JP2007503697A5 - - Google Patents

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Publication number
JP2007503697A5
JP2007503697A5 JP2006524765A JP2006524765A JP2007503697A5 JP 2007503697 A5 JP2007503697 A5 JP 2007503697A5 JP 2006524765 A JP2006524765 A JP 2006524765A JP 2006524765 A JP2006524765 A JP 2006524765A JP 2007503697 A5 JP2007503697 A5 JP 2007503697A5
Authority
JP
Japan
Prior art keywords
conductive
conductive layer
heat transfer
support
transfer material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006524765A
Other languages
English (en)
Japanese (ja)
Other versions
JP4970940B2 (ja
JP2007503697A (ja
Filing date
Publication date
Priority claimed from US10/648,421 external-priority patent/US6872500B2/en
Application filed filed Critical
Publication of JP2007503697A publication Critical patent/JP2007503697A/ja
Publication of JP2007503697A5 publication Critical patent/JP2007503697A5/ja
Application granted granted Critical
Publication of JP4970940B2 publication Critical patent/JP4970940B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2006524765A 2003-08-26 2004-08-23 支持体上の導電性層のパターン形成 Expired - Fee Related JP4970940B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/648,421 2003-08-26
US10/648,421 US6872500B2 (en) 2003-08-26 2003-08-26 Method of patterning an electroconductive layer on a support
PCT/US2004/027261 WO2005022968A1 (en) 2003-08-26 2004-08-23 Patterning an electroconductive layer on a support

Publications (3)

Publication Number Publication Date
JP2007503697A JP2007503697A (ja) 2007-02-22
JP2007503697A5 true JP2007503697A5 (enExample) 2011-03-10
JP4970940B2 JP4970940B2 (ja) 2012-07-11

Family

ID=34216728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006524765A Expired - Fee Related JP4970940B2 (ja) 2003-08-26 2004-08-23 支持体上の導電性層のパターン形成

Country Status (5)

Country Link
US (1) US6872500B2 (enExample)
JP (1) JP4970940B2 (enExample)
CN (1) CN1843066A (enExample)
TW (1) TWI360721B (enExample)
WO (1) WO2005022968A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060066803A1 (en) * 2004-09-30 2006-03-30 Aylward Peter T Substrate free flexible liquid crystal displays
US7781047B2 (en) * 2004-10-21 2010-08-24 Eastman Kodak Company Polymeric conductor donor and transfer method
JP4738860B2 (ja) * 2005-03-25 2011-08-03 株式会社リコー エレクトロクロミック表示素子
US20070090758A1 (en) * 2005-10-21 2007-04-26 Kwasny David M Electroluminescent panel
US8062824B2 (en) * 2006-07-17 2011-11-22 E. I. Du Pont De Nemours And Company Thermally imageable dielectric layers, thermal transfer donors and receivers
US8137767B2 (en) 2006-11-22 2012-03-20 Fujifilm Corporation Antireflective film, polarizing plate and image display device
US20100159648A1 (en) * 2008-12-22 2010-06-24 Tombs Thomas N Electrophotograph printed electronic circuit boards
US20100155128A1 (en) * 2008-12-22 2010-06-24 Tombs Thomas N Printed electronic circuit boards and other articles having patterned coonductive images
US8512933B2 (en) 2008-12-22 2013-08-20 Eastman Kodak Company Method of producing electronic circuit boards using electrophotography
CN102762026B (zh) * 2011-04-27 2015-03-18 瑞化股份有限公司 透明导电线路的构造及制造方法
AT513830B1 (de) * 2013-08-14 2014-08-15 Universität Linz Verfahren zum Aufbringen einer organischen Halbleiterschicht auf der Basis von Epindolidion auf einen Träger
US10852680B2 (en) * 2015-07-31 2020-12-01 Hp Indigo B.V. Print substrate surface modification
TW201730292A (zh) * 2015-11-20 2017-09-01 Toagosei Co Ltd 導電性高分子用隱形蝕刻墨水及導電性高分子之圖案化方法
TWI686563B (zh) * 2018-04-11 2020-03-01 台灣愛司帝科技股份有限公司 微型發光二極體顯示器及其製作方法
CN114729076B (zh) 2019-11-26 2024-09-20 默克专利股份有限公司 非硫醇类基于氮的疏水性聚合物刷材料及其用于基板表面修饰的用途

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4052209A (en) * 1975-03-07 1977-10-04 Minnesota Mining And Manufacturing Company Semiconductive and sensitized photoconductive compositions
DE59010247D1 (de) 1990-02-08 1996-05-02 Bayer Ag Neue Polythiophen-Dispersionen, ihre Herstellung und ihre Verwendung
DE69319200T2 (de) * 1992-10-14 1999-01-28 Agfa-Gevaert N.V., Mortsel Antistatische Beschichtungszusammensetzung
ATE228545T1 (de) 1994-05-06 2002-12-15 Bayer Ag Leitfähige beschichtungen
DE69633523T2 (de) 1995-11-22 2006-02-16 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Naval Research Laboratory Leitende gemusterte polymeroberfläche, verfahren zu ihrer herstellung und diese enthaltende anordnungen
JPH10217623A (ja) * 1997-01-31 1998-08-18 Dainippon Printing Co Ltd 熱転写受像シート
EP1079397A1 (en) 1999-08-23 2001-02-28 Agfa-Gevaert N.V. Method of making an electroconductive pattern on a support
US6623903B2 (en) * 2001-06-22 2003-09-23 Agfa-Gevaert Material and method for making an electroconductive pattern
EP1326260A1 (en) * 2001-12-11 2003-07-09 Agfa-Gevaert Material for making a conductive pattern
US6800429B2 (en) 2001-12-26 2004-10-05 Eastman Kodak Company Imaging materials with conductive layers containing electronically conductive polymer particles

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