JP2007530297A - 疎水性領域及び終点検出ポートを備える研磨パッド - Google Patents
疎水性領域及び終点検出ポートを備える研磨パッド Download PDFInfo
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- JP2007530297A JP2007530297A JP2007505000A JP2007505000A JP2007530297A JP 2007530297 A JP2007530297 A JP 2007530297A JP 2007505000 A JP2007505000 A JP 2007505000A JP 2007505000 A JP2007505000 A JP 2007505000A JP 2007530297 A JP2007530297 A JP 2007530297A
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- Prior art keywords
- polishing
- polishing pad
- detection port
- endpoint detection
- layer
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
Description
米国特許第5,433,651号は、パッドの一部分が取り除かれて光が通過できる開口を提供する研磨パッドを開示している。米国特許第5,893,796号及び第5,964,643号は、研磨パッドの一部分を取り除いて開口を提供し、かつ透明なポリウレタン又は石英のプラグをその開口に配置して透明な窓を提供するか、あるいは研磨パッドの支持材の一部分を取り除いてパッドに透明な窓を提供することを開示している。米国特許第6,171,181及び第6,387,312号は、高冷却速度で流動性材料(例えば、ポリウレタン)を固化することによって形成される透明領域を有する研磨パッドを開示している。
Claims (23)
- 疎水性領域と、親水性領域と、終点検出ポートとを備える研磨層を備える化学機械研磨パッドであって、前記疎水性領域が終点検出ポートに略隣接し、前記疎水性領域が、34mN/m以下の表面エネルギを有するポリマ材料を含み、また前記親水性領域が、34mN/mよりも大きな表面エネルギを有するポリマ材料を含む研磨パッド。
- 前記疎水性領域が、前記研磨層の周りのリングから構成される、請求項1に記載の研磨パッド。
- 前記疎水性領域及び前記親水性領域が、交互の同心形状部の形態である、請求項1に記載の研磨パッド。
- 前記研磨層が、複数の交互の疎水性同心形状部及び親水性同心形状部を含む、請求項1に記載の研磨パッド。
- 前記交互の疎水性同心形状部及び親水性同心形状部が、前記終点検出ポートを完全に囲む、請求項4に記載の研磨パッド。
- 前記疎水性領域が、前記終点検出ポートを完全に囲む、請求項1に記載の研磨パッド。
- 前記疎水性領域は、ポリエチレンテレフタレート、フッ素重合体、ポリスチレン、ポリプロピレン、ポリシロキサン、シリコンゴム、ポリカーボネート、ポリブタジエン、ポリエチレン、アクリロニトリルブタジエンスチレンコポリマ、過フッ化炭化水素、ポリ四フッ化エチレン、及びそれらの組み合わせからなる群から選択されるポリマ材料を含む、請求項1に記載の研磨パッド。
- 前記親水性領域が、熱可塑性ポリマ、熱硬化性ポリマ、及びそれらの組み合わせからなる群から選択されるポリマ材料を含む、請求項1に記載の研磨パッド。
- 前記熱可塑性ポリマ又は前記熱硬化性ポリマが、ポリウレタン、ポリビニルアルコール、ポリビニルアセテート、ポリ塩化ビニル、ポリ塩化ビニリデン、ポリカーボネート、ポリアクリル酸、ポリアクリルアミド、ナイロン、ポリエステル、ポリエーテル、ポリアミド、ポリイミド、ポリエーテルエーテルケトン、それらのコポリマ、及びそれらの混合物からなる群から選択される、請求項8に記載の研磨パッド。
- 前記ポリマがポリウレタンである、請求項8に記載の研磨パッド。
- 前記終点検出ポートが開口部を備える、請求項1に記載の研磨パッド。
- 前記終点検出ポートが光透過性材料を含む、請求項1に記載の研磨パッド。
- 前記光透過性材料が、190nm〜3500nmの1つ以上の波長において少なくとも10%の光透過率を有する、請求項12に記載の研磨パッド。
- 前記光透過性材料が、接着剤を使用することなく前記研磨層に貼着される、請求項12に記載の研磨パッド。
- 前記研磨層が研磨粒子をさらに含む、請求項1に記載の研磨パッド。
- 前記研磨粒子が、アルミナ、シリカ、酸化チタン、セリア、ジルコニア、ゲルマニア、マグネシア、それらの同時形成される生成物、及びそれらの組み合わせからなる群から選択される金属酸化物を含む、請求項15に記載の研磨パッド。
- 前記研磨層が、溝を備える研磨面を備える、請求項1に記載の研磨パッド。
- 前記研磨層と略同一の広がりのサブパッド層をさらに備え、該サブパッド層が、前記研磨層の前記光学的終点検出ポートと略整列される光学的終点検出ポートを備える、請求項1に記載の研磨パッド。
- 前記研磨層の前記光学的終点検出ポートが光透過性材料を含み、前記サブパッド層の前記光学的終点検出ポートが開口部を備える、請求項18に記載の研磨パッド。
- 前記研磨層の前記光学的終点検出ポートが開口部を備え、前記サブパッド層の前記光学的終点検出ポートが光透過性材料を含む、請求項18に記載の研磨パッド。
- 前記研磨層の前記光学的終点検出ポートが、開口部を囲む疎水性材料のリングを備える、請求項20に記載の研磨パッド。
- 基板を研磨する方法であって、
(i)研磨すべきワークピースを用意するステップと、
(ii)前記ワークピースと、請求項1に記載の研磨パッドを備える化学機械研磨システムとを接触させるステップと、
(iii)前記研磨システムで前記ワークピースの表面の少なくとも一部分を磨削して、前記ワークピースを研磨するステップと、
を含む方法。 - 研磨終点を現場で検出するステップをさらに含む、請求項22に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US10/808,827 US7204742B2 (en) | 2004-03-25 | 2004-03-25 | Polishing pad comprising hydrophobic region and endpoint detection port |
US10/808,827 | 2004-03-25 | ||
PCT/US2005/008410 WO2005099962A1 (en) | 2004-03-25 | 2005-03-14 | Polishing pad comprising hydrophobic region and endpoint detection port |
Publications (2)
Publication Number | Publication Date |
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JP2007530297A true JP2007530297A (ja) | 2007-11-01 |
JP4856055B2 JP4856055B2 (ja) | 2012-01-18 |
Family
ID=34962661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007505000A Expired - Fee Related JP4856055B2 (ja) | 2004-03-25 | 2005-03-14 | 疎水性領域及び終点検出ポートを備える研磨パッド |
Country Status (7)
Country | Link |
---|---|
US (1) | US7204742B2 (ja) |
JP (1) | JP4856055B2 (ja) |
KR (1) | KR101195276B1 (ja) |
CN (1) | CN100493847C (ja) |
MY (1) | MY137517A (ja) |
TW (1) | TWI275447B (ja) |
WO (1) | WO2005099962A1 (ja) |
Cited By (7)
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WO2011129254A1 (ja) * | 2010-04-15 | 2011-10-20 | 東洋ゴム工業株式会社 | 研磨パッド |
JP2013052492A (ja) * | 2011-09-06 | 2013-03-21 | Toyo Tire & Rubber Co Ltd | 研磨パッド及びその製造方法 |
JP2013052491A (ja) * | 2011-09-06 | 2013-03-21 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
JP2014515319A (ja) * | 2011-05-23 | 2014-06-30 | ネクスプラナー コーポレイション | 上に別個の突起を有する均一な本体を有する研磨パッド |
US9067298B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
US9067297B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with foundation layer and polishing surface layer |
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- 2005-03-14 KR KR1020067019552A patent/KR101195276B1/ko not_active IP Right Cessation
- 2005-03-14 WO PCT/US2005/008410 patent/WO2005099962A1/en active Application Filing
- 2005-03-14 JP JP2007505000A patent/JP4856055B2/ja not_active Expired - Fee Related
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WO2011129254A1 (ja) * | 2010-04-15 | 2011-10-20 | 東洋ゴム工業株式会社 | 研磨パッド |
JP2011228358A (ja) * | 2010-04-15 | 2011-11-10 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
US9126304B2 (en) | 2010-04-15 | 2015-09-08 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
JP2014515319A (ja) * | 2011-05-23 | 2014-06-30 | ネクスプラナー コーポレイション | 上に別個の突起を有する均一な本体を有する研磨パッド |
US9296085B2 (en) | 2011-05-23 | 2016-03-29 | Nexplanar Corporation | Polishing pad with homogeneous body having discrete protrusions thereon |
JP2013052492A (ja) * | 2011-09-06 | 2013-03-21 | Toyo Tire & Rubber Co Ltd | 研磨パッド及びその製造方法 |
JP2013052491A (ja) * | 2011-09-06 | 2013-03-21 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
US9067298B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
US9067297B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with foundation layer and polishing surface layer |
US9931729B2 (en) | 2011-11-29 | 2018-04-03 | Cabot Microelectronics Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
US9931728B2 (en) | 2011-11-29 | 2018-04-03 | Cabot Microelectronics Corporation | Polishing pad with foundation layer and polishing surface layer |
JP2016068194A (ja) * | 2014-09-30 | 2016-05-09 | 富士紡ホールディングス株式会社 | 研磨パッド |
Also Published As
Publication number | Publication date |
---|---|
US7204742B2 (en) | 2007-04-17 |
TW200600260A (en) | 2006-01-01 |
TWI275447B (en) | 2007-03-11 |
KR101195276B1 (ko) | 2012-10-26 |
KR20060127219A (ko) | 2006-12-11 |
CN1933939A (zh) | 2007-03-21 |
MY137517A (en) | 2009-02-27 |
JP4856055B2 (ja) | 2012-01-18 |
US20050211376A1 (en) | 2005-09-29 |
WO2005099962A1 (en) | 2005-10-27 |
CN100493847C (zh) | 2009-06-03 |
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