JP2007511070A - 高密度高分子メモリ素子アレイにおけるサイドウォール形成方法 - Google Patents
高密度高分子メモリ素子アレイにおけるサイドウォール形成方法 Download PDFInfo
- Publication number
- JP2007511070A JP2007511070A JP2006537996A JP2006537996A JP2007511070A JP 2007511070 A JP2007511070 A JP 2007511070A JP 2006537996 A JP2006537996 A JP 2006537996A JP 2006537996 A JP2006537996 A JP 2006537996A JP 2007511070 A JP2007511070 A JP 2007511070A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- electrode
- memory
- memory cell
- organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 69
- 229920000642 polymer Polymers 0.000 title description 27
- 230000008569 process Effects 0.000 claims abstract description 54
- 238000005530 etching Methods 0.000 claims abstract description 26
- 239000011368 organic material Substances 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 238000009792 diffusion process Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 7
- 230000004888 barrier function Effects 0.000 claims description 4
- 230000003213 activating effect Effects 0.000 claims 1
- 230000008021 deposition Effects 0.000 abstract description 9
- 239000010410 layer Substances 0.000 description 131
- 210000004027 cell Anatomy 0.000 description 96
- 239000002800 charge carrier Substances 0.000 description 49
- 239000010408 film Substances 0.000 description 41
- 239000012044 organic layer Substances 0.000 description 35
- 230000006870 function Effects 0.000 description 30
- 235000012431 wafers Nutrition 0.000 description 27
- 239000010949 copper Substances 0.000 description 26
- 238000005229 chemical vapour deposition Methods 0.000 description 19
- 239000007789 gas Substances 0.000 description 18
- 239000004020 conductor Substances 0.000 description 17
- 230000005684 electric field Effects 0.000 description 17
- 229920000620 organic polymer Polymers 0.000 description 16
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 description 14
- 238000010586 diagram Methods 0.000 description 13
- 238000009826 distribution Methods 0.000 description 13
- 238000012545 processing Methods 0.000 description 12
- 238000000151 deposition Methods 0.000 description 10
- 230000004907 flux Effects 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 230000001737 promoting effect Effects 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 8
- 239000002243 precursor Substances 0.000 description 8
- 230000002441 reversible effect Effects 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 125000002524 organometallic group Chemical group 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000005284 excitation Effects 0.000 description 5
- 238000010574 gas phase reaction Methods 0.000 description 5
- 238000001459 lithography Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000014759 maintenance of location Effects 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000006399 behavior Effects 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 229910021332 silicide Inorganic materials 0.000 description 3
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 231100000331 toxic Toxicity 0.000 description 3
- 230000002588 toxic effect Effects 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 229910000792 Monel Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- ZVQOOHYFBIDMTQ-UHFFFAOYSA-N [methyl(oxido){1-[6-(trifluoromethyl)pyridin-3-yl]ethyl}-lambda(6)-sulfanylidene]cyanamide Chemical compound N#CN=S(C)(=O)C(C)C1=CC=C(C(F)(F)F)N=C1 ZVQOOHYFBIDMTQ-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- OBBCYCYCTJQCCK-UHFFFAOYSA-L copper;n,n-diethylcarbamodithioate Chemical compound [Cu+2].CCN(CC)C([S-])=S.CCN(CC)C([S-])=S OBBCYCYCTJQCCK-UHFFFAOYSA-L 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910000856 hastalloy Inorganic materials 0.000 description 2
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 229910001026 inconel Inorganic materials 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000033116 oxidation-reduction process Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- -1 poly (p-phenylene vinylene) Polymers 0.000 description 2
- 229920001197 polyacetylene Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 150000004032 porphyrins Chemical class 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 230000000638 stimulation Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 208000000044 Amnesia Diseases 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- 208000026139 Memory disease Diseases 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 229910052946 acanthite Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 125000002015 acyclic group Chemical group 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 210000003850 cellular structure Anatomy 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013626 chemical specie Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229920000547 conjugated polymer Polymers 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000000572 ellipsometry Methods 0.000 description 1
- CPBQJMYROZQQJC-UHFFFAOYSA-N helium neon Chemical compound [He].[Ne] CPBQJMYROZQQJC-UHFFFAOYSA-N 0.000 description 1
- 238000002847 impedance measurement Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000012886 linear function Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 150000002678 macrocyclic compounds Chemical class 0.000 description 1
- 230000006984 memory degeneration Effects 0.000 description 1
- 208000023060 memory loss Diseases 0.000 description 1
- 230000005055 memory storage Effects 0.000 description 1
- 239000012702 metal oxide precursor Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000834 poly(ferrocenylene) polymer Polymers 0.000 description 1
- 229920000828 poly(metallocenes) Polymers 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- XUARKZBEFFVFRG-UHFFFAOYSA-N silver sulfide Chemical compound [S-2].[Ag+].[Ag+] XUARKZBEFFVFRG-UHFFFAOYSA-N 0.000 description 1
- 229940056910 silver sulfide Drugs 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000007704 wet chemistry method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5664—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using organic memory material storage elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
- G11C13/0016—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material comprising polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/701—Organic molecular electronic devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
- H10K19/202—Integrated devices comprising a common active layer
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Abstract
Description
Claims (12)
- ウェハ表面のリソグラフィー形状に対応したメモリ構成からなるアレイを備えたメモリデバイス(1300)であって、
各メモリ構成は、
前記ウェハ(806)のビット線(610)から形成された第1の電極(104,1502)と、
前記第1の電極(104,1502)の横に位置する2つの第2の電極(110,1504)と、
前記第1の電極(104,1502)と前記第2の電極(110,1504)の各々との間に配置された選択的導電媒体を備えており、
前記第1の電極(104,1502)は、前記第2の電極(110,1504)の各々とともに、前記選択的導電媒体のメモリ部を選択的に作動させるように動作可能であるメモリデバイス(1300)。 - 各第2の電極(110,1504)は略垂直であり、前記第1の電極(104,1502)の側部に隣接して横方向に積層されている請求項1記載のメモリデバイス(1300)。
- 前記選択的導電媒体は不動態材料(106,200)及び有機材料(108,300,400,402,500)のうちの少なくとも1つを備えた請求項1記載のメモリデバイス(1300)。
- 前記第1の電極(104,1502)は前記第2の電極(110,1504)とともに前記有機材料(108,300,400,402,500)のメモリ部を作動させるように動作可能である請求項3記載のメモリデバイス(1300)。
- ビット線電極を有し、基板層(612)の上方に隆起面を設けたウェハ(806)を用意するステップと、
前記隆起面及び前記基板層(612)の上に選択的導電層(622,1308)を形成するステップと、
前記選択的導電層(622,1308)の上に上部電極層(635,640,642,740)を形成するステップと、
表面をエッチングして、壁を有するリソグラフィー形状を形成するステップであって、該壁はその上に形成されたメモリセルを備えているステップとを含むメモリセルの製造方法であって、
前記形成されたメモリセルは2つの隣接するメモリ素子に関連する前記ビット線電極を有し、各メモリ素子は選択的導電層(622,1308)の一部及び前記上部電極層(635,640,642,740)の一部を含んでいるメモリセルの製造方法。 - 2つの隣接するメモリ素子を関連づけるステップはさらに、前記メモリ素子の一部を選択的に作動させるステップを含む、請求項5記載のメモリセルの製造方法。
- 表面をエッチングするステップはさらに、前記上部電極層(635,640,642,740)の表面または前記選択的導電層(622,1308)の表面をエッチングするステップを含む、請求項5記載のメモリセルの製造方法。
- 表面をエッチングするステップはさらに、前記ビット線電極の表面をエッチングするステップを含む、請求項5記載のメモリセルの製造方法。
- 前記上部電極層(635,640,642,740)の形成前に前記選択的導電層(622,1308)の表面をエッチングするステップをさらに含む、請求項5記載のメモリセルの製造方法。
- 前記選択的導電層(622,1308)の表面をエッチングするステップは、CMPプロセス(740)をさらに含む、請求項5記載のメモリセルの製造方法。
- バリア層を形成して前記第1の電極(104,1502)及び前記上部電極が層へ拡散することを軽減するステップをさらに含む、請求項5記載のメモリセルの製造方法。
- メモリセルをリソグラフィー形状のサイドウォール(115)上に形成する手段と、
前記メモリセル(115)をさらなるメモリセルから分割する手段を備えた有機メモリデバイスの製造システム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/699,903 US7015504B2 (en) | 2003-11-03 | 2003-11-03 | Sidewall formation for high density polymer memory element array |
PCT/US2004/031275 WO2005045935A2 (en) | 2003-11-03 | 2004-09-23 | Sidewall formation for high density polymer memory element array |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007511070A true JP2007511070A (ja) | 2007-04-26 |
Family
ID=34551066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006537996A Pending JP2007511070A (ja) | 2003-11-03 | 2004-09-23 | 高密度高分子メモリ素子アレイにおけるサイドウォール形成方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7015504B2 (ja) |
EP (1) | EP1697992A2 (ja) |
JP (1) | JP2007511070A (ja) |
KR (1) | KR101087299B1 (ja) |
CN (1) | CN100539159C (ja) |
TW (1) | TWI359495B (ja) |
WO (1) | WO2005045935A2 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101215279B1 (ko) * | 2004-05-21 | 2012-12-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 조명 장치 |
US7148144B1 (en) * | 2004-09-13 | 2006-12-12 | Spansion Llc | Method of forming copper sulfide layer over substrate |
US7269050B2 (en) * | 2005-06-07 | 2007-09-11 | Spansion Llc | Method of programming a memory device |
JP5052055B2 (ja) * | 2005-07-01 | 2012-10-17 | 株式会社半導体エネルギー研究所 | 記憶装置及び半導体装置の作製方法 |
KR101369864B1 (ko) * | 2005-08-12 | 2014-03-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 및 그 제조방법 |
US7291563B2 (en) * | 2005-08-18 | 2007-11-06 | Micron Technology, Inc. | Method of etching a substrate; method of forming a feature on a substrate; and method of depositing a layer comprising silicon, carbon, and fluorine onto a semiconductor substrate |
JP4919146B2 (ja) * | 2005-09-27 | 2012-04-18 | 独立行政法人産業技術総合研究所 | スイッチング素子 |
EP1784055A3 (en) * | 2005-10-17 | 2009-08-05 | Semiconductor Energy Laboratory Co., Ltd. | Lighting system |
US8283724B2 (en) | 2007-02-26 | 2012-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Memory element and semiconductor device, and method for manufacturing the same |
JP2008311449A (ja) * | 2007-06-15 | 2008-12-25 | National Institute Of Advanced Industrial & Technology | シリコンによる2端子抵抗スイッチ素子及び半導体デバイス |
US8198124B2 (en) * | 2010-01-05 | 2012-06-12 | Micron Technology, Inc. | Methods of self-aligned growth of chalcogenide memory access device |
US9178142B2 (en) * | 2013-03-04 | 2015-11-03 | Intermolecular, Inc. | Doped electrodes used to inhibit oxygen loss in ReRAM device |
CN111640864A (zh) * | 2020-05-28 | 2020-09-08 | 厦门半导体工业技术研发有限公司 | 一种半导体集成电路器件及其制造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003017282A1 (fr) * | 2001-08-13 | 2003-02-27 | Advanced Micro Devices, Inc. | Cellule de memoire |
WO2003032392A2 (en) * | 2001-10-09 | 2003-04-17 | Axon Technologies Corporation | Programmable microelectronic device, structure, and system, and method of forming the same |
WO2003046995A1 (en) * | 2001-11-28 | 2003-06-05 | Thin Film Electronics Asa | Matrix-addressable apparatus with one or more memory devices |
WO2003052827A1 (fr) * | 2001-12-18 | 2003-06-26 | Matsushita Electric Industrial Co., Ltd. | Memoire non volatile |
JP2003248241A (ja) * | 2002-02-25 | 2003-09-05 | Fuji Photo Film Co Ltd | エレクトロクロミック装置 |
JP2005518665A (ja) * | 2002-02-20 | 2005-06-23 | マイクロン テクノロジー インコーポレイテッド | 抵抗変化メモリ用のセレン化銀/カルコゲナイドガラス |
JP2005521245A (ja) * | 2002-03-14 | 2005-07-14 | マイクロン テクノロジー インコーポレイテッド | 可変抵抗材料セルの製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0821826B1 (en) * | 1996-02-16 | 2003-07-23 | Koninklijke Philips Electronics N.V. | Write-once read-many electrical memory element of a conjugated polymer or oligomer |
US6545891B1 (en) * | 2000-08-14 | 2003-04-08 | Matrix Semiconductor, Inc. | Modular memory device |
WO2002049643A1 (en) * | 2000-12-21 | 2002-06-27 | The Mclean Hospital Corporation | Treatment of depression |
US6501134B1 (en) * | 2001-01-09 | 2002-12-31 | Advanced Micro Devices, Inc. | Ultra thin SOI devices with improved short-channel control |
US6858481B2 (en) * | 2001-08-13 | 2005-02-22 | Advanced Micro Devices, Inc. | Memory device with active and passive layers |
US6847047B2 (en) * | 2002-11-04 | 2005-01-25 | Advanced Micro Devices, Inc. | Methods that facilitate control of memory arrays utilizing zener diode-like devices |
US6656763B1 (en) * | 2003-03-10 | 2003-12-02 | Advanced Micro Devices, Inc. | Spin on polymers for organic memory devices |
US6977389B2 (en) * | 2003-06-02 | 2005-12-20 | Advanced Micro Devices, Inc. | Planar polymer memory device |
US6858883B2 (en) * | 2003-06-03 | 2005-02-22 | Hewlett-Packard Development Company, L.P. | Partially processed tunnel junction control element |
US6803267B1 (en) * | 2003-07-07 | 2004-10-12 | Advanced Micro Devices, Inc. | Silicon containing material for patterning polymeric memory element |
-
2003
- 2003-11-03 US US10/699,903 patent/US7015504B2/en not_active Expired - Lifetime
-
2004
- 2004-09-23 JP JP2006537996A patent/JP2007511070A/ja active Pending
- 2004-09-23 EP EP04784925A patent/EP1697992A2/en not_active Withdrawn
- 2004-09-23 WO PCT/US2004/031275 patent/WO2005045935A2/en active Application Filing
- 2004-09-23 KR KR1020067008664A patent/KR101087299B1/ko not_active IP Right Cessation
- 2004-09-23 CN CNB2004800397805A patent/CN100539159C/zh not_active Expired - Fee Related
- 2004-10-13 TW TW093130971A patent/TWI359495B/zh not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003017282A1 (fr) * | 2001-08-13 | 2003-02-27 | Advanced Micro Devices, Inc. | Cellule de memoire |
WO2003032392A2 (en) * | 2001-10-09 | 2003-04-17 | Axon Technologies Corporation | Programmable microelectronic device, structure, and system, and method of forming the same |
WO2003046995A1 (en) * | 2001-11-28 | 2003-06-05 | Thin Film Electronics Asa | Matrix-addressable apparatus with one or more memory devices |
WO2003052827A1 (fr) * | 2001-12-18 | 2003-06-26 | Matsushita Electric Industrial Co., Ltd. | Memoire non volatile |
JP2005518665A (ja) * | 2002-02-20 | 2005-06-23 | マイクロン テクノロジー インコーポレイテッド | 抵抗変化メモリ用のセレン化銀/カルコゲナイドガラス |
JP2003248241A (ja) * | 2002-02-25 | 2003-09-05 | Fuji Photo Film Co Ltd | エレクトロクロミック装置 |
JP2005521245A (ja) * | 2002-03-14 | 2005-07-14 | マイクロン テクノロジー インコーポレイテッド | 可変抵抗材料セルの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2005045935A2 (en) | 2005-05-19 |
EP1697992A2 (en) | 2006-09-06 |
KR101087299B1 (ko) | 2011-11-29 |
US20050092983A1 (en) | 2005-05-05 |
WO2005045935A3 (en) | 2005-10-13 |
US7015504B2 (en) | 2006-03-21 |
CN1954431A (zh) | 2007-04-25 |
TW200531263A (en) | 2005-09-16 |
TWI359495B (en) | 2012-03-01 |
KR20060109456A (ko) | 2006-10-20 |
CN100539159C (zh) | 2009-09-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101415283B1 (ko) | 메모리 셀 형성을 위한 인-시투 표면 처리 | |
KR101163681B1 (ko) | Cu2s의 mocvd 형성 | |
US6753247B1 (en) | Method(s) facilitating formation of memory cell(s) and patterned conductive | |
US9219166B2 (en) | Nonvolatile flash memory structures including fullerene molecules and methods for manufacturing the same | |
US7645632B2 (en) | Self aligned memory element and wordline | |
US6803267B1 (en) | Silicon containing material for patterning polymeric memory element | |
CN101267002B (zh) | 非易失性存储元件及其制造方法 | |
US20060231889A1 (en) | Two-terminal solid-state memory device and two-terminal flexible memory device based on nanocrystals or nanoparticles | |
JP2007511070A (ja) | 高密度高分子メモリ素子アレイにおけるサイドウォール形成方法 | |
CN100428519C (zh) | 制造记忆胞元之方法、记忆胞元及记忆胞元装置 | |
US6836398B1 (en) | System and method of forming a passive layer by a CMP process | |
US7012013B1 (en) | Dielectric pattern formation for organic electronic devices | |
US8542540B2 (en) | Nonvolatile memory and methods for manufacturing the same with molecule-engineered tunneling barriers | |
US7199416B1 (en) | Systems and methods for a memory and/or selection element formed within a recess in a metal line |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070907 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20071122 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20071122 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100127 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100202 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20100324 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20100412 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100506 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20100818 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110621 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110920 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110928 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20111020 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20111027 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20111118 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20111128 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111219 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120424 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20120830 |