JP2006186097A - Viscous fluid coating method and program - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a coating method for selectively coating a viscous fluid only at a predetermined position of a component prior to mounting it to a board, in a component mounter for mounting components to the board. <P>SOLUTION: The coating method for coating the viscous fluid on components to be mounted to a board 120 from under components by a component mounter 100 contains the coating position obtaining step of obtaining a position in a component to be coated with the viscous fluid from a component information storage part 305; the relative position obtaining step of obtaining a relative position relationship between a viscous fluid coating part to coat the viscous fluid and a component; and the coating step of coating the viscous fluid at a predetermined position of the component, based on the coating position obtained by the coating position obtaining step and the relative position relationship obtained by the relative position obtaining step. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a viscous fluid application method applied to a component mounter that is a circuit board production apparatus, and more particularly to a method of selectively applying a viscous fluid to a predetermined position of a component.

  Conventionally, when an electronic component is mounted on a substrate, as shown in FIG. 15, after a solder pattern is printed on the substrate in a solder printer 901, an adhesive is applied to a necessary portion of the substrate using an adhesive applicator 902. The electronic components are mounted by the subsequent mounting machines 903 and 904, and finally the soldering is performed by the reflow apparatus 905.

  In the mounting line, the adhesive applicator 902 applies an adhesive to a portion of a substrate on which a relatively large electronic component such as a QFP (Quad Flat Package) or a BGA (Ball Grid Array) is mounted. In this case, after mounting a large electronic component on the substrate by the subsequent mounting machine 903, the electronic component is temporarily fixed to prevent the electronic component from being displaced due to an impact at the time of carrying the substrate when moving to the next process.

  However, the provision of the adhesive applicator 902 in the mounting line increases not only the introduction cost but also the cost in the installation space. Therefore, in order to avoid this, a proposal to add an adhesive application function to the mounting machine has been made. Yes.

For example, in Patent Document 1, as shown in FIGS. 13 and 14, a component mounter is provided in the middle of transporting an electronic component 9 held by a head 4 that holds and transports a component of a component mounter to a substrate. As shown in FIG. 14B, the retained electronic component 9 is immersed in the adhesive 10 in the tank 1 through the tank 1 in which the adhesive 10 is accommodated, as shown in FIG. In addition, after applying the adhesive 10a to the back of the electronic component 9, a technique for temporarily bonding the substrate and the electronic component by transporting and mounting the electronic component 9 to the substrate has been proposed.
Japanese Unexamined Patent Publication No. 64-66998

  However, in the technique described in Patent Document 1, since the electronic component held in the tank filled with the adhesive that is a viscous fluid is immersed and applied with the adhesive, the adhesive is applied to all one surface of the electronic component. Therefore, it cannot be applied to an electronic component having a terminal on the surface because the terminal is insulated by an adhesive.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a viscous fluid application method for selectively applying a viscous fluid only to a predetermined position of a component.

  In order to achieve the above object, a viscous fluid application method according to the present invention is a method of applying a viscous fluid from below a component to a component mounted on a board by a component mounting machine, and the position in the component to which the viscous fluid is applied. An application position acquisition step for acquiring the relative position between the viscous fluid application means for applying the viscous fluid and the component, a relative position acquisition step for acquiring the relative position relationship, and the application position and the relative position obtained by the application position acquisition step. An application step of applying a viscous fluid to a predetermined position of the part based on the relative positional relationship obtained by the acquisition step.

  This makes it possible to selectively apply a viscous fluid only to a predetermined part of a component that needs to be applied with a viscous fluid. For example, an adhesive as a viscous fluid can be applied only to a component body while avoiding a terminal portion. On the contrary, the flux as the viscous fluid can be applied only to the terminal portion.

  The application step may further include a discharge direction control step for controlling the discharge direction of the viscous fluid.

  Thereby, it becomes possible to apply a viscous fluid to an arbitrary part according to the shape and size of the component.

  The viscous fluid application method may further include a defect detection step of imaging a part after application of the viscous fluid and detecting a defective application of the viscous fluid by image analysis, and a removal step of removing the part in which the defect is detected.

  As a result, when the application state of viscous fluid is imaged, and the application failure of viscous fluid is confirmed, the component can be removed. Can be improved.

  Further, the viscous fluid may be applied to the component while the component and the viscous fluid applying means move relatively, and the component moves while the component moves toward the mounting point of the substrate. You may make a viscous fluid apply | coat.

  By applying viscous fluid while moving relatively, it becomes possible to apply viscous fluid continuously in the direction of relative movement, and by applying viscous fluid intermittently, viscous fluid can be applied in a matrix or staggered pattern. It is also possible to apply. On the other hand, the moving time of the component can be effectively used by applying the viscous fluid while the component is moving inside the mounting machine.

  The problem solution can be realized not only as such a viscous fluid application method but also as a program for causing a computer to execute the method. Of course, the same applies to a storage medium for storing the program. Furthermore, it can also be realized as a component mounter having a configuration capable of implementing such a method.

  According to the present invention, the viscous fluid can be applied to the part only at a necessary portion.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is an external perspective view of a part mounting machine 100 that realizes the viscous fluid coating method according to the embodiment of the present invention, with a part cut away.

  A component mounting machine 100 shown in the figure is a device that can be incorporated into a mounting line, mounts an electronic component on a substrate received from upstream, and sends out a substrate with the electronic component mounted downstream, and sucks and conveys the electronic component. A multi-head unit 110 having a plurality of mounting heads that can mount electronic components on the substrate, an XY robot 113 that moves the multi-head unit 110 in the horizontal plane direction, and a component supply unit 115 that supplies components to the mounting head And. In addition, in the same figure, the component supply part 115 is shown in the state in which the cover was covered.

  Specifically, the component mounting machine 100 is a mounting machine capable of mounting various electronic components from minute components to connectors on a board. □ Large electronic components of 10 mm or more, and irregular shaped components such as switches and connectors , A mounting machine capable of mounting IC components such as QFP (Quad Flat Package) and BGA (Ball Grid Array).

FIG. 2 is a plan view showing a main internal configuration of the component mounter 100.
The component mounter 100 further includes a nozzle station 119 on which a replacement nozzle that is replaceably attached to the mounting head to accommodate various types of component types, a rail 121 that forms a track for transporting the substrate 120, and a transport A mounting table 122 on which the mounted substrate 120 is placed and an electronic component is mounted, and a component collection device 123 as a removing unit that collects the component when there is a defect in the sucked and held electronic component.

  In addition, the component supply unit 115 is provided before and after the component mounting machine 100, and includes a component supply unit 115a that supplies electronic components stored in a tape shape, and a plate that is partitioned according to the size of the component. And a component supply unit 115b for supplying electronic components to be stored.

  FIG. 3 is a perspective view schematically showing details of the multi-head unit 110. FIG. 4 is a side view schematically showing details of the multi-head unit 110.

  The multi-head unit 110 shown in FIGS. 3 and 4 is connected to the XY robot 113 and is movable in the XY directions (X arrow and Y arrow directions in the figure), and is provided in parallel to the lower surface of the head base 401. The two hanging rails 402 extending in the length direction of the head base 401 and the hanging rails 402 engage with the hanging base rail 402, are held in a hanging shape by the head base 401, and are slidable with respect to the head base 401 (S arrow in the figure). Direction) U-shaped moving body 403, an application portion 410 as a viscous fluid applying means attached to the U-shaped moving body 403, and eight mounting heads 101 that can be raised and lowered relative to the head base body 401. (FIG. 5 is a front view showing a part of the U-shaped moving body 403 cut out). Further, the mounting head 101 includes a detachable holding nozzle 112 for sucking the electronic component A, and the drawing shows a state in which the holding nozzle 112 holds the electronic component A.

  The application unit 410 includes two discharge nozzles 411 provided on the lower upper surface of the U-shaped moving body 403, two tanks 412 that hold an adhesive for supplying the discharge nozzle 411, and a tube 414 that connects them. It has.

  As shown in FIG. 6, the discharge nozzle 411 has a semi-cylindrical shape, and a plurality of discharge ports 415 are formed radially upward with the relative movement direction S of the U-shaped moving body 403 with respect to the head base 401 as an axis. The outer peripheral surface of 411 is provided.

  An existing technique can be adopted as an adhesive discharge method of the application unit 410. For example, there is a method of jetting the adhesive at a high speed from the discharge port 415 by instantaneously increasing the pressure of a part of the adhesive supply path.

  Further, as shown in FIG. 5, an imaging unit 413 constituting a failure detection unit is provided on the opposite side of the tank 412 of the U-shaped moving body 403. This imaging means 413 is a CCD camera, and is combined with a light source 422 disposed in the U-shaped moving body 403 and an optical system 421 such as a mirror, so that the discharge nozzle 411 is disposed on the lower upper surface of the U-shaped moving body 403. The lower surface of the electronic component held by the holding nozzle 112 can be imaged through the imaging window 416 provided at the sandwiched position.

  The U-shaped moving body 403 includes a driving device (not shown) such as a stepping motor. The U-shaped moving body 403 extends along the two hanging rails 402 provided in the length direction of the head base body 401. It is freely movable in the length direction (S direction in the figure).

FIG. 7 is a block diagram showing a functional configuration of the component mounter 100.
As shown in the figure, the component mounter 100 includes an application position acquisition unit 301, a relative position acquisition unit 302, an ejection direction control unit 303, an application control unit 304, a component information storage unit 305, and a defect detection. Part 307.

  The application position acquisition unit 301 grasps the type of the electronic component A held by the holding nozzle 112 and determines the position at which the adhesive of the electronic component A is applied from the component information stored in the component information storage unit 305. The information is acquired and transmitted to the application control unit 304 and the ejection direction control unit 303.

  The relative position acquisition unit 302 acquires the relative position between the electronic component A held by the holding nozzle 112 and the discharge nozzle 411 and transmits the information to the application control unit 304 and the like. Specifically, the relative position is acquired by detecting the relative positional relationship between the head base 401 and the U-shaped moving body 403 from the driving state of the driving device and calculating the relative position based on the information. .

  The discharge direction control unit 303 is based on the information on the position where the adhesive is applied to the electronic component A transmitted from the application position acquisition unit 301, and any one of the plurality of discharge ports 415 provided in the discharge nozzle 411. Controls whether the adhesive is discharged from Specifically, a method of selecting the discharge port 415 by controlling whether to increase the pressure of a part of the adhesive supply path can be exemplified.

  The application control unit 304 is a CPU, a numerical processor, or the like, and is a processing unit that controls the application unit 410 based on component information and relative position information. The application control unit 304 also controls the amount of adhesive discharged.

  The component information storage unit 305 is a hard disk or the like that stores information on electronic components that require application of an adhesive, the amount and position of the adhesive when applied, a component library, and the like.

  FIG. 8 is a diagram showing a part of information of electronic component information stored in the component information storage unit 305.

  As shown in the figure, in the part information storage unit 305, (1) the coordinates of the part that is the base point to which the adhesive is first applied corresponding to the part number of the part, and (2) the X direction from the coordinates. The number of adhesive points to be applied and the intervals thereof, (3) Similarly, the number of adhesive points to be applied in the Y direction, and the interval thereof, and (4) the amount of adhesive to be applied per point are stored. Yes.

  The application position and the application amount are obtained by acquiring the shape of the application target part of the component from the component information storage unit 305 in advance and automatically generating the application position data from the shape of the application part. The information is newly stored in the storage unit 305.

  Specifically, in the case of an electronic component A as shown in FIG. 9A, the electrodes C, which are conductive portions at the left and right ends of the component, are excluded from the shape of the application target portion, and the application position is limited to the internal rectangular region. Is automatically generated. If the viscous fluid to be applied is cream solder or flux, as shown in FIG. 9B, the application position is automatically created with the portion of the electrode C as the shape of the application target portion. In these cases, the part information storage unit 305 stores data indicating the shape of the electrode C corresponding to the product number and the position of the electrode C in the part, and the application position is automatically generated based on this data.

  Based on the coating position created as described above, for example, for the product number A001, the number of points in the X-axis direction and the Y-axis direction is set to nine, and the pitch in the X-axis direction and the pitch in the Y-axis direction are set to be the same. In this case, the adhesive can be applied at the matrix application points B as shown in FIG. Further, if the number of points in the X-axis direction is set to 5 and the number of points in the Y-axis direction is set to 2 for the product number A002, the adhesive can be applied at the matrix-shaped application points B as shown in FIG. . If the pitch is set small, as shown in FIGS. 9A and 9B, it is possible to continuously apply the adhesive to the application target portion. If the number of points on either the X axis or the Y axis is set to 0, the setting is such that no adhesive is applied to the electronic component A having the corresponding product number.

  FIG. 10 is a flowchart showing the steps of the viscous fluid application method executed by the component mounter 100 according to the present embodiment.

  First, it is determined whether all the holding nozzles 112 attached to the mounting head 101 are suitable for the next mounting operation (S601), and the holding nozzles 112 necessary for the mounting operation are not aligned with each mounting head 101. When (S601: N), the multi-head unit 110 moves to the nozzle station 119 and performs nozzle replacement (S602). Examples of the type of the holding nozzle 112 include, for example, types S, M, and L, depending on the size of a component that can be sucked.

  Next, the multi-head unit 110 moves to the component supply units 115a and 115b, and holds the electronic component A by suction (S603). In the case of this embodiment, eight electronic components A are picked up at the same time, and at this stage, the application position acquisition unit 301 grasps the product number and the holding order of each electronic component held. Yes.

  The application position acquisition unit 301 further acquires each application position, each point, each application amount, and the like of the viscous fluid corresponding to the grasped product number of each electronic component from the component information storage unit 305 (S604).

  Next, the multi-head unit 110 starts to move toward the component mounting point of the board 120 placed on the mounting table 122 (S605).

  Subsequently, the coating unit 410 provided on the U-shaped moving body 403 starts moving with respect to the head base body 401 (S606).

  The relative position acquisition unit 302 acquires the relative positional relationship between the head base 401 and the application unit 410 (S607).

  Next, from the acquired part number and order of the electronic components held, application position information, and relative position information, the application control unit 304 determines that “the discharge nozzle 411 is positioned at the lower part of the lower surface of the electronic component to be applied. If “Yes” is determined (S608: Y), the application unit 410 discharges the adhesive and applies the adhesive to a predetermined position of the electronic component (S609). At this time, the relative movement between the head base 401 and the coating unit 410 is not stopped, and the ejection port 415 suitable for the electronic component is selected by the ejection direction control unit 303, and only the selected ejection port 415 is bonded. The agent is discharged.

  Here, in a direction perpendicular to the relative movement direction S between the head base 401 and the application unit 410, the adhesive can be applied to the application point B at once by the discharge nozzle 411 including the plurality of discharge ports 415. . On the other hand, in the same direction as the relative movement direction S, the application point B is intermittently applied to the application point B as the application unit 410 moves, so that the application point B is formed in a matrix or continuously as shown in FIG. Can be arranged.

  Next, the application state of the adhesive is imaged by the imaging means 413, and the defect detection unit 307 analyzes this image to detect whether the adhesive is applied satisfactorily or whether there is an application defect (S610).

  And it repeats with respect to each electronic component holding the said steps S606 to S610 (S611: N). Finally, when the adhesive has been applied to all necessary electronic components (S611: Y), all the held electronic components are mounted on the substrate 120 (S612).

  Note that the electronic component A in which the adhesive application failure is detected in the failure confirmation step S610 is either collected by the component collection device 123 or discarded in a disposal box (not shown).

  Thereby, it can apply | coat so that the application | coating point B lined up perpendicularly | vertically with respect to the relative movement direction S may be formed in the lower surface of the electronic component A hold | maintained at the holding nozzle 112, and the space | interval of the application | coating point B, The number can also be arbitrarily selected. Further, as shown in FIG. 9, an adhesive can be applied to the electronic component A in a matrix by relative movement between the electronic component A held by the holding nozzle 112 and the discharge nozzle 411.

  As described above, according to the present embodiment, the adhesive can be selectively applied to a predetermined portion of the lower surface of the electronic component according to the type of the electronic component.

  In addition, since the application state of the adhesive can be confirmed by the image pickup means 413, it is possible to improve the mounting quality by collecting the electronic component in which the application failure has occurred and mounting a new electronic component. Become. Furthermore, if this component mounting machine 100 is adopted, it is not necessary to introduce an adhesive applicator to the mounting line, and the equipment cost can be reduced.

  In this embodiment, the viscous fluid applied to the electronic component is an adhesive. However, the present invention is not limited to this, and flux or solder (cream solder) may be used as long as it is a viscous fluid. Also, the method of applying viscous fluid is not only the ejection by the above-mentioned jetting, but also spraying, the tip of the nozzle opening for ejection is brought close to the part, and the nozzle is moved away after applying the viscous fluid pushed out by screw type etc. to the part A method of applying a certain amount of viscous fluid may be adopted. In the case where a viscous fluid such as a flux is applied to an electronic component, the viscous fluid is selectively applied to a terminal portion that is a soldering portion, contrary to the present embodiment.

  Further, the application unit 410 is not limited to one that moves with the mounting head 101. For example, as shown in FIG. 11, the application unit 410 is attached to the base of the component mounting machine 100 so as not to move, and the electronic component A is applied to the application unit 410 that does not move together with the mounting head 101 that holds the application component. A relatively moving object may be used. In addition, since the application unit 410 illustrated in FIG. 11 includes a plurality of discharge ports 415 in a matrix shape, the viscous fluid may be applied in a matrix shape while the electronic component A is stationary on the application unit 410. it can. In this case, the mechanical structure of the multi-head unit 110 including the mounting head 101 is simplified, and a tank or the like that holds the viscous fluid can be fixed to the component mounting machine 100. Therefore, a relatively large amount of viscous fluid can be held. It becomes possible.

  Also, as shown in FIG. 12, a discharge nozzle 411 of the coating unit 410 is provided in the vicinity of the component supply window 125 provided in the component supply unit 115a, and the mounting head 101 removes the component from the component supply unit 115a. The viscous fluid may be applied immediately after receiving the supply. In this case, it is not necessary to provide a new driving device in the mounting machine for applying the viscous fluid, and it is not necessary to separately provide a moving route for the mounting head 101 for applying the viscous fluid. A viscous fluid can be applied along with the movement.

  The present invention can be applied to a component mounter that mounts a component on a substrate, and in particular, can be applied to a component mounter that selectively applies a viscous fluid to a specific portion of a component.

1 is an external perspective view showing a part cut out of a component mounter according to an embodiment of the present invention. It is a top view which shows the main internal structures of the said component mounting machine. It is a perspective view which shows the detail of a multihead part typically. It is a side view which shows the detail of a multihead part typically. It is a front view which notches and shows a part of U-shaped moving body. It is a perspective view which expands and shows typically a discharge nozzle and an electronic component. It is a block diagram which shows the functional structure of the said component mounting machine. It is a figure which shows the one part content of the information of the electronic component memorize | stored in a components information storage part. It is a figure which shows the variation of the arrangement | positioning state of the adhesive agent apply | coated to an electronic component. It is a flowchart which shows the viscous fluid application | coating method performed with a component mounting machine. It is a perspective view which shows the arrangement | positioning variation of an application part. It is a perspective view which shows the arrangement | positioning variation of an application part. It is a side view which shows the conventional viscous fluid application | coating method. It is a side view which shows the application state of the conventional viscous fluid. It is a block diagram which shows the conventional mounting line typically.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Component mounting machine 101 Mounting head 110 Multihead part 112 Holding nozzle 113 XY robot 115 Component supply part 119 Nozzle station 120 Board | substrate 121 Rail 122 Mounting table 123 Component collection apparatus 125 Window 301 Application position acquisition part 302 Relative position acquisition part 303 Discharge direction Control unit 304 Application control unit 305 Component information storage unit 307 Defect detection unit 401 Head base 402 Hanging rail 403 U-shaped moving body 410 Application unit 411 Discharge nozzle 412 Tank 413 Imaging means 414 Tube 415 Discharge port 416 Imaging window

Claims (13)

A method of applying a viscous fluid to a component mounted on a board by a component mounting machine,
An application position acquisition step of acquiring an application position in a component to which a viscous fluid is applied;
A relative position acquisition step of acquiring a relative positional relationship between the viscous fluid applying means for applying the viscous fluid and the component;
A viscous fluid comprising: an application step of applying a viscous fluid to a predetermined position of a component based on the application position obtained by the application position acquisition step and the relative positional relationship obtained by the relative position acquisition step. Application method. The application step further includes
The viscous fluid application method according to claim 1, further comprising a discharge direction control step of controlling a discharge direction of the viscous fluid. The viscous fluid application method further includes:
A defect detection step of imaging a part after application of viscous fluid and detecting a defective application of viscous fluid by image analysis;
The viscous fluid application method according to claim 1, further comprising a removing step of removing a component in which a defect is detected. The application step further includes
2. The viscous fluid application method according to claim 1, wherein the viscous fluid is applied to the component while the component and the viscous fluid application means move relatively. The application step further includes
The viscous fluid application method according to claim 1, wherein the viscous fluid is applied to the component while moving while the component is moving toward the mounting point of the substrate. The viscous fluid application method further includes:
The shape acquisition step of the application target portion for acquiring the shape of the application target portion of the component from the component information storage means;
The viscous fluid application method according to claim 1, further comprising: an application position creation step of creating an application position indicating a position where the part should be applied from the acquired shape of the application target part. Furthermore, the viscous fluid is an adhesive, and the component is a component having a conductive portion in the shape of the application target portion,
The viscous fluid coating method according to claim 6, wherein the coating position creating step excludes the conductive portion from the shape of the coating target portion. Further, the viscous fluid is cream solder or flux, and the component is a component having a conductive portion in the shape of the application target portion,
The viscous fluid coating method according to claim 6, wherein the coating position creating step creates the coating position with the conductive portion as the shape of the coating target portion. Furthermore, the component mounting machine includes a plurality of holding nozzles that can hold a plurality of components simultaneously,
The application position acquisition step acquires each application position of a plurality of parts held by the holding nozzle,
The application step sequentially applies viscous fluid to each predetermined position of a plurality of parts based on the application position obtained by the application position acquisition step and the relative positional relationship obtained by the relative position acquisition step. The viscous fluid coating method according to claim 1.   The viscous fluid application program which makes a computer perform the step contained in the viscous fluid application method of any one of Claims 1-9. A component mounter for mounting components on a board,
Viscous fluid application means for applying a viscous fluid to the lower part of the component;
Application position acquisition means for acquiring the position in the part to which the viscous fluid is applied from the part information storage means;
Relative position acquisition means for acquiring a relative positional relationship between the viscous fluid application means and the component, a component based on the application position obtained by the application position acquisition means and the relative positional relationship obtained by the relative position acquisition means And a viscous fluid applying means for applying the viscous fluid at a predetermined position. The viscous fluid application means further includes
The component mounting machine according to claim 11, further comprising a discharge direction control unit that controls a discharge direction of the viscous fluid. The component mounter further includes
An imaging means for imaging the component after applying the viscous fluid;
12. The apparatus according to claim 11, further comprising: a defect detection unit that analyzes an image obtained by the imaging unit and detects a defective application of the viscous fluid; and a removal unit that removes a component in which the defect is detected by the defect detection unit. The component mounting machine described.

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