JP2008020791A5 - - Google Patents

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Publication number
JP2008020791A5
JP2008020791A5 JP2006193987A JP2006193987A JP2008020791A5 JP 2008020791 A5 JP2008020791 A5 JP 2008020791A5 JP 2006193987 A JP2006193987 A JP 2006193987A JP 2006193987 A JP2006193987 A JP 2006193987A JP 2008020791 A5 JP2008020791 A5 JP 2008020791A5
Authority
JP
Japan
Prior art keywords
wiring
terminal
semiconductor chip
substrate
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006193987A
Other languages
English (en)
Japanese (ja)
Other versions
JP4851255B2 (ja
JP2008020791A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006193987A priority Critical patent/JP4851255B2/ja
Priority claimed from JP2006193987A external-priority patent/JP4851255B2/ja
Priority to US11/772,274 priority patent/US7965368B2/en
Publication of JP2008020791A publication Critical patent/JP2008020791A/ja
Publication of JP2008020791A5 publication Critical patent/JP2008020791A5/ja
Application granted granted Critical
Publication of JP4851255B2 publication Critical patent/JP4851255B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006193987A 2006-07-14 2006-07-14 表示装置 Active JP4851255B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006193987A JP4851255B2 (ja) 2006-07-14 2006-07-14 表示装置
US11/772,274 US7965368B2 (en) 2006-07-14 2007-07-02 Display device comprising a semiconductor chip including a first terminal which overlaps a first and second line, the first terminal connected to the first line and overlapping and insulated from the second line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006193987A JP4851255B2 (ja) 2006-07-14 2006-07-14 表示装置

Publications (3)

Publication Number Publication Date
JP2008020791A JP2008020791A (ja) 2008-01-31
JP2008020791A5 true JP2008020791A5 (enExample) 2009-07-23
JP4851255B2 JP4851255B2 (ja) 2012-01-11

Family

ID=39076741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006193987A Active JP4851255B2 (ja) 2006-07-14 2006-07-14 表示装置

Country Status (2)

Country Link
US (1) US7965368B2 (enExample)
JP (1) JP4851255B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4448535B2 (ja) 2007-12-18 2010-04-14 株式会社 日立ディスプレイズ 表示装置
JP5220692B2 (ja) * 2009-06-17 2013-06-26 株式会社ジャパンディスプレイイースト 表示装置
US8629965B2 (en) 2009-06-17 2014-01-14 Hitachi Displays, Ltd. Display device
JP5730062B2 (ja) * 2011-02-21 2015-06-03 株式会社ジャパンディスプレイ 表示装置
CN102682664A (zh) * 2012-05-30 2012-09-19 深圳市华星光电技术有限公司 一种走线结构及显示面板
JP2016057616A (ja) * 2014-09-05 2016-04-21 株式会社半導体エネルギー研究所 表示パネル、入出力装置、情報処理装置
KR102891620B1 (ko) * 2019-09-25 2025-11-28 삼성디스플레이 주식회사 표시장치 및 이의 제조 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW340192B (en) * 1993-12-07 1998-09-11 Sharp Kk A display board having wiring with three-layered structure and a display device including the display board
JPH08179351A (ja) * 1994-12-22 1996-07-12 Toshiba Corp 表示装置用アレイ基板
JPH08313925A (ja) 1995-05-18 1996-11-29 Citizen Watch Co Ltd 半導体集積回路
JP3826605B2 (ja) * 1999-03-08 2006-09-27 セイコーエプソン株式会社 半導体装置の実装構造の製造方法、液晶装置、および電子機器
KR100390456B1 (ko) * 2000-12-13 2003-07-07 엘지.필립스 엘시디 주식회사 액정 디스플레이 패널 및 그 제조방법
JP4006304B2 (ja) * 2002-09-10 2007-11-14 株式会社 日立ディスプレイズ 画像表示装置
JP2005062582A (ja) * 2003-08-18 2005-03-10 Hitachi Displays Ltd 表示装置
KR101034181B1 (ko) * 2003-08-21 2011-05-12 엘지디스플레이 주식회사 액정표시장치용 어레이기판 제조방법
JP2005099310A (ja) 2003-09-24 2005-04-14 Seiko Epson Corp 実装構造体、ｉｃ、電気光学装置および電子機器
JP4257526B2 (ja) * 2004-06-01 2009-04-22 セイコーエプソン株式会社 半導体装置
JP4202300B2 (ja) * 2004-06-24 2008-12-24 三菱電機株式会社 液晶表示装置及び液晶表示装置の検査方法

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