JP2007504761A - 熱導出が改善された送信モジュール - Google Patents
熱導出が改善された送信モジュール Download PDFInfo
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- JP2007504761A JP2007504761A JP2006525658A JP2006525658A JP2007504761A JP 2007504761 A JP2007504761 A JP 2007504761A JP 2006525658 A JP2006525658 A JP 2006525658A JP 2006525658 A JP2006525658 A JP 2006525658A JP 2007504761 A JP2007504761 A JP 2007504761A
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- transmission module
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/03—Constructional details, e.g. casings, housings
- H04B1/036—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/15323—Connection portion the connection portion being formed on the die mounting surface of the substrate being a land array, e.g. LGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Abstract
Description
図4には本発明の送信モジュールが概略的な断面図で示されている。これはさらなる集積コンポーネントをモジュールサブストレートの上面に有している。
図5には公知の送信モジュールが概略的な平面図で示されている。
図6にはリードフレーム上の公知のパワー増幅器が概略的な断面図で示されている。
Claims (16)
- 移動無線用途向けの送信モジュールであって、
送信フィルタ(TX)と、
多層モジュールサブストレート(MS)を伴い、
当該多層モジュールサブストレートは、接続部を実現する少なくとも2つの構造化された金属化面(ME1,ME2,・・・MEn)と、前記金属化面間に位置する絶縁層(IS1,IS2,・・・ISm)を有しており、
当該絶縁層は上面と、下面と、当該下面に設けられた外部コンタクト(AK)を有しており、
前記下面には凹部(CA)が設けられており、当該凹部内にはチップ構成素子(PA)がフリップチップ構成で前記接続部と接続されており、当該チップ構成素子の外部を向いている背面は、チップエレメントからの熱導出を改善するために金属化部(M)と熱的に接触接続している、
ことを特徴とする、移動無線アプリケーション用の送信モジュール。 - 前記凹部(CA)は、少なくとも部分的に電気的に絶縁性のアンダーフィラー(UF)によって満たされている、請求項1記載の送信モジュール。
- 前記アンダーフィラー(UF)は前記凹部(CA)を部分的に満たし、当該アンダーフィラー(UF)上に、金属化部(M)として、導電性充填質量体が配置されており、当該充填質量体は前記凹部(CA)を完全に満たす、請求項2記載の送信モジュール。
- 前記凹部(CA)は完全に導電性のアンダーフィラー(UF)によって満たされており、当該アンダーフィラー(UF)上に金属化部(M)が設けられている、請求項2記載の送信モジュール。
- 前記金属化部(M)は、少なくともチップ構成素子(PA)の背面上に設けられている、請求項1または4記載の送信モジュール。
- 前記金属化部(M)は金属製カバーとして構成されており、当該金属製カバーによって前記凹部(CA)は閉成されている、請求項1または4記載の送信モジュール。
- 前記金属化部(M)は、少なくともチップ構成素子(PA)の背面上にスパッタリングされている、請求項5記載の送信モジュール。
- 前記金属化部(M)は、外部の回路周辺部と直接的に熱的に接触接続している、請求項1から7までのいずれか1項記載の送信モジュール。
- 前記金属化部(M)は、外部の回路周辺部と伝熱的に接着されている、またははんだ付けされている、請求項8記載の送信モジュール。
- 付加的にインピーダンス整合回路を含み、当該インピーダンス整合回路は前記モジュールサブストレート(MS)内に組み込まれているか、または部分的に前記モジュールサブストレート内に組み込まれており、前記上面に取り付けられたSMD構成素子または組み込まれた受動的な構成素子によって補足されている、または完全に、前記上面に取り付けられたSMD構成素子または組み込まれた受動的な構成素子によって実現されている、請求項1から9までのいずれか1項記載の送信モジュール。
- 前記送信フィルタ(TX)はローパスフィルタであって、当該ローパスフィルタは前記モジュールサブストレート内の接続部内に組み込まれている、請求項1から10までのいずれか1項記載の送信モジュール。
- 前記上面上にスイッチ(S)が組み込まれており、当該スイッチは、送信動作と受信動作との間の切り替えおよび/または異なる帯域間の切り替えを可能にする、請求項11記載の送信モジュール。
- 前記スイッチ(S)はPINダイオード,GaAsスイッチ,CMOSスイッチまたはMEMSスイッチとして構成されている、請求項12記載の送信モジュール。
- 前記送信フィルタ(TX)は、前記モジュールサブストレート(MS)内の接続部内に組み込まれており、前記モジュールサブストレートの上面に配置されている受信フィルタ(RX)が設けられており、整合回路は前記モジュールサブストレート(MS)内に組み込まれている、請求項11から13までのいずれか1項記載の送信モジュール。
- 前記多層モジュールサブストレート(MS)はLTCCセラミック,HTCCセラミックまたはラミネートである、請求項1から14までのいずれか1項記載の送信モジュール。
- 前記チップ構成素子(PA)は送信動作用のパワー増幅器として構成されている、請求項1から15までのいずれか1項記載の送信モジュール。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10340438A DE10340438B4 (de) | 2003-09-02 | 2003-09-02 | Sendemodul mit verbesserter Wärmeabführung |
PCT/EP2004/009065 WO2005029714A1 (de) | 2003-09-02 | 2004-08-12 | Sendemodul mit verbesserter wärmeabführung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007504761A true JP2007504761A (ja) | 2007-03-01 |
JP4404903B2 JP4404903B2 (ja) | 2010-01-27 |
Family
ID=34305580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006525658A Expired - Fee Related JP4404903B2 (ja) | 2003-09-02 | 2004-08-12 | 熱導出が改善された送信モジュール |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070108584A1 (ja) |
JP (1) | JP4404903B2 (ja) |
DE (1) | DE10340438B4 (ja) |
WO (1) | WO2005029714A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20140075357A (ko) * | 2012-12-11 | 2014-06-19 | 삼성전기주식회사 | 칩 내장형 인쇄회로기판과 그를 이용한 반도체 패키지 및 칩 내장형 인쇄회로기판의 제조방법 |
Families Citing this family (10)
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US8749021B2 (en) * | 2006-12-26 | 2014-06-10 | Megit Acquisition Corp. | Voltage regulator integrated with semiconductor chip |
TW200924453A (en) * | 2007-11-16 | 2009-06-01 | Htc Corp | Wireless communication module |
DE102009000888B4 (de) * | 2009-02-16 | 2011-03-24 | Semikron Elektronik Gmbh & Co. Kg | Halbleiteranordnung |
KR101522994B1 (ko) * | 2010-12-16 | 2015-05-26 | 한국전자통신연구원 | Fbar 듀플렉서 모듈 및 그 제조 방법 |
DE102014102518B4 (de) | 2014-02-26 | 2022-04-28 | Snaptrack, Inc. | Package für ein abstimmbares Filter |
CN110392926B (zh) * | 2017-03-14 | 2022-12-06 | 株式会社村田制作所 | 高频模块 |
EP3876683A1 (en) | 2020-03-05 | 2021-09-08 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Heat removal mechanism for stack-based electronic device with process control component and processing components |
JP2021158554A (ja) * | 2020-03-27 | 2021-10-07 | 株式会社村田製作所 | 高周波モジュールおよび通信装置 |
JP2021158556A (ja) * | 2020-03-27 | 2021-10-07 | 株式会社村田製作所 | 高周波モジュールおよび通信装置 |
CN112738994B (zh) * | 2020-11-24 | 2022-12-09 | 鹤山市世拓电子科技有限公司 | 一种内嵌功率器件的印刷电路板 |
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-
2003
- 2003-09-02 DE DE10340438A patent/DE10340438B4/de not_active Expired - Fee Related
-
2004
- 2004-08-12 WO PCT/EP2004/009065 patent/WO2005029714A1/de active Application Filing
- 2004-08-12 US US10/570,189 patent/US20070108584A1/en not_active Abandoned
- 2004-08-12 JP JP2006525658A patent/JP4404903B2/ja not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140075357A (ko) * | 2012-12-11 | 2014-06-19 | 삼성전기주식회사 | 칩 내장형 인쇄회로기판과 그를 이용한 반도체 패키지 및 칩 내장형 인쇄회로기판의 제조방법 |
JP2014116602A (ja) * | 2012-12-11 | 2014-06-26 | Samsung Electro-Mechanics Co Ltd | チップ内蔵型印刷回路基板及びそれを用いた半導体パッケージ、並びにチップ内蔵型印刷回路基板の製造方法 |
JP2019024101A (ja) * | 2012-12-11 | 2019-02-14 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | チップ内蔵型印刷回路基板および半導体パッケージ |
KR102107038B1 (ko) * | 2012-12-11 | 2020-05-07 | 삼성전기주식회사 | 칩 내장형 인쇄회로기판과 그를 이용한 반도체 패키지 및 칩 내장형 인쇄회로기판의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
WO2005029714A1 (de) | 2005-03-31 |
JP4404903B2 (ja) | 2010-01-27 |
US20070108584A1 (en) | 2007-05-17 |
DE10340438B4 (de) | 2005-08-04 |
DE10340438A1 (de) | 2005-04-14 |
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