JP2007507864A - 放射検出器 - Google Patents
放射検出器 Download PDFInfo
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- JP2007507864A JP2007507864A JP2006529611A JP2006529611A JP2007507864A JP 2007507864 A JP2007507864 A JP 2007507864A JP 2006529611 A JP2006529611 A JP 2006529611A JP 2006529611 A JP2006529611 A JP 2006529611A JP 2007507864 A JP2007507864 A JP 2007507864A
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- 230000005855 radiation Effects 0.000 title claims abstract description 103
- 230000035945 sensitivity Effects 0.000 claims abstract description 151
- 239000004065 semiconductor Substances 0.000 claims abstract description 56
- 230000003595 spectral effect Effects 0.000 claims abstract description 42
- 238000009826 distribution Methods 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 33
- 230000003287 optical effect Effects 0.000 claims abstract description 23
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 5
- 230000008447 perception Effects 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 25
- 239000002346 layers by function Substances 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000975 dye Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0304—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/544—Solar cells from Group III-V materials
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Light Receiving Elements (AREA)
- Led Device Packages (AREA)
- Measurement Of Radiation (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
図1Aおよび図1Bは本発明の放射検出器の第1実施例の断面並びに本発明の放射検出器の第2実施例の部分の断面を略示し、
図2は種々の光学フィルタを備えている本発明の放射検出器の第3実施例の検出器感度のスペクトル分布並びに感度値に関してチップの感度に関連付けられている明所視標準比視感度を示している。
Claims (21)
- 予め定めた波長λ0に感度最大値を有している予め定めたスペクトル感度分布(14)に従って放射を検出するための放射検出器であって、放射検出器が少なくとも1つの半導体チップ(1)および少なくとも1つの、半導体チップ(1)に配属されている光学フィルタを有している形式のものにおいて、
− 半導体チップは少なくとも1つのIII−V半導体材料を含んでおり、
− 光学フィルタは、感度最大値の波長λ0より大きい波長を有する放射を吸収する
ことを特徴とする放射放出器。 - 予め定めたスペクトル感度分布(14)は人間の目である
請求項1記載の放射放出器。 - 人間の目のスペクトル感度分布(14)に従って放射を検出するための、少なくとも1つの半導体チップ(1)を有している放射放出器において、
半導体チップ(1)は少なくとも1つのIII−V半導体材料を含んでいる
ことを特徴とする放射放出器。 - 放射検出器が少なくとも1つの、半導体チップ(1)に配属されている光学フィルタを有しておりかつ該光学フィルタは人間の目の感度最大値の波長λ0 ′より大きい波長を有する放射を吸収する
請求項1記載の放射放出器。 - 半導体チップはLEDチップである
請求項1から4までのいずれか1項記載の放射放出器。 - 半導体チップ(1)の感度はλ1において少なくとも1つの極大値(13)を有しており、ここで該波長は50nmより大きくは、有利には15nmより大きくは、波長λ0もしくは波長λ0 ′とは相異していない
請求項1から5までのいずれか1項記載の放射放出器。 - 検出器は、半導体チップ(1)を少なくとも部分的に取り囲んでいるカバー部(4)を有している
請求項1から6までのいずれか1項記載の放射放出器。 - カバー部(4)は樹脂、有利には反応性樹脂を含んでいる
請求項7記載の放射放出器。 - 光学フィルタは少なくとも部分的にカバー部(4)内、カバー部外および/またはカバー部上に配置されておりおよび/またはカバー部材料それ自体がフィルタを形成する
請求項7または8記載の放射検出器。 - 光学フィルタは多数のフィルタ粒子(5)を含んでいる
請求項1から9までのいずれか1項記載の放射放出器。 - 半導体チップ(1)はフィルタ層(3)を有している
請求項1から10までのいずれか1項記載の放射放出器。 - フィルタ層(3)はλ0もしくはλ0 ′より短い波長を吸収する
請求項11記載の放射検出器。 - 放射検出器は検出器感度(12)を有しており、その際任意の波長において該検出器感度(12)の相応の値および予め定めた感度(14)の差は40%より小さい、有利には25%より小さい
請求項1から12までのいずれか1項記載の放射放出器。 - III−V半導体材料は、InxGayAl1−x−yP、InxGayAl1−x−yNまたはInxGayAl1−x−yAs、ただしそれぞれ0≦x≦1,0≦y≦1およびx+y≦1である
請求項1から13までのいずれか1項記載の放射放出器。 - LEDチップ(1)の放出波長は赤のスペクトル領域にある
請求項5から14までのいずれか1項記載の放射放出器。 - 請求項1から15までのいずれか1項記載の放射放出器の、周囲光センサとしての使用。
- 請求項1から15までのいずれか1項記載の放射放出器の、機能の仕方、機能する期間、知覚および/または用途が予め定めたスペクトル感度分布に結び付いている装置に対する影響力を制御するための使用。
- 請求項1から15までのいずれか1項記載の放射放出器の、照明装置の明るさを制御するための使用。
- 請求項1から15までのいずれか1項記載の放射放出器の、LCD画像スクリーンのバックライトの明るさを制御するための使用。
- 請求項1から15までのいずれか1項記載の放射放出器の、表示装置の明るさを制御するための使用。
- 請求項1から15までのいずれか1項記載の放射放出器の、照明装置の投入接続または遮断時点を制御するための使用。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10345410A DE10345410A1 (de) | 2003-09-30 | 2003-09-30 | Strahlungsdetektor |
DE10345410.1 | 2003-09-30 | ||
PCT/DE2004/001877 WO2005041247A2 (de) | 2003-09-30 | 2004-08-24 | Strahlungsdetektor |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007507864A true JP2007507864A (ja) | 2007-03-29 |
JP5700899B2 JP5700899B2 (ja) | 2015-04-15 |
Family
ID=34399078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006529611A Active JP5700899B2 (ja) | 2003-09-30 | 2004-08-24 | 放射検出器 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7700905B2 (ja) |
EP (1) | EP1668674B1 (ja) |
JP (1) | JP5700899B2 (ja) |
KR (1) | KR20060070569A (ja) |
CN (1) | CN100502056C (ja) |
DE (1) | DE10345410A1 (ja) |
TW (1) | TWI324397B (ja) |
WO (1) | WO2005041247A2 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10345410A1 (de) | 2003-09-30 | 2005-05-04 | Osram Opto Semiconductors Gmbh | Strahlungsdetektor |
DE102004029412A1 (de) * | 2004-02-27 | 2005-10-13 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines solchen Halbleiterchips |
KR20130036337A (ko) * | 2004-03-31 | 2013-04-11 | 오스람 옵토 세미컨덕터스 게엠베하 | 방사선 검출기 |
EP1730787B1 (de) * | 2004-03-31 | 2020-04-29 | OSRAM Opto Semiconductors GmbH | Strahlungsdetektor |
DE102007012115A1 (de) | 2006-11-30 | 2008-06-05 | Osram Opto Semiconductors Gmbh | Strahlungsdetektor |
DE102008016095A1 (de) | 2008-03-28 | 2009-10-01 | Osram Opto Semiconductors Gmbh | Lumineszenzdiodenmodul |
DE102009024069A1 (de) * | 2009-06-05 | 2010-12-09 | Osram Opto Semiconductors Gmbh | Optisches Beleuchtungsgerät und optisches Aufzeichnungsgerät |
US20150316219A1 (en) * | 2014-05-01 | 2015-11-05 | CoreLed Systems, LLC | High-pass filter for led lighting |
EP3261134A1 (en) * | 2016-06-20 | 2017-12-27 | ams AG | Directional photodetector and optical sensor arrangement |
DE102018119710A1 (de) * | 2018-08-14 | 2020-02-20 | Universität Leipzig | Vorrichtung und verfahren zur bestimmung einer wellenlänge einer strahlung |
DE102019207404A1 (de) * | 2019-05-21 | 2020-11-26 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronische Messvorrichtung zur Messung einer Intensität einer elektromagnetischen Strahlung |
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JP2001308351A (ja) * | 2000-04-18 | 2001-11-02 | Toshiba Corp | 光半導体装置 |
JP2003258292A (ja) * | 2002-03-01 | 2003-09-12 | Toshiba Corp | 光半導体センサ |
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-
2003
- 2003-09-30 DE DE10345410A patent/DE10345410A1/de not_active Withdrawn
-
2004
- 2004-08-24 CN CNB2004800283876A patent/CN100502056C/zh active Active
- 2004-08-24 WO PCT/DE2004/001877 patent/WO2005041247A2/de active Application Filing
- 2004-08-24 JP JP2006529611A patent/JP5700899B2/ja active Active
- 2004-08-24 US US10/573,095 patent/US7700905B2/en active Active
- 2004-08-24 KR KR1020067006197A patent/KR20060070569A/ko active Search and Examination
- 2004-08-24 EP EP04786174.5A patent/EP1668674B1/de active Active
- 2004-09-29 TW TW093129335A patent/TWI324397B/zh active
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JPS5091339A (ja) * | 1973-12-06 | 1975-07-22 | ||
JPH05235410A (ja) * | 1992-02-26 | 1993-09-10 | Hitachi Cable Ltd | 送受信用光半導体素子及びそれを用いた光通信用モジュール |
JP2000252482A (ja) * | 1999-02-25 | 2000-09-14 | Kureha Chem Ind Co Ltd | 受光センサ及び該センサを用いた装置 |
JP2001119063A (ja) * | 1999-10-20 | 2001-04-27 | Nitto Kogaku Kk | 発光兼受光回路並びにカメラ及び光学装置 |
JP2001308351A (ja) * | 2000-04-18 | 2001-11-02 | Toshiba Corp | 光半導体装置 |
JP2003258292A (ja) * | 2002-03-01 | 2003-09-12 | Toshiba Corp | 光半導体センサ |
Also Published As
Publication number | Publication date |
---|---|
US7700905B2 (en) | 2010-04-20 |
CN1860616A (zh) | 2006-11-08 |
KR20060070569A (ko) | 2006-06-23 |
CN100502056C (zh) | 2009-06-17 |
EP1668674A2 (de) | 2006-06-14 |
WO2005041247A3 (de) | 2005-07-07 |
TW200520239A (en) | 2005-06-16 |
WO2005041247A2 (de) | 2005-05-06 |
EP1668674B1 (de) | 2013-05-22 |
JP5700899B2 (ja) | 2015-04-15 |
DE10345410A1 (de) | 2005-05-04 |
US20070040101A1 (en) | 2007-02-22 |
TWI324397B (en) | 2010-05-01 |
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