JP2011129608A - Component mounting method, and substrate fixture - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting method in which components can be easily mounted on both top and reverse sides of a flexible substrate by a component mounting device, and to provide a substrate fixture that is manufactured inexpensively and facilitates fixture maintenance. <P>SOLUTION: The substrate fixture includes top and reverse-side plates 1 and 2 provided with openings 11 and 22 at positions on both the top and reverse sides of the flexible substrate 3 which correspond to mounting positions of the components, and positioning and fixing parts 14, 21, 24, 31 of mutually fixing the top and reverse-side plates in a state where the top and reverse-side plates and the substrate are relatively positioned, so the fixture includes a small number of components and is manufactured inexpensively, and the fixture maintenance is facilitated. Further, once the substrate is positioned and fixed to the substrate fixture, the components can be mounted on both the top and reverse sides of the substrate with high precision without detaching the substrate from the substrate fixture. Consequently, the number of processes of positioning and fixing the substrate for the component mounting can be decreased to lighten the load on an operator. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a component mounting method for supplying a flexible substrate to a component mounting apparatus and mounting the component on the substrate, and a substrate fixing jig used in the component mounting method.

  For example, Patent Document 1 discloses a substrate fixing jig used when a flexible substrate is supplied to a component mounting apparatus and components are mounted on the substrate. The substrate fixing jig includes a fixing plate, a covering plate, and an alignment jig. The substrate is placed between the fixing plate and the covering plate by covering the substrate placed on the fixing plate with the covering plate. It is designed to be positioned and fixed. A plurality of magnets are embedded in the covering range of the cover plate of the fixed plate, and positioning holes are drilled in the mounting range of the substrate in the fixed plate according to the arrangement of the positioning holes drilled in the substrate. In addition, the covering area of the substrate on the covering plate is provided with an opening that covers the terminal portion and edge portion of the substrate and exposes the component mounting portion, and a positioning hole that matches the arrangement of the positioning holes drilled in the substrate Is perforated. The positioning jig is provided with positioning pins that match the positioning holes of the fixing plate, the cover plate, and the substrate.

  When the substrate is fixed to the substrate fixing jig having the above-described configuration, the fixing plate is placed on the positioning jig by inserting the positioning hole of the fixing plate into the positioning pin of the positioning jig. Then, the positioning hole of the substrate is inserted into the positioning pin to place the substrate on the fixed plate, and the positioning hole of the covering plate is inserted into the positioning pin to cover the substrate with the covering plate. As a result, the fixed plate, the substrate and the cover plate can be relatively positioned to expose the component mounting part of the substrate from the opening of the cover plate, and the cover plate is attracted to the fixed plate by the magnetic force of the magnet embedded in the fixed plate. Can be fixed.

Japanese Patent Laying-Open No. 2006-5106 (paragraph numbers 0027 to 0032, FIG. 2)

  In recent years, in order to increase the component mounting density in a flexible substrate, electronic components have been mounted on both the front and back surfaces of the substrate. The substrate fixing jig described in Patent Document 1 is a jig for mounting electronic components only on the surface of the substrate, but when mounting electronic components on both the front and back surfaces of the substrate using this substrate fixing jig, It is necessary to prepare a cover plate for the front surface of the substrate and a cover plate for the back surface. First, using a positioning jig, positioning is performed so that the component mounting portion on the surface of the substrate is exposed from the opening of the surface covering plate, and the surface covering plate is fixed to the fixing plate. Then, the substrate fixing jig on which the substrate is positioned and fixed is supplied to the component mounting apparatus, and the electronic component is mounted on the surface of the substrate.

  Next, once remove the board from the board fixing jig, turn the board over and position it using the alignment jig so that the component mounting part on the back side of the board is exposed from the opening of the cover plate for the back side. The covering plate is fixed to the fixing plate. Then, the substrate fixing jig on which the substrate is positioned and fixed is supplied to the component mounting apparatus, and the electronic component is mounted on the back surface of the substrate. As described above, since it is necessary to prepare two cover plates for the front surface and the back surface of the substrate in addition to the fixing plate and the alignment jig as the substrate fixing jig, jig production becomes expensive and jig maintenance is required. Management is complicated. Further, the number of work steps for mounting electronic components on both the front and back surfaces of the substrate using the substrate fixing jig is large, which increases the burden on the operator.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a component mounting method capable of easily mounting components on both the front and back surfaces of a flexible substrate by a component mounting apparatus and jig manufacturing at low cost. An object of the present invention is to provide a substrate fixing jig that can be easily maintained.

  In order to solve the above-described problem, the structural feature of the invention according to claim 1 is that the component mounting method for mounting components on the front and back surfaces of the flexible substrate by a component mounting apparatus is formed in a plate shape larger than the substrate. And a step of positioning the substrate with respect to the back plate by bringing the back surface into contact with the back plate provided with an opening at a position corresponding to the mounting part of the component on the back surface of the substrate. And a surface plate formed in a plate shape larger than the substrate and provided with an opening at a position corresponding to a mounting site of the component on the surface of the substrate placed on the back plate. A step of abutting on the surface of the substrate and positioning and placing on the back plate; and fixing the front plate and the back plate with the substrate sandwiched therebetween And mounting the component on one surface of the front and back surfaces of the substrate by the component mounting apparatus with one of the front plate and the back plate fixed with the substrate interposed therebetween. And mounting the component on the other surface of the front surface and the back surface of the substrate by the component mounting device with the other of the front plate and the back plate facing up. That is.

  The structural feature of the invention according to claim 2 is a board fixing jig for holding the board between the front and back surfaces of the flexible board by a component mounting apparatus so that the board is sandwiched and is larger than the board. Formed on the back surface of the substrate that has been positioned and placed, and is formed in a plate shape that is larger than the substrate, the back plate having an opening provided at a position corresponding to the mounting site of the component, A front plate, which is positioned and placed on the substrate with respect to the back plate and has an opening provided at a position corresponding to the mounting site of the component on the front surface of the substrate, the front plate, the substrate, and Positioning fixing means for fixing the front plate and the back plate in a state where the back plate is relatively positioned.

  According to a third aspect of the present invention, in the second aspect of the present invention, the positioning fixing unit includes a positioning pin provided on one of the front plate and the rear plate, and the other plate and the second plate. A positioning hole into which the positioning pin is inserted is provided in the substrate, and when the substrate is sandwiched between the front plate and the back plate, the positioning pin is inserted into the both positioning holes, and the front plate, Relative positioning of the substrate and the back plate.

  According to a fourth aspect of the present invention, in the second or third aspect of the invention, the positioning and fixing means includes a magnet on at least one of the front plate and the back plate, and the substrate. Is fixed between the front plate, the substrate, and the back plate by the attractive force of the magnet when the plate is sandwiched between the front plate and the back plate.

  A structural feature of the invention according to claim 5 is that, according to any one of claims 2 to 4, notches are respectively formed at different positions of the front plate and the back plate, and the front plate and The exposed portions of the back plate facing the notches are pressed in directions away from each other to separate the front plate and the back plate so that the substrate is the front plate and the back plate. It is taking out from between.

  According to the first aspect of the present invention, the substrate is sandwiched and fixed between the front and back plates provided with openings at positions corresponding to the mounting sites of the components on both the front and back surfaces of the flexible substrate. Since the components are supplied and mounted on both the front and back surfaces of the substrate, the components can be mounted on both the front and back surfaces of the substrate without being removed from between the plates once the substrate is positioned and fixed. Therefore, it is possible to reduce the number of man-hours for positioning and fixing the board in component mounting, and the burden on the operator can be reduced.

  According to the second aspect of the present invention, the front and back plates provided with openings at positions corresponding to the mounting sites of the components on both the front and back surfaces of the flexible substrate, and the front and back plates and the substrate are relatively positioned. Since the substrate fixing jig is constituted by the positioning and fixing means for fixing the back surface plates to each other, the number of parts of the jig is small, jig manufacturing is low cost, and jig maintenance management is easy. In addition, once the substrate is positioned and fixed to the substrate fixing jig, components can be mounted on both the front and back surfaces of the substrate with high accuracy without removing the substrate from the substrate fixing jig. Therefore, it is possible to reduce the number of man-hours for positioning and fixing the board in component mounting, and the burden on the operator can be reduced.

  According to the invention of claim 3, since the positioning pins are provided on one of the front and back plates and the positioning holes are provided on the other and the substrate, the openings on the front and back surfaces of the substrate are opened from the openings of the front plate and the back plate. It is possible to mount the electronic component with high accuracy by accurately exposing a plurality of mounting parts of the electronic component.

  According to the fourth aspect of the present invention, the magnet is attached to one of the front and back plates and the front plate and the back plate are fixed by magnetic force, so when the substrate is fixed to the substrate fixing jig. Work becomes easier. In addition, since the front plate, the substrate, and the back plate can be fixed in close contact with each other, it is possible to prevent the positional deviation of the substrate during the component mounting operation and to mount components with high accuracy.

  According to the fifth aspect of the present invention, since the notches are formed at different positions on the front surface plate and the back surface plate, the front surface plate and the back surface plate are fixed when the substrate is fixed to the substrate fixing jig. Even if there is a close contact, the exposed plate facing each notch of the front and back plate is placed between the front plate and the back plate by, for example, placing a finger on the exposed portion and peeling off the front plate and the back plate. The substrate can be easily taken out from.

It is a perspective view which shows the positional relationship when a board | substrate is fixed with the plate for front surfaces of the board | substrate fixing jig by the 1st Embodiment of this invention, and the plate for back surfaces. It is a perspective view which shows the plate for surfaces of FIG. It is a perspective view which shows the plate for back surfaces of FIG. It is a figure which shows the solder printing apparatus, component mounting apparatus, and reflow furnace which are arrange | positioned at the component mounting process. It is a perspective view which shows the positional relationship when a board | substrate is fixed with the plate for setting of the board | substrate fixing jig by the 2nd Embodiment of this invention, and the plate for suppression. FIG. 6 is a perspective view showing a state immediately before the setting plate is placed on the extraction plate in order to take out the substrate on the setting plate of FIG. 5. FIG. 6 is a perspective view showing a state immediately after the set plate is placed on the take-out plate in order to take out the substrate on the set plate in FIG. 5.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a first embodiment of the invention will be described with reference to the drawings. As shown in FIG. 1, the substrate fixing jig according to the first embodiment includes a front plate 1, a back plate 2, positioning pins 21 as positioning fixing means of the present invention, positioning holes 11 and 31, and a magnet. 14 and 24, the substrate 3 is sandwiched between the front plate 1 and the back plate 2, and the front plate 1, the substrate 3 and the back plate 2 are connected by the positioning pins 21 and the positioning holes 11 and 31. In the state of relative positioning, the front plate 1 and the back plate 2 are fixed by the magnets 14 and 24.

  The substrate 3 fixed to the substrate fixing jig is a flexible substrate whose planar shape is formed in a substantially rectangular shape by an insulating film such as a polyester film or a polyimide film. Circuit patterns (not shown) for mounting electronic components are formed on the front and back surfaces of the substrate 3. Two circular positioning holes 31 through which the two round bar-shaped positioning pins 21 provided on the back plate 2 are inserted are formed in two diagonal corners of the four corners of the substrate 3. It is installed.

  As shown in FIG. 2, the surface plate 1 is formed in a substantially rectangular shape whose planar shape is larger than the planar shape of the substrate 3 by a magnetic metal plate such as a steel material. Two circular positioning holes 11 having substantially the same diameter as the positioning holes 31 are formed in the surface plate 1 at positions corresponding to the two positioning holes 31 of the substrate 3 when the substrate 3 is fixed. Yes. The surface plate 1 is provided with a plurality of openings 12 through which a plurality of mounting parts of electronic components on the surface of the substrate 3 can be exposed when the substrate 3 is fixed. In this example, six rectangular strip-shaped openings 12 extending in the long side direction of the surface plate 1 are arranged in parallel in the short side direction. In addition, circular through-holes 13 are formed in substantially central portions on both sides in the long side direction of the surface plate 1, and columnar magnets 14 having substantially the same diameter as the through-holes 13 are formed in the through-holes 13. Each is fitted. Further, two substantially rectangular cutouts 15 are formed on both sides of the front plate 1 in the long side direction.

  As shown in FIG. 3, the back plate 2 is formed in a substantially rectangular shape having a planar shape that is larger than the planar shape of the substrate 3 by a metal plate having magnetism such as a steel material and substantially the same as the planar shape of the surface plate 1. ing. The back plate 2 has substantially the same diameter as the positioning holes 11 and 31 at positions corresponding to the two positioning holes 31 of the substrate 3 and the two positioning holes 11 of the front plate 1 when the substrate 3 is fixed. Two positioning pins 21 having a diameter are provided upright. The back plate 2 is provided with a plurality of openings 22 through which a plurality of mounting parts (not shown) of electronic components on the back surface of the substrate 3 can be exposed when the substrate 3 is fixed. In this example, five rectangular strip-shaped openings 22 extending in the long side direction of the back plate 1 are arranged in parallel in the short side direction. In addition, circular through holes 23 are respectively drilled in the four corners of the back plate 2, and cylindrical magnets 24 having substantially the same diameter as the through holes 23 are fitted in the through holes 23, respectively. Yes. Further, on the both sides in the long side direction of the back plate 2, one substantially rectangular cutout 25 is formed at a position different from the position of the cutout 15 of the front plate 1.

  As described above, the front surface plate 1 and the back surface plate 2 provided with the openings 11 and 22 at positions corresponding to the mounting parts of the electronic components on both the front and back surfaces of the substrate 3, and the front surface plate 1, the substrate 3 and the back surface Since the positioning pin 21, the positioning holes 11 and 31, and the magnets 14 and 24 that fix the front surface plate 1 and the back surface plate 2 in a state where the plate 2 is relatively positioned, a substrate fixing jig is configured. The number of parts is small, jig production is low cost, and jig maintenance management is easy.

  When fixing the substrate 3 to the substrate fixing jig, the operator makes the back surface of the substrate 3 face the back plate 2 placed on the work table, and positions the positioning holes of the substrate 3 on the positioning pins 21 of the back plate 2. 31 is inserted, and the substrate 3 is placed in contact with the back plate 2. Further, the front plate 1 is made to face the surface of the substrate 3, the positioning holes 11 of the front plate 1 are inserted into the positioning pins 21 of the back plate 2, and the front plate 1 is brought into contact with the substrate 3. Place.

  Thus, when the substrate 3 is sandwiched between the front plate 1 and the back plate 2, the positioning pins 21 of the back plate 2 are inserted into the positioning holes 11 and 31 of the front plate 1 and the substrate 3 for the front surface. Since the position of the substrate 3 with respect to the plate 1 and the back plate 2 is positioned, a plurality of mounting parts of electronic components on the front and back surfaces of the substrate 3 from the openings 11 and 22 of the front plate 1 and the back plate 2 are defined. It is possible to accurately expose and mount electronic components with high accuracy. At this time, the front plate 1 and the back plate 2 are attracted to each other by the magnetic force of the magnets 14 and 24 of the front plate 1 and the back plate 2, so that the work for fixing the substrate 3 to the substrate fixing jig is performed. Becomes easier. In addition, since the front plate 1, the substrate 3 and the back plate 2 can be fixed in close contact with each other, it is possible to prevent the positional deviation of the substrate 3 during the component mounting operation and to mount components with high accuracy.

  Here, as shown in FIG. 4, in the mounting process of the electronic components on both the front and back surfaces of the substrate 3, the solder printing device 4 for the front surface and the back surface, the component mounting device 5, the reflow furnace 6, and the substrate transport device 7 are included. It is arranged. The substrate 3 positioned and fixed to the substrate fixing jig (hereinafter simply referred to as “fixed substrate 3”) has the surface up, and the surface solder printing device 4 and component mounting device by the conveyor belt 7a of the substrate transfer device 7 5 and the reflow furnace 6 are continuously supplied to perform each treatment. Thereafter, the fixed substrate 3 is reversed by a reversing device (not shown) and the back surface is turned up, and returned to the solder printing device 4 for the back surface by a return conveyor (not shown) to perform the above-described processes. First, the schematic configuration of the solder printing apparatus 4, the component mounting apparatus 5, and the reflow furnace 6 will be described.

  The solder printing apparatus 4 includes a stage 41 for moving the fixed substrate 3 in the vertical direction and the horizontal direction, a screen mask 42 having an opening formed in accordance with a solder printing position on the fixed substrate 3, and cream solder on the screen mask 42. And a squeegee 44 that slidably contacts the upper surface of the screen mask 42 to print cream solder at a solder printing position on the fixed substrate 3.

  The component mounting apparatus 5 includes a pair of fixed rails 51 that extend in a horizontal direction orthogonal to the board conveyance direction by the conveyor belt 7 a and are arranged in parallel at a predetermined interval, and extend in a horizontal direction orthogonal to the fixed rail 51. A moving rail 52 that is arranged so that both ends thereof are movably supported along the fixed rail 51 and moves a component picking head 53 described later in the horizontal direction, and a component picking that is supported so as to be movable along the moving rail 52. A head 53, a suction nozzle 54 that is mounted on the component picking head 53 so as to be rotatable about a vertical axis and movable in the vertical direction, and sucks an electronic component; and a plurality of component supply feeders 55 that supply a plurality of types of electronic components; It has. The reflow furnace 6 includes a heat generating portion 61 that generates heat at a predetermined temperature, and a blower portion 62 that blows warm air at a predetermined temperature from the heat generating portion 61 into the furnace.

  Next, a process of mounting electronic components on both the front and back surfaces of the fixed substrate 3 will be described. First, after starting the solder printing device 4, the component mounting device 5, the reflow furnace 6, and the like, the worker places the fixed substrate 3 on the conveyor belt 7a with the surface of the fixed substrate 3 facing up. When the fixed substrate 3 is conveyed by the conveyor belt 7a and supplied to the surface solder printing device 4, the position of the solder printing position on the surface of the fixed substrate 3 and the opening of the surface screen mask 42 are aligned by the movement of the stage 41. Is done. Subsequently, cream solder is supplied onto the surface screen mask 42 by the solder supply unit 43, and the cream solder is printed at a solder printing position on the surface of the fixed substrate 3 by the movement of the squeegee 44. Then, the fixed substrate 3 is returned onto the conveyor belt 7a by the movement of the stage 41.

  When the fixed substrate 3 is conveyed by the conveyor belt 7a and supplied to the component mounting apparatus 5, the electronic component is sampled from the component supply feeder 55 by the movement of the moving rail 52 and the component sampling head 53 and the movement and suction of the suction nozzle 54. Then, the electronic component collected is mounted on the component mounting portion on the surface of the fixed substrate 3 by the movement of the moving rail 52 and the component collecting head 53 and the movement and rotation of the suction nozzle 54 again. At this time, since the fixed substrate 3 is higher by the thickness of the back plate 2, the electronic components are mounted with an offset. When the mounting of a predetermined number of electronic components is completed and the fixed substrate 3 is conveyed by the conveyor belt 7a and supplied to the reflow furnace 6, the solder paste printed on the surface of the fixed substrate 3 is at a predetermined temperature in the furnace. It is heated and melted. Thereafter, when the fixed substrate 3 is conveyed outside the furnace by the conveyor belt 7a, the solder paste is cooled and solidified, so that the electronic component can be electrically connected to the circuit pattern formed on the surface of the fixed substrate 3. The mounting of the electronic components on the surface of the fixed substrate 3 is completed.

  Then, the fixed substrate 3 is reversed by the reversing device so that the back surface is turned up, returned to the solder printing position 4 for the back surface by the return conveyor, and each processing described above is performed on the back surface of the fixed substrate 3. 3 is completed. Then, the operator places a finger on the exposed portion of the back plate 2 facing the notch 15 of the front plate 1 and the exposed portion of the front plate 1 facing the notch 25 of the back plate 2, Each exposed portion is pressed away from each other to separate the front plate 1 and the back plate 2. As a result, the substrate 3 can be easily taken out between the front plate 1 and the back plate 2. As described above, the substrate 3 is sandwiched between the front surface plate 1 and the back surface plate 2 and positioned and fixed so as to be supplied to the component mounting apparatus 5 and the like. Electronic components can be mounted on both the front and back surfaces of the substrate 3 with high accuracy without being removed from between the plates 1 and 2 for use. Therefore, the number of steps for positioning and fixing the substrate 3 in component mounting can be reduced, and the burden on the operator can be reduced.

  Next, a second embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 5 and 6, the substrate fixing jig according to the second embodiment includes a setting plate 81, a holding plate 82, an extraction plate 83, positioning pins 811 and 816, positioning holes 821, A positioning notch 841 and a magnet 814 are provided, and the substrate 84 is sandwiched between the setting plate 81 and the holding plate 82, and the setting plate 81 is formed by positioning pins 811, 816, positioning holes 821 and positioning notches 841. The setting plate 81 and the holding plate 82 are fixed by the magnet 814 in a state where the substrate 84 and the holding plate 82 are relatively positioned. Then, the substrate 84 is taken out by placing the setting plate 81 on which the substrate 84 on which the electronic component has been mounted is set on the extraction plate 83.

  The substrate 84 fixed to the substrate fixing jig is a small substrate formed of a resin material in a substantially square shape with a planar shape having a rounded corner. A circuit pattern (not shown) for mounting electronic components is formed only on the surface of the substrate 84. Two semicircular positioning notches 841 into which two round bar-shaped positioning pins 811 provided on the set plate 81 are fitted are formed at substantially central portions of two orthogonal sides of the substrate 84.

  The set plate 81 is formed in a substantially rectangular shape that can arrange a plurality of substrates 84 in a lattice shape (in this example, 3 × 5, 15 in total) by a magnetic metal plate such as steel. ing. The set plate 81 is formed with a plurality of (15) concave portions 810 having a substantially square shape that can be fitted with the respective substrates 84 and arranged at predetermined intervals. In each recess 810, two positioning pins 811 having substantially the same diameter as the positioning notches 841 are erected at positions corresponding to the two positioning notches 841 of the substrate 84 when the respective substrates 84 are fitted. ing.

  Further, each recess 810 is provided with a take-out hole 812 for taking out the substrate 84 on which the electronic component has been mounted at a position shifted from the center of the recess 810. In addition, circular through-holes 813 are respectively drilled at four corners of the setting plate 81 and at two positions in the approximate center, and a cylindrical magnet having substantially the same diameter as the through-hole 813 is formed in the through-holes 813. 814 is inserted in each. In addition, one substantially rectangular notch 815 is formed at each of the positions of the set plate 81 that is shifted to the left and right from the substantially central portion on both sides in the long side direction. In addition, two round rod-shaped positioning pins 816 that can be inserted into two circular positioning holes 821 provided in the holding plate 82 are provided upright at substantially central portions on both sides in the long side direction of the setting plate 81. Has been.

  The holding plate 82 is formed of a metal plate having magnetism, such as a steel material, so that the planar shape is substantially the same as the planar shape of the setting plate 81. In the holding plate 82, two positioning holes 821 having substantially the same diameter as the positioning pins 816 are formed at positions corresponding to the two positioning pins 816 provided on the setting plate 81. In addition, the holding plate 82 is provided with a plurality of openings 822 through which a mounting portion of an electronic component on each substrate 84 can be exposed when a plurality (15) of the substrates 84 are fixed. In this example, three rectangular strip-shaped openings 822 extending in the long side direction of the holding plate 82 are arranged in parallel in the short side direction.

  The extraction plate 83 is formed in a substantially rectangular shape whose planar shape is substantially the same as the planar shape of the setting plate 81 by a metal plate or plastic plate having no magnetism such as aluminum. In the extraction plate 83, a plurality (15) of diameters smaller than the diameter of the extraction hole 812 and longer than the depth are provided at positions corresponding to the plurality (15) of extraction holes 812 formed in the setting plate 81. ) Taking-out pins 831 are erected. In addition, a substantially rectangular notch 832 is provided at a position shifted from the substantially central part on both sides in the long side direction of the extraction plate 83 to the left and right and different from the position of the notch 815 of the setting plate 81. Each one is formed.

  When fixing a plurality (15) of the substrates 84 to the substrate fixing jig having the above-described configuration, the operator sets the back surface of the substrate 84 to face the set plate 81 placed on the work table, and sets the substrate. The substrate 84 is fitted into the concave portion 810 of the plate for plate 81, and the positioning notch 841 of the substrate 84 is fitted into the positioning pin 811 of the set plate 81 so that the substrate 84 is placed on the set plate 81 in contact with it. . Further, the restraining plate 82 is opposed to the surface of the substrate 84, and the positioning plate 82 is inserted into the positioning pin 816 of the setting plate 81 so that the restraining plate 82 is brought into contact with the substrate 84. Place.

  Thus, when the substrate 84 is sandwiched between the setting plate 81 and the holding plate 82, the positioning notches 841 of the substrate 84 are fitted into the positioning pins 811 of the setting plate 81, and further, the positioning pins 816 of the setting plate 81 are inserted. Since the position of the substrate 84 relative to the set plate 81 and the restraining plate 82 is positioned through the positioning hole 821 of the restraining plate 82, the electronic components on the surface of the substrate 84 from each opening 822 of the restraining plate 82 It is possible to mount the electronic component with high accuracy by exposing the mounting portion with high accuracy. At this time, since the holding plate 82 is attracted to the setting plate 81 by the magnets 814 of the setting plate 81, the work for fixing the substrate 84 to the substrate fixing jig is facilitated. Further, since the set plate 81 and the restraining plate 82 can be fixed in close contact with each other, it is possible to prevent the positional deviation of the substrate 84 during the component mounting operation and to mount components with high accuracy.

  Then, the same process as the electronic component mounting process described in the first embodiment is performed only on the surface of the substrate 84. When the electronic component mounting process is completed, the operator places the board fixing jig on the work table with the setting plate 81 facing down, and holds the board fixing jig so as to face the notch 815 of the setting plate 81. A finger is placed on the exposed portion of the plate 82 and lifted upward, and the holding plate 82 is peeled off from the set plate 81. Then, as shown in FIG. 6, the setting plate 81 on which a plurality of (15) substrates 84 are set is placed on the extraction plate 83.

  Then, as shown in FIG. 7, the takeout pin 831 of the takeout plate 83 protrudes from the takeout hole 812 of the set plate 81. Then, one end of the substrate 84 that comes into contact with the tip of the take-out pin 831 is pushed up with the positioning pin 811 of the setting plate 81 as a fulcrum. Therefore, the operator can easily take out one end of the substrate 84 from the concave portion 810 of the setting plate 81 with his / her finger. Then, the operator puts a finger on the exposed portion of the set plate 81 facing the notch 832 of the take-out plate 83, and pulls the set plate 81 upward to separate it from the take-out plate 83, and the next electronic component 84. Preparation for the mounting process begins.

  In the above-described embodiment, the positioning holes 11 of the front surface plate 1, the positioning pins 21 of the back surface plate 2, the positioning holes 31 of the substrate 3, and the positioning pins 811, 1 for the one substrate 84 of the setting plate 81. Although two positioning notches 841 of the two substrates 84, positioning pins 816 of the setting plate 81, and positioning holes 821 of the holding plate 82 are provided at two locations, any number may be provided at arbitrary positions. . Further, the configuration is such that two magnets 14 on the front plate 1, four magnets 24 on the back plate 2, and six magnets 814 on the set plate 81 are provided, but an arbitrary number is provided at an arbitrary position. It may be. Further, four cutouts 15 on the front plate 1, two cutouts 25 on the back plate 2, two cutouts 815 on the set plate 81, and two cutouts 832 on the takeout plate 83 are provided. However, if the cutout 15 and the cutout 832 are provided so that the positions of the cutout 15 and the cutout 25 are different, an arbitrary number is provided at any position. May be.

  Further, in the mounting process of the electronic component according to the first embodiment, the process of placing the fixed substrate 3 on the conveyor belt 7a is performed by an operator, but is configured to be automated through an apparatus. Also good. In addition, the step of inverting the fixed substrate 3 to perform the back surface mounting after the surface mounting of the substrate 3 is completed and the step of returning the fixed substrate 3 to the back side substrate printing apparatus 4 are automatically performed through the apparatus. However, it may be performed by an operator. Moreover, although the board | substrate printing apparatus 4 for the surface of the board | substrate 3 and the back surface was provided, you may comprise so that printing of the front and back both surfaces of the board | substrate 3 is possible by the board | substrate printing apparatus 4 of 1 unit | set. Further, instead of the holding plate 82 of the substrate fixing jig of the second embodiment, an adhesive (for example, “silica” manufactured by Mitsubishi Plastics Co., Ltd.) is poured into the setting plate 81 and the substrate 84 is moved. You may comprise so that it may fix.

  DESCRIPTION OF SYMBOLS 1 ... Front plate, 2 ... Back plate, 3,84 ... Board, 5 ... Component mounting apparatus, 11, 31 ... Positioning hole (positioning fixing means), 12, 22 ... Opening part, 14, 24 ... Magnet (Positioning) Fixing means), 15, 25 ... notches, 21 ... positioning pins (positioning fixing means).

Claims (5)

In a component mounting method for mounting components on the front and back surfaces of a flexible substrate by a component mounting device,
The back plate is formed by bringing the back surface into contact with a back plate formed in a plate shape larger than the substrate and having an opening provided at a position corresponding to the mounting part of the component on the back surface of the substrate. Positioning and mounting with respect to,
A surface plate formed in a plate shape larger than the substrate and provided with an opening at a position corresponding to a mounting site of the component on the surface of the substrate placed on the back plate. Abutting on the front surface and positioning and placing on the back plate; and
Fixing the front plate and the back plate in a state of sandwiching the substrate;
The component is mounted on one surface of the front surface and the back surface of the substrate by the component mounting apparatus with one of the plate for the front surface and the plate for the back surface fixed with the substrate interposed therebetween, Mounting the component on the other surface of the front surface and the back surface of the substrate by the component mounting apparatus with the other plate out of the front plate and the back plate;
A component mounting method comprising: A substrate fixing jig for fixing the substrate by sandwiching the substrate in order to mount the component on the front and back surfaces of the flexible substrate by a component mounting device,
A back plate having an opening provided at a position corresponding to a mounting part of the component on the back surface of the substrate, which is formed in a plate shape larger than the substrate and positioned and placed;
A surface which is formed in a plate shape larger than the substrate, is positioned and placed on the substrate with respect to the back plate, and an opening is provided at a position corresponding to the mounting part of the component on the surface of the substrate Plates for
Positioning fixing means for fixing the front plate and the back plate in a state in which the front plate, the substrate and the back plate are relatively positioned;
A substrate fixing jig characterized by comprising: In claim 2,
The positioning fixing means is provided with a positioning pin in one of the front plate and the back plate and a positioning hole into which the positioning pin is fitted in the other plate and the substrate,
When the substrate is sandwiched between the front plate and the back plate, the positioning pins are inserted into the positioning holes to relatively position the front plate, the substrate and the back plate. A substrate fixing jig. In claim 2 or 3,
The positioning fixing means includes a magnet on at least one of the front plate and the back plate,
A substrate fixing jig for fixing the front plate, the substrate, and the back plate by an attractive force of the magnet when the substrate is sandwiched between the front plate and the back plate. . In any one of Claims 2-4,
Notches are respectively formed at different positions on the front plate and the back plate,
The exposed plates facing the notches of the front plate and the back plate are pressed in directions away from each other to separate the front plate and the back plate so that the substrate is separated from the front plate. A substrate fixing jig, wherein the substrate fixing jig is taken out from between the back plate.

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