JP2007502917A5 - - Google Patents
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- Publication number
- JP2007502917A5 JP2007502917A5 JP2006524007A JP2006524007A JP2007502917A5 JP 2007502917 A5 JP2007502917 A5 JP 2007502917A5 JP 2006524007 A JP2006524007 A JP 2006524007A JP 2006524007 A JP2006524007 A JP 2006524007A JP 2007502917 A5 JP2007502917 A5 JP 2007502917A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- tera
- layer
- depositing
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 6
- 238000000151 deposition Methods 0.000 claims 4
- 210000002381 Plasma Anatomy 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims 1
Claims (2)
- 基板に材料を堆積させる方法であって、
前記基板を、プラズマソースを有するチャンバ内で、RF電源に結合された基板ホルダに配置することと、
調整可能なエッチング耐性ARC(TERA)層を前記基板にPECVDを使用して堆積させることとを具備し、
前記TERA層の少なくとも一部分の堆積速度が、RF電力が基板ホルダに印加されないときより速くなるように、前記RF電源によって提供されるRF電力が選ばれる方法。 - 基板への前記調整可能なエッチング耐性ARC(TERA)層の堆積は、TERA層として少なくとも2つの層で堆積させることを含んでいる請求項1に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/644,958 | 2003-08-21 | ||
US10/644,958 US7371436B2 (en) | 2003-08-21 | 2003-08-21 | Method and apparatus for depositing materials with tunable optical properties and etching characteristics |
PCT/US2004/026803 WO2005021832A2 (en) | 2003-08-21 | 2004-08-18 | Method and appartus for depositing materials with tunable properties |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007502917A JP2007502917A (ja) | 2007-02-15 |
JP2007502917A5 true JP2007502917A5 (ja) | 2007-10-11 |
JP4903567B2 JP4903567B2 (ja) | 2012-03-28 |
Family
ID=34194197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006524007A Expired - Fee Related JP4903567B2 (ja) | 2003-08-21 | 2004-08-18 | 調整可能な光学的性質およびエッチング特性を有する材料を堆積させる方法と装置。 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7371436B2 (ja) |
JP (1) | JP4903567B2 (ja) |
KR (1) | KR101029286B1 (ja) |
CN (1) | CN100540733C (ja) |
DE (1) | DE112004001026T5 (ja) |
TW (1) | TWI248637B (ja) |
WO (1) | WO2005021832A2 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030000924A1 (en) * | 2001-06-29 | 2003-01-02 | Tokyo Electron Limited | Apparatus and method of gas injection sequencing |
US7077903B2 (en) * | 2003-11-10 | 2006-07-18 | International Business Machines Corporation | Etch selectivity enhancement for tunable etch resistant anti-reflective layer |
US20050221020A1 (en) * | 2004-03-30 | 2005-10-06 | Tokyo Electron Limited | Method of improving the wafer to wafer uniformity and defectivity of a deposited dielectric film |
US7497959B2 (en) | 2004-05-11 | 2009-03-03 | International Business Machines Corporation | Methods and structures for protecting one area while processing another area on a chip |
JP5015534B2 (ja) * | 2006-09-22 | 2012-08-29 | 財団法人高知県産業振興センター | 絶縁膜の成膜方法 |
US20080197015A1 (en) * | 2007-02-16 | 2008-08-21 | Terry Bluck | Multiple-magnetron sputtering source with plasma confinement |
US20110151142A1 (en) * | 2009-12-22 | 2011-06-23 | Applied Materials, Inc. | Pecvd multi-step processing with continuous plasma |
US8741394B2 (en) | 2010-03-25 | 2014-06-03 | Novellus Systems, Inc. | In-situ deposition of film stacks |
JP2014082354A (ja) * | 2012-10-17 | 2014-05-08 | Hitachi High-Technologies Corp | プラズマ処理装置 |
US10170278B2 (en) * | 2013-01-11 | 2019-01-01 | Applied Materials, Inc. | Inductively coupled plasma source |
US9275869B2 (en) * | 2013-08-02 | 2016-03-01 | Lam Research Corporation | Fast-gas switching for etching |
US9899210B2 (en) * | 2015-10-20 | 2018-02-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical vapor deposition apparatus and method for manufacturing semiconductor device using the same |
CN110945159B (zh) * | 2017-07-28 | 2022-03-01 | 东京毅力科创株式会社 | 用于基板的后侧沉积的系统和方法 |
CN110106504B (zh) * | 2019-04-04 | 2021-03-23 | Tcl华星光电技术有限公司 | 一种蚀刻设备 |
DE102019129789A1 (de) | 2019-11-05 | 2021-05-06 | Aixtron Se | Verfahren zum Abscheiden einer zweidimensionalen Schicht sowie CVD-Reaktor |
US20210381107A1 (en) * | 2020-06-03 | 2021-12-09 | Micron Technology, Inc. | Material deposition systems, and related methods and microelectronic devices |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5687328A (en) * | 1979-12-18 | 1981-07-15 | Matsushita Electronics Corp | Semiconductor treatment device |
US4960488A (en) * | 1986-12-19 | 1990-10-02 | Applied Materials, Inc. | Reactor chamber self-cleaning process |
JPH04348031A (ja) * | 1990-12-28 | 1992-12-03 | Mitsubishi Electric Corp | 化学気相成長装置 |
JP3276514B2 (ja) * | 1994-04-26 | 2002-04-22 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JPH09148322A (ja) | 1995-11-22 | 1997-06-06 | Sharp Corp | シリコン酸化膜の成膜方法及びプラズマcvd成膜装置 |
KR19990030660A (ko) * | 1997-10-02 | 1999-05-06 | 윤종용 | 전자빔을 이용한 반도체장치의 층간 절연막 형성방법 |
JP2000021860A (ja) * | 1998-07-03 | 2000-01-21 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP3818561B2 (ja) * | 1998-10-29 | 2006-09-06 | エルジー フィリップス エルシーディー カンパニー リミテッド | シリコン酸化膜の成膜方法および薄膜トランジスタの製造方法 |
EP1077480B1 (en) * | 1999-08-17 | 2008-11-12 | Applied Materials, Inc. | Method and apparatus to enhance properties of Si-O-C low K films |
US6461980B1 (en) * | 2000-01-28 | 2002-10-08 | Applied Materials, Inc. | Apparatus and process for controlling the temperature of a substrate in a plasma reactor chamber |
JP2001308016A (ja) * | 2000-04-24 | 2001-11-02 | Matsushita Electric Ind Co Ltd | 化学的気相成長装置および方法 |
JP2003179045A (ja) * | 2001-12-13 | 2003-06-27 | Tokyo Electron Ltd | プラズマ処理装置及びその制御方法 |
US6869542B2 (en) * | 2003-03-12 | 2005-03-22 | International Business Machines Corporation | Hard mask integrated etch process for patterning of silicon oxide and other dielectric materials |
-
2003
- 2003-08-21 US US10/644,958 patent/US7371436B2/en not_active Expired - Fee Related
-
2004
- 2004-08-18 DE DE112004001026T patent/DE112004001026T5/de not_active Withdrawn
- 2004-08-18 JP JP2006524007A patent/JP4903567B2/ja not_active Expired - Fee Related
- 2004-08-18 CN CNB2004800237721A patent/CN100540733C/zh not_active Expired - Fee Related
- 2004-08-18 WO PCT/US2004/026803 patent/WO2005021832A2/en active Application Filing
- 2004-08-18 KR KR1020067003476A patent/KR101029286B1/ko not_active IP Right Cessation
- 2004-08-20 TW TW093125118A patent/TWI248637B/zh not_active IP Right Cessation
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