JP2007506861A - 薄膜状構造部材を製造する方法と製造設備 - Google Patents
薄膜状構造部材を製造する方法と製造設備 Download PDFInfo
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- JP2007506861A JP2007506861A JP2006527277A JP2006527277A JP2007506861A JP 2007506861 A JP2007506861 A JP 2007506861A JP 2006527277 A JP2006527277 A JP 2006527277A JP 2006527277 A JP2006527277 A JP 2006527277A JP 2007506861 A JP2007506861 A JP 2007506861A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000010409 thin film Substances 0.000 title description 13
- 239000000758 substrate Substances 0.000 claims abstract description 126
- 238000010438 heat treatment Methods 0.000 claims abstract description 27
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 13
- 230000000694 effects Effects 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 18
- 238000000576 coating method Methods 0.000 claims description 18
- 230000003446 memory effect Effects 0.000 claims description 18
- 238000004070 electrodeposition Methods 0.000 claims description 4
- 230000002457 bidirectional effect Effects 0.000 claims description 2
- 230000007704 transition Effects 0.000 claims description 2
- 238000000926 separation method Methods 0.000 abstract description 22
- 238000001816 cooling Methods 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 11
- 230000008021 deposition Effects 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 238000000151 deposition Methods 0.000 description 7
- 229910000734 martensite Inorganic materials 0.000 description 7
- 230000008901 benefit Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910001566 austenite Inorganic materials 0.000 description 3
- 230000002427 irreversible effect Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000005294 ferromagnetic effect Effects 0.000 description 2
- 230000005291 magnetic effect Effects 0.000 description 2
- 229910001000 nickel titanium Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- HLXZNVUGXRDIFK-UHFFFAOYSA-N nickel titanium Chemical compound [Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ti].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni].[Ni] HLXZNVUGXRDIFK-UHFFFAOYSA-N 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002887 superconductor Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0005—Separation of the coating from the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
- H10N60/0576—Processes for depositing or forming copper oxide superconductor layers characterised by the substrate
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Laminated Bodies (AREA)
- Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
- Electrolytic Production Of Metals (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
Abstract
Description
Claims (9)
- 薄膜状構造部材(16)の製造方法において、
形状記憶合金より成る基板(12)上の構造部材(16)を、該基板(12)を被覆することにより製造し、
構造部材(16)で被覆された基板(12)を、該基板が、形状記憶効果により変形するように温度調整し、
構造部材(16)を基板ベルト(12)と分離する
薄膜状構造部材(16)の製造方法において、
前記基板ベルトのテクスチュア構造を、この薄膜状構造部材(12)の準エピタキシャルな成長により基板上に転写することを特徴とする方法。 - 基板(12)を被覆する前に変形し、被覆後に基板が元の形に移行するように加熱することで一方向効果を利用することを特徴とする請求項1記載の方法。
- 被覆前に基板(12)を1つの形に変形し、被覆後に基板(12)が別の形に移行するように温度調整して二方向効果を利用することを特徴とする請求項1記載の方法。
- 被覆後に基板(12)が1つの形に、次いで別の形に移行するように、交互に加熱、冷却することを特徴とする請求項3記載の方法。
- 基板ベルト(12)を、構造部材用製造装置と、構造部材を製造するための温度調整可能な分離装置に案内し、かつ形状記憶合金より成る基板ベルト(12)を使用して、ベルト形の薄膜状構造部材(16)を製造する、基板ベルトを有する製造設備において、
前記基板ベルト(12)上に薄膜状構造部材(16)を準エピタキシャルに成長させる製造装置を備えることを特徴とする基板ベルト(12)によりベルト状の薄膜状構造部材を製造する製造設備。 - 製造装置が、PVDによる被覆装置又は電気的析出装置であることを特徴とする請求項5記載の製造設備。
- 製造装置(17)に変形装置が前置接続されたことを特徴とする請求項5又は6記載の製造設備。
- 製造装置(17)に基板ベルト用温度調節装置(22)が前置接続されたことを特徴とする請求項5又は6記載の製造設備。
- 基板ベルト(12)を、製造設備内を周回する無端のベルトとして形成したことを特徴とする請求項5から8の1つに記載の製造設備。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10346368A DE10346368B4 (de) | 2003-09-29 | 2003-09-29 | Verfahren und Herstellungsanlage zum Herstellen eines schichtartigen Bauteils |
DE10346368.2 | 2003-09-29 | ||
PCT/DE2004/002203 WO2005031043A1 (de) | 2003-09-29 | 2004-09-28 | Verfahren und herstellungsanlage zum herstellen eines schichtartigen bauteils |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007506861A true JP2007506861A (ja) | 2007-03-22 |
JP4689611B2 JP4689611B2 (ja) | 2011-05-25 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2006527277A Expired - Fee Related JP4689611B2 (ja) | 2003-09-29 | 2004-09-28 | 薄膜状構造部材を製造する方法と製造設備 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070035062A1 (ja) |
EP (1) | EP1668173B1 (ja) |
JP (1) | JP4689611B2 (ja) |
AT (1) | ATE491826T1 (ja) |
DE (2) | DE10346368B4 (ja) |
DK (1) | DK1668173T3 (ja) |
WO (1) | WO2005031043A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012176883A1 (ja) * | 2011-06-23 | 2012-12-27 | 旭技研株式会社 | 金属箔の製造方法及び製造装置 |
JP2017115167A (ja) * | 2015-12-21 | 2017-06-29 | 日立金属株式会社 | アルミニウム箔の製造方法およびアルミニウム箔製造用陰極ドラム |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10346370A1 (de) * | 2003-09-29 | 2005-04-28 | Siemens Ag | Verfahren und Herstellungsanlage zum Herstellen eines Bandes auf einem Substratband |
CN113755678B (zh) * | 2021-09-18 | 2024-05-28 | 无锡东创智能材料科技有限公司 | 一种形状记忆合金丝的训练装置以及训练方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5462128A (en) * | 1977-10-26 | 1979-05-18 | Hamasawa Kogyo Kk | Peeling of electroforming exterior blade |
JPH01235606A (ja) * | 1988-03-17 | 1989-09-20 | Canon Inc | 情報記録媒体用基板の製造方法 |
US6024907A (en) * | 1998-02-02 | 2000-02-15 | Bruce Jagunich | Embossing with an endless belt composed of a shape memory alloy |
WO2003012172A2 (de) * | 2001-07-25 | 2003-02-13 | Siemens Aktiengesellschaft | Verfahren und vorrichtung zum erzeugen eines texturierten bandes aus metall |
JP2003138394A (ja) * | 2001-10-30 | 2003-05-14 | Hikari Tekku Kk | 金属管の製造方法 |
Family Cites Families (9)
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US2849752A (en) * | 1956-12-17 | 1958-09-02 | Ibm | Machine for embossing thermoplastic workpiece |
GB1421818A (en) * | 1972-05-08 | 1976-01-21 | Xerox Corp | Nickel electroforming process |
US3966383A (en) * | 1974-12-30 | 1976-06-29 | Ethyl Corporation | Apparatus for embossing film |
US4055955A (en) * | 1976-08-16 | 1977-11-01 | Alfred Davis Johnson | Memory alloy heat engine and method of operation |
US4530739A (en) * | 1984-03-09 | 1985-07-23 | Energy Conversion Devices, Inc. | Method of fabricating an electroplated substrate |
US4787837A (en) * | 1986-08-07 | 1988-11-29 | Union Carbide Corporation | Wear-resistant ceramic, cermet or metallic embossing surfaces, methods for producing same, methods of embossing articles by same and novel embossed articles |
US5049243A (en) * | 1990-12-24 | 1991-09-17 | Xerox Corporation | Electroforming process for multi-layer endless metal belt assembly |
US5049242A (en) * | 1990-12-24 | 1991-09-17 | Xerox Corporation | Endless metal belt assembly with controlled parameters |
DE10136891B4 (de) * | 2001-07-25 | 2004-07-22 | Siemens Ag | Verfahren zum Erzeugen eines flächenhaften Basismaterials aus Metall |
-
2003
- 2003-09-29 DE DE10346368A patent/DE10346368B4/de not_active Expired - Fee Related
-
2004
- 2004-09-28 WO PCT/DE2004/002203 patent/WO2005031043A1/de active Application Filing
- 2004-09-28 DE DE502004012006T patent/DE502004012006D1/de active Active
- 2004-09-28 US US10/572,939 patent/US20070035062A1/en not_active Abandoned
- 2004-09-28 JP JP2006527277A patent/JP4689611B2/ja not_active Expired - Fee Related
- 2004-09-28 DK DK04786902.9T patent/DK1668173T3/da active
- 2004-09-28 EP EP04786902A patent/EP1668173B1/de not_active Not-in-force
- 2004-09-28 AT AT04786902T patent/ATE491826T1/de active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5462128A (en) * | 1977-10-26 | 1979-05-18 | Hamasawa Kogyo Kk | Peeling of electroforming exterior blade |
JPH01235606A (ja) * | 1988-03-17 | 1989-09-20 | Canon Inc | 情報記録媒体用基板の製造方法 |
US6024907A (en) * | 1998-02-02 | 2000-02-15 | Bruce Jagunich | Embossing with an endless belt composed of a shape memory alloy |
WO2003012172A2 (de) * | 2001-07-25 | 2003-02-13 | Siemens Aktiengesellschaft | Verfahren und vorrichtung zum erzeugen eines texturierten bandes aus metall |
JP2003138394A (ja) * | 2001-10-30 | 2003-05-14 | Hikari Tekku Kk | 金属管の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012176883A1 (ja) * | 2011-06-23 | 2012-12-27 | 旭技研株式会社 | 金属箔の製造方法及び製造装置 |
JP2017115167A (ja) * | 2015-12-21 | 2017-06-29 | 日立金属株式会社 | アルミニウム箔の製造方法およびアルミニウム箔製造用陰極ドラム |
Also Published As
Publication number | Publication date |
---|---|
EP1668173A1 (de) | 2006-06-14 |
WO2005031043A1 (de) | 2005-04-07 |
US20070035062A1 (en) | 2007-02-15 |
DE10346368A1 (de) | 2005-05-12 |
ATE491826T1 (de) | 2011-01-15 |
DE10346368B4 (de) | 2006-05-18 |
DE502004012006D1 (de) | 2011-01-27 |
DK1668173T3 (da) | 2011-04-04 |
JP4689611B2 (ja) | 2011-05-25 |
EP1668173B1 (de) | 2010-12-15 |
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