JP2008004602A5 - - Google Patents
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- Publication number
- JP2008004602A5 JP2008004602A5 JP2006169981A JP2006169981A JP2008004602A5 JP 2008004602 A5 JP2008004602 A5 JP 2008004602A5 JP 2006169981 A JP2006169981 A JP 2006169981A JP 2006169981 A JP2006169981 A JP 2006169981A JP 2008004602 A5 JP2008004602 A5 JP 2008004602A5
- Authority
- JP
- Japan
- Prior art keywords
- metal surface
- treatment liquid
- wiring board
- manufacturing
- flip chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims 16
- 239000002184 metal Substances 0.000 claims 16
- 239000007788 liquid Substances 0.000 claims 11
- 238000004519 manufacturing process Methods 0.000 claims 8
- 229910000679 solder Inorganic materials 0.000 claims 8
- 239000012790 adhesive layer Substances 0.000 claims 7
- 239000000843 powder Substances 0.000 claims 6
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 238000007654 immersion Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 229910000510 noble metal Inorganic materials 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006169981A JP4839138B2 (ja) | 2006-06-20 | 2006-06-20 | 配線基板の製造方法 |
| US11/760,291 US7642130B2 (en) | 2006-06-20 | 2007-06-08 | Manufacturing method of wiring substrate |
| TW096120959A TW200802658A (en) | 2006-06-20 | 2007-06-11 | Manufacturing method of wiring substrate |
| KR1020070059921A KR20070120896A (ko) | 2006-06-20 | 2007-06-19 | 배선 기판의 제조 방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006169981A JP4839138B2 (ja) | 2006-06-20 | 2006-06-20 | 配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008004602A JP2008004602A (ja) | 2008-01-10 |
| JP2008004602A5 true JP2008004602A5 (https=) | 2009-04-30 |
| JP4839138B2 JP4839138B2 (ja) | 2011-12-21 |
Family
ID=38862088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006169981A Expired - Fee Related JP4839138B2 (ja) | 2006-06-20 | 2006-06-20 | 配線基板の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7642130B2 (https=) |
| JP (1) | JP4839138B2 (https=) |
| KR (1) | KR20070120896A (https=) |
| TW (1) | TW200802658A (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4576270B2 (ja) * | 2005-03-29 | 2010-11-04 | 昭和電工株式会社 | ハンダ回路基板の製造方法 |
| WO2007007865A1 (en) * | 2005-07-11 | 2007-01-18 | Showa Denko K.K. | Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board |
| WO2007029866A1 (en) * | 2005-09-09 | 2007-03-15 | Showa Denko K.K. | Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board |
| JP2013004738A (ja) | 2011-06-16 | 2013-01-07 | Shinko Electric Ind Co Ltd | 配線基板の製造方法 |
| US8618647B2 (en) | 2011-08-01 | 2013-12-31 | Tessera, Inc. | Packaged microelectronic elements having blind vias for heat dissipation |
| TWI557855B (zh) * | 2011-12-30 | 2016-11-11 | 旭德科技股份有限公司 | 封裝載板及其製作方法 |
| US10886250B2 (en) | 2015-07-10 | 2021-01-05 | Invensas Corporation | Structures and methods for low temperature bonding using nanoparticles |
| TWI822659B (zh) | 2016-10-27 | 2023-11-21 | 美商艾德亞半導體科技有限責任公司 | 用於低溫接合的結構和方法 |
| CN116848631A (zh) | 2020-12-30 | 2023-10-03 | 美商艾德亚半导体接合科技有限公司 | 具有导电特征的结构及其形成方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2681738B2 (ja) * | 1993-05-12 | 1997-11-26 | 昭和電工株式会社 | 連続的はんだ回路形成法 |
| JP3536954B2 (ja) * | 1995-04-14 | 2004-06-14 | 富士写真フイルム株式会社 | ハロゲン化銀乳剤 |
| US5736074A (en) * | 1995-06-30 | 1998-04-07 | Micro Fab Technologies, Inc. | Manufacture of coated spheres |
| TW453137B (en) * | 1997-08-25 | 2001-09-01 | Showa Denko Kk | Electrode structure of silicon semiconductor device and the manufacturing method of silicon device using it |
| JP3678048B2 (ja) * | 1999-04-05 | 2005-08-03 | 松下電器産業株式会社 | 半田プリコート方法および半田プリコート基板 |
| AU2003256837A1 (en) * | 2002-07-26 | 2004-02-16 | Muna Ahmed Abu-Dalo | Removing metals from solution using metal binding compounds and sorbents therefor |
| JP4006409B2 (ja) | 2004-03-17 | 2007-11-14 | 新光電気工業株式会社 | 配線基板の製造方法 |
| JP4421367B2 (ja) * | 2004-04-23 | 2010-02-24 | 日本高純度化学株式会社 | 置換型無電解金めっき液 |
-
2006
- 2006-06-20 JP JP2006169981A patent/JP4839138B2/ja not_active Expired - Fee Related
-
2007
- 2007-06-08 US US11/760,291 patent/US7642130B2/en not_active Expired - Fee Related
- 2007-06-11 TW TW096120959A patent/TW200802658A/zh unknown
- 2007-06-19 KR KR1020070059921A patent/KR20070120896A/ko not_active Withdrawn
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