JP2008004640A - 発光装置 - Google Patents

発光装置 Download PDF

Info

Publication number
JP2008004640A
JP2008004640A JP2006170629A JP2006170629A JP2008004640A JP 2008004640 A JP2008004640 A JP 2008004640A JP 2006170629 A JP2006170629 A JP 2006170629A JP 2006170629 A JP2006170629 A JP 2006170629A JP 2008004640 A JP2008004640 A JP 2008004640A
Authority
JP
Japan
Prior art keywords
light emitting
emitting device
case
light
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006170629A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008004640A5 (enExample
Inventor
Toshimasa Hayashi
稔真 林
Hideki Kokubu
英樹 國分
Yuuki Ito
優輝 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2006170629A priority Critical patent/JP2008004640A/ja
Publication of JP2008004640A publication Critical patent/JP2008004640A/ja
Publication of JP2008004640A5 publication Critical patent/JP2008004640A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Led Device Packages (AREA)
JP2006170629A 2006-06-20 2006-06-20 発光装置 Pending JP2008004640A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006170629A JP2008004640A (ja) 2006-06-20 2006-06-20 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006170629A JP2008004640A (ja) 2006-06-20 2006-06-20 発光装置

Publications (2)

Publication Number Publication Date
JP2008004640A true JP2008004640A (ja) 2008-01-10
JP2008004640A5 JP2008004640A5 (enExample) 2008-10-30

Family

ID=39008807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006170629A Pending JP2008004640A (ja) 2006-06-20 2006-06-20 発光装置

Country Status (1)

Country Link
JP (1) JP2008004640A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277607A (ja) * 2007-05-01 2008-11-13 Matsushita Electric Ind Co Ltd 発光装置、線状発光装置、面状発光装置、液晶表示装置および電子機器
KR101293934B1 (ko) * 2012-02-29 2013-08-16 (주) 아모엘이디 엘이디 패키지용 리플렉터 및 이를 포함하는 엘이디 패키지
US8803182B2 (en) 2009-02-24 2014-08-12 Nichia Corporation Light emitting device comprising protective element and base
JP2014164804A (ja) * 2013-02-21 2014-09-08 Nichia Chem Ind Ltd 照明装置、及び、液晶表示装置
JP2015119011A (ja) * 2013-12-17 2015-06-25 日亜化学工業株式会社 樹脂パッケージ及び発光装置

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01302874A (ja) * 1988-05-31 1989-12-06 Matsushita Electron Corp 光半導体装置
JPH09116187A (ja) * 1995-10-16 1997-05-02 Stanley Electric Co Ltd 完全同軸複合光素子
JPH11150306A (ja) * 1997-09-12 1999-06-02 Unisplay Sa 光源、並びに光源を備えたランプ
JP2004056075A (ja) * 2002-05-31 2004-02-19 Stanley Electric Co Ltd 発光装置およびその製造方法
JP2004266124A (ja) * 2003-03-03 2004-09-24 Matsushita Electric Ind Co Ltd 半導体発光装置
JP2005109382A (ja) * 2003-10-02 2005-04-21 Citizen Electronics Co Ltd 発光ダイオード
JP2005123477A (ja) * 2003-10-17 2005-05-12 Toyoda Gosei Co Ltd 光デバイス
JP2005197423A (ja) * 2004-01-07 2005-07-21 Matsushita Electric Ind Co Ltd Ｌｅｄ光源
JP2005294786A (ja) * 2004-03-31 2005-10-20 Shiyuubai Cho 高輝度チップ型発光ダイオード
JP2006024645A (ja) * 2004-07-06 2006-01-26 Rohm Co Ltd 半導体発光装置
JP2006134948A (ja) * 2004-11-02 2006-05-25 Omron Corp 発光光源
JP2006156192A (ja) * 2004-11-30 2006-06-15 Mirai:Kk 照明ユニット及びこれを備えた照明装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01302874A (ja) * 1988-05-31 1989-12-06 Matsushita Electron Corp 光半導体装置
JPH09116187A (ja) * 1995-10-16 1997-05-02 Stanley Electric Co Ltd 完全同軸複合光素子
JPH11150306A (ja) * 1997-09-12 1999-06-02 Unisplay Sa 光源、並びに光源を備えたランプ
JP2004056075A (ja) * 2002-05-31 2004-02-19 Stanley Electric Co Ltd 発光装置およびその製造方法
JP2004266124A (ja) * 2003-03-03 2004-09-24 Matsushita Electric Ind Co Ltd 半導体発光装置
JP2005109382A (ja) * 2003-10-02 2005-04-21 Citizen Electronics Co Ltd 発光ダイオード
JP2005123477A (ja) * 2003-10-17 2005-05-12 Toyoda Gosei Co Ltd 光デバイス
JP2005197423A (ja) * 2004-01-07 2005-07-21 Matsushita Electric Ind Co Ltd Ｌｅｄ光源
JP2005294786A (ja) * 2004-03-31 2005-10-20 Shiyuubai Cho 高輝度チップ型発光ダイオード
JP2006024645A (ja) * 2004-07-06 2006-01-26 Rohm Co Ltd 半導体発光装置
JP2006134948A (ja) * 2004-11-02 2006-05-25 Omron Corp 発光光源
JP2006156192A (ja) * 2004-11-30 2006-06-15 Mirai:Kk 照明ユニット及びこれを備えた照明装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277607A (ja) * 2007-05-01 2008-11-13 Matsushita Electric Ind Co Ltd 発光装置、線状発光装置、面状発光装置、液晶表示装置および電子機器
US8803182B2 (en) 2009-02-24 2014-08-12 Nichia Corporation Light emitting device comprising protective element and base
KR101293934B1 (ko) * 2012-02-29 2013-08-16 (주) 아모엘이디 엘이디 패키지용 리플렉터 및 이를 포함하는 엘이디 패키지
JP2014164804A (ja) * 2013-02-21 2014-09-08 Nichia Chem Ind Ltd 照明装置、及び、液晶表示装置
JP2015119011A (ja) * 2013-12-17 2015-06-25 日亜化学工業株式会社 樹脂パッケージ及び発光装置
US9698312B2 (en) 2013-12-17 2017-07-04 Nichia Corporation Resin package and light emitting device

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