JP2003289179A - Printed wiring board and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed wiring board that can be improved in reliability and reduced in size by forming printed wiring at the three-dimensional portion of a mounted component by using an ink material, and to provide a method of manufacturing the printed wiring board. <P>SOLUTION: This printed wiring board is provided with a printed board 1, wiring 2 formed on the board 1, and the mounted component 3 mounted on the board 1 and having the three-dimensional portion. This board is also provided with an electrode portion 4 formed on the component 3, and the printed wiring 6 which is printed on the three-dimensional portion of the component 3 by using the conductive ink material jetted from an ink jetting means 8 and connects the electrode portion 4 and wiring 2 to each other. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly belongs to a mounting technology field for mounting components on a printed circuit board, and further relates to applied technology for components, particularly semiconductor packages, etc., in accordance with miniaturization of the printed circuit board. The present invention relates to a printed wiring board for forming a wiring circuit on an uneven surface of a printed board on which a component is mounted or a three-dimensional side surface of the component, a manufacturing method thereof, and the like.

[0002]

2. Description of the Related Art Conventionally, as a method of connecting a printed wiring board and a mounted component, a lead portion of the component is inserted into a through hole of the printed wiring board and the lead portion and the through hole are soldered, or a chip component is printed. There is a method of mounting on the pad (electrode portion) of the wiring board and soldering the electrode portion of the chip component and the pad of the printed wiring board. Also,
As a method for connecting the semiconductor chip component and the printed wiring board, a TAB method in which electrodes are connected to each other through a copper foil,
There are a wire bonding method in which a gold wire is used for connection, and a flip chip method in which a metal ball having a small diameter is attached to an electrode for connection.

[0003]

However, the conventional connection method has the following problems. First of all, in the connection wiring method of the printed wiring board and the mounted components, it is necessary to provide a through hole at the connection point of the printed circuit board, which imposes design restrictions and there is a limit to the miniaturization of leads and through holes. There was a limit to miniaturization.
Further, in the method of mounting the electrode part of the chip component on the pad (electrode) of the printed wiring board and soldering the component pad and the pad of the printed wiring board, there is a limit in controlling the amount, position and shape of the solder. However, there is a problem that there is a limit to miniaturization of the printed circuit board.

Further, in the wire bonding method, which is a method of connecting a semiconductor chip component and a printed wiring board, the gold wire is protected by a cover, a resin mold, or the like, so that it is difficult to confirm the continuity or insulation of the gold wire. In the flip chip method, since the metal ball is sandwiched between the printed wiring board and the component, it is difficult to confirm the continuity and insulation of the connection portion. When the confirmation is performed, an X-ray projection device is used. There were problems such as the need for expensive equipment.

Further, most of the conventional method of mounting components (surface mounting) is a method of applying cream solder by screen printing, placing the component on it and soldering it by a reflow oven or the like. However, it is difficult to control the amount, position and shape of soldering, and there is a limit to further improvement of accuracy and miniaturization.

Therefore, the present invention has been made in order to solve the above problems, and prints with a conductive ink material ejected from an ink ejecting means on a three-dimensionally shaped portion of a mounted component or an uneven portion on a printed board. By electrically connecting the mounted components to the wiring on the printed circuit board, it is possible to improve the reliability of the connection part and to provide a novel printed wiring board that can be miniaturized and also provide a manufacturing method thereof. The purpose is to do.

[0007]

According to a first aspect of the present invention, there is provided a printed circuit board, a printed circuit board, wiring formed on the printed circuit board, the printed circuit board mounted on the printed circuit board, and a three-dimensionally shaped portion. The mounted component, the electrode portion formed on the mounted component, and the three-dimensionally shaped portion of the mounted component are printed by the conductive ink material ejected from the ink ejecting unit, and the electrode portion and the wiring are electrically connected. And printed wirings that are electrically connected to each other.

A printed wiring board according to claim 2 of the present invention is
A printed board, wiring formed on the printed board, a mounting component having an electrode portion mounted on the printed board, and an uneven portion on the printed substrate between the electrode portion of the mounting component and the wiring. And a printed wiring which is printed with a conductive ink material ejected from the ink ejecting means and electrically connects the electrode portion and the wiring.

A printed wiring board according to claim 3 of the present invention is
The electrode portion of the mounting component is formed by printing with a conductive ink material ejected from an ink ejecting unit.

A method of manufacturing a printed wiring board according to a fourth aspect of the present invention comprises a wiring forming step of forming wiring on the printed board, a mounting step of mounting mounting components on the printed board,
An electrode portion forming step of forming an electrode portion on the mounting component, and thereafter, a conductive ink material is ejected from an ink ejecting means to form a three-dimensional shape portion of the mounting component between the electrode portion and the wiring. Alternatively, a printing step of printing on an uneven portion on the printed board and electrically connecting the electrode portion of the mounting component and the wiring is provided.

A method of manufacturing a printed wiring board according to a fifth aspect of the present invention comprises a wiring forming step of forming wiring on the printed board, and a mounting step of mounting mounting components on the printed board.
A moving step of moving an ink ejecting means for ejecting a conductive ink material to the vicinity of a three-dimensionally shaped portion of the mounting component; and, after the moving step, ejecting the ink material from the ink ejecting means to form the mounting component. A printing step of forming a printed wiring between the wiring and the wiring and a connecting step of electrically connecting the mounting component and the wiring by the printing step are provided.

In the method for manufacturing a printed wiring board according to a sixth aspect of the present invention, the conductive ink material is used in the printing step while moving the nozzle of the ink jet printer between the electrode portion of the mounting component and the wiring. Is ejected from the nozzle of the inkjet printer.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. One example of the printed wiring board according to the first embodiment of the present invention will be described below with reference to FIG. FIG. 1 is an explanatory view showing a partially enlarged cross section of a printed wiring board and an ink application module according to the first embodiment together. In FIG. 1, 1 is a printed wiring board (printed circuit board), 2 is a wiring pattern formed on the printed wiring board 1, 3 is a mounting component such as an IC chip mounted on the printed wiring board 1, and 4 is a mounting component 3. It is an electrode portion of the mounting component 3 formed on the side surface which is a three-dimensionally shaped portion. A base ink layer 5 is formed at the boundary between the electrode portion 4 of the mounting component 3 and the wiring pattern 2. A printed wiring 6 is continuously formed on the side surface of the electrode portion 4 of the mounting component 3 and on the wiring pattern 2 with a conductive ink material. As the ink material, it is possible to generally use a mixture of a conductive material such as Au (gold) and silver (Ag) in a solvent such as butyl carbitol acetate and 3-dimethyl-2-imitazolidine. The ink solvent that can be used in the ink jet method as described above is mixed with carbon powder (other conductive materials may be used). A protective film 7 made of a resin or the like for protecting the printed wiring 6 is formed on the printed wiring 6.
Since the printed wiring 6 is formed continuously, the ink material is ejected from the ejection port of the ink application module, and the ejection port is moved by driving the actuator. A protective film 7 made of a resin or the like for protecting the printed wiring 6 is formed on the printed wiring 6.

The base ink layer 5 is an ink layer for improving the connection reliability of the circuit-forming ink applied between the electrodes of the printed circuit board and the electrodes of the mounted components, and has the function (1) each electrode and circuit. (2) Select one that has excellent adhesion to the forming ink and that is resistant to shock such as vibration and temperature change. The protective film 7 is an ink layer that enhances the environmental resistance of the circuit-forming ink, and has the functions of (1) excellent adhesion to the circuit-forming ink (2) moisture absorption resistance (3) heat resistance (4) The one that is hard to be scratched is appropriately selected. Glycerin or the like is added to provide moisture absorption resistance.

As another embodiment, when there is unevenness on the printed wiring board 1 between the mounting component 3 and the wiring pattern 2, for example, other mounting components are present,
In order to electrically connect the electrode portion 4 of the mounting component 3 and the wiring pattern 2, the printed wiring 6 may be formed of a conductive ink material ejected from the ejection port of the ink application module. Further, in FIG. 1, reference numeral 8 denotes an ink application module, which is used to sequentially form the base ink layer 5, the printed wiring 6, and the protective film 7. The ink application module 8 is configured as shown in FIG. 1 and has a waste liquid discharge path 9 and a waste liquid reservoir 10.

Embodiment 2. Next, a second embodiment will be described with reference to FIG. FIG. 2 shows the second embodiment.
FIG. 3 is a partial schematic configuration diagram showing the configuration of an ink application module 8 according to the present invention. In FIG. 2, reference numeral 8 represents the entire apparatus of the ink application module. Reference numeral 11 denotes a circuit-forming ink buffer for forming the printed wiring 6, and 12 denotes the base ink layer 5.
Is a buffer for the base ink for forming the protective film, 13 is a buffer for the protective ink for forming the protective film 7, and 14 is a buffer for the cleaning liquid. 15 is each buffer 11, 1
It is an individual hose connected to each of No. 2 and 1314 to supply various inks and cleaning liquids. Reference numeral 16 is a common hose that supplies these various hoses 12 in common and supplies various inks. Reference numeral 17 denotes an ejection portion for ejecting various inks from the ejection outlet 17a, and the ejection portion 17 is fixed to a shaft 18. On the other hand, the shaft 18 is rotatable and has drive means (motor) connected to a drive circuit 19 attached thereto. The shaft 18 is rotated by a drive circuit 19. When the shaft 18 rotates, the ejection part 17 moves up and down according to the rotation, and the ejection port 17a moves up and down accordingly.

A method of manufacturing the printed wiring board shown in FIG. 1 using the ink application module 8 shown in FIG. 2 will be described below. First, the mounting component 3 is fixed onto the printed board 1 with an adhesive or the like. Mount the ink application module 8 on the component 3
The base ink is moved to the vicinity of the boundary portion between the electrode portion 4 and the wiring pattern 2, and the base ink is ejected from the base ink buffer 12 via the individual hose 15 and the common hose 16.
7a to be ejected. Next, the ink application module 8 is vertically moved from above the electrode portion 4 of the mounting component 3 to below, and horizontally on the wiring pattern 2.
During this movement, the circuit forming ink is ejected from the circuit forming buffer 11 via the individual hose 15 and the common hose 16 from the ejection port 17a of the ejection unit 17 to form the printed wiring 6 as shown in FIG. . Next, the ink application module 8 is moved again above the electrode portion 4 of the mounting component 3 and ink is ejected from the buffer 13 for protective ink to form the protective film, as in the case of forming the printed wiring 6. The protective film 7 is formed. In this way, the printed wiring 6 and the protective film 7 are formed while moving the ink application module 8, but the ejection portion of the ink application module 8 is formed at the boundary between the electrode portion 4 of the mounting component 3 and the wiring pattern 2. 17 is rotated by the drive means 19 or the like, and various inks or the like are ejected from the ejection port 17a perpendicularly to the electrode portion 4 of the mounting component 3 and the wiring pattern 2. At each stage after the formation of the base ink layer 5, the formation of the printed wiring 6, and the formation of the protective film 7, the ejection port 17a of the ink application module 8 is moved with respect to the waste liquid pool 10 to remove the cleaning liquid buffer. The cleaning liquid is guided from the nozzle 14 to the jet nozzle 17a and the jet nozzle 1
The common hose 16, the ejection part 17, and the ejection port 17a are cleaned by ejecting from the 7a. This waste liquid is stored in the waste liquid reservoir 10 and is collected through the waste liquid discharge path 9.

Embodiment 3. Next, the third embodiment will be described with reference to FIGS. 3 and 4. FIG. 3 is a perspective view of an ink application module set in which the ink application modules 8 are arranged so as to correspond to the number of electrodes of the mounting component 3.
FIG. 4 is a perspective view of the mounting component 3 after forming a large number of printed wirings 6 using the ink application module set shown in FIG. In FIG. 3, reference numeral 20 denotes an ink application module set including a large number of ink application modules 8, and each ink application module 8 has the configuration shown in FIG. Each ink application module 8 is arranged on the side wall of the ink application module set 20 in correspondence with the number of electrodes of the mounted parts. FIG. 3 shows each ink application module 8
The common hose 16, the ejection part 17, and the ejection port 17a are shown, but the drive means 19 is omitted. Although the various buffers 11, 12, 13, and 14 are not shown, the basic configuration is the same as that shown in FIG. 2. For example, various buffers not shown in FIG. Various inks are sequentially supplied from the buffer to the ink application module set 20 through a common hose (not shown), and ejected from the ejection ports 17a of each ink application module 8.

Now, a manufacturing method for forming the mounting component 3 having the printed wiring 6 as shown in FIG. 4 will be described. First, the mounting component 3 is fixed onto the printed board 1 with an adhesive or the like. Next, the ink application module set 20 is placed on the mounting component 3. At this time, the ink application module set 20 is outside the electrode portion 4 of the mounting component 3,
Each ink application module 8 is formed so as to be in a position close to the electrode portion 4 of the mounting component 3. The method of forming the base ink layer 5, the printed wiring 6 and the protective film 7 by each ink application module 8 is the same as in the case of the second embodiment. Further, the cleaning of the common hose, the ejection portion, etc. is also the same as in the case of the second embodiment. When it is necessary to move the mounting component 3 of each ink application module 8 in the vertical direction with respect to the electrode portion 4, even when the ink application module set 20 is moved in the vertical direction, the mounting component 3 and the printed circuit board 1 are moved together. You may move up and down. In this case, it is not necessary to move each ink application module 8 itself in the vertical direction, and it is possible to move the ink application modules 8 at once when there are many ink application modules 8. In this way, if the number of the ink application modules 8 is set according to the number of the electrode parts 4 of the mounting component 3, the printed wiring 6, the protective film 7 and the like can be formed at one time, which enables efficient work. Become. FIG. 4 shows the configuration of the mounting component 3 in which the formation of the printed wiring 6 and the like is completed in this way.

Fourth Embodiment Next, a fourth embodiment of the present invention will be described with reference to FIGS. 5, 6, 7 and 8. FIG. 5 is a control block configuration diagram for controlling the movement of the ink application module 8 with respect to the mounting component 3 and the ink ejection of the ink application module 8. 6 (a) (b)
FIGS. 7C, 7D, and 7A, 7B, and 7C are explanatory views schematically showing how the mounting component 3 of the ink application module 8 moves with respect to the electrode portion 4. In addition, FIG.
6 is a flowchart showing a procedure of controlling by the configuration of the control block configuration diagram shown in FIG. 5. In these figures, reference numerals 21, 22, 23, 24 and 25 are drive circuits respectively, and motors M1, M2, M3, M4,
It is equipped with M5. The drive circuit 21 moves the ink application module 8 in the vertical direction, the drive circuit 22 rotates the ejection portion 17 of the ink application module 8 along the electrode surface of the mounting component 3, and the drive circuit 23 operates the ink application module 8. The drive circuit 24 is moved in the direction perpendicular to the paper surface.
Moves the ink application module 8 so as to approach or separate from the mounting component 3. Further, the drive circuit 25 rotates the printed wiring board 1 on which the mounting component 3 is placed at the application position of the ink application module 8.

Reference numeral 26 denotes a control circuit, which drives the motors M1 to M5, respectively, and activates the ink buffer module 27 and the ink application module 8 (indicated as an ink ejection module 28 in FIG. 5) to apply ink. It is controlled so as to eject from the ejection port 7a of the module 8. Sensors 29, 30 and 31 are attached to the ink application module 8. The sensor 29 senses the forward direction of the ink applying module 8,
The sensors 30 and 31 detect the downward direction and the upward direction of the ink application module 8, respectively.

Here, a further explanation will be given using the explanatory views of FIGS. 6 and 7 and the flow chart of FIG. Step 301,
In 302, the ink ejection module 28 is brought close to the electrode portion 4 of the mounting component 8 by using the drive circuits 21, 22, 23, 24, and 25. At this time, the electrode portion 4 of the mounting component 3
The position data of is input to the control circuit 26 in advance. The control circuit 26 moves the ink ejection module 28 together with the data of the movement distances sent from the drive circuits 21, 22, 23, 24, 25. The sensor 29 senses whether it is close to the electrode portion 4 of the mounting component 3, and when the ink ejection module 28 is close to the electrode portion 4 of the mounting component 3, the control circuit 26 stops the drive circuit 21 and the like.
The positional relationship between the ink ejection module 28 and the mounting component 3 at this time is shown in the state of FIG.

Steps 303, 304, 305, 30
6 and 307, the drive circuit 21 moves the ink ejection module 28 downward along the side surface of the electrode portion 4 of the mounting component 3. Ink ejection module 28 at this time
6 (b) and 6 (c) show the movement status of the above. At this time, under the control of the control circuit 26, ink is supplied from the ink buffer module 27 to the ink ejection module 2 and ink is ejected from the ink ejection module 28. In this way, the printed wiring 6 is formed on the side surface of the electrode portion 4 of the mounting component 3. Also, in this process,
The sensor 29 includes the ink ejection module 28 and the mounting component 3
It constantly senses whether or not it is close to the electrode portion 4 of. When the sensor 29 is not in proximity, the control circuit 26 controls the drive circuits 22 and 23 to drive them so that they are in proximity. Then, step 308
When the sensor 30 senses the wiring pattern 2 of the printed wiring board 1 in, the process proceeds to the next step.

Next, in steps 309 and 310, the ink ejection module 8 is moved to the boundary portion between the electrode portion 4 of the mounting component 3 and the wiring pattern 2, and the drive circuit 22 is driven to eject the ink ejection module 8. 17 rotates. The state of the rotating process of the ejection part 17 is shown in FIG. Also in this rotation process, the ink ejection module 8
Ink is ejected from the ejection height 7a of the ink, and the printed wiring 6 is formed at the boundary portion. Even during this rotation process, the sensors 29 and 30 always sense the proximity of the ink ejection module 8 and the electrode portion 4 of the mounting component 3 and the proximity of the wiring pattern 2. If they are not close by sensing the proximity state, the drive circuits 21, 22, and 24 are driven to move the ink ejection module 8 so as to be close to the side wall of the electrode portion of the mounting component 8 and the wiring pattern 2.
The drive circuit 22 has built-in coordinate system movement information in advance, and can accommodate various three-dimensional shapes of the mounting component 3.

Next, in steps 314 and 315, the drive circuit 24 drives the ink ejection module 8 to move in the horizontal direction. At the time of this movement, the sensor 29 senses whether or not the ink ejection module 8 is close to the wiring pattern 2, and if not, drives the drive circuit 21 to bring it closer. This moving process is shown in FIG.
It is shown in (a) and (b). Further, in this movement process, the ink ejection module 8 ejects ink from the ejection port 17a of the ejection portion 17 to form the printed wiring 6 on the wiring pattern 2. Further, in step 318, all the steps are completed when the sensor 31 no longer senses the electrode portion 4 of the mounting component 3. This state is shown in Figure 7.
It shows in (c). At this time, the distance that the sensor 31 does not sense, that is, the distance between the electrode portion 4 of the mounting component 3 and the ink ejection module 8 is input to the drive circuit 21 in accordance with the length of the wiring pattern 2 of the mounting component 3. Keep it.

The above steps are applied not only when the printed wiring 6 is formed but also when the protective film 7 is formed. When forming the base ink layer 5, step 30 is performed.
Apply 9, 310.

Embodiment 5. Next, a printed wiring system according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 9 is a schematic perspective view showing an overall outline of the printed wiring system according to the fifth embodiment. In FIG. 9, reference numeral 32 is a moving means such as a belt conveyor for moving the printed wiring board 1 on which the mounting component 3 is mounted, 33 is arranged along the moving means 32, and drives the ink applying module 8 and the ink applying module 8. A drive circuit unit 34 composed of the drive circuits 21 to 25 and the like is a waste liquid reservoir waste port provided near the moving means 32 for discharging excess ink and cleaning liquid. As shown in FIG. 9, the drive circuit 25 for rotating the printed wiring board 1 is arranged below the moving means 32. In the drawings, the same reference numerals indicate the same or corresponding parts.

Next, the operation will be described. Means of transportation 32
Moves each printed wiring board 1 on which the mounting component 3 is mounted by a belt conveyor or the like, and drives the drive circuit unit 33.
Each of the ink application positions is temporarily stopped. When the drive circuit unit 33 detects that the printed wiring board 1 has stopped at the ink applying position, it drives the ink applying module 8 and the motors M1 to M5 to start applying ink to the mounting component 3 and the printed wiring board 1.
The ink application is as described in the fourth embodiment, for example, and detailed description thereof is omitted.

When the series of operations for forming the printed wiring by the ink applying module 8 is completed, the drive circuit unit 33 notifies the moving means 32 of the signal for ending the ink application, and the moving means 32 is driven again to perform the next printing. The wiring board 1 stops at the ink application position of the drive circuit unit 33. In this way, the printed wiring boards 1 on which the mounting components 3 are mounted are sequentially moved by the moving means 32, and the printed wirings are formed on the stopped printed wiring boards 1 by applying the ink of the ink applying module 8 respectively. . According to the present embodiment, the printed wiring board can be continuously formed on the plurality of printed wiring boards 1 and the mounting components 3, and the mass production of the printed wiring board as described above can be achieved. it can.

As described above, the present invention relates to the connection of a printed wiring board and its mounted components, and an actuator (driving circuit unit) and an ink jet printer (ink application module) are used to form a three-dimensional arbitrary circuit on an uneven surface or a vertical horizontal surface. The present invention relates to a circuit manufacturing technique for forming a. The application field and scope of application are mainly in the field of mounting technology for mounting components on a printed circuit board, but with miniaturization of the printed circuit board, it can be understood as an application technology for components, especially semiconductor packages. it can. Further, the products to which the present invention is applied are all electric products in which a circuit is formed by using a printed wiring board. In particular, it is effective as a component connection method for a printed circuit board or the like that is downsized and lightweight by using a build-up board, a filled via structure, or the like.

For example, when the present invention is applied to a build-up board, it is possible to connect the electrode and the component drawn to the surface layer through necessary layers without using through holes penetrating the front and back of the board. This makes it possible to draw another wiring in a layer that does not require connection. Furthermore, by using a via with a filled via structure on the surface layer of the build-up board, the wiring drawn out to the surface layer by build-up connects the parts on the filled via (via filled with plating or filling material) without electrodes other than vias. It becomes possible to do.

[0032]

As described above, according to the present invention, the printed wiring can be formed on the three-dimensionally shaped portion of the mounting component by the conductive ink ejected from the ink ejecting means.
Further, according to the present invention, there is an effect that the three-dimensionally shaped portion of the mounted component and the wiring pattern on the printed board can be easily electrically connected by moving the ink jetting means. Further, according to the present invention, the printed wiring can be automatically and quickly formed on the three-dimensionally shaped portion of the mounted component.

[Brief description of drawings]

FIG. 1 is an explanatory diagram illustrating a partially enlarged cross section of a printed wiring board and an ink application module according to a first embodiment together.

FIG. 2 is an ink application module 8 according to a second embodiment.
3 is a partial schematic configuration diagram showing the configuration of FIG.

FIG. 3 is a perspective view of an ink application module set in which the ink application modules 8 are arranged so as to correspond to the number of electrodes of the mounting component 3.

FIG. 4 is a perspective view of the mounting component 3 after forming a large number of printed wirings 6 using the ink application module set shown in FIG.

5 is a control block configuration diagram for controlling movement of the ink application module 8 with respect to the mounting component 3 and ink ejection of the ink application module 8. FIG.

FIG. 6 is an explanatory diagram schematically showing the movement of the mounting component 3 of the ink application module 8 with respect to the electrode portion 4.

FIG. 7 is an explanatory view schematically showing the movement of the mounting component 3 of the ink application module 8 with respect to the electrode portion 4.

FIG. 8 is a flowchart showing a procedure of controlling by the configuration of the control block configuration diagram shown in FIG.

FIG. 9 is a block configuration diagram showing a printed wiring system according to Embodiment 5 of the present invention.

[Explanation of symbols]

1 ... Printed wiring board (printing board), 2 ... Wiring pattern, 3 ... Mounting component, 4 ... Electrode part, 5 ... Base ink layer, 6 ... Printed wiring, 7 ... Protective film, 8 ...・ Ink application (jetting) module, 9 ・ ・ Waste liquid discharge route, 10 ・ ・
Waste liquid reservoir, 11 ... Circuit formation ink buffer, 1
2 ... Buffer for base ink, 13 ... Buffer for protective ink, 14 ... Buffer for cleaning liquid, 15 ... Individual hose, 16 ... Common hose, 17 ... Spouting part, 17a
..Spouts, 18 ... Shafts, 19 ... Driving means, 20 ...
Ink ejection module set 21,22,23,2
4, 25 ... Drive circuit, 26 ... Control circuit, 27 ... Ink buffer module, 28 ... Ink ejection module, 29, 30, 31 ... Sensor, 32 ... Moving means,
33 ... Drive circuit unit.

Claims (6)

[Claims] 1. A printed circuit board, wiring formed on the printed circuit board, a mounting component mounted on the printed circuit board and having a three-dimensionally shaped portion, and an electrode portion formed on the mounting component. A printed wiring board, which is printed on a three-dimensionally shaped portion of a mounting component with a conductive ink material ejected from an ink ejecting means, and has a printed wiring that electrically connects the electrode portion and the wiring. 2. A printed circuit board, wiring formed on the printed circuit board, a mounting component having an electrode portion mounted on the printed circuit board, and the printing between the electrode portion of the mounting component and the wiring. A printed wiring board printed with a conductive ink material ejected from an ink ejecting means on a concavo-convex portion on a substrate, and including a printed wiring electrically connecting the electrode portion and the wiring. 3. The printed wiring board according to claim 1, wherein the electrode portion of the mounting component is formed by printing with a conductive ink material ejected from an ink ejecting unit. 4. A wiring forming step of forming wiring on a printed circuit board, a mounting step of mounting a mounting component on the printed circuit board, an electrode portion forming step of forming an electrode portion on the mounting component, and thereafter, A conductive ink material is jetted from the ink jetting means to print on a three-dimensionally shaped portion of the mounting component between the electrode portion and the wiring or an uneven portion on the printed board, and an electrode of the mounting component. A method of manufacturing a printed wiring board, comprising: a printing step of electrically connecting a portion and the wiring. 5. A wiring forming step of forming wiring on a printed circuit board, a mounting step of mounting a mounted component on the printed circuit board, and an ink ejecting means for ejecting a conductive ink material are three-dimensional in the mounted component. A moving step of moving to the vicinity of the shape portion, a printing step of ejecting the ink material from the ink ejecting means after the moving step to form a printed wiring between the mounting component and the wiring, and this printing step According to the above, the method for manufacturing a printed wiring board, comprising the step of electrically connecting the mounting component and the wiring. 6. The printing step comprises ejecting the conductive ink material from the nozzle of the inkjet printer while moving the nozzle of the inkjet printer between the electrode portion of the mounting component and the wiring. Item 4. A method for manufacturing a printed wiring board according to Item 4 or 5.