JP2004531027A5 - - Google Patents

Download PDF

Info

Publication number
JP2004531027A5
JP2004531027A5 JP2002580344A JP2002580344A JP2004531027A5 JP 2004531027 A5 JP2004531027 A5 JP 2004531027A5 JP 2002580344 A JP2002580344 A JP 2002580344A JP 2002580344 A JP2002580344 A JP 2002580344A JP 2004531027 A5 JP2004531027 A5 JP 2004531027A5
Authority
JP
Japan
Prior art keywords
composition
finely divided
divided particles
conductive pattern
zinc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002580344A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004531027A (ja
JP4163003B2 (ja
Filing date
Publication date
Priority claimed from GBGB0108887.1A external-priority patent/GB0108887D0/en
Application filed filed Critical
Publication of JP2004531027A publication Critical patent/JP2004531027A/ja
Publication of JP2004531027A5 publication Critical patent/JP2004531027A5/ja
Application granted granted Critical
Publication of JP4163003B2 publication Critical patent/JP4163003B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002580344A 2001-04-09 2002-04-04 電子回路での導体組成物の使用 Expired - Fee Related JP4163003B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0108887.1A GB0108887D0 (en) 2001-04-09 2001-04-09 Conductor composition III
PCT/US2002/010496 WO2002082465A2 (en) 2001-04-09 2002-04-04 The use of conductor compositions in electronic circuits

Publications (3)

Publication Number Publication Date
JP2004531027A JP2004531027A (ja) 2004-10-07
JP2004531027A5 true JP2004531027A5 (enExample) 2005-08-18
JP4163003B2 JP4163003B2 (ja) 2008-10-08

Family

ID=9912547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002580344A Expired - Fee Related JP4163003B2 (ja) 2001-04-09 2002-04-04 電子回路での導体組成物の使用

Country Status (9)

Country Link
EP (1) EP1377986B1 (enExample)
JP (1) JP4163003B2 (enExample)
KR (1) KR100558827B1 (enExample)
CN (1) CN1500277A (enExample)
AU (1) AU2002307095A1 (enExample)
DE (1) DE60212950T2 (enExample)
GB (1) GB0108887D0 (enExample)
TW (1) TW201040989A (enExample)
WO (1) WO2002082465A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0307547D0 (en) 2003-04-01 2003-05-07 Du Pont Conductor composition V
US7485245B1 (en) * 2007-10-18 2009-02-03 E.I. Du Pont De Nemours And Company Electrode paste for solar cell and solar cell electrode using the paste
WO2009052364A1 (en) * 2007-10-18 2009-04-23 E.I. Du Pont De Nemours And Company Conductive compositions and processes for use in the manufacture of semiconductor devices: multiple busbars
US20100258165A1 (en) * 2009-04-09 2010-10-14 E.I. Du Pont De Nemours And Company Glass compositions used in conductors for photovoltaic cells
CN102348657A (zh) * 2009-04-09 2012-02-08 E.I.内穆尔杜邦公司 用于光伏电池导体中的玻璃组合物
CN102348656A (zh) * 2009-04-09 2012-02-08 E.I.内穆尔杜邦公司 用于光伏电池导体中的玻璃组合物
TW201115592A (en) * 2009-06-19 2011-05-01 Du Pont Glass compositions used in conductors for photovoltaic cells
JP5971250B2 (ja) 2011-08-03 2016-08-17 日立化成株式会社 組成物セット、導電性基板及びその製造方法並びに導電性接着材組成物
FR3044962B1 (fr) * 2015-12-10 2017-12-22 Saint Gobain Vitrage muni d'un dispositif conducteur electrique et possedant une resistance amelioree aux tests cycliques de temperature.

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4510179A (en) * 1981-08-18 1985-04-09 Matsushita Electric Industrial Co., Ltd. Electrode on heat-resisting and isolating substrate and the manufacturing process for it

Similar Documents

Publication Publication Date Title
TWI265762B (en) Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof
TW550989B (en) Layered wiring line of silver or silver alloy and method for forming the same and display panel substrate using the same
JP2009152112A5 (enExample)
JP2004127737A5 (enExample)
JP2003089864A5 (enExample)
JP2005149764A5 (enExample)
CA2426861A1 (en) Conductive metal paste
WO2003052776A3 (de) Verfahren zum herstellen eier elektrisch leitenden widerstandsschicht sowie heiz- und/oder kühlvorrichtung
JP2006501670A5 (enExample)
KR950031213A (ko) 전기적으로 가열가능한 흡탈착용 활성탄 몸체 및 이의 제조방법
JP2004349167A5 (enExample)
WO2007137099A3 (en) Double layer carbon nanotube-based structures and methods for removing heat from solid-state devices
JP2003315813A5 (enExample)
JP2006228475A5 (enExample)
JP2004524665A5 (enExample)
DE60334959D1 (de) Zerstäubungstarget aus Basis von Kupfer mit ultrafeinem Korngefüge
JP2004128357A5 (enExample)
JP2005105053A5 (enExample)
JP4285197B2 (ja) 回路基板の製造方法及び回路基板
JP2007503697A5 (enExample)
TW200508797A (en) Patterning an electroconductive layer on a support
JP2003234020A5 (enExample)
JP2005183803A5 (enExample)
WO2005016656A3 (en) Imaging material with improved scratch resistance
JP2004006290A5 (ja) 導電性部材の製造方法及び導電性部材