JP7173093B2 - game machine - Google Patents

Description

The present invention relates to gaming machines.

Pachinko machines, slot machines, and the like are known as types of gaming machines. In these gaming machines, it is known that a lottery is held based on the establishment of a predetermined lottery condition, and a privilege is given to the player according to the result of the lottery. In addition, it is common that an effect is performed to make the player predict or recognize the result of the lottery. These gaming machines are provided with a board on which electronic parts for advancing games and electronic parts for executing effects are mounted.

Specifically, for a pachinko machine, for example, a lottery is performed based on the entry of a game ball into a ball entry section provided in the game area, and a variable display of patterns is performed on the display surface of the display device, and the lottery is performed. A configuration is known in which, when a winning result is obtained in , a combination of specific patterns or the like is finally displayed on the display surface, and a transition is made to a special game state advantageous to the player. When the state shifts to the special game state, for example, opening and closing of a ball entry device or the like provided in the game area is started, and game balls are paid out based on the entry of the ball into the ball entry device. (See Patent Document 1, for example).

JP 2012-170465 A

Here, in the gaming machines such as those exemplified above, it is necessary to mount the electronic components on the board in a suitable manner, and there is still room for improvement in this respect.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a gaming machine in which electronic components can be suitably mounted on a substrate.

In order to solve the above problems, the invention according to claim 1 is a gaming machine provided with a predetermined substrate,
A first predetermined electronic component and a second predetermined electronic component smaller than the first predetermined electronic component are mounted on the predetermined substrate,
a resist is provided between a plurality of connecting portions to which the plurality of electrodes of the first predetermined electronic component are electrically connected on the predetermined substrate;
The resist is not provided between a plurality of connecting portions to which the plurality of electrodes of the second predetermined electronic component are electrically connected on the predetermined substrate,
An outline display defining the area is provided around the area where the first predetermined electronic component is mounted on the predetermined substrate,
The predetermined board is characterized in that the area around the area on which the second predetermined electronic component is mounted is not provided with an outline display that defines the area.

ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to mount an electronic component suitably on a board|substrate.

1 is a front view of a pachinko machine according to a first embodiment; FIG. 1 is a perspective view showing the main configuration of a pachinko machine in an expanded state; FIG. 1 is a perspective view showing the main configuration of a pachinko machine in an expanded state; FIG. It is a front view which shows the structure of a game board. It is an explanatory view for explaining the configuration related to the discharge of the game ball that has flowed down the game area. It is a front view of a main controller. 1 is a front view of a pachinko machine with a decorative cover and a decorative substrate removed; FIG. (a) is a plan view showing a first mounting surface that is one side plate surface of the first decoration substrate; FIG. 4C is a plan view of the first mounting surface of the decoration substrate, and (c) is a plan view of the first mounting surface of the first decoration substrate showing an enlarged peripheral region of the small chip resistor mounted on the first decoration substrate; be. FIG. 8(a) is a cross-sectional view taken along line AA of FIG. 8(a); (a) is a plan view showing a first mounting surface that is one side plate surface of the second decorative substrate; FIG. 4C is a plan view of the first mounting surface of the decoration substrate, and (c) is a plan view of the first mounting surface of the second decoration substrate showing an enlarged peripheral region of the small chip resistor mounted on the second decoration substrate; be. 4 is a wiring diagram of a first light emitting circuit section in the first decorative substrate; FIG. (a) is a perspective view of the first mounting surface side of the first decoration substrate showing an enlarged periphery of the bypass capacitor; (b) a first mounting of the first decoration substrate showing an enlarged periphery of the small chip resistor; It is a perspective view of the surface side. (a) is a plan view of the first mounting surface of the first decorative substrate showing an enlarged peripheral region of the decoupling capacitor; (b) is an explanatory diagram for explaining the relationship between the pads in the peripheral region and the solder resist; (c) is an explanatory diagram for explaining the movement of the decoupling capacitor that can occur, and (d) is an explanatory diagram for explaining the movement of the decoupling capacitor that can occur in the comparative example. (a) is a plan view of the first mounting surface of the first decorative substrate showing an enlarged peripheral area of the small chip resistor; (b) is an explanation for explaining the relationship between the pads in the peripheral area and the solder resist; It is a figure, (c) is an explanatory diagram for explaining the movement mode of the small chip resistor that can occur, (d) is an explanatory diagram for explaining the movement mode of the small chip resistor that can occur in the comparative example is. (a) is a plan view showing the second mounting surface of the first decoration substrate, and (b) is a plan view of the second mounting surface of the first decoration substrate showing an enlarged rear side area of the first light emitting circuit section. (a) is a cross-sectional view of a first decorative substrate, and (b) is a cross-sectional view of a first decorative substrate in a comparative example. (a) is a plan view showing the first plate surface of the aggregate substrate, (b) is an explanatory diagram for explaining the trough division of the aggregate substrate, and (c) is an explanatory diagram for explaining the mountain division of the aggregate substrate. is. (a) is a perspective view of a dividing jig used for dividing an aggregate substrate, (b) is a front view of the dividing jig, and (c) is for explaining how the aggregate substrate is divided using the dividing jig. is an explanatory diagram of . 1 is a block diagram showing an electrical configuration of a pachinko machine; FIG. It is an explanatory view for explaining the contents of various counters used for winning or losing lottery. It is a flowchart which shows the main process performed by main side CPU. It is a flowchart which shows the timer interrupt processing performed by main side CPU. It is a flowchart which shows the special figure special electric control processing performed by main side CPU. It is a flow chart showing a special figure variation start process executed by the main side CPU. (a) is a plan view showing the first mounting surface of the first decoration substrate in the second embodiment; (b) the first decoration showing an enlarged peripheral region of the decoupling capacitor mounted on the first decoration substrate; 4 is a plan view of the first mounting surface of the substrate; FIG. FIG. 11 is a plan view of a first light emitting surface of a light emitting substrate according to a third embodiment; FIG. 4 is a plan view of the second light emitting surface of the light emitting substrate; (a) A plan view of a first light emitting surface of a light emitting substrate in a fourth embodiment, and (b) a plan view of the first light emitting surface of the light emitting substrate showing an enlarged peripheral region of a bypass capacitor. (a) is a plan view of a second light emitting surface of a light emitting substrate, and (b) is a plan view of the second light emitting surface of the light emitting substrate showing an enlarged peripheral region of a power supply terminal and a GND terminal.

<First Embodiment>
A first embodiment of a pachinko machine 10, which is a type of game machine, will be described in detail below with reference to the drawings. FIG. 1 is a front view of the pachinko machine 10, and FIGS. 2 and 3 are perspective views showing the main components of the pachinko machine 10 in an expanded state. 2 omits the configuration within the game area of the pachinko machine 10 for the sake of convenience, and FIG. 3 omits the configuration behind the pachinko machine 10 of the main controller 60, which will be described later.

The pachinko machine 10, as shown in FIG. have. The outer frame 11 is formed by connecting wooden plates on four sides and has a rectangular frame shape. A pachinko machine 10 is installed in a game hall by fixing an outer frame 11 to an island facility. Incidentally, the pachinko machine 10 does not have to have the outer frame 11, and the pachinko machine 10 may have a structure in which the outer frame 11 is attached to the island facilities of the game hall.

As shown in FIGS. 2 and 3, the gaming machine body 12 includes an inner frame 13, a front door frame 14 arranged in front of the inner frame 13, and a back pack unit 15 arranged behind the inner frame 13. and have. The inner frame 13 of the game machine body 12 is rotatably supported by the outer frame 11 . More specifically, the inner frame 13 can be rotated forward with the left side as the rotation base end side and the right side as the rotation tip side in a front view.

A front door frame 14 is rotatably supported by the inner frame 13, and is rotatable forward with the left side as the rotation base end side and the right side as the rotation tip side in a front view. In addition, the back pack unit 15 is rotatably supported by the inner frame 13, and is rotatable rearward with the left side as the rotation base end and the right side as the rotation tip side in a front view.

The gaming machine main body 12 is provided with a locking device at its turning tip, and has a function of locking the gaming machine main body 12 to the outer frame 11 so that it cannot be opened. It has a function of locking the door frame 14 with respect to the inner frame 13 so that it cannot be opened. Each of these locked states is released by unlocking the cylinder lock 17 exposed on the front surface of the pachinko machine 10 using an unlock key.

<Configuration of the front side>
Next, the configuration of the front side of the gaming machine body 12 will be described.

The inner frame 13 is mainly composed of a resin base 21 that has substantially the same outer shape as the outer frame 11 . A substantially elliptical window hole 23 is formed in the central portion of the resin base 21 . A game board 24 is detachably attached to the resin base 21 . The game board 24 is made of plywood, and the game area PA formed on the front surface of the game board 24 is exposed to the front side of the inner frame 13 through the window holes 23 of the resin base 21 .

<Game board configuration>
Here, the configuration of the game board 24 will be described with reference to FIG. FIG. 4 is a front view of the game board 24. FIG.

An inner rail portion 25 and an outer rail portion 26 are attached to the game board 24 so as to partition a part of the outer edge of the game area PA. The guide rail is configured as A game ball shot from a game ball shooting mechanism 27 (see FIG. 2) attached below the window hole 23 in the resin base 21 is guided to the upper part of the game area PA by guide rails.

Incidentally, the game ball launching mechanism 27 includes a launch rail 27a extending toward the guide rail, a ball feeder 27b that supplies game balls stored in an upper tray 54a, which will be described later, onto the launch rail 27a, and a and a solenoid 27c, which is an electric actuator that shoots the game ball supplied to the guide rail toward the guide rail. When a shooting operation device (or operation handle) 28 provided on the front door frame 14 is rotated, a solenoid 27c is driven and controlled to shoot a game ball.

The game board 24 is formed with a plurality of large and small openings penetrating in the front-rear direction. Each opening is provided with a general winning port 31, a special electric winning device 32, a first operating port 33, a second operating port 34, a through gate 35, a variable display unit 36, a special figure unit 37, a general figure unit 38, etc. ing. A total of four general winning openings 31 are provided, and the others are provided one each.

Even if a ball enters the through gate 35, no game ball is put out. On the other hand, when a ball enters the general winning hole 31, the special electric winning device 32, the first operating hole 33 and the second operating hole 34, a predetermined number of game balls are paid out. Specifically, regarding the number of prize balls, when one game ball enters the first operation port 33 or when one game ball enters the second operation port 34 , one prize ball is paid out, and when one game ball enters the general winning hole 31, 10 prize balls are paid out and sent to the special electric prize winning device 32 When one game ball is entered, 15 prize balls are paid out.

In addition, the number of prize balls is arbitrary, for example, the second operation port 34 may have a smaller number of prize balls than the first operation port 33, and the second operation port 34 may be the first operation port. The number of prize balls may be larger than 33.

In addition, an out port 24a is provided at the bottom of the game board 24, and game balls that do not enter various winning ports are discharged from the game area PA through the out port 24a. Further, the game board 24 is provided with a large number of nails 24b for appropriately dispersing and adjusting the falling direction of game balls, and various members such as windmills.

Here, the entry ball means that the game ball passes through a predetermined opening, and not only is the game ball discharged from the game area PA after passing through the opening, but also from the game area PA after passing through the opening. A mode in which the liquid continues to flow down the game area PA without being discharged is also included. However, in the following description, in order to clearly distinguish from the entry of game balls into the out port 24a, the general winning port 31, the special electric winning device 32, the first operating port 33, the second operating port 34, and the through gate 35 The entry of a game ball into the game ball is also expressed as winning.

The first operating port 33 and the second operating port 34 are unitized as an operating port device and installed on the game board 24 . Both the first working port 33 and the second working port 34 are open upward. Further, the two operating ports 33 and 34 are vertically aligned with the first operating port 33 facing upward. The second operating port 34 is provided with a universal electrical accessory 34a as a guide piece consisting of a pair of left and right movable pieces. A game ball cannot enter the second operating port 34 when the universal electrical role 34a is closed, and the winning to the second operating port 34 becomes possible when the universal electrical role 34a is in the open state.

A through gate 35 is provided upstream of the second operation port 34 in the direction in which the game ball flows. The through-gate 35 has a through-hole (not shown) penetrating in the vertical direction, and a game ball entering the through-gate 35 flows down the game area PA after winning. As a result, the game ball that has entered the through gate 35 can enter the second operating port 34. - 特許庁

Based on the winning of the through gate 35, the universal electrical accessory 34a of the second operating port 34 is switched from the closed state to the open state. Specifically, the internal lottery is performed with the winning of the through gate 35 as a trigger, and the general figure unit 38 provided in the lower right corner which is the area where the game ball does not pass in the game area PA. Variation display of the pattern is performed in the section 38a. Then, when the result of the internal lottery is the electric power open winning, the stop result corresponding to the result is displayed, and the variable display of the universal diagram display section 38a ends, the state shifts to the electric power open state. In the common electric open state, the common electric accessory 34a is opened in a predetermined manner.

In addition, the normal figure display unit 38a is composed of a segment display device in which a plurality of LED display segments are arranged in a predetermined manner. It may be constituted by other types of display devices such as displays, CRTs or dot matrix displays. In addition, as the pattern variably displayed in the normal figure display unit 38a, a configuration in which a plurality of types of characters are variably displayed, a configuration in which a plurality of types of symbols are variably displayed, a configuration in which a plurality of types of characters are variably displayed, or A configuration in which a plurality of types of colors are switched and displayed can be considered.

In the normal pattern unit 38, a normal pattern holding display portion 38b is provided at a position adjacent to the normal pattern display portion 38a. The number of winning game balls in the through gate 35 is reserved up to four, and the reserved number is displayed by lighting of the normal figure reservation display section 38b.

A winning lottery is performed with the winning of the first operating port 33 or the second operating port 34 as a trigger. Then, the result of the lottery is clearly shown through the display effect on the special figure unit 37 and the symbol display device 41 of the variable display unit 36. - 特許庁

In detail, the special figure unit 37 is provided with a special figure display section 37a. The display area of the special figure display portion 37a is narrower than the display surface 41a of the pattern display device 41. In the special figure display section 37a, a variable display or a predetermined display of the pattern is performed by performing a winning lottery with the winning of the first operation opening 33 or the winning of the second operation opening 34 as a trigger. Then, a result corresponding to the lottery result is displayed. In addition, the special figure display unit 37a is configured by a segment display device in which a plurality of LED display segments are arranged in a predetermined manner, but is not limited to this, a liquid crystal display device, an organic EL It may be constituted by other types of display devices such as displays, CRTs or dot matrix displays. In addition, as the pattern displayed in the special figure display unit 37a, a configuration in which multiple types of characters are displayed, a configuration in which multiple types of symbols are displayed, a configuration in which multiple types of characters are displayed, or multiple types of colors is displayed.

In the special figure unit 37, a special figure reservation display section 37b is provided at a position adjacent to the special figure display section 37a. The number of game balls won in the first operation port 33 or the second operation port 34 is reserved up to four, and the number of reservations is displayed by lighting the special figure reservation display part 37b.

More specifically, the pattern display device 41 is configured as a liquid crystal display device having a liquid crystal display, and display contents are controlled by a display control device, which will be described later. The pattern display device 41 is not limited to a liquid crystal display device, and may be a plasma display device, an organic EL display device, or another display device having a display screen such as a CRT, or a dot matrix display device. may

In the design display device 41, when the fluctuation display or the predetermined display of the pattern is performed in the special figure display unit 37a based on the winning to the first operation port 33 or the winning to the second operation port 34, the pattern is displayed according to it A variable display or a predetermined display is performed. For example, on the display surface 41a of the pattern display device 41, three pattern rows of upper, middle and lower rows are set as a plurality of display areas. The symbols are scroll-displayed in ascending or descending order. In this scroll display, scroll display is first started in all symbol rows, then the scroll display is switched to standby display in the order of upper symbol row→lower symbol row→middle symbol row. The game ends with the design still displayed. Then, in a game turn in which the game result is a jackpot result, a combination of predetermined symbols is stopped and displayed on the preset effective line on the display surface 41 a of the symbol display device 41 . Specifically, when the maximum winning jackpot result described later is obtained, the combination of the same odd numbered symbols is stopped and displayed, and when the low probability jackpot result described later is obtained, the combination of the same even numbered symbols is stopped and displayed. In the case of a low winning high probability big winning result, the combination of symbols which are not the same combination of symbols but not the low winning high probability big winning result are stop-displayed.

In the symbol display device 41, not only the display effect triggered by the winning of the first operation port 33 or the second operation port 34, but also the display effect during the opening/closing execution mode that shifts after winning is performed. will be In addition, based on the winning of any of the operation ports 33, 34, the display is started on the special figure display unit 37a and the symbol display device 41, and the predetermined result is displayed and the end is one of the game rounds. times. In addition, the pattern display device 41 may arbitrarily display the patterns in any manner without being limited to the above. can be changed as appropriate. Further, the patterns displayed variably on the pattern display device 41 are not limited to the above-described patterns, and for example, only numbers may be variably displayed as the patterns.

When a big win is won in a winning lottery based on the winning to the first operating port 33 or the winning to the second operating port 34, it shifts to the opening/closing execution mode in which the winning to the special electric prize winning device 32 is possible. The special electric prize winning device 32 includes a large prize winning opening (not shown) leading to the back side of the game board 24, and an opening/closing door 32a for opening and closing the big winning opening. The opening/closing door 32a is arranged in either a closed state or an open state. Specifically, the opening/closing door 32a is normally in a closed state in which game balls cannot win prizes, and is switched to an open state in which game balls can win prizes when the internal lottery wins the transition to the opening/closing execution mode. It has become. Incidentally, the open/close execution mode is a mode to be shifted to when a winning result is obtained. It should be noted that although it is not impossible to win a prize in the closed state, it may be configured to be in a state in which it is more difficult to win a prize than in the open state.

<Configuration for discharge of game balls>
FIG. 5 is an explanatory diagram for explaining a configuration relating to ejection of game balls that have flowed down the game area PA.

As already explained, a game ball entering any one of the general winning opening 31, the special electric winning device 32, the first operating opening 33, the second operating opening 34 and the out opening 24a is discharged from the game area PA. In other words, the game ball launched from the game ball launching mechanism 27 and flowed into the game area PA is any of the general winning port 31, the special electric winning device 32, the first operating port 33, the second operating port 34, and the out port 24a It will be discharged from the game area PA by entering the ball into. A game ball entering any one of the general prize winning port 31, the special electric prize winning device 32, the first operating port 33, the second operating port 34 and the out port 24a is led to the back side of the game board 24.例文帳に追加

On the back surface of the game board 24, discharge passage portions 42 to 48 are formed corresponding to the general prize winning port 31, the special electric prize winning device 32, the first operating port 33, the second operating port 34 and the out port 24a, respectively. . The game balls that have flowed into the discharge passages 42 to 48 are led to the lower end of the game board 24 on the back side of the game board 24 by flowing down the discharge passages 42 to 48 into which they flowed in, and are sent to a discharge ball recovery section (not shown). is recovered. Then, the game balls collected by the discharge ball collecting section are discharged to the ball circulation device of the island facility where the pachinko machine 10 is installed in the game hall.

Various detection sensors 42a to 48a for detecting game balls are provided in the discharge passages 42 to 48, respectively. These discharge passage portions 42 to 48 and detection sensors 42a to 48a will be described below. Since four general prize winning openings 31 are provided as already explained, there are discharge passage portions 42 to 44 corresponding to each of these four openings. In this case, one detection sensor 42a is provided for each of the first discharge passage portion 42 corresponding to the leftmost general prize winning port 31 and the second discharge passage portion 43 corresponding to the general prize winning port 31 adjacent thereto. 43a is provided. Specifically, the first winning opening detection sensor 42a is provided so that the detection range exists in the middle of the first discharge passage portion 42, and the detection range is in the middle of the second discharge passage portion 43. A second winning hole detection sensor 43a is provided so as to exist. The game ball entering the leftmost general winning hole 31 is detected by the first winning hole detection sensor 42a while passing through the first discharge passage part 42, and enters the general winning hole 31 on the right side. The ball is detected by the second winning opening detection sensor 43a while passing through the second discharge passage portion 43. FIG. In addition, a third discharge passage portion 44 is formed so as to join the two general prize winning openings 31 on the right side at a midway position. The third discharge passage portion 44 has an entrance side area corresponding to each of the two general winning openings 31, and has one exit side area by joining the entrance side areas in the middle. is doing. A third winning opening detection sensor 44a is provided so that a detection range exists in the middle of the exit side area of the third discharge passage portion 44 . A game ball that enters one of the two right-side general winning holes 31 is detected by the third winning hole detection sensor 44a while passing through the third discharge passage portion 44. - 特許庁

A fourth discharge passage portion 45 exists corresponding to the special electric prize winning device 32 . A special electric detection sensor 45a is provided so that a detection range exists in the middle of the fourth discharge passage portion 45, and the game ball entering the special electric prize winning device 32 passes through the fourth discharge passage portion 45. It is detected by the special electric detection sensor 45a. A fifth discharge passage portion 46 exists corresponding to the first operation port 33 . A first operation opening detection sensor 46a is provided so that a detection range exists in the middle of the fifth discharge passage portion 46, and the game ball entering the first operation opening 33 passes through the fifth discharge passage portion 46. It is detected by the first operation port detection sensor 46a while passing through. A sixth discharge passage portion 47 exists corresponding to the second operation port 34 . A second operation opening detection sensor 47a is provided so that a detection range exists in the middle of the sixth discharge passage portion 47, and the game ball entering the second operation opening 34 passes through the sixth discharge passage portion 47. It is detected by the second operation opening detection sensor 47a while it is passing through. A seventh discharge passage portion 48 is present corresponding to the out port 24a. An out-port detection sensor 48a is provided so that a detection range exists in the middle of the seventh discharge passage portion 48, and the game ball entering the out port 24a passes through the seventh discharge passage portion 48. It is detected by the outlet detection sensor 48a.

A game ball that is detected by any one of the various detection sensors 42a to 48a will not be detected by the other detection sensors 42a to 48a. A gate detection sensor 49a is also provided for the through gate 35, and the game ball passing through the through gate 35 on the way down the game area PA is detected by the gate detection sensor 49a.

Electromagnetic induction type proximity sensors are used as the various detection sensors 42a to 49a, but any sensor can be used as long as the game balls can be detected individually. Further, the various detection sensors 42a-49a are electrically connected to a main controller 60 which will be described later, and detection results of the various detection sensors 42a-49a are output to the main controller 60. FIG. Specifically, the various detection sensors 42a to 49a output a LOW level signal when no game ball is detected, and output a HI level signal when a game ball is detected. Note that the relationship between HI and LOW may be reversed without being limited to this.

As shown in FIG. 2, the front door frame 14 is provided so as to cover the entire front side of the inner frame 13 in which the game board 24 having the above configuration is attached to the resin base 21 . As shown in FIG. 1, the front door frame 14 is formed with a window portion 51 through which substantially the entire game area PA can be viewed from the front. The window portion 51 has a substantially elliptical shape, and a window panel 52 is fitted therein. The window panel 52 is made of glass in a colorless and transparent manner, but is not limited to this, and may be made of a synthetic resin in a colorless and transparent manner. As long as it is visible, it may be colored and transparent.

Above the window portion 51, a pair of left and right speaker portions 53 are provided for outputting sound effects and the like according to the game state. An upper bulging portion 54 bulging forward and a lower bulging portion 55 are vertically arranged below the window portion 51 . An upper plate 54a that opens upward is provided inside the upper bulging portion 54, and a lower plate 55a that likewise opens upward is provided inside the lower bulging portion 55. As shown in FIG. The upper plate 54a has a function of temporarily storing game balls paid out from a payout device, which will be described later, and guiding them toward the game ball launching mechanism 27 while aligning them in a line. In addition, the lower tray 55a has a function of storing surplus game balls in the upper tray 54a.

As shown in FIG. 1, on the front surface of the front door frame 14, a first decoration substrate 56 is provided on the left lower portion of the window portion 51, and a second decoration substrate 56 is provided on the upper side of the window portion 51 in the center in the left-right direction. A substrate 57 is provided. A plurality of LED chips are mounted on each of the decoration substrates 56 and 57, and these decoration substrates 56 and 57 perform light emitting effects corresponding to the game state. The front door frame 14 is provided with a first decorative cover 58 that covers the front of the first decorative board 56 and a second decorative cover 59 that covers the front of the second decorative board 57 . These decorative covers 58 and 59 are made of a transparent or translucent resin that transmits light emitted from the LED chips, and protrude toward the front of the pachinko machine 10 . Details of the decorative substrates 56 and 57 and the decorative covers 58 and 59 will be described later.

Next, the configuration of the rear side of the gaming machine main body 12 will be described.

As shown in FIG. 2, a main control device 60 is mounted on the back surface of the inner frame 13 (specifically, the game board 24) for main control of the game. FIG. 6 is a front view of the main controller 60. FIG.

<Configuration of main controller 60>
As shown in FIG. 6, the main controller 60 has a main control board 61 housed in a board box 60a. An MPU 62 is mounted on the element mounting surface, which is one plate surface of the main control board 61 . The board box 60a is formed transparent so that the MPU 62 accommodated in the board box 60a can be visually observed from the outside of the board box 60a. Although the board box 60a is formed colorless and transparent, it may be formed colored and transparent as long as the MPU 62 accommodated in the board box 60a can be visually observed from the outside of the board box 60a. The main controller 60 is mounted on the rear surface of the resin base 21 in the board box 60a such that the facing wall portion 60b facing the element mounting surface of the main control board 61 faces the pachinko machine 10 rearward. Therefore, by opening the game machine main body 12 to the front of the pachinko machine 10 with respect to the outer frame 11 and exposing the back surface of the resin base 21, it becomes possible to see the opposing wall portion 60b of the board box 60a and It is possible to see the MPU 62 through the opposing wall portion 60b.

The board box 60a is formed by assembling a plurality of case bodies 60c back and forth, and the plurality of case bodies 60c prevents the separation of the case bodies 60c and leaves traces of the case bodies 60c when the case bodies 60c are separated. A coupling portion 60e is provided for leaving the . A plurality of coupling portions 60e are arranged side by side on one side of the substantially rectangular parallelepiped board box 60a. As a result, in a state in which separation of the case body 60c is prevented by using some of the joints 60e, even if the case body 60c is separated by destroying the part of the joints 60e, another joint is subsequently performed. By bringing the portion 60e into the coupled state, it is possible to prevent the separation of the case body 60c again. In addition, since the connecting portion 60e is destroyed and a trace remains when the case body 60c is separated, it is possible to grasp whether or not the case body 60c is illegally separated by visually checking the connecting portion 60e. It becomes possible. In addition, a sealing seal 60f is attached to one side of the substrate box 60a opposite to the one side on which the connecting portions 60e are arranged so as to straddle the boundary between the case bodies 60c. When the sealing seal 60f is peeled off, the adhesive layer remains on the case body 60c. As a result, when the sealing seal 60f is peeled off when the case body 60c is separated, it is possible to leave a trace.

In the main control device 60 having the above configuration, the main control board 61 is owned by the manager of the game hall in order to generate an opportunity to change the setting state of the pachinko machine 10 within the range of "setting 1" to "setting 6". A setting key insertion unit 68a into which a setting key is inserted and turned ON, an update button 68b operated to sequentially change the setting state of the pachinko machine 10 after the ON operation to the setting key insertion unit 68a, and a main control unit. A reset button 68c operated to clear the data of a main side RAM 65 provided in the MPU 62 of 60, which will be described later, and first to third notification display devices 69a to 69c for notifying the management results of the game history. , is provided. Incidentally, the setting state of the pachinko machine 10 is not limited to the six stages of "setting 1" to "setting 6", and any number of stages may be used.

These setting key insertion portion 68a, update button 68b, reset button 68c, and first to third notification display devices 69a to 69c are all provided on the element mounting surface of the main control board 61. FIG. As already explained, the device mounting surface of the main control board 61 faces the opposing wall portion 60b of the board box 60a. not been That is, the opposed wall portion 60b has individual openings in areas opposed to the setting key insertion portion 68a, the update button 68b, and the reset button 68c. As a result, it is possible to insert a setting key into the setting key insertion portion 68a without opening the board box 60a, to press the update button 68b, and to press the reset button 68c. It is possible.

By inserting the setting key into the setting key inserting portion 68a and rotating it in a predetermined direction, the setting key inserting portion 68a is turned on. By starting the supply of operating power to the pachinko machine 10 in that state (that is, by starting the supply of operating power to the MPU 62 of the main controller 60), the setting state of the pachinko machine 10 can be changed. changeable state. In this state, each time the update button 68b is pressed once, the setting state of the pachinko machine 10 is changed step by step in the range of "setting 1" to "setting 6" in ascending order. When the update button 68b is operated in the state of "setting 6", the state is updated to "setting 1". The setting key insertion portion 68a is turned off by rotating the setting key inserted in the setting key insertion portion 68a from the ON operation position in a direction opposite to the predetermined direction to return to the initial position. Become. When the setting key insertion portion 68a is turned off, the changeable state ends, and the game can be played with the set values at that time. In other words, even if the update button 68b is operated after the changeable state ends, the setting value cannot be changed.

The ON operation for the setting key insertion portion 68a is valid only when the supply of operating power to the pachinko machine 10 is started (that is, when the supply of operating power to the MPU 62 of the main controller 60 is started). Therefore, even if the setting key inserting portion 68a is turned ON after the MPU 62 of the main controller 60 has completed the operation power supply start process, the setting value cannot be changed.

The setting state of the pachinko machine 10 determines the advantage per unit time in the pachinko machine 10, and the larger the value of "setting n" (n is an integer from "1" to "6") (that is, setting The higher the value, the higher the advantage. Although the details will be described later, there are a low probability mode in which the winning probability is relatively low and a high probability mode in which the winning probability is relatively high as a winning lottery mode that determines the winning probability of the jackpot result, and the set value is It is set so that the higher the value, the higher the winning probability of the jackpot result in the low probability mode. On the other hand, the winning probability of the jackpot results in the high probability mode is constant regardless of the set value.

The reset button 68c is operated to clear the data in the main RAM 65 as described above, but in order to clear the data, the operating power must be supplied to the pachinko machine 10 while the reset button 68c is pressed. (that is, it is necessary to start supplying operating power to the MPU 62 of the main controller 60). The ON operation for the reset button 68c is valid only when the supply of operating power to the pachinko machine 10 is started (that is, when the supply of operating power to the MPU 62 of the main controller 60 is started). Therefore, even if the reset button 68c is pressed after the MPU 62 of the main controller 60 completes the operation power supply start process, the data in the main RAM 65 cannot be cleared.

Each of the first to third notification display devices 69a to 69c is a segment display device in which seven LED display segments are arranged. It may be a light emitter, a liquid crystal display device, or an organic EL display. Each of the first to third notification display devices 69a to 69c is installed so that its display surface faces the direction in which the element mounting surface of the main control board 61 faces. covered. In this case, since the substrate box 60a is transparent, the display surfaces of the first to third notification display devices 69a to 69c housed in the substrate box 60a can be viewed from the outside of the substrate box 60a. becomes possible. As already explained, the main controller 60 is mounted on the rear surface of the resin base 21 in the substrate box 60a so that the facing wall portion 60b facing the element mounting surface of the main control substrate 61 faces the rear of the pachinko machine 10. Therefore, when the game machine main body 12 is opened to the front of the pachinko machine 10 with respect to the outer frame 11 and the back surface of the resin base 21 is exposed to the front of the pachinko machine 10, the first to third notifications are made through the opposing wall portion 60b. It is possible to view the display surfaces of the display devices 69a to 69c.

On the display surface of the first notification display device 69a, not only numbers "0" to "9" but also various characters including alphabetic characters are displayed. On the other hand, the numbers "0" to "9" are displayed on the second notification display device 69b and the third notification display device 69c. The management result of the game history is notified using the first to third notification display devices 69a to 69c. Further, in a changeable state in which the setting state of the pachinko machine 10 can be changed, a value corresponding to the current setting value is displayed on the third notification display device 69c. The value corresponding to the set value may be displayed on the first notification display device 69a, or may be displayed on the second notification display device 69b. In addition, the setting value before entering the changeable state is displayed on one of the first to third notification display devices 69a to 69c, and the current setting value is displayed on the first to third notification display devices. It is also possible to adopt a configuration in which the information is displayed on another notification display device out of the display devices 69a to 69c.

A sound emission control device 81 is provided above the main control device 60 on the back of the inner frame 13 . The audio light emission control device 81 executes sound output control, light emission control, and control of the display control device 82 according to instructions from the main control device 60 . In addition, the sound emission control device 81 executes emission control of the LED chips mounted on the first decoration substrate 56 and the second decoration substrate 57 .

As shown in FIG. 3, the back pack unit 15 is installed so as to cover the back side of the inner frame 13 including the main controller 60 and the sound emission control device 81 . The back pack unit 15 includes a back pack 72 made of a transparent synthetic resin, and a payout mechanism 73 and a controller assembly unit 74 are attached to the back pack 72 .

The payout mechanism part 73 includes a tank 75 to which game balls supplied from the island facilities of the game hall are sequentially replenished, and a payout device 76 for paying out the game balls stored in the tank 75 . The game balls paid out from the payout device 76 are discharged to the upper tray 54a or the lower tray 55a through a payout passage provided on the downstream side of the payout device 76.例文帳に追加The payout mechanism 73 is supplied with a main power supply of, for example, 24 volts AC, and is equipped with a back pack board having a power switch for turning the power ON and OFF.

The control device assembly unit 74 includes a payout control device 77 having a function of controlling a payout device 76, and a predetermined electric power required by various control devices, etc., is generated and output, and is accompanied by the operation of the shooting operation device 28 by the player. A power supply/shooting control device 78 for controlling the launching of game balls is provided. The payout control device 77 and the power supply/launch control device 78 are arranged one on top of the other in such a manner that the payout control device 77 is behind the pachinko machine 10 .

FIG. 7 is a front view of the pachinko machine 10 with the decorative covers 58 and 59 and the decorative substrates 56 and 57 removed. As shown in FIG. 1, the first decorative cover 58 has the upper, lower left and lower right portions of the back surface of the first decorative cover 58 erected to the rear of the pachinko machine 10 to form cylindrical cover fixing bosses 58a to 58c. are integrally formed. Further, the second decorative cover 59 is integrally formed with columnar cover fixing bosses 59a and 59b by erecting the left and right portions of the rear surface of the second decorative cover 59 toward the rear of the pachinko machine 10. As shown in FIG. Threaded holes (not shown) are formed at the ends of the raised ends of these cover fixing bosses 58a to 58c, 59a, and 59b. As shown in FIG. 7, the front door frame 14 is formed with through holes 14a to 14e that pass through the front door frame 14 in the front-rear direction so as to correspond to the cover fixing bosses 58a to 58c, 59a, and 59b. . As shown in FIG. 1, the first decorative cover 58 and the second decorative cover 59 are attached to the front door frame 14 by fixing the cover fixing bosses 58a to 58c, 59a, and 59b from the rear side of the front door frame 14 with screws. Fixed.

<Structure of Decorative Substrates 56 and 57>
Next, the configuration of the decorative substrates 56 and 57 will be described.

FIG. 8(a) is a plan view showing a first mounting surface 84 which is one plate surface of the first decoration substrate 56, and FIG. 8(b) is a decoupling capacitor 85 mounted on the first decoration substrate 56. FIG. 8C is a plan view of the first mounting surface 84 of the first decorative substrate 56 showing an enlarged peripheral area 86 of the peripheral area 86 of the small chip resistor 87 mounted on the first decorative substrate 56. FIG. 9 is a plan view of the first mounting surface 84 of the first decorative substrate 56 showing an enlarged view of 88, and FIG. 9 is a cross-sectional view taken along the line AA of FIG. 8(a). 10(a) is a plan view showing the first mounting surface 89, which is one plate surface of the second decoration substrate 57, and FIG. 10(b) is a bypass mounted on the second decoration substrate 57. FIG. FIG. 10(c) is a plan view of the first mounting surface 89 of the second decoration substrate 57 showing an enlarged peripheral region 98 of the capacitor 97, and FIG. FIG. 10 is a plan view of the first mounting surface 89 of the second decorative substrate 57 showing an enlarged peripheral area 102;

The decorative substrates 56 and 57 are four-layer substrates having a structure in which conductive layers and insulating layers are alternately laminated. As the insulating layer, a composite material obtained by impregnating a glass cloth base material with a thermosetting epoxy resin is used. The conductive layer is formed by etching a copper foil plate placed over or under the insulating layer.

As shown in FIG. 9, the first decoration substrate 56 includes a first wiring layer 91 arranged on the first mounting surface 84 side of the first decoration substrate 56 and the other side of the first decoration substrate 56 as conductive layers. and a second wiring layer 92 arranged on the side of a second mounting surface 95 which is a plate surface of. The first decorative substrate 56 includes a GND plane layer 93 (a ground plane layer or a ground plane layer) and a power plane layer 94 as conductive layers arranged between the first wiring layer 91 and the second wiring layer 92 . and have. Lands and wiring patterns are formed on the first wiring layer 91 and the second wiring layer 92 by etching a copper foil plate.

Although illustration is omitted, the second decoration substrate 57, like the first decoration substrate 56, has a first wiring layer disposed on the first mounting surface 89 side and the other side of the second decoration substrate 57 as a conductive layer. and a second wiring layer disposed on the side of the second mounting surface, which is the side plate surface. The second decorative substrate 57, like the first decorative substrate 56, has a GND plane layer (ground plane layer or ground plane layer) as a conductive layer disposed between the first wiring layer and the second wiring layer. and a power plane layer. Lands and wiring patterns are formed on the first wiring layer and the second wiring layer by etching a copper foil plate.

As shown in FIG. 1, the upper right portion of the first decorative substrate 56 is formed with a stepped recess 56a corresponding to the lower left portion of the curved window portion 51. As shown in FIG. A notch portion 56b is formed in the lower left portion of the first decoration board 56 to avoid the cover fixing boss 58b of the first decoration cover 58. As shown in FIG. Since the cutout portion 56b is provided in the first decoration board 56, the first decoration board 56 can be provided in a wide area behind the first decoration cover 58 while avoiding the cover fixing bosses 58b.

The first decorative substrate 56 is a deformed substrate having a stepped concave portion 56a and a notch portion 56b. The first decorative substrate 56 is not a rectangular or substantially rectangular substrate. As shown in FIG. 8(a), the dimension of the first decoration substrate 56 in the first direction DR1 (vertical direction in FIG. 8(a)) is the second dimension perpendicular to the first direction DR1 of the first decoration substrate 56. It is larger than the dimension in the direction DR2 (horizontal direction in FIG. 8A).

As shown in FIG. 10(a), the second decorative substrate 57 is formed in a horizontally elongated substantially elliptical shape. The second decoration substrate 57 is not a rectangular or substantially rectangular substrate. The dimension of the second decoration substrate 57 in the major axis direction LD (horizontal direction in FIG. 10(a)) is larger than the dimension of the second decoration substrate 57 in the minor axis direction SD (vertical direction in FIG. 10(a)).

As shown in FIG. 8A, a protruding portion 56c is provided substantially in the center of the stepped recessed portion 56a in the vertical direction. The first decoration board 56 is passed through the left side of the upper end of the first decoration board 56 , the left side of the lower end, and the right side of the lower end of the first decoration board 56 in the thickness direction. Fixing through-holes 56d to 56g are formed so that they can be fixed with screws. Further, as shown in FIG. 10( a ), the second decoration substrate 57 is passed through the left and right portions of the second decoration substrate 57 in the thickness direction so that the second decoration substrate 57 is attached to the front door frame 14 . Fixing through-holes 57a and 57b are formed for screw fixation.

As shown in FIG. 7, the front door frame 14 is provided with a columnar substrate to which decoration substrates 56 and 57 (FIGS. 8A and 10A) can be fixed on the front surface of the front door frame 14. Fixed bosses 103 to 108 are integrally formed. The board fixing bosses 103 to 108 stand in front of the pachinko machine 10 from the front surface of the front door frame 14, and decorative boards 56 and 57 can be screwed to the ends of the board fixing bosses 103 to 108. Screw holes 103a to 108a are formed. The decoration boards 56 and 57 are screwed onto the board fixing bosses 103 to 108 from the front of the pachinko machine 10 so that the first mounting surfaces 84 and 89 (FIGS. 8(a) and 10(a)) are attached to the pachinko machine 10. It faces forward and is fixed to the front surface of the front door frame 14 as shown in FIG.

As already explained, the light emission control of the LED chips mounted on the decorative substrates 56 and 57 and the sound output control of the speaker section 53 are performed by the audio light emission control device 81 (FIG. 3). As shown in FIG. 8A, the first decorative board 56 has a first connector 111 and a second connector 111 on a second mounting surface 95 (FIG. 9), which is a board surface opposite to the first mounting surface 84. As shown in FIG. A connector 112 is mounted. Further, as shown in FIG. 10A, the second decorative board 57 has a third connector 113, a fourth connector 114, and a third connector 113, a fourth connector 114, and a connector on the second mounting surface opposite to the first mounting surface 89. A fifth connector 115 is mounted.

A harness (not shown) for electrically connecting the sound emission control device 81 ( FIG. 3 ) and the first decoration board 56 is attached to the first connector 111 . Harnesses (not shown) for electrically connecting the first decoration board 56 and the second decoration board 57 are attached to the second connector 112 and the third connector 113 . Harnesses (not shown) for electrically connecting the second decorative board 57 and the pair of left and right speaker portions 53 are attached to the fourth connector 114 and the fifth connector 115 . The sound emission control device 81 outputs information for performing emission control of the LED chips mounted on the first decoration substrate 56 to the first decoration substrate 56 . In addition, the sound emission control device 81 transmits information for controlling light emission of the LED chips mounted on the second decoration substrate 57 to the second decoration substrate 57 via the first decoration substrate 56 and the speaker unit 53 . output information for sound output control.

As shown in FIG. 7, the front door frame 14 has first to fifth connectors 111 to 115 (FIGS. 8(a) and 10(a)) which penetrate the front door frame 14 in the front-rear direction. First to fifth connector insertion holes 14f to 14j are formed. The decorative boards 56 and 57 (FIGS. 8A and 10A) are exposed on the rear side of the front door frame 14 with the connectors 111 to 115 inserted through the corresponding connector insertion holes 14f to 14j. , and is fixed to the front door frame 14 . Harnesses (not shown) are attached to and detached from the first to fifth connectors 111 to 115 from the rear side of the front door frame 14 .

As shown in FIG. 8A, the first decorative substrate 56 is provided with a first light emitting circuit section 121, a second light emitting circuit section 122 and a third light emitting circuit section 123. As shown in FIG. Further, as shown in FIG. 10(a), the second decorative substrate 57 is provided with a fourth light emitting circuit section 124. As shown in FIG. These light emitting circuit units 121 to 124 are equipped with circuits for controlling light emission of a plurality of LED chips.

Specific configurations of the light emitting circuit units 121 to 124 will be described by taking the configuration of the first light emitting circuit unit 121 as an example.

FIG. 11 is a wiring diagram of the first light emitting circuit section 121 on the first decoration board 56. As shown in FIG. As shown in FIG. 11, the first light emitting circuit section 121 includes an LED driver 126, a bypass capacitor 85, 16 LED chips 127-142 and 8 small chip resistors 87, 143-149. . Although not shown, the second to fourth light emitting circuit units 122 to 124 also include LED drivers, bypass capacitors, multiple LED chips, and multiple small chip resistors. The number of LED chips included in each of the light emitting circuit units 121 to 124 is arbitrary, and the number of small chip resistors included in each of the light emitting circuit units 121 to 124 depends on the connection mode between the LED driver and the LED chip. Determined.

As shown in FIG. 11, the LED driver 126 includes a power terminal 151, a clock terminal 152, a data terminal 153, a GND terminal 154 (ground terminal or ground terminal), and first to eighth output terminals 155 to 162. , is equipped with A wiring pattern 164 for inputting a clock signal received from the sound emission control device 81 is electrically connected to the clock terminal 152 , and lighting control data received from the sound emission control device 81 is inputted to the data terminal 153 . An input wiring pattern 165 is electrically connected. A second wiring pattern 172b for electrically connecting the LED driver 126 to the GND plane layer 93 (FIG. 9) is connected to the GND terminal 154. A fourth wiring pattern 172d for supplying power is electrically connected.

In this specification, the term "terminal" refers to a linear metal part (for example, , the power terminal 151 and the GND terminal 154 (FIG. 8(b)) in the LED driver 126. Further, the term "electrode" in this specification means, in a narrow sense, the corresponding pad (or pad) and the electrical plane. At a metal part (for example, a first electrode 85a and a second electrode 85b (FIG. 8B)) provided in an electronic component (including a small chip component described later) for connecting with a bypass capacitor 85 On the other hand, the term “electrode” in this specification broadly refers to an electronic component (a small chip component to be described later) for electrically connecting to a corresponding pad (or pad). ) and includes the above-mentioned "terminal".

The LED driver 126 performs light emission control of the LED chips 127 to 142 connected to the first to eighth output terminals 155 to 162 based on the lighting control data received from the audio light emission control device 81 . Two LED chips out of the sixteen LED chips 127-142 and one small chip out of the eight small chip resistors 87, 143-149 are connected to each output terminal 155-162 of the LED driver 126. is electrically connected to the resistor. Small chip resistors 87, 143-149 are provided to limit the current flowing through the LED chips 127-142. By providing the small chip resistors 87 and 143 to 149, the LED chips 127 to 142 can be driven below the allowable current.

FIG. 12(a) is a perspective view of the first mounting surface 84 side of the first decoration board 56 showing an enlarged periphery of the bypass capacitor 85, and FIG. 12(b) is an enlarged view of the periphery of the small chip resistor 87. is a perspective view of the first mounting surface 84 side of the first decorative substrate 56 shown in FIG. As shown in FIG. 12(a), the bypass capacitor 85 is a surface-mounted chip capacitor, specifically, a laminated ceramic capacitor in which a large number of dielectrics and electrodes are stacked. The bypass capacitor 85 has a substantially rectangular parallelepiped shape and includes a pair of metal first and second electrodes 85a and 85b at both ends in the longitudinal direction.

The decoupling capacitor 85 has a dimension of 0.1 mm or more and 0.9 mm or less in a longitudinal direction along a plane orthogonal to the thickness direction of the decoupling capacitor 85 (hereinafter, also referred to as a "longitudinal direction of the decoupling capacitor 85"). It is a small chip component. In this specification, a small chip component is an electronic component whose longitudinal direction (hereinafter also referred to as "longitudinal direction of the small chip component") is 0.1 mm or more and 0.9 mm or less. is. Since the longitudinal dimension of the small chip component is 0.9 mm or less, the area occupied by the small chip component on the first decorative substrate 56 can be suppressed. As a result, it is possible to secure a large area for mounting electronic components other than the small chip component on the first decorative substrate 56 . In addition, small chip components can be commonly used as electronic components mounted between the first decorative substrate 56 and a substrate having a high mounting density of electronic components. Since the longitudinal dimension of the small chip component is 0.1 mm or more, the mechanical strength at the joint between the small chip component and the first decorative substrate 56 and the mechanical strength of the small chip component itself are excessively reduced. You can prevent it from slipping. Here, the connecting portion of the small chip component includes a pad electrically connected to the electrode of the small chip component, a solder fillet electrically connecting the electrode and the pad, and a wiring pattern drawn out from the pad. . By setting the longitudinal dimension of the small chip component to 0.1 mm or more, it is possible to prevent difficulty in visually confirming whether or not there is a mounting omission of the small chip component. The longitudinal dimension of the small chip component is preferably 0.3 mm or more and 0.8 mm or less. Since the longitudinal dimension of the small chip component is 0.8 mm or less, the area occupied by the small chip component on the first decorative substrate 56 can be reduced. By setting the longitudinal dimension of the small chip component to 0.3 mm or more, the mechanical strength of the small chip component and the mechanical strength of the small chip component itself can be increased. In addition, it is possible to simplify the process for confirming the presence or absence of mounting omissions of small chip components. More preferably, the longitudinal dimension of the small chip component is 0.4 mm or more and 0.7 mm or less. Since the longitudinal dimension of the small chip component is 0.7 mm or less, the area occupied by the small chip component on the first decorative substrate 56 can be further reduced. By setting the longitudinal dimension of the small chip component to 0.4 mm or more, the mechanical strength at the connection point between the small chip component and the first decorative substrate 56 and the mechanical strength of the small chip component itself are increased, It is possible to reduce the possibility of breakage of the small chip component itself, as well as reduce the possibility of breakage of the small chip component itself. Moreover, since the dimension of the small chip component in the longitudinal direction is 0.4 mm or more, it is possible to enhance the confirmation accuracy when visually confirming whether or not there is a mounting omission of the small chip component.

The bypass capacitor 85 has a longitudinal dimension of approximately 0.6 mm along a plane orthogonal to the thickness direction, and a lateral dimension along a plane orthogonal to the thickness direction (hereinafter also referred to as "transverse direction"). ) and the dimension in the thickness direction are approximately 0.3 mm. Since the longitudinal dimension of the decoupling capacitor 85 is 0.7 mm or less, the area occupied by the decoupling capacitor 85 in the first decoration board 56 can be reduced. By setting the longitudinal dimension of the bypass capacitor 85 to 0.4 mm or more, the mechanical strength of the connection point between the bypass capacitor 85 and the first decorative board 56 and the mechanical strength of the bypass capacitor 85 itself are increased, can be reduced, and the possibility of the bypass capacitor 85 itself being damaged can be reduced. Moreover, since the longitudinal dimension of the decoupling capacitor 85 is 0.4 mm or more, it is possible to improve the confirmation accuracy when visually confirming whether or not the decoupling capacitor 85 is mounted. The longitudinal dimension of the bypass capacitor 85 may be smaller than 0.6 mm (for example, 0.4 mm), and the transverse dimension of the bypass capacitor 85 may be smaller than 0.3 mm. (for example, a configuration of 0.2 mm) or a configuration in which the dimension in the thickness direction is smaller than 0.3 mm (for example, a configuration of 0.2 mm).

A first pad 171a (or a first pad) corresponding to the first electrode 85a of the bypass capacitor 85 and a second pad 171b corresponding to the second electrode 85b are provided on the first mounting surface 84 side of the first decoration substrate 56. (or second pad) is provided. The first pad 171a and the second pad 171b are a pair. Two wiring patterns 172a and 172b are drawn out from the first pad 171a, and two wiring patterns 172c and 172d are drawn out from the second pad 171b. These pads 171a, 171b and wiring patterns 172a-172d are integrally formed by etching a single copper foil plate.

The bypass capacitor 85 is mounted on the first mounting surface 84 side of the first decorative substrate 56 by soldering the electrodes 85a and 85b to the corresponding pads 171a and 171b. A solder fillet 173a that electrically connects the first electrode 85a and the first pad 171a is formed on the first pad 171a, and a second electrode 85b and the second electrode 85b are formed on the second pad 171b. A solder fillet 173b is formed to electrically connect the second pad 171b. The solder fillets 173a and 173b are formed by heating the solder paste applied on the pads 171a and 171b to melt the solder and then cooling and solidifying the paste. In the longitudinal direction of the bypass capacitor 85, the first electrode 85a is fixed substantially in the center of the first pad 171a, and the second electrode 85b is fixed substantially in the center of the second pad 171b.

As shown in FIG. 8B, the first wiring pattern 172a drawn out from the first pad 171a connected to the first electrode 85a of the bypass capacitor 85 is connected through the via hole 174 provided in the first decorative substrate 56. The second wiring pattern 172b drawn out from the first pad 171a is electrically connected to the GND terminal 154 of the LED driver 126 while being electrically connected to the GND plane layer 93 (FIG. 9). A third wiring pattern 172c drawn out from a second pad 171b electrically connected to a second electrode 85b of the bypass capacitor 85 is connected to the power plane layer 94 through a via hole 175 provided in the first decorative substrate 56. ( FIG. 9 ), and the fourth wiring pattern 172 d drawn out from the second pad 171 b is electrically connected to the power supply terminal 151 of the LED driver 126 . Thus, the first pad 171a is arranged between the GND terminal 154 of the LED driver 126 and the GND plane layer 93, and the second pad 171b is arranged between the power terminal 151 of the LED driver 126 and the power plane layer 94. placed in between.

The bypass capacitor 85 is capable of accumulating electric charge, and reduces peaks of noise components contained in the driving power supply of the LED driver 126 by charging and reduces valleys of the noise components by discharging. Thus, the bypass capacitor 85 absorbs noise components contained in the drive power supply for the LED driver 126 .

By disposing the bypass capacitor 85 between the power terminal 151 of the LED driver 126 and the power plane layer 94, the noise component contained in the driving power supplied from the sound emission control device 81 to the LED driver 126 is reduced. The influence on the LED driver 126 can be reduced. As shown in FIG. 8B, the bypass capacitor 85 is placed close to the power terminal 151 so that there is no electronic component such as another IC between the bypass capacitor 85 and the power terminal 151 of the LED driver 126. are placed. As a result, it is possible to increase the possibility that the noise component contained in the drive power supplied to the power supply terminal 151 of the LED driver 126 is absorbed by the bypass capacitor 85, and the LED driver 126 can reduce the influence of the noise component. Possibility of receiving and malfunctioning can be reduced. Since there is no other IC between the bypass capacitor 85 and the power supply terminal 151, the noise component generated from the LED driver 126 is absorbed by the bypass capacitor 85, and the noise component misleads the other IC. You can prevent it from working. In addition, since there is no other electronic component between the bypass capacitor 85 and the power supply terminal 151, the noise component generated from the LED driver 126 is absorbed by the bypass capacitor 85, and the noise component is It is possible to prevent electronic components from malfunctioning.

As shown in FIG. 12(b), the small chip resistor 87, like the bypass capacitor 85 (FIG. 12(a)), has a substantially rectangular parallelepiped shape, and has a pair of metal first electrodes at both ends in the longitudinal direction. 87a and a second electrode 87b. Similar to the bypass capacitor 85, the small chip resistor 87 has a longitudinal direction along a plane orthogonal to the thickness direction of the small chip resistor 87 (hereinafter also referred to as "longitudinal direction of the small chip resistor 87"). It is a small chip part with dimensions of 0.1 mm or more and 0.9 mm or less. The small chip resistor 87 has a longitudinal dimension of approximately 0.6 mm along a plane orthogonal to the thickness direction, and a lateral dimension along a plane orthogonal to the thickness direction (hereinafter also referred to as "transverse direction"). ) and the dimension in the thickness direction are approximately 0.3 mm. Since the longitudinal dimension of the small chip resistor 87 is 0.7 mm or less, the area occupied by the small chip resistor 87 on the first decorative substrate 56 can be reduced. Since the longitudinal dimension of the small chip resistor 87 is 0.4 mm or more, the mechanical strength of the small chip resistor 87 and the mechanical strength of the small chip resistor 87 itself is increased. can be increased, the possibility of damage to the connection portion can be reduced, and the possibility of damage to the small chip resistor 87 itself can be reduced. Further, since the longitudinal dimension of the small chip resistor 87 is 0.4 mm or more, it is possible to improve the confirmation accuracy when visually confirming whether or not there is a mounting omission of the small chip resistor 87 . Note that the small chip resistor 87 may have a configuration in which the longitudinal dimension of the small chip resistor 87 is smaller than 0.6 mm (for example, a configuration of 0.4 mm), and the small chip resistor 87 may have a lateral dimension of 0.3 mm. (for example, 0.2 mm) or smaller than 0.3 mm (for example, 0.2 mm) in the thickness direction.

On the first mounting surface 84 side of the first decorative substrate 56, a first pad 176a (or a first pad) corresponding to the first electrode 87a of the small chip resistor 87 and a second pad corresponding to the second electrode 87b are provided. A pad 176b (or a second pad) is provided. The first pad 176a and the second pad 176b are a pair. One wiring pattern 181a is drawn from the first pad 176a, and one wiring pattern 181b is drawn from the second pad 176b. These pads 176a, 176b and wiring patterns 181a, 181b are integrally formed by etching a single copper foil plate.

The small chip resistor 87 is mounted on the first mounting surface 84 side of the first decorative substrate 56 by soldering the electrodes 87a and 87b to the corresponding pads 176a and 176b. A solder fillet 177a that electrically connects the first electrode 87a and the first pad 176a is formed on the first pad 176a, and a second electrode 87b and the second electrode 87b are formed on the second pad 176b. A solder fillet 177b is formed to electrically connect the second pad 176b. The solder fillets 177a and 177b are formed by heating the solder paste applied on the pads 176a and 176b to form molten solder, which is then cooled and solidified. In the longitudinal direction of the small chip resistor 87, the first electrode 87a is fixed substantially in the center of the first pad 176a, and the second electrode 87b is fixed substantially in the center of the second pad 176b.

As shown in FIG. 8C, the LED chip 142 is a surface-mounted chip component. The LED chip 142 has a substantially rectangular parallelepiped shape and has a pair of metal first and second electrodes 142a and 142b at both ends in the longitudinal direction. Also, on the first decoration substrate 56, copper first pads 178a (or first pads) corresponding to the first electrodes 142a and copper second pads 178b (or second pads) corresponding to the second electrodes 142b are provided. ) are provided. The first pad 178a and the second pad 178b are a pair.

A first wiring pattern 181 a drawn out from a first pad 176 a of the small chip resistor 87 is electrically connected to a second pad 178 b of the LED chip 142 . Also, the second wiring pattern 181b drawn out from the second pad 176b of the small chip resistor 87 is electrically connected to the eighth output terminal 162 of the LED driver 126. As shown in FIG.

As described above, electronic components such as connectors 111 to 115, LED drivers 126, LED chips 127 to 142, bypass capacitors 85 and 97, and small chip resistors 87, 101, 143 to 149 are mounted on the decorative substrates 56 and 57. It is Out of these electronic parts, the small chip parts (bypass capacitors 85, 97 and small chip resistors 87, 101, 143-149) are smaller in size than the other electronic parts. (or pads) is smaller than the contact area between electrodes and pads (or pads) in other electronic components. For this reason, among the various electronic components mounted on the decoration boards 56 and 57, the connection points between the small chip parts and the decoration boards 56 and 57 are compared with the connection points between the other electronic parts and the decoration boards 56 and 57. low mechanical strength. In this specification, at the connection points between the small chip parts and the decorative substrates 56 and 57, pads electrically connected to the electrodes of the small chip parts and electrodes of the small chip parts and the pads are electrically connected. It includes a solder fillet to be connected and a wiring pattern drawn out from the pad. Specifically, at the connection point between the bypass capacitor 85 and the first decoration board 56, pads 171a and 171b electrically connected to the electrodes 85a and 85b of the bypass capacitor 85, electrodes 85a and 85b of the bypass capacitor 85 are provided. It includes solder fillets 173a and 173b electrically connecting 85b and pads 171a and 171b, and wiring patterns 172a to 172d drawn out from the pads 171a and 171b. Also, at the connection points between the small chip resistor 87 and the first decorative substrate 56, pads 176a and 176b electrically connected to the electrodes 87a and 87b of the small chip resistor 87 and pads 176a and 176b of the small chip resistor 87 It includes solder fillets 177a and 177b electrically connecting electrodes 87a and 87b and pads 176a and 176b, and wiring patterns 181a and 181b drawn out from pads 176a and 176b.

By using small chip components (bypass capacitors 85, 97 and small chip resistors 87, 101, 143-149) smaller than the electronic components such as the LED driver 126 and the LED chips 127-142, the capacitors in the decorative substrates 56, 57 And while the area occupied by the resistor can be reduced, when the decoration substrates 56 and 57 are distorted, the connection points between the small chip components and the decoration substrates 56 and 57 are likely to be damaged. , and damage to the small chip component itself becomes more likely to occur. In this specification, the damage to the connecting portions between the small chip components and the decorative substrates 56 and 57 includes cracks in the solder fillets that electrically connect the electrodes of the small chip components and the pads (or pads). The damage includes a solder fillet peeling damage, a pad peeling damage from the decorative substrates 56 and 57, and a wiring pattern peeling off from the decorative substrates 56 and 57 around the pads. In this specification, damage to the small chip component itself includes damage that cracks the small chip component and damage that destroys the internal structure of the small chip component (for example, the laminated structure of the bypass capacitors 85 and 97). be

The second mounting surface 95 of the decorative boards 56 and 57 is screwed to the front door frame 14 as a case where the decorative boards 56 and 57 on which the small chip parts are mounted may be distorted. Electronic components such as the LED driver 126 and the LED chips 127 to 142 mounted on the first decorative substrate 56 when a harness (not shown) is attached to or detached from the connectors 111 to 115 mounted on the generates heat, and the heat exerts thermal stress on the decorative substrates 56 and 57 . Further, in the manufacturing method for separating the plurality of decorative substrates 56 and 57 after mounting electronic components including small chip components on the aggregate substrate including the plurality of decorative substrates 56 and 57, the aggregate substrate is divided. In this case, the decorative substrates 56 and 57 on which the small chip parts are mounted may be distorted. In these cases, bending stress may act on the decorative substrates 56 and 57, and torsional stress may act on the decorative substrates 56 and 57 as well.

FIG. 13(a) is a plan view of the first mounting surface 84 of the first decoration substrate 56 showing an enlarged peripheral region 182 (FIG. 8(b)) of the bypass capacitor 85, and FIG. FIG. 11 is an explanatory diagram for explaining the relationship between pads 171a and 171b in a region 182 and a solder resist 222; FIG. 13(c) is an explanatory diagram for explaining the movement of the decoupling capacitor 85 that can occur in this embodiment, and FIG. 13(d) shows the movement of the decoupling capacitor 85 that can occur in the comparative example. It is an explanatory view for explaining. In addition, in FIG. 13B, the solder resist 222 is hatched.

As shown in FIG. 13A, a first pad 171a and a second pad 171b corresponding to the first electrode 85a and the second electrode 85b of the bypass capacitor 85 are shaped substantially rectangular. As shown in FIG. 13(b), the first pad 171a and the second pad 171b have the same shape and size. The vertical dimension LA1 of the pads 171a and 171b is approximately 0.35 mm, which is larger than the lateral dimension of the bypass capacitor 85 (approximately 0.3 mm). Since the pair of pads 171a and 171b have the same shape and size, the amount of solder paste applied to the pair of pads 171a and 171b can be substantially the same. The vertical dimension LA1 of the pads 171a and 171b may be the same as the widthwise dimension of the bypass capacitor 85, and the vertical dimension LA1 of the pads 171a and 171b may be smaller than the widthwise dimension of the bypass capacitor 85. may be configured.

A lateral dimension LA2 of the pads 171a and 171b is approximately 0.32 mm. The first pad 171a and the second pad 171b are separated from each other by a predetermined distance LA3 (specifically, about 0.28 mm) in the longitudinal direction (first direction DR1) of the bypass capacitor 85 (FIG. 13(a)). It is The distance (predetermined distance LA3) between the outer edge of the first pad 171a on the second pad 171b side and the outer edge of the second pad 171b on the first pad 171a side is the lengthwise dimension of the bypass capacitor 85 (approximately 0.6 mm). ) is set within a range of approximately 1/3 (0.2 mm) to approximately 1/2 (approximately 0.3 mm). As a result, in the longitudinal direction of the bypass capacitor 85, the first electrode 85a of the bypass capacitor 85 is positioned substantially in the center of the first pad 171a and the second electrode 85b is positioned substantially in the center of the second pad 171b. The bypass capacitor 85 can be mounted on the first decorative substrate 56 .

No solder resist 222 is applied between the first pads 171a and the second pads 171b. If the solder resist 222 is applied to a narrow area between the first pad 171a and the second pad 171b, the pads 171a and 171b may be partially or entirely soldered if the solder resist 222 is displaced. The probability of occurrence of defective products covered with the resist 222 increases. On the other hand, since the solder resist 222 is not applied between the first pads 171a and the second pads 171b, part or all of these pads 171a and 171b are covered with the solder resist 222. It is possible to prevent this and allow the solder paste to adhere to the entire area of these pads 171a and 171b. As a result, it is possible to secure the connection area between the first pad 171a and the first electrode 85a and secure the mechanical strength of the connection portion between the first pad 171a and the first electrode 85a. It is possible to ensure the mechanical strength of the connecting portion between the second pad 171b and the second electrode 85b by ensuring the connection area with the second electrode 85b.

As shown in FIG. 13A, the pair of pads 171a and 171b are spaced apart in the first direction DR1, which is the longitudinal direction of the bypass capacitor 85, so that the first decorative substrate 56 is placed in a reflow furnace in the reflow process. , the heating of the solder paste applied on the pair of pads 171a and 171b is substantially reduced by transporting the first decorative substrate 56 in the second direction DR2 perpendicular to the first direction DR1. can be started at the same time.

The solder paste applied to the pads 171a and 171b is heated in a reflow furnace to become liquid molten solder. The molten solder floats the electrodes 85a and 85b of the bypass capacitor 85 and attracts them. The solder paste contains a flux component, and molten solder flows on the pads 171a and 171b. Also, gas is released from the molten solder. When the solder paste melts on one pad 171a of the pair of pads 171a and 171b before the solder paste melts on the other pad 171b, only one electrode 85a of the pair of electrodes 85a and 85b of the bypass capacitor 85 comes into contact with the melted solder. The surface tension of the molten solder destroys the balance of the forces acting on the electrodes 85 a and 85 b of the bypass capacitor 85 . Then, the bypass capacitor 85 is likely to rotate around the normal direction of the first decorative substrate 56, and the bypass capacitor 85 is placed on one pad 171a with one electrode 85a. A so-called chip rise, which rises substantially vertically, tends to occur. In this way, if there is a difference in the timing at which the solder paste melts between the pair of pads 171a and 171b, rotation of the bypass capacitor 85 and standing of the chip tend to occur. On the other hand, in the reflow process, the first decorative substrate 56 is conveyed in the second direction DR2, and the heating of the solder paste applied on the pair of pads 171a and 171b is started substantially at the same time. The timing at which the solder paste melts between 171a and 171b can be aligned, and the rotation of the bypass capacitor 85 and the occurrence of standing chips can be prevented.

As shown in FIG. 8B, the decoupling capacitor 85 is mounted on the first decoration board 56 in such a manner that the longitudinal direction of the decoupling capacitor 85 is parallel to the first direction DR1. As shown in FIG. 8(c), the small chip resistor 87 is mounted on the first decorative substrate 56 such that the longitudinal direction of the small chip resistor 87 is parallel to the first direction DR1. Although not shown, the small chip resistors 143 to 149 are also mounted on the first decorative substrate 56 in such a manner that the longitudinal direction of the small chip resistors 143 to 149 is parallel to the first direction DR1. Thus, the small chip components (the bypass capacitor 85 and the small chip resistors 87, 143 to 149) are mounted on the first decoration board 56 in such a manner that the longitudinal direction of the small chip components is parallel to the first direction DR1. It is

As shown in FIGS. 8(b) and 8(c), the separation direction of the pads 171a and 171b corresponding to the electrodes 85a and 85b of the bypass capacitor 85 and the pads 176a and 176a corresponding to the electrodes 87a and 87b of the small chip resistor 87 The separation direction of 176b is the first direction DR1. The spacing directions of the pads 171a, 171b, 176a, 176b are common in a plurality of small chip components. For this reason, in the reflow process, the pair of decoupling capacitors 85 are separated by conveying the first decorative substrate 56 in a direction (second direction DR2) or substantially perpendicular to the common separation direction (first direction DR1). The timing of starting heating of the solder paste applied on the pair of pads 171a and 171b corresponding to the electrodes 85a and 85b can be aligned, and it corresponds to the pair of electrodes 87a and 87b of the small chip resistor 87. The timing at which the heating of the solder paste applied on the pair of pads 176a and 176b is started can be aligned. As a result, it is possible to prevent the rotation of a plurality of small chip components and the occurrence of standing chips.

In the pads 171a and 171b corresponding to the electrodes 85a and 85b of the bypass capacitor 85, heat is likely to escape to the wiring patterns 172a to 172d at the positions where the wiring patterns 172a to 172d are drawn (leading positions of the wiring patterns 172a to 172d). Therefore, the temperature rise in the initial stage of heating in the reflow process tends to be delayed compared to the portions where the wiring patterns 172a to 172d are not drawn out. Also, the first wiring pattern 172a and the third wiring pattern 172c connected to the GND plane layer 93 or the power plane layer 94, which have a larger area than the pads 171a and 171b, are connected to the GND plane layer 93 or the power plane layer. Compared with the second wiring pattern 172b and the fourth wiring pattern 172d which are not connected to 94, the temperature rise in the initial stage of heating is delayed. For this reason, the portion where the first wiring pattern 172a connected to the GND plane layer 93 is led out in the first pad 171a is more likely in the initial stage of heating than the portion where the second wiring pattern 172b is led out. Temperature rise tends to be delayed. Further, the portion of the second pad 171b where the third wiring pattern 172c connected to the power plane layer 94 is drawn out has a higher temperature in the initial stage of heating than the portion where the fourth wiring pattern 172d is drawn out. Delayed rise. In the reflow process, the temperature distribution in the pads 171a and 171b at the initial stage of heating changes under the influence of the number of wiring patterns 172a to 172d drawn out from the pair of pads 171a and 171b, their drawing positions, and connection destinations. Also, the drawing direction of the wiring patterns 172a to 172d drawn from the pair of pads 171a and 171b may affect the temperature distribution in the pads 171a and 171b at the initial stage of heating. Although the details will be described later, in the first decoration substrate 56 of the present embodiment, the pair of pads 171a and 171b are heated so as not to cause a difference in temperature distribution in the pads 171a and 171b in the initial stage of heating. The number of wiring patterns 172a to 172d led out from 171b, lead positions, connection destinations, and lead directions are set.

As shown in FIG. 13D, in the bypass capacitor 183 in the comparative example, the first wiring pattern 185a is drawn rightward from the right end of the first pad 184a (or the first pad). A second wiring pattern 185b is drawn out leftward from the left end of the 1 pad 184a. The first wiring pattern 185a in the comparative example is a wiring pattern electrically connected to the GND plane layer 93 (FIG. 9) through the via hole 174, like the first wiring pattern 172a of the present embodiment already described. In addition, the second wiring pattern 185b in the comparative example is a wiring pattern electrically connected to the GND terminal 154 of the LED driver 126, like the second wiring pattern 172b in this embodiment already described. A third wiring pattern 185c extends downward from the lower end of the second pad 184b (or the second pad), and a fourth wiring pattern 185d extends leftward from the left end of the second pad 184b. pulled out. The third wiring pattern 185c in the comparative example is a wiring pattern electrically connected to the power plane layer 94 (FIG. 9) through the via hole 175, similar to the already described third wiring pattern 172c of the present embodiment. In addition, the fourth wiring pattern 172d in the comparative example is a wiring pattern electrically connected to the power terminal 151 of the LED driver 126, like the fourth wiring pattern 172d of the present embodiment already described. In the first pad 184a, the portion where the first wiring pattern 185a and the second wiring pattern 185b are drawn out (right end and left end of the first pad 184a) tends to be delayed in temperature rise in the initial stage of heating. In particular, the temperature rise of the portion where the first wiring pattern 185a connected to the GND plane layer 93 is drawn out (the left end portion of the first pad 184a) tends to be delayed. Also, in the second pad 184b, the portion where the third wiring pattern 185c and the fourth wiring pattern 185d are drawn out (lower end and left end of the second pad 184b) tends to be delayed in temperature rise in the initial stage of heating. In particular, the temperature rise of the portion where the third wiring pattern 185c connected to the power plane layer 94 is drawn out (lower end portion of the second pad 184b) tends to be delayed. Therefore, the temperature of the upper right portion of the second pad 184b is likely to rise in the initial heating stage of the reflow process. When the solder paste is melted only in the upper right portion of the second pad 184b, as shown in FIG. The decoupling capacitor 183 rotates about the normal direction of , and the decoupling capacitor 183 may be mounted on the first decoration board 56 in a tilted state. In this case, the connection area of the solder fillet 186 between the first pad 184a and the first electrode 183a becomes small, which may cause connection failure. Further, there is a possibility that the rotation of the bypass capacitor 183 causes the bypass capacitor 183 to be mounted in a state where the first pad 184a and the first electrode 183a are not in electrical contact. Furthermore, the chip stand-up in which the bypass capacitor 183 rises with one electrode 183a on the first pad 184a easily occurs. Thus, in the comparative example in which the wiring patterns 185a to 185d drawn out from the first pad 184a and the second pad 184b are drawn out at different positions, mounting defects of the bypass capacitor 183 are likely to occur.

On the other hand, in the first decorative substrate 56 of the present embodiment, as shown in FIG. 13A, the first wiring pattern 172a is drawn rightward from the first pad 171a, and the third wiring pattern 172c is drawn rightward from the second pad 171b. Further, the second wiring pattern 172b is drawn leftward from the first pad 171a, and the fourth wiring pattern 172d is drawn leftward from the second pad 171b. In a configuration in which the same number (specifically, two) of wiring patterns 172a to 172d are drawn from the first pad 171a and the second pad 171b, the first wiring pattern 172a is drawn from the center of the first pad 171a. The direction (rightward direction) in which the side of the first pad 171a with the third wiring pattern 172c extends is the direction in which the side of the second pad 171b from which the third wiring pattern 172c is drawn exists when viewed from the center of the second pad 171b. (right direction), and the direction (left direction) in which the side of the first pad 171a from which the second wiring pattern 172b is drawn exists when viewed from the center of the first pad 171a is the second direction. It is the same direction as the side of the second pad 171b from which the fourth wiring pattern 172d is drawn when viewed from the center of the pad 171b (leftward direction). As a result, it is possible to prevent a difference in temperature distribution between the pair of pads 171a and 171b in the initial stage of heating in the reflow process, and to prevent the bypass capacitor 85 from rotating and from standing up.

A plurality of capacitors (not shown) having a longitudinal dimension along a plane perpendicular to the thickness direction larger than that of the small chip components are mounted on the first decorative substrate 56. The direction in which the side of the first pad from which the first wiring pattern is drawn out when viewed from the center of the first pad (or first pad) electrically connected to one electrode is the second electrode of the capacitor. is different from the direction in which the side of the second pad from which the third wiring pattern is drawn out exists when viewed from the center of the second pad (second pad) electrically connected to the second pad. In the bypass capacitor 85, which is a small chip component, the direction in which the side of the first pad 171a from which the first wiring pattern 172a is drawn exists when viewed from the center of the first pad 171a and the direction in which the side of the first pad 171a from which the first wiring pattern 172a is drawn out and the direction in which the side of the first pad 171a exists when viewed from the center of the second pad 171b. The direction in which the side of the second pad 171b from which the third wiring pattern 172c is drawn out is set to be the same direction, and the second wiring pattern 172b is drawn out when viewed from the center of the first pad 171a. The direction in which the side of the first pad 171a exists is the same as the direction in which the side of the second pad 171b from which the fourth wiring pattern 172d is drawn when viewed from the center of the second pad 171b (left direction). , the rotation of the bypass capacitor 85 and the occurrence of standing chips are prevented.

As shown in FIG. 8B, in the first pad 171a, the lead position of the first wiring pattern 172a electrically connected to the GND plane layer 93 (FIG. 9) through the via hole 174 is the first pad. The drawing position of the third wiring pattern 172c, which is substantially in the vertical center of the right end of the wiring pattern 171a and is electrically connected to the power plane layer 94 (FIG. 9) through the via hole 175 in the second pad 171b, is located in the second pad 171b. 2 is approximately the center in the vertical direction at the right end of the pad 171b. The GND plane layer 93 has an area larger than that of the first pad 171a, and the power plane layer 94 has an area larger than that of the second pad 171b.

The first pad 171a is electrically connected to the GND plane layer 93 having a larger area than the first pad 171a through the first wiring pattern 172a, and the second pad 171b is electrically connected through the third wiring pattern 172c. In the configuration electrically connected to the power supply plane layer 94 having a larger area than the second pad 171b, the first wiring pattern 172a among the four sides of the first pad 171a is located at the center of the first pad 171a. The direction (rightward direction) in which the drawn side exists is the direction in which the side in which the third wiring pattern 172c is drawn out when viewed from the center of the second pad 171b among the four sides of the second pad 171b exists ( to the right). This reduces the possibility of a difference in temperature distribution between the pair of pads 171a and 171b in the initial heating stage of the reflow process.

As shown in FIG. 13A, the width dimension of the first wiring pattern 172a extending rightward from the right end of the first pad 171a is the third width dimension extending rightward from the right end of the second pad 171b. It is substantially the same as the width dimension of the wiring pattern 172c. Therefore, compared to a configuration in which these wiring patterns 172a and 172c have different width dimensions, the possibility of a difference in temperature distribution occurring in the pair of pads 171a and 171b in the initial stage of heating in the reflow process is reduced. The width dimension of the second wiring pattern 172b extending leftward from the left end of the first pad 171a is approximately the width dimension of the fourth wiring pattern 172d extending leftward from the left end of the second pad 171b. are identical. Therefore, compared to a configuration in which these wiring patterns 172b and 172d have different width dimensions, the possibility of a difference in temperature distribution occurring in the pair of pads 171a and 171b in the initial stage of heating in the reflow process is reduced.

As already explained, the first wiring pattern 172a electrically connected to the GND plane layer 93 is drawn out from the right end of the first pad 171a, so the right side of the first pad 171a is the left side of the first pad 171a. The temperature rise in the initial stage of heating tends to be delayed. In addition, since the third wiring pattern 172c connected to the power plane layer 94 is drawn out from the right end of the second pad 171b, the right side of the second pad 171b has a higher temperature in the initial stage of heating than the left side of the second pad 171b. Temperature rise tends to be delayed. The number of wiring patterns 172a and 172c drawn from the first pad 171a is the same as the number of wiring patterns 172b and 172d drawn from the second pad 171b. In addition, the direction in which the side from which the first wiring pattern 172a is drawn out of the four sides of the first pad 171a exists is the second of the four sides of the second pad 171b. It is the same direction as the side in which the third wiring pattern 172c is drawn out when viewed from the center of the pad 171b, and is the same direction as the side of the first pad 171a when viewed from the center of the first pad 171a. The direction in which the side from which the second wiring pattern 172b is led exists is the direction in which the side from which the fourth wiring pattern 172d is led out of the four sides of the second pad 171b exists when viewed from the center of the second pad 171b. in the same direction as As a result, the surface tension of the melted solder on the first pad 171a acts on the first electrode 85a of the bypass capacitor 85, and the surface tension of the melted solder on the second pad 171b acts on the second electrode 85b of the bypass capacitor 85. can be balanced with the forces acting. Therefore, even if only the left side of the solder paste in the pair of pads 171a and 171b melts first, the bypass capacitor 85 is moved in parallel as shown in FIG. Rotation of the capacitor 85 can be prevented. As a result, it is possible to suppress the reduction in the connection area due to the solder fillet 173a between the first pad 171a and the first electrode 85a, and the reduction in the connection area due to the solder fillet 173b between the second pad 171b and the second electrode 85b. can reduce the extent of

FIG. 14(a) is a plan view of the first mounting surface 84 of the first decorative substrate 56 showing an enlarged peripheral region 187 (FIG. 8(c)) of the small chip resistor 87, and FIG. FIG. 4 is an explanatory diagram for explaining the relationship between pads 176a and 176b in the peripheral region 187 and the solder resist 222; Also, FIG. 14(c) is an explanatory diagram for explaining the mode of movement of the small chip resistor 87 that can occur in this embodiment, and FIG. is an explanatory diagram for explaining the movement mode of the . In addition, in FIG. 14B, the solder resist 222 is hatched.

As shown in FIG. 14(a), a first pad 176a and a second pad 176b corresponding to the first electrode 87a and the second electrode 87b of the small chip resistor 87 are formed in a substantially rectangular shape. As shown in FIG. 14(b), the first pad 176a and the second pad 176b have the same shape and size. The vertical dimension LB1 of the pads 176a and 176b is approximately 0.35 mm, which is larger than the widthwise dimension of the small chip resistor 87 (approximately 0.3 mm). Since the pair of pads 176a and 176b have the same shape and size, the amount of solder paste applied to the pair of pads 176a and 176b can be substantially the same. The vertical dimension LB1 of the pads 176a and 176b may be the same as the widthwise dimension of the small chip resistor 87. It is good also as a structure smaller than a dimension.

The lateral dimension LB2 of the pads 176a, 176b is approximately 0.32 mm. The first pad 176a and the second pad 176b are separated by a predetermined distance LB3 (specifically, about 0.28 mm) in the longitudinal direction (first direction DR1) of the small chip resistor 87 (FIG. 14(a)). are provided. The distance (predetermined interval LB3) between the outer edge of the first pad 176a on the second pad 176b side and the outer edge of the second pad 176b on the first pad 176a side is the dimension in the longitudinal direction of the small chip resistor 87 (substantially 0 It is set in the range of approximately 1/3 (0.2 mm) to approximately 1/2 (approximately 0.3 mm) of .6 mm). As a result, in the longitudinal direction of the small chip resistor 87, the first electrode 87a of the small chip resistor 87 is positioned substantially in the center of the first pad 176a, and the second electrode 87b is positioned substantially in the center of the second pad 176b. The small chip resistor 87 can be mounted on the first decoration substrate 56 in such a manner.

No solder resist 222 is applied between the first pads 176a and the second pads 176b. If the solder resist 222 is applied to a narrow area between the first pad 176a and the second pad 176b, part or all of the pads 176a and 176b may not be soldered if the solder resist 222 is displaced. The probability of occurrence of defective products covered with the resist 222 increases. On the other hand, since the solder resist 222 is not applied between the first pad 176a and the second pad 176b, part or all of these pads 176a and 176b are covered with the solder resist 222. It is possible to prevent this and allow the solder paste to adhere to the entire area of these pads 176a, 176b. As a result, it is possible to secure the connection area between the first pad 176a and the first electrode 87a and secure the mechanical strength of the connection portion between the first pad 176a and the first electrode 87a. By securing a connection area with the second electrode 87b, the mechanical strength of the connection portion between the second pad 176b and the second electrode 87b can be secured.

As shown in FIG. 14(d), in the small chip resistor 191 in the comparative example, the first wiring pattern 193a is drawn rightward from the right end of the first pad 192a (or the first pad). A second wiring pattern 193b is drawn leftward from the left end of the second pad 192b (or second pad). The first wiring pattern 193a in the comparative example is a wiring pattern electrically connected to the second electrode 142b (FIG. 8(c)) of the LED chip 142, similar to the already described first wiring pattern 181a of the present embodiment. In addition, the second wiring pattern 193b in the comparative example is a wiring pattern electrically connected to the eighth output terminal 162 of the LED driver 126, like the second wiring pattern 181b in the present embodiment already described. . The right side of the first pad 192a from which the first wiring pattern 193a is drawn tends to be delayed in temperature rise in the initial stage of heating in the reflow process compared to the left side from which the wiring pattern is not drawn. Also, the left side of the second pad 192b from which the second wiring pattern 193b is drawn tends to be delayed in temperature rise in the initial stage of heating compared to the right side from which the wiring pattern is not drawn. Therefore, in the initial stage of heating, a state in which only the left portion of the solder paste on the first pad 192a and only the right portion of the solder paste on the second pad 192b are likely to melt occurs, as shown in FIG. 14(d). In addition, the small chip resistor 191 rotates with the normal direction of the first decoration substrate 56 as the axis of rotation, and there is a risk that the small chip resistor 191 may be mounted on the first decoration substrate 56 in a tilted state. . If the small chip resistor 191 is mounted in an inclined state, the connection area of the solder fillet 194 between the first pad 184a and the first electrode 183a becomes small, and the connection area between the second pad 184b and the second electrode 183b becomes small. The connection area by the solder fillet 195 becomes small. Also, due to the rotation of the small chip resistor 191, the small chip resistor 191 may be mounted in a state where the first pad 192a and the first electrode 191a are not in electrical contact. Furthermore, the small chip resistor 191 is likely to rise on the first pad 192a with one electrode 191a. As described above, in the comparative example in which the wiring patterns 193a and 193b are drawn out at different positions in the pair of pads 192a and 192b, mounting defects of the small chip resistor 191 are likely to occur.

On the other hand, in the first decorative substrate 56 of the present embodiment, as shown in FIG. 14A, the first wiring pattern 181a is drawn rightward from the right end of the first pad 176a. A second wiring pattern 181b is drawn rightward from the right end of the second pad 176b. The lead-out position of the first wiring pattern 181a is approximately the center in the vertical direction of the right end of the first pad 176a, and the lead-out position of the second wiring pattern 181b is approximately the center in the vertical direction of the right end of the second pad 176b. In a configuration in which the same number (specifically, one) of wiring patterns 181a and 181b are led out from the first pad 176a and the second pad 176b, the center of the first pad 176a among the four sides of the first pad 176a The direction (right direction) in which the side where the first wiring pattern 181a is led out when viewed from above is the direction in which the second wiring pattern 181b is led out of the four sides of the second pad 176b when viewed from the center of the second pad 176b. This direction is the same as the direction (to the right) in which the edge that is bounded exists. As a result, it is possible to prevent a difference in temperature distribution between the pair of pads 176a and 176b in the initial stage of heating in the reflow process, and to prevent the small chip resistor 87 from rotating and standing up.

A plurality of resistors (not shown) having a longitudinal dimension along a plane perpendicular to the thickness direction larger than that of the small chip parts are mounted on the first decorative substrate 56. Among the four sides of the first pad (or first pad) electrically connected to the first electrode of the device, the direction in which the side from which the first wiring pattern is drawn exists when viewed from the center of the first pad is , of the four sides of the second pad (or second pad) electrically connected to the second electrode of the resistor, there is a side from which the second wiring pattern is drawn when viewed from the center of the second pad. It is different from the direction to do. In the small chip resistor 87, which is a small chip component, the direction in which the side from which the first wiring pattern 181a is led out exists when viewed from the center of the first pad 176a among the four sides of the first pad 176a; By making the direction of the four sides of the pad 176b in the same direction as the side in which the second wiring pattern 181b is drawn out when viewed from the center of the second pad 176b, the small chip resistor 87 can be rotated. Also, the occurrence of standing chips is prevented.

Since the right end of the first pad 176a is the lead-out position of the first wiring pattern 181a, the temperature rise in the initial stage of heating tends to lag behind that of the left end of the first pad 176a. Further, since the right end of the second pad 176b is the lead-out position of the second wiring pattern 181b, the temperature rise in the initial stage of heating tends to lag behind the left end of the second pad 176b. The number of wiring patterns 181a drawn from the first pads 176a is the same as the number of wiring patterns 181b drawn from the second pads 176b. Of the four sides of the first pad 176a, the direction (right direction) in which the side from which the first wiring pattern 181a is drawn when viewed from the center of the first pad 176a exists The direction is the same as the direction in which the side from which the second wiring pattern 181b is drawn exists when viewed from the center of the second pad 176b. As a result, the surface tension of the melted solder on the first pads 176a acts on the first electrodes 87a of the small chip resistor 87, and the surface tension of the melted solder on the second pads 176b acts on the small chip resistor 87. can be balanced with the forces acting on the two electrodes 87b. Therefore, even if only the left portion of the solder paste of the pair of first pad 176a and second pad 176b melts first, the small chip resistor 87 moves as shown in FIG. 14(c). is a translational movement, and rotation of the small chip resistor 87 can be prevented. As a result, it is possible to suppress the reduction in the connection area due to the solder fillet 177a between the first pad 176a and the first electrode 87a, and the reduction in the connection area due to the solder fillet 177b between the second pad 176b and the second electrode 87b. can reduce the extent of

As already explained, the first pad 176a electrically connected to the first electrode 87a of the small chip resistor 87 is electrically connected to the second electrode 142b of the LED chip 142 via the first wiring pattern 181a. is electrically connected to the second pad 178b (see FIG. 8(c)). As already explained, the second pad 176b electrically connected to the second electrode 87b of the small chip resistor 87 is connected to the LED driver 126 (FIG. 8A) through the second wiring pattern 181b. It is electrically connected to a pad (or pad, not shown) that is electrically connected to the eighth output terminal 162 (FIG. 11). As shown in FIGS. 8A and 8C, the second pad 178b, which is the connection destination when viewed from the first pad 176a, exists in the upward direction, and the connection destination, when viewed from the second pad 176b. A pad (or pad, not shown) corresponding to the eighth output terminal 162 exists in the upper left direction. A portion of the pad (not shown) corresponding to the eighth output terminal 162, to which the second wiring pattern 181b is connected, extends in the direction in which the second wiring pattern 181b is pulled out from the second pad 176b (FIGS. 8A and 8C). 8(a) and 8(c) (the second direction DR2 in FIGS. 8A and 8C), the second wiring from the second pad 176b is based on the second pad 176b It exists in the direction opposite to the drawing direction of the pattern 181b. The second wiring pattern 181b is pulled out from the second pad 176b in the same direction (right direction) as the direction in which the first wiring pattern 181a is pulled out from the first pad 176a. ), the second pad 176b is routed in the opposite direction with respect to the second pad 176b.

A portion where the second wiring pattern 181b exists in a direction opposite to the direction in which the second wiring pattern 181b is pulled out from the second pad 176b with respect to the second pad 176b when viewed in the direction of one axis (second direction DR2) Also in the configuration in which the second wiring pattern 181b is connected to the connection destination by , the second wiring pattern 181b is drawn out from the second pad 176b in the same direction as the first wiring pattern 181a is drawn out from the first pad 176a. This can reduce the possibility of a difference in temperature distribution between the pair of first pad 176a and second pad 176b in the initial stage of heating in the reflow process.

As shown in FIG. 14A, the width dimension of the first wiring pattern 181a drawn out to the right from the right end of the first pad 176a is the second wiring pattern drawn out to the right from the right end of the second pad 176b. It is substantially the same as the width dimension of the wiring pattern 181 . Therefore, in comparison with the configuration in which the width dimensions of the wiring patterns 181a and 181b drawn out from the pads 176a and 176b are different, there is a difference in the temperature distribution within the pair of pads 176a and 176b in the initial heating stage of the reflow process. less likely to occur.

As already described with reference to FIGS. 8(a) to 8(c), in the first decoration substrate 56, the small chip components are arranged such that the longitudinal direction of the small chip components is the first direction DR1 (first decoration substrate 56 is mounted on the first decorative substrate 56 so as to be parallel to the longitudinal direction of the . Therefore, compared to the case where the small chip components are mounted on the first decoration substrate 56 in such a manner that the longitudinal direction of the small chip component is orthogonal to the first direction DR1 (longitudinal direction of the first decoration substrate 56), the first decoration substrate 56 The maximum value of stress that can act on the connecting portion between the small chip component and the first decorative substrate 56 is reduced, and the maximum value of stress that can act on the small chip component itself is also reduced. ing.

As described above, the first decorative substrate 56 is mounted with a plurality of capacitors (not shown) having a longitudinal dimension along a plane perpendicular to the thickness direction larger than that of the small chip components. Some of these capacitors are mounted on the first decoration board 56 in such a manner that the longitudinal direction of the capacitors is not parallel to the first direction DR1. The small chip component is protected by being mounted on the first decorative substrate 56 in such a manner that the longitudinal direction of the small chip component is perpendicular to the first direction DR1.

As shown in FIG. 10B, the bypass capacitor 97 is mounted on the second decoration board 57 so that the longitudinal direction of the bypass capacitor 97 is parallel to the longitudinal direction LD of the second decoration board 57 . Further, as shown in FIG. 10(c), the small chip resistor 101 is mounted on the second decoration substrate 57 in such a manner that the longitudinal direction of the small chip resistor 101 is parallel to the long axis direction LD of the second decoration substrate 57. is implemented in In this way, the small chip parts (the bypass capacitor 97 and the small chip resistor 101) are mounted on the second decoration board 57 in such a manner that the longitudinal direction of the small chip parts is parallel to the long axis direction LD of the second decoration board 57. Therefore, compared to the case where the small chip components are mounted on the second decoration substrate 57 in such a manner that the longitudinal direction of the small chip component is orthogonal to the long axis direction LD of the second decoration substrate 57, the second decoration substrate 57 has The maximum value of stress that can act on the connecting portion between the small chip component and the second decorative substrate 57 when distortion occurs is reduced, and the maximum value of stress that can act on the small chip component itself is also reduced. there is

As shown in FIG. 8(b), in the first decoration board 56, the first wiring pattern 172a drawn out from the first pad 171a and the third wiring pattern 172c drawn out from the second pad 171b serve as bypass capacitors. It extends in a direction orthogonal to the longitudinal direction of 85 (one of the short directions of bypass capacitor 85). Further, the second wiring pattern 172b drawn out from the first pad 171a and the fourth wiring pattern 172d drawn out from the second pad 171b are arranged in a direction orthogonal to the longitudinal direction of the bypass capacitor 85 (the short side of the bypass capacitor 85). direction). In this way, the wiring patterns 172a to 172d drawn out from the pads 171a and 171b of the bypass capacitor 85 extend in a direction perpendicular to the longitudinal direction of the bypass capacitor 85 (short side direction). The wiring patterns 172a to 172d drawn out from the pads 171a and 171b of the decoupling capacitor 85 may extend in a direction substantially perpendicular to the longitudinal direction of the decoupling capacitor 85. FIG.

As already explained, the pads 171a and 171b and the wiring patterns 172a to 172d are integrally formed, and the electrodes 85a and 85b of the bypass capacitor 85 are fixed to the pads 171a and 171b by solder fillets 173a and 173b. If the wiring patterns 172a to 172d drawn out from the pads 171a and 171b are configured to extend in a direction parallel to the longitudinal direction of the bypass capacitor 85, the folding lines extending in a direction orthogonal or substantially orthogonal to the longitudinal direction are used. When a force that bends the first decoration board 56 acts on the first decoration board 56 with the reference point of . 85 itself is likely to be damaged. Further, in this configuration, the stress acting on the periphery of the bypass capacitor 85 due to the distortion of the first decorative substrate 56 is likely to be transmitted to the bypass capacitor 85 itself, and the bypass capacitor 85 is likely to be damaged. On the other hand, the wiring patterns 172a to 172d drawn out from the pads 171a and 171b extend in a direction orthogonal or substantially orthogonal to the longitudinal direction of the decoupling capacitor 85. The maximum value of the stress that can act on the connecting portion between the bypass capacitor 85 and the first decoration board 56 when the first decoration board 56 is distorted is reduced. The maximum value of stress that can act on itself is reduced. As a result, it is possible to prevent damage to the connecting portion between the bypass capacitor 85 and the first decoration board 56, and to prevent damage to the bypass capacitor 85 itself.

As described above, the first decorative substrate 56 is equipped with a plurality of capacitors (not shown) having a longitudinal dimension along a plane perpendicular to the thickness direction larger than that of the small chip components. , the drawing direction of the wiring pattern drawn from the pad (or pad) electrically connected to the electrode of the capacitor is drawn in a direction perpendicular to or substantially perpendicular to the longitudinal direction of the capacitor. . The bypass capacitor 85, which is a small chip component, is protected by a configuration in which the wiring patterns 172a to 172d drawn out from the pads 171a and 171b extend in a direction orthogonal or substantially orthogonal to the longitudinal direction of the bypass capacitor 85. It is

As already explained, the wiring patterns 181a and 181b drawn from the pads 176a and 176b of the small chip resistor 87 are arranged in the second direction DR2 perpendicular to the longitudinal direction of the small chip resistor 87. lateral direction). As already explained, the small chip resistor 87 is electrically connected to the wiring patterns 181a, 181b by solder fillets 177a, 177b that electrically contact the electrodes 87a, 87b and the pads 176a, 176b. If the wiring patterns 181a and 181b drawn out from the pads 176a and 176b extend in a direction parallel to the longitudinal direction of the small chip resistor 87, distortion of the first decoration substrate 56 causes the peripheral of the bypass capacitor 85 to become distorted. The acting stress is likely to be transmitted to the bypass capacitor 85 itself, and the bypass capacitor 85 is likely to be damaged. On the other hand, the wiring patterns 181a and 181b drawn out from the pads 176a and 176b of the small chip resistor 87 are arranged in a direction perpendicular to the longitudinal direction of the small chip resistor 87 (short side direction of the small chip resistor 87). Alternatively, the maximum value of stress that can act on the small chip resistor 87 can be reduced by adopting a configuration extending in substantially orthogonal directions. As a result, when the first decoration substrate 56 is distorted, the connecting portion between the small chip resistor 87 and the first decoration substrate 56 can be prevented from being damaged.

As described above, the first decorative substrate 56 is mounted with a plurality of resistors (not shown) having a longitudinal dimension along a plane perpendicular to the thickness direction larger than that of the small chip component. part, the drawing direction of the wiring pattern drawn from the pad (or pad) electrically connected to the electrode of the resistor is different from the direction perpendicular to or substantially perpendicular to the longitudinal direction of the resistor. pulled out. The small chip resistor 87, which is a small chip component, has a configuration in which wiring patterns 181a and 181b drawn from pads 176a and 176b extend in a direction perpendicular to or substantially perpendicular to the longitudinal direction of the small chip resistor 87. protected by

As shown in FIGS. 8(a) to 8(c), on the first decorative substrate 56, small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are mounted on the first mounting surface. It is mounted only on the surface 84 side and is not mounted on the second mounting surface 95 side. The LED chips 127 to 142 (FIG. 11) and the LED driver 126 are also mounted on the first mounting surface 84 in the configuration in which the small chip components are concentrated on the first mounting surface 84 side of the first decorative substrate 56 .

15(a) is a plan view showing the second mounting surface 95 of the first decoration substrate 56, and FIG. 15(b) is an enlarged view of the rear side area 205 of the first light emitting circuit portion 121 of the first decoration substrate 56. FIG. 2 is a plan view of the second mounting surface 95 of FIG. As shown in FIG. 15(b), no small chip component is mounted on the LED back side corresponding area 201 of the second mounting surface 95. As shown in FIG. The area 201 corresponding to the LED back side is the area of the second mounting surface 95 located on the back side of the area where the LED chips 127 to 142 (FIG. 9) are mounted on the first mounting surface 84 (FIG. 8A) and 2 The distance from the outer edge of the area of the mounting surface 95 is within 1 mm. Small chip components are not mounted on the second mounting surface 95 located behind the area on the first mounting surface 84 where the LED chips 127 to 142 are mounted. The effect of thermal stress that may act on the first decorative substrate 56 due to heat generation on small chip components is reduced. The LED back side corresponding area 201 is an area that is repeatedly heated by heat generated when the LED chips 127 to 142 are driven, and is an area that is likely to be distorted by the heat of the first decorative substrate 56 . If a small chip component is mounted on the LED back side corresponding area 201, the repeated execution of the light emission effect on the first decoration substrate 56 causes thermal stress to the connection point between the small chip component and the first decoration substrate 56. In addition, there is a risk that a thermal stress load will be accumulated in the small chip component itself. On the other hand, since the small chip components are mounted so as to avoid the LED back side corresponding area 201, the light emission effect on the first decoration substrate 56 is repeatedly executed, resulting in the small chip components and the first decoration. It is possible to prevent damage to the connecting portion with the substrate 56 and prevent damage to the small chip component itself.

As shown in FIG. 15(b), no small chip component is mounted on the driver back side corresponding area 202 of the second mounting surface 95. As shown in FIG. The driver back side corresponding area 202 is the area where the LED driver 126 (FIG. 8(a)) is mounted on the first mounting surface 84 (FIG. 8(a)) and pads (or pads) corresponding to the terminals of the LED driver 126. The area of the second mounting surface 95 located on the back side of the area provided with , and the area within 1 mm from the outer edge of the area of the second mounting surface 95 . Due to the configuration in which no small chip components are mounted on the area of the second mounting surface 95 located on the back side of the area where the LED driver 126 is mounted on the first mounting surface 84, the heat generated by the LED driver 126 causes the first The effect of thermal stress that may act on the decorative substrate 56 on small chip components is reduced. The driver back side corresponding area 202 is an area that is repeatedly heated by heat generated when the LED driver 126 is driven, and is an area that is likely to be distorted by the heat of the first decoration substrate 56 . If a small chip component is mounted on the driver rear side corresponding area 202, the repeated execution of the light emission effect on the first decoration board 56 causes thermal stress to the connecting portion between the small chip component and the first decoration board 56. In addition, there is a risk that a thermal stress load will be accumulated in the small chip component itself. On the other hand, since the small chip component is mounted so as to avoid the driver back side corresponding area 202, the light emission effect on the first decoration substrate 56 is repeatedly executed, resulting in the small chip component and the first decoration. It is possible to prevent damage to the connecting portion with the substrate 56 and prevent damage to the small chip component itself.

As shown in FIGS. 8(a) to 8(c), on the first decoration board 56, the small chip parts (the bypass capacitor 85 and the small chip resistor 87) are placed at a distance of 1 mm or more from the outer edge of the LED chip 142. placed. By arranging the small chip component 1 mm or more away from the outer edge of the LED chip 142, it is possible to prevent damage to the connecting portion between the small chip component and the first decorative substrate 56 due to thermal stress. It is possible to prevent the small chip component itself from being damaged by thermal stress.

As shown in FIGS. 8(a) to 8(c), on the first decoration board 56, the small chip components (the bypass capacitor 85 and the small chip resistor 87) are connected to the outer edge of the LED driver 126 and the terminals of the LED driver 126. are placed at a distance of 1 mm or more from the pads corresponding to the By arranging the small chip parts 1 mm or more away from the outer edge of the LED driver 126 and the pads corresponding to the terminals of the LED driver 126, the connection points between the small chip parts and the first decorative substrate 56 are not damaged by thermal stress. In addition, it is possible to prevent the small chip component itself from being damaged by thermal stress.

As shown in FIGS. 8(a) to 8(c), in the first decoration board 56, the small chip parts (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are arranged around the through holes. They are arranged to avoid areas 211a to 211d. The through-hole peripheral regions 211a-211d are regions whose distance from the outer edge of the fixed through-holes 56d-56g is less than 5 mm. When the first decoration substrate 56 is screwed to the front door frame 14, a force that causes the first decoration substrate 56 to be distorted may act on the through-hole peripheral regions 211a to 211d. By arranging the small chip parts away from the outer edge of the fixing through holes 56d to 56g by 5 mm or more, when the first decorative board 56 is screwed to the front door frame 14, the second part that may occur near the fixing through holes 56d to 56g. It is possible to prevent the connection point between the small chip part and the first decoration board 56 from being damaged due to the distortion of the first decoration board 56, and also prevent the small chip part itself from being damaged.

As shown in FIG. 8(a), the fixing through holes 56d to 56g are provided at the corners of the first decorative substrate 56. As shown in FIG. Therefore, compared to the structure in which the fixing through-holes 56d to 56g are provided near the center of the first decoration board 56, the area of the first decoration board 56 where small chip components cannot be mounted is reduced.

As already explained, the fixing through hole 56e is provided in the protrusion 56c of the stepped recess 56a. As a result, it is possible to stably fix the first decoration board 56 to the front door frame 14 while securing an area in which small chip components can be mounted.

In the configuration in which the small chip components are concentrated on the first mounting surface 84, the connectors 111 and 112 are concentrated on the second mounting surface 95 as shown in FIG. 15(a). As shown in FIG. 8(a), on the first mounting surface 84, the small chip components are arranged avoiding the areas 203 and 204 corresponding to the back side of the connector. The connector back side corresponding areas 203 and 204 are the area of the first mounting surface 84 located on the back side of the area where the connectors 111 and 112 are mounted on the second mounting surface 95 (FIG. 15(a)) and the first mounting surface. The distance from the outer edge of the area 84 is less than 5 mm. Since no small chip components are mounted on the area of the first mounting surface 84 located on the back side of the area where the connectors 111 and 112 are mounted on the second mounting surface 95, the harness to the connectors 111 and 112 can be easily connected. The influence of the stress that may be applied to the first decoration substrate 56 to the small chip components during attachment and detachment is reduced. The connector back side corresponding regions 203 and 204 are regions where tensile stress is likely to act when a harness (not shown) is attached to the connectors 111 and 112, and where compressive stress acts when the harness is pulled out from the connectors 111 and 112. This is an easy area. If the small chip parts are mounted on the connector back side corresponding areas 203 and 204, there is a risk that stress will act on the connection points between the small chip parts and the first decoration board 56 when the harnesses are attached to and detached from the connectors 111 and 112. In addition, there is a risk that stress will act on the small chip component itself. On the other hand, since the small chip parts are arranged so as to avoid the areas 203 and 204 corresponding to the back side of the connector, the connection points between the small chip parts and the first decoration board 56 are not easily connected when the harnesses are attached to and detached from the connectors 111 and 112. Damage is prevented, and the small chip component itself is prevented from being damaged.

As shown in FIG. 8(a), the LED driver 126 is arranged in a region including a region less than 10 mm from the outer edge of the first decoration substrate 56, while small chip components (a bypass capacitor 85 and a small chip resistor 87 , 143 to 149 (FIG. 11)) are arranged at a distance of 10 mm or more from the outer edge of the first decoration substrate 56 . As already explained, the connection points between the small chip components among the various electronic components mounted on the first decoration board 56 and the first decoration board 56 are the same as the connection points between the other electronic components and the first decoration board 56 . Comparatively low mechanical strength. Since the small chip parts are arranged at a distance of 10 mm or more from the outer edge of the first decoration board 56, the small chip parts and the first decoration board 56 may be separated from each other by touching the small chip parts with the hand of the operator when handling the first decoration board 56. 1, the possibility of damage to the connecting portion with the decoration board 56 is reduced, and the possibility of damage to the small chip component itself is also reduced.

Small chip parts (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are arranged avoiding the through-hole peripheral regions 211a to 211d and the region where the distance from the outer edge of the first decorative substrate 56 is less than 10 mm. In this configuration, the fixing through-holes 56d to 56g are provided in regions where the distance from the outer edge of the first decorative substrate 56 is less than 10 mm. For this reason, compared to the configuration in which the fixing through holes 56d to 56g are provided at positions separated from the outer edge of the first decoration substrate 56 by 10 mm or more, the area of the region in which the small chip components can be mounted on the first decoration substrate 56 is reduced. are widely ensured.

As shown in FIG. 8(b), on the first decoration board 56, around the LED driver 126, there is an outline silk 213 that enables the mounting position of the LED driver 126 to be grasped, and the electronic components mounted on the LED driver 126. An identification silk 214 (indicated as "IC1") is provided so that it can be grasped that it is. Further, as shown in FIG. 8(c), around the LED chip 142, an outline silk 215 is provided around the LED chip 142 so that the mounting position of the LED chip 142 can be grasped, and an electronic component mounted is the LED chip 142. Identification silk 216 (displayed as "LED 16") is provided so that it can be grasped. As shown in FIG. 9, the first wiring layer 91 is covered with a solder resist 222. As shown in FIG. The outline silk 213 and the identification silk 214 are printed in a convex form from the first mounting surface 84 . The outline silks 213 and 215 and the identification silks 214 and 216 are printed before the electronic components are mounted on the first decoration board 56 .

After mounting electronic components including small chip components on the first decorative substrate 56, when visually confirming that there is no mounting omission of the electronic components, the operator must place a By comparing the positions where the electronic components (the LED driver 126 and the LED chip 142) are mounted, it is possible to grasp whether the electronic components are mounted at the correct positions. Also, the operator can grasp the type of the mounted electronic component (LED driver 126 and LED chip 142) based on the display contents of the identification silk screens 214 and 216. FIG.

As shown in FIG. 8(b), only an identification silk 217 (indicated by "C1") is provided around the bypass capacitor 85 so that it is possible to confirm that the mounted electronic component is the bypass capacitor 85. However, there is no outer silk screen that enables the user to grasp the mounting position of the decoupling capacitor 85 . As already explained, the external dimensions (vertical dimension, horizontal dimension and height dimension) of the bypass capacitor 85 are compared with the external dimensions of the electronic components (the LED driver 126 and the LED chips 127 to 142, etc.) other than the small chip components. small. For this reason, when the outline silk of the bypass capacitor 85 is printed on the first decoration board 56, the decoupling capacitor 85 can be identified by looking only at the outline silk even though the bypass capacitor 85 actually leaks after the electronic component is mounted. There is a risk that the operator will mistakenly recognize that 85 is mounted. On the other hand, by adopting a configuration in which the outline silk is not provided around the decoupling capacitor 85, it is possible to easily grasp the mounting omission of the decoupling capacitor 85 after the electronic component is mounted. Further, since the identification silk 217 is provided around the decoupling capacitor 85 , it is possible to recognize that the component mounted around the identification silk 217 is the decoupling capacitor 85 .

As already explained, the outer dimensions of the small chip resistor 87, like the outer dimensions of the bypass capacitor 85, are smaller than the outer dimensions of electronic components other than the small chip components. As shown in FIG. 8(c), an identification silk 218 (indicated as "R8") is placed around the small chip resistor 87 to make it possible to confirm that the mounted electronic component is the small chip resistor 87. ) are provided, and the outline silk screen for confirming the mounting position of the small chip resistor 87 is not provided. As a result, it is possible to easily grasp the mounting omission of the small chip resistor 87 . Further, since the identification silk 218 is provided around the small chip resistor 87, it is possible to grasp that the electronic component mounted around the identification silk 218 is the small chip resistor 87. be able to. When electronic components are mounted on the first decorative substrate 56 using an automatic mounting device, the automatic mounting device mounts the electronic components by coordinate control from a reference position on the first decorative substrate 56. Even if the outline silk is not provided around the , the mounting position of the small chip component does not shift.

The character size of the identification silks 217 and 218 provided around the small chip parts (bypass capacitor 85 and small chip resistor 87) is larger than that of the electronic parts (LED driver 126 and LED chip 142). It has the same dimensions as the character dimensions of the identification silks 214 and 216 provided around it. This facilitates visual confirmation of the identification silks 217 and 218 provided around the small chip component.

FIG. 16(a) is a cross-sectional view of the first decoration substrate 56 in this embodiment, and FIG. 16(b) is a cross-sectional view of the first decoration substrate 224 in the comparative example. As already explained, the pair of pads 171a and 171b corresponding to the pair of electrodes 85a and 85b of the bypass capacitor 85 are formed in the longitudinal direction of the bypass capacitor 85 at intervals of approximately 0.28 mm. Moreover, as already explained, the solder resist 222 is not applied between the first pads 171a and the second pads 171b (see FIG. 16A). In the process of applying the solder paste to the first decoration substrate 56, the first mounting surface 84 and the second mounting surface 95 (FIG. 9) of the first decoration substrate 56 are masked with a metal mask 226 having openings. The metal mask 226 is, for example, a thin metal plate with a thickness of approximately 150 μm. The metal mask 226 is provided with openings penetrating through the metal mask 226 in the thickness direction at positions corresponding to the pads (or pads) of the first decoration substrate 56 . Solder paste is applied onto the pads through the openings in the metal mask 226 . Since the metal mask 226 has a uniform thickness, it is possible to uniformly apply the solder paste to each pad.

As shown in FIG. 16(b), since the external silks 225a and 225b are convex with respect to the surface of the solder resist 222, small chip parts (bypass capacitor 85 and small chip resistor 87 (FIG. 8(b) and FIG. 8(b)) 8(c))), external silks 225a and 225b are provided around the first mounting surface 84, the external silks 225a and 225b are present between the first mounting surface 84 and the metal mask 226, and the first mounting The distance between the surface 84 and the metal mask 226 increases. In this configuration, the solder paste 227 may enter the gap between the first pad 171a and the second pad 171b and electrically connect the first pad 171a and the second pad 171b. In particular, when the solder paste 221 is continuously applied to a large number of the first decorative substrates 56, the solder paste 221 accumulated at the edge of the opening of the metal mask 226 tends to flow to the back side of the opening. The first pad 171a and the second pad 171b are likely to be electrically connected. On the other hand, in this embodiment, as shown in FIG. 16(a), no outline silk is provided around the small chip component. As a result, it is possible to prevent the first mounting surface 84 and the metal mask 226 from being too far apart, and to prevent the solder paste 221 from entering between the pads 171a and 171b. can be done. In addition, it is possible to prevent a part of the small chip component from being placed on the outline silk and causing a soldering defect.

Next, a method for manufacturing the decorative substrates 56 and 57 will be described.

As a method for efficiently manufacturing the first decoration substrate 56, after mounting electronic components on an aggregate substrate (printed wiring board before electronic components are mounted) including a plurality of first decoration substrates 56, the aggregate substrate is divided. Then, a plurality of first decorative substrates 56 with electronic components mounted thereon can be taken out at once. In addition, as a method for efficiently manufacturing the second decoration substrate 57, after mounting electronic components on an aggregate substrate (printed wiring board before electronic components are mounted) including a plurality of second decoration substrates 57, the aggregate substrate is manufactured. can be considered to take out a plurality of second decoration substrates 57 with electronic components mounted thereon. By manufacturing the decorative substrates 56 and 57 by these methods, the number of executions of the step of mounting the electronic components can be reduced compared to the case where the decorative substrates 56 and 57 with the electronic components mounted thereon are manufactured one by one. In addition, the manufacturing efficiency of the decorative substrates 56 and 57 can be improved. A method for manufacturing the decorative substrates 56 and 57 will be described below by taking a method for efficiently manufacturing the first decorative substrate 56 as an example.

FIG. 17(a) is a plan view showing a first plate surface 268, which is a plate surface on one side of the collective substrate 231, and FIG. FIG. 17(c) is an explanatory view for explaining the trough division for dividing the aggregate substrate 231, and FIG. 17C is for explaining the ridge division for dividing the aggregate substrate 231 so that the first plate surface 268 has a mountain shape (convex shape). It is an explanatory diagram. In practice, a plurality of electronic components are mounted on each of the first decorative substrates 56 included in the collective substrate 231, and wiring patterns and the like are also formed. In c), the illustration is simplified in order to avoid complication of the drawing.

The collective substrate 231 is a four-layer substrate having a structure in which conductive layers and insulating layers are alternately laminated, like the decorative substrates 56 and 57 already described. As shown in FIG. 17(a), an assembly substrate 231 is formed by processing a portion of a single printed wiring board formed into a substantially square shape while rotating a drill-like cutting tool (router) having a blade on its side surface. The printed wiring board is cut out by router processing or the like, and divided grooves 232 to 247 and slits 251 to 258 are formed in the printed wiring board.

The collective substrate 231 is partitioned into four first decoration substrates 56 and seven waste substrates 261-267 by dividing grooves 232-247 and slits 251-258. The process of forming the dividing grooves 232 to 247 and the slits 251 to 258 in the collective board 231 is performed before electronic components are mounted on the collective board 231 . Division of the collective substrate 231 is performed using division grooves 232 to 247 and slits 251 to 258 .

The dividing grooves 232 to 247 are formed linearly by cutting the assembly substrate 231 using, for example, a disk-shaped blade that rotates at high speed. The division grooves 232 to 247 have a V-shaped cross section that reduces the thickness of the collective substrate 231, and the bottoms of the division grooves 232 to 247 are the thinnest portions. The area where the division grooves 232 to 247 are formed in the collective substrate 231 has lower mechanical strength than the area where the division grooves 232 to 247 are not formed. Therefore, by dividing the collective substrate 231 using the dividing grooves 232 to 247 as base points, the stress acting on the first decoration substrate 56 when dividing the collective substrate 231 can be reduced. As a result, it is possible to reduce the stress that may act on the connection points between the small chip parts (the bypass capacitor 85 and the small chip resistors 87, 143 to 149) and the first decoration board 56 when the collective board 231 is divided. At the same time, the stress that may act on the small chip component itself can be reduced. In addition, it is possible to prevent the base point of division from deviating from the division grooves 232-247. Note that the cross-sectional shape of the division grooves 232 to 247 is not limited to the V shape. The cross-sectional shape of the dividing grooves 232 to 247 may be rectangular or U-shaped as long as the shape allows the assembly substrate 231 to be easily separated by an external force.

Since the dividing grooves 232 to 247 are formed in a straight line, it acts on the first decorative substrate 56 when the aggregate substrate 231 is divided, compared with the configuration in which the dividing grooves 232 to 247 are formed in a curved shape. possible stress is reduced.

In this embodiment, the dividing grooves 232 to 247 make it easy to distinguish between the first plate surface 268 and the second plate surface 269 (FIG. 17(b)) which is the plate surface on the opposite side of the first plate surface 268. It is formed only on the first plate surface 268 side of the collective board 231 in order to improve the workability of the board dividing process. The slits 251-258 are formed, for example, by the router processing described above. The slits 251-258 are long and narrow holes, and are wider than the dividing grooves 232-247.

As shown in FIG. 17( a ), a center waste substrate 261 having a vertically elongated substantially rectangular shape is provided at the center of the collective substrate 231 in the left-right direction. A pair of first decorative substrates 56 are provided on the left side of the central discarded substrate 261 with the dividing grooves 232 and 233 interposed therebetween, and a pair of first decorative substrates 56 are provided on the right side of the central discarded substrate 261 with the dividing grooves 234 and 235 interposed therebetween. A decorative substrate 56 is provided. The four first decoration substrates 56 are flush with each other, and the first mounting surfaces 84 of these first decoration substrates 56 are present on the first board surface 268 side of the collective substrate 231 .

As already explained, the first decorative substrate 56 is formed with a stepped concave portion 56a and a notch portion 56b. In the lower left first decoration board 56, the stepped recess 56a is provided on the side of the central discarded board 261, and the notch 56b is provided on the side of the left discarded board 263, which will be described later. In the first decorative board 56 on the upper left, the stepped recess 56a is provided on the left discarded board 263 side, and the notch 56b is provided on the central discarded board 261 side. The stepped recesses 56a of the pair of first decorative substrates 56 face each other. A space between these stepped recesses 56a is cut out, and the stepped recesses 56a are not connected to each other.

In the lower right first decoration board 56, the stepped recess 56a is provided on the right side discarded board 266, which will be described later, and the notch 56b is provided on the center discarded board 261 side. In the upper right first decorative board 56, the stepped recess 56a is provided on the central discarded board 261 side, and the notch 56b is provided on the right discarded board 266 side. The stepped recesses 56a of the pair of first decorative substrates 56 face each other. A space between these stepped recesses 56a is cut out, and the stepped recesses 56a are not connected to each other.

On the left side of the central discarded substrate 261, a lower left discarded substrate 262, a substantially rectangular left discarded substrate 263 and an upper left discarded substrate 264 are provided on the lower, left and upper sides of the pair of first decorative substrates 56. FIG. The lower left discarded substrate 262 is connected to the left discarded substrate 263 and the central discarded substrate 261 via the dividing grooves 236 and 237, while the upper left discarded substrate 264 is connected via the dividing grooves 238 and 239 to the left discarded substrate 263 and the central discarded substrate 261 via the dividing grooves 238 and 239. It is connected to the discarded substrate 261 . A slit 251 is formed between the lower left disposal substrate 262 and the upper left first decoration substrate 56, and the lower left disposal substrate 262 and the upper left first decoration substrate 56 are not connected. A slit 252 is formed between the upper left discarded substrate 264 and the upper right first decoration substrate 56, and the upper left discarded substrate 264 and the upper right first decoration substrate 56 are not connected. The left discard board 263 is connected to the lower left first decoration board 56 and the upper left first decoration board 56 via the dividing grooves 240 and 241 .

On the right side of the central discarded substrate 261, a lower right discarded substrate 265, a vertically elongated substantially rectangular right discarded substrate 266, and an upper right discarded substrate 267 are provided on the lower, right and upper sides of the pair of first decoration substrates 56, respectively. The lower right discarded substrate 265 is connected to the central discarded substrate 261 and the right discarded substrate 266 via the dividing grooves 242 and 243 , while the upper right discarded substrate 267 connects to the central discarded substrate 261 and the right discarded substrate 266 via the dividing grooves 244 and 245 . It is connected to the right discarded board 266 . A slit 253 is formed between the lower right disposal substrate 265 and the lower left first decoration substrate 56, and the lower right disposal substrate 265 and the lower left first decoration substrate 56 are not connected. Also, a slit 254 is formed between the upper right disposal substrate 267 and the lower right first decoration substrate 56, and the upper right disposal substrate 267 and the lower right first decoration substrate 56 are not connected. The right discarded board 266 is connected to the lower left first decorative board 56 and the lower right first decorative board 56 via the dividing grooves 246 and 247 .

In this manner, the discarded substrates 262 to 267 are provided along the entire periphery of the collective substrate 231, and the four first decorative substrates 56 are surrounded by the discarded substrates 262 to 267. FIG. As a result, it is possible to handle the collective substrate 231 without touching the electronic components mounted on the first decorative substrate 56 after mounting the electronic components. Therefore, it is possible to prevent the electronic parts from being damaged by contacting the electronic parts with the operator's hand. Note that the number of the first decorative substrates 56 included in the collective substrate 231 is not limited to "4". The number of the first decoration substrates 56 included in the aggregate substrate 231 may be more than "4" (for example, "6"), and the number of the first decoration substrates 56 included in the aggregate substrate 231 may be "4". A configuration with less than 4” (for example, “2”) may also be used.

A pair of first decorative substrates 56 are provided on the left side of the central discarded substrate 261 with the stepped concave portion 56a facing each other, and a pair of first decorative substrates 56 are provided on the right side of the central discarded substrate 261 with the stepped concave portion 56a facing each other. 56 is provided, the vertical dimension of the aggregate substrate 231 including the four first decoration substrates 56 is reduced.

Next, the manufacturing process of the decorative substrates 56 and 57 will be described by taking the manufacturing process of the first decorative substrate 56 as an example.

In the manufacturing process of the first decorative board 56, first, the second plate surface 269 of the collective board 231 (on the side of the second mounting surface 95, see FIG. 17B) faces upward, and then the second plate surface 269 of the collective board 231 is mounted. A solder application process of applying solder paste to the pads (or pads) provided on the plate surface 269, an adhesive application process of applying an adhesive for fixing the connectors, and the connectors 111 and 112 using an automatic mounting device (not shown). (FIG. 8A) is mounted on the second plate surface 269 side of the aggregate substrate 231, a reflow step of transferring the aggregate substrate 231 to a reflow furnace and heating it, and a cooling of cooling the aggregate substrate 231 to room temperature. process is performed. As a result, the connectors 111 and 112 are mounted on the second board surface 269 side of the collective board 231 . The curing of the adhesive prevents the connectors 111 and 112 from dropping in the second reflow process.

After that, with the first board surface 268 of the collective board 231 facing upward, solder paste is applied onto the land provided on the first board surface 268 side (first mounting surface 84 side) of the collective board 231. a component mounting process for mounting electronic components including small chip components on the first plate surface 268 side of the collective substrate 231 using an automatic mounting device (not shown); A reflow process for heating, a cooling process for cooling the collective board 231 to room temperature, a board dividing process for dividing the collective board 231 after electronic components are mounted, and a visual check for any missing electronic components in the first decorative board 56 . Then, a mounting confirmation process, etc. are performed. As a result, electronic components including small chip components are mounted on the first board surface 268 side of the collective board 231 .

As shown in FIG. 17A, a first mounting reference hole 271 and a second mounting reference hole 272 are formed in the left discarded substrate 263 and the right discarded substrate 266 so as to pass through the collective substrate 231 in the thickness direction. ing. The first mounting reference hole 271 is used for alignment of the assembly substrate 231 in the component mounting process for mounting the electronic component on the first plate surface 268 side, and the second mounting reference hole 272 is used to mount the electronic component on the second plate surface 268 side. It is used for alignment of the collective board 231 in the process of mounting components on the board surface 269 side. After aligning the assembly board 231, the automatic mounting apparatus sequentially places the small chip parts so that the electrodes of the small chip parts are placed on the solder paste applied to the corresponding pads (or pads) by coordinate control. 1 Set on the decoration substrate 56 .

As a method of dividing the aggregate substrate 231, a method of manually splitting the aggregate substrate 231 by an operator and a method of mechanically cutting the aggregate substrate 231 using a press or the like are known. Of these methods, by adopting the manual division method, it is possible to flexibly deal with multiple types of aggregated substrates while suppressing equipment costs.

The group substrate 231 is split by dividing the group substrate 231 so that the first board surface 268 where the small chip components are aggregated has a valley shape (concave) with the dividing grooves 232 to 247 as base points, and It can be considered that the collective board 231 is divided so that the plate surface 268 has a mountain shape (convex shape). In the substrate dividing step, as shown in FIG. 17B, the collective substrate 231 is divided into a plurality of substrates (specifically, by dividing the substrate 231 into a plurality of pieces (specifically In practice, four first decorative substrates 56 are taken out.

As already explained, the small chip components (bypass capacitor 85 and small chip resistors 87, 143 to 149) of the first decoration board 56 are concentrated on the first mounting surface 84 side. Small chip components are integrated on the first plate surface 268 side (the first mounting surface 84 side) in the collective substrate 231, and are not mounted on the second plate surface 269 side (the second mounting surface 95 side). Further, as already explained, the connection points between the small chip components and the first decoration board 56 have lower mechanical strength than the connection points between the other electronic components and the first decoration board 56 . As shown in FIG. 17(c), when the aggregate substrate 231 is divided into ridges, the force that can act on the first plate surface 268 side (first mounting surface 84 side) of the aggregate substrate 231 is tensile stress, and the second The force that can act on the plate surface 269 side (the second mounting surface 95 side) is compressive stress. On the other hand, when the collective substrate 231 is divided into valleys as shown in FIG. A force that can act on the second plate surface 269 side (second mounting surface 95 side) is a tensile stress.

The stress when dividing the collective substrate 231 acts more on the mountain-shaped (convex) plate surface than on the valley-shaped (concave) plate surface. By dividing the aggregate substrate 231 so that the first plate surface 268 side (first mounting surface 84 side) where the small chip components are aggregated has a valley shape (concave), small chips can be obtained when the aggregate substrate 231 is divided. It is possible to reduce the stress that may act on the connecting portion between the component and the first decoration board 56, and reduce the stress that may act on the small chip component itself. As a result, it is possible to reduce the possibility that the connecting portion between the small chip component and the first decorative substrate 56 will be damaged, and that the small chip component itself will be damaged. In this way, by reducing the possibility of poor contact between small chip components in the substrate dividing process, the manufacturing efficiency of the first decorative substrate 56 can be improved.

Among the small chip parts, the laminated ceramic capacitor used as the bypass capacitor 85 is weak against tensile stress, and when the tensile stress acts on the bypass capacitor 85, the bypass capacitor 85 itself is likely to crack. By dividing the assembly substrate 231 into valleys (concave) on the side of the first plate surface 268 (the side of the first mounting surface 84) where the small chip components including the bypass capacitor 85 are concentrated, the bypass capacitor 85 is formed. By using the force that can act on the bypass capacitor 85 as a compressive stress, it is possible to avoid applying a tensile stress to the bypass capacitor 85 . This reduces the possibility that the bypass capacitors 85 themselves will be damaged when the collective substrate 231 is divided.

As already explained, by dividing the collective substrate 231 with the dividing grooves 232 to 247 as base points, it is possible to minimize the stress that may act on the connection points between the small chip components and the first decorative substrate 56. The stress that can be applied to small chip components can be minimized. On the other hand, if the base point of division deviates from the dividing grooves 232 to 247, these stresses will increase. A dividing jig is used to prevent the base point of dividing from being deviated from the dividing grooves 232 to 247 and to improve the workability of the substrate dividing process.

18(a) is a perspective view of a dividing jig 281 used for dividing the collective substrate 231 in this embodiment, FIG. 18(b) is a front view of the dividing jig 281, and FIG. 18(c). 4 is an explanatory diagram for explaining how the assembly board 231 is divided using the dividing jig 281. FIG. As shown in FIG. 18(a), the dividing jig 281 supports a metal thin blade 282 that abuts on the dividing grooves 232 to 247 and serves as a fulcrum when dividing the aggregate substrate 231, and the thin blade 282. a base 283; The base portion 283 includes a resin-made base portion 283a molded in the shape of a horizontally elongated rectangular parallelepiped, and a rectangular parallelepiped standing portion 283b integrally formed by standing up from one side plate surface of the base portion 283a. there is

The thin blade 282 includes a plate-shaped blade portion 282a and a flange portion 282b. The thin blade 282 is fixed to the base portion 283 by screwing the flange portion 282b to the standing portion 283b. The blade portion 282a protrudes upward from the upper plane of the standing portion 283b and extends in the longitudinal direction of the standing portion 283b.

A projecting portion 283c for assisting alignment of the assembly substrate 231 with respect to the blade portion 282a is integrally formed at substantially the center of the standing portion 283b in the longitudinal direction so that the blade portion 282a abuts on the dividing grooves 232 to 247. there is The projecting portion 283c projects upward from the upper plane of the standing portion 283b with a projecting dimension larger than that of the blade portion 282a. As shown in FIG. 17(a), recesses 284 and 285 are provided between the pair of first decorative substrates 56 on the right side of the left discarded substrate 263 and the left portion of the central discarded substrate 261 so that the protrusion 283c can be inserted therethrough. is provided. Further, recesses 286 and 287 are provided between the pair of first decorative substrates 56 on the right side of the central discarded substrate 261 and the left portion of the right discarded substrate 266 so that the protrusion 283c can be inserted therethrough.

As shown in FIG. 18(c), the operator turns the first plate surface 268 (first mounting surface 84) of the collective substrate 231 downward, and disposes of the central discarded substrate 261, the left discarded substrate 263, and the right discarded substrate 266. One of them (in FIG. 18(c), the central discarded substrate 261) is fixed on the standing portion 283b. At this time, by inserting the projecting portion 283c into the concave portions 284 to 287 (FIG. 17(a)) provided in the waste substrates 261, 263, and 266, the dividing grooves 232 to 247, which are the base points of division, abut against the blade portion 282a. You can easily create a state of contact. In this state, a downward force is applied to the second plate surface 269 side to push downward the portion that protrudes to the right from the upright portion 283b, thereby forming the first plate surface 268 into a valley shape (concave). , and the dividing grooves 232 to 247 can be used as base points to divide the collective substrate 231 into valleys.

For example, a worker first prepares a collective substrate 231 (FIG. 17(a)) as a first unit including a pair of first decorative substrates 56 on the left side, a lower left discarded substrate 262, a left discarded substrate 263 and an upper left discarded substrate 264, A second unit including a pair of first decoration substrates 56 on the right side, a central discarded substrate 261 , a lower right discarded substrate 265 , a right discarded substrate 266 and an upper right discarded substrate 267 . After that, in the first unit, the pair of first decoration substrates 56 and the left discarded substrate 263 are separated, so that the two first decoration substrates 56 can be taken out. In addition, in the second unit, the pair of first decorative substrates 56 and the central discarded substrate 261 are separated, and the pair of first decorative substrates 56 and the right discarded substrate 266 are separated to obtain two first decorative substrates. The decorative substrate 56 can be taken out. The order of dividing the collective substrate 231 to take out the four first decorative substrates 56 is arbitrary.

With the blade portion 282a in contact with the division grooves 232 to 247 serving as the division base points, the substrate assembly 231 is divided into valleys using the blade portions 282a as fulcrums, so that the division base points are displaced from the division grooves 232 to 247. You can prevent it from being lost. As a result, it is possible to minimize the stress that may act on the connection points between the small chip components and the first decorative substrate 56 when dividing the collective substrate 231, and minimize the stress that may act on the small chip components themselves. can be suppressed.

By pushing the second mounting surface 95 downward to divide the aggregate substrate 231 into valleys, compared to the configuration in which the aggregate substrate 231 is divided into valleys by pulling up the second mounting surface 95, the operator can is easy to apply force for dividing the aggregate substrate 231 . Further, in the central discarded substrate 261, the left discarded substrate 263, and the right discarded substrate 266, recesses 284 to 287 (FIG. 17(a)) are provided between the pair of first decoration substrates 56, so that the first decoration It is possible to fix the collective board 231 to the dividing jig 281 while preventing the stress acting on the electronic components mounted on the board 56 from increasing.

As already described with reference to FIG. 8(a), the first decorative substrate 56 is provided with fixing through holes 56d to 56g, and small chip components are arranged avoiding the through hole peripheral regions 211a to 211d. there is For this reason, as shown in FIG. 18(c), any one of the central discarded substrate 261, the left discarded substrate 263, and the right discarded substrate 266 is placed on the standing portion with the first plate surface 268 (first mounting surface 84) facing downward. 283b, a downward force is applied to the second plate surface 269 side to push downward the portion protruding from the standing portion 283b to divide the collective substrate 231, the fixing through hole is used as a portion to be pushed downward. Around 56d to 56g can be selected. As a result, the stress that may act on the small chip components mounted on the first board surface 268 side (the first mounting surface 84 side) can be minimized.

As already described, the dividing grooves 232 to 247 are formed only on the first plate surface 268 side of the collective substrate 231 and are not formed on the second plate surface 269 side. For this reason, the operator can set the collective substrate 231 on the dividing jig 281 with the plate surface (first plate surface 268) on which the dividing grooves 232 to 247 are formed facing downward. 231 is reduced.

As shown in FIG. 17(a), 16 dividing grooves 232 to 247 present in the collective substrate 231 extend in the first direction DR1. The extending directions of these dividing grooves 232 to 247 are parallel to each other. Further, as already explained with reference to FIGS. 8(a) to 8(c), the small chip parts (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are are mounted on the first decorative substrate 56 in such a manner that the longitudinal direction of the substrate is parallel to the 16 dividing grooves 232 to 247 existing in the collective substrate 231. As shown in FIG. For this reason, compared to the configuration in which the longitudinal direction of the small chip components is perpendicular to the extending direction of the dividing grooves 232 to 247, when the aggregate substrate 231 is divided with the dividing grooves 232 to 247 as a base point, the small chip components and the second chip components are separated from each other. The stress that can act on the connecting portion with the 1 decoration board 56 is reduced, and the stress that can act on the small chip component itself is also reduced.

As shown in FIG. 17(a), slits 255 to 258 are provided in the collective substrate 231 at locations corresponding to the regions where the decoupling capacitors 85 are mounted. As already explained, the slits 255 to 258 are long and narrow holes, and are wider than the dividing grooves 233 , 234 , 240 and 247 . The stress that can act around the slits 255 to 258 when the aggregate substrate 231 is divided with the division grooves 232 to 247 as the base point is smaller than the stress that can act around the division grooves 232 to 247 . Since the slits 255 to 258 are provided at the positions corresponding to the mounting area of the decoupling capacitor 85, the stress that may act on the connecting part between the decoupling capacitor 85 and the first decoration board 56 when the assembly board 231 is divided is reduced. In addition, the stress that may act on the bypass capacitor 85 itself is reduced.

As shown in FIGS. 8A and 8B, the bypass capacitor 85 is arranged closer to the stepped concave portion 56a than the LED driver 126 is. As already described with reference to FIG. 17A, the dividing grooves 233, 234, 240, and 247 are not provided on the stepped concave portion 56a side of the collective substrate 231. As shown in FIG. By arranging the bypass capacitor 85 on the opposite side of the dividing grooves 233, 234, 240, and 247 with the LED driver 126 interposed therebetween, when the collective substrate 231 is divided with the dividing grooves 233, 234, 240, and 247 as base points, In addition, the stress that can act on the connecting portion between the bypass capacitor 85 and the first decoration board 56 can be reduced, and the stress that can act on the bypass capacitor 85 itself can be reduced. As a result, when dividing the collective substrate 231, the possibility of breaking the connection point between the bypass capacitor 85 and the first decoration board 56 is reduced, and the possibility of breaking the bypass capacitor 85 itself is reduced. has been reduced.

As already explained with reference to FIGS. 8(b) and 8(c), the separation direction of the pads 171a and 171b corresponding to the electrodes 85a and 85b of the bypass capacitor 85 and the electrodes 87a and 87b of the small chip resistor 87 correspond to The separation direction of the pads 176a and 176b is the first direction DR1. In the reflow process, the pair of electrodes 85a and 85b of the bypass capacitor 85 are transported in a direction (second direction DR2) orthogonal to or substantially orthogonal to the common separation direction (first direction DR1). A pair of pads 176a corresponding to a pair of electrodes 87a, 87b of the small chip resistor 87 can be matched in timing to start heating the solder paste applied on the corresponding pair of pads 171a, 171b. , 176b can be started to be heated. As a result, it is possible to prevent the rotation of a plurality of small chip components and the occurrence of standing chips. As shown in FIG. 17A, on the first plate surface 268 side of the left discarded substrate 263, a recognition mark 288 is provided to enable confirmation of the transport direction of the collective substrate 231 in the reflow process. Although not shown, a recognition mark is also provided on the second plate surface 269 side of the left discarded substrate 263 to enable confirmation of the transport direction of the collective substrate 231 in the reflow process. As a result, the possibility of the worker mistaking the conveying direction of the collective board 231 is reduced.

As already described with reference to FIG. 8A, in the configuration in which the LED driver 126 is arranged in a region including a region less than 10 mm from the outer edge of the first decorative substrate 56, small chip components (the bypass capacitor 85 and the small The chip resistors 87, 143-149 (FIG. 11)) are arranged at a distance of 10 mm or more from the outer edge of the first decorative substrate 56. FIG. As already explained, the connection points between the small chip components among the various electronic components mounted on the first decoration board 56 and the first decoration board 56 are the same as the connection points between the other electronic components and the first decoration board 56 . Comparatively low mechanical strength. Further, the area within 10 mm from the outer edge of the first decorative substrate 56 is an area that may exist in the vicinity of the dividing grooves 232 to 247 (FIG. 17) in the aggregate substrate 231 (FIG. 17). This is the area where force may be applied to crack the substrate 231 . Since the small chip components are arranged at a distance of 10 mm or more from the outer edge of the first decoration board 56, the maximum stress that can be applied to the connection points between the small chip components and the first decoration board 56 when the assembly board 231 is divided. is reduced, and the maximum value of stress that can act on the small chip component itself is also reduced.

<Electrical Configuration of Pachinko Machine 10>
FIG. 19 is a block diagram showing the electrical configuration of the pachinko machine 10. As shown in FIG.

The main control device 60 comprises a main control board 61 that controls the main game, and a power outage monitoring board 67 that monitors the power supply. An MPU 62 is mounted on the main control board 61 . The MPU 62 incorporates a main ROM 64 and a main RAM 65 in addition to a main CPU 63 which is an arithmetic processing device including a control section and a calculation section. In addition to the elements described above, the MPU 62 incorporates an interrupt circuit, a timer circuit, a data input/output circuit, various counter circuits as a random number generator, and the like.

The main ROM 64 is a memory such as a NOR flash memory and a NAND flash memory that does not require external power supply (that is, non-volatile storage means), and is used exclusively for reading. The main ROM 64 stores various control programs executed by the main CPU 63 and fixed value data.

The main RAM 65 is a memory (that is, volatile storage means) such as SRAM and DRAM that requires power supply from the outside to retain data, and is used for both reading and writing. The main RAM 65 can be randomly accessed, and has a faster read time than the main ROM 64 when compared with the same data capacity. The main RAM 65 temporarily stores various data for execution of the control program stored in the main ROM 64 .

The main CPU 63 executes processing for managing the game history. The main side CPU 63 grasps the entry history of the game ball to the general winning hole 31, the special electric winning device 32, the first operation hole 33, the second operation hole 34 and the out hole 24a. Accordingly, the frequency of the ball entering the general winning opening 31, the special electric winning device 32, the first operating opening 33 and the second operating opening 34 is grasped. In addition, the main CPU 63 grasps the frequency of occurrence of an opening/closing execution mode and a high-frequency support mode, which will be described later.

The MPU 62 is provided with an input port and an output port. An input side of the MPU 62 is connected to a power failure monitoring board 67 and a payout control device 77 provided in the main control device 60 . A power supply/emission control device 78 having a function of supplying operating power is connected to the power failure monitoring board 67 , and operating power is supplied to the MPU 62 via the power failure monitoring board 67 .

Various sensors such as ball entry detection sensors 42a to 49a are connected to the input side of the MPU 62 . As already described, the respective ball entry detection sensors 42a to 49a include the first winning opening detection sensor 42a, the second winning opening detection sensor 43a, the third winning opening detection sensor 44a, the special electric detection sensor 45a, and the first operation opening detection. A sensor 46a, a second working opening detection sensor 47a, an outlet detection sensor 48a and a gate detection sensor 49a are included. Based on the detection results of these ball-entering detection sensors 42a to 49a, the main CPU 63 determines whether a ball is entering each ball-entering section. Further, in the main CPU 63, various lotteries are executed based on the winning of the first operating port 33, and various lotteries are executed based on the winning of the second operating port 34.

The input side of the MPU 62 is provided with a setting key insertion portion 68a, an update button 68b and a reset button 68c provided on the main control board 61 . A sensor (not shown) is provided in the setting key inserting portion 68a, and the sensor detects whether the setting key inserting portion 68a is arranged at the ON operation position or the OFF operation position. Based on the detection result from the sensor, the main CPU 63 identifies whether the setting key insertion portion 68a is located at the ON operation position or the OFF operation position. The update button 68b is provided with a sensor (not shown), and the sensor detects whether or not the update button 68b is pressed. Then, the main CPU 63 determines whether or not the update button 68b is pressed based on the detection result from the sensor. The reset button 68c is provided with a sensor (not shown), and the sensor detects whether or not the reset button 68c is pressed. Then, the main CPU 63 determines whether or not the reset button 68c is pressed based on the detection result from the sensor.

The output side of the MPU 62 is connected with a power failure monitor board 67, a payout control device 77 and a sound emission control device 81. A prize ball command is output to the payout control device 77 based on, for example, a game ball entering a prize ball corresponding ball entry portion among the ball entry portions where the occurrence of the ball entry corresponds to the payout of the game ball. be. Various commands such as a variation command, a type command, and an opening command are output to the sound emission control device 81 .

On the output side of the MPU 62, a special electric drive unit 32b that opens and closes the open/close door 32a of the special electric prize winning device 32, a general electric drive unit 34b that opens and closes the general electric accessory 34a of the second operation opening 34, A figure unit 37 and a general figure unit 38 are connected. Incidentally, the special figure unit 37 is provided with a special figure display section 37a and a special figure reservation display section 37b, but all of these are connected to the output side of the MPU62. Similarly, the normal map unit 38 is provided with a normal map display unit 38a and a normal map reservation display unit 38b, all of which are connected to the output side of the MPU62. Various driver circuits are provided on the main control board 61, and the MPU 62 executes drive control of various drive units and various display units through the driver circuits.

In other words, in the opening/closing execution mode, the driving control of the special electric driving unit 32b is executed in the main CPU 63 so that the special electric winning device 32 is opened and closed. In addition, when the general electric accessory 34a is won in the open state, the main side CPU 63 executes drive control of the general electric drive unit 34b so that the general electric accessory 34a is opened and closed. Moreover, display control of the special figure display part 37a is performed in main side CPU63 in the case of each game time. In addition, when the lottery result of whether or not to open the general electric accessory 34a is specified, the main side CPU 63 controls the display of the general pattern display unit 38a. Also, when the winning to the first operation port 33 or the second operation port 34 occurs, or when the variable display is started in the special figure display unit 37a, display control of the special figure reservation display unit 37b in the main side CPU63 is executed, and when winning to the through gate 35 occurs, or when variable display is started in the normal pattern display unit 38a, the main CPU 63 controls the display of the normal pattern reservation display unit 38b.

First to third notification display devices 69a to 69c are connected to the output side of the MPU 62. FIG. The management results of the game history are displayed on the first to third notification display devices 69a to 69c. Further, when the setting state of the pachinko machine 10 is changed, the current setting value is displayed on the third notification display device 69c. The display of the first to third notification display devices 69 a to 69 c is controlled by the main CPU 63 .

The blackout monitoring board 67 relays between the main control board 61 and the power/launch control device 78 and monitors the maximum voltage output from the power/launch control device 78, which is a stable DC voltage of 24 volts. The payout control device 77 controls the payout of prize balls and rental balls by the payout device 76 based on the prize ball command received from the main controller 60 .

The power/emission control device 78 is connected to, for example, a commercial power supply (external power supply) in a game hall or the like. Then, based on the external power supplied from the commercial power supply, the main control board 61, the payout control device 77, etc. are generated with the necessary operating power, and the generated operating power is supplied. Incidentally, the power supply/launch control device 78 is provided with a power supply unit for power failure such as a backup capacitor, and even if the power supply of the pachinko machine 10 is in the OFF state, the power supply unit for power failure is used as the main power supply. Electric power for memory retention is supplied to the main side RAM 65 and the payout control device 77 of the control device 60 . The power/shooting control device 78 controls the shooting of the game ball shooting mechanism 27, and the game ball shooting mechanism 27 is driven when predetermined shooting conditions are met. Further, as already explained, the payout mechanism 73 is provided with a power switch, and when the power switch is turned ON, the supply of operating power to the pachinko machine 10 is started, and the power switch is turned OFF. , the supply of operating power to the pachinko machine 10 is stopped.

The sound emission control device 81 drives and controls the speaker section 53 provided on the front door frame 14 based on various commands received from the main control device 60 . Further, as already explained, the sound emission control device 81 controls the emission of the LED chips 127 to 142 mounted on the first decoration board 56 and the LED chips mounted on the second decoration board 57 . Furthermore, the audio emission control device 81 controls the display control device 82 . The display control device 82 executes display control of the pattern display device 41 based on the command received from the sound emission control device 81 .

<Electrical Configuration for Performing Various Lottery Draws by Main Side CPU 63>
Next, an electrical configuration for performing various lotteries by the main CPU 63 will be described with reference to FIG.

The main side CPU 63 uses various counter information during the game to set the jackpot occurrence lottery, the display setting of the special figure display section 37a, the setting of the symbol display of the symbol display device 41, the display setting of the normal figure display section 38a, and the like. Specifically, as shown in FIG. 20, the winning random number counter C1 used for the lottery of winning generation, the big winning type counter C2 used when judging the big winning type, and the pattern display device 41 fluctuate. The reach random number counter C3 used for the reach generation lottery when doing, the random number initial value counter CINI used for setting the initial value of the hit random number counter C1, and the display duration in the special figure display unit 37a and the pattern display device 41 are determined. A variation type counter CS is used. Furthermore, it is decided to use the general electric accessory open counter C4 used for the lottery of whether or not the general electrical accessory 34a of the second operation port 34 is in the general electrical open state. The counters C1 to C3, CINI, CS, and C4 are provided in the various counter areas 65b of the main RAM 65. FIG.

Each of the counters C1 to C3, CINI, CS, and C4 is a loop counter that adds 1 to the previous value each time it is updated and returns to "0" after reaching the maximum value. Each counter is updated at short intervals. Information corresponding to the hit random number counter C1, the jackpot type counter C2, and the reach random number counter C3 is provided in the main side RAM 65 as acquisition information storage means when a prize is won in the first operation opening 33 or the second operation opening 34. stored in the reserved storage area 65a.

The pending storage area 65a comprises a pending area RE and an execution area AE. The reservation area RE includes a first reservation area RE1, a second reservation area RE2, a third reservation area RE3, and a fourth reservation area RE4. In addition, a combination of each numerical value information of the hit random number counter C1, the jackpot type counter C2 and the reach random number counter C3 is stored as reserved information in one of the reserved areas RE1 to RE4.

In this case, in the first reservation area RE1 to the fourth reservation area RE4, when the winning to the first operation port 33 or the second operation port 34 occurs multiple times in succession, the first reservation area RE1 → the second Each numerical information is stored chronologically in order of reservation area RE2→third reservation area RE3→fourth reservation area RE4. By providing the four reservation areas RE1 to RE4 in this way, up to four winning histories of game balls to the first operation port 33 or the second operation port 34 are retained and stored. .

It should be noted that the number that can be reserved and stored is not limited to four, and may be any number, such as two, three, or five or more, or may be singular.

The execution area AE is an area for moving each numerical value information stored in the first reservation area RE1 of the reservation area RE when starting the variable display of the special figure display section 37a, and the start of one game round. At that time, the success or failure determination is performed based on various numerical information stored in the execution area AE.

Each of the above counters will be described in detail.

First, the universal electrical role item release counter C4 will be described. For example, the universal electrical role item release counter C4 is configured to be incremented by 1 in order within the range of 0 to 250, and return to "0" after reaching the maximum value. The general electric role release counter C4 is periodically updated, and stored in the general electric reservation area 65c of the main side RAM 65 at the timing when the game ball wins the through gate 35. - 特許庁Then, at a predetermined timing, a lottery is performed as to whether or not to control the general electric role item 34a to the open state based on the stored value of the general electric role item opening counter C4.

In this pachinko machine 10, a plurality of types of support modes are set so that the mode of support by the general electric role item 34a is different from each other. Specifically, in the support mode, when compared with the situation in which the game ball is continuously shot in the same manner in the game area PA, the general electric accessory 34a of the second operation port 34 opens per unit time. A high-frequency support mode and a low-frequency support mode are set so that the frequency of states is relatively high and low.

In the high frequency support mode and the low frequency support mode, the probability of winning the general electric open state in the general electric open lottery using the general electric accessory open counter C4 is the same (for example, both are 4/5). , in the high frequency support mode, the number of times that the general electrical role 34a is in the open state when the general electrical open state is won is set more than in the low frequency support mode, and the open time for one time is set longer. It is In this case, in the high frequency support mode, when the general electric open state is won and the open state of the general electric accessory 34a occurs multiple times, the time from the end of one open state to the start of the next open state The closing time is set shorter than one opening time. Furthermore, in the high-frequency support mode, compared to the low-frequency support mode, the minimum secured time (i.e., the The duration of one display on the display section 38a) is set short.

As described above, in the high-frequency support mode, the probability of winning the second operation port 34 is higher than in the low-frequency support mode. In other words, in the low frequency support mode, the probability of winning the first operation opening 33 is higher than in the second operation opening 34, but in the high frequency support mode, the second operation opening is higher than the first operation opening 33. The probability of winning a prize to the mouth 34 is increased. When a prize is won in the second operation port 34, a predetermined number of game balls are paid out. Therefore, in the high-frequency support mode, the player can play the game while not reducing the number of balls in his hand too much. It can be carried out.

In addition, the configuration for making the high-frequency support mode more frequent than the low-frequency support mode to be in the electric power open state per unit time is not limited to the above. A configuration may be adopted in which the probability of winning the electric power open state is increased. In addition, after one general electric open lottery is performed, the time secured for the next general electric open lottery is performed (for example, based on the winning of the through gate 35, it is executed in the universal diagram display unit 38a In a configuration where multiple types of variable display time) are prepared, in the high-frequency support mode, it is easier to select a shorter reserved time than in the low-frequency support mode, or is set so that the average reserved time is shorter. good too. In addition, the number of open times is increased, the open time is lengthened, and the secured time that is secured after one electric power open lottery is performed and the next electric power open lottery is performed is shortened. The advantage of the high-frequency support mode over the low-frequency support mode may be increased by applying any one condition or any combination of shortening the average time and increasing the winning probability.

Here, as already explained, the pachinko machine 10 has the setting states of "setting 1" to "setting 6", but the opening frequency and opening mode of the general electric role 34a in the low frequency support mode Even the setting values are the same, and the opening frequency and the opening mode of the general electrical accessory 34a in the high-frequency support mode are also the same regardless of the setting values. However, it is not limited to this, and at least one of the opening frequency and opening mode of the general electric role 34a for at least one of the low frequency support mode and the high frequency support mode varies according to the setting state of the pachinko machine 10 may be configured. For example, the higher the set value, the higher the frequency of opening the general electrical accessory 34a in the low-frequency support mode. A configuration may be adopted in which the probability of a game ball entering the mouth 34 is increased. In addition, the higher the set value, the higher the frequency of opening the general electrical accessory 34a in the high-frequency support mode. A configuration may be adopted in which the ball entry probability of the game ball to the operation opening 34 is increased.

Next, the winning random number counter C1 will be described. The winning random number counter C1 is configured such that, for example, 1 is sequentially added within the range of 0 to 7999, and after reaching the maximum value, it returns to "0". In particular, when the winning random number counter C1 completes one cycle, the value of the random number initial value counter CINI at that time is read as the initial value of the winning random number counter C1. The random number initial value counter CINI is a loop counter similar to the winning random number counter C1 (value=0 to 7999). The hit random number counter C1 is periodically updated, and stored in the reservation storage area 65a of the main side RAM 65 at the timing when the game ball enters the first operation opening 33 or the second operation opening .

The values of random numbers for winning the jackpot are stored in the main ROM 64 as a success/failure table. As shown in FIG. 19, the main-side ROM 64 is provided with a success/failure table storage area 64a. In the right/wrong table storage area 64a, a low right/wrong table for the low probability mode and a high right/wrong table for the high probability mode are stored as right/wrong tables.

The low certainty table is provided in one-to-one correspondence with the setting states of "setting 1" to "setting 6". That is, the low accuracy table for setting 1 that is referred to when the setting state of the pachinko machine 10 is "setting 1" and the setting 2 that is referred to when the setting state of the pachinko machine 10 is "setting 2" A low accuracy table for setting, a low accuracy table for setting 3 that is referred to when the setting state of the pachinko machine 10 is "setting 3", and a case where the setting state of the pachinko machine 10 is "setting 4" A low accuracy table for setting 4 that is referred to, a low accuracy table for setting 5 that is referred to when the setting state of the pachinko machine 10 is "setting 5", and a setting state of the pachinko machine 10 is " There is a low validity table for setting 6 that is referenced if setting 6”.

These low-probability tables are set so that the higher the setting value, the higher the winning probability of the jackpot result. Specifically, when the low certainty table for setting 1 is referred to, the result is a big hit at 1/320, and when the low certainty table for setting 2 is referred to, the result is about 1/308. When the low accuracy table for setting 3 is referred to, a big win result is obtained at about 1/278, and when the low accuracy table for setting 4 is referred, a big win result is obtained at about 1/286. When the low probability table for setting 5 is referred to, a big win result is obtained at about 1/276, and when the low probability table for setting 6 is referred to, a big win result is obtained at about 1/267. As a result, when the setting state of the pachinko machine 10 is set to a high setting value, it becomes easier for a large winning result to occur in the low-probability mode, which is advantageous for the player.

On the other hand, only one type of high-probability table is provided so as to be common to any setting state of "setting 1" to "setting 6". The high-probability table is set so that the winning probability of the jackpot results is higher than that of the low-probability table in any setting state of "setting 1" to "setting 6". Specifically, when the high certainty table is referred to, the jackpot result is about 1/30. As a result, regardless of the setting state of the pachinko machine 10, the high-probability mode can be made more advantageous than the low-probability mode. In addition, even in the lowest setting state "setting 1", it is possible to increase the probability of a big hit result by entering the high probability mode than in the low probability mode of "setting 6" which is the highest setting state. becomes. In addition, the high probability mode can be prevented from being advantageous or disadvantageous depending on the setting state of the pachinko machine 10, and the memory capacity for pre-storing the high probability table in the main side ROM 64 can be suppressed. becomes possible.

The jackpot type counter C2 is configured to be incremented by 1 in order within the range of 0 to 29, and return to "0" after reaching the maximum value. The jackpot type counter C2 is periodically updated, and stored in the reservation storage area 65a at the timing when the game ball wins the first operation opening 33 or the second operation opening .

In this pachinko machine 10, a plurality of jackpot results are set. These multiple jackpot results are (1) the aspect of the opening/closing control of the special electric prize winning device 32 in the opening/closing execution mode, (2) the lottery mode in the winning/losing lottery means after the opening/closing execution mode ends, and (3) the first prize after the opening/closing execution mode ends. A plurality of jackpot results are set by providing a difference in the three conditions of the support mode in the universal electrical accessory 34a of the second operation port 34.

As a mode of opening/closing control of the special electric prize winning device 32 in the opening/closing execution mode, the frequency of winning to the special electric prize winning device 32 from the start to the end of the opening/closing execution mode is relatively high. A frequency winning mode and a low frequency winning mode are set. Specifically, in both the high-frequency winning mode and the low-frequency winning mode, the round game is executed up to a predetermined number of times.

A round game is a game that continues until either one of the elapse of a predetermined upper limit duration period and the predetermined upper limit number of game balls winning the special electric prize winning device 32 is satisfied. That is. In addition, the number of round games in the opening/closing execution mode triggered by the result of the big win is the same as the fixed number of rounds regardless of the type of the result of the big win triggered by the shift. Specifically, the upper limit number of round games is set to 15 rounds regardless of the jackpot result.

In addition, in the pachinko machine 10, a plurality of types of one-time opening mode of the special electric prize winning device 32 are set with different opening durations from opening to closing of the special electric prize winning device 32.例文帳に追加Specifically, a long time mode in which the open duration is set to a long time of 29 seconds, and a short time mode in which the open duration is set to a short time shorter than the long time of 0.06 seconds, is set.

In the pachinko machine 10, when the shooting operation device 28 is operated by the player, the game ball shooting mechanism 27 is driven so that one game ball is shot toward the game area PA every 0.6 seconds. controlled. In the round game, the upper limit number of end conditions is set to nine. Then, in the long time mode among the above open modes, the open continuation time is set to be longer than the product of the shooting cycle of the game ball and one round game. On the other hand, in the short-time mode, the opening duration is set to be shorter than the product of the game ball launch cycle and one round game, more specifically, shorter than the game ball launch cycle. Therefore, when one opening is performed in the long-time mode, it is expected that the special electric winning device 32 will win the maximum number of prizes in one round game, and one time in the short-time mode. When the opening is performed for the first time, it is expected that no prize will be won to the special electric prize winning device 32, or if there will be a prize, it will be about one.

In the high-frequency winning mode, the special electric winning device 32 is opened once in a long time mode in each round game. On the other hand, in the low-frequency winning mode, the special electric winning device 32 is opened once in a short time mode in each round game.

In the high frequency winning mode and the low frequency winning mode, the number of times of opening and closing the special electric winning device 32, the number of round games, the opening duration for one opening, and the upper limit number in one round game is higher than the low-frequency winning mode, and is not limited to the above value, and is arbitrary is.

As shown in FIG. 19, the main ROM 64 is provided with a distribution table storage area 64b. The distribution table storage area 64b stores a distribution table in which the distribution destination of the jackpot result for the jackpot type counter C2 is set. In the allocation table, low-probability jackpot results, low-win high-probability jackpot results, and maximum-benefit jackpot results are set as jackpot results to be distributed in the event of a jackpot result.

A low-probability jackpot result is a jackpot result in which the opening/closing execution mode becomes a high-frequency prize-winning mode, and after the opening/closing execution mode ends, the winning/failure lottery mode becomes a low-probability mode and the support mode becomes a high-frequency support mode. However, this high-frequency support mode transitions to the low-frequency support mode when the number of games reaches the end reference number of times (specifically, 100 times) after transition.

The result of the low winning high probability jackpot is that the opening and closing execution mode becomes the low frequency winning mode, and after the opening and closing execution mode ends, the lottery mode becomes the high probability mode and the support mode becomes the high frequency support mode. be. These high-probability mode and high-frequency support mode are continued until the lottery result in the success/failure lottery results in a big win state winning, and the game shifts to a big win state accordingly.

The maximum profit jackpot result is a jackpot result in which the opening/closing execution mode becomes a high-frequency prize winning mode, and after the opening/closing execution mode ends, the winning/failure lottery mode becomes a high-probability mode and the support mode becomes a high-frequency support mode. These high-probability mode and high-frequency support mode are continued until the lottery results in the win/fail lottery result in winning the big win state, and the game shifts to the big win state accordingly.

In relation to each game state described above, the normal game state is not the open/close execution mode, but the win/fail lottery mode is the low probability mode, and the support mode is the low frequency support mode. In addition, as the game result, it is possible to adopt a configuration in which the low winning high probability jackpot result is not set. In addition, in the opening and closing execution mode in the low winning high probability jackpot result, the number of round games may be less than in the case of the low probability jackpot result and the maximum profit jackpot result.

In the distribution table, among the values of the jackpot type counter C2 of "0 to 29", "0 to 9" correspond to the low probability jackpot result, and "10 to 14" correspond to the low prize winning high probability jackpot result. , and "15 to 29" corresponds to the maximum winning jackpot result.

Only one sorting table is provided so that it is common to any setting state of "setting 1" to "setting 6". As a result, it is possible to prevent the setting state of the pachinko machine 10 from causing an advantage or a disadvantage in terms of how the jackpot results are distributed, and at the same time, the memory capacity for pre-storing the distribution table in the main-side ROM 64 can be increased. can be suppressed.

It should be noted that it is also possible to adopt a configuration in which the distribution mode of the jackpot result is different according to the setting state of the pachinko machine 10 . For example, the higher the set value, the higher the probability of being assigned to the maximum advantageous jackpot result, or the higher the set value, the higher the probability of being assigned to the maximum advantageous jackpot result or the low winning high probability jackpot result. In this case, the higher the set value, the higher the probability of entering the high-probability mode after a big win. In addition, the higher the set value, the lower the probability of being distributed to the low winning high probability jackpot result. It is good also as a structure which can be distributed to a jackpot result. In this case, the higher the set value, the higher the probability of occurrence of the opening/closing execution mode of the high-frequency winning mode.

Next, the reach random number counter C3 will be described. The reach random number counter C3 is configured such that it is incremented by 1 in order within the range of 0 to 238, for example, and returns to "0" after reaching the maximum value. In the pachinko machine 10, an expected effect is set as a kind of display effect in the pattern display device 41.例文帳に追加The expected effect is a gaming machine equipped with a symbol display device 41 capable of performing a variable display of symbols, and the symbol display device 41 in which the final stop result is the award corresponding result in a game round that results in a predetermined big win result. It is a display state for making the player think that it is a variable display state that is likely to result in the grant correspondence result in the stage before the stop result is derived and displayed after the symbol variable display is started in . Concretely, a combination of symbols with the same number on any of the activated lines is stopped and displayed with respect to the award correspondence result.

There are two types of expectation effects: a ready-to-win display and an advance notice display for expecting the occurrence of the ready-to-win display and the occurrence of the grant correspondence result in a stage before the occurrence of the ready-to-win display.

In the ready-to-win display, a combination of ready-to-win symbols is displayed by stopping and displaying the symbols of some of the plurality of symbol rows displayed on the display surface 41a of the symbol display device 41, and the remaining symbols are displayed in that state. It includes a display state in which symbols are variably displayed in the symbol row. In addition, in a state in which the combinations of ready-to-win patterns are displayed as described above, the patterns are displayed in the remaining pattern rows in a variable manner, and a predetermined character or the like is displayed as a moving image on the background screen to produce a ready-to-win effect. , the combination of the ready-to-win pattern is reduced or hidden, and then a predetermined character or the like is displayed as a moving image on substantially the entire display surface 41a to perform the ready-to-win effect.

In the advance notice display, the symbols are variably displayed in all of the symbol rows after the symbol variability display is started on the display surface 41a of the symbol display device 41, or in a part of the symbol rows and a plurality of symbols are displayed. In the situation where the symbols are variably displayed in the symbol row, a mode is included in which characters are displayed separately from the symbols on the symbol row. It also includes a background screen in a predetermined mode different from the previous mode, and a pattern in the pattern row in a predetermined mode different from the previous mode. Such an advance notice display can occur in any game cycle when the reach display is performed or when the reach display is not performed. It is set to occur with probability.

The ready-to-win display is executed regardless of the value of the ready-to-win random number counter C3 in game rounds in which the same combination of symbols is finally stopped and displayed. Also, in a game cycle corresponding to a big hit result in which the same combination of symbols is not stop-displayed, the game is not executed regardless of the value of the reach random number counter C3. Also, in the game round corresponding to the result of losing, the reach random number counter C3 obtained at a predetermined timing by referring to the reach table stored in the main ROM 64 is executed when the reach display corresponds to the occurrence of the reach display. .

On the other hand, the decision as to whether or not to perform the advance notice display is made not by the main controller 60 but by the sound emission control device 81 . In this case, the sound emission control device 81 determines that the game round corresponding to one of the jackpot results is more likely to generate the notice display than the game round corresponding to the result of losing, and that the notice display with a low appearance rate is more likely to occur. Lottery processing for advance notice display is executed so as to satisfy at least one of the conditions of being likely to occur. Incidentally, the result of the lottery is reflected when the symbol display device 41 executes an effect for a game cycle.

Here, the probability of occurrence of the ready-to-win display in game rounds resulting in a loss is the same regardless of the setting state of "setting 1" to "setting 6". As a result, it is possible to prevent the setting state of the pachinko machine 10 from giving an advantage or a disadvantage with respect to the probability of occurrence of the ready-to-win display in game rounds resulting in a loss. However, the present invention is not limited to this, and a configuration may be adopted in which the higher the set value, the higher the probability of occurrence of the ready-to-win display in game rounds that result in an error.

Next, the variation type counter CS will be described. The fluctuation type counter CS is configured to be incremented by 1 in order within the range of 0 to 198, for example, and return to "0" after reaching the maximum value. The variation type counter CS is used when the main side CPU 63 determines the display continuation time in the special figure display unit 37a and the display continuation time of the design in the design display device 41. The fluctuation type counter CS is updated once each time a timer interrupt process, which will be described later, is executed, and is repeatedly updated within the remaining time until the next timer interrupt process is executed. Then, the buffer value of the variation type counter CS is acquired when determining the variation pattern at the start of the variation display in the special figure display unit 37a and at the start of variation in the design by the design display device 41.

<Regarding the processing configuration of the main CPU 63>
Next, each process executed by the main CPU 63 to advance the game will be described. The processing of the main CPU 63 can be roughly classified into main processing that is activated upon power-on and timer interrupt processing that is periodically activated (at 4 millisecond cycles in this embodiment).

<Main processing>
First, the main processing will be described with reference to the flowchart of FIG.

In the main process, power-on wait process is first executed (step S101). In the power-on wait process, for example, the process waits without proceeding to the next process until a predetermined wait time (specifically, one second) elapses after the main process is activated. The start of operation and initial setting of the pattern display device 41 are completed during the execution period of the power-on wait process. Thereafter, access to the main RAM 65 is permitted (step S102).

After that, it is determined whether or not the setting key insertion portion 68a is turned on (step S103). If the setting key insertion portion 68a has not been turned ON (step S103: NO), it is determined whether or not the reset button 68c has been pressed (step S104). When the reset button 68c is pressed (step S104: YES), each area of the main RAM 65 except for the area where the setting value information indicating the setting state of the pachinko machine 10 is set in the main RAM 65. "0" is cleared, and initial setting is performed for the "0" cleared area (step S105). In other words, when the supply of operating power to the pachinko machine 10 is started while pressing the reset button 68c without turning ON the setting key inserting portion 68a, the operation of the pachinko machine 10 for the set value information The clearing process of the main RAM 65 is executed while maintaining the state before the power supply is stopped, and the memory area for which the clearing process has been executed is initialized. As a result, other areas of the main RAM 65 can be initialized without changing the set values. In step S105, the various registers of the main CPU 63 are also initialized after being cleared to "0".

If the reset button 68c is not pressed (step S104: NO), it is determined whether or not the power failure flag is set to "1" (step S106). A power failure flag is provided in the main RAM 65, and when the predetermined power failure processing is normally executed when the supply of operating power to the main CPU 63 is stopped, the power failure flag is set to "1". will be set. If the power failure flag is set to "1", it is determined whether or not the checksum calculation result matches the checksum saved when the power was shut off, that is, the validity of the stored data is determined (step S107). . When the process of step S105 is executed, or when an affirmative determination is made in step S107, it is determined whether or not the setting value of the pachinko machine 10 is normal by confirming the main side RAM 65 (step S108). Specifically, if the setting value is any one of "setting 1" to "setting 6", it is determined to be normal, and if it is "0" or 7 or more, it is determined to be abnormal.

When a negative determination is made in any of steps S106 to S108, operation prohibition processing is executed. In the operation prohibition process, after executing an error notification process for notifying the hall manager or the like of the occurrence of an error (step S109), an infinite loop occurs. The operation prohibition process is canceled by executing the all clear process (step S115), which will be described later.

If affirmative determinations are made in all of steps S106 to S108, power-on setting processing is executed (step S110). In the power-on setting process, a predetermined area of the main side RAM 65 is set to an initial value such as initialization of a power failure flag, and a command corresponding to the current game state is transmitted to the sound emission control device 81 .

Although the main CPU 63 is configured to periodically execute timer interrupt processing, generation of timer interrupt processing is prohibited at the stage when the main processing is started. The state in which the occurrence of the timer interrupt processing is prohibited is released at the timing before the processing of step S110 is completed and the processing of step S111 is executed, and execution of the timer interrupt processing is permitted. As a result, when the supply of operating power to the main CPU 63 is started, the power-on setting process of step S110 is completed, and the timer interrupt process is not executed until the stage before the process of step S111 is started. Therefore, the main CPU 63 does not start the process for advancing the game until the relevant situation is reached.

After that, the remaining processing of steps S111 to S114 is performed. In other words, although the main CPU 63 is configured to periodically execute timer interrupt processing, there will be a residual time between one timer interrupt processing and the next timer interrupt processing. Although this remaining time varies according to the processing completion time of each timer interrupt processing, the remaining processing of steps S111 to S114 is repeatedly executed using such irregular time. In this respect, it can be said that the remaining processes of steps S111 to S114 are irregular processes that are executed irregularly.

In the remaining process, first, in step S111, interrupt prohibition is set to prohibit the occurrence of timer interrupt processing. In subsequent step S112, a random number initial value update process for updating the random number initial value counter CINI is executed, and in step S113, a fluctuation counter update process for updating the fluctuation type counter CS is executed. In these updating processes, the current numerical information is read out from the corresponding counter of the main RAM 65, and after executing the process of adding 1 to the read numerical information, the process of overwriting the reading source counter is executed. In this case, they are cleared to "0" when the counter value exceeds the maximum value. After that, in step S114, interrupt permission is set to switch from the state in which the occurrence of timer interrupt processing is prohibited to the state in which it is permitted. If the process of step S114 has been executed, the process returns to step S111, and the processes of steps S111 to S114 are repeated.

On the other hand, if the setting key inserting portion 68a is turned ON (step S103: YES), all clear processing is executed (step S115). In the all-clearing process, all areas of the main RAM 65 including the area in which the setting value information indicating the setting state of the pachinko machine 10 is set in the main RAM 65 are cleared to "0" and cleared to "0". Initialize the area. That is, when an operation for changing the setting state of the pachinko machine 10 is performed, all areas of the main side RAM 65 are cleared to "0" even if the reset button 68c is not pressed, and the clearing is performed. Initialization is performed for the storage area in which the process has been performed. In step S115, the various registers of the main side CPU 63 are also initialized after being cleared to "0". In addition, it is not limited to this, and even if an operation for changing the setting state of the pachinko machine 10 is performed, if the reset button 68c is not pressed, all of the main side RAM 65 A configuration may be adopted in which the all clear process is executed when the reset button 68c is pressed while an operation for changing the setting state of the pachinko machine 10 is being performed without the clear process being executed.

Then, after executing the set value update process in step S116, the process proceeds to step S110. In the set value update process (step S116), first, the set value counter provided in the main RAM 65 is set to "1". The setting value counter is a counter for specifying which setting value the setting state of the pachinko machine 10 is by the main side CPU 63 . By setting "1" to the set value counter, the set value becomes "set 1" regardless of the set value up to that point when the set value update process is executed. After that, display control is performed on the third notification display device 69c so that the number "1" corresponding to "setting 1" is displayed. The manager of the game hall can grasp the current setting state of the pachinko machine 10 by confirming the third notification display device 69c when changing the setting value. After that, update execution processing is executed.

In the update execution process, it is determined whether or not the update button 68b has been pressed once on the condition that the setting key insertion portion 68a has not been turned off. adds 1 to the value of the set value counter of the main side RAM 65 . If the value of the set value counter after adding 1 exceeds "6", the set value counter is set to "1". As a result, each time the update button 68b is pressed once, the set value is updated to the value one step higher. going back. In the update execution process, when the value of the set value counter is updated, the display of the third notification display device 69c is controlled so that the number corresponding to the value of the set value counter of the main RAM 65 is displayed. By checking the third notification display device 69c, the manager of the game hall can grasp the setting state of the pachinko machine 10 after the update button 68b is pressed. In the setting value update process (step S116), the update execution process is repeatedly executed until the setting key insertion portion 68a is turned off. Then, when the setting key insertion portion 68a is turned off, the display of the setting values on the third notification display device 69c is ended, and this setting value updating process is ended.

<Timer interrupt processing>
Next, timer interrupt processing will be described with reference to the flowchart of FIG. Timer interrupt processing is executed periodically (for example, every 4 milliseconds).

In the timer interrupt process, first, a power failure information storage process is executed (step S201). In the power failure information storage process, it is monitored whether or not a power failure signal corresponding to the occurrence of a power failure is received from the power failure monitoring board 67, and when the occurrence of a power failure is specified, the power failure process is executed and then an infinite loop is performed. Become. In the power failure processing, the power failure flag of the main RAM 65 is set to "1", the checksum is calculated, and the calculated checksum is saved.

After that, random number update processing for lottery is executed (step S202). In the lottery random number update process, the hit random number counter C1, the jackpot type counter C2, the reach random number counter C3, and the general electric accessory release counter C4 are updated. Specifically, the current numerical information is sequentially read out from the hit random number counter C1, the jackpot type counter C2, the reach random number counter C3, and the general electric role release counter C4, and the process of adding 1 to each of the read numerical information was executed. Afterwards, a process of overwriting the read source counter is executed. In this case, they are cleared to "0" when the counter value exceeds the maximum value. After that, in step S203, random number initial value update processing is executed in the same manner as in step S112, and in step S204, variation counter update processing is executed in the same manner as in step S113.

After that, fraud detection processing is executed to monitor whether or not a predetermined event set as a monitoring target for fraud has occurred (step S205). In the fraud detection process, the game stop flag provided in the main side RAM 65 is set to "1" by monitoring the occurrence of a plurality of types of events and confirming that a predetermined event has occurred. In the subsequent step S206, it is determined whether or not the progress of the game is stopped by determining whether or not the game stop flag is set to "1". When a negative determination is made in step S206, the processes after step S207 are executed.

In step S207, port output processing is executed. In the port output process, when the output information has been set in the previous timer interrupt process, a process for outputting corresponding to the output information to the various driving units 32b and 34b is executed. For example, when the information to switch the special electric prize winning device 32 to the open state is set, the output of the drive signal to the special electric drive unit 32b is started, and when the information to switch to the closed state is set stops the output of the drive signal. In addition, when information is set to switch the general electric accessory 34a of the second operation port 34 to the open state, the output of the drive signal to the general electric drive unit 34b is started to switch to the closed state. When the information is set, the output of the drive signal is stopped.

After that, read processing is executed (step S208). In the reading process, signals other than the power failure signal and the winning signal are read, and the read information is stored for use in future processing.

After that, ball entry detection processing is executed (step S209). In the ball-entering detection process, signals received from the ball-entering detection sensors 42a to 49a are read, and based on the reading results, the out port 24a, the general prize-winning port 31, the special electric prize-winning device 32, and the first operation port 33 , the presence or absence of the ball entering the second operating port 34 and the through gate 35 is specified.

After that, a timer update process is executed to collectively update the numerical information of a plurality of types of timer counters provided in the main RAM 65 (step S210). In this case, the timer counters that are updated by subtracting the stored numerical information are collectively handled. may be configured.

After that, a launch control process for controlling the launch of game balls is executed (step S211). In a situation where the shooting operation to the shooting operation device 28 is continued, one game ball is shot in 0.6 seconds, which is a predetermined shooting cycle. In the following step S212, as an input state monitoring process, based on the information read in the reading process of step S208, disconnection of each ball detection sensor 42a to 49a is checked, and the opening of the gaming machine main body 12 and the front door frame 14 is checked. I do.

After that, a special figure special electric control process for performing execution control of the game round and execution control of the opening and closing execution mode is executed (step S213). Special figure special electric control processing is explained in detail later.

After that, the general map general electric control process is executed (step S214). In the general map general electric control process, when the prize to the through gate 35 is generated, the processing for acquiring the reservation information on the general map side is executed, and when the reservation information on the general map side is stored Then, open determination is performed for the reservation information, and processing for performing the production for the normal map is performed with the open determination as a trigger. Moreover, based on the result of open determination, the process which opens and closes the universal electrical accessory 34a of the 2nd operation|movement opening 34 is performed. In this case, if the support mode is the low-frequency support mode, corresponding processing is executed, and if the support mode is the high-frequency support mode, corresponding processing is executed. Further, when the opening/closing execution mode is set, the low-frequency support mode is set even if the immediately preceding support mode is the high-frequency support mode.

In the following step S215, based on the processing result of step S213 and step S214 immediately before, while setting the output information for reflecting the increase or decrease number of pending information pertaining to the special figure display unit 37a to the special figure pending display unit 37b , Set the output information for reflecting the increase/decrease number of the reservation information related to the normal map display unit 38a to the normal map reservation display unit 38b. In addition, in step S215, based on the processing results of step S213 and step S214 immediately before, along with setting the output information for updating the display content of the special figure display unit 37a, the display content of the normal figure display unit 38a Set the output information for updating.

After that, the content of the command and signal received from the payout control device 77 is confirmed, and payout state reception processing for performing processing corresponding to the confirmation result is executed (step S216). Also, a payout output process for setting the prize ball command as an output target is executed (step S217). Also, an external information setting process is executed for controlling the start and end of the output of the external signal according to the processing results of the various processes executed in the current timer interrupt process (step S218). Thereafter, a management process for displaying information corresponding to the ball entry result of the game ball in the game area PA on the first to third notification display devices 69a to 69c is executed (step S219), and this timer interrupt End the process.

<Special special train control processing>
Next, the special figure special electric control process of step S213 is demonstrated, referring the flowchart of FIG.

First, a hold information acquisition process is executed (step S301). In the reservation information acquisition process, it is determined whether or not the winning to the first operation port 33 or the second operation port 34 has occurred, and if the winning has occurred, the number of reservations in the reservation storage area 65a is the upper limit It is determined whether or not it is less than a value ("4" in this embodiment). If the number of reservations is less than the upper limit, the number of reservations is incremented by 1, and the numerical information of the winning random number counter C1, the jackpot type counter C2 and the reach random number counter C3 updated in the previous step S202 is used for holding. Store in the first reserved area among the empty reserved areas RE1 to RE4 of the area RE. It should be noted that when the winning to the first operation port 33 and the second operation port 34 occurs at the same time, the processing for acquiring the above-described pending information is executed within the range of executing the processing for acquiring the pending information once. Run multiple times. Also, when the hold information is newly acquired, a command at the time of acquisition corresponding to it is transmitted to the sound emission control device 81 . When receiving the command, the sound emission control device 81 updates the display of the image indicating the number of pieces of pending information on the pattern display device 41 to the display content corresponding to the increase of the pending information.

After that, the information of the special special electric counter provided in the main RAM 65 is read (step S302), and the special special electric address table provided in the main ROM 64 is read (step S303). Then, the start address corresponding to the information of the special special electric counter is acquired from the special special electric address table (step S304), and jumps to the process indicated by the acquired start address among the processes of steps S306 to S312 (step S305 ). The special special electric counter is a counter for the main side CPU 63 to grasp which of the various processes of steps S306 to S312 should be executed, and the special special electric address table is a counter for the special special electric counter. The start address of the program for executing the processing of steps S306 to S312 is set in association with the numerical information.

In step S306, special figure fluctuation start processing is executed. FIG. 24 is a flow chart showing a special figure variation start process.

In the special figure fluctuation start process, data setting process is executed on the condition that the number of pieces of reservation information stored in the reservation area RE is 1 or more (step S401: YES) (step S402). In the data setting process, first, the number of reservations is decremented by 1, and the data stored in the first reservation area RE1 of the reservation area RE is moved to the execution area AE. After that, a process of shifting the data stored in each of the reservation areas RE1 to RE4 of the reservation area RE is executed. This data shift process is a process of sequentially shifting the data stored in the first reservation area RE1 to the fourth reservation area RE4 to the lower area side. , the third reservation area RE3→the second reservation area RE2, the fourth reservation area RE4→the third reservation area RE3, etc. After that, the fourth reservation area RE4 is cleared to "0". At this time, a shift command is transmitted to the sound emission control device 81 for recognizing that the data in the reserved area has been shifted. When receiving the command, the sound emission control device 81 updates the display of the image indicating the number of pieces of pending information on the pattern display device 41 to the display content corresponding to the decrease of the pending information.

After executing the data setting process, the success/failure table is read from the success/failure table storage area 64a of the main ROM 64 (step S403). As already described, the right/wrong table storage area 64a stores a low right/wrong right/wrong table for setting 1 to a low right/wrong right/wrong table for setting 6 and a high right/wrong right/wrong table. In step S403, the current winning/failing lottery mode is grasped by first reading information indicating the winning/failure lottery mode from the main RAM 65 . If the high-probability mode is selected, the high-probability table is read from the yes-no table storage area 64a. On the other hand, when it is in the low probability mode, the setting state of the pachinko machine 10 is grasped by reading the value of the setting value counter of the main side RAM65. Then, the low-probability table corresponding to the comprehended set value is read out from the validity table storage area 64a.

Thereafter, the success/failure determination process is executed with reference to the success/failure table read in step S403 (step S404). In the success/failure determination process, the information for success/failure determination among the information stored in the execution area AE, that is, the numerical value information related to the winning random number counter C1 matches the jackpot numerical value information set in the success/failure table read out in step S403. Determine whether or not

When the result of the success/failure determination process is a jackpot winning result (step S405: YES), a distribution determination process is executed (step S406). In the distribution determination process, out of the information stored in the execution area AE, information for distribution determination, that is, numerical information related to the jackpot type counter C2 is read. Then, with reference to the distribution table provided in the distribution table storage area 64b of the main ROM 64, it is specified which jackpot result the numerical information related to the read jackpot type counter C2 corresponds to. Specifically, it specifies which one of the low probability jackpot result, the low prize winning high probability jackpot result, and the maximum profit jackpot result corresponds.

After that, a stop result setting process for the jackpot result is executed (step S407). Specifically, the information on the form of the pattern to be finally stopped and displayed on the special figure display unit 37a in the game round related to the start of this fluctuation is obtained from the stop result table for the jackpot result stored in advance in the main side ROM 64. specified, and writes the specified information in the main side RAM 65 . In the stop result table for the jackpot result, information on the form of the pattern stopped and displayed on the special figure display section 37a is set differently for each type of jackpot result.

After that, a flag setting process corresponding to the distribution determination result is executed (step S408). Specifically, the main RAM 65 is provided with flags corresponding to the types of each jackpot result, and in step S408, among the flags corresponding to each jackpot result type, A flag corresponding to the result is set to "1".

On the other hand, if it is determined in step S405 that the winning result is not a jackpot winning result, a stop result setting process for a losing result is executed (step S409). Specifically, the information on the form of the pattern to be finally stopped and displayed on the special figure display unit 37a in the game round related to the start of this fluctuation is obtained from the stop result table for the deviation result stored in advance in the main side ROM 64 specified, and writes the specified information in the main side RAM 65 . The information on the form of the pattern selected in this case is different from the information on the form of the pattern selected in the case of the jackpot result.

After executing the processing of either step S408 or step S409, the process of grasping the duration of the game round is executed (step S410). In this process, the numerical information of the fluctuation type counter CS is obtained. Also, it is determined whether or not the ready-to-win display is generated on the symbol display device 41 in the current game round. Specifically, when the game round related to the start of this fluctuation is the result of the low-probability jackpot or the result of the maximum profit jackpot, it is determined that the ready-to-win display occurs. In addition, when neither of the jackpot results is obtained and the numerical information relating to the ready-to-win random number counter C3 stored in the execution area AE is numerical information corresponding to the occurrence of ready-to-win, it is determined that a ready-to-win display occurs.

When it is determined that the ready-to-win display occurs, the continuous period table for ready-to-win occurrence generation stored in the main ROM 64 is referred to, and the duration of the game cycle corresponding to the numerical information of the current variation type counter CS is acquired. . On the other hand, when it is determined that the ready-to-win display does not occur, the continuous period table for no-to-win occurrence stored in the main ROM 64 is referred to, and the continuation of the game round corresponding to the numerical information of the current fluctuation type counter CS. Get duration. Incidentally, the duration of game rounds that can be acquired by referring to the non-reach duration table is different from the duration of game rounds that can be acquired by referring to the duration table for reach occurrence.

It should be noted that the continuation period of the game round when the ready-to-win situation does not occur is set so that the continuation period of the game round becomes shorter as the number of reservation information stored in the reservation area RE increases. Also, in the situation where the support mode is the high frequency support mode, compared to the case where the number of pending information is the same as in the situation where the support mode is the low frequency support mode, a shorter duration of game rounds is selected. A non-reach duration table is set. However, the present invention is not limited to this, and a configuration may be adopted in which the duration of the game cycle does not change according to the number of pieces of pending information or the support mode, or the above relationship may be reversed. Furthermore, the above configuration may be applied to the continuation period of the game cycle when reach occurs. In addition, in the case of various jackpot results, the duration table may be set individually for each of the case of the loss reach and the case of the loss result of no reach. In this case, the continuation period of the game round is distributed according to each game result.

After that, the information of the duration of the game round acquired in step S410 is set in the special figure special electric timer counter provided in the main side RAM 65 (step S411). The update of the numerical information set in the special special electric timer counter is executed in the timer update process (step S210). By the way, as an effect for the game cycle, the variable display of the pattern in the special figure display unit 37a and the variable display of the pattern in the pattern display device 41 are performed. is displayed (in the symbol display device 41, a predetermined combination of symbols is waiting on the activated line), the final stop display is performed for the final stop period (for example, 0.5 seconds). In this case, the duration of the game round acquired in step S410 is the total time for one game round.

After that, the variation command and the type command are transmitted to the sound emission control device 81 (step S412). The variation command includes information on the duration of game rounds. Here, as described above, the duration of game rounds obtained by referring to the non-reach duration table is different from the duration of game rounds obtained by referring to the duration table for reach occurrence. Even if the variation command does not include information on the presence or absence of the occurrence of reach, the sound emission control device 81 can specify the presence or absence of the occurrence of reach from the information on the duration of the game cycle. In this respect, it can be said that the variation command includes information indicating whether or not reach occurs. Note that the variation command may include information that directly indicates the presence or absence of reach occurrence. Also, the type command includes information on the game result.

When the sound emission control device 81 receives the variation command and the type command from the main side CPU 63, the decoration substrates 56 and 57, the speaker section 53 and the pattern display device 41 execute an effect for the game round. In this case, the effect for the game round is performed in a mode corresponding to the contents of the variation command and the type command. In addition, the pattern display device 41 performs a variable display of symbols as an effect for the game cycle, and when the effect for the game cycle ends, a combination of symbols corresponding to the results of the winning/failure determination process and the distribution determination process is displayed. Stop is displayed.

After that, the variable display of the design in the special figure display section 37a is started (step S413). Then, 1 is added to the special figure special electric counter (step S414), and this special figure fluctuation start process is terminated. Numerical information of the special figure special electric counter when the special figure fluctuation start processing is executed is "0". By adding "1" in step S414, the numerical information of the special special electric counter becomes "1".

Returning to the description of the special figure special electric control processing (FIG. 23), in step S307, the special figure fluctuation processing is executed. In the special figure fluctuation process, it is determined whether or not it is the timing before the final stop display during the duration of the game round, and if it is before the final stop display, the display mode of the pattern in the special figure display section 37a is regulated. Executes processing to change the When it is time to display the final stop, by adding 1 to the numerical information of the special figure special electric counter, the numerical information of the counter is changed from the one corresponding to the special figure fluctuation processing to the special figure fixed processing. update to something. In this embodiment, the main CPU 63 does not send the final stop command to the sound emission control device 81 .

In step S308, processing during special figure determination is executed. In the processing during special figure determination, the display mode of the pattern in the special figure display section 37a is set to the display mode corresponding to the lottery result of the current game round. Also, in the special figure finalizing process, it is determined whether or not the final stop period has elapsed, and when the period has elapsed, it is determined whether or not the transition to the opening/closing execution mode occurs. When the transition to the opening/closing execution mode does not occur, the numerical information of the special special electric counter is cleared to "0". When the transition to the opening and closing execution mode occurs, by adding 1 to the numerical information of the special special electric counter, the numerical information of the counter is changed from the one corresponding to the special electric confirmation processing to the one corresponding to the special electric start processing. Update.

In step S309, special electric start processing is executed. In the special electric start process, if the process for starting the opening period in the current opening/closing execution mode has not yet been executed, the opening period setting process is executed. Also, an opening command is transmitted to the sound emission control device 81 . Upon receiving the opening command, the sound emission control device 81 causes the decoration boards 56 and 57, the speaker section 53 and the pattern display device 41 to perform the opening effect. When the opening period has passed, a start process for starting the first round game is executed. In the start process, the special electric prize winning device 32 is set in an open state, and conditions for ending the round game are set. When setting the end condition, the upper limit duration period for continuing the special electric prize winning device 32 in the open state in the first round game of this time is set, and the special electric prize winning device 32 can win in the first round game of this time. The upper limit number of game balls is set in a winning number counter provided in the main side RAM 65. - 特許庁

In step S310, special electric open processing is executed. In the special electric open process, it is determined whether or not the end condition of the round game is established. When the termination condition is established, the special electric prize winning device 32 is closed. Then, if the round game ended this time is not the last round game to be executed, by adding 1 to the numerical information of the special special electric counter, the numerical information of the counter is changed from the one corresponding to the special electric open processing to the special electric closed processing. , and if the round game that ended this time is the last round game, by adding 2 to the numerical information of the special special electric counter, the numerical information of the counter corresponds to the special electric open processing. Update from one to one corresponding to the special electric end processing.

In step S311, processing during special electric closing is executed. In the special electric closing process, it is determined whether or not the interval period between round games has elapsed. The interval period is set when the previous round game ends. When the interval period has passed, the special electric prize winning device 32 is put into an open state, and conditions for ending the round game are set. Then, by subtracting 1 from the numerical value information of the special special electric counter, the numerical value information of the counter is updated from the one corresponding to the special electric closed processing to the one corresponding to the special electric open processing.

In step S312, special electric end processing is executed. In the special electric end processing, if the processing for starting the ending period in the current opening/closing execution mode has not yet been executed, the ending period (for example, 5 seconds) is set and the ending command is transmitted to the sound emission control device 81. . By receiving the ending command, the sound emission control device 81 causes the decoration substrates 56 and 57, the speaker section 53 and the pattern display device 41 to perform the ending effect. When the ending period elapses, each of the success/failure lottery mode and the support mode after the end of the opening/closing execution mode is set to a mode corresponding to the result of the big win that triggered the start of the opening/closing execution mode this time.

According to this embodiment detailed above, the following excellent effects are obtained.

In the first decoration board 56, the same number (specifically, two) of wiring patterns 172a to 172d are led out from the pair of pads 171a and 171b corresponding to the pair of electrodes 85a and 85b of the bypass capacitor 85. As shown in FIG. Of the four sides of the first pad 171a, the direction in which the side from which the first wiring pattern 172a is drawn when viewed from the center of the first pad 171a (rightward direction) is It is the same direction as the direction (rightward direction) in which the side from which the third wiring pattern 172c is drawn exists when viewed from the center of the second pad 171b. Further, the direction (leftward direction) in which the side from which the second wiring pattern 172b is drawn out when viewed from the center of the first pad 171a exists among the four sides of the first pad 171a is the four sides of the second pad 171b. It is the same direction as the direction (leftward direction) in which the side from which the fourth wiring pattern 172d is drawn exists when viewed from the center of the second pad 171b. As a result, in the initial heating stage of the reflow process, it is possible to prevent a difference in temperature distribution between the pair of pads 171a and 171b, and to prevent the bypass capacitor 85 from rotating and from standing up.

The bypass capacitor 85 is a small chip part with a longitudinal dimension of approximately 0.6 mm and a lateral dimension and a thickness dimension of approximately 0.3 mm. Since the longitudinal dimension of the decoupling capacitor 85 along the plane perpendicular to the thickness direction is 0.7 mm or less, the area occupied by the decoupling capacitor 85 on the first decorative substrate 56 can be reduced. By setting the longitudinal dimension of the bypass capacitor 85 to be 0.4 mm or more, the mechanical strength of the connection between the bypass capacitor 85 and the first decoration board 56 and the mechanical strength of the bypass capacitor 85 itself are increased, and the connection is improved. While being able to reduce the possibility that a part will be damaged, the possibility that the bypass capacitor 85 itself will be damaged can be reduced. Moreover, since the dimension of the bypass capacitor 85 in the longitudinal direction is 0.4 mm or more, it is possible to improve the confirmation accuracy when visually confirming the presence or absence of mounting leakage of the bypass capacitor 85 .

In a configuration in which the same number (specifically, one) of wiring patterns 181a and 181b are led out from a pair of pads 176a and 176b corresponding to a pair of electrodes 87a and 87b of the small chip resistor 87, the first pad 176a When viewed from the center of the first pad 176a, the direction (right direction) in which the side from which the first wiring pattern 181a is drawn out of the four sides of the second pad 176b is It is the same direction as the direction (right direction) in which the side from which the second wiring pattern 181b is drawn exists when viewed from the center of the . As a result, it is possible to prevent a difference in temperature distribution between the pair of pads 176a and 176b in the initial stage of heating in the reflow process, and to prevent the small chip resistor 87 from rotating and standing up.

Similar to the bypass capacitor 85, the small chip resistor 87 has a longitudinal dimension along a plane perpendicular to the thickness direction of the component (longitudinal dimension of the small chip resistor 87) of 0.1 mm or more and 0.1 mm or more. It is a small chip component with a size of 9 mm or less. The small chip resistor 87 is a small chip component with a longitudinal dimension of approximately 0.6 mm and a lateral dimension and a thickness dimension of approximately 0.3 mm. Since the longitudinal dimension of the small chip resistor 87 is 0.7 mm or less, the area occupied by the small chip resistor 87 on the first decorative substrate 56 can be reduced. Since the longitudinal dimension of the small chip resistor 87 is 0.4 mm or more, the mechanical strength at the connection point between the small chip resistor 87 and the first decorative substrate 56 and the mechanical strength of the small chip resistor 87 itself are improved. It is possible to increase the strength, reduce the possibility of damage to the connection portion, and reduce the possibility of damage to the small chip resistor 87 itself. Moreover, since the dimension of the small chip resistor 87 in the longitudinal direction is 0.4 mm or more, it is possible to improve the confirmation accuracy when visually checking whether or not there is a mounting omission of the small chip resistor 87 .

A first pad 171a corresponding to the first electrode 85a of the bypass capacitor 85 is electrically connected to the GND plane layer 93 having a larger area than the first pad 171a through a first wiring pattern 172a, and the bypass capacitor A second pad 171b corresponding to the second electrode 85b of 85 is electrically connected to the power plane layer 94 having a larger area than the second pad 171b through a third wiring pattern 172c. Of the four sides of the first pad 171a, the direction in which the side from which the first wiring pattern 172a is drawn when viewed from the center of the first pad 171a (rightward direction) is It is the same direction as the direction (rightward direction) in which the side from which the third wiring pattern 172c is drawn exists when viewed from the center of the second pad 171b. This reduces the possibility of a difference in temperature distribution between the pair of pads 171a and 171b in the initial heating stage of the reflow process.

The width of the first wiring pattern 172a drawn from the first pad 171a corresponding to the first electrode 85a of the bypass capacitor 85 is the same as the width of the third wiring pattern drawn from the second pad 171b corresponding to the second electrode 85b. It is substantially the same as the width dimension of 172c. Therefore, compared to a configuration in which these wiring patterns 172a and 172c have different width dimensions, the possibility of causing a difference in temperature distribution between the pair of pads 171a and 171b in the initial stage of heating in the reflow process is reduced. Further, the width dimension of the second wiring pattern 172b drawn out from the first pad 171a is substantially the same as the width dimension of the fourth wiring pattern 172d drawn out from the second pad 171b. Therefore, compared to a configuration in which these wiring patterns 172b and 172d have different width dimensions, the possibility of a difference in temperature distribution occurring in the pair of pads 171a and 171b in the initial stage of heating in the reflow process is reduced.

The width dimension of the first wiring pattern 181a drawn from the first pad 176a corresponding to the first electrode 87a of the small chip resistor 87 is the second wiring pattern drawn from the second pad 176b corresponding to the second electrode 87b. It is substantially the same as the width dimension of the wiring pattern 181 . Therefore, in comparison with the configuration in which the wiring patterns 181a and 181b drawn out from the pads 176a and 176b have different widths, there is a difference in the temperature distribution within the pair of pads 176a and 176b in the initial heating stage of the reflow process. less likely to occur.

Since the number of wiring patterns 172a to 172d drawn from the pair of pads 171a and 171b corresponding to the pair of electrodes 85a and 85b of the bypass capacitor 85 and the drawing positions are shared, the molten solder on the first pad 171a The force acting on the first electrode 85a of the bypass capacitor 85 due to the surface tension of the second pad 171b and the force acting on the second electrode 85b of the bypass capacitor 85 due to the surface tension of the molten solder on the second pad 171b can be balanced. Therefore, even if only the left side of the solder paste in the pair of pads 171a and 171b melts first, the bypass capacitor 85 can be moved in parallel to prevent the bypass capacitor 85 from rotating. . As a result, it is possible to suppress the reduction in the connection area due to the solder fillet 173a between the first pad 171a and the first electrode 85a, and the reduction in the connection area due to the solder fillet 173b between the second pad 171b and the second electrode 85b. can reduce the extent of

Since the number of wiring patterns 181a and 181b drawn from the pair of pads 176a and 176b corresponding to the pair of electrodes 87a and 87b of the small chip resistor 87 and the drawing positions are common, The force acting on the first electrode 87a of the small chip resistor 87 due to the surface tension of the molten solder and the force acting on the second electrode 87b of the small chip resistor 87 due to the surface tension of the molten solder on the second pad 176b are can be balanced. Therefore, even if only the left portion of the solder paste of the pair of first pad 176a and second pad 176b melts first, the small chip resistor 87 is moved in parallel, and the small chip resistor 87 is moved in parallel. rotation can be prevented. As a result, it is possible to suppress the reduction in the connection area due to the solder fillet 177a between the first pad 176a and the first electrode 87a, and the reduction in the connection area due to the solder fillet 177b between the second pad 176b and the second electrode 87b. can reduce the extent of

The small chip components (the bypass capacitor 85 and the small chip resistor 87) are mounted on the first decoration board 56 such that the longitudinal direction of the small chip component is parallel to the first direction DR1. The dimension of the first decoration substrate 56 in the first direction DR1 is larger than the dimension of the first decoration substrate 56 in the second direction DR2 orthogonal to the first direction DR1. Assuming that the small chip component is mounted on the first decoration substrate 56 so that the longitudinal direction of the small chip component is orthogonal to the first direction DR1, the boundary line extending in the first direction DR1 is used as a base point for the first decoration. When a force that bends the substrate 56 acts on the first decoration substrate 56, there is a possibility that stress will act on the connection portion between the small chip component and the first decoration substrate 56 to damage the connection portion. In addition, there is a risk that a stress that damages the small chip component will act on the small chip component itself. On the other hand, since the small chip component is mounted on the first decoration substrate 56 so that the longitudinal direction of the small chip component is orthogonal to the first direction DR1, the small chip component and the first decoration are mounted. The maximum value of stress that can act on the connecting portion with the substrate 56 is reduced, and the maximum value of stress that can act on the small chip component is also reduced. Therefore, damage to the connecting portion between the small chip component and the first decorative substrate 56 is prevented, and damage to the small chip component itself is also prevented.

The small chip parts (the bypass capacitor 97 and the small chip resistor 101) are mounted on the second decoration board 57 so that the longitudinal direction of the small chip parts is parallel to the longitudinal direction LD. The dimension of the second decoration substrate 57 in the long axis direction LD is larger than the dimension of the second decoration substrate 57 in the short axis direction SD perpendicular to the long axis direction LD. Assuming that the small chip component is mounted on the second decoration substrate 57 so that the longitudinal direction of the small chip component is perpendicular to the longitudinal direction LD, the boundary line extending in the longitudinal direction LD is used as a base point for the second decoration. When a force that bends the substrate 57 acts on the second decoration substrate 57, there is a possibility that stress that damages the connection portion will act on the connection portion between the small chip component and the second decoration substrate 57. In addition, there is a risk that a stress that damages the small chip component will act on the small chip component itself. On the other hand, the small chip component is mounted on the second decoration substrate 57 so that the longitudinal direction of the small chip component is orthogonal to the long axis direction LD. The maximum value of stress that can act on the connecting portion with the substrate 57 is reduced, and the maximum value of stress that can act on the small chip component is also reduced. Therefore, damage to the connecting portion between the small chip component and the second decorative substrate 57 is prevented, and damage to the small chip component itself is also prevented.

Electrodes 85a and 85b of bypass capacitor 85 are fixed to pads 171a and 171b by solder fillets 173a and 173b. Pads 171a, 171b and wiring patterns 172a-172d are integrally formed by etching a copper foil plate. The wiring patterns 172a to 172d drawn out from the pads 171a and 171b extend in a direction perpendicular to the longitudinal direction of the decoupling capacitor 85 (lateral direction) or in a direction substantially perpendicular to the longitudinal direction. If the wiring patterns 172a to 172d drawn out from the pads 171a and 171b extend in a direction parallel to the longitudinal direction of the decoupling capacitor 85, a boundary line perpendicular to the long side direction of the decoupling capacitor 85 or a boundary line substantially perpendicular to the long side direction of the decoupling capacitor 85 When the first decoration substrate 56 is distorted in the direction of bending the first decoration substrate 56 with the line as the base point, the stress that damages the connection portion between the bypass capacitor 85 and the first decoration substrate 56 is applied. may act on the bypass capacitor 85 itself, and stress may act on the bypass capacitor 85 itself to damage the bypass capacitor 85 . On the other hand, the wiring patterns 172a to 172d drawn out from the pads 171a and 171b extend in a direction orthogonal or substantially orthogonal to the longitudinal direction of the decoupling capacitor 85. It is possible to reduce the maximum value of stress that can act on the connecting portion between the bypass capacitor 85 and the first decoration substrate 56 when distortion occurs, and to reduce the maximum value of stress that can act on the bypass capacitor 85 itself. be able to.

Electrodes 87a, 87b of the small chip resistor 87 are fixed to pads 176a, 176b by solder fillets 177a, 177b. Pads 176a, 176b and wiring patterns 181a, 181b are integrally formed by etching a copper foil plate. The wiring patterns 181a and 181b drawn out from the pads 176a and 176b extend in a direction (lateral direction) perpendicular to the longitudinal direction of the small chip resistor 87 or a direction substantially perpendicular thereto. If the wiring patterns 181a and 181b drawn out from the pads 176a and 176b extend in a direction parallel to the longitudinal direction of the small chip resistor 87, a line perpendicular to the long side direction of the small chip resistor 87 or an approximately When a bending stress that bends the first decoration substrate 56 with the boundary of the orthogonal line acts on the first decoration substrate 56, the connection portion between the small chip resistor 87 and the first decoration substrate 56 is bent. In addition, there is a risk that stress that damages the small chip resistor 87 will act on the small chip resistor 87 itself. On the other hand, the wiring patterns 181a and 181b drawn out from the pads 176a and 176b are configured to extend in a direction orthogonal or substantially orthogonal to the longitudinal direction of the small chip resistor 87. 56, the maximum value of the stress that can act on the connecting portion between the small chip resistor 87 and the first decorative substrate 56 can be reduced, and the stress that can act on the small chip resistor 87 itself. can be reduced.

A first pad 176a electrically connected to the first electrode 87a of the small chip resistor 87 is electrically connected to the second electrode 142b of the LED chip 142 via the first wiring pattern 181a. It is electrically connected to the pad 178b (see FIG. 8(c)). Also, the second pad 176b electrically connected to the second electrode 87b of the small chip resistor 87 is connected to the eighth output terminal 162 of the LED driver 126 (FIG. 8(a)) via the second wiring pattern 181b. (FIG. 11) is electrically connected to a pad (not shown) that is electrically connected. A portion of the pad (not shown) corresponding to the eighth output terminal 162, to which the second wiring pattern 181b is connected, extends in the direction in which the second wiring pattern 181b is pulled out from the second pad 176b (FIGS. 8A and 8C). 8(a) and 8(c) (the second direction DR2 in FIGS. 8A and 8C), the second wiring from the second pad 176b is based on the second pad 176b It exists in the direction opposite to the drawing direction of the pattern 181b. The second wiring pattern 181b is pulled out from the second pad 176b in the same direction (right direction) as the direction in which the first wiring pattern 181a is pulled out from the first pad 176a. ), the second pad 176b is routed in the opposite direction with respect to the second pad 176b. A portion where the second wiring pattern 181b exists in a direction opposite to the direction in which the second wiring pattern 181b is pulled out from the second pad 176b with respect to the second pad 176b when viewed in the direction of one axis (second direction DR2) Also in the configuration in which the second wiring pattern 181b is connected to the connection destination by , the second wiring pattern 181b is drawn out from the second pad 176b in the same direction as the first wiring pattern 181a is drawn out from the first pad 176a. This can reduce the possibility of a difference in temperature distribution between the pair of first pad 176a and second pad 176b in the initial stage of heating in the reflow process.

A pair of pads corresponding to a pair of electrodes of the small chip component have the same shape and size. Therefore, the amount of solder paste applied on the pair of pads can be made uniform in the solder application process, and the amount of melted solder generated on the pair of pads can be made uniform. As a result, the surface tension of the melted solder on the first pad acts on the first electrode of the small chip component, and the surface tension of the melted solder on the second pad acts on the second electrode of the small chip component. can be balanced. Therefore, it is possible to prevent rotation of the small chip component and standing up of the small chip component.

The bypass capacitor 85 is mounted on the first decoration board 56 such that the longitudinal direction of the bypass capacitor 85 is parallel to the first direction DR1. A pair of pads 171a and 171b corresponding to a pair of electrodes 85a and 85b of the bypass capacitor 85 are spaced apart in the longitudinal direction of the bypass capacitor 85. As shown in FIG. Also, the small chip resistor 87 is mounted on the first decoration substrate 56 so that the longitudinal direction of the small chip resistor 87 is parallel to the first direction DR1. A pair of pads 176a and 176b corresponding to a pair of electrodes 87a and 87b of the small chip resistor 87 are spaced apart in the longitudinal direction of the small chip resistor 87. As shown in FIG. Thus, in a plurality of small chip parts (the bypass capacitor 85 and the small chip resistor 87), the pair of pads 176a and 176b have the same separation direction. Therefore, in the reflow process, the pair of pads 171a and 171a corresponding to the pair of electrodes 85a and 85b of the decoupling capacitor 85 are transferred by conveying the first decoration substrate 56 in a direction orthogonal or substantially orthogonal to the common separation direction. The solder paste applied on 171b can be heated at the same timing, and the solder paste applied on the pair of pads 176a and 176b corresponding to the pair of electrodes 87a and 87b of the small chip resistor 87 can be aligned. It is possible to align the timing at which the heating of the solder paste that has been applied is started. As a result, it is possible to prevent the rotation of a plurality of small chip components and the occurrence of standing chips.

In a configuration in which small chip components (bypass capacitor 85 and small chip resistor 87) are concentrated on the first mounting surface 84 of the first decoration board 56, the connectors 111 and 112 are arranged on the second mounting surface of the first decoration board 56. 95 only. On the first mounting surface 84, the small chip components are located in areas 203 and 204 corresponding to the back side of the connectors (areas of the first mounting surface 84 corresponding to the areas where the connectors 111 and 112 are mounted on the second mounting surface 95 and their peripheral areas). ) are arranged to avoid As a result, it is possible to reduce the maximum value of the tensile stress that can act on the connecting portion between the small chip component and the first decorative substrate 56 when the harness is attached to the connectors 111 and 112, and also to reduce the tensile stress acting on the small chip component itself. The maximum possible tensile stress can be reduced. In addition, it is possible to reduce the maximum value of the compressive stress that can act on the connecting portion between the small chip component and the first decorative substrate 56 when the harness is pulled out from the connectors 111 and 112, and also can act on the small chip component itself. The maximum compressive stress can be reduced.

In the first decoration board 56, the small chip components (the bypass capacitor 85 and the small chip resistors 87, 143-149 (FIG. 11)) are arranged at a distance of 5 mm or more from the outer edges of the fixed through-holes 56d-56g. there is No small chip components are mounted in the through-hole peripheral regions 211a to 211d. By arranging the small chip components at a distance of 5 mm or more from the outer edge of the fixing through holes 56d to 56g, when the first decorative board 56 is screwed to the front door frame 14, the second part that may occur near the fixing through holes 56d to 56g is reduced. It is possible to prevent the connection point between the small chip part and the first decoration board 56 from being damaged due to the distortion of the first decoration board 56, and also prevent the small chip part itself from being damaged.

No small chip component is mounted on the LED back side corresponding area 201 on the second mounting surface 95 of the first decorative substrate 56 . The LED back side corresponding area 201 is the area of the second mounting surface 95 located on the back side of the area where the LED chips 127 to 142 are mounted on the first mounting surface 84 and the distance from the outer edge of the area of the second mounting surface 95. is an area within 1 mm. Small chip components are not mounted on the second mounting surface 95 located behind the area on the first mounting surface 84 where the LED chips 127 to 142 are mounted. The effect of thermal stress that may act on the first decorative substrate 56 due to heat generation on small chip components is reduced. Since the small chip parts are mounted so as to avoid the LED back side corresponding area 201, the light emission effect on the first decoration board 56 is repeatedly executed, resulting in the connection between the small chip parts and the first decoration board 56. It is possible to prevent the part from being damaged, and also to prevent the small chip component itself from being damaged.

No small chip components are mounted on the driver back side corresponding area 202 of the second mounting surface 95 . The area 202 corresponding to the driver back side is an area of the second mounting surface 95 located on the back side of the area where the LED driver 126 is mounted on the first mounting surface 84 and the area where pads corresponding to the terminals of the LED driver 126 are provided. and a region within 1 mm from the outer edge of the region of the second mounting surface 95 . A small chip component is mounted on the area of the second mounting surface 95 located behind the area where the LED driver 126 is mounted on the first mounting surface 84 and the area where pads corresponding to the terminals of the LED driver 126 are provided. This configuration reduces the influence of thermal stress that may act on the first decorative substrate 56 due to the heat generated by the LED driver 126 on small chip components. Since the small chip parts are mounted so as to avoid the driver back side corresponding area 202, the light emission effect on the first decoration board 56 is repeatedly executed, resulting in connection between the small chip parts and the first decoration board 56.例文帳に追加It is possible to prevent the part from being damaged, and also to prevent the small chip component itself from being damaged.

In the first decoration board 56, the small chip components (the bypass capacitor 85 and the small chip resistor 87) are arranged at a distance of 1 mm or more from the outer edge of the LED chip 142. FIG. By arranging the small chip component 1 mm or more away from the outer edge of the LED chip 142, it is possible to minimize the effect of thermal stress on the connection between the small chip component and the first decoration substrate 56, and to minimize the effect of the small chip component. The effects of thermal stress on the part itself can be minimized. In addition, by arranging the small chip component 1 mm or more away from the outer edge of the LED chip 142, it is possible to prevent damage to the connecting portion between the small chip component and the first decorative substrate 56 due to thermal stress. At the same time, it is possible to prevent the small chip component itself from being damaged by thermal stress.

In the first decoration board 56, the small chip parts (the bypass capacitor 85 and the small chip resistor 87) are arranged at a distance of 1 mm or more from the outer edge of the LED driver 126 and the pads corresponding to the terminals of the LED driver 126. . By arranging the small chip parts 1 mm or more away from the outer edge of the LED driver 126 and the pads corresponding to the terminals of the LED driver 126, the connection points between the small chip parts and the first decorative substrate 56 are not damaged by thermal stress. In addition, it is possible to prevent the small chip component itself from being damaged by thermal stress.

In the first decoration board 56, the small chip components (bypass capacitor 85 and small chip resistors 87, 143-149 (FIG. 11)) are arranged avoiding the through-hole peripheral regions 211a-211d. The through-hole peripheral regions 211a-211d are regions whose distance from the outer edge of the fixed through-holes 56d-56g is less than 5 mm. By arranging the small chip components at a distance of 5 mm or more from the outer edge of the fixing through holes 56d to 56g, when the first decorative board 56 is screwed to the front door frame 14, the second part that may occur near the fixing through holes 56d to 56g is reduced. It is possible to prevent the connection point between the small chip part and the first decoration board 56 from being damaged due to the distortion of the first decoration board 56, and also prevent the small chip part itself from being damaged.

On the first mounting surface 84, the small chip components are arranged avoiding the areas 203 and 204 corresponding to the back side of the connector. The connector back side corresponding regions 203 and 204 are the region of the first mounting surface 84 located on the back side of the region where the connectors 111 and 112 are mounted on the second mounting surface 95 and the outer edge of the region of the first mounting surface 84 . It is a region where the distance is less than 5 mm. Since no small chip components are mounted on the area of the first mounting surface 84 located on the back side of the area where the connectors 111 and 112 are mounted on the second mounting surface 95, the harness to the connectors 111 and 112 can be easily connected. The influence of the stress that may be applied to the first decoration substrate 56 to the small chip components during attachment and detachment is reduced. Since the small chip parts are arranged so as to avoid the areas 203 and 204 corresponding to the back side of the connectors, the connecting points between the small chip parts and the first decoration board 56 are damaged when the harnesses are attached to and detached from the connectors 111 and 112.例文帳に追加is prevented, and the small chip component itself is prevented from being damaged.

The LED driver 126 is arranged in an area including an area less than 10 mm from the outer edge of the first decorative substrate 56, while the small chip components (bypass capacitor 85 and small chip resistors 87, 143-149 (FIG. 11)) are , are arranged apart from the outer edge of the first decoration substrate 56 by 10 mm or more. Of the various electronic components mounted on the first decoration board 56, the connection points between the small chip components and the first decoration board 56 are more mechanically sensitive than the connection points between other electronic components and the first decoration board 56. low strength. Since the small chip parts are arranged at a distance of 10 mm or more from the outer edge of the first decoration board 56, the small chip parts and the first decoration board 56 may be separated from each other by touching the small chip parts with the hand of the operator when handling the first decoration board 56. 1, the possibility of damage to the connecting portion with the decoration board 56 is reduced, and the possibility of damage to the small chip component itself is also reduced. In addition, the maximum value of stress that can act on the connection points between the small chip components and the first decorative substrate 56 is reduced when dividing the collective board 231, and the maximum value of stress that can act on the small chip components themselves is also reduced. It is

Small chip parts (bypass capacitor 85 and small chip resistors 87, 143 to 149 (FIG. 11)) are arranged avoiding the through-hole peripheral regions 211a to 211d and the region where the distance from the outer edge of the first decorative substrate 56 is less than 10 mm. In this configuration, the fixing through-holes 56d to 56g are provided in regions where the distance from the outer edge of the first decorative substrate 56 is less than 10 mm. For this reason, compared to the configuration in which the fixing through holes 56d to 56g are provided at positions separated from the outer edge of the first decoration substrate 56 by 10 mm or more, the area of the region in which the small chip components can be mounted on the first decoration substrate 56 is reduced. are widely ensured.

A bypass capacitor 85 is arranged between the power terminal 151 of the LED driver 126 and the power plane layer 94 . This reduces the influence of the noise component contained in the drive power supplied from the sound emission control device 81 to the LED driver 126 on the LED driver 126 . The bypass capacitor 85 is arranged close to the power terminal 151 so that there is no electronic component such as another IC between the bypass capacitor 85 and the power terminal 151 . As a result, it is possible to increase the possibility that the noise component contained in the drive power supplied to the power supply terminal 151 of the LED driver 126 is absorbed by the bypass capacitor 85, and the LED driver 126 can reduce the influence of the noise component. Possibility of receiving and malfunctioning can be reduced. Since there is no other IC between the bypass capacitor 85 and the power supply terminal 151, the noise component generated from the LED driver 126 is absorbed by the bypass capacitor 85, and the noise component misleads the other IC. You can prevent it from working. In addition, since there is no other electronic component between the bypass capacitor 85 and the power supply terminal 151, the noise component generated from the LED driver 126 is absorbed by the bypass capacitor 85, and the noise component is It is possible to prevent electronic components from malfunctioning.

Around the decoupling capacitor 85, only an identification silk 217 (indicated by "C1") is provided to enable confirmation that the mounted electronic component is the decoupling capacitor 85. There is no outline silk that can be grasped. The external dimensions (vertical, horizontal and height dimensions) of the bypass capacitor 85 are smaller than the external dimensions of electronic components (LED driver 126, LED chips 127 to 142, etc.) other than small chip components. For this reason, when the outline silk of the bypass capacitor 85 is printed on the first decoration board 56, the decoupling capacitor 85 can be identified by looking only at the outline silk even though the bypass capacitor 85 actually leaks after the electronic component is mounted. There is a risk that the operator will mistakenly recognize that 85 is mounted. On the other hand, by adopting a configuration in which the outline silk is not provided around the decoupling capacitor 85, it is possible to easily grasp the mounting omission of the decoupling capacitor 85 after the electronic component is mounted. Further, since the identification silk 217 is provided around the decoupling capacitor 85 , it is possible to recognize that the component mounted around the identification silk 217 is the decoupling capacitor 85 .

The outer dimensions of the small chip resistor 87, like the outer dimensions of the bypass capacitor 85, are smaller than the outer dimensions of electronic components other than the small chip components. Around the small chip resistor 87, only an identification silk 218 (indicated as "R8") is provided to enable confirmation that the mounted electronic component is the small chip resistor 87. No external silk screen is provided to enable confirmation of the mounting position of the resistor 87 . As a result, it is possible to easily grasp the mounting omission of the small chip resistor 87 . Further, since the identification silk 218 is provided around the small chip resistor 87, it is possible to grasp that the electronic component mounted around the identification silk 218 is the small chip resistor 87. be able to.

Since the outline silks 225a and 225b are convex with respect to the surface of the solder resist 222, when the outline silks 225a and 225b are provided around the small chip parts (the bypass capacitor 85 and the small chip resistor 87), The outline silks 225a and 225b are present between the first mounting surface 84 and the metal mask 226, and the distance between the first mounting surface 84 and the metal mask 226 is increased. In this configuration, the solder paste 227 may enter the gap between the first pad 171a and the second pad 171b and electrically connect the first pad 171a and the second pad 171b. In particular, when the solder paste 221 is continuously applied to a large number of the first decorative substrates 56, the solder paste 221 accumulated at the edge of the opening of the metal mask 226 tends to flow to the back side of the opening. The first pad 171a and the second pad 171b are likely to be electrically connected. On the other hand, in this embodiment, no outline silk is provided around the small chip component. As a result, it is possible to prevent the first mounting surface 84 and the metal mask 226 from being too far apart, and to prevent the solder paste 221 from entering between the pads 171a and 171b. can be done. In addition, it is possible to prevent a part of the small chip component from being placed on the outline silk and causing a soldering defect.

The LED back side corresponding area 201 where the small chip parts are not mounted on the second mounting surface 95 of the first decorative substrate 56 is the LED chips 127 to 142 (FIG. 9) on the first mounting surface 84 (FIG. 8A). It is not limited to the area of the second mounting surface 95 located on the back side of the mounted area and the area within 1 mm from the outer edge of the area of the second mounting surface 95 . The LED back side corresponding area 201 is defined as the area of the second mounting surface 95 located on the back side of the area where the LED chips 127 to 142 are mounted on the first mounting surface 84 and the distance from the outer edge of the area of the second mounting surface 95. may be within 2 mm. As a result, it is possible to further reduce the influence of thermal stress that may act on the first decorative substrate 56 due to the heat generated by the LED chips 127 to 142 on small chip components. Therefore, it is possible to reduce the possibility that the connecting portion between the small chip component and the first decoration substrate 56 will be damaged due to the repeated execution of the light emission effect on the first decoration substrate 56. It is possible to reduce the possibility that the chip component itself will be damaged.

・A region 202 corresponding to the back side of the driver on the second mounting surface 95 of the first decoration board 56 where the small chip components are not mounted is the LED driver 126 (FIG. 8A) on the first mounting surface 84 (FIG. 8A). The area of the second mounting surface 95 located behind the mounting area and the area where the pads corresponding to the terminals of the LED driver 126 are provided, and the distance from the outer edge of the area of the second mounting surface 95 is within 1 mm. is not limited to the area of The area 202 corresponding to the driver back side is the area of the second mounting surface 95 located on the back side of the area where the LED driver 126 is mounted on the first mounting surface 84 and the area where pads corresponding to the terminals of the LED driver 126 are provided. And the distance from the outer edge of the area of the second mounting surface 95 may be within 2 mm. As a result, it is possible to further reduce the influence of thermal stress that may act on the first decorative substrate 56 due to the heat generated by the LED driver 126 on small chip components. Therefore, it is possible to reduce the possibility that the connecting portion between the small chip component and the first decoration substrate 56 will be damaged due to the repeated execution of the light emission effect on the first decoration substrate 56. It is possible to reduce the possibility that the chip component itself will be damaged.

・In the first decorative board 56, through-hole peripheral regions 211a-211d where small chip components (bypass capacitor 85 and small chip resistors 87, 143-149 (FIG. 11)) are not mounted are the outer edges of fixed through-holes 56d-56g. is not limited to a region of less than 5 mm from the The through-hole peripheral regions 211a to 211d may be regions having a distance of less than 7 mm from the outer edges of the fixed through-holes 56d to 56g. As a result, when the first decoration substrate 56 is screw-fixed to the front door frame 14, distortion of the first decoration substrate 56 that can occur in the vicinity of the fixing through holes 56d to 56g causes the small chip components and the first decoration substrate to be distorted. It is possible to reduce the possibility that the connecting portion with 56 will be damaged, and also reduce the possibility that the small chip component itself will be damaged. Also, the through-hole peripheral regions 211a to 211d may be regions having a distance of less than 4 mm from the outer edges of the fixed through-holes 56d to 56g. As a result, when the first decorative board 56 is screwed to the front door frame 14, the stress acting on the connecting portion between the small chip component and the first decorative board 56 and the stress acting on the small chip component itself are reduced. , it is possible to secure a large area for mounting small chip components on the first decoration substrate 56 .

・On the first mounting surface 84 of the first decoration board 56, the connector back side corresponding areas 203 and 204 where the small chip components are not mounted are not mounted on the second mounting surface 95 (FIG. 15(a)). It is not limited to the area of the first mounting surface 84 located on the back side of the area where the mounting surface 84 is located and the area of which the distance from the outer edge of the area of the first mounting surface 84 is less than 5 mm. The connector back side corresponding regions 203 and 204 are defined by the region of the first mounting surface 84 located on the back side of the region where the connectors 111 and 112 are mounted on the second mounting surface 95 and the outer edge of the region of the first mounting surface 84. A region with a distance of less than 7 mm may be used. As a result, it is possible to reduce the possibility that the connecting portion between the small chip component and the first decorative substrate 56 will be damaged when the harness is attached to or detached from the connectors 111 and 112, and the small chip component itself will be damaged. Possibility can be reduced. Further, the connector back side corresponding regions 203 and 204 are defined as the region of the first mounting surface 84 located on the back side of the region where the connectors 111 and 112 are mounted on the second mounting surface 95 and the outer edge of the region of the first mounting surface 84 . It may be a region with a distance of less than 4 mm from the As a result, when the harnesses are attached to and detached from the connectors 111 and 112, the stress acting on the connection points between the small chip parts and the first decoration board 56 and the small chip parts themselves is reduced, while the small chip parts are attached to the first decoration board 56. It is possible to secure a large area of the mountable region.

・A region near the outer edge of the board where the small chip parts (the bypass capacitor 85 and the small chip resistors 87, 143 to 149 (FIG. 11)) are not mounted on the first decorative board 56 has a distance from the outer edge of the first decorative board 56. It is not limited to areas of less than 10 mm. The area near the outer edge of the board where the small chip components are not mounted may be an area with a distance of less than 12 mm from the outer edge of the first decoration board 56 . This reduces the possibility of damage to the connecting portion between the small chip component and the first decoration board 56 caused by the worker's hand touching the small chip component when handling the first decoration board 56. In addition, it is possible to reduce the possibility that the small chip component itself will be damaged. In addition, when the aggregate substrate 231 including a plurality of the first decoration substrates 56 is divided and the first decoration substrates 56 are taken out, when the aggregate substrate 231 is divided, the small chip components and the first decoration substrates 56 are connected to each other. The resulting stress can be reduced, and the stress acting on the small chip component itself can be reduced. Also, the area near the outer edge of the board where the small chip components are not mounted may be an area with a distance of less than 8 mm from the outer edge of the first decoration board 56 . As a result, the area where the small chip components can be mounted on the first decoration board 56 is reduced while reducing the possibility of damage to the connection points between the small chip components and the first decoration board 56 and the possibility of damage to the small chip components themselves. area can be secured widely.

<Second embodiment>
This embodiment differs from the first embodiment in that the longitudinal direction of some of the small chip components mounted on the first decorative substrate 56 is orthogonal to the first direction DR1. . The configuration different from that of the first embodiment will be described below. Note that the description of the same configuration as that of the first embodiment is basically omitted.

FIG. 25(a) is a plan view showing the first mounting surface 84 of the first decoration board 56 in this embodiment, and FIG. 25(b) is a peripheral area of the bypass capacitor 291 mounted on the first decoration board 56. FIG. 292 is an enlarged plan view of the first mounting surface 84 of the first decoration substrate 56. FIG. As in the first embodiment, as shown in FIG. 25A, the dimension of the first decoration substrate 56 in the first direction DR1 is the dimension of the first decoration substrate 56 in the direction perpendicular to the first direction DR1 greater than

As shown in FIG. 25(b), the bypass capacitor 291 extends in the longitudinal direction along a plane perpendicular to the thickness direction of the bypass capacitor 291 (hereinafter referred to as the "bypass capacitor 291 (also referred to as "longitudinal direction") is 0.1 mm or more and 0.9 mm or less. The bypass capacitor 291 has a longitudinal dimension of approximately 0.6 mm along a plane orthogonal to the thickness direction, and a lateral dimension along a plane orthogonal to the thickness direction (hereinafter also referred to as "transverse direction"). ) and the dimension in the thickness direction are approximately 0.3 mm. Since the longitudinal dimension along the plane perpendicular to the thickness direction of the bypass capacitor 291 is 0.7 mm or less, the area occupied by the bypass capacitor 291 in the light emitting substrate 301 can be reduced. By setting the longitudinal dimension of the bypass capacitor 291 along the plane orthogonal to the thickness direction to be 0.4 mm or more, the mechanical strength at the connection point between the bypass capacitor 291 and the light emitting substrate 301 and the mechanical strength of the bypass capacitor 291 itself are improved. It is possible to increase the strength, reduce the possibility of damage to the connection portion, and reduce the possibility of damage to the bypass capacitor 291 itself. Moreover, since the dimension of the bypass capacitor 291 in the longitudinal direction is 0.4 mm or more, it is possible to improve the confirmation accuracy when visually confirming whether or not there is a mounting leakage of the bypass capacitor 291 . The longitudinal dimension of the bypass capacitor 291 may be smaller than 0.6 mm (for example, 0.4 mm), and the transverse dimension of the bypass capacitor 291 may be smaller than 0.3 mm. (for example, a configuration of 0.2 mm) or a configuration in which the dimension in the thickness direction is smaller than 0.3 mm (for example, a configuration of 0.2 mm).

A first wiring pattern 294a drawn out from a first pad 293a (or first pad) corresponding to the first electrode 291a of the bypass capacitor 291 is connected to the GND plane layer 93 ( 9), and the second wiring pattern 294b drawn out from the first pad 293a is electrically connected to the GND terminal 297 (ground terminal or ground terminal) of the LED driver 296. . A third wiring pattern 294c drawn out from a second pad 293b (or a second pad) corresponding to the second electrode 291b of the bypass capacitor 291 is connected to the power plane layer through a via hole 298 provided in the first decorative substrate 56. 94 (FIG. 9). Thus, the first pad 293a is arranged between the GND terminal 297 of the LED driver 296 and the GND plane layer 93, and the second pad 293b is arranged between the power terminal 299 of the LED driver 296 and the power plane layer 94. placed in between.

The bypass capacitor 291 is mounted on the first decoration board 56 such that the longitudinal direction of the bypass capacitor 291 is orthogonal or substantially orthogonal to the first direction DR1. The first wiring pattern 294a is drawn upward from the upper end of the first pad 293a, and the second wiring pattern 294b is drawn downward from the lower end of the first pad 293a. The third wiring pattern 294c is drawn upward from the upper end of the second pad 293b, and the fourth wiring pattern 294d is drawn downward from the lower end of the second pad 293b.

In this way, the wiring patterns 294a to 294d drawn out from the pair of pads 293a and 293b corresponding to the pair of electrodes 291a and 291b of the bypass capacitor 291 are arranged in a direction orthogonal or substantially orthogonal to the longitudinal direction of the bypass capacitor 291. extends to Therefore, the first decorative substrate 56 is distorted compared to the configuration in which the wiring patterns 294a to 294d drawn out from the pair of pads 293a and 293b extend parallel to the longitudinal direction of the bypass capacitor 291. In this case, it is possible to reduce the stress that may act on the connecting portion between the bypass capacitor 291 and the first decoration board 56, and reduce the stress that may act on the bypass capacitor 291 itself. For example, it is possible to reduce the stress that may act on the connection points between the bypass capacitors 291 and the first decorative substrate 56 when dividing the aggregate substrate 231, and to reduce the stress that may act on the bypass capacitors 291 themselves. can.

According to this embodiment detailed above, the following excellent effects are obtained.

The dimension of the first decoration substrate 56 in the first direction DR1 is larger than the dimension of the first decoration substrate 56 in the direction perpendicular to the first direction DR1. In the configuration in which the longitudinal direction of the decoupling capacitor 291 is orthogonal to the first direction DR1, the wiring patterns 294a to 294d drawn from the pair of pads 293a and 293b corresponding to the pair of electrodes 291a and 291b of the decoupling capacitor 291 are It extends in a direction orthogonal or substantially orthogonal to the longitudinal direction of the bypass capacitor 291 . Therefore, the first decorative substrate 56 is distorted compared to the configuration in which the wiring patterns 294a to 294d drawn out from the pair of pads 293a and 293b extend parallel to the longitudinal direction of the bypass capacitor 291. In this case, it is possible to reduce the stress that may act on the connecting portion between the bypass capacitor 291 and the first decorative board 56, and reduce the stress that may act on the bypass capacitor 291 itself.

<Third Embodiment>
This embodiment is different from the above-described first embodiment in that both plate surfaces are provided with light-emitting substrates on which LED chips are mounted. The configuration different from that of the first embodiment will be described below. Note that the description of the same configuration as that of the first embodiment is basically omitted.

A movable object (not shown) is provided on the right side of the pattern display device 41 on the front side of the game board 24 (FIG. 4). The movable object is arranged in a region where game balls do not flow down. The movable object includes a light-emitting substrate 301 (FIG. 26) having LED chips mounted on both plate surfaces, and a substrate case (not shown) that accommodates the light-emitting substrate 301 .

26 is a plan view of the first light emitting surface 302 of the light emitting substrate 301 in this embodiment, and FIG. 27 is a plan view of the second light emitting surface 303 of the light emitting substrate 301. As shown in FIG. In FIG. 26, illustration of the wiring pattern formed on the first light emitting surface 302 is omitted, and in FIG. 27, illustration of the wiring pattern formed on the second light emitting surface 303 is omitted. As shown in FIG. 26, the light-emitting substrate 301 is formed in a vertically elongated substantially elliptical shape. The light emitting substrate 301 is a four-layer substrate having a structure in which conductive layers and insulating layers are alternately laminated, like the first decorative substrate 56 in the first embodiment. Although illustration is omitted, the light emitting substrate 301 includes a first wiring layer arranged on the first light emitting surface 302 side and a wiring layer arranged on the second light emitting surface 303 side, similar to the first decorative substrate 56 in the first embodiment. and a second wiring layer arranged in the Further, the light emitting substrate 301 has a GND plane layer (ground plane layer or ground plane layer) and a power plane layer.

As shown in FIG. 26, LED chips 304 to 313 and a first LED driver 314 for controlling light emission of these LED chips 304 to 313 are mounted on the first light emitting surface 302 of the light emitting substrate 301 . Further, as shown in FIG. 27, LED chips 315 to 325 and a second LED driver 326 for controlling light emission of these LED chips 315 to 325 are mounted on the second light emitting surface 303 of the light emitting substrate 301 . As shown in FIG. 26, the LED chips 304 to 313 are arranged in a region near the center of the first light emitting surface 302, and as shown in FIG. located in the area.

As shown in FIG. 27, the second light emitting surface 303 of the light emitting substrate 301 is mounted with a connector 327 for receiving lighting control data from the audio light emission control device 81 (FIG. 19). A harness (not shown) that electrically connects the light emitting board 301 and the sound light emitting control device 81 is attached to the connector 327 . The first LED driver 314 performs light emission control of the LED chips 304 to 313 mounted on the first light emitting surface 302 based on the lighting control data received from the sound emission control device 81, and the second LED driver 326 performs sound emission. Light emission control of the LED chips 315 to 325 mounted on the second light emitting surface 303 is performed based on lighting control data received from the control device 81 .

A substrate case (not shown) is made of a transparent or translucent resin that transmits light emitted from the LED chips 304-313 and 315-325. The board case is pivotally supported on the front side of the game board 24 and is rotatable around a vertically extending shaft. In a game state other than the opening/closing execution mode, the first light emitting surface 302 of the light emitting board 301 faces the front of the pachinko machine 10 . In the gaming state, light emission control of the LED chips 304 to 313 mounted on the first light emitting surface 302 is performed, so that an area near the center of the first light emitting surface 302 emits light. When the game state shifts to the open/close execution mode, the movable object (not shown) rotates 180 degrees around the axis so that the second light emitting surface 303 of the light emitting board 301 faces the front of the pachinko machine 10 . In the opening/closing execution mode, light emission control of the LED chips 315 to 325 mounted on the second light emitting surface 303 is performed, so that the area near the outer edge of the second light emitting surface 303 emits light. When the opening/closing execution mode ends, the movable object rotates about the axis by 180 degrees in the direction opposite to that at the start of the opening/closing execution mode so that the first light emitting surface 302 faces the front of the pachinko machine 10 . In the opening/closing execution mode, the movable object is configured to perform a light emitting effect different from that in the game state other than the opening/closing execution mode, thereby improving the interest of the effect during the opening/closing execution mode.

As shown in FIG. 26, a bypass capacitor 328 and small chip resistors 331 to 335 are mounted on the first light emitting surface 302 of the light emitting substrate 301 . Similar to the bypass capacitor 85 in the first embodiment, the bypass capacitor 328 is substantially rectangular parallelepiped. Similar to the bypass capacitor 85 in the first embodiment, the bypass capacitor 328 extends in the longitudinal direction along a plane orthogonal to the thickness direction of the bypass capacitor 328 (hereinafter also referred to as "longitudinal direction of the bypass capacitor 328"). is a small chip component with a dimension of 0.1 mm or more and 0.9 mm or less. The bypass capacitor 328 has a longitudinal dimension of approximately 0.6 mm along a plane orthogonal to the thickness direction, and a lateral dimension along a plane orthogonal to the thickness direction (hereinafter also referred to as "transverse direction"). ) and the dimension in the thickness direction are approximately 0.3 mm. Since the longitudinal dimension of the bypass capacitor 328 is 0.7 mm or less, the area occupied by the bypass capacitor 328 in the light emitting substrate 301 can be further reduced. By setting the longitudinal dimension of the bypass capacitor 328 to be 0.4 mm or more, the mechanical strength at the connection point between the bypass capacitor 328 and the light emitting substrate 301 and the mechanical strength of the bypass capacitor 328 itself are increased, and the connection point is damaged. In addition, it is possible to reduce the possibility that the bypass capacitor 328 itself will be damaged. Moreover, since the longitudinal dimension of the decoupling capacitor 328 is 0.4 mm or more, it is possible to enhance the confirmation accuracy when visually confirming whether or not the decoupling capacitor 328 has a mounting leak. The longitudinal dimension of the bypass capacitor 328 may be smaller than 0.6 mm (for example, 0.4 mm), and the transverse dimension of the bypass capacitor 328 may be smaller than 0.3 mm. (for example, a configuration of 0.2 mm) or a configuration in which the dimension in the thickness direction is smaller than 0.3 mm (for example, a configuration of 0.2 mm).

Similar to the small chip resistor 87 in the first embodiment, the small chip resistors 331-335 are substantially rectangular parallelepipeds. The small chip resistors 331 to 335, like the small chip resistor 87 in the first embodiment, extend in a longitudinal direction along a plane orthogonal to the thickness direction of the small chip resistors 331 to 335 (hereinafter referred to as "small The chip resistors 331 to 335 are also called "longitudinal directions" of the chip resistors 331 to 335). The small chip resistors 331 to 335 have a longitudinal dimension of approximately 0.6 mm along a plane orthogonal to the thickness direction, and a widthwise direction of the small chip resistors 331 to 335 (hereinafter referred to as "short direction"). ) and the dimension in the thickness direction are approximately 0.3 mm. Since the longitudinal dimension of the small chip resistors 331 to 335 is 0.7 mm or less, the area occupied by the small chip resistors 331 to 335 on the light emitting substrate 301 can be further reduced. Since the longitudinal dimension of the small chip resistors 331 to 335 is 0.4 mm or more, the mechanical strength at the connection points between the small chip resistors 331 to 335 and the light emitting substrate 301 and the small chip resistors 331 to 335 themselves By increasing the mechanical strength of the chip resistors 331 to 335, it is possible to reduce the possibility of damage to the connection points and reduce the possibility of damage to the small chip resistors 331 to 335 themselves. In addition, since the longitudinal dimension of the small chip resistors 331 to 335 is 0.4 mm or more, it is possible to improve the confirmation accuracy when visually checking whether or not there is a mounting omission in the small chip resistors 331 to 335. . In addition, the small chip resistors 331 to 335 may have a configuration in which the longitudinal dimension is smaller than 0.6 mm (for example, a configuration in which it is 0.4 mm), and the short dimension of the small chip resistors 331 to 335 may be less than 0.3 mm (for example, 0.2 mm), or the dimension in the thickness direction may be less than 0.3 mm (for example, 0.2 mm). .

In the light emitting substrate 301, small chip parts (bypass capacitor 328 and small chip resistors 331 to 335) are concentrated on the first light emitting surface 302 side and not mounted on the second light emitting surface 303 side. Therefore, by handling the light-emitting substrate 301 so that the stress acting on the first light-emitting surface 302 side of the light-emitting substrate 301 becomes smaller than the stress acting on the second light-emitting surface 303 side, the small chip component and the light-emitting substrate 301 It is possible to reduce the possibility of damage to the connecting portion of the small chip component itself, as well as to reduce the possibility of damage to the small chip component itself. For example, when an aggregate substrate (not shown) including a plurality of light emitting substrates 301 is divided and the light emitting substrates 301 are taken out, the size can be reduced by dividing the aggregate substrate in such a manner that the first light emitting surface 302 side has a valley shape (concave). It is possible to prevent a tensile stress from acting on the connecting portion between the chip component and the light emitting substrate 301 . As a result, it is possible to prevent the connecting portion between the small chip component and the light emitting substrate 301 from being damaged, and also prevent the small chip component itself from being damaged.

As shown in FIG. 27, chip resistors 336-346 are mounted on the second light-emitting surface 303 of the light-emitting substrate 301 to limit the current flowing through the LED chips 315-325. By providing the chip resistors 336 to 346, the LED chips 315 to 325 can be driven with a current less than the allowable current. Each of the chip resistors 336 to 346 has a substantially rectangular parallelepiped shape and has a pair of metal first and second electrodes (not shown) at both ends in the longitudinal direction. The chip resistors 336 to 346 are surface mount type resistors having a longitudinal dimension of 1 mm and a lateral dimension and a thickness dimension of 0.5 mm. The longitudinal dimension along a plane perpendicular to the thickness direction of the chip resistors 336-346 (1 mm, which is the longitudinal dimension of the chip resistors 336-346) is greater than 0.9 mm, and the chip resistors 336-346 is not a small chip component. Note that the longitudinal dimension of the chip resistors 336 to 346 may be greater than 1 mm (eg, 1.6 mm), and the lateral dimension is greater than 0.5 mm (eg, 0.8 mm). and the dimension in the thickness direction may be greater than 0.5 mm (for example, 0.8 mm).

A power source for driving the second LED driver 326 is supplied from the sound emission control device 81 to the power terminal 348 of the second LED driver 326 via the connector 327 . A bypass capacitor 352 is mounted on the second light emitting surface 303 of the light emitting substrate 301 to absorb noise components contained in the driving power source of the second LED driver 326 . The bypass capacitor 352 has a substantially rectangular parallelepiped shape and has a pair of metal first and second electrodes 352a and 352b at both ends in the longitudinal direction. The bypass capacitor 352 is a surface-mount capacitor with a longitudinal dimension of 1 mm and a lateral dimension and a thickness dimension of 0.5 mm. The longitudinal dimension along a plane orthogonal to the thickness direction of bypass capacitor 352 (1 mm, which is the longitudinal dimension of bypass capacitor 352) is greater than 0.9 mm, and bypass capacitor 352 is not a small chip component. The longitudinal dimension of the bypass capacitor 352 may be greater than 1 mm (eg, 1.6 mm), and the lateral dimension may be greater than 0.5 mm (eg, 0.8 mm). and the dimension in the thickness direction may be greater than 0.5 mm (for example, 0.8 mm).

The first electrode 352a of the bypass capacitor 352 is electrically connected to the GND terminal 349 of the second LED driver 326 and a GND plane layer (not shown), while the second electrode 352b is electrically connected to the power terminal 348 of the second LED driver 326 and the power supply. It is electrically connected to a plane layer (not shown). By disposing the bypass capacitor 352 between the power terminal 348 and the power plane layer, noise components contained in the drive power supplied from the sound emission control device 81 to the second LED driver 326 are suppressed by the second LED driver 326 . reduced impact on

The chip resistor 340 on the second light emitting surface 303 of the light emitting substrate 301 is arranged in a region including the driver back side corresponding region 353 on the first light emitting surface 302 . The driver back side corresponding area 353 is provided with pads (or pads) corresponding to the area where the first LED driver 314 (FIG. 26) is mounted and the terminals of the first LED driver 314 on the first light emitting surface 302 (FIG. 26). The area of the second light emitting surface 303 located on the back side of the area where the light is present and the area within 1 mm from the area of the second light emitting surface 303 . As already explained, the chip resistor 340 is not a small chip component. The connecting portion between the chip resistor 340 and the light emitting substrate 301 has higher mechanical strength than the connecting portion between the small chip component and the light emitting substrate 301 . Also, the chip resistor 340 itself has high mechanical strength compared to the small chip component itself. By arranging the chip resistor 340 in a region including the driver backside corresponding region 353 on the second light emitting surface 303 , the LED chip 319 can be arranged near the driver backside corresponding region 353 . On the other hand, as shown in FIG. 26, the small chip components (bypass capacitor 328 and small chip resistors 331 to 335) on the first light emitting surface 302 of the light emitting substrate 301 are arranged avoiding the driver back side corresponding region 354. FIG. The driver back side corresponding area 354 is provided with pads (or pads) corresponding to the area where the second LED driver 326 (FIG. 27) is mounted and the terminals of the second LED driver 326 on the second light emitting surface 303 (FIG. 27). It is a region of the first light emitting surface 302 located on the back side of the region where the light is present and a region within 1 mm from the region of the first light emitting surface 302 . A small chip component is placed in the area of the first light emitting surface 302 located behind the area where the second LED driver 326 is mounted on the second light emitting surface 303 and the area where pads corresponding to the terminals of the second LED driver 326 are provided. The non-mounted configuration reduces the influence of thermal stress that may act on the light emitting substrate 301 due to the heat generated by the second LED driver 326 on small chip components. By arranging the small chip parts away from the driver back side corresponding area 354, it is possible to prevent damage to the connection points between the small chip parts and the light emitting substrate 301 due to the influence of thermal stress due to the heat generated by the second LED driver 326. In addition, it is possible to prevent damage to the small chip component itself.

As shown in FIG. 27 , the chip resistors 343 on the second light emitting surface 303 of the light emitting substrate 301 are arranged in a region including the LED back side corresponding region 355 on the first light emitting surface 302 . The LED back side corresponding region 355 is the region of the second light emitting surface 303 located on the back side of the region where the LED chips 310 and 311 (FIG. 26) are mounted on the first light emitting surface 302 (FIG. 26) and the second light emitting surface. The distance from the outer edge of the area 303 is within 1 mm. By arranging the chip resistor 343 in a region including the LED backside corresponding region 355 on the second light emitting surface 303 , the LED chip 322 can be arranged near the LED backside corresponding region 355 . On the other hand, as shown in FIG. 26, the small chip components (bypass capacitor 328 and small chip resistors 331 to 335) on the first light emitting surface 302 of the light emitting substrate 301 are arranged avoiding the LED back side corresponding regions 361 to 371. there is The LED back side corresponding regions 361 to 371 are the regions of the first light emitting surface 302 located on the back side of the region where the LED chips 315 to 325 (FIG. 27) are mounted on the second light emitting surface 303 (FIG. 27) and the first light emitting surface 303 (FIG. 27). The distance from the outer edge of the area of the light emitting surface 302 is within 1 mm. In the second light emitting surface 303, the area of the first light emitting surface 302 located on the back side of the area where the LED chips 315 to 325 are mounted is not mounted with small chip components. The influence of thermal stress that may act on the light emitting substrate 301 due to heat generation on small chip components is reduced. Since the small chip parts are arranged to avoid the LED back side corresponding areas 361 to 371, the connection points between the small chip parts and the light emitting substrate 301 are damaged due to the thermal stress caused by the heat generated by the LED chips 315 to 325. In addition, it is possible to prevent the small chip component itself from being damaged.

As shown in FIG. 26, an LED chip 310 is mounted near the center of the first light emitting surface 302 of the light emitting substrate 301 . The longitudinal dimension along the plane perpendicular to the thickness direction of the LED chip 310 is greater than 0.9 mm, and the LED chip 310 is not a small chip component. As shown in FIG. 26, the LED chip 310 is mounted in a region including the LED back side corresponding region 368 on the first light emitting surface 302 . The LED chip 310 uses the area of the first light emitting surface 302 located behind the area where the LED chip 322 (FIG. 27) is mounted on the second light emitting surface 303 (FIG. 27) in the LED back side corresponding area 368. Implemented in the containing region. On the first light emitting surface 302 of the light emitting substrate 301, some electronic components (LED chips 310) that are not small chip components are mounted, and on the second light emitting surface 303 (FIG. 27), LED chips 322 (FIG. 27) are mounted. By mounting in a region including the region of the first light emitting surface 302 located on the back side of the region, a wide area is secured in the region where electronic components other than small chip components can be mounted on the first light emitting surface 302. .

A part of the electronic component (LED chip 310) that is not a small chip component is located on the back side of the area where the LED chip 322 (FIG. 27) is mounted on the second light emitting surface 303 (FIG. 27). In the light-emitting substrate 301 mounted on the area including the area of , the small chip components are arranged avoiding the areas 361 to 371 corresponding to the back side of the LED. This reduces the possibility that the connection between the small chip component and the light emitting substrate 301 and the small chip component itself will be damaged due to the influence of thermal stress.

As shown in FIG. 27 , the chip resistors 341 on the second light emitting surface 303 of the light emitting substrate 301 are arranged in a region including the connector peripheral region 372 . Connector peripheral region 372 is the region less than 5 mm from the outer edge of connector 327 . By arranging the chip resistors 341 in the area including the connector peripheral area 372 on the second light emitting surface 303, the number of LED chips 315 to 325 on the light emitting substrate 301 is reduced compared to the case where the connector peripheral area 372 is avoided. can be widely dispersed, and the light emitting area of the second light emitting surface 303 can be widened. On the other hand, as shown in FIG. 26, the small chip components (bypass capacitor 328 and small chip resistors 331 to 335) on the first light emitting surface 302 of the light emitting substrate 301 are arranged so as to avoid the connector rear side corresponding region 373. FIG. The connector back side corresponding region 373 is the region of the first light emitting surface 302 located on the back side of the region where the connector 327 is mounted on the second light emitting surface 303 (FIG. 27) and the outer edge of the region of the first light emitting surface 302. It is a region where the distance is less than 5 mm. Since no small chip component is mounted on the area of the first light emitting surface 302 located on the back side of the area where the connector 327 is mounted on the second light emitting surface 303, light is emitted when the harness is attached to or detached from the connector 327. The effect of stress that may act on substrate 301 on small chip components is reduced. By arranging the small chip parts away from the connector back side corresponding area 373, the stress that may be applied to the connection point between the small chip parts and the light emitting substrate 301 when attaching and detaching a harness (not shown) to the connector 327 is reduced. In addition, the stress acting on the small chip component itself can be reduced. Therefore, it is possible to prevent damage to the connecting portion between the small chip component and the light emitting substrate 301 when attaching/detaching the harness to/from the connector 327, and also to prevent the small chip component itself from being damaged.

As shown in FIG. 27, the chip resistors 336 on the second light emitting surface 303 of the light emitting substrate 301 are arranged in a region including the substrate outer edge region 374 on the second light emitting surface 303 side. A substrate outer edge region 374 on the second light emitting surface 303 side is a region of less than 10 mm from the outer edge of the light emitting substrate 301 on the second light emitting surface 303 . By arranging the chip resistors 336 in a region including the substrate outer edge region 374 on the second light emitting surface 303, the number of LED chips 315 to 325 on the light emitting substrate 301 is reduced compared to the case where the substrate outer edge region 374 is avoided. can be widely distributed. On the other hand, as shown in FIG. 26, the small chip components (bypass capacitor 328 and small chip resistors 331 to 335) on the first light emitting surface 302 of the light emitting substrate 301 avoid the substrate outer edge region 375 on the first light emitting surface 302 side. are placed. A substrate outer edge area 375 on the first light emitting surface 302 side is an area of less than 10 mm from the outer edge of the light emitting substrate 301 on the first light emitting surface 302 . By arranging the small chip components while avoiding the substrate outer edge region 375 on the first light emitting surface 302, the small chip components may be prevented from touching the small chip components by an operator's hand when handling the light emitting substrate 301. and the light emitting substrate 301 can be prevented from being damaged, and the small chip component itself can be prevented from being damaged. In addition, when an aggregate substrate including a plurality of light emitting substrates 301 is divided and the light emitting substrates 301 are taken out, the stress that may act on the connecting portions between the small chip components and the light emitting substrates 301 when the aggregate substrate is divided can be reduced. At the same time, the stress acting on the small chip component itself can be reduced. Therefore, it is possible to prevent damage to the connection points between the small chip components and the light emitting substrate 301 when dividing the collective substrate, and also to prevent damage to the small chip components themselves.

As shown in FIGS. 26 and 27, the light emitting substrate 301 has a fixing through hole 301a which penetrates the light emitting substrate 301 in the thickness direction so that the light emitting substrate 301 can be screwed to a substrate case (not shown). , 301b are formed. As shown in FIG. 27 , the chip resistors 346 on the second light emitting surface 303 of the light emitting substrate 301 are arranged in a region including the fixed through hole peripheral region 376 . The fixed through-hole peripheral region 376 is a region less than 5 mm from the outer edge of the fixed through-hole 301b. In the second light emitting surface 303, by arranging the chip resistors 346 in a region including the fixed through hole peripheral region 376, compared to the case of arranging the chip resistor 346 while avoiding the fixed through hole peripheral region 376, the number of LEDs on the light emitting substrate 301 is reduced. Chips 315-325 can be widely distributed. On the other hand, as shown in FIG. 26, the small chip components (bypass capacitor 328 and small chip resistors 331 to 335) on the first light emitting surface 302 of the light emitting substrate 301 are arranged avoiding the fixed through hole peripheral regions 377 and 378. ing. The fixed through-hole peripheral regions 377 and 378 are regions on the first light emitting surface 302 that are less than 5 mm from the outer edges of the fixed through-holes 301a and 301b. By arranging the small chip components on the first light emitting surface 302 while avoiding the areas 377 and 378 around the fixing through holes, when the light emitting board 301 is fixed to the board case body (not shown), the small chip components and the light emitting board can be separated from each other. 301 can be reduced, and the stress acting on the small chip component itself can be reduced. Therefore, when fixing the light-emitting board 301 to the board case body, it is possible to prevent the connecting portion between the small chip component and the light-emitting board 301 from being damaged, and also prevent the small chip component itself from being damaged.

As shown in FIG. 27, the longitudinal dimension along the plane orthogonal to the thickness direction of the LED chips 317, 324 is greater than 0.9 mm, and the LED chips 317, 324 are not small chip components. Also, the longitudinal dimension along the plane orthogonal to the thickness direction of the chip resistors 338, 345 is greater than 0.9 mm, and the chip resistors 338, 345 are not small chip components. In the light-emitting substrate 301 , the LED chips 317 and 324 are arranged so that the longitudinal direction along the plane orthogonal to the thickness direction of the LED chips 317 and 324 is parallel to the short-axis direction SDA orthogonal to the long-axis direction LDA of the light-emitting substrate 301 . It is mounted on the light-emitting substrate 301 in the following manner. In the chip resistors 338 and 345, the longitudinal direction along the plane orthogonal to the thickness direction of the chip resistors 338 and 345 is parallel to the short axis direction SDA orthogonal to the long axis direction LDA of the light emitting substrate 301. It is mounted on the light emitting substrate 301 in a manner similar to that described above. On the other hand, as shown in FIG. 26, in the light-emitting substrate 301, the small chip components (the bypass capacitor 328 and the small chip resistors 331 to 335) have a longitudinal direction along a plane orthogonal to the thickness direction of the small chip components. It is mounted on the light emitting substrate 301 in parallel with the longitudinal direction LDA of the light emitting substrate 301 . As a result, compared to the case where the small chip component is mounted on the light emitting substrate 301 in such a manner that the longitudinal direction of the small chip component is parallel to the short axis direction SDA orthogonal to the long axis direction LDA, the case where the light emitting substrate 301 is distorted. Furthermore, the maximum value of stress that can act on the connecting portion between the small chip component and the light emitting substrate 301 is reduced, and the maximum value of stress that can act on the small chip component itself is also reduced.

The mechanical strength of the connecting portion between the small chip component and the light emitting substrate 301 is lower than the mechanical strength of the connecting portion between the electronic component larger than the small chip component and the light emitting substrate 301 . Also, the mechanical strength of the small chip component itself is lower than the mechanical strength of the electronic component itself, which is larger than the small chip component. Some of the electronic components larger than the small chip components are mounted on the light emitting substrate 301 in such a manner that the longitudinal direction of the electronic component is not parallel to the long axis direction LDA of the light emitting substrate 301. The chip components are mounted on the light emitting substrate 301 in such a manner that the longitudinal direction thereof is parallel to the longitudinal direction LDA of the light emitting substrate 301 . This protects the connection points between the small chip component and the light emitting substrate 301 and the small chip component itself.

According to this embodiment detailed above, the following excellent effects are obtained.

In the configuration in which the chip resistor 340 is arranged on the second light emitting surface 303 of the light emitting substrate 301 in a region including the driver back side corresponding region 353, the small chip components (the bypass capacitor 328 and the small chip resistor 331 335) are arranged avoiding the driver rear side corresponding area 354. FIG. The driver back side corresponding region 354 is located on the back side of the region where the second LED driver 326 is mounted on the second light emitting surface 303 and the region where pads corresponding to the terminals of the second LED driver 326 are provided. and a region within 1 mm from the region of the first light emitting surface 302 . A small chip component is placed in the area of the first light emitting surface 302 located behind the area where the second LED driver 326 is mounted on the second light emitting surface 303 and the area where pads corresponding to the terminals of the second LED driver 326 are provided. The non-mounted configuration reduces the influence of thermal stress that may act on the light emitting substrate 301 due to the heat generated by the second LED driver 326 on small chip components. By arranging the small chip parts away from the driver back side corresponding area 354, it is possible to prevent damage to the connection points between the small chip parts and the light emitting substrate 301 due to the influence of thermal stress due to the heat generated by the second LED driver 326. In addition, it is possible to prevent damage to the small chip component itself.

In the configuration in which the chip resistor 343 on the second light emitting surface 303 of the light emitting substrate 301 is arranged in a region including the LED back side corresponding region 355, the small chip components on the first light emitting surface 302 of the light emitting substrate 301 are arranged in the LED back side corresponding region 355. It is arranged avoiding 361-371. The LED back side corresponding regions 361 to 371 are the region of the first light emitting surface 302 located on the back side of the region where the LED chips 315 to 325 are mounted on the second light emitting surface 303 and the outer edge of the region of the first light emitting surface 302. is within 1 mm. In the second light emitting surface 303, the area of the first light emitting surface 302 located on the back side of the area where the LED chips 315 to 325 are mounted is not mounted with small chip parts. The effect of thermal stress that may act on the light emitting substrate 301 due to heat generation on small chip components is reduced. Since the small chip parts are arranged to avoid the LED back side corresponding areas 361 to 371, the connection points between the small chip parts and the light emitting substrate 301 are damaged due to the thermal stress caused by the heat generated by the LED chips 315 to 325. In addition, it is possible to prevent the small chip component itself from being damaged.

A part of the electronic component (LED chip 310) that is not a small chip component is located on the back side of the area where the LED chip 322 (FIG. 27) is mounted on the second light emitting surface 303 (FIG. 27). In the light-emitting substrate 301 mounted on the area including the area of , the small chip components are arranged avoiding the areas 361 to 371 corresponding to the back side of the LED. This reduces the possibility that the connection between the small chip component and the light emitting substrate 301 and the small chip component itself will be damaged due to the influence of thermal stress.

In the configuration in which the chip resistors 341 on the second light emitting surface 303 of the light emitting substrate 301 are arranged in a region including the connector peripheral region 372 , the small chip components on the first light emitting surface 302 of the light emitting substrate 301 are located in the connector back side corresponding region 373 . are placed to avoid The connector back side corresponding region 373 is the region of the first light emitting surface 302 located on the back side of the region where the connector 327 is mounted on the second light emitting surface 303 and the distance from the outer edge of the region of the first light emitting surface 302 is less than 5 mm. is the area of Since no small chip component is mounted on the area of the first light emitting surface 302 located on the back side of the area where the connector 327 is mounted on the second light emitting surface 303, light is emitted when the harness is attached to or detached from the connector 327. The effect of stress that may act on substrate 301 on small chip components is reduced. By arranging the small chip components away from the connector back side corresponding area 373, the stress that can be applied to the connecting portion between the small chip components and the light emitting substrate 301 when attaching and detaching a harness (not shown) to the connector 327 is reduced. In addition, the stress acting on the small chip component itself can be reduced. Therefore, it is possible to prevent damage to the connecting portion between the small chip component and the light emitting substrate 301 when attaching and detaching the harness to and from the connector 327, and also to prevent the small chip component itself from being damaged.

In the configuration in which the chip resistors 336 on the second light emitting surface 303 of the light emitting substrate 301 are arranged in a region including the substrate outer edge region 374, the small chip components on the first light emitting surface 302 of the light emitting substrate 301 are arranged on the first light emitting surface 302 It is arranged avoiding the substrate outer edge region 375 on the side. As a result, it is possible to prevent damage to the connecting portion between the small chip component and the light emitting substrate 301 due to the worker's hand touching the small chip component when handling the light emitting substrate 301, and the small chip component itself. can be prevented from being damaged. In addition, when an aggregate substrate including a plurality of light emitting substrates 301 is divided and the light emitting substrates 301 are taken out, the stress that may act on the connecting portions between the small chip components and the light emitting substrates 301 when the aggregate substrate is divided can be reduced. At the same time, the stress acting on the small chip component itself can be reduced. Therefore, it is possible to prevent damage to the connection points between the small chip components and the light emitting substrate 301 when dividing the collective substrate, and also to prevent damage to the small chip components themselves.

In the configuration in which the chip resistors 346 on the second light emitting surface 303 of the light emitting substrate 301 are arranged in a region including the fixed through-hole peripheral region 376, the small chip components on the first light emitting surface 302 of the light emitting substrate 301 are arranged around the fixed through holes. It is arranged to avoid the peripheral areas 377 and 378 . As a result, when the light-emitting substrate 301 is fixed to the substrate case body, it is possible to reduce the stress that may act on the connecting portion between the small chip component and the light-emitting substrate 301, and reduce the stress that acts on the small chip component itself. can do. Therefore, when fixing the light-emitting board 301 to the board case body, it is possible to prevent the connecting portion between the small chip component and the light-emitting board 301 from being damaged, and also prevent the small chip component itself from being damaged.

Some of the electronic components larger than the small chip components are mounted on the light emitting substrate 301 in such a manner that the longitudinal direction of the electronic component is not parallel to the long axis direction LDA of the light emitting substrate 301. 328 and small chip resistors 331 to 335) are mounted on the light emitting substrate 301 in such a manner that the longitudinal direction along the plane orthogonal to the thickness direction of the small chip component is parallel to the longitudinal direction LDA of the light emitting substrate 301. ing. As a result, compared to the case where the small chip component is mounted on the light emitting substrate 301 in such a manner that the longitudinal direction of the small chip component is parallel to the short axis direction SDA orthogonal to the long axis direction LDA, the case where the light emitting substrate 301 is distorted. Furthermore, the maximum value of stress that can act on the connecting portion between the small chip component and the light emitting substrate 301 is reduced, and the maximum value of stress that can act on the small chip component itself is also reduced.

In the first light emitting surface 302 of the light emitting substrate 301, the driver back side corresponding area 354 where the small chip parts (the bypass capacitor 328 and the small chip resistors 331 to 335) are not mounted is the second light emitting surface 303 (FIG. 27). The area of the first light emitting surface 302 located behind the area where the two LED drivers 326 (FIG. 27) are mounted and the area where the pads corresponding to the terminals of the second LED driver 326 are provided, and the area of the first light emitting surface 302 The distance from the area is not limited to within 1 mm. The driver back side corresponding region 354 is the first light emitting surface 302 located on the back side of the region where the second LED driver 326 is mounted on the second light emitting surface 303 and the region where pads corresponding to the terminals of the second LED driver 326 are provided. and a region within 2 mm from the region of the first light emitting surface 302 . As a result, it is possible to further reduce the influence of thermal stress that may act on the light emitting substrate 301 due to the heat generated by the second LED driver 326 on the small chip components. Therefore, it is possible to reduce the possibility that the connecting portion between the small chip component and the light emitting substrate 301 will be damaged due to the thermal stress caused by the heat generated by the second LED driver 326, and the possibility that the small chip component itself will be damaged. can be reduced. In addition, the driver back side corresponding region 354 is the first light emitting region located on the back side of the region where the second LED driver 326 is mounted on the second light emitting surface 303 and the region where pads corresponding to the terminals of the second LED driver 326 are provided. The distance from the area of the surface 302 and the area of the first light emitting surface 302 may be within 0.5 mm. As a result, while reducing the influence of thermal stress that may act on the light-emitting substrate 301 due to the heat generated by the second LED driver 326 on the small-sized chip components, the first light-emitting surface 302 of the light-emitting substrate 301 has a region where small-sized chip components can be mounted. area can be secured widely.

・On the first light emitting surface 302 of the light emitting substrate 301, the LED back side corresponding areas 361 to 371 where the small chip parts (the bypass capacitor 328 and the small chip resistors 331 to 335) are not mounted are the LEDs on the second light emitting surface 303 (FIG. 27). The area of the first light emitting surface 302 located behind the area where the chips 315 to 325 (FIG. 27) are mounted and the distance from the outer edge of the area of the first light emitting surface 302 is limited to within 1 mm. no. The LED back side corresponding regions 361 to 371 are formed from the region of the first light emitting surface 302 located on the back side of the region where the LED chips 315 to 325 are mounted on the second light emitting surface 303 and the outer edge of the region of the first light emitting surface 302. may be within 2 mm. As a result, it is possible to further reduce the influence of thermal stress that may act on the light emitting substrate 301 due to the heat generated by the LED chips 315 to 325 on small chip components. Therefore, it is possible to reduce the possibility that the connection points between the small chip parts and the light emitting substrate 301 will be damaged due to the thermal stress caused by the heat generated by the LED chips 315 to 325, and the small chip parts themselves can be damaged. can be reduced. Further, the LED back side corresponding regions 361 to 371 are defined as the region of the first light emitting surface 302 located on the back side of the region where the LED chips 315 to 325 are mounted on the second light emitting surface 303 and the region of the first light emitting surface 302. The area may be within 0.5 mm from the outer edge. As a result, small chip components can be mounted on the first light emitting surface 302 of the light emitting substrate 301 while reducing the influence of thermal stress that may act on the light emitting substrate 301 due to the heat generated by the LED chips 315 to 325 on the small chip components. A large area can be secured for the region.

A connector 327 is mounted on the second light emitting surface 303 (FIG. 27) in the connector back side corresponding area 373 where the small chip parts (bypass capacitor 328 and small chip resistors 331 to 335) are not mounted on the first light emitting surface 302 of the light emitting substrate 301. It is not limited to the region of the first light emitting surface 302 located on the back side of the region where the light emitting surface 302 is located and the region of which the distance from the outer edge of the region of the first light emitting surface 302 is less than 5 mm. The connector back side corresponding region 373 is the region of the first light emitting surface 302 located on the back side of the region where the connector 327 is mounted on the second light emitting surface 303 and the distance from the outer edge of the region of the first light emitting surface 302 is less than 7 mm. may be the area of . As a result, it is possible to reduce the stress that may act on the connecting portion between the small chip component and the light emitting substrate 301 when attaching and detaching the harness to and from the connector 327, and reduce the stress that acts on the small chip component itself. Therefore, it is possible to reduce the possibility of damage to the connecting portion between the small chip component and the light emitting substrate 301 when attaching and detaching the harness to the connector 327, and reduce the possibility of damage to the small chip component itself. Further, the connector back side corresponding region 373 is defined as the region of the first light emitting surface 302 located on the back side of the region where the connector 327 is mounted on the second light emitting surface 303 and the distance from the outer edge of the region of the first light emitting surface 302 is It may be a region of less than 4 mm. As a result, when the harness is attached to or detached from the connector 327, the small chip components can be attached to the first light emitting surface 302 of the light emitting board 301 while reducing the stress acting on the small chip components themselves and the connection points between the small chip components and the light emitting board 301. It is possible to secure a large area of the mountable region.

In the first light emitting surface 302 of the light emitting substrate 301, the fixed through hole peripheral regions 377 and 378 where the small chip components (the bypass capacitor 328 and the small chip resistors 331 to 335) are not mounted are the fixed through holes 301a in the first light emitting surface 302. , 301b is not limited to a region less than 5 mm from the outer edge. The fixed through-hole peripheral regions 377 and 378 may be regions of less than 7 mm from the outer edges of the fixed through-holes 301a and 301b on the first light emitting surface 302 . As a result, when the light-emitting substrate 301 is fixed to a substrate case (not shown), the stress that may act on the connecting portion between the small chip component and the light-emitting substrate 301 can be reduced, and the stress acting on the small chip component itself can be reduced. It is possible to reduce the stress to be applied. Therefore, when fixing the light-emitting substrate 301 to the substrate case body, it is possible to reduce the possibility of damage to the connecting portion between the small chip component and the light-emitting substrate 301, and reduce the possibility of damage to the small chip component itself. can do. Also, the fixed through-hole peripheral regions 377 and 378 may be regions of less than 4 mm from the outer edges of the fixed through-holes 301 a and 301 b on the first light emitting surface 302 . As a result, when the light emitting substrate 301 is fixed to a substrate case body (not shown), the stress acting on the small chip component itself and the connecting portion between the small chip component and the light emitting substrate 301 is reduced. It is possible to secure a large area for mounting small chip components on one light emitting surface 302 .

A substrate outer edge region 375 on the side of the first light emitting surface 302 where the small chip components (bypass capacitor 328 and small chip resistors 331 to 335) are not mounted on the first light emitting surface 302 of the light emitting substrate 301 emits light on the first light emitting surface 302. It is not limited to a region less than 10 mm from the outer edge of substrate 301 . The substrate outer edge region 375 on the first light emitting surface 302 side may be a region less than 12 mm from the outer edge of the light emitting substrate 301 on the first light emitting surface 302 . As a result, it is possible to reduce the possibility that the connecting portion between the small chip component and the light emitting substrate 301 will be damaged due to the operator's hand touching the small chip component when handling the light emitting substrate 301. , the possibility of damage to the small chip component itself can be reduced. In addition, when an aggregate substrate including a plurality of light emitting substrates 301 is divided and the light emitting substrates 301 are taken out, the stress that may act on the connecting portions between the small chip components and the light emitting substrates 301 when the aggregate substrate is divided can be reduced. At the same time, the stress acting on the small chip component itself can be reduced. Also, the substrate outer edge region 375 on the first light emitting surface 302 side may be a region less than 8 mm from the outer edge of the light emitting substrate 301 on the first light emitting surface 302 . As a result, the small chip components can be mounted on the first light emitting surface 302 of the light emitting substrate 301 while reducing the possibility of damage to the connection points between the small chip components and the light emitting substrate 301 and the possibility of damage to the small chip components themselves. It is possible to secure a large area for the

<Fourth Embodiment>
In this embodiment, a bypass capacitor is mounted on the first light emitting surface 302 side of the light emitting substrate 301 to absorb the noise component contained in the driving power source of the second LED driver 326 mounted on the second light emitting surface 303 side. is different from the third embodiment. The configuration different from that of the third embodiment will be described below. Note that the description of the same configuration as that of the third embodiment is basically omitted.

FIG. 28(a) is a plan view of the first light emitting surface 302 of the light emitting substrate 301 in this embodiment. As shown in FIG. 28(a), a second LED driver 326 (FIG. 29(a)) mounted on the second light emitting surface 303 side (FIG. 29(a)) is mounted on the first light emitting surface 302 side of the light emitting substrate 301 (FIG. 29(a)). )) is mounted with a bypass capacitor 381 for absorbing noise components contained in the drive power supply. FIG. 28(b) is a plan view of the first light emitting surface 302 of the light emitting substrate 301 showing an enlarged peripheral region 388 of the bypass capacitor 381. FIG.

Similar to the bypass capacitor 85 in the first embodiment, the bypass capacitor 381 is, as shown in FIG. A second electrode 381b is provided. Similar to the bypass capacitor 85 in the first embodiment, the bypass capacitor 381 extends in the longitudinal direction along a plane orthogonal to the thickness direction of the bypass capacitor 381 (hereinafter also referred to as "longitudinal direction of the bypass capacitor 381"). is a small chip component with a dimension of 0.1 mm or more and 0.9 mm or less. The bypass capacitor 381 has a longitudinal dimension of approximately 0.6 mm along a plane orthogonal to the thickness direction, and a lateral dimension along a plane orthogonal to the thickness direction (hereinafter also referred to as "transverse direction"). ) and the dimension in the thickness direction are approximately 0.3 mm. Since the longitudinal dimension of the bypass capacitor 381 is 0.7 mm or less, the area occupied by the bypass capacitor 381 in the light emitting substrate 301 can be further reduced. Since the longitudinal dimension of the bypass capacitor 381 is 0.4 mm or more, the mechanical strength at the connection point between the bypass capacitor 381 and the light emitting substrate 301 and the mechanical strength of the bypass capacitor 381 itself are increased, and the connection point is damaged. In addition, it is possible to reduce the possibility that the bypass capacitor 381 itself will be damaged. In addition, it is possible to improve the confirmation accuracy when visually confirming the presence or absence of mounting leakage of the bypass capacitor 381 . The longitudinal dimension of the bypass capacitor 381 may be smaller than 0.6 mm (for example, 0.4 mm), and the transverse dimension of the bypass capacitor 381 may be smaller than 0.3 mm. (for example, a configuration of 0.2 mm) or a configuration in which the dimension in the thickness direction is smaller than 0.3 mm (for example, a configuration of 0.2 mm).

On the first light emitting surface 302 of the light emitting substrate 301, a first pad 382a (or a first pad) made of metal (specifically, made of copper) corresponding to the first electrode 381a of the bypass capacitor 381 and a second electrode 381b are provided. A corresponding metal (specifically, copper) second pad 382b (or second pad) is provided. The first pad 382a and the second pad 382b are a pair. The first electrode 381a is electrically connected to the first pad 382a, and the second electrode 381b is electrically connected to the second pad 382b.

29A is a plan view of the second light emitting surface 303 of the light emitting substrate 301. FIG. As already described in the third embodiment, the second LED driver 326 has a power terminal 348 and a GND terminal 349 . 29B is a plan view of the second light emitting surface 303 of the light emitting substrate 301 showing an enlarged peripheral region 389 of the power terminal 348 and the GND terminal 349. FIG. As shown in FIGS. 28(b) and 29(b), the light-emitting substrate 301 has a first pad 382a (FIG. 28(b)) corresponding to the first electrode 381a of the bypass capacitor 381 and the second LED driver 326. A first through hole 383 is provided to electrically connect the GND terminal 349 (FIG. 29(b)), and a second pad 382b (FIG. 28(b)) corresponding to the second electrode 381b of the bypass capacitor 381 is provided. ) and the power terminal 348 (FIG. 29(b)) of the second LED driver 326 are provided. These through holes 383 and 384 are formed so as to pass through the light emitting substrate 301 in the thickness direction, and the inner peripheries of these through holes 383 and 384 are plated with a metal such as copper.

As shown in FIG. 28B, on the first light emitting surface 302 of the light emitting substrate 301, a first pad 382a and a GND via hole 385 (ground via hole or ground via hole) provided on the light emitting substrate 301 are electrically connected. A first wiring pattern 386a is provided to connect the first wiring pattern 386a, and a second wiring pattern 386b is provided to electrically connect the first pad 382a and the first through hole 383 to each other. A first pad 382a corresponding to the first electrode 381a of the bypass capacitor 381 is electrically connected to a GND plane layer (not shown) through a first wiring pattern 386a and a GND via hole 385, and a second wiring pattern. It is electrically connected to the GND terminal 349 (FIG. 29(b)) of the second LED driver 326 via 386b and the first through hole 383. FIG.

The first light emitting surface 302 of the light emitting substrate 301 is provided with a third wiring pattern 386c that electrically connects the second pads 382b and the power supply via holes 387 provided in the light emitting substrate 301, and the second pads 382b. and the second through hole 384 are provided. A second pad 382b corresponding to the second electrode 381b of the bypass capacitor 381 is electrically connected to a power plane layer (not shown) through a third wiring pattern 386c and a power via hole 387, and is connected to a fourth wiring pattern. It is electrically connected to the power supply terminal 348 (FIG. 29(b)) of the second LED driver 326 via 386d and the second through hole 384. FIG.

By placing the bypass capacitor 381 between the power terminal 348 of the second LED driver 326 and a power plane layer (not shown), it is included in the drive power supplied from the sound emission control device 81 to the second LED driver 326. Therefore, the influence of the noise component on the second LED driver 326 can be reduced. The bypass capacitor 381 (FIG. 28(b)) is connected to the power supply so that there is no electronic component such as another IC between the bypass capacitor 381 and the power supply terminal 348 (FIG. 29(b)) of the second LED driver 326. It is arranged close to terminal 348 . As a result, it is possible to increase the possibility that the noise component contained in the drive power supplied to the power supply terminal 348 of the second LED driver 326 is absorbed by the bypass capacitor 381, and that the second LED driver 326 absorbs the noise component. It is possible to reduce the possibility of being affected and malfunctioning. Also, by absorbing the noise component generated from the second LED driver 326 in the bypass capacitor 381, it is possible to prevent the noise component from malfunctioning electronic components such as other ICs.

In the light emitting substrate 301, the small chip components including the bypass capacitor 381 are concentrated on the first light emitting surface 302 side (FIG. 28(a)) and mounted on the second light emitting surface 303 side (FIG. 29(a)). It has not been. Therefore, by handling the light-emitting substrate 301 so that the stress acting on the first light-emitting surface 302 side of the light-emitting substrate 301 becomes smaller than the stress acting on the second light-emitting surface 303 side, the small chip component and the light-emitting substrate 301 It is possible to reduce the possibility of damage to the connecting portion of the small chip component itself, as well as to reduce the possibility of damage to the small chip component itself. For example, when an aggregate substrate (not shown) including a plurality of light emitting substrates 301 is divided and the light emitting substrates 301 are taken out, the size can be reduced by dividing the aggregate substrate in such a manner that the first light emitting surface 302 side has a valley shape (concave). It is possible to prevent a tensile stress from acting on the connecting portion between the chip component and the light emitting substrate 301 . As a result, it is possible to prevent the connecting portion between the small chip component and the light emitting substrate 301 from being damaged, and also prevent the small chip component itself from being damaged.

As shown in FIGS. 29(a) and 29(b), on the second light emitting surface 303 of the light emitting substrate 301, the first through holes 383 and the second through holes 384 are separated from the outer edge of the second LED driver 326 by approximately 0.8 mm. position. Also, as shown in FIGS. 28(a) and (b), the bypass capacitor 381 has a first through hole 383 and a second through hole 383 in the direction away from the second LED driver 326 (FIGS. 28(a) and (b)). It is mounted at a position approximately 0.8 mm away from the hole 384 .

As shown in FIG. 28( a ), the bypass capacitor 381 is arranged to avoid the driver rear side corresponding region 391 . The driver back side corresponding area 391 is provided with pads (or pads) corresponding to the area where the second LED driver 326 (FIG. 29) is mounted and the terminals of the second LED driver 326 on the second light emitting surface 303 (FIG. 29). It is a region of the first light emitting surface 302 located on the back side of the region where the light is present and a region within 1 mm from the region of the first light emitting surface 302 . A bypass capacitor 381 is provided in a region of the first light emitting surface 302 located behind the region where the second LED driver 326 is mounted on the second light emitting surface 303 and the region where pads corresponding to the terminals of the second LED driver 326 are provided. The non-mounted configuration reduces the influence of thermal stress that may act on the light emitting substrate 301 due to the heat generated by the second LED driver 326 on the bypass capacitor 381 . By arranging the bypass capacitor 381 so as to avoid the area 391 corresponding to the driver back side, it is possible to prevent the connection point between the bypass capacitor 381 and the light emitting substrate 301 from being damaged due to the thermal stress caused by the heat generated by the second LED driver 326. In addition, the bypass capacitor 381 itself can be prevented from being damaged.

As shown in FIG. 28(b), on the first light emitting surface 302 of the light emitting substrate 301, a first wiring for electrically connecting a first pad 382a corresponding to the first electrode 381a of the bypass capacitor 381 and a GND via hole 385 The pattern 386a is a linear wiring pattern drawn leftward from the left end of the first pad 382a. A third wiring pattern 386c electrically connecting the second pad 382b corresponding to the second electrode 381b of the bypass capacitor 381 and the power supply via hole 387 is a straight line extending leftward from the left end of the second pad 382b. It is a wiring pattern with a shape.

Of the four sides of the first pad 382a, the direction in which the side from which the first wiring pattern 386a is drawn when viewed from the center of the first pad 382a (leftward direction) is This direction is the same as the direction (leftward direction) in which the side from which the third wiring pattern 386c is drawn exists when viewed from the center of the second pad 382b. Therefore, it is possible to prevent a difference in temperature distribution between the pair of first pad 382a and second pad 382b in the initial heating stage of the reflow process. The direction in which the first wiring pattern 386a is drawn out from the first pad 382a is the same direction (to the left) as the direction in which the third wiring pattern 386c is drawn out from the second pad 382b. Therefore, it is possible to reduce the difference in temperature distribution that may occur in the pair of first pad 382a and second pad 382b in the initial stage of heating.

The first wiring pattern 386 a and the third wiring pattern 386 c are drawn out in a direction orthogonal or substantially orthogonal to the longitudinal direction of the decoupling capacitor 381 . Therefore, when the light emitting substrate 301 is distorted, the maximum value of the stress that can act on the connecting portion between the bypass capacitor 381 and the light emitting substrate 301 can be reduced, and the stress that can act on the bypass capacitor 381 itself can be reduced. Maximum value can be reduced. Also, the first wiring pattern 386 a and the third wiring pattern 386 c linearly extend in the longitudinal direction of the bypass capacitor 381 . Therefore, it is possible to reduce the possibility that the connecting portion between the bypass capacitor 381 and the light emitting substrate 301 is damaged due to the influence of distortion that may occur in the light emitting substrate 301, and the possibility that the bypass capacitor 381 itself is damaged.

On the first light-emitting surface 302 of the light-emitting substrate 301, the second wiring pattern 386b electrically connecting the first pad 382a corresponding to the first electrode 381a of the bypass capacitor 381 and the first through-hole 383 is connected to the first pad 382a. This is a linear wiring pattern that is pulled out to the right from the right end of the . A fourth wiring pattern 386d electrically connecting the second pad 382b corresponding to the second electrode 381b of the bypass capacitor 381 and the second through-hole 384 extends rightward from the right end of the second pad 382b. It is a linear wiring pattern with

Of the four sides of the first pad 382a, the direction in which the side from which the second wiring pattern 386b is drawn when viewed from the center of the first pad 382a (right direction) is It is the same direction as the direction (right direction) in which the side from which the fourth wiring pattern 386d is drawn exists when viewed from the center of the second pad 382b. Therefore, it is possible to prevent a difference in temperature distribution between the first pad 382a and the second pad 382b in the initial heating stage of the reflow process. The direction (right direction) in which the second wiring pattern 386b is drawn out from the first pad 382a is the same as the direction (right direction) in which the fourth wiring pattern 386d is drawn out from the second pad 382b. Therefore, it is possible to reduce the difference in temperature distribution that may occur in the pair of first pad 382a and second pad 382b in the initial stage of heating.

The second wiring pattern 386b and the fourth wiring pattern 386d are drawn out in a direction orthogonal or substantially orthogonal to the longitudinal direction of the decoupling capacitor 381. As shown in FIG. Therefore, when the light emitting substrate 301 is distorted, the maximum value of the stress that can act on the connecting portion between the bypass capacitor 381 and the light emitting substrate 301 can be reduced, and the stress that can act on the bypass capacitor 381 itself can be reduced. Maximum value can be reduced. The second wiring pattern 386b and the fourth wiring pattern 386d extend linearly in the longitudinal direction of the decoupling capacitor 381. As shown in FIG. Therefore, it is possible to reduce the possibility that the connecting portion between the bypass capacitor 381 and the light emitting substrate 301 is damaged due to the influence of distortion that may occur in the light emitting substrate 301, and the possibility that the bypass capacitor 381 itself is damaged.

According to this embodiment detailed above, the following excellent effects are obtained.

A bypass capacitor 381 for absorbing noise components contained in the driving power source of the second LED driver 326 mounted on the second light emitting surface 303 side of the light emitting substrate 301 is mounted on the board opposite to the second light emitting surface 303 . It is mounted on the first light emitting surface 302 side, which is a surface. Bypass capacitor 381 is a small chip component. A second pad 382b corresponding to the second electrode 381b of the bypass capacitor 381 is electrically connected to the power plane layer through the third wiring pattern 386c and the power via hole 387, and is connected to the fourth wiring pattern 386d and the second electrode via hole 387. It is electrically connected to the power terminal 348 of the second LED driver 326 through the through hole 384 . By disposing the bypass capacitor 381 between the power supply terminal 348 of the second LED driver 326 and the power plane layer, the noise component contained in the drive power supplied from the sound emission control device 81 to the second LED driver 326 is suppressed. to the second LED driver 326 can be reduced.

The bypass capacitor 381 is arranged close to the power terminal 348 so that there is no electronic component such as another IC between the bypass capacitor 381 and the power terminal 348 of the second LED driver 326 . As a result, it is possible to increase the possibility that the noise component contained in the drive power supplied to the power supply terminal 348 of the second LED driver 326 is absorbed by the bypass capacitor 381, and that the second LED driver 326 absorbs the noise component. It is possible to reduce the possibility of being affected and malfunctioning. Also, by absorbing the noise component generated from the second LED driver 326 in the bypass capacitor 381, it is possible to prevent the noise component from malfunctioning electronic components such as other ICs.

A first pad 382a corresponding to the first electrode 381a of the bypass capacitor 381 is electrically connected to the GND terminal 349 of the second LED driver 326 via the first through hole 383, and the second electrode 381b of the bypass capacitor 381 is electrically connected to the power terminal 348 of the second LED driver 326 through the second through hole 384 . For this reason, a bypass capacitor 381 for absorbing noise components contained in the driving power supply of the second LED driver 326 mounted on the second light emitting surface 303 side is provided on the plate surface opposite to the second light emitting surface 303 . It can be arranged on a certain first light emitting surface 302 side. In the configuration in which the bypass capacitor 381 is a small chip component, by arranging the bypass capacitor 381 on the first light emitting surface 302 side, the small chip components can be concentrated on the first light emitting surface 302 side of the light emitting substrate 301 . Therefore, by handling the light-emitting substrate 301 so that the stress acting on the first light-emitting surface 302 side of the light-emitting substrate 301 becomes smaller than the stress acting on the second light-emitting surface 303 side, the small chip components and the light-emitting substrate 301 It is possible to reduce the possibility of damage to the connection points of the small chip components and to reduce the possibility of damage to the small chip components themselves. For example, when an aggregate substrate (not shown) including a plurality of light emitting substrates 301 is divided and the light emitting substrates 301 are taken out, the size can be reduced by dividing the aggregate substrate in such a manner that the first light emitting surface 302 side has a valley shape (concave). It is possible to prevent a tensile stress from acting on the connecting portion between the chip component and the light emitting substrate 301 . As a result, it is possible to prevent the connecting portion between the small chip component and the light emitting substrate 301 from being damaged, and also prevent the small chip component itself from being damaged.

The bypass capacitor 381 is arranged to avoid the driver rear side corresponding region 391 . The area 391 corresponding to the driver back side is located on the back side of the area where the second LED driver 326 is mounted on the second light emitting surface 303 and the area where pads corresponding to the terminals of the second LED driver 326 are provided. and a region within 1 mm from the region of the first light emitting surface 302 . A bypass capacitor 381 is provided in a region of the first light emitting surface 302 located behind the region where the second LED driver 326 is mounted on the second light emitting surface 303 and the region where pads corresponding to the terminals of the second LED driver 326 are provided. The non-mounted configuration reduces the influence of thermal stress that may act on the light emitting substrate 301 due to the heat generated by the second LED driver 326 on the bypass capacitor 381 . By arranging the bypass capacitor 381 so as to avoid the area 391 corresponding to the driver back side, it is possible to prevent the connection point between the bypass capacitor 381 and the light emitting substrate 301 from being damaged due to the thermal stress caused by the heat generated by the second LED driver 326. In addition, the bypass capacitor 381 itself can be prevented from being damaged.

Of the four sides of the first pad 382a corresponding to the first electrode 381a of the decoupling capacitor 381, the direction in which the side from which the first wiring pattern 386a is drawn when viewed from the center of the first pad 382a exists. It is the same direction as the direction in which the side from which the third wiring pattern 386c is drawn out when viewed from the center of the second pad 382b among the four sides of the second pad 382b corresponding to the second electrode 381b. Therefore, it is possible to prevent a difference in temperature distribution between the pair of first pad 382a and second pad 382b in the initial heating stage of the reflow process. The direction in which the first wiring pattern 386a is drawn out from the first pad 382a is the same as the direction in which the third wiring pattern 386c is drawn out from the second pad 382b. Therefore, the difference in temperature distribution between the pair of first pad 382a and second pad 382b can be reduced in the initial stage of heating.

The first wiring pattern 386a and the third wiring pattern 386c are drawn out in a direction orthogonal or substantially orthogonal to the longitudinal direction of the decoupling capacitor 381 . Therefore, when the light emitting substrate 301 is distorted, the maximum value of the stress that can act on the connecting portion between the bypass capacitor 381 and the light emitting substrate 301 can be reduced, and the stress that can act on the bypass capacitor 381 itself can be reduced. Maximum can be reduced. Also, the first wiring pattern 386 a and the third wiring pattern 386 c linearly extend in the longitudinal direction of the bypass capacitor 381 . For this reason, it is possible to reduce the possibility that the connecting portion between the bypass capacitor 381 and the light emitting substrate 301 will be damaged due to the influence of distortion that may occur in the light emitting substrate 301, and the possibility that the bypass capacitor 381 itself will be damaged.

Of the four sides of the first pad 382a corresponding to the first electrode 381a of the decoupling capacitor 381, the direction in which the side from which the second wiring pattern 386b is drawn exists when viewed from the center of the first pad 382a is the decoupling capacitor 381 It is the same direction as the side in which the fourth wiring pattern 386d is drawn out when viewed from the center of the second pad 382b among the four sides of the second pad 382b corresponding to the second electrode 381b. Therefore, it is possible to prevent a difference in temperature distribution between the pair of first pad 382a and second pad 382b in the initial heating stage of the reflow process. The direction in which the second wiring pattern 386b is drawn out from the first pad 382a is the same as the direction in which the fourth wiring pattern 386d is drawn out from the second pad 382b. Therefore, the difference in temperature distribution between the pair of first pad 382a and second pad 382b can be reduced in the initial stage of heating.

The second wiring pattern 386b and the fourth wiring pattern 386d are drawn out in a direction orthogonal or substantially orthogonal to the longitudinal direction of the decoupling capacitor 381. As shown in FIG. Therefore, when the light emitting substrate 301 is distorted, the maximum value of the stress that can act on the connecting portion between the bypass capacitor 381 and the light emitting substrate 301 can be reduced, and the stress that can act on the bypass capacitor 381 itself can be reduced. Maximum value can be reduced. The second wiring pattern 386b and the fourth wiring pattern 386d extend linearly in the longitudinal direction of the bypass capacitor 381. As shown in FIG. For this reason, it is possible to reduce the possibility that the connecting portion between the bypass capacitor 381 and the light emitting substrate 301 will be damaged due to the influence of distortion that may occur in the light emitting substrate 301, and the possibility that the bypass capacitor 381 itself will be damaged.

In addition, on the first light emitting surface 302 of the light emitting substrate 301, the area 391 corresponding to the back side of the driver where the bypass capacitor 381 is not mounted is the area where the second LED driver 326 (FIG. 29) is mounted on the second light emitting surface 303 (FIG. 29). and the area of the first light emitting surface 302 located on the back side of the area where the pads corresponding to the terminals of the second LED driver 326 are provided and the distance from the area of the first light emitting surface 302 is limited to within 1 mm never. A region 391 corresponding to the driver back side is the first light emitting surface 302 located on the back side of the region where the second LED driver 326 is mounted on the second light emitting surface 303 and the region where pads corresponding to the terminals of the second LED driver 326 are provided. and a region within 2 mm from the region of the first light emitting surface 302 . As a result, it is possible to further reduce the influence of thermal stress that may act on the light emitting substrate 301 due to the heat generated by the second LED driver 326 on the small chip components. Therefore, it is possible to reduce the possibility that the connection point between the bypass capacitor 381 and the light emitting substrate 301 will be damaged due to the thermal stress caused by the heat generated by the second LED driver 326, and the possibility that the bypass capacitor 381 itself will be damaged. can be reduced. In addition, the driver back side corresponding region 391 is the first light emission located on the back side of the region where the second LED driver 326 is mounted on the second light emitting surface 303 and the region where pads corresponding to the terminals of the second LED driver 326 are provided. The distance from the area of the surface 302 and the area of the first light emitting surface 302 may be within 0.5 mm. As a result, while reducing the influence of thermal stress that may act on the light-emitting substrate 301 due to the heat generated by the second LED driver 326 on the small-sized chip components, the first light-emitting surface 302 of the light-emitting substrate 301 has a region where small-sized chip components can be mounted. area can be secured widely.

<Other embodiments>
It should be noted that the present invention is not limited to the description of the above-described embodiment, and various modifications and improvements are possible without departing from the spirit of the present invention. For example, it may be changed as follows. Incidentally, the configurations of the following different forms may be applied individually or in combination with the configuration of the above-described embodiment.

(1) In the above-described first embodiment, all electronic components including the connectors 111 and 112 and small chip components are concentrated on one mounting surface of the first decorative substrate 56, and the mounting A configuration in which the small chip parts are arranged to avoid the peripheral areas of the connectors 111 and 112 on the surface may be adopted. Specifically, a first connector 111, a second connector 112, and small chip components (bypass capacitors 85, 97 and small chip resistors 87, 101, 143) are mounted on the mounting surface, which is one plate surface of the first decoration board 56. 149) are integrated. No electronic components are mounted on the back surface of the first decorative substrate 56, which is the surface opposite to the mounting surface. In the first decoration board 56, no small chip components are mounted in the first connector peripheral area that is less than a predetermined distance (more specifically, less than 5 mm) from the outer edge of the first connector 111. FIG. The first connector peripheral region is a region where tensile stress is likely to act when the harness is attached to the first connector 111, and is a region where compressive stress is likely to act when the harness is removed from the first connector. In addition, no small chip component is mounted in the second connector peripheral area that is less than a predetermined distance (more specifically, less than 5 mm) from the second connector 112 . The second connector peripheral region is a region on which tensile stress tends to act when the harness is attached to the second connector 112 and a region on which compressive stress tends to act when the harness is removed from the second connector 112 . If a small chip component is mounted in the connector peripheral region, there is a risk that the connecting portion between the small chip component and the first decorative substrate 56 may be damaged when the harness is attached to or detached from the connectors 111 and 112. Damage to the small chip component itself may occur. On the other hand, since the small chip parts are arranged so as to avoid the area around the connectors, damage to the connection points between the small chip parts and the first decoration board 56 is prevented when the harnesses are attached to and detached from the connectors 111 and 112. In addition, damage to the small chip component itself is prevented.

Thus, in the configuration in which all the electronic components are concentrated on the mounting surface of the first decoration board 56, the small chip components are arranged on the mounting surface while avoiding the peripheral areas of the connectors 111 and 112. As a result, it is possible to prevent damage to the connecting portion between the small chip component and the first decoration board 56 when attaching and detaching the harness to and from the connectors 111 and 112, and also to prevent damage to the small chip component itself. .

(2) In the first embodiment, the wiring patterns 172a to 172d drawn from the pair of pads 171a and 171b may be drawn in different directions. Specifically, a first wiring pattern is drawn obliquely upward to the right from the right end of the first pad 171a corresponding to the first electrode 85a of the bypass capacitor 85, and extends diagonally upward to the right from the right end of the first pad 171a. A third wiring pattern is drawn obliquely downward to the right from the approximate vertical center of the right end of the second pad 171b. Even in a configuration in which the first wiring pattern and the third wiring pattern drawn out from the pads 171a and 171b are drawn out in different directions, the first pad 171a has four sides of the first pad 171a. and the direction in which the side of the second pad 171b among the four sides of the second pad 171b has a side from which the third wiring pattern is led when viewed from the center of the second pad 171b. By adopting a configuration in which .

(3) In the first embodiment, a part of the wiring patterns 172a to 172d drawn out from the pads 171a and 171b may extend in a direction not perpendicular to the longitudinal direction of the bypass capacitor 85. FIG. Specifically, as in the first embodiment, the first wiring pattern 172a is drawn rightward from the right end of the first pad 171a corresponding to the first electrode 85a of the bypass capacitor 85, A wiring pattern 172b is drawn leftward from the left end of the first pad 171a. Further, as in the first embodiment, the fourth wiring pattern 172d is drawn leftward from the left end of the second pad 171b corresponding to the second electrode 85b of the bypass capacitor 85. As shown in FIG. The third wiring pattern in this configuration is drawn out obliquely downward to the right from the right end of the second pad 171b. As described above, even if a part of the wiring patterns 172a to 172d drawn out from the pads 171a and 171b extends in a direction not orthogonal to the longitudinal direction of the bypass capacitor 85, the wiring patterns 172a to 172d drawn out from the pads 171a and 171b In comparison with the configuration in which the wiring pattern extends in the longitudinal direction of the bypass capacitor 85, the stress that can act on the connecting portion between the bypass capacitor 85 and the first decoration substrate 56 when the first decoration substrate 56 is distorted. can be reduced, and the maximum stress that can act on the bypass capacitor 85 itself can be reduced.

(4) In the first embodiment, the first decorative substrate 56 has a GND solid pattern (a solid ground pattern or a solid ground pattern) instead of the GND plane layer 93, and a power plane layer 94 instead of the power plane layer 94. A solid pattern may be provided. Specifically, the first decoration board is a two-layer board having a first mounting surface and a second mounting surface. A GND solid pattern and a power solid pattern, which are larger in area than the wiring patterns 172a to 172d, are formed on the second mounting surface of the first decorative substrate. A first wiring pattern 172a drawn out from a first pad 171a of the bypass capacitor 85 is electrically connected to the GND solid pattern through a through hole provided in the first decoration substrate, and a The drawn second wiring pattern 172 b is electrically connected to the GND terminal 154 of the LED driver 126 . Also, the third wiring pattern 172c drawn out from the second pad 171b of the bypass capacitor 85 is electrically connected to the power solid pattern through a through hole provided in the first decoration board, and the second pad A fourth wiring pattern 172 d drawn out from 171 b is electrically connected to the power terminal 151 of the LED driver 126 . The first wiring pattern 172a connected to the GND solid pattern having a larger area than the first pad 171a has a higher temperature in the initial stage of heating than the second wiring pattern 172b not connected to the GND solid pattern. is delayed. In addition, the third wiring pattern 172c connected to the power supply solid pattern having a larger area than the second pad 171b has a higher resistance in the initial stage of heating than the fourth wiring pattern 172d not connected to the power supply solid pattern. Slow temperature rise. Also in this configuration, in a configuration in which the same number (specifically, two) of wiring patterns 172a to 172d are drawn from the first pad 171a and the second pad 171b, the wiring patterns 172a to 172d of the four sides of the first pad 171a When viewed from the center of the first pad 171a, the direction in which the side from which the first wiring pattern 172a is drawn exists is the third wiring pattern 172c of the four sides of the second pad 171b when viewed from the center of the second pad 171b. It is the same direction as the direction in which the drawn edge exists. In addition, the direction in which the side from which the second wiring pattern 172b is led out of the four sides of the first pad 171a exists is the second of the four sides of the second pad 171b. It is the same direction as the side where the fourth wiring pattern 172d is drawn out when viewed from the center of the pad 171b. As a result, the difference in temperature distribution between the pair of pads 171a and 171b can be reduced in the initial stage of heating in the reflow process, and the rotation of the bypass capacitor 85 and the rise of the chip can be prevented.

(5) In the third embodiment, the second LED driver 326 for controlling the light emission of the LED chips 315 to 325 of the second light emitting surface 303 and the noise component contained in the driving power supply of the second LED driver 326 A noise absorption capacitor for absorbing noise may be mounted on the first light emitting surface 302 . The noise absorption capacitor in this configuration is a small chip component, like the bypass capacitor 85 in the first embodiment. By mounting the noise absorbing capacitor on the first light emitting surface 302, all the small chip parts mounted on the light emitting substrate 301 can be concentrated on the first light emitting surface 302 side while the noise absorbing capacitor is a small chip part. can. Therefore, by handling the light-emitting substrate 301 so that the stress acting on the first light-emitting surface 302 side of the light-emitting substrate 301 becomes smaller than the stress acting on the second light-emitting surface 303 side, the small chip components and the light-emitting substrate 301 It is possible to reduce the possibility of damage to the connection points of the small chip components and to reduce the possibility of damage to the small chip components themselves. For example, when an aggregate substrate (not shown) including a plurality of light emitting substrates 301 is divided and the light emitting substrates 301 are taken out, the size can be reduced by dividing the aggregate substrate in such a manner that the first light emitting surface 302 side has a valley shape (concave). It is possible to prevent a tensile stress from acting on the connecting portion between the chip component and the light emitting substrate 301 . As a result, it is possible to prevent the connecting portion between the small chip component and the light emitting substrate 301 from being damaged, and also prevent the small chip component itself from being damaged.

(6) In the third and fourth embodiments, instead of fixing the light-emitting substrate 301 to the substrate case with screws, the light-emitting substrate 301 is sandwiched between the substrate case from the front side and the back side. may be The board case has a front side case body and a back side case body. The front side case body is provided with a front side fixing protrusion that stands up on the back side, and the back side case body is provided with a back side fixing protrusion that stands up on the front side. The light-emitting substrate 301 is fixed to the substrate case by being sandwiched between the front-side fixing protrusion and the rear-side fixing protrusion. In the light-emitting substrate 301, the small chip component is arranged at a distance of 5 mm or more from the sandwiched portion between the front-side fixed protrusion and the rear-side fixed protrusion. As a result, it is possible to prevent the connecting portion between the small chip component and the light emitting substrate 301 from being damaged by the influence of the distortion of the light emitting substrate 301 which may occur in the vicinity of the clamping portion, and also prevent the small chip component itself from being damaged. .

(7) In each of the above-described embodiments, the direction in which the side from which the wiring pattern is drawn when viewed from the center of the first pad (or the first pad) among the four sides of the first pad (or the first pad) exists; or second pad), if the direction in which the side from which the wiring pattern is drawn out when viewed from the center of the second pad is the same direction, the wiring pattern is drawn out in the first pad. The lead position of the wiring pattern on the side where the wiring pattern is drawn may not be the same as the lead position of the wiring pattern on the side where the wiring pattern is drawn on the second pad. For example, in the above-described first embodiment, on the right side of the rectangular first pad 176a electrically connected to the first electrode 87a of the small chip resistor 87, from a position above the center in the vertical direction to the right The first wiring pattern 181a is drawn out to the second electrode 87b, and the second wiring pattern 181a extends rightward from a position below the center in the vertical direction on the right side of the rectangular second pad 176b electrically connected to the second electrode 87b. A configuration in which the wiring pattern 181b is drawn out may be employed. Also in such a configuration, the direction (right direction) in which the side from which the first wiring pattern 181a is drawn out of the four sides of the first pad 176a exists when viewed from the center of the first pad 176a, Since the direction (right direction) in which the side from which the second wiring pattern 181b is drawn out when viewed from the center of the second pad 176b among the four sides of 176b exists is the same direction (rightward direction), the initial stage of heating in the reflow process is the same. It is possible to reduce the possibility of a difference in temperature distribution between the first pad 176a and the second pad 176b.

(8) In each of the above embodiments, the first pad (or first pad) electrically connected to the first electrode of the small chip component and the second pad (or second pad) electrically connected to the second electrode of the small chip component. The shape of the pad is not limited to a rectangle, and may be a polygon such as a hexagon or an octagon. For example, in a configuration in which the first pad and the second pad are hexagonal in shape, the direction in which the side from which the first wiring pattern is drawn out of the six sides of the first pad exists when viewed from the center of the first pad. is the same direction as the direction in which the side from which the second wiring pattern is drawn out when viewed from the center of the second pad among the six sides of the second pad exists. It is possible to reduce the possibility of a difference in temperature distribution between the first pad and the second pad.

(9) In each of the above embodiments, the small chip parts (the bypass capacitors 85 and 97 and the small chip resistors 87 and 101 in the first embodiment, the bypass capacitor 291 in the second embodiment, the bypass Instead of the configuration in which narrowly defined electrodes (first electrodes 85a, 87a, 97a, 101a, 291a, 381a and second electrodes 85b, 87b, 97b, 101b, 291b, 381b) are provided in the capacitor 381), the compact A configuration in which terminals are provided on the chip component may be employed. As already explained in the first embodiment, a "terminal" is a linear terminal provided on an electronic component (including a small chip component) for electrical connection with a corresponding pad (or pad). In addition to being a metal part, in a narrow sense, an "electrode" is a metal part provided on an electronic component (including small chip components) for electrical surface connection with the corresponding pad (or pad). Yes, not including the above "terminals".

Specifically, the bypass capacitors 85, 97, 291, 381 are provided with a line extending from one end in the longitudinal direction along a plane orthogonal to the thickness direction of the bypass capacitors 85, 97, 291, 381. A linear first terminal is provided and extends from the other end of the decoupling capacitor 85 on the side opposite to the one end in the longitudinal direction to the other side opposite to the one side in the longitudinal direction. A configuration in which a second terminal is provided may be employed. Further, the small chip resistors 87 and 101 are provided with linear first terminals extending from one end in the longitudinal direction along a plane orthogonal to the thickness direction of the small chip resistors 87 and 101 to one side in the longitudinal direction. A linear second terminal is provided that extends from the other end of the small chip resistor 87 on the side opposite to the one end in the longitudinal direction to the other side opposite to the one side in the longitudinal direction. It may be configured as

(10) In each of the above embodiments, the LED drivers 126, 314, 326 may be provided with narrowly-defined electrodes instead of the terminals. As already explained in the first embodiment, a "terminal" is a linear terminal provided on an electronic component (including a small chip component) for electrical connection with a corresponding pad (or pad). In addition to being a metal part, in a narrow sense, an "electrode" is a metal part provided on an electronic component (including small chip components) for electrical surface connection with the corresponding pad (or pad). Yes, not including the above "terminals". Specifically, electrodes in a narrow sense are provided at locations facing pads (or pads) in the substantially rectangular parallelepiped housings of the LED drivers 126, 314, and 326, and the pads and the electrodes are electrically connected by soldering. It is good also as a structure connected to.

(11) In the above-described first embodiment, the slits 255 to 258 are provided at locations corresponding to the regions on which the decoupling capacitors 85 are mounted on the aggregate substrate 231, but the present invention is not limited to this. Instead, a second divided groove (divided groove with a thin bottom) that is deeper than the normal first divided groove may be formed at the location. The first split groove and the second split groove are formed linearly. The plate thickness of the bottom of the second split groove is smaller than the plate thickness of the bottom of the first split groove, and the mechanical strength of the second split groove is lower than the mechanical strength of the first split groove. Therefore, when the aggregate substrate 231 is divided into valleys with the first and second divided grooves existing on a straight line as base points, the stress acting around the second divided groove acts around the first divided groove. less than the stress that By providing a second dividing groove in the area corresponding to the area where the decoupling capacitor 85 is mounted on the collective board 231, the decoupling capacitor 85 and the first decoration board 56 are separated when the collective board 231 is divided. It is possible to reduce the stress that may act on the connection points, and reduce the stress that may act on the bypass capacitor 85 itself.

(12) In the first embodiment, the dividing grooves 232 to 247 are formed only on the first plate surface 268 side of the collective substrate 231. However, the dividing groove 232 is not limited to this. 247 may be provided on both the first plate surface 268 side and the second plate surface 269 side. The dividing grooves 232 to 247 are formed one each on the first plate surface 268 side and the second plate surface 269 side of the collective substrate 231, and the formation positions thereof are the first plate surface 268 side and the second plate surface. H.269 side is substantially matched. In this configuration, the discarded substrates 261 to 267 are provided with a mountain-side display by silk printing so that the plate surface that becomes a mountain-shaped (convex) can be confirmed when the aggregate substrate 231 is divided into valleys. The mountain side display is provided on the second plate surface 269 side. By setting the collective substrate 231 on the dividing jig 281 with the side printed with the mountain side display facing upward, the operator sets the collective substrate 231 so that the first plate surface 268 has a valley shape (concave). can be divided into valleys. The mountain side display is printed only on the discard board, and is not printed on the first decoration board 56 taken out from the collective board 231 . In this way, by adopting a configuration in which the side faces of the mountains are printed on the discarded substrates 261 to 267, it is possible to prevent the collective substrate 231 from being erroneously divided into mountains.

(13) In the first embodiment, the dividing grooves 232 to 235, 240, 241, 246, and 247 are formed at the boundaries between the first decorative substrate 56 and the discarded substrates 261, 263, and 266 in the collective substrate 231. However, it is not limited to this. It is also possible to adopt a configuration in which perforations are formed in which portions that are not connected to each other alternately exist. The mechanical strength of the perforations of the aggregate substrate 231 is lower than the mechanical strength of the peripheral area of the perforations. By providing perforations at the boundaries between the first decoration substrate 56 and the discarded substrates 261, 263, 266, the stress that may act on the connection points between the small chip components and the first decoration substrate 56 when dividing the collective substrate 231 is reduced. In addition, the stress that may act on the small chip component itself can be reduced.

(14) In the above-described first embodiment, a plurality of first decorative substrates 56 are set on the collective substrate 231, but the present invention is not limited to this, and a plurality of types of substrates are set on the collective substrate 231. It may be configured as Thereby, it is possible to take out a plurality of types of substrates from one collective substrate 231 .

(15) In the above-described first embodiment, a configuration may be adopted in which push position indications indicating positions to apply force to divide the collective board 231 into valleys are silk-printed on the collective board 231 . After fixing the substrate assembly 231 to the dividing jig 281, the operator can divide the substrate assembly 231 by pushing down the portion where the push position indication is printed with a finger. By designating the place to apply force to split the aggregate substrate 231 by the push position display, the stress that can be applied to the connecting portion between the small chip component and the first decoration substrate 56 when the aggregate substrate 231 is divided can be minimized. In addition to minimizing the stress that may act on the small chip component itself.

(16) In the first embodiment and the second embodiment, the decorative substrates 56 and 57 for executing the lighting effect are mounted with small chip parts (the bypass capacitor 85 and the small chip resistor 87). However, the configuration is not limited to this, and for example, a configuration in which a small chip component is mounted on a motor control board for executing a vibration performance that vibrates the pachinko machine 10 may be used. In addition, the main control board 61 provided in the main control device 60, the sound emission control board provided in the sound emission control device 81, the payout control board provided in the payout control device 77, and the power/launch control device 78 are provided. At least one of the power supply/emission control board and the display control board provided in the display control device 82 may have a small chip component mounted thereon.

(17) Display control based on commands sent from the main controller 60 instead of the configuration in which the display controller 82 is controlled by the sound emission control device 81 based on commands sent from the main controller 60 The device 82 may be configured to control the sound emission control device 81 . Further, instead of the configuration in which the sound emission control device 81 and the display control device 82 are provided separately, a configuration in which both control devices are provided as one control device may be used, and the function of one of these two control devices may be changed. may be integrated into the main controller 60 , or both functions of both controllers may be integrated into the main controller 60 . Also, the content of the command sent from the main control device 60 to the sound emission control device 81 and the content of the command sent from the sound emission control device 81 to the display control device 82 are also arbitrary.

(18) Other types of pachinko machines different from the above embodiments, such as a pachinko machine in which an electric accessory is released a predetermined number of times when a game ball enters a specific area of a special device, or a game ball in a specific area of a special device The present invention can also be applied to a pachinko machine that generates a right and a jackpot when a ball is entered, a pachinko machine equipped with other accessories, an arrange ball machine, a mahball, and the like.

In addition, a non-ball game machine, for example, equipped with a plurality of reels on which a plurality of types of patterns are attached in the circumferential direction, the rotation of the reel is started by inserting medals and operating the start lever, and the stop switch is operated. or after the reels are stopped by the lapse of a predetermined time, if a specific pattern or a combination of specific patterns is formed on the effective line that can be visually recognized from the display window, a privilege such as payout of medals is given to the player. The present invention can also be applied to slot machines.

In addition, the game machine main body which is openably and closably supported by the outer frame is provided with a storage portion and a take-in device, and after a predetermined number of game balls stored in the storage portion are taken in by the take-in device, the start lever is operated. The present invention can also be applied to a gaming machine that combines a pachinko machine and a slot machine, in which the reels start rotating.

<Invention groups extracted from the above embodiments>
Hereinafter, the features of the group of inventions extracted from each of the above-described embodiments will be described, showing effects and the like as necessary. In the following description, for ease of understanding, configurations corresponding to the above-described embodiments are appropriately shown in parentheses or the like, but are not limited to the specific configurations shown in parentheses or the like.

<Characteristic group A>
Feature A1. Predetermined electronic components (bypass capacitors 85, 97, small chip resistors 87, 101 in the first embodiment, bypass capacitor 291 in the second embodiment, bypass capacitor 381 in the fourth embodiment) In a game machine provided with substrates (first decorative substrate 56, second decorative substrate 57 in the first embodiment, light-emitting substrate 301 in the fourth embodiment),
The predetermined electronic component includes a first predetermined electrode (first electrodes 85a, 87a, 291a, 381a) and a second predetermined electrode (second electrodes 85b, 87b, 291b, 381b) as a pair of electrodes,
The predetermined substrate is
a first predetermined connection portion (first pads 171a, 176a, 293a, 382a) to which the first predetermined electrode is electrically connected;
a first predetermined wiring pattern (first wiring patterns 172a, 181a, 294a, 386a, second wiring patterns 172b, 294b, 386b) drawn from the first predetermined connection portion;
a second predetermined connection portion (second pads 171b, 176b, 293b, 382b) to which the second predetermined electrode is electrically connected;
a second predetermined wiring pattern (second wiring pattern 181b, third wiring patterns 172c, 294c, 386c, fourth wiring patterns 172d, 294d, 386d) drawn from the second predetermined connection portion;
and
When viewed from the center of the first predetermined connection portion, the direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is drawn out is the second direction when viewed from the center of the second predetermined connection portion. A gaming machine characterized in that the direction is the same as the direction in which the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn out exists.

According to feature A1, when viewed from the center of the first predetermined connection portion, the direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is drawn out is the same when viewed from the center of the second predetermined connection portion. It is the same direction as the side of the second predetermined connection portion from which the second predetermined wiring pattern is drawn. Therefore, the temperature distribution in the pair of the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating in the reflow process can be made uniform, and the adhesive applied onto the first predetermined connection portion and the second predetermined connection portion can be made uniform. It is possible to arrange the manner in which the solder paste is melted. As a result, it is possible to prevent the predetermined electronic component from rotating with the normal direction of the predetermined substrate as the rotation axis, and the predetermined electronic component can be mounted on one connecting portion (the first predetermined connecting portion or the second predetermined connecting portion). It is possible to prevent the occurrence of so-called chip standing, which is caused by only one electrode (the first predetermined electrode or the second predetermined electrode). Therefore, it is possible to secure the electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is possible to secure the electrical connection area between the second predetermined electrode and the second predetermined connection portion. .

Feature A2. The characteristic A1, wherein a direction in which the first predetermined wiring pattern is led out from the first predetermined connection portion is the same as a direction in which the second predetermined wiring pattern is led out from the second predetermined connection portion. The game machine described.

According to the characteristic A2, it is possible to reduce the possibility that a difference in temperature distribution between the first predetermined connection portion and the second predetermined connection portion occurs in the initial stage of heating in the reflow process.

Feature A3. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion through the first predetermined wiring pattern,
The second predetermined connection portion is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion via the second predetermined wiring pattern. The gaming machine according to feature A1 or A2.

According to feature A3, the predetermined wiring pattern is electrically connected to a large-area metal region (first metal region or second metal region) at a predetermined connection portion (first predetermined connection portion or second predetermined connection portion). In the initial stage of heating in the reflow process, the temperature of the side where the drawn-out portion of (the first predetermined wiring pattern or the second predetermined wiring pattern) exists tends to be delayed, but when viewed from the center of the first predetermined connection portion, the temperature rise in the initial stage of heating The direction in which the side whose temperature rise is likely to be delayed is the same direction as the direction in which the side whose temperature rise is likely to be delayed exists in the initial stage of heating when viewed from the center of the second predetermined connection portion. Thereby, the temperature distribution in the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating can be made uniform.

Feature A4. The wiring pattern drawn out from the first predetermined connection portion is only the first predetermined wiring pattern,
The gaming machine according to any one of features A1 to A3, wherein the wiring pattern drawn out from the second predetermined connection portion is only the second predetermined wiring pattern.

According to feature A4, it is possible to reduce the possibility of a difference occurring in the temperature distribution in the pair of first predetermined connection portion and second predetermined connection portion in the initial stage of heating.

Feature A5. The predetermined substrate is
a third predetermined wiring pattern (second wiring patterns 172b, 294b, 386b) drawn from the first predetermined connection portion;
a fourth predetermined wiring pattern (fourth wiring patterns 172d, 294d, 386d) drawn out from the second predetermined connection portion;
and
When viewed from the center of the first predetermined connection portion, the direction in which the side of the first predetermined connection portion from which the third predetermined wiring pattern is drawn exists is the fourth direction when viewed from the center of the second predetermined connection portion. The gaming machine according to any one of features A1 to A3, wherein the direction is the same as the direction in which the side of the second predetermined connecting portion from which the predetermined wiring pattern is drawn out exists.

According to feature A5, the configuration of feature A1 is provided, and the direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is drawn out exists when viewed from the center of the first predetermined connection portion is the second direction. In the configuration in which the side of the second predetermined connection portion from which the second predetermined wiring pattern is drawn exists in the same direction as viewed from the center of the predetermined connection portion, the second predetermined connection portion viewed from the center of the first predetermined connection portion 3. The direction in which the side of the first predetermined connection portion from which the predetermined wiring pattern is drawn is the direction of the second predetermined connection portion from which the fourth predetermined wiring pattern is drawn when viewed from the center of the second predetermined connection portion. It is the same direction as the direction in which the edge exists. Therefore, the temperature distribution in the pair of the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating in the reflow process can be made uniform, and the adhesive applied onto the first predetermined connection portion and the second predetermined connection portion can be made uniform. It is possible to arrange the manner in which the solder paste is melted. As a result, it is possible to prevent the predetermined electronic component from rotating around the normal direction of the predetermined substrate as a rotation axis, and the predetermined electronic component is mounted on one of the connecting portions (the first predetermined connecting portion or the second predetermined connecting portion). Therefore, it is possible to prevent the occurrence of so-called chip rising, which is caused only by the first electrode (the first predetermined electrode or the second predetermined electrode). Therefore, it is possible to secure the electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is possible to secure the electrical connection area between the second predetermined electrode and the second predetermined connection portion. .

Feature A6. The characteristic feature A5 is characterized in that the drawing direction of the third predetermined wiring pattern from the first predetermined connection portion is the same as the drawing direction of the fourth predetermined wiring pattern from the second predetermined connection portion. The game machine described.

According to the feature A6, it is possible to reduce the possibility of a difference in temperature distribution between the pair of first predetermined connection portion and second predetermined connection portion in the initial stage of heating in the reflow process.

Feature A7. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion through the first predetermined wiring pattern,
The third predetermined wiring pattern is not electrically connected to a metal region having a larger area than the first predetermined connection portion,
The second predetermined connection portion is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion through the second predetermined wiring pattern,
The game machine according to feature A5 or A6, wherein the fourth predetermined wiring pattern is not electrically connected to a metal region having a larger area than the second predetermined connection portion.

According to feature A7, the predetermined wiring pattern is electrically connected to a large metal region (first metal region or second metal region) at a predetermined connection portion (first predetermined connection portion or second predetermined connection portion). In the initial stage of heating in the reflow process, the temperature of the side where the lead-out portion of (the first predetermined wiring pattern or the second predetermined wiring pattern) exists tends to be delayed, but when viewed from the center of the first predetermined connection portion, the temperature rise in the initial stage of heating The direction in which the side whose temperature rise is likely to be delayed is the same direction as the direction in which the side whose temperature rise is likely to be delayed exists in the initial stage of heating when viewed from the center of the second predetermined connection portion. Also, when viewed from the center of the first predetermined connection portion, the direction in which the side where the third predetermined wiring pattern not electrically connected to the large-area metal region is drawn from the first predetermined connection portion exists , the same direction as the side where the fourth predetermined wiring pattern, which is not electrically connected to the large-area metal region from the second predetermined connection portion, extends when viewed from the center of the second predetermined connection portion. direction. Therefore, the temperature distribution in the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating can be made uniform.

Feature A8. In the connection object (pad electrically connected to the eighth output terminal 162 of the LED driver 126) electrically connected to the second predetermined connection portion using the second predetermined wiring pattern, the second predetermined wiring pattern is used. A portion to which the wiring pattern is connected is in a predetermined uniaxial direction (the second direction in FIGS. 8A and 8C) including the direction in which the second predetermined wiring pattern is led out from the second predetermined connection portion. DR2), it exists in the direction opposite to the direction in which the second predetermined wiring pattern is led out from the second predetermined connection portion with respect to the second predetermined connection portion, and
The second predetermined wiring pattern is pulled out from the second predetermined connection portion in the same direction as the direction in which the first predetermined wiring pattern is drawn out from the first predetermined connection portion, and then in the predetermined uniaxial direction. The gaming machine according to any one of features A1 to A7, wherein the game machine is drawn in the opposite direction with respect to the second predetermined connecting portion when viewed.

According to feature A8, when the second predetermined wiring pattern is viewed in the direction of one predetermined axis, the direction opposite to the direction in which the second predetermined wiring pattern is pulled out from the second predetermined connection portion is based on the second predetermined connection portion. Also in the configuration in which the second predetermined wiring pattern is connected to the connection target at the location existing in the second predetermined connection portion, the second predetermined wiring pattern is drawn out from the second predetermined connection portion in the same direction as the first predetermined wiring pattern is drawn out from the first predetermined connection portion. ing. As a result, it is possible to reduce the possibility of a difference in temperature distribution between the pair of the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating in the reflow process.

Feature A9. The predetermined electronic component has a configuration in which a dimension in a first direction orthogonal to a thickness direction of the predetermined electronic component is larger than a dimension in a second direction orthogonal to the thickness direction of the predetermined electronic component,
At least one of a direction in which the first predetermined wiring pattern is led out from the first predetermined connection portion and a direction in which the second predetermined wiring pattern is led out from the second predetermined connection portion is a direction orthogonal to the first direction or substantially The gaming machine according to any one of features A1 to A8, wherein the directions are perpendicular to each other.

According to feature A9, when the predetermined substrate is distorted, the maximum value of the stress that can act on the connecting portion between the predetermined electronic component and the predetermined substrate can be reduced, and the stress that can act on the predetermined electronic component itself can be reduced. can be reduced. As a result, it is possible to prevent the connecting portion between the predetermined electronic component and the predetermined substrate from being damaged, and also prevent the predetermined electronic component itself from being damaged.

Feature A10. The first predetermined connection portion, the second predetermined connection portion, the first predetermined wiring pattern, and the second predetermined wiring pattern are formed on a predetermined mounting surface (of the first decoration substrate 56) which is one side of the predetermined substrate. provided on the first mounting surface 84),
The gaming machine according to feature A9, wherein at least one of the first predetermined wiring pattern and the second predetermined wiring pattern is a wiring pattern extending linearly on the predetermined mounting surface.

According to feature A10, at least one of the first predetermined wiring pattern and the second predetermined wiring pattern extends linearly on the predetermined mounting surface. Therefore, when the predetermined substrate is distorted, it is possible to reduce the maximum value of the stress that can act on the connecting portion between the predetermined electronic component and the predetermined substrate, and the maximum value of the stress that can act on the predetermined electronic component itself. can be reduced. As a result, it is possible to prevent the connecting portion between the predetermined electronic component and the predetermined substrate from being damaged, and also prevent the predetermined electronic component itself from being damaged.

Feature A11. The predetermined substrate has predetermined non-penetrating via holes (via holes 174 and 175) extending from the predetermined mounting surface in the thickness direction of the predetermined substrate or predetermined through holes (first through holes 383) penetrating the predetermined substrate in the thickness direction. , second through holes 384),
At least one of the first predetermined wiring pattern and the second predetermined wiring pattern electrically connects the first predetermined connection portion or the second predetermined connection portion and the predetermined via hole or the predetermined through hole on the predetermined mounting surface. The gaming machine according to feature A10, characterized in that the wiring pattern is a linear wiring pattern connected to the .

According to feature A11, the predetermined substrate is distorted by providing predetermined via holes or predetermined through holes in the predetermined substrate and forming at least one of the first predetermined wiring pattern and the second predetermined wiring pattern as a linear wiring pattern. In the above, it is possible to reduce the maximum value of stress that can act on the connecting portion between the predetermined electronic component and the predetermined substrate, and reduce the maximum value of stress that can act on the predetermined electronic component itself.

Feature A12. The predetermined substrate is
a third predetermined wiring pattern (second wiring patterns 172b, 294b, 386b) drawn from the first predetermined connection portion;
a fourth predetermined wiring pattern (fourth wiring patterns 172d, 294d, 386d) drawn out from the second predetermined connection portion;
and
The predetermined electronic component has a configuration in which a dimension in a first direction orthogonal to a thickness direction of the predetermined electronic component is larger than a dimension in a second direction orthogonal to the thickness direction of the predetermined electronic component,
A direction in which the first predetermined wiring pattern is led out from the first predetermined connection portion, a direction in which the second predetermined wiring pattern is led out from the second predetermined connection portion, and a direction in which the third predetermined wiring pattern is led out from the first predetermined connection portion. and the direction in which the fourth predetermined wiring pattern is led out from the second predetermined connection portion are orthogonal or approximately orthogonal to the first direction. 1. The gaming machine according to 1.

According to feature A12, in the configuration in which the dimension of the predetermined electronic component in the first direction is larger than the dimension in the second direction, the direction in which the first predetermined wiring pattern is led out from the first predetermined connection portion and the direction in which the second predetermined wiring pattern The direction of extraction from the second predetermined connection portion, the direction of extraction of the third predetermined wiring pattern from the first predetermined connection portion, and the direction of extraction of the fourth predetermined wiring pattern from the second predetermined connection portion are directions orthogonal to the first direction or It is a direction that is substantially orthogonal. Therefore, when the predetermined substrate is distorted, it is possible to reduce the maximum value of the stress that can act on the connecting portion between the predetermined electronic component and the predetermined substrate, and the maximum value of the stress that can act on the predetermined electronic component itself. can be reduced.

Feature A13. The predetermined electronic component is a capacitor (the bypass capacitors 85 and 97 in the first embodiment, the bypass capacitor 291 in the second embodiment, the bypass capacitor 381 in the fourth embodiment) or a resistor (the The game machine according to any one of features A1 to A12, characterized in that it is a small chip resistor 87, 101).

According to feature A13, the configuration of feature A1 is provided, and the direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is drawn out exists when viewed from the center of the first predetermined connection portion is the second direction. It is the same direction as the side of the second predetermined connection portion from which the second predetermined wiring pattern is drawn when viewed from the center of the predetermined connection portion. Therefore, the temperature distribution in the pair of the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating in the reflow process can be made uniform, and the adhesive applied onto the first predetermined connection portion and the second predetermined connection portion can be made uniform. It is possible to arrange the manner in which the solder paste is melted. As a result, it is possible to prevent the capacitor or the resistor from rotating with the normal direction of the predetermined substrate as the axis of rotation, and the capacitor or the resistor can be prevented from rotating on one connecting portion (the first predetermined connecting portion or the second predetermined connecting portion). Therefore, it is possible to prevent the occurrence of so-called chip rising, which is caused by only one electrode (first predetermined electrode or second predetermined electrode). Therefore, it is possible to secure the electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is possible to secure the electrical connection area between the second predetermined electrode and the second predetermined connection portion. .

Feature A14. Predetermined electronic components (bypass capacitors 85, 97, small chip resistors 87, 101 in the first embodiment, bypass capacitor 291 in the second embodiment, bypass capacitor 381 in the fourth embodiment) In a game machine provided with substrates (first decorative substrate 56, second decorative substrate 57 in the first embodiment, light-emitting substrate 301 in the fourth embodiment),
The predetermined electronic component includes a first predetermined electrode (first electrodes 85a, 87a, 291a, 381a) and a second predetermined electrode (second electrodes 85b, 87b, 291b, 381b) as a pair of electrodes,
The predetermined substrate is
a first predetermined connection portion (first pads 171a, 176a, 293a, 382a) to which the first predetermined electrode is electrically connected;
a first predetermined wiring pattern (first wiring patterns 172a, 181a, 294a, 386a, second wiring patterns 172b, 294b, 386b) drawn from the first predetermined connection portion;
a second predetermined connection portion (second pads 171b, 176b, 293b, 382b) to which the second predetermined electrode is electrically connected;
a second predetermined wiring pattern (second wiring pattern 181b, third wiring patterns 172c, 294c, 386c, fourth wiring patterns 172d, 294d, 386d) drawn from the second predetermined connection portion;
and
A gaming machine, wherein a direction in which the first predetermined wiring pattern is led out from the first predetermined connection portion is the same as a direction in which the second predetermined wiring pattern is led out from the second predetermined connection portion.

According to feature A14, the direction in which the first predetermined wiring pattern is led out from the first predetermined connection portion is the same as the direction in which the second predetermined wiring pattern is led out from the second predetermined connection portion. It is possible to reduce the possibility of a difference in temperature distribution occurring in the pair of the first predetermined connection portion and the second predetermined connection portion in the initial stage, and at the same time, it is possible to coat the first predetermined connection portion and the second predetermined connection portion. It is possible to arrange the manner in which the solder paste is melted. As a result, it is possible to prevent the predetermined electronic component from rotating with the normal direction of the predetermined substrate as the rotation axis, and the predetermined electronic component can be mounted on one connecting portion (the first predetermined connecting portion or the second predetermined connecting portion). It is possible to prevent the occurrence of so-called chip standing, which is caused by only one electrode (the first predetermined electrode or the second predetermined electrode). Therefore, it is possible to secure the electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is possible to secure the electrical connection area between the second predetermined electrode and the second predetermined connection portion. .

For the configuration of features A1 to A14, any one of features A1 to A14, features B1 to B12, features C1 to C12, features D1 to D12, features E1 to E6, features F1 to F15, feature G1, and feature H1 or one or more configurations may be applied. As a result, it is possible to obtain a synergistic effect due to the combined configuration.

<Characteristic group B>
Feature B1. Predetermined electronic components (bypass capacitors 85, 97, small chip resistors 87, 101 in the first embodiment, bypass capacitor 291 in the second embodiment, bypass capacitor 381 in the fourth embodiment) In a game machine provided with substrates (first decorative substrate 56, second decorative substrate 57 in the first embodiment, light-emitting substrate 301 in the fourth embodiment),
The predetermined electronic component has a configuration in which a dimension in a first direction orthogonal to a thickness direction of the predetermined electronic component is larger than a dimension in a second direction orthogonal to the thickness direction of the predetermined electronic component,
The predetermined substrate is
Predetermined connection portions (first pads 171a, 176a, 293a, 382a) to which the electrodes (first electrodes 85a, 87a, 291a, 381a, second electrodes 85b, 87b, 291b, 381b) of the predetermined electronic component are electrically connected , second pads 171b, 176b, 293b, 382b);
Predetermined wiring patterns (first wiring patterns 172a, 181a, 294a, 386a, second wiring patterns 172b, 294b, 386b, second wiring pattern 181b, third wiring patterns 172c, 294c, 386c) drawn out from the predetermined connection portion , fourth wiring patterns 172d, 294d, 386d),
with
A gaming machine, wherein a direction in which the predetermined wiring pattern is pulled out from the predetermined connecting portion is a direction perpendicular to or substantially perpendicular to the first direction.

According to feature B1, the direction in which the predetermined wiring pattern is led out from the predetermined connection portion is a direction orthogonal or substantially orthogonal to the first direction. Therefore, when the predetermined substrate is distorted, it is possible to reduce the maximum value of the stress that can act on the connecting portion between the predetermined electronic component and the predetermined substrate, and the maximum value of the stress that can act on the predetermined electronic component itself. can be reduced. As a result, it is possible to prevent the connecting portion between the predetermined electronic component and the predetermined substrate from being damaged. Further, by reducing the maximum value of stress that can act on the predetermined electronic component itself, it is possible to prevent the predetermined electronic component itself from being damaged.

Feature B2. The predetermined connection portion and the predetermined wiring pattern are provided on a predetermined mounting surface (the first mounting surface 84 of the first decorative substrate 56), which is one plate surface of the predetermined substrate,
The game machine according to feature B1, wherein the predetermined wiring pattern is a wiring pattern extending linearly on the predetermined mounting surface.

According to feature B2, the predetermined wiring pattern extends linearly on the predetermined mounting surface. Therefore, when the predetermined substrate is distorted, it is possible to reduce the maximum value of the stress that can act on the connecting portion between the predetermined electronic component and the predetermined substrate, and the maximum value of the stress that can act on the predetermined electronic component itself. can be reduced. As a result, it is possible to prevent the connecting portion between the predetermined electronic component and the predetermined substrate from being damaged, and also prevent the predetermined electronic component itself from being damaged.

Feature B3. The predetermined substrate has non-through predetermined via holes (via holes 174 and 175) extending from the predetermined mounting surface in the thickness direction of the predetermined substrate or predetermined through holes (first through holes 383) penetrating the predetermined substrate in the thickness direction. , second through holes 384),
The gaming machine according to feature B2, wherein the predetermined wiring pattern is a linear wiring pattern that electrically connects the predetermined connection portion and the predetermined via hole or the predetermined through hole on the predetermined mounting surface. .

According to feature B3, by providing a predetermined via hole or a predetermined through hole in the predetermined substrate and making the predetermined wiring pattern a linear wiring pattern, the predetermined electronic component and the predetermined substrate can be connected when the predetermined substrate is distorted. It is possible to reduce the maximum value of stress that can act on the part and reduce the maximum value of stress that can act on the predetermined electronic component itself.

Feature B4. The predetermined electronic component includes first predetermined electrodes (first electrodes 85a, 87a, 291a, 381a) and second predetermined electrodes (second electrodes 85b, 87b, 291b, 381b),
The predetermined substrate is
a first predetermined connection portion (first pads 171a, 176a, 293a, 382a) which is the predetermined connection portion to which the first predetermined electrode is electrically connected;
a first predetermined wiring pattern (first wiring patterns 172a, 181a, 294a, 386a, second wiring patterns 172b, 294b, 386b) which is the predetermined wiring pattern electrically connected to the first predetermined connection portion;
a second predetermined connection portion (second pads 171b, 176b, 293b, 382b) which is the predetermined connection portion to which the second predetermined electrode is electrically connected;
Second predetermined wiring patterns (second wiring pattern 181b, third wiring patterns 172c, 294c, 386c, fourth wiring patterns 172d, 294d, fourth wiring patterns 172d, 294d, 386d) and
and
A direction in which the first predetermined wiring pattern is led out from the first predetermined connection portion and a direction in which the second predetermined wiring pattern is led out from the second predetermined connection portion are directions perpendicular to or substantially perpendicular to the first direction. The game machine according to any one of features B1 to B3, characterized by:

According to feature B4, the direction in which the first predetermined wiring pattern is led out from the first predetermined connection portion and the direction in which the second predetermined wiring pattern is led out from the second predetermined connection portion are orthogonal or substantially orthogonal to the first direction. is the direction. Therefore, when the predetermined substrate is distorted, it is possible to reduce the maximum value of the stress that can act on the connecting portion between the predetermined electronic component and the predetermined substrate, and the maximum value of the stress that can act on the predetermined electronic component itself. can be reduced. As a result, it is possible to prevent the connecting portion between the predetermined electronic component and the predetermined substrate from being damaged. Further, by reducing the maximum value of stress that can act on the predetermined electronic component itself, it is possible to prevent the predetermined electronic component itself from being damaged.

Feature B5. When viewed from the center of the first predetermined connection portion, the direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is drawn out is the second direction when viewed from the center of the second predetermined connection portion. The game machine according to feature B4, wherein the direction is the same as the direction in which the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn out exists.

According to feature B5, the temperature distribution in the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating in the reflow process can be made uniform, and the adhesive is applied onto the first predetermined connection portion and the second predetermined connection portion. It is possible to arrange the manner in which the solder paste is melted. As a result, it is possible to prevent the predetermined electronic component from rotating with the normal direction of the predetermined substrate as the rotation axis, and the predetermined electronic component can be mounted on one connecting portion (the first predetermined connecting portion or the second predetermined connecting portion). It is possible to prevent the occurrence of so-called chip standing, which is caused by only one electrode (the first predetermined electrode or the second predetermined electrode). Therefore, it is possible to secure the electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is possible to secure the electrical connection area between the second predetermined electrode and the second predetermined connection portion. .

Feature B6. The game machine according to feature B4 or B5, wherein the predetermined electronic component includes the first predetermined electrode and the second predetermined electrode as a pair of electrodes.

According to feature B6, the configuration of feature B4 is provided, and the direction in which the lead-out position of the first predetermined wiring pattern from the first predetermined connection portion exists when viewed from the center of the first predetermined connection portion is the second predetermined connection portion. As viewed from the center of the second predetermined wiring pattern, the lead position from the second predetermined connection portion is the same direction. The temperature distribution in the connecting portion can be made uniform, and the mode of melting of the solder paste applied on the pair of first predetermined connecting portion and second predetermined connecting portion can be made uniform. As a result, it is possible to prevent the predetermined electronic component from rotating with the normal direction of the predetermined substrate as the rotation axis, and the predetermined electronic component can be mounted on one connecting portion (the first predetermined connecting portion or the second predetermined connecting portion). It is possible to prevent the occurrence of so-called chip standing, which is caused by only one electrode (the first predetermined electrode or the second predetermined electrode). Therefore, it is possible to secure the electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is possible to secure the electrical connection area between the second predetermined electrode and the second predetermined connection portion. .

Feature B7. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion through the first predetermined wiring pattern,
The second predetermined connection portion is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion via the second predetermined wiring pattern. The gaming machine according to any one of features B4 to B6.

According to feature B7, the predetermined wiring pattern is electrically connected to a large-area metal region (first metal region or second metal region) at a predetermined connection portion (first predetermined connection portion or second predetermined connection portion). In the initial stage of heating in the reflow process, the temperature of the side where the drawn-out portion of (the first predetermined wiring pattern or the second predetermined wiring pattern) exists tends to be delayed, but when viewed from the center of the first predetermined connection portion, the temperature rise in the initial stage of heating The direction in which the side whose temperature rise is likely to be delayed is the same direction as the direction in which the side whose temperature rise is likely to be delayed exists in the initial stage of heating when viewed from the center of the second predetermined connection portion. Thereby, the temperature distribution in the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating can be made uniform.

Feature B8. The wiring pattern drawn out from the first predetermined connection portion is only the first predetermined wiring pattern,
The gaming machine according to any one of features B4 to B7, wherein the wiring pattern drawn out from the second predetermined connection portion is only the second predetermined wiring pattern.

According to feature B8, the configuration of feature B4 is provided, and the direction in which the first predetermined wiring pattern is led out from the first predetermined connection portion and the direction in which the second predetermined wiring pattern is led out from the second predetermined connection portion are in the first direction. In the configuration in which the directions are perpendicular or substantially perpendicular, the wiring pattern drawn out from the first predetermined connection portion is only the first predetermined wiring pattern, and the wiring pattern drawn out from the second predetermined connection portion is the first wiring pattern. 2 Only predetermined wiring patterns are provided. Therefore, when the predetermined substrate is distorted, it is possible to reduce the maximum value of the stress that can act on the connecting portion between the predetermined electronic component and the predetermined substrate, and the maximum value of the stress that can act on the predetermined electronic component itself. can be reduced.

Feature B9. The predetermined substrate is
a third predetermined wiring pattern (second wiring patterns 172b, 294b, 386b) drawn from the first predetermined connection portion;
a fourth predetermined wiring pattern (fourth wiring patterns 172d, 294d, 386d) drawn out from the second predetermined connection portion;
and
A direction in which the third predetermined wiring pattern is led out from the first predetermined connection portion and a direction in which the fourth predetermined wiring pattern is led out from the second predetermined connection portion are directions perpendicular to or substantially perpendicular to the first direction. The game machine according to any one of features B4 to B7, characterized by:

According to feature B9, the first predetermined wiring pattern, the second predetermined wiring pattern, the third predetermined wiring pattern, and the fourth predetermined wiring pattern extend in a direction orthogonal or substantially orthogonal to the first direction. Therefore, when the predetermined substrate is distorted, it is possible to reduce the maximum value of the stress that can act on the connecting portion between the predetermined electronic component and the predetermined substrate, and the maximum value of the stress that can act on the predetermined electronic component itself. can be reduced. As a result, it is possible to prevent the connecting portion between the predetermined electronic component and the predetermined substrate from being damaged, and also prevent the predetermined electronic component itself from being damaged.

Feature B10. When viewed from the center of the first predetermined connection portion, the direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is drawn out is the second direction when viewed from the center of the second predetermined connection portion. the same direction as the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn,
When viewed from the center of the first predetermined connection portion, the direction in which the side of the first predetermined connection portion from which the third predetermined wiring pattern is drawn exists is the fourth direction when viewed from the center of the second predetermined connection portion. The game machine according to characteristic B9, wherein the direction is the same as the direction in which the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn out exists.

According to feature B10, the configuration of feature B4 is provided, and the direction in which the lead-out position of the first predetermined wiring pattern from the first predetermined connection section exists when viewed from the center of the first predetermined connection section is the second predetermined connection section. When viewed from the center of the second predetermined wiring pattern, the lead position of the second predetermined wiring pattern from the second predetermined connection portion is the same as the direction in which the third predetermined wiring pattern extends when viewed from the center of the first predetermined connection portion. The direction in which the lead-out position from the first predetermined connection portion exists is the same direction as the direction in which the lead-out position of the fourth predetermined wiring pattern from the second predetermined connection portion exists when viewed from the center of the second predetermined connection portion. Therefore, the temperature distribution in the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating in the reflow process can be made uniform, and the solder applied on the first predetermined connection portion and the second predetermined connection portion can be evened out. It is possible to arrange the manner in which the paste melts. As a result, it is possible to prevent the predetermined electronic component from rotating about the normal direction of the predetermined substrate as the rotation axis, and the predetermined electronic component rises on one of the predetermined connection portions with only one of the predetermined electrodes, so-called standing chip occurs. can be prevented. Therefore, it is possible to ensure the electrical connection area between the predetermined electrode and the predetermined connection portion.

Feature B11. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion through the first predetermined wiring pattern,
The third predetermined wiring pattern is not connected to a metal region having a larger area than the first predetermined connection portion,
The second predetermined connection portion is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion through the second predetermined wiring pattern,
The game machine according to feature B9 or B10, wherein the fourth predetermined wiring pattern is not connected to a metal region having a larger area than the second predetermined connection portion.

According to feature B11, only the first predetermined wiring pattern among the first predetermined wiring pattern and the third predetermined wiring pattern drawn out from the first predetermined connection portion is connected to a metal region having a larger area than the first predetermined connection portion. Only the second predetermined wiring pattern of the second predetermined wiring pattern and the fourth predetermined wiring pattern drawn out from the second predetermined connection portion is connected to a metal region having a larger area than the second predetermined connection portion. ing. Therefore, in the initial stage of heating in the reflow process, it is possible to reduce the possibility of a difference between the manner in which the temperature of the first predetermined wiring pattern rises and the manner in which the temperature of the second predetermined wiring pattern rises. Further, the third wiring pattern drawn out from the first predetermined connection portion and the fourth predetermined wiring pattern drawn out from the second predetermined connection portion are not electrically connected to the wide metal region. Therefore, in the initial stage of heating in the reflow process, it is possible to reduce the possibility of a difference between the manner in which the temperature of the third predetermined wiring pattern rises and the manner in which the temperature of the fourth predetermined wiring pattern rises. Thereby, it is possible to prevent the temperature distribution in the first predetermined connection portion from being different from the temperature distribution in the second predetermined connection portion.

Feature B12. The predetermined electronic component is a capacitor (the bypass capacitors 85 and 97 in the first embodiment, the bypass capacitor 291 in the second embodiment, the bypass capacitor 381 in the fourth embodiment) or a resistor (the The game machine according to any one of features B1 to B11, characterized in that it is a small chip resistor 87, 101).

According to feature B12, the configuration of feature B1 is provided, and the direction in which the predetermined wiring pattern is led out from the predetermined connection portion is a direction orthogonal or substantially orthogonal to the first direction. Therefore, when the given substrate is distorted, the maximum value of stress that can act on the connecting portion between the capacitor or resistor and the given substrate can be reduced, and the stress that can act on the capacitor or resistor itself can be reduced. Maximum value can be reduced. By reducing the maximum value of stress that can act on the connecting portion between the capacitor or resistor and the predetermined substrate, it is possible to prevent the connecting portion between the capacitor or resistor and the predetermined substrate from being damaged. Also, by reducing the maximum value of stress that can act on the capacitor or resistor itself, damage to the capacitor or resistor itself can be prevented.

For the configuration of features B1 to B12, any one of features A1 to A14, features B1 to B12, features C1 to C12, features D1 to D12, features E1 to E6, features F1 to F15, feature G1, and feature H1 or one or more configurations may be applied. As a result, it is possible to obtain a synergistic effect due to the combined configuration.

<Characteristic group C>
Feature C1. A first predetermined electronic component (connectors 111 and 112 in the first embodiment, a second LED driver 326, a connector 327, and LED chips 315 to 325 in the third embodiment) and a second predetermined electronic component smaller than the first predetermined electronic component A predetermined substrate (first decoration substrate 56 , in a gaming machine equipped with a light emitting substrate 301),
The first predetermined electronic component is mounted on a first predetermined plate surface (second mounting surface 95, second light emitting surface 303), which is one plate surface of the predetermined substrate,
The second predetermined electronic component is mounted on a second predetermined plate surface (first mounting surface 84, first light emitting surface 302) opposite to the first predetermined plate surface of the predetermined substrate,
A gaming machine characterized in that the second predetermined electronic component is not mounted in an area on the second predetermined plate surface that is behind the area on the first predetermined plate surface in which the first predetermined electronic component is mounted. .

According to the feature C1, since the second predetermined electronic component is not mounted in the area behind the area in the first predetermined plate surface in which the first predetermined electronic component is mounted in the second predetermined plate surface, When a stress that distorts the predetermined substrate acts on the region, it is possible to prevent damage to the connecting portion between the second predetermined electronic component and the predetermined substrate due to the influence of the stress, and to prevent damage to the second predetermined electronic component itself. can be prevented.

Feature C2. Areas (areas 203 and 204 corresponding to the back side of the connector, areas 203 and 204 corresponding to the back side of the driver, corresponding to the back side of the driver The gaming machine according to feature C1, wherein the second predetermined electronic component is not mounted in the region 354 and the LED back side corresponding regions 361 to 371).

According to feature C2, in the second predetermined plate surface, the second predetermined electronic component is also present in a region that is less than a predetermined distance from the region behind the region on the first predetermined plate surface where the first predetermined electronic component is mounted. Since the configuration is not mounted, when a stress that distorts the predetermined substrate acts on a region that is less than the predetermined distance from the back side region, the second predetermined electronic component and the predetermined substrate are affected by the stress. While being able to prevent that the connection location with is damaged, it can prevent that the 2nd predetermined electronic component itself is damaged.

Feature C3. A specific electronic component (LED chip 310) larger than the second predetermined electronic component is mounted on the second predetermined plate surface side of the predetermined substrate,
In a region (LED back side corresponding region 368) of the second predetermined plate surface that is less than a predetermined distance from a region on the back side of the region where the first predetermined electronic component is mounted on the first predetermined plate surface, the specific electronic The game machine according to feature C2, characterized in that parts are mounted.

According to feature C3, the configuration of feature C2 is provided, and the distance from the area on the first predetermined plate surface where the first predetermined electronic component is mounted is less than a predetermined distance on the second predetermined plate surface. In the configuration in which the second predetermined electronic component is not mounted, the specific electronic component is mounted in an area that is less than the predetermined distance from the rear side area. As a result, it is possible to secure a large area of the area in which the specific electronic component larger than the second predetermined electronic component can be arranged on the second predetermined plate surface.

Feature C4. A specific electronic component (LED chip 310) larger than the second predetermined electronic component is mounted on the second predetermined plate surface side of the predetermined substrate,
Features C1 to C3, wherein the specific electronic component is mounted in an area on the second predetermined plate surface behind the area on the first predetermined plate surface in which the first predetermined electronic component is mounted. 1. The gaming machine according to any one of the above.

According to the feature C4, the configuration of the feature C1 is provided, and the second predetermined electronic component is mounted on the second predetermined plate surface on the back side of the area on the first predetermined plate surface on which the first predetermined electronic component is mounted. In the configuration without the back side, the specific electronic component is mounted in the region on the back side. As a result, it is possible to secure a large area of the area in which the specific electronic component larger than the second predetermined electronic component can be arranged on the second predetermined plate surface.

Feature C5. The predetermined substrate is
a specific connection portion (a pad connected to the power supply terminal 348 of the second LED driver 326, a pad connected to the GND terminal 349) connected to the electrode of the first predetermined electronic component;
a predetermined connection portion (first pad 382a, second pad 382b) connected to the electrode of the second predetermined electronic component (electrode 381a, 381b of bypass capacitor 381);
a predetermined wiring pattern (second wiring pattern 386b, fourth wiring pattern 386d) electrically connecting the predetermined connection portion and the specific connection portion;
and
The predetermined wiring pattern is electrically connected to the predetermined connection portion on the second predetermined plate surface outside the area behind the area where the first predetermined electronic component is mounted on the first predetermined plate surface. ,
The second predetermined electronic component is mounted in an area on the second predetermined plate surface that is behind the area on the first predetermined plate surface where the first predetermined electronic component is mounted (mounting area for the second LED driver 326). The game machine according to any one of features C1 to C4, characterized in that it does not

According to feature C5, the predetermined wiring pattern is extended to the outside of the area on the second predetermined plate surface behind the area where the first predetermined electronic component is mounted on the first predetermined plate surface, and is electrically connected to the predetermined connection portion. By doing so, it is possible to prevent the second predetermined electronic component from being arranged in the area on the back side.

Feature C6. The second predetermined electronic component is not mounted in a predetermined outer edge region (a region less than 10 mm from the outer edge of the first decorative substrate 56) whose distance from the outer edge of the predetermined substrate is less than the predetermined distance. The gaming machine according to any one of features C1 to C5.

According to feature C6, the second predetermined electronic component is arranged on the predetermined substrate while avoiding the predetermined outer edge region. For this reason, when handling the predetermined board, an operator's hand accidentally touches the second predetermined electronic component, and the connecting portion between the second predetermined electronic component and the predetermined board or the second predetermined electronic component itself is damaged. Possibility can be reduced. Further, in a method of manufacturing a predetermined substrate by dividing an aggregate substrate including a plurality of predetermined substrates to obtain the plurality of predetermined substrates, the second predetermined electronic component and the predetermined substrate are connected when the aggregate substrate is divided. It is possible to reduce the stress that may act on the part, and reduce the stress that may act on the second predetermined electronic component itself. As a result, it is possible to prevent the connecting portion between the second predetermined electronic component and the predetermined substrate from being damaged when dividing the collective substrate, and also prevent the second predetermined electronic component itself from being damaged.

Feature C7. The gaming machine according to feature C6, wherein the first predetermined electronic component is mounted in the predetermined outer edge area.

According to feature C7, in the configuration of feature C6 above, in which the second predetermined electronic component is not mounted in the predetermined outer edge area, by mounting the first predetermined electronic component in the predetermined outer edge area, the predetermined outer edge Compared to a configuration in which both the second predetermined electronic component and the first predetermined electronic component are not mounted in the region, it is possible to ensure a large area of the region where the first predetermined electronic component can be mounted on the predetermined substrate.

Feature C8. The predetermined substrate is provided with substrate fixing portions (fixing through-holes 56d to 56g) for fixing the predetermined substrate,
Any one of features C1 to C7, characterized in that the second predetermined electronic component is not mounted in a fixing portion peripheral region (through-hole peripheral regions 211a to 211d) whose distance from the substrate fixing portion is less than a specific distance. 1. The gaming machine according to 1.

According to feature C8, since the second predetermined electronic component is arranged so as to avoid the area around the fixing portion, when the predetermined board is fixed, the connecting portion between the second predetermined electronic component and the predetermined board can be affected. The stress can be reduced, and the stress that can act on the second predetermined electronic component itself can be reduced.

Feature C9. The gaming machine according to feature C8, wherein the first predetermined electronic component is mounted in the fixed portion peripheral area.

According to feature C9, in the configuration having the configuration of feature C8, in which the second predetermined electronic component is not mounted in the fixed portion peripheral region, by mounting the first predetermined electronic component in the fixed portion peripheral region, Compared to a configuration in which both the second predetermined electronic component and the first predetermined electronic component are not mounted in the fixed portion peripheral region, it is possible to secure a wider area of the region where the first predetermined electronic component can be mounted on the predetermined substrate. can.

Feature C10. In the first predetermined plate surface of the predetermined substrate, a predetermined outer edge area (an area less than 10 mm from the outer edge of the first decorative substrate 56), which is less than a predetermined distance from the outer edge of the predetermined substrate, includes the second Predetermined electronic parts are not mounted,
The game machine according to feature C8 or C9, wherein the board fixing portion is provided in the predetermined outer edge region.

According to feature C10, by arranging the fixing portion in the predetermined outer edge region where the second predetermined electronic component cannot be disposed, it is possible to secure a large area of the region where the second predetermined electronic component can be mounted on the predetermined substrate. Further, in a method for manufacturing a predetermined substrate by dividing an aggregate substrate including a plurality of predetermined substrates to obtain the plurality of predetermined substrates, the second predetermined electronic component and the predetermined substrate are connected when the aggregate substrate is divided. It is possible to reduce the stress that may act on the part, and reduce the stress that may act on the second predetermined electronic component itself. As a result, it is possible to prevent the connecting portion between the second predetermined electronic component and the predetermined board from being damaged when dividing the collective substrate, and also prevent the second predetermined electronic component itself from being damaged. By providing the fixing portion at the outer edge, it is possible to reduce the area of the region on the predetermined substrate where the second predetermined electronic component cannot be mounted.

Feature C11. Any one of features C1 to C10, wherein the first predetermined electronic component is a connector (connectors 111, 112, 327), an IC (second LED driver 326), or an LED chip (LED chips 315 to 325) The gaming machine described in .

According to feature C11, when the first predetermined electronic component is a connector, it is possible to reduce the tensile stress that may act on the connecting portion between the second predetermined electronic component and the predetermined substrate when attaching the harness to the connector. Also, it is possible to reduce the compressive stress that may act on the connecting portion between the second predetermined electronic component and the predetermined board when the harness is removed from the connector. As a result, when the harness is attached to or detached from the connector, it is possible to prevent the connecting portion between the second predetermined electronic component and the predetermined board from being damaged, and also prevent the second predetermined electronic component itself from being damaged. Further, when the first predetermined electronic component is an IC, the IC is arranged so as to avoid the predetermined back side region. It is possible to prevent the connecting portion between the second predetermined electronic component and the predetermined board from being damaged by the influence, and also prevent the second predetermined electronic component itself from being damaged. Furthermore, when the first predetermined electronic component includes an LED chip, since the LED chip is arranged to avoid the predetermined back side area, the LED chip generates heat and thermal stress acts on the predetermined substrate. In such a case, it is possible to prevent the connecting portion between the second predetermined electronic component and the predetermined substrate from being damaged by the influence of the stress, and also prevent the second predetermined electronic component itself from being damaged.

Feature C12. The second predetermined electronic component is a capacitor (the bypass capacitors 85 and 97 in the first embodiment, the bypass capacitor 291 in the second embodiment, the bypass capacitor 381 in the fourth embodiment) or a resistor (the The gaming machine according to any one of features C1 to C11, characterized in that the small chip resistors 87, 101) are in the form of small chip resistors.

According to feature C12, having the configuration of feature C1, a capacitor or a resistor is mounted in a region on the second predetermined plate surface behind the region on the first predetermined plate surface where the first predetermined electronic component is mounted. Therefore, when a stress that distorts the predetermined substrate acts on the area on the back side, it is possible to prevent damage to the connection points between the capacitor or resistor and the predetermined substrate due to the influence of the stress. , the capacitor or resistor itself can be prevented from being damaged.

For the configuration of features C1 to C12, any one of features A1 to A14, features B1 to B12, features C1 to C12, features D1 to D12, features E1 to E6, features F1 to F15, feature G1, and feature H1 or one or more configurations may be applied. As a result, it is possible to obtain a synergistic effect due to the combined configuration.

<Characteristic group D>
Feature D1. In a game machine provided with predetermined substrates (first decorative substrate 56, second decorative substrate 57, light-emitting substrate 301),
The predetermined substrate includes first predetermined electronic components (connectors 111 and 112 in the first embodiment, second LED driver 326, connector 327, and LED chips 315 to 325 in the third embodiment) and the first predetermined electronic components. A plurality of second predetermined electronic components (bypass capacitor 85 and small chip resistor 87 in the first embodiment, bypass capacitor 328 and small chip resistors 331 to 335 in the third embodiment) smaller than the component are mounted. has been
The plurality of second predetermined electronic components are mounted on a first plate surface (first mounting surface 84, first light emitting surface 302), which is one plate surface of the predetermined substrate, and are mounted on the predetermined substrate. A gaming machine characterized in that no light is mounted on a second plate surface (second mounting surface 95, second light emitting surface 303) opposite to the first plate surface.

According to feature D1, the second predetermined electronic components are concentrated on the first board surface side of the predetermined board, and are not mounted on the second board surface side. Therefore, by handling the predetermined substrate so that the stress acting on the first plate surface side of the predetermined substrate becomes the minimum stress, it is possible to prevent the connecting portion between the second predetermined electronic component and the predetermined substrate from being damaged. At the same time, damage to the second predetermined electronic component itself can be prevented. For example, in a method for manufacturing a predetermined substrate by dividing an aggregate substrate in which a plurality of predetermined substrates are connected to obtain a plurality of predetermined substrates, the first plate surface on which the second predetermined electronic component is mounted has a valley shape (concave). By splitting the assembly board so that the tensile stress can be prevented from acting on the connecting portion between the second predetermined electronic component and the predetermined board, and at the same time, the tensile stress acts on the second predetermined electronic component itself. can be prevented. Moreover, it is possible to reduce the stress that may act on the connecting portion between the second predetermined electronic component and the predetermined substrate, and reduce the stress that may act on the second predetermined electronic component itself. As a result, when dividing the collective substrate, it is possible to prevent damage to the connecting portion between the second predetermined electronic component and the predetermined substrate, and also to prevent damage to the second predetermined electronic component itself.

Feature D2. A plurality of the first predetermined electronic components are mounted on the predetermined substrate,
Some of the first predetermined electronic components among the plurality of first predetermined electronic components are mounted on the second plate surface side,
The game machine according to feature D1, wherein some of the plurality of first predetermined electronic components are mounted on the first board surface side.

According to feature D2, in the configuration in which the first predetermined electronic component is mounted on both the first plate surface side and the second plate surface side of the predetermined substrate, the configuration of feature D1 is provided, and the plurality of second predetermined electronic components The components are concentrated on the first plate surface side of the predetermined substrate and are not mounted on the second plate surface side. Even in a configuration in which the first predetermined electronic components are mounted on both the first plate surface side and the second plate surface side of the predetermined substrate, the second predetermined electronic components are concentrated on the first plate surface side of the predetermined substrate. Therefore, if the predetermined substrate is handled so that the stress acting on the first plate surface side of the predetermined substrate becomes the minimum stress, the connecting portion between the second predetermined electronic component and the predetermined substrate will be damaged. In addition, it is possible to prevent damage to the second predetermined electronic component itself. In addition, by adopting a configuration in which the first predetermined electronic component is mounted on both the first plate surface side and the second plate surface side of the predetermined substrate, the degree of freedom in arranging the first predetermined electronic component on the predetermined substrate is increased. be able to.

Feature D3. Characteristic D1 or D2, characterized in that the second predetermined electronic component is not mounted in an area on the first plate surface behind the area on the second plate surface in which the first predetermined electronic component is mounted. The gaming machine described in .

According to the feature D3, when a stress that distorts the predetermined substrate acts on the region behind the region on the second plate surface where the first predetermined electronic component is mounted on the first plate surface, the stress exerts the influence of the stress. It is possible to prevent damage to the connecting portion between the second predetermined electronic component and the predetermined substrate, and prevent damage to the second predetermined electronic component itself.

Feature D4. The predetermined substrate is
a specific connection portion electrically connected to the electrode of the first predetermined electronic component (a pad connected to the power supply terminal 348 of the second LED driver 326, a pad connected to the GND terminal 349);
a predetermined connection portion (first pad 382a, second pad 382b) electrically connected to the electrode of the second predetermined electronic component (electrode 381a, 381b of bypass capacitor 381);
and
The game machine according to any one of features D1 to D3, wherein the predetermined connection portion and the specific connection portion are electrically connected.

According to feature D4, the second predetermined electronic component electrically connected to the first predetermined electronic component mounted on the second plate surface side is mounted on the first plate surface side opposite to the second plate surface side. By arranging the second predetermined electronic components on the first plate surface side, the second predetermined electronic components are not mounted on the second plate surface side.

Feature D5. The predetermined substrate is
a specific connection portion (a pad connected to the power supply terminal 348 of the second LED driver 326, a pad connected to the GND terminal 349) connected to the electrode of the first predetermined electronic component;
a predetermined connection portion (first pad 382a, second pad 382b) connected to the electrode of the second predetermined electronic component (electrode 381a, 381b of bypass capacitor 381);
a predetermined wiring pattern (second wiring pattern 386b, fourth wiring pattern 386d) electrically connecting the predetermined connection portion and the specific connection portion;
and
the predetermined wiring pattern is electrically connected to the predetermined connection portion on the first plate surface outside a region on the back side of the region on the second plate surface where the first predetermined electronic component is mounted;
The second predetermined electronic component is not mounted in the area on the first plate surface behind the area on the second plate surface where the first predetermined electronic component is mounted (mounting area for the second LED driver 326). The gaming machine according to any one of features D1 to D4, characterized by:

According to the characteristic D5, the predetermined wiring pattern is extended to the outside of the area behind the area on the second plate surface where the first predetermined electronic component is mounted on the first plate surface and electrically connected to the predetermined connection portion. Therefore, it is possible to prevent the second predetermined electronic component from being arranged in the area on the back side.

Feature D6. The second predetermined electronic component is a capacitor (the bypass capacitors 85 and 97 in the first embodiment, the bypass capacitor 291 in the second embodiment, the bypass capacitor 381 in the fourth embodiment) or a resistor (the The game machine according to any one of features D1 to D5, characterized in that the small chip resistors 87, 101) are in the form of small chip resistors.

According to feature D6, having the configuration of feature D1, the capacitors or resistors are concentrated on the first plate surface side of the predetermined substrate and are not mounted on the second plate surface side. Therefore, by handling the predetermined substrate so that the stress acting on the first plate surface side of the predetermined substrate is minimized, it is possible to prevent damage to the connection points between the capacitors or resistors and the predetermined substrate. , the capacitor or resistor itself can be prevented from being damaged. For example, in a method of manufacturing a predetermined substrate by dividing an aggregate substrate in which a plurality of predetermined substrates are connected to obtain a plurality of predetermined substrates, the first plate surface on which capacitors or resistors are mounted has a valley shape (concave). By splitting the assembly substrate so that it is possible to prevent tensile stress from acting on the connection points between the capacitors or resistors and the predetermined substrate, it is possible to prevent tensile stress from acting on the capacitors or resistors themselves. can do. In addition, it is possible to reduce the stress that may act on the connecting portion between the capacitor or resistor and the predetermined substrate, and reduce the stress that may act on the capacitor or resistor itself. As a result, it is possible to prevent the connection points between the capacitors or resistors and the predetermined substrate from being damaged when dividing the collective substrate, and also prevent the capacitors or resistors themselves from being damaged.

Feature D7. The second predetermined electronic component is not mounted in a predetermined outer edge region (a region less than 10 mm from the outer edge of the first decorative substrate 56) whose distance from the outer edge of the predetermined substrate is less than the predetermined distance. The gaming machine according to any one of features D1 to D6.

According to feature D7, the second predetermined electronic component is arranged on the predetermined substrate while avoiding the predetermined outer edge region. For this reason, when handling the predetermined board, an operator's hand accidentally touches the second predetermined electronic component, and the connecting portion between the second predetermined electronic component and the predetermined board or the second predetermined electronic component itself is damaged. Possibility can be reduced. Further, in a method of manufacturing a predetermined substrate by dividing an aggregate substrate including a plurality of predetermined substrates to obtain the plurality of predetermined substrates, the second predetermined electronic component and the predetermined substrate are connected when the aggregate substrate is divided. It is possible to reduce the stress that may act on the part, and reduce the stress that may act on the second predetermined electronic component itself. As a result, it is possible to prevent the connecting portion between the second predetermined electronic component and the predetermined substrate from being damaged when dividing the collective substrate, and also prevent the second predetermined electronic component itself from being damaged.

Feature D8. The game machine according to feature D7, wherein the first predetermined electronic component is mounted in the predetermined outer edge area.

According to the feature D8, in the configuration having the configuration of the feature D7, in which the second predetermined electronic component is not mounted in the predetermined outer edge area, by mounting the first predetermined electronic component in the predetermined outer edge area, the predetermined outer edge Compared to a configuration in which both the second predetermined electronic component and the first predetermined electronic component are not mounted in the region, it is possible to ensure a large area of the region where the first predetermined electronic component can be mounted on the predetermined substrate.

Feature D9. The predetermined substrate is provided with substrate fixing portions (fixing through-holes 56d to 56g) for fixing the predetermined substrate,
Features D1 to D8, characterized in that the second predetermined electronic component is arranged avoiding a fixing portion peripheral region (through-hole peripheral regions 211a to 211d) whose distance from the substrate fixing portion is less than a specific distance. 1. The gaming machine according to any one of the above.

According to feature D9, since the second predetermined electronic component is arranged so as to avoid the area around the fixing portion, when the predetermined board is fixed, it can act on the connecting portion between the second predetermined electronic component and the predetermined board. The stress can be reduced, and the stress that can act on the second predetermined electronic component itself can be reduced.

Feature D10. The game machine according to feature D9, wherein the first predetermined electronic component is mounted in the peripheral area of the fixed portion.

According to feature D10, in the configuration having the configuration of feature D9, in which the second predetermined electronic component is not mounted in the peripheral region of the fixed portion, by mounting the first predetermined electronic component in the peripheral region of the fixed portion, Compared to a configuration in which both the second predetermined electronic component and the first predetermined electronic component are not mounted in the fixed portion peripheral region, it is possible to secure a wider area of the region where the first predetermined electronic component can be mounted on the predetermined substrate. can.

Feature D11. In the first plate surface of the predetermined substrate, the second predetermined electronic parts are not mounted,
The game machine according to feature D9 or D10, wherein the board fixing portion is provided in the predetermined outer edge region.

According to feature D11, by arranging the fixing portion in the predetermined outer edge region where the second predetermined electronic component cannot be disposed, it is possible to secure a large area of the region where the second predetermined electronic component can be mounted on the predetermined substrate. Further, in a method of manufacturing a predetermined substrate by dividing an aggregate substrate including a plurality of predetermined substrates to obtain the plurality of predetermined substrates, the second predetermined electronic component and the predetermined substrate are connected when the aggregate substrate is divided. It is possible to reduce the stress that may act on the part, and reduce the stress that may act on the second predetermined electronic component itself. As a result, it is possible to prevent the connecting portion between the second predetermined electronic component and the predetermined substrate from being damaged when dividing the collective substrate, and also prevent the second predetermined electronic component itself from being damaged. By providing the fixing portion at the outer edge, it is possible to reduce the area of the region on the predetermined substrate where the second predetermined electronic component cannot be mounted.

Feature D12. A specific capacitor (the bypass capacitor 352 in the third embodiment) is mounted as the first predetermined electronic component on the second plate surface side of the predetermined substrate, and the first electronic component is mounted on the first plate surface side of the predetermined substrate. 2. A configuration in which a predetermined capacitor (bypass capacitor 328 in the third embodiment) is mounted as a predetermined electronic component, and a specific resistor (third chip resistors 336 to 346 in the embodiment) are mounted, and a predetermined resistor (small chip resistor 331 in the third embodiment) is mounted as the second predetermined electronic component on the first plate surface side of the predetermined substrate. 335) are implemented, the game machine according to any one of features D1 to D11.

According to feature D12, in a configuration in which a specific capacitor that is a first predetermined electronic component and a specific capacitor that is a second predetermined electronic component are mounted on a predetermined board, by arranging the predetermined capacitor on the first board surface side, , the second predetermined electronic components can be concentrated on the first plate surface side, and a state in which the second predetermined electronic components are not mounted on the second plate surface side can be obtained. Further, in a configuration in which a specific resistor, which is a first predetermined electronic component, and a specific resistor, which is a second predetermined electronic component, are mounted on a predetermined substrate, by arranging the predetermined resistor on the first board surface side, The second predetermined electronic components can be concentrated on the first plate surface side, and the second predetermined electronic component is not mounted on the second plate surface side.

Note that any one of features A1 to A14, features B1 to B12, features C1 to C12, features D1 to D12, features E1 to E6, features F1 to F15, features G1, and feature H1 or one or more configurations may be applied. As a result, it is possible to obtain a synergistic effect due to the combined configuration.

<Characteristic group E>
Feature E1. In a gaming machine provided with a predetermined substrate (first decorative substrate 56),
The predetermined substrate has a first predetermined electronic component (LED driver 126, LED chip 142) and a second predetermined electronic component (bypass capacitor 85, small chip resistor 87) smaller than the first predetermined electronic component. is implemented and
A plurality of connection portions (first pad 178a, second pad 178b) a resist is provided between
A plurality of connecting portions (first pads 171a, 176a) to which a plurality of electrodes (first electrodes 85a, 87a, second electrodes 85b, 87b) of the second predetermined electronic component are electrically connected on the predetermined substrate. , the second pad 171b, and the second pad 176b) are not provided with the resist,
An outline display (outline silks 213, 215) for partitioning the area is provided around the area in which the first predetermined electronic component is mounted on the predetermined substrate,
A game machine according to claim 1, characterized in that the predetermined board does not have an outline display for demarcating the area around the area where the second predetermined electronic component is mounted.

According to the feature E1, when visually confirming after mounting the first predetermined electronic component and the second predetermined electronic component, the outline display provided around the first predetermined electronic component is used to identify the first predetermined electronic component. It is possible to confirm whether or not there is a mounting omission, and it is possible to confirm whether or not a positional deviation of the first predetermined electronic component has occurred. By adopting a configuration in which no external shape display is provided around the second predetermined electronic component, it is possible to prevent the occurrence of a gap between the predetermined substrate and the metal mask in the area where the second predetermined electronic component is mounted. . As a result, it is possible to prevent the solder paste from entering between the connecting portions to which the resist is not applied and causing the two connecting portions to come into electrical contact with each other.

Feature E2. In the predetermined substrate, outside the area where the second predetermined electronic component is mounted, a component identification display (identification silk 217, 218) are provided.

According to feature E2, it is possible to visually confirm that the electronic component mounted on the predetermined board is the second predetermined electronic component based on the component identification display. In addition, in the configuration having the configuration of feature E1, and in the configuration in which the predetermined substrate is not provided with the external shape display for partitioning the region around the region where the second predetermined electronic component is mounted, the second electronic component is displayed based on the component identification display. It is possible to confirm whether or not the predetermined electronic component is mounted.

Feature E3. Outside the area where the first predetermined electronic component is mounted on the predetermined board, a first component identification display (identification Silks 214, 216) are provided,
Outside the area where the second predetermined electronic component is mounted on the predetermined board, a second component identification display (identification Silks 217, 218) are provided,
The gaming machine according to feature E1 or E2, wherein the character size of the second component identification display is the same as the character size of the first component identification display.

According to feature E3, it is possible to visually confirm that the electronic component mounted on the predetermined board is the first predetermined electronic component based on the first component identification display, and the second component identification display can Based on this, it is possible to visually confirm that the electronic component mounted on the predetermined board is the second predetermined electronic component. In addition, in the configuration having the configuration of feature E1, and in the configuration in which the predetermined substrate is not provided with the external shape display for partitioning the region around the region where the second predetermined electronic component is mounted, the second electronic component is displayed based on the component identification display. It is possible to confirm whether or not the predetermined electronic component is mounted.

With the configuration of feature E1, the second predetermined electronic component is smaller than the first predetermined electronic component, but the character size of the second component identification display is the same as the character size of the first component identification display. Therefore, it is possible to easily visually confirm that the electronic component mounted on the predetermined substrate is the second predetermined electronic component.

Feature E4. A predetermined control component (the LED driver 126 in the first embodiment, the second LED driver 326 in the fourth embodiment) is mounted on the predetermined substrate,
The predetermined substrate is
predetermined connection portions (second pads 171b, 382b) electrically connected to the electrodes of the second predetermined electronic component (second electrode 85b of bypass capacitor 85, second electrode 381b of bypass capacitor 381);
Specific connection portions (pad electrically connected to power terminal 151, pad electrically connected to power terminal 348) electrically connected to predetermined terminals (power terminals 151, 348) of the predetermined control component )When,
and
The predetermined connection portion and the specific connection portion are electrically connected,
The game machine according to any one of features E1 to E3, wherein no control component (IC) other than the predetermined control component is arranged between the predetermined terminal and the second predetermined electronic component. .

According to feature E4, it is possible to prevent other control components from malfunctioning due to the influence of noise components at predetermined terminals of the predetermined control components.

Feature E5. The gaming machine according to feature E4, wherein no electronic component other than the predetermined control component is arranged between the predetermined terminal and the second predetermined electronic component.

According to feature E5, it is possible to prevent other electronic components from malfunctioning under the influence of noise components at predetermined terminals of predetermined control components.

Feature E6. The second predetermined electronic component is a capacitor (the bypass capacitors 85 and 97 in the first embodiment, the bypass capacitor 291 in the second embodiment, the bypass capacitor 381 in the fourth embodiment) or a resistor (the The game machine according to any one of features E1 to E5, characterized in that the small chip resistors 87, 101) are in the form of small chip resistors.

According to feature E6, having the configuration of feature E1, it is possible to prevent the formation of a gap between the predetermined substrate and the metal mask in the region where the capacitor or resistor is mounted. As a result, it is possible to prevent the solder paste from flowing between the connecting portions to which the resist is not applied and causing the two connecting portions to come into electrical contact with each other.

For the configuration of features E1 to E6, any one of features A1 to A14, features B1 to B12, features C1 to C12, features D1 to D12, features E1 to E6, features F1 to F15, feature G1, and feature H1 or one or more configurations may be applied. As a result, it is possible to obtain a synergistic effect due to the combined configuration.

<Feature group F>
Feature F1. Predetermined substrates (first decorative substrate 56, second In a game machine equipped with a decorative substrate 57 and a light emitting substrate 301),
The predetermined electronic component has a dimension in a first direction (the longitudinal direction of the bypass capacitors 85, 97, 381 and the longitudinal direction of the small chip resistors 87, 101) orthogonal to the thickness direction of the predetermined electronic component. It is configured to be larger than the dimension in the second direction perpendicular to the thickness direction of the component (the lateral direction of the bypass capacitors 85, 97, 381 and the lateral direction of the small chip resistors 87, 101),
The predetermined substrate has a dimension in a predetermined direction (first direction DR1, major axis directions LD, LDA) along the surface of the predetermined substrate, which is a direction along the surface of the predetermined substrate and in the predetermined direction. A configuration that is larger than the dimension of a specific direction (second direction DR2, short axis directions SD, SDA) that is an orthogonal direction,
A gaming machine, wherein the predetermined electronic component is mounted on the predetermined substrate such that the first direction of the predetermined electronic component is parallel to the predetermined direction of the predetermined substrate.

According to feature F1, since the predetermined electronic component is mounted on the predetermined substrate such that the first direction of the predetermined electronic component is parallel to the predetermined direction of the predetermined substrate, the first direction of the predetermined electronic component is Compared to the configuration in which the predetermined electronic component is mounted on the predetermined board in a manner not parallel to the predetermined direction of the predetermined board, when the predetermined board is distorted, the connection portion between the predetermined electronic component and the predetermined board can be affected. The stress can be reduced, and the stress that can act on the predetermined electronic component itself can be reduced. As a result, it is possible to prevent the connecting portion between the predetermined electronic component and the predetermined substrate from being damaged. Moreover, by reducing the stress that may act on the predetermined electronic component itself when the predetermined substrate is distorted, it is possible to prevent the predetermined electronic component itself from being damaged.

Feature F2. The predetermined substrate includes specific electronic components (LED chips 317, 324, chip resistors 338, 345) larger than the predetermined electronic components,
The dimensions of the specific electronic component in a specific first direction (the longitudinal direction of the LED chips 317 and 324 and the longitudinal direction of the chip resistors 338 and 345) orthogonal to the thickness direction of the specific electronic component are A configuration that is larger than the dimension in a specific second direction (the lateral direction of the LED chips 317 and 324 and the lateral direction of the chip resistors 338 and 345) orthogonal to the thickness direction,
The gaming machine according to feature F1, wherein the specific electronic component is mounted on the predetermined substrate in such a manner that the specific first direction of the specific electronic component is not parallel to the predetermined direction of the predetermined substrate. .

According to feature F2, in a configuration in which the specific electronic component is mounted on the predetermined board in such a manner that the specific first direction of the specific electronic component is not parallel to the predetermined direction of the predetermined board, the configuration of feature F1 is provided, and the predetermined The electronic component is mounted on the predetermined substrate such that the first direction of the predetermined electronic component is parallel to the predetermined direction of the predetermined substrate. Therefore, in the configuration in which the stress that can act on the connection portion between the predetermined electronic component and the predetermined substrate and the stress that can act on the predetermined electronic component itself when the predetermined substrate is distorted are reduced, the specific electronic component on the predetermined substrate can increase the degree of freedom of implementation.

Feature F3. The game machine according to feature F1 or F2, wherein the outer shape of the predetermined board is neither rectangular nor substantially rectangular.

According to feature F3, in a configuration in which the external shape of the predetermined substrate is neither rectangular nor substantially rectangular, the predetermined electronic component has the configuration of feature F1, and the predetermined electronic component has a first direction parallel to a predetermined direction of the predetermined substrate. It is mounted on a predetermined substrate in such a manner as to For this reason, compared to the configuration in which the first direction of the predetermined electronic component is orthogonal to the predetermined direction of the predetermined substrate, stress that can act on the connection portion between the predetermined electronic component and the predetermined substrate when the predetermined substrate is distorted. can be reduced, and the stress that can act on the predetermined electronic component itself can be reduced.

Feature F4. The predetermined electronic component is a capacitor (the bypass capacitors 85 and 97 in the first embodiment, the bypass capacitor 291 in the second embodiment, the bypass capacitor 381 in the fourth embodiment) or a resistor (the A game machine according to any one of features F1 to F3, characterized in that it is a small chip resistor 87, 101).

According to feature F4, compared with the configuration of feature F1, the capacitor or resistor is mounted on the predetermined substrate in such a manner that the first direction of the capacitor or resistor is not parallel to the predetermined direction of the predetermined substrate. As a result, when the predetermined substrate is distorted, the stress that may act on the connecting portion between the capacitor or resistor and the predetermined substrate can be reduced, and the stress that may act on the capacitor or resistor itself can be reduced. . By reducing the stress that can act on the connection points between the capacitors or resistors and the predetermined substrate when the predetermined substrate is distorted, it is possible to prevent the connection points between the capacitors or resistors and the predetermined substrate from being damaged. In addition, by reducing the stress that may act on the capacitor or resistor itself when the predetermined substrate is distorted, the capacitor or resistor itself can be prevented from being damaged.

Feature F5. The predetermined substrate is
Predetermined connection portions (first pads 171a, 176a, 293a, 382a) to which the electrodes (first electrodes 85a, 87a, 291a, 381a, second electrodes 85b, 87b, 291b, 381b) of the predetermined electronic component are electrically connected , second pads 171b, 176b, 293b, 382b);
Predetermined wiring patterns (first wiring patterns 172a, 181a, 294a, 386a, second wiring patterns 172b, 294b, 386b, second wiring patterns 181b, third wiring patterns 172c, 294c, 386c) drawn out from the predetermined connection portions , fourth wiring patterns 172d, 294d, 386d),
and
The game machine according to any one of features F1 to F4, wherein a direction in which the predetermined wiring pattern is pulled out from the predetermined connection portion is a direction perpendicular to or substantially perpendicular to the first direction.

According to the feature F5, the predetermined wiring pattern extends in a direction perpendicular to or substantially perpendicular to the first direction. Therefore, when the predetermined substrate is distorted, it is possible to reduce the maximum value of the stress that can act on the connecting portion between the predetermined electronic component and the predetermined substrate, and the maximum value of the stress that can act on the predetermined electronic component itself. can be reduced. As a result, it is possible to prevent the connecting portion between the predetermined electronic component and the predetermined substrate from being damaged, and also prevent the predetermined electronic component itself from being damaged.

Feature F6. The predetermined connection portion and the predetermined wiring pattern are provided on a predetermined mounting surface (the first mounting surface 84 of the first decorative substrate 56), which is one plate surface of the predetermined substrate,
The game machine according to feature F5, wherein the predetermined wiring pattern is a wiring pattern extending linearly on the predetermined mounting surface.

According to feature F6, the predetermined wiring pattern extends linearly on the predetermined mounting surface. Therefore, when the predetermined substrate is distorted, it is possible to reduce the maximum value of the stress that can act on the connecting portion between the predetermined electronic component and the predetermined substrate, and the maximum value of the stress that can act on the predetermined electronic component itself. can be reduced. As a result, it is possible to prevent the connecting portion between the predetermined electronic component and the predetermined substrate from being damaged, and also prevent the predetermined electronic component itself from being damaged.

Feature F7. The predetermined substrate has non-through predetermined via holes (via holes 174 and 175) extending from the predetermined mounting surface in the thickness direction of the predetermined substrate or predetermined through holes (first through holes 383) penetrating the predetermined substrate in the thickness direction. , second through holes 384),
The gaming machine according to feature F6, wherein the predetermined wiring pattern is a linear wiring pattern that electrically connects the predetermined connection portion and the predetermined via hole or the predetermined through hole on the predetermined mounting surface. .

According to the feature F7, by providing a predetermined via hole or a predetermined through hole in the predetermined substrate and making the predetermined wiring pattern a linear wiring pattern, the predetermined electronic component and the predetermined substrate can be connected when the predetermined substrate is distorted. It is possible to reduce the maximum value of stress that can act on the part and reduce the maximum value of stress that can act on the predetermined electronic component itself.

Feature F8. The predetermined electronic component includes first predetermined electrodes (first electrodes 85a, 87a, 291a, 381a) and second predetermined electrodes (second electrodes 85b, 87b, 291b, 381b),
The predetermined substrate is
a first predetermined connection portion (first pads 171a, 176a, 293a, 382a) to which the first predetermined electrode is electrically connected;
a first predetermined wiring pattern (first wiring patterns 172a, 181a, 294a, 386a, second wiring patterns 172b, 294b, 386b) electrically connected to the first predetermined connection portion;
a second predetermined connection portion (second pads 171b, 176b, 293b, 382b) to which the second predetermined electrode is electrically connected;
a second predetermined wiring pattern (second wiring pattern 181b, third wiring patterns 172c, 294c, 386c, fourth wiring pattern 172d, 294d, 386d) electrically connected to the second predetermined connection portion;
and
A direction in which the first predetermined wiring pattern is led out from the first predetermined connection portion and a direction in which the second predetermined wiring pattern is led out from the second predetermined connection portion are directions orthogonal to the first direction of the predetermined electronic component. Or the gaming machine according to any one of features F1 to F7, wherein the directions are substantially perpendicular to each other.

According to feature F8, the direction in which the first predetermined wiring pattern is led out from the first predetermined connection portion and the direction in which the second predetermined wiring pattern is led out from the second predetermined connection portion are orthogonal or substantially orthogonal to the first direction. is the direction. Therefore, when the predetermined substrate is distorted, it is possible to reduce the maximum value of the stress that can act on the connecting portion between the predetermined electronic component and the predetermined substrate, and the maximum value of the stress that can act on the predetermined electronic component itself. can be reduced. As a result, it is possible to prevent the connecting portion between the predetermined electronic component and the predetermined substrate from being damaged, and also prevent the predetermined electronic component itself from being damaged.

Feature F9. When viewed from the center of the first predetermined connection portion, the direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is drawn out is the second direction when viewed from the center of the second predetermined connection portion. The game machine according to feature F8, characterized in that the direction is the same as the direction in which the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn out exists.

According to feature F9, the temperature distribution in the first predetermined connection portion and the second predetermined connection portion can be uniformed in the initial stage of heating in the reflow process, and the adhesive is applied to the first predetermined connection portion and the second predetermined connection portion. It is possible to arrange the manner in which the solder paste is melted. As a result, it is possible to prevent the predetermined electronic component from rotating with the normal direction of the predetermined substrate as the rotation axis, and the predetermined electronic component can be mounted on one connecting portion (the first predetermined connecting portion or the second predetermined connecting portion). It is possible to prevent the occurrence of so-called chip standing, which is caused by only one electrode (the first predetermined electrode or the second predetermined electrode). Therefore, it is possible to secure the electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is possible to secure the electrical connection area between the second predetermined electrode and the second predetermined connection portion. .

Feature F10. The game machine according to feature F8 or F9, wherein the predetermined electronic component includes the first predetermined electrode and the second predetermined electrode as a pair of electrodes.

According to feature F10, the configuration of feature F8 is provided, and the direction in which the lead-out position of the first predetermined wiring pattern from the first predetermined connection portion exists when viewed from the center of the first predetermined connection portion is the second predetermined connection portion. As viewed from the center of the second predetermined wiring pattern, the lead position from the second predetermined connection portion is the same direction. The temperature distribution in the connecting portion can be made uniform, and the mode of melting of the solder paste applied on the pair of first predetermined connecting portion and second predetermined connecting portion can be made uniform. As a result, it is possible to prevent the predetermined electronic component from rotating with the normal direction of the predetermined substrate as the rotation axis, and the predetermined electronic component can be mounted on one connecting portion (the first predetermined connecting portion or the second predetermined connecting portion). It is possible to prevent the occurrence of so-called chip standing, which is caused by only one electrode (the first predetermined electrode or the second predetermined electrode). Therefore, it is possible to secure the electrical connection area between the first predetermined electrode and the first predetermined connection portion, and it is possible to secure the electrical connection area between the second predetermined electrode and the second predetermined connection portion. .

Feature F11. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion through the first predetermined wiring pattern,
The second predetermined connection portion is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion via the second predetermined wiring pattern. The gaming machine according to any one of features F8 to F10.

According to feature F11, the predetermined wiring pattern is electrically connected to a large metal region (first metal region or second metal region) at a predetermined connection portion (first predetermined connection portion or second predetermined connection portion). In the initial stage of heating in the reflow process, the temperature of the side where the lead-out portion of (the first predetermined wiring pattern or the second predetermined wiring pattern) exists tends to be delayed, but when viewed from the center of the first predetermined connection portion, the temperature rise in the initial stage of heating The direction in which the side whose temperature rise is likely to be delayed is the same direction as the direction in which the side whose temperature rise is likely to be delayed exists in the initial stage of heating when viewed from the center of the second predetermined connection portion. Thereby, the temperature distribution in the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating can be made uniform.

Feature F12. The wiring pattern drawn out from the first predetermined connection portion is only the first predetermined wiring pattern,
The gaming machine according to any one of features F8 to F11, wherein the wiring pattern drawn out from the second predetermined connection portion is only the second predetermined wiring pattern.

According to feature F12, the configuration of feature F8 is provided, and the direction in which the first predetermined wiring pattern is led out from the first predetermined connection portion and the direction in which the second predetermined wiring pattern is led out from the second predetermined connection portion are in the first direction. In the configuration in which the directions are orthogonal or substantially orthogonal, the wiring pattern drawn out from the first predetermined connection portion is only the first predetermined wiring pattern, and the wiring pattern drawn out from the second predetermined connection portion is Only the second predetermined wiring pattern is provided. Therefore, when the predetermined substrate is distorted, it is possible to reduce the maximum value of the stress that can act on the connecting portion between the predetermined electronic component and the predetermined substrate, and the maximum value of the stress that can act on the predetermined electronic component itself. can be reduced.

Feature F13. The predetermined substrate is
a third predetermined wiring pattern (second wiring patterns 172b, 294b, 386b) drawn from the first predetermined connection portion;
a fourth predetermined wiring pattern (fourth wiring patterns 172d, 294d, 386d) drawn out from the second predetermined connection portion;
and
A direction in which the third predetermined wiring pattern is led out from the first predetermined connection portion and a direction in which the fourth predetermined wiring pattern is led out from the second predetermined connection portion are directions perpendicular to the first direction of the predetermined electronic component. Or the gaming machine according to any one of features F8 to F11, wherein the directions are substantially perpendicular to each other.

According to the feature F13, the first predetermined wiring pattern, the second predetermined wiring pattern, the third predetermined wiring pattern, and the fourth predetermined wiring pattern extend in a direction orthogonal or substantially orthogonal to the first direction. Therefore, when the predetermined substrate is distorted, it is possible to reduce the maximum value of the stress that can act on the connecting portion between the predetermined electronic component and the predetermined substrate, and the maximum value of the stress that can act on the predetermined electronic component itself. can be reduced. As a result, it is possible to prevent the connecting portion between the predetermined electronic component and the predetermined substrate from being damaged, and also prevent the predetermined electronic component itself from being damaged.

Feature F14. When viewed from the center of the first predetermined connection portion, the direction in which the side of the first predetermined connection portion from which the first predetermined wiring pattern is drawn out is the second direction when viewed from the center of the second predetermined connection portion. the same direction as the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn,
When viewed from the center of the first predetermined connection portion, the direction in which the side of the first predetermined connection portion from which the third predetermined wiring pattern is drawn exists is the fourth direction when viewed from the center of the second predetermined connection portion. The gaming machine according to feature F13, characterized in that the direction is the same as the direction in which the side of the second predetermined connection portion from which the predetermined wiring pattern is drawn out exists.

According to feature F14, the temperature distribution in the pair of the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating in the reflow process can be made uniform, and the temperature above the first predetermined connection portion and the second predetermined connection portion can be adjusted. It is possible to arrange the manner in which the solder paste applied to the surface melts. As a result, it is possible to prevent the predetermined electronic component from rotating about the normal direction of the predetermined substrate as the rotation axis, and the predetermined electronic component rises on one of the predetermined connection portions with only one of the predetermined electrodes, so-called standing chip occurs. can be prevented. Therefore, it is possible to secure an electrical connection area between the predetermined electrode and the predetermined connection portion.

Feature F15. The first predetermined connection portion is electrically connected to a first metal region (GND plane layer 93) having a larger area than the first predetermined connection portion through the predetermined wiring pattern,
The third predetermined wiring pattern is not electrically connected to a metal region having a larger area than the first predetermined connection portion,
The second predetermined connection portion is electrically connected to a second metal region (power plane layer 94) having a larger area than the second predetermined connection portion via the predetermined wiring pattern,
The gaming machine according to feature F13 or F14, wherein the fourth predetermined wiring pattern is not electrically connected to a metal region having a larger area than the second predetermined connection portion.

According to the feature F15, the predetermined wiring pattern is electrically connected to the wide metal region (first metal region or second metal region) at the predetermined connection portion (first predetermined connection portion or second predetermined connection portion). In the initial stage of heating in the reflow process, the temperature of the side where the lead-out portion of (the first predetermined wiring pattern or the second predetermined wiring pattern) exists tends to be delayed, but when viewed from the center of the first predetermined connection portion, the temperature rise in the initial stage of heating The direction in which the side whose temperature rise is likely to be delayed is the same direction as the direction in which the side whose temperature rise is likely to be delayed exists in the initial stage of heating when viewed from the center of the second predetermined connection portion. Also, when viewed from the center of the first predetermined connection portion, the direction in which the side where the third predetermined wiring pattern not electrically connected to the large-area metal region is drawn from the first predetermined connection portion exists , the same direction as the side where the fourth predetermined wiring pattern, which is not electrically connected to the large-area metal region from the second predetermined connection portion, extends when viewed from the center of the second predetermined connection portion. direction. Therefore, the temperature distribution in the first predetermined connection portion and the second predetermined connection portion in the initial stage of heating can be made uniform.

For the configuration of features F1 to F15, any one of features A1 to A14, features B1 to B12, features C1 to C12, features D1 to D12, features E1 to E6, features F1 to F15, feature G1, and feature H1 or one or more configurations may be applied. As a result, it is possible to obtain a synergistic effect due to the combined configuration.

<Characteristic group G>
Feature G1. A predetermined control component (the LED driver 126 in the first embodiment, the second LED driver 326 in the fourth embodiment) and a predetermined capacitor (the bypass capacitor 85 in the first embodiment, the bypass capacitor 381 in the fourth embodiment) In a game machine equipped with a mounted predetermined substrate (first decorative substrate 56, light emitting substrate 301),
The predetermined board has power supply wiring patterns (third wiring patterns 172c, 386c, fourth wiring patterns 172d, 386d), and
The predetermined capacitor is electrically connected to the power supply wiring pattern and the ground (GND plane layer 93),
A gaming machine, wherein no control component (IC) other than the predetermined control component is arranged between the predetermined terminal and the predetermined capacitor.

Feature G1. By allowing the predetermined capacitor to absorb the noise component of the driving power supplied to the predetermined terminal of the predetermined control component, it is possible to prevent the predetermined control component from malfunctioning under the influence of the noise component. Further, by allowing the predetermined capacitor to absorb the noise component generated from the predetermined control component, it is possible to prevent other electronic components from malfunctioning under the influence of the noise component.

For the configuration of feature G1, any one of features A1 to A14, features B1 to B12, features C1 to C12, features D1 to D12, features E1 to E6, features F1 to F15, feature G1, and feature H1 Or multiple configurations may be applied. As a result, it is possible to obtain a synergistic effect due to the combined configuration.

<Characteristic group H>
Feature H1. In a gaming machine provided with a predetermined substrate (first decorative substrate 56),
The predetermined substrate includes a first predetermined electronic component (the LED driver 126 and the LED chip 142 in the first embodiment) and a second predetermined electronic component smaller than the first predetermined electronic component (the bypass circuit in the first embodiment). A capacitor 85 and a small chip resistor 87) are mounted,
An outline display (outline silks 213, 215) for partitioning the area is provided around the area in which the first predetermined electronic component is mounted on the predetermined substrate,
A game machine according to claim 1, characterized in that the predetermined board does not have an outline display for demarcating the area around the area where the second predetermined electronic component is mounted.

According to the feature H1, in visual confirmation after mounting the first predetermined electronic component and the second predetermined electronic component, the first predetermined electronic component is detected by using the outline display provided around the first predetermined electronic component. In addition, it is possible to confirm whether or not the positional deviation of the first predetermined electronic component has occurred. In a configuration in which the second predetermined electronic component is smaller than the first predetermined electronic component, by not providing an external shape display around the second predetermined electronic component, in the visual check, the predetermined electronic component is not actually mounted. It is possible to prevent a worker from erroneously recognizing that a predetermined electronic component is mounted only by looking at the outline display despite the fact that the electronic component is mounted.

For the configuration of feature H1, any one of features A1 to A14, features B1 to B12, features C1 to C12, features D1 to D12, features E1 to E6, features F1 to F15, feature G1, and feature H1 Or multiple configurations may be applied. As a result, it is possible to obtain a synergistic effect due to the combined configuration.

According to the inventions according to the feature group A, the feature group B, the feature group C, the feature group D, the feature group E, the feature group F, the feature group G, and the feature group H, the following problems can be solved. It is possible to solve.

Pachinko machines, slot machines, and the like are known as types of gaming machines. In these gaming machines, it is known that a lottery is held based on the establishment of a predetermined lottery condition, and a privilege is given to the player according to the result of the lottery. In addition, it is common that an effect is performed to make the player predict or recognize the result of the lottery. These gaming machines are provided with a board on which electronic parts for advancing games and electronic parts for executing effects are mounted.

Specifically, for a pachinko machine, for example, a lottery is performed based on the entry of a game ball into a ball entry section provided in the game area, and a variable display of patterns is performed on the display surface of the display device, and the lottery is performed. A configuration is known in which, when a winning result is obtained in , a combination of specific patterns or the like is finally displayed on the display surface, and a transition is made to a special game state advantageous to the player. When the state shifts to the special game state, for example, opening and closing of a ball entry device or the like provided in the game area is started, and game balls are paid out based on the entry of the ball into the ball entry device. ing.

Here, in the gaming machines such as those exemplified above, it is necessary to mount the electronic components on the board in a suitable manner, and there is still room for improvement in this respect.

The basic configuration of a gaming machine to which each of the above features can be applied or to which each feature is applied is shown below.

Pachinko machine: an operation means operated by a player, a game ball shooting means for shooting game balls based on the operation of the operation means, a ball passage for guiding the shot game balls to a predetermined game area, and a game This game machine is provided with game parts arranged in an area, and gives a privilege to a player when a game ball passes through a predetermined passing part of the game parts.

A game machine such as a slot machine: equipped with a pattern display device for variably displaying a plurality of patterns, the variable display of the plurality of patterns is started by the operation of the start operation means, and the operation of the stop operation means is caused by the operation of the stop operation means. The game machine stops the variable display of the plurality of pictures after a predetermined period of time has passed, and gives a privilege to the player according to the pictures after the stop.

Reference Signs List 10 Pachinko machine 56 First decoration substrate 56d to 56g Fixed through hole 57 Second decoration substrate 84 First mounting surface 85 Bypass capacitor 85a First electrode 85b Second electrode , 87...Small chip resistor, 87a...First electrode, 87b...Second electrode, 93...GND plane layer, 94...Power supply plane layer, 95...Second mounting surface, 97...Bypass capacitor, 101...Small chip resistor , 111, 112... connector, 126... LED driver, 142... LED chip, 142a... first electrode, 142b... second electrode, 151... power supply terminal, 152, 153... terminal, 154... GND terminal, 155 to 162... terminal 171a first pad 171b second pad 172a first wiring pattern 172b second wiring pattern 172c third wiring pattern 172d fourth wiring pattern 174, 175 via hole 176a second wiring pattern 1 pad 176b...second pad 178a...first pad 178b...second pad 181a...first wiring pattern 181b...second wiring pattern 203, 204...connector back side corresponding area 211a to 211d...through hole Peripheral region 213... Outline silk 214... Identification silk 215... Outline silk 216 to 218... Identification silk 291... Bypass capacitor 291a... First electrode 291b... Second electrode 293a... First pad, 293b... Second pad 294a... First wiring pattern 294b... Second wiring pattern 294c... Third wiring pattern 294d... Fourth wiring pattern 301... Light emitting substrate 302... First light emitting surface 303... Second Light-emitting surface 310 LED chip 315 to 325 LED chip 326 Second LED driver 327 Connector 328 Bypass capacitor 331 to 335 Small chip resistor 336 to 346 Chip resistor 348 Power supply Terminals 349 GND terminal 352 Bypass capacitor 353, 354 Driver backside corresponding area 355, 361 to 371 LED backside corresponding area 381 Bypass capacitor 381a First electrode 381b Second electrode 382a 1st pad 382b 2nd pad 383 1st through hole 384 2nd through hole 386a 1st wiring pattern 386b 2nd wiring pattern 386c 3rd wiring pattern 386d 4th Wiring patterns, DR1...first direction, DR2...second direction, LD, LDA...long axis direction, SD, SDA... short axis direction.

Claims (6)

In a game machine equipped with a predetermined board,
A first predetermined electronic component and a second predetermined electronic component smaller than the first predetermined electronic component are mounted on the predetermined substrate,
a resist is provided between a plurality of connecting portions to which the plurality of electrodes of the first predetermined electronic component are electrically connected on the predetermined substrate;
The resist is not provided between a plurality of connecting portions to which the plurality of electrodes of the second predetermined electronic component are electrically connected on the predetermined substrate,
An outline display defining the area is provided around the area where the first predetermined electronic component is mounted on the predetermined substrate,
A game machine according to claim 1, characterized in that the predetermined board does not have an outline display for demarcating the area around the area where the second predetermined electronic component is mounted. In the predetermined substrate, outside the area where the second predetermined electronic component is mounted, a component identification display indicating that the electronic component mounted in the area is the second predetermined electronic component is provided. 2. The game machine according to claim 1, characterized in that there is a game machine. Outside the area where the first predetermined electronic component is mounted on the predetermined substrate, a first component identification display indicating that the electronic component mounted in the area is the first predetermined electronic component is provided. and
Outside the area where the second predetermined electronic component is mounted on the predetermined substrate, a second component identification display indicating that the electronic component mounted in the area is the second predetermined electronic component is provided. and
3. The game machine according to claim 1, wherein the character size of the second component identification display is the same as the character size of the first component identification display. A predetermined control component is mounted on the predetermined substrate,
The predetermined substrate is
a predetermined connection portion electrically connected to the electrode of the second predetermined electronic component;
a specific connection portion electrically connected to a predetermined terminal of the predetermined control component;
and
The predetermined connection portion and the specific connection portion are electrically connected,
4. The gaming machine according to any one of claims 1 to 3, wherein no control component other than said predetermined control component is arranged between said predetermined terminal and said second predetermined electronic component. 5. A gaming machine according to claim 4, wherein no electronic component other than said predetermined control component is arranged between said predetermined terminal and said second predetermined electronic component. 6. The gaming machine according to any one of claims 1 to 5, wherein said second predetermined electronic component is a capacitor or a resistor.

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