CN1843066A - 载体上的导电层的构图方法 - Google Patents

载体上的导电层的构图方法 Download PDF

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Publication number
CN1843066A
CN1843066A CN200480024249.0A CN200480024249A CN1843066A CN 1843066 A CN1843066 A CN 1843066A CN 200480024249 A CN200480024249 A CN 200480024249A CN 1843066 A CN1843066 A CN 1843066A
Authority
CN
China
Prior art keywords
polymer
conductive
layer
acid
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200480024249.0A
Other languages
English (en)
Chinese (zh)
Inventor
M·S·伯贝里
C·C·安德森
M·莱伦塔尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of CN1843066A publication Critical patent/CN1843066A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/211—Changing the shape of the active layer in the devices, e.g. patterning by selective transformation of an existing layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/165—Thermal imaging composition

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
CN200480024249.0A 2003-08-26 2004-08-23 载体上的导电层的构图方法 Pending CN1843066A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/648,421 2003-08-26
US10/648,421 US6872500B2 (en) 2003-08-26 2003-08-26 Method of patterning an electroconductive layer on a support

Publications (1)

Publication Number Publication Date
CN1843066A true CN1843066A (zh) 2006-10-04

Family

ID=34216728

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200480024249.0A Pending CN1843066A (zh) 2003-08-26 2004-08-23 载体上的导电层的构图方法

Country Status (5)

Country Link
US (1) US6872500B2 (enExample)
JP (1) JP4970940B2 (enExample)
CN (1) CN1843066A (enExample)
TW (1) TWI360721B (enExample)
WO (1) WO2005022968A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102762026A (zh) * 2011-04-27 2012-10-31 瑞化股份有限公司 透明导电线路的构造及制造方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060066803A1 (en) * 2004-09-30 2006-03-30 Aylward Peter T Substrate free flexible liquid crystal displays
US7781047B2 (en) * 2004-10-21 2010-08-24 Eastman Kodak Company Polymeric conductor donor and transfer method
JP4738860B2 (ja) * 2005-03-25 2011-08-03 株式会社リコー エレクトロクロミック表示素子
US20070090758A1 (en) * 2005-10-21 2007-04-26 Kwasny David M Electroluminescent panel
US8062824B2 (en) * 2006-07-17 2011-11-22 E. I. Du Pont De Nemours And Company Thermally imageable dielectric layers, thermal transfer donors and receivers
US8137767B2 (en) 2006-11-22 2012-03-20 Fujifilm Corporation Antireflective film, polarizing plate and image display device
US20100159648A1 (en) * 2008-12-22 2010-06-24 Tombs Thomas N Electrophotograph printed electronic circuit boards
US20100155128A1 (en) * 2008-12-22 2010-06-24 Tombs Thomas N Printed electronic circuit boards and other articles having patterned coonductive images
US8512933B2 (en) 2008-12-22 2013-08-20 Eastman Kodak Company Method of producing electronic circuit boards using electrophotography
AT513830B1 (de) * 2013-08-14 2014-08-15 Universität Linz Verfahren zum Aufbringen einer organischen Halbleiterschicht auf der Basis von Epindolidion auf einen Träger
US10852680B2 (en) * 2015-07-31 2020-12-01 Hp Indigo B.V. Print substrate surface modification
TW201730292A (zh) * 2015-11-20 2017-09-01 Toagosei Co Ltd 導電性高分子用隱形蝕刻墨水及導電性高分子之圖案化方法
TWI686563B (zh) * 2018-04-11 2020-03-01 台灣愛司帝科技股份有限公司 微型發光二極體顯示器及其製作方法
CN114729076B (zh) 2019-11-26 2024-09-20 默克专利股份有限公司 非硫醇类基于氮的疏水性聚合物刷材料及其用于基板表面修饰的用途

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4052209A (en) * 1975-03-07 1977-10-04 Minnesota Mining And Manufacturing Company Semiconductive and sensitized photoconductive compositions
DE59010247D1 (de) 1990-02-08 1996-05-02 Bayer Ag Neue Polythiophen-Dispersionen, ihre Herstellung und ihre Verwendung
DE69319200T2 (de) * 1992-10-14 1999-01-28 Agfa-Gevaert N.V., Mortsel Antistatische Beschichtungszusammensetzung
ATE228545T1 (de) 1994-05-06 2002-12-15 Bayer Ag Leitfähige beschichtungen
DE69633523T2 (de) 1995-11-22 2006-02-16 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Naval Research Laboratory Leitende gemusterte polymeroberfläche, verfahren zu ihrer herstellung und diese enthaltende anordnungen
JPH10217623A (ja) * 1997-01-31 1998-08-18 Dainippon Printing Co Ltd 熱転写受像シート
EP1079397A1 (en) 1999-08-23 2001-02-28 Agfa-Gevaert N.V. Method of making an electroconductive pattern on a support
US6623903B2 (en) * 2001-06-22 2003-09-23 Agfa-Gevaert Material and method for making an electroconductive pattern
EP1326260A1 (en) * 2001-12-11 2003-07-09 Agfa-Gevaert Material for making a conductive pattern
US6800429B2 (en) 2001-12-26 2004-10-05 Eastman Kodak Company Imaging materials with conductive layers containing electronically conductive polymer particles

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102762026A (zh) * 2011-04-27 2012-10-31 瑞化股份有限公司 透明导电线路的构造及制造方法
CN102762026B (zh) * 2011-04-27 2015-03-18 瑞化股份有限公司 透明导电线路的构造及制造方法

Also Published As

Publication number Publication date
US6872500B2 (en) 2005-03-29
WO2005022968A1 (en) 2005-03-10
JP4970940B2 (ja) 2012-07-11
TWI360721B (en) 2012-03-21
US20050048406A1 (en) 2005-03-03
TW200508797A (en) 2005-03-01
JP2007503697A (ja) 2007-02-22

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication