JP2007532002A - 熱拡散器構造、集積回路、熱拡散器構造を形成する方法、および集積回路を形成する方法 - Google Patents

熱拡散器構造、集積回路、熱拡散器構造を形成する方法、および集積回路を形成する方法 Download PDF

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Publication number
JP2007532002A
JP2007532002A JP2007506481A JP2007506481A JP2007532002A JP 2007532002 A JP2007532002 A JP 2007532002A JP 2007506481 A JP2007506481 A JP 2007506481A JP 2007506481 A JP2007506481 A JP 2007506481A JP 2007532002 A JP2007532002 A JP 2007532002A
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Japan
Prior art keywords
heat
heat spreader
integrated circuit
base portion
spreader structure
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Pending
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JP2007506481A
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English (en)
Japanese (ja)
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JP2007532002A5 (enExample
Inventor
ディーン，ナンシー・エフ
ラシアー，イグナティウス・ジェイ
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Honeywell International Inc
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Honeywell International Inc
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Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of JP2007532002A publication Critical patent/JP2007532002A/ja
Publication of JP2007532002A5 publication Critical patent/JP2007532002A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B7/00—Heating by electric discharge
    • H05B7/18—Heating by arc discharge
    • H05B7/20—Direct heating by arc discharge, i.e. where at least one end of the arc directly acts on the material to be heated, including additional resistance heating by arc current flowing through the material to be heated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2007506481A 2004-03-30 2005-03-29 熱拡散器構造、集積回路、熱拡散器構造を形成する方法、および集積回路を形成する方法 Pending JP2007532002A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US55788904P 2004-03-30 2004-03-30
PCT/US2005/010550 WO2005096731A2 (en) 2004-03-30 2005-03-29 Heat spreader constructions, integrated circuitry, methods of forming heat speader contruictions, and methods of forming integrated circuitry

Publications (2)

Publication Number Publication Date
JP2007532002A true JP2007532002A (ja) 2007-11-08
JP2007532002A5 JP2007532002A5 (enExample) 2008-05-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007506481A Pending JP2007532002A (ja) 2004-03-30 2005-03-29 熱拡散器構造、集積回路、熱拡散器構造を形成する方法、および集積回路を形成する方法

Country Status (7)

Country Link
US (1) US20090027857A1 (enExample)
EP (1) EP1731002A4 (enExample)
JP (1) JP2007532002A (enExample)
KR (1) KR20070006682A (enExample)
CN (1) CN1906974A (enExample)
TW (1) TW200605370A (enExample)
WO (1) WO2005096731A2 (enExample)

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JP4589269B2 (ja) * 2006-06-16 2010-12-01 ソニー株式会社 半導体装置およびその製造方法
JP5025328B2 (ja) * 2007-05-16 2012-09-12 株式会社東芝 熱伝導体
US20080296756A1 (en) * 2007-05-30 2008-12-04 Koch James L Heat spreader compositions and materials, integrated circuitry, methods of production and uses thereof
TWI322652B (en) * 2007-11-06 2010-03-21 Yu Hsueh Lin Structure and manufacturing method of circuit substrate board
US8939347B2 (en) 2010-04-28 2015-01-27 Intel Corporation Magnetic intermetallic compound interconnect
US9847308B2 (en) 2010-04-28 2017-12-19 Intel Corporation Magnetic intermetallic compound interconnect
US20110278351A1 (en) * 2010-05-11 2011-11-17 Aleksandar Aleksov Magnetic particle attachment material
US8313958B2 (en) 2010-05-12 2012-11-20 Intel Corporation Magnetic microelectronic device attachment
US8434668B2 (en) 2010-05-12 2013-05-07 Intel Corporation Magnetic attachment structure
US8609532B2 (en) 2010-05-26 2013-12-17 Intel Corporation Magnetically sintered conductive via
US8547699B1 (en) 2010-11-09 2013-10-01 Adtran, Inc. Enclosure for outside plant equipment with interconnect for mating printed circuit boards, printed circuit board device and method of repairing outside plant equipment
CN109314092B (zh) * 2015-11-16 2022-10-18 英特尔公司 具有互锁插入件的散热器
WO2017172703A1 (en) * 2016-03-30 2017-10-05 Parker-Hannifin Corporation Thermal interface material
CN109549666A (zh) * 2018-11-19 2019-04-02 飞依诺科技(苏州)有限公司 均热装置及手持超声检测设备
US20230354558A1 (en) * 2022-04-28 2023-11-02 Honeywell International Inc. Integrated heat spreader

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JPS62281453A (ja) * 1986-05-30 1987-12-07 Hitachi Ltd チツプキヤリアモジユ−ル
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JPH10284657A (ja) * 1997-04-10 1998-10-23 Nec Corp 半導体装置
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Also Published As

Publication number Publication date
KR20070006682A (ko) 2007-01-11
WO2005096731A3 (en) 2006-02-23
EP1731002A2 (en) 2006-12-13
WO2005096731A2 (en) 2005-10-20
EP1731002A4 (en) 2010-05-26
CN1906974A (zh) 2007-01-31
TW200605370A (en) 2006-02-01
US20090027857A1 (en) 2009-01-29

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