount from each land portion to the opening of the plate-shaped mask is necessary. After a spacer is pasted around the opening, it is superimposed on a printed board using the plate-like mask.

  According to the above configuration, after a plate-shaped mask having a uniform thickness corresponding to the printed circuit board is created, a spacer is pasted around the opening of the plate-shaped mask, so that the surface-mounted electronic component The amount of cream solder applied can be adjusted according to the type. Further, the coating amount can be easily changed by changing or replacing the thickness of the spacer attached to the plate-like mask. Therefore, compared with the case where the thickness of the plate-like mask is changed by etching as in the prior art, it is possible to easily realize high-quality soldering by adjusting the amount of cream solder applied.

  In addition, a gaming machine of the present invention includes a control board using a printed board printed by the electronic component mounting method described above.

  According to the above configuration, since the control board manufactured by high-quality soldering by adjusting the amount of cream solder applied can be provided, a highly reliable gaming machine can be obtained.

  Furthermore, the present invention provides an apparatus for printing solder on a printed circuit board capable of printing cream solder with an application amount corresponding to the type of surface mount electronic component through an opening in a land part of the printed circuit board. A mask holding mechanism for detachably holding a plate-shaped mask having a predetermined position, a spacer supply mechanism for supplying a spacer having a predetermined thickness, which can be attached to the plate-shaped mask, to a standby position, and a spacer. A mounting mechanism having a holding part that is detachably held, and a moving part that moves the holding part so that it can be positioned from a standby position to an arbitrary position of a plate-like mask, and a surface-mount type electronic component A gap necessity determination unit that determines whether or not a gap for adjusting the amount of application from each land portion to the opening of the plate-like mask is required, and a plate-like mask that is determined to require a gap Perimeter of opening In, and a stuck mechanism control unit for controlling the affixed mechanism to affixed spacers.

  According to the above configuration, after a plate-shaped mask having a uniform thickness corresponding to the printed circuit board is created, a spacer is pasted around the opening of the plate-shaped mask, so that the surface-mounted electronic component It can be set as the plate-shaped mask which can adjust the application quantity of cream solder according to a classification. Further, the coating amount can be easily changed by changing or replacing the spacer thickness. Therefore, compared with the conventional case where the thickness of the plate-shaped mask is changed by etching, a plate-shaped mask having a thickness corresponding to the surface mount type electronic component can be easily manufactured in a short time. Is possible.

  Hereinafter, preferred embodiments of the present invention will be described. In the following description, a case where the present invention is applied to a first type pachinko gaming machine (also referred to as “digital pachi”) is shown as a preferred embodiment for the gaming machine according to the present invention.

(Control board)
First, the control board 100 mounted on the gaming machine of the present embodiment will be described. As shown in FIG. 6, the control board 100 is a flexible printed circuit board 101 (hereinafter referred to as FPC) on which surface-mounted components including an IC chip 102, a capacitor 103, a resistor 104, a connector 105, and the like are mounted. The FPC 101 is made of a flexible substrate made of a resin film such as polyimide having heat resistance and flexibility by a casting method, a plating method, a thermoplastic polyimide method, etc., and copper or a copper alloy provided so as to cover the surface thereof. And a conductor. The FPC 101 has one surface on which the component is mounted and the other surface on which a wiring pattern is formed. Note that the wiring pattern may be formed on both surfaces of the FPC 101.

  In addition, a so-called through hole (not shown) is formed in the FPC 101. In this through hole, the cylindrical conductor is provided at a position corresponding to the lead L (terminal) of the surface mount component, and electrically connects the conductor on the wiring pattern side and the conductor on the component side. The surface mount component can be mounted on the FPC 101 by inserting the lead L into the through hole, placing the surface mount component on the FPC 101, and soldering the lead of the surface mount component and the FPC 101. As will be described in detail later, in the present embodiment, the lead of the surface mount component and the FPC 101 are transferred to the FPC 101 by the solder printing device and the surface mount component is placed on the FPC 101, and then the cream is mounted. Solder connection is achieved by melting and solidifying the solder H.

(Solder printer)
Here, the solder printing apparatus 1 will be described. FIG. 1 is a schematic view showing a part of the solder printing apparatus 1. The solder printing apparatus 1 is an apparatus that superimposes a plate-shaped metal mask 101a on an FPC 101 and transfers cream solder to the FPC 101 through the metal mask 101a. The metal mask 101a is made of a stainless steel plate, and through holes 101b corresponding to the through holes formed in the FPC 101 are formed in various places by an apparatus (not shown).

  As shown in FIG. 1, the solder printing apparatus 1 includes a supply mechanism 2, a sticking mechanism 3, a control device 4, an operation panel 5, and a mask holding mechanism 6.

  The supply device 2 includes a pair of rotating rollers 21a and 21b, a sensor 22, and a motor (not shown) that rotationally drives the rotating rollers 21a and 21b. The motor (not shown) is driven and controlled by a motor driving unit 42 of the control device 4 described later. The rotation rollers 21a and 21b are arranged to face each other so that their rotation axes are parallel to each other. A long sheet 2b (hereinafter simply referred to as a sheet 21b) wound around the rotating roller 21b is wound around the rotating rollers 21a and 21b so as to be wound around the rotating roller 21a. Spacers 2a are pasted on the surface of the sheet 2b at equal intervals. All the spacers 2a pasted have the same size and shape. The spacer 2a may have a disk shape or a rectangular parallelepiped shape. Further, the material for forming the spacer 2a, the thickness, and the like can be appropriately changed.

  Further, a pasting mechanism 3 described later is disposed above the sheet 2b wound around the rotating rollers 21a and 21b, and the spacer 2a pasted on the sheet 2b is peeled off by the pasting mechanism 3. It is like that. More specifically, the spacer 2a on the surface is peeled off by the attaching mechanism 3 while the sheet 2b wound around the rotating roller 21b is being wound around the rotating roller 21a. That is, the spacer 2a is not attached to the sheet 2b wound around the rotating roller 21a.

  The sensor 22 is provided in the vicinity of the sheet 2b wound around the rotating rollers 21a and 21b, and detects the spacer 2a that moves together with the wound sheet 2b. The sensor 22 is connected to a control device 4 described later, and inputs a detection signal to the control device 4 when detecting the spacer 2a. The rotating rollers 21a and 21b described above are controlled to be driven and stopped based on a signal from the sensor 22.

  The attaching mechanism 3 peels off the spacer 2a attached to the sheet 2b, and attaches a predetermined number of spacers 2a around the through hole 101b provided in the metal mask 101a. The affixing mechanism 3 includes a moving bar 31 and an attaching / detaching mechanism 32 that holds the spacer 2 a and moves the moving bar 31. The moving bar 31 is parallel to the metal mask 101a and the wound sheet 2b so that the attaching / detaching mechanism 32 can move between the metal mask 101a fixed by the mask moving mechanism 6 and the supply device 2. Arranged. The moving bar 31 extends in the width direction (left and right direction in the drawing) of the metal mask 101a, and can be moved in parallel in the length direction (back direction in the drawing) of the metal mask 101a. That is, the attachment / detachment mechanism 32 that moves the horizontal bar 31 can be moved to any position of the metal mask 101a.

  The attachment / detachment mechanism 32 includes a horizontal moving part 32a, a vertical bar 32b, and an attachment / detachment part 32c. The horizontal moving part 32a is attached so as to be movable along the horizontal bar 31 by rotation of a motor or the like. Further, the vertical bar 32b is fixed to the horizontal moving part 32a so as to move the horizontal bar 31 together with the horizontal moving part 32a. Furthermore, the attaching / detaching portion 32c is attached so as to be movable up and down along the vertical bar 32b. Thereby, the attaching / detaching part 32c moves in the horizontal direction along the horizontal bar 31, and can move in the vertical direction along the vertical bar 32b.

  The attaching / detaching portion 32c can hold the spacer 2a at the tip portion and can change the orientation of the tip portion by 180 degrees. Specifically, holding the spacer 2a attached to the sheet 2b with the tip of the detachable portion 32c vertically downward, the horizontal bar 31 and the vertical bar 32b move along the horizontal and vertical directions, The tip of the spacer 2a is rotated 180 degrees vertically upward. The held spacer 2a is bonded to the metal mask 101a. The attaching / detaching portion 32c may be configured to suck and hold the spacer 2a, or may be configured to be gripped by an arm or the like.

  The control device 4 controls the supply device 2 and the pasting mechanism 3 based on an input from the operation panel 5 or the like. The control device 4 includes a pasting drive unit 41, a motor drive unit 42, a calculation unit 43, a storage unit 44, a first input / output unit 45, and a second input / output unit 46.

  The pasting drive unit 41 drives and controls the pasting mechanism 3. That is, based on the signal from the sticking drive unit 41, the horizontal moving unit 32a moves along the moving bar 31, and the attaching / detaching unit 32c moves along the vertical bar 32b. Moreover, the sticking drive part 41 controls the attaching / detaching part 32c to peel the spacer 2a from the sheet 2b, or to adhere the peeled spacer 2a to the metal mask 101a.

  The motor driving unit 42 controls the supply device 2. Specifically, the motor drive unit 42 drives and controls a motor (not shown) that rotates the rotary motors 21a and 21b. The computing unit 43 executes various programs such as processing routines stored in the storage unit 44 and controls the supply device 2 and the pasting device 3 via the pasting drive unit 41 and the motor drive unit 42. The storage unit 44 stores various programs executed by the calculation unit 43 and various data tables such as a spacer pasting table described later. The first input / output unit 45 converts each signal into a signal suitable for information processing when the signal is input from the sensor 22 of the supply device 2 or the pasting mechanism 3. The second input / output unit 46 is connected to the operation panel 5 and converts the input / output signal into a signal suitable for information processing.

  The operation panel 5 is a panel on which an operator operates, and includes a key input unit 51 for inputting characters and numbers, a start button 52 for starting spacer pasting and solder printing, and a completion lamp for informing that processing has been completed. 53.

  The mask moving mechanism 6 sandwiches the metal mask 101a conveyed to the solder printing apparatus 1 and moves to each predetermined processing position. The predetermined processing position is a position where the spacer 2a can be adhered by the attaching mechanism 3 shown in FIG.

  Although not shown, the solder printing apparatus 1 includes a fixing mechanism for fixing the FCP 101, a squeegee for applying cream solder to the metal mask 101a, and the like.

(Solder printer: Spacer pasting table)
Here, the spacer sticking table memorize | stored in the memory | storage part 44 of the control apparatus 4 is demonstrated. The spacer pasting table is referred to when the spacer 2a is bonded to the metal mask 101a, and has a board type column, a solder position column, and a number of stacked layers column as shown in FIG. The type of control board conveyed to the solder printing apparatus 1 is stored in the board type column. In the solder position column, the position where the surface-mounted component is soldered is stored as coordinate data with the width direction as the X axis and the length direction as the Y axis. This soldering position coincides with the position of the through hole provided in the FPC 101 and the through hole provided in the metal mask 101a.

  Further, the number of stacked layers of spacers 2a to be bonded to the periphery of each solder position is stored in the stacked number column. The number of stacked layers varies depending on the size of the through hole 101b corresponding to the solder position. As will be described in detail later, the amount of cream solder transferred to the FPC 101 can be adjusted by the number of stacked spacers 2a adhered to the periphery of each solder position.

  In this table, when the control board “A1” is manufactured by the FCP 101 and the metal mask 101a conveyed to the solder printing apparatus 1, the solder position column and the number of stacked layers column corresponding to “A1” in the substrate type column of the spacer pasting table Is referred to. Then, for example, “one sheet” of spacer is bonded around the position corresponding to the solder position “(x1, Y1)” of the metal mask 101a. Note that “0” in the number-of-stacks column means that the spacer is not bonded. That is, there is no need to adjust the amount of cream solder applied.

(Mechanical structure of gaming machine)
Next, a gaming machine having the control board 100 will be described with reference to FIGS. FIG. 7 is a perspective view showing the appearance of the pachinko gaming machine 10 in the present embodiment. FIG. 8 is a back view of the pachinko gaming machine 10 shown in FIG.

  As shown in FIG. 7, the pachinko gaming machine 10 includes a main body frame 12 having an opening on the front surface, various components disposed inside the main body frame 12, and a shaft that can be opened and closed in front of the main body frame 12. It is composed of a worn door 11. This door 11 is for closing an opening from the front, and a game is normally performed in the closed state. Further, on the front surface of the main body frame 12, an upper plate 13a, a lower plate 13b, and a firing handle 14 for storing game balls are arranged.

  A protective plate 19 having transparency is disposed on the door 11. The protection plate 19 is disposed so as to face the front surface of a game board (not shown) in a state where the door 11 is closed.

  The firing handle 14 is provided so as to be rotatable with respect to the main body frame 12. On the back side of the firing handle 14, a firing solenoid (not shown) as a driving device is provided. Further, a touch sensor (not shown) is provided on the peripheral edge of the firing handle 14. When the touch sensor is touched by the player, it is detected that the firing handle 14 is gripped by the player. When the firing handle 14 is gripped by the player and is rotated clockwise, power is supplied to the firing solenoid, and the game balls stored in the upper plate 13a are sequentially fired onto the game board. The game board is provided with a winning opening and the like, and a game is advanced by entering a game ball into the winning opening.

  In addition, an effect image related to the game is displayed on a liquid crystal display device (not shown) arranged behind the game board (on the back side). For example, for each of a plurality of symbol strings (three columns in the present embodiment), symbols (which are also identification information for production. For example, numbers from “0” to “9”) are displayed in a variable manner. The

  Further, as shown in FIG. 8, a prize ball tank 70 for temporarily storing game balls is provided on the back surface of the pachinko gaming machine 10, and the control board 100 described above is attached. The control board 100 includes, for example, an external connection terminal board 100A that electrically connects a prepaid card unit (not shown) that processes information related to the prepaid card outside the pachinko gaming machine 10 and the main body of the pachinko gaming machine 10, and a prize opening. It includes a CR prize ball payout control board 100B and the like on which a circuit that causes a predetermined number of prize balls to be paid out by a prize ball payout mechanism (not shown) according to the type of the winning ball is mounted.

(Control board manufacturing process)
Next, a manufacturing process of the control board 100 provided in the pachinko gaming machine 10 will be described.

(Process before solder printing)
In the control board 100, a wiring pattern is printed on the FPC 101 by a device (not shown), and a through hole for inserting a lead of a surface mount component is formed. On the other hand, a plate-shaped metal mask 101 a is prepared, and a through hole 101 b is formed at a position corresponding to the through hole formed in the FPC 101. Thereafter, the metal mask 101a and the FPC 101 are conveyed to the solder printing apparatus 1 of FIG.

(Solder printing process: operation of solder printing equipment)
In the solder printing apparatus 1, first, the spacer 2a is bonded to the conveyed metal mask 101a. Specifically, when the metal mask 101a is transported to the solder printing apparatus 1, the arithmetic unit 43 executes a spacer pasting / solder printing processing routine program stored in the storage unit 44, and is shown in the flowchart of FIG. A processing routine is started.

  First, when a metal mask 101a having a through hole 101b formed at a predetermined location is transported by a transport device (not shown), the metal mask 101a is sandwiched by the mask moving mechanism 6 and transported to the processing position shown in FIG. (S1). Then, the board type is acquired (S2). Specifically, the type of the control board manufactured by the conveyed FCP 101 and metal mask 101a is acquired. The board type may be transmitted from a control device that controls the entire manufacturing process, or may be input from the operation panel 5 by an operator.

  Next, referring to the spacer pasting table in FIG. 2, one is selected from all solder positions corresponding to the acquired board type (S3). Then, the number of stacked spacers corresponding to the selected solder position is acquired (S4), and the sticking mechanism 3 is controlled to stick the spacers 2a corresponding to the number of stacked layers on the part corresponding to the solder position (S5). Specifically, the rotation rollers 21a and 21b of the supply mechanism 2 are rotated at a constant speed, and the spacer 2a is sent out from the rotation roller 2b. When the sensor 22 detects the spacer 2a, the rotation of the rotating rollers 21a and 21b is stopped, and the spacer 2a is peeled off from the sheet 2b by the attaching / detaching portion 32c of the attaching mechanism 3. The peeled spacer 2a is adhered to the periphery of the solder position of the metal mask 101a held by the mask moving mechanism 6. When the number of stacked spacers 2a is plural, the above operation is repeated.

  The position where the spacer 2a is bonded is a position adjacent to the solder position calculated from the solder position acquired from the table of FIG. 2 and a predetermined value stored in advance.

  Then, in the spacer pasting table, it is determined whether or not selection of all solder positions corresponding to the acquired board type has been completed (S6). When all the solder positions have not been selected (S6: NO), the process returns to S3. When all the solder positions have been selected (S6: YES), as shown in FIG. The metal mask 101a is moved to the middle dotted line portion by the mask moving mechanism 6, and the FPC 101 and the metal mask 101a are overlaid (S7). Note that the position overlapping the FPC 101 refers to a position where the through hole 101b of the metal mask 101a and the corresponding through hole 110 of the FPC 101 coincide. At this time, the spacers 2a bonded to the metal mask 101a are overlapped so as to be interposed between the FPC 101 and the spacer 2a.

  Next, as shown in FIG. 4B, the squeegee 120 including the cream solder H is moved in the direction of the arrow in the figure, and the cream solder H is applied onto the metal mask 101a by the squeegee 120 (S8). At this time, the squeegee 120 is slid against the metal mask 101a. For this reason, in the place where the spacer 2a is bonded, the metal mask 101a and the FPC 101 are isolated as shown in FIG. On the other hand, in a place where the spacer 2a is not bonded, the metal mask 101a and the FPC 101 come into close contact with each other.

  When the application of the cream solder H is completed, the superimposed metal mask 101a is separated from the FPC 101 as shown in FIG. 4D (S9). Then, this routine ends. When the metal mask 101a is separated from the FPC 101, as shown in FIG. 4D, the cream solder H filled in the through hole 101b is transferred to the upper surface of the FPC 101, and the cream solder H is applied to the FPC 101.

  The size of the through hole for mounting the surface mount component is determined by the lead interval of the surface mount component. Therefore, when the size of the through hole is different, the amount of the cream solder H transferred to the FPC 101 is also changed accordingly. Specifically, it is necessary to transfer the cream solder H to a through hole having a large size than to a through hole having a small size. For this reason, since the layer is formed between the metal mask 101a and the FPC 101 when the spacer 2a is adhered around the through hole 101b corresponding to the through hole having a large dimension, the cream solder H is added by the thickness of the layer. It becomes possible to transfer a large number of through holes with large dimensions. Therefore, the application amount of the cream solder H can be adjusted according to the presence or absence of the spacer 2a and the number of laminated layers (thickness) of the spacer 2a.

  Since the metal mask 101a is not provided with the spacer 2a or the like on the surface to which the cream solder H is applied with the squeegee 120, the cream solder H can be smoothly filled into the through hole 101b.

(Process after solder printing)
After the printing process in the solder printing apparatus 1, the FPC 101 to which the cream solder H is transferred is transported to a component mounting apparatus (not shown). And by this apparatus, as shown to Fig.5 (a), surface mount components are mounted in the cream solder H. FIG. After that, when it is conveyed to a reflow furnace (not shown) and the cream solder H is melted and bonded, as shown in FIG. 5B, the surface mount component falls downward, and each lead L of the surface mount component is surely passed through the FPC 101. The hole 120 is inserted. And the manufacture of the control board 100 is completed by cooling and solidifying the cream solder H.

(Outline of this embodiment)
As described above, the present embodiment is a method for mounting an electronic component (surface-mounted component) on a printed circuit board (FPC 101), and is a surface-mounting method in which surface-mounted electronic components having different pin pitches (lead intervals) are mixed. After a plate-like mask (metal mask 101a) is superimposed on the printed board to be mounted, surface mounting is performed on the land portion (through hole 110 in FIG. 4) of the printed board through the opening (through hole 101b) of the plate-like mask. In the mounting method of the electronic component on the printed circuit board for printing the cream solder H with the application amount corresponding to the type of the electronic component of the mold, the opening of the plate-like mask from each land portion based on the type of the surface-mounted electronic component A plate-shaped mask that determines whether or not a gap for adjusting the coating amount up to the portion is necessary (see the spacer adjustment table) and that a gap is necessary (the number of stacked layers is other than “0”) After affixed spacer 2a around the opening, and is configured to perform a superposition of a printed substrate using a plate-like mask.

  According to the above configuration, after a plate-shaped mask having a uniform thickness corresponding to the printed circuit board is created, a spacer is pasted around the opening of the plate-shaped mask, so that the surface-mounted electronic component The amount of cream solder applied can be adjusted according to the type. Further, the coating amount can be easily changed by changing or replacing the thickness of the spacer attached to the plate-like mask. Therefore, compared with the case where the thickness of the plate-like mask is changed by etching as in the prior art, it is possible to easily realize high-quality soldering by adjusting the amount of cream solder applied.

  Further, the gaming machine (pachinko gaming machine 10) of the present embodiment is configured to include a control board using a printed board printed by the electronic component mounting method described above.

  According to the above configuration, since the control board manufactured by high-quality soldering by adjusting the amount of cream solder applied can be provided, a highly reliable gaming machine can be obtained.

  Further, in the present embodiment, cream solder (cream solder H) is applied in an amount corresponding to the type of the surface mount electronic component through the opening (through hole 101b) in the land portion (through hole 110 in FIG. 4) of the printed circuit board. And a mask holding mechanism (mask holding mechanism 6) for holding a plate-like mask (metal mask 101a) having a uniform thickness in a detachable manner at a predetermined position , A spacer supply mechanism (supply mechanism 2) for supplying a spacer (spacer 2a) having a predetermined thickness, which can be attached to a plate-shaped mask, to a standby position, and a holding portion (detachment portion) for holding the spacer in a removable manner 32c) and a moving part (horizontal moving part 32a, attaching / detaching mechanism 32) that moves the holding part so as to be positionable from a standby position to an arbitrary position of the plate-like mask. Based on the applied pasting mechanism (adjustment mechanism 3) and the type of surface-mount type electronic component, the necessity of a gap for adjusting the coating amount from each land portion to the opening of the plate-like mask is determined (spacer adjustment) (Refer to the table) The gap necessity determination unit (the control device 4, the calculation unit 43) and a pasting mechanism so that a spacer is pasted around the opening of the plate-like mask that is judged to require a gap. It is set as the structure which has the sticking mechanism control part (the control apparatus 4, the calculating part 43) to control.

  According to the above configuration, after a plate-shaped mask having a uniform thickness corresponding to the printed circuit board is created, a spacer is pasted around the opening of the plate-shaped mask, so that the surface-mounted electronic component It can be set as the plate-shaped mask which can adjust the application quantity of cream solder according to a classification. Further, the coating amount can be easily changed by changing or replacing the spacer thickness. Therefore, compared with the conventional case where the thickness of the plate-shaped mask is changed by etching, a plate-shaped mask having a thickness corresponding to the surface mount type electronic component can be easily manufactured in a short time. Is possible.

(Modification of this embodiment)
Moreover, although this invention was demonstrated based on suitable embodiment, this invention can be changed in the range which does not exceed the meaning. For example, in the above-described embodiment, the number of stacked spacers 2a differs according to the size of the through hole 101b, but the size of the spacer 2a is changed according to the size of the through hole 101b. Also good. For example, a plurality of types of spacers having different sizes and shapes may be prepared in advance, and a spacer suitable for the through hole 101b may be selected and bonded.

  Moreover, although the plate-shaped mask closely adhered to the FPC is a metal mask, it is not limited to this and can be changed as appropriate. Furthermore, the solder printing apparatus that adheres the spacer and transfers the cream solder to the metal mask is not limited to the configuration of the above-described embodiment, and can be changed as appropriate.

  Although the present invention has been described in the preferred embodiments above, the present invention is not so limited. It will be understood that various other embodiments may be made without departing from the spirit and scope of the invention. Furthermore, in this embodiment, although the effect | action and effect by the structure of this invention are described, these effect | actions and effects are examples and do not limit this invention.

Schematic which shows a solder printing apparatus. The figure which shows a spacer sticking table. The figure which shows the flowchart of a spacer sticking / solder printing processing routine. (A) The figure which overlap | superposed the metal mask and FPC. (B) The figure which starts application of cream solder to a metal mask. (C) The figure which finished applying cream solder. (D) The figure which peeled off the metal mask from FPC. (A) The figure which mounted the surface mounting component in the cream solder. (B) The figure which melted and solidified cream solder and soldered the surface mounting components. The perspective view of a control board. The perspective view of a pachinko gaming machine provided with the control board of FIG. The perspective view of the back surface of the pachinko machine of FIG.

Explanation of symbols

1 Solder printer 101 FPC
101a Metal mask 101b Through hole 110 Through hole H Cream solder

Claims (3)

After superimposing a plate-shaped mask on a printed circuit board to be surface-mounted by mixing surface-mount type electronic components having different pin pitches, the surface-mounted type is placed on the land portion of the printed circuit board through the opening of the plate-shaped mask. In the mounting method of the electronic component on the printed circuit board for printing the cream solder with the application amount corresponding to the type of the electronic component,
Based on the type of the electronic component of the surface mounting type, it is determined whether or not a gap for adjusting the coating amount from each land portion to the opening of the plate-like mask is necessary, and the gap is determined to be necessary A method of mounting an electronic component on a printed circuit board, comprising: attaching a spacer around the opening of the plate-shaped mask; and then superimposing the printed circuit board using the plate-shaped mask.   A gaming machine comprising a control board using a printed board printed by the electronic component mounting method according to claim 1. In a solder printing apparatus for printed circuit boards that enables printing of cream solder at an application amount corresponding to the type of surface-mount type electronic component through an opening in a land portion of the printed circuit board,
A mask holding mechanism for detachably holding the plate-like mask having a uniform thickness at a predetermined position;
A spacer supply mechanism having a predetermined thickness and supplying a spacer that can be attached to the plate-shaped mask to a standby position;
A pasting mechanism having a holding part for detachably holding the spacer, and a moving part for moving the holding part from the standby position to an arbitrary position of the plate-like mask;
A gap necessity determination unit that determines whether or not a gap for application amount adjustment from each land portion to the opening of the plate-like mask is based on the type of the surface-mount type electronic component;
A printing mechanism comprising: a pasting mechanism control unit that controls the pasting mechanism so as to paste the spacer around the opening of the plate-like mask that is determined to require the gap. A device for printing solder on a board.

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