JP2007521657A - 超薄型裏面照射フォトダイオード・アレイの構造と製造方法 - Google Patents
超薄型裏面照射フォトダイオード・アレイの構造と製造方法 Download PDFInfo
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- JP2007521657A JP2007521657A JP2006517765A JP2006517765A JP2007521657A JP 2007521657 A JP2007521657 A JP 2007521657A JP 2006517765 A JP2006517765 A JP 2006517765A JP 2006517765 A JP2006517765 A JP 2006517765A JP 2007521657 A JP2007521657 A JP 2007521657A
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- photodiode array
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/107—Integrated devices having multiple elements covered by H10F30/00 in a repetitive configuration, e.g. radiation detectors comprising photodiode arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/199—Back-illuminated image sensors
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/606,053 US6762473B1 (en) | 2003-06-25 | 2003-06-25 | Ultra thin back-illuminated photodiode array structures and fabrication methods |
| PCT/US2004/020835 WO2005001941A2 (en) | 2003-06-25 | 2004-06-22 | Ultra thin back-illuminated photodiode array structures and fabrication methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007521657A true JP2007521657A (ja) | 2007-08-02 |
| JP2007521657A5 JP2007521657A5 (https=) | 2007-09-13 |
Family
ID=32682711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006517765A Pending JP2007521657A (ja) | 2003-06-25 | 2004-06-22 | 超薄型裏面照射フォトダイオード・アレイの構造と製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6762473B1 (https=) |
| EP (2) | EP1636856B1 (https=) |
| JP (1) | JP2007521657A (https=) |
| CN (1) | CN100533775C (https=) |
| AT (1) | ATE531082T1 (https=) |
| IL (1) | IL172495A0 (https=) |
| WO (1) | WO2005001941A2 (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024056782A (ja) * | 2015-07-17 | 2024-04-23 | 株式会社半導体エネルギー研究所 | 撮像装置 |
| JP2024100871A (ja) * | 2015-06-19 | 2024-07-26 | 株式会社半導体エネルギー研究所 | 撮像装置 |
| JP2024103708A (ja) * | 2014-10-24 | 2024-08-01 | 株式会社半導体エネルギー研究所 | 撮像装置及び電子機器 |
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| US8686529B2 (en) | 2010-01-19 | 2014-04-01 | Osi Optoelectronics, Inc. | Wavelength sensitive sensor photodiodes |
| US7709921B2 (en) * | 2008-08-27 | 2010-05-04 | Udt Sensors, Inc. | Photodiode and photodiode array with improved performance characteristics |
| US7576369B2 (en) * | 2005-10-25 | 2009-08-18 | Udt Sensors, Inc. | Deep diffused thin photodiodes |
| US8519503B2 (en) * | 2006-06-05 | 2013-08-27 | Osi Optoelectronics, Inc. | High speed backside illuminated, front side contact photodiode array |
| US7880258B2 (en) * | 2003-05-05 | 2011-02-01 | Udt Sensors, Inc. | Thin wafer detectors with improved radiation damage and crosstalk characteristics |
| US8120023B2 (en) * | 2006-06-05 | 2012-02-21 | Udt Sensors, Inc. | Low crosstalk, front-side illuminated, back-side contact photodiode array |
| US7075091B2 (en) * | 2004-01-29 | 2006-07-11 | Ge Medical Systems Global Technology Company, Llc | Apparatus for detecting ionizing radiation |
| US7439516B2 (en) * | 2004-10-01 | 2008-10-21 | General Electric Company | Module assembly for multiple die back-illuminated diode |
| JP2008538659A (ja) * | 2005-04-22 | 2008-10-30 | アイスモス テクノロジー コーポレイション | 酸化物で内面が覆われた溝を有する超接合素子と酸化物で内面を覆われた溝を有する超接合素子を製造するための方法 |
| TW200644165A (en) * | 2005-05-04 | 2006-12-16 | Icemos Technology Corp | Silicon wafer having through-wafer vias |
| US20080099924A1 (en) * | 2005-05-04 | 2008-05-01 | Icemos Technology Corporation | Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric Shape |
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| US7768085B2 (en) * | 2005-10-11 | 2010-08-03 | Icemos Technology Ltd. | Photodetector array using isolation diffusions as crosstalk inhibitors between adjacent photodiodes |
| US7560791B2 (en) * | 2005-10-28 | 2009-07-14 | Icemos Technology Ltd. | Front lit PIN/NIP diode having a continuous anode/cathode |
| US7745798B2 (en) * | 2005-11-15 | 2010-06-29 | Fujifilm Corporation | Dual-phosphor flat panel radiation detector |
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| US7935933B2 (en) * | 2006-01-30 | 2011-05-03 | General Electric Company | Detector for an x-ray imaging system |
| CN101432885A (zh) * | 2006-03-02 | 2009-05-13 | 艾斯莫斯技术有限公司 | 用于光探测器阵列的前侧电触点及其制造方法 |
| JP2009528703A (ja) * | 2006-03-02 | 2009-08-06 | アイスモス・テクノロジー・リミテッド | 非感光領域に対して高い割合の感光領域を有するフォトダイオード |
| US7576371B1 (en) | 2006-03-03 | 2009-08-18 | Array Optronix, Inc. | Structures and methods to improve the crosstalk between adjacent pixels of back-illuminated photodiode arrays |
| US20070241377A1 (en) * | 2006-04-12 | 2007-10-18 | Semicoa | Back-illuminated photo-transistor arrays for computed tomography and other imaging applications |
| JP5437791B2 (ja) * | 2006-04-25 | 2014-03-12 | コーニンクレッカ フィリップス エヌ ヴェ | (Bi)CMOSプロセスによるアバランシェフォトダイオードの製造方法 |
| US7429772B2 (en) * | 2006-04-27 | 2008-09-30 | Icemos Technology Corporation | Technique for stable processing of thin/fragile substrates |
| US7667400B1 (en) | 2006-06-09 | 2010-02-23 | Array Optronix, Inc. | Back-illuminated Si photomultipliers: structure and fabrication methods |
| TW200818534A (en) * | 2006-08-10 | 2008-04-16 | Icemos Technology Corp | Method of manufacturing a photodiode array with through-wafer vias |
| US20080079108A1 (en) * | 2006-09-29 | 2008-04-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for Improving Sensitivity of Backside Illuminated Image Sensors |
| US8436443B2 (en) * | 2006-09-29 | 2013-05-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Backside depletion for backside illuminated image sensors |
| US9178092B2 (en) | 2006-11-01 | 2015-11-03 | Osi Optoelectronics, Inc. | Front-side illuminated, back-side contact double-sided PN-junction photodiode arrays |
| DE102007007584A1 (de) | 2006-12-29 | 2008-07-03 | Osram Opto Semiconductors Gmbh | Halbleiterdetektoranordnung und Herstellungsverfahren für eine Halbleiterdetektoranordnung |
| US8580651B2 (en) * | 2007-04-23 | 2013-11-12 | Icemos Technology Ltd. | Methods for manufacturing a trench type semiconductor device having a thermally sensitive refill material |
| US7723172B2 (en) | 2007-04-23 | 2010-05-25 | Icemos Technology Ltd. | Methods for manufacturing a trench type semiconductor device having a thermally sensitive refill material |
| WO2009009774A1 (en) * | 2007-07-11 | 2009-01-15 | Cubic Corporation | Integrated modulating retro-reflector |
| WO2009023603A1 (en) * | 2007-08-10 | 2009-02-19 | Semicoa | Back-illuminated, thin photodiode arrays with trench isolation |
| US20090085148A1 (en) * | 2007-09-28 | 2009-04-02 | Icemos Technology Corporation | Multi-directional trenching of a plurality of dies in manufacturing superjunction devices |
| US20100053802A1 (en) * | 2008-08-27 | 2010-03-04 | Masaki Yamashita | Low Power Disk-Drive Motor Driver |
| US7846821B2 (en) | 2008-02-13 | 2010-12-07 | Icemos Technology Ltd. | Multi-angle rotation for ion implantation of trenches in superjunction devices |
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| US7902540B2 (en) * | 2008-05-21 | 2011-03-08 | International Business Machines Corporation | Fast P-I-N photodetector with high responsitivity |
| US20090314947A1 (en) * | 2008-05-30 | 2009-12-24 | Array Optronix, Inc. | Radiation Detector with Isolated Pixels Photosensitive Array for CT and Other Imaging Applications |
| US7851698B2 (en) * | 2008-06-12 | 2010-12-14 | Sunpower Corporation | Trench process and structure for backside contact solar cells with polysilicon doped regions |
| CN102217082B (zh) | 2008-09-15 | 2013-12-04 | Osi光电子股份有限公司 | 具有浅n+层的薄有源层鱼骨形光敏二极管及其制造方法 |
| US20100108893A1 (en) * | 2008-11-04 | 2010-05-06 | Array Optronix, Inc. | Devices and Methods for Ultra Thin Photodiode Arrays on Bonded Supports |
| US8399909B2 (en) | 2009-05-12 | 2013-03-19 | Osi Optoelectronics, Inc. | Tetra-lateral position sensing detector |
| US8409908B2 (en) * | 2009-07-30 | 2013-04-02 | General Electric Company | Apparatus for reducing photodiode thermal gain coefficient and method of making same |
| US8614495B2 (en) | 2010-04-23 | 2013-12-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Back side defect reduction for back side illuminated image sensor |
| DE102011009373B4 (de) | 2011-01-25 | 2017-08-03 | Austriamicrosystems Ag | Fotodiodenbauelement |
| US8598021B2 (en) * | 2011-09-29 | 2013-12-03 | Varian Semiconductor Equipment Associates, Inc. | Method for junction avoidance on edge of workpieces |
| US8822262B2 (en) | 2011-12-22 | 2014-09-02 | Sunpower Corporation | Fabricating solar cells with silicon nanoparticles |
| US8946814B2 (en) | 2012-04-05 | 2015-02-03 | Icemos Technology Ltd. | Superjunction devices having narrow surface layout of terminal structures, buried contact regions and trench gates |
| EP2845230A1 (en) | 2012-04-30 | 2015-03-11 | Koninklijke Philips N.V. | Imaging detector with per pixel analog channel well isolation with decoupling |
| JP6084401B2 (ja) * | 2012-08-30 | 2017-02-22 | 浜松ホトニクス株式会社 | 側面入射型のフォトダイオードの製造方法 |
| US9576842B2 (en) | 2012-12-10 | 2017-02-21 | Icemos Technology, Ltd. | Grass removal in patterned cavity etching |
| JP6231741B2 (ja) | 2012-12-10 | 2017-11-15 | キヤノン株式会社 | 固体撮像装置およびその製造方法 |
| US8912615B2 (en) | 2013-01-24 | 2014-12-16 | Osi Optoelectronics, Inc. | Shallow junction photodiode for detecting short wavelength light |
| US10050076B2 (en) * | 2014-10-07 | 2018-08-14 | Terapede Systems Inc. | 3D high resolution X-ray sensor with integrated scintillator grid |
| US9930281B2 (en) | 2016-01-20 | 2018-03-27 | Semiconductor Components Industries, Llc | Image sensors having photodiode regions implanted from multiple sides of a substrate |
Citations (6)
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| US3574009A (en) * | 1968-03-06 | 1971-04-06 | Unitrode Corp | Controlled doping of semiconductors |
| JPH05206499A (ja) * | 1991-08-08 | 1993-08-13 | Santa Barbara Res Center | インジウム・アンチモン光検出器 |
| US5670383A (en) * | 1994-04-04 | 1997-09-23 | General Electric Company | Method for fabrication of deep-diffused avalanche photodiode |
| JPH09298285A (ja) * | 1996-04-30 | 1997-11-18 | Nec Corp | 受光素子内蔵集積回路装置及びその製造方法 |
| JPH10335624A (ja) * | 1997-06-05 | 1998-12-18 | Hamamatsu Photonics Kk | 裏面照射型受光デバイス及びその製造方法 |
| US20020011639A1 (en) * | 1999-07-02 | 2002-01-31 | Carlson Lars S. | Indirect back surface contact to semiconductor devices |
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-
2003
- 2003-06-25 US US10/606,053 patent/US6762473B1/en not_active Expired - Fee Related
-
2004
- 2004-06-08 US US10/863,558 patent/US7112465B2/en not_active Expired - Fee Related
- 2004-06-22 EP EP04777237A patent/EP1636856B1/en not_active Expired - Lifetime
- 2004-06-22 AT AT04777237T patent/ATE531082T1/de not_active IP Right Cessation
- 2004-06-22 CN CNB2004800247278A patent/CN100533775C/zh not_active Expired - Fee Related
- 2004-06-22 EP EP10075651A patent/EP2270873A3/en not_active Withdrawn
- 2004-06-22 JP JP2006517765A patent/JP2007521657A/ja active Pending
- 2004-06-22 WO PCT/US2004/020835 patent/WO2005001941A2/en not_active Ceased
-
2005
- 2005-12-11 IL IL172495A patent/IL172495A0/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US3574009A (en) * | 1968-03-06 | 1971-04-06 | Unitrode Corp | Controlled doping of semiconductors |
| JPH05206499A (ja) * | 1991-08-08 | 1993-08-13 | Santa Barbara Res Center | インジウム・アンチモン光検出器 |
| US5670383A (en) * | 1994-04-04 | 1997-09-23 | General Electric Company | Method for fabrication of deep-diffused avalanche photodiode |
| JPH09298285A (ja) * | 1996-04-30 | 1997-11-18 | Nec Corp | 受光素子内蔵集積回路装置及びその製造方法 |
| JPH10335624A (ja) * | 1997-06-05 | 1998-12-18 | Hamamatsu Photonics Kk | 裏面照射型受光デバイス及びその製造方法 |
| US20020011639A1 (en) * | 1999-07-02 | 2002-01-31 | Carlson Lars S. | Indirect back surface contact to semiconductor devices |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024103708A (ja) * | 2014-10-24 | 2024-08-01 | 株式会社半導体エネルギー研究所 | 撮像装置及び電子機器 |
| JP7705984B2 (ja) | 2014-10-24 | 2025-07-10 | 株式会社半導体エネルギー研究所 | 撮像装置及び電子機器 |
| JP2024100871A (ja) * | 2015-06-19 | 2024-07-26 | 株式会社半導体エネルギー研究所 | 撮像装置 |
| JP7742455B2 (ja) | 2015-06-19 | 2025-09-19 | 株式会社半導体エネルギー研究所 | 撮像装置 |
| JP2024056782A (ja) * | 2015-07-17 | 2024-04-23 | 株式会社半導体エネルギー研究所 | 撮像装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20040262652A1 (en) | 2004-12-30 |
| US7112465B2 (en) | 2006-09-26 |
| CN1842921A (zh) | 2006-10-04 |
| WO2005001941A3 (en) | 2005-03-10 |
| WO2005001941A2 (en) | 2005-01-06 |
| EP1636856B1 (en) | 2011-10-26 |
| EP2270873A2 (en) | 2011-01-05 |
| IL172495A0 (en) | 2006-04-10 |
| ATE531082T1 (de) | 2011-11-15 |
| US6762473B1 (en) | 2004-07-13 |
| CN100533775C (zh) | 2009-08-26 |
| EP2270873A3 (en) | 2012-03-28 |
| EP1636856A2 (en) | 2006-03-22 |
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