JP2007501716A5 - - Google Patents

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Publication number
JP2007501716A5
JP2007501716A5 JP2006522555A JP2006522555A JP2007501716A5 JP 2007501716 A5 JP2007501716 A5 JP 2007501716A5 JP 2006522555 A JP2006522555 A JP 2006522555A JP 2006522555 A JP2006522555 A JP 2006522555A JP 2007501716 A5 JP2007501716 A5 JP 2007501716A5
Authority
JP
Japan
Prior art keywords
fixed abrasive
abrasive article
substrate
support assembly
force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006522555A
Other languages
English (en)
Japanese (ja)
Other versions
JP4634381B2 (ja
JP2007501716A (ja
Filing date
Publication date
Priority claimed from US10/636,792 external-priority patent/US7160178B2/en
Application filed filed Critical
Publication of JP2007501716A publication Critical patent/JP2007501716A/ja
Publication of JP2007501716A5 publication Critical patent/JP2007501716A5/ja
Application granted granted Critical
Publication of JP4634381B2 publication Critical patent/JP4634381B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2006522555A 2003-08-07 2004-06-24 三次元固定砥粒物品のインサイチュ活性化 Expired - Fee Related JP4634381B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/636,792 US7160178B2 (en) 2003-08-07 2003-08-07 In situ activation of a three-dimensional fixed abrasive article
PCT/US2004/020415 WO2005016596A1 (en) 2003-08-07 2004-06-24 In situ activation of a three-dimensional fixed abrasive article

Publications (3)

Publication Number Publication Date
JP2007501716A JP2007501716A (ja) 2007-02-01
JP2007501716A5 true JP2007501716A5 (https=) 2007-07-19
JP4634381B2 JP4634381B2 (ja) 2011-02-16

Family

ID=34116473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006522555A Expired - Fee Related JP4634381B2 (ja) 2003-08-07 2004-06-24 三次元固定砥粒物品のインサイチュ活性化

Country Status (10)

Country Link
US (1) US7160178B2 (https=)
EP (1) EP1651386B1 (https=)
JP (1) JP4634381B2 (https=)
KR (1) KR101161883B1 (https=)
CN (1) CN100519079C (https=)
AT (1) ATE390988T1 (https=)
DE (1) DE602004012864T2 (https=)
MY (1) MY137233A (https=)
TW (1) TWI327504B (https=)
WO (1) WO2005016596A1 (https=)

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US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
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US9221148B2 (en) 2009-04-30 2015-12-29 Rdc Holdings, Llc Method and apparatus for processing sliders for disk drives, and to various processing media for the same
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US20100330890A1 (en) 2009-06-30 2010-12-30 Zine-Eddine Boutaghou Polishing pad with array of fluidized gimballed abrasive members
CN103221180A (zh) 2010-09-21 2013-07-24 铼钻科技股份有限公司 具有基本平坦颗粒尖端的超研磨工具及其相关方法
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US9067298B2 (en) * 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with grooved foundation layer and polishing surface layer
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US9597769B2 (en) 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US20190337119A1 (en) * 2016-12-21 2019-11-07 3M Innovative Properties Company Pad conditioner with spacer and wafer planarization system
WO2019012389A1 (en) 2017-07-11 2019-01-17 3M Innovative Properties Company ABRASIVE ARTICLES COMPRISING ADAPTABLE COATINGS AND POLISHING SYSTEM MANUFACTURED THEREFROM
JP7165719B2 (ja) 2017-08-04 2022-11-04 スリーエム イノベイティブ プロパティズ カンパニー 平坦性が向上された微細複製研磨表面
US12048980B2 (en) 2017-08-25 2024-07-30 3M Innovative Properties Company Surface projection polishing pad
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