JP2007525594A5 - - Google Patents
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- Publication number
- JP2007525594A5 JP2007525594A5 JP2006543928A JP2006543928A JP2007525594A5 JP 2007525594 A5 JP2007525594 A5 JP 2007525594A5 JP 2006543928 A JP2006543928 A JP 2006543928A JP 2006543928 A JP2006543928 A JP 2006543928A JP 2007525594 A5 JP2007525594 A5 JP 2007525594A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- radiant energy
- plating solution
- electroless plating
- support structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007772 electroless plating Methods 0.000 claims 20
- 239000000463 material Substances 0.000 claims 19
- 238000007747 plating Methods 0.000 claims 6
- 238000010438 heat treatment Methods 0.000 claims 4
- 230000001678 irradiating Effects 0.000 claims 1
- 239000000376 reactant Substances 0.000 claims 1
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/734,704 US7368017B2 (en) | 2003-12-12 | 2003-12-12 | Method and apparatus for semiconductor wafer planarization |
US10/734,704 | 2003-12-12 | ||
US10/735,216 | 2003-12-12 | ||
US10/735,216 US7358186B2 (en) | 2003-12-12 | 2003-12-12 | Method and apparatus for material deposition in semiconductor fabrication |
PCT/US2004/040951 WO2005061760A1 (en) | 2003-12-12 | 2004-12-07 | Method and apparatus for material deposition |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007525594A JP2007525594A (ja) | 2007-09-06 |
JP2007525594A5 true JP2007525594A5 (zh) | 2007-10-25 |
JP4742047B2 JP4742047B2 (ja) | 2011-08-10 |
Family
ID=34713904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006543928A Expired - Fee Related JP4742047B2 (ja) | 2003-12-12 | 2004-12-07 | 材料成長のための方法および装置 |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1692324B1 (zh) |
JP (1) | JP4742047B2 (zh) |
KR (1) | KR101233444B1 (zh) |
MY (1) | MY184648A (zh) |
SG (3) | SG149018A1 (zh) |
TW (1) | TWI319784B (zh) |
WO (1) | WO2005061760A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW202121520A (zh) * | 2019-08-27 | 2021-06-01 | 日商東京威力科創股份有限公司 | 基板液處理方法、基板液處理裝置、及電腦可讀取記錄媒體 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4239789A (en) * | 1979-05-08 | 1980-12-16 | International Business Machines Corporation | Maskless method for electroless plating patterns |
US4359485A (en) * | 1981-05-01 | 1982-11-16 | Bell Telephone Laboratories, Incorporated | Radiation induced deposition of metal on semiconductor surfaces |
JPS61104083A (ja) * | 1984-10-27 | 1986-05-22 | Hitachi Ltd | 無電解めつき方法 |
EP0260516A1 (en) * | 1986-09-15 | 1988-03-23 | General Electric Company | Photoselective metal deposition process |
US4982065A (en) * | 1989-03-07 | 1991-01-01 | Ngk Insulators, Ltd. | Method of producing a core for magnetic head |
US5260108A (en) * | 1992-03-10 | 1993-11-09 | International Business Machines Corporation | Selective seeding of Pd by excimer laser radiation through the liquid |
JPH10219468A (ja) * | 1997-02-07 | 1998-08-18 | Matsushita Electric Ind Co Ltd | 導体化膜形成方法 |
JPH1192951A (ja) * | 1997-09-16 | 1999-04-06 | Ebara Corp | 基板のめっき方法 |
US5989653A (en) * | 1997-12-08 | 1999-11-23 | Sandia Corporation | Process for metallization of a substrate by irradiative curing of a catalyst applied thereto |
JP3792038B2 (ja) * | 1998-01-09 | 2006-06-28 | 株式会社荏原製作所 | めっき装置 |
IE980461A1 (en) * | 1998-06-15 | 2000-05-03 | Univ Cork | Method for selective activation and metallisation of materials |
WO2000035259A2 (de) * | 1998-12-10 | 2000-06-15 | Gerhard Naundorf | Verfahren zur herstellung von leiterbahnstrukturen |
JP4035752B2 (ja) * | 2000-03-31 | 2008-01-23 | セイコーエプソン株式会社 | 微細構造体の製造方法 |
-
2004
- 2004-12-02 MY MYPI20044983A patent/MY184648A/en unknown
- 2004-12-07 EP EP04813286.4A patent/EP1692324B1/en not_active Not-in-force
- 2004-12-07 WO PCT/US2004/040951 patent/WO2005061760A1/en active Application Filing
- 2004-12-07 SG SG200809204-1A patent/SG149018A1/en unknown
- 2004-12-07 KR KR1020067011581A patent/KR101233444B1/ko active IP Right Grant
- 2004-12-07 JP JP2006543928A patent/JP4742047B2/ja not_active Expired - Fee Related
- 2004-12-07 SG SG200809205-8A patent/SG149019A1/en unknown
- 2004-12-07 SG SG2012043196A patent/SG182190A1/en unknown
- 2004-12-10 TW TW093138385A patent/TWI319784B/zh not_active IP Right Cessation
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