JP2007501517A - 動的測定サンプリング方法及びそれを行うシステム - Google Patents

動的測定サンプリング方法及びそれを行うシステム Download PDF

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Publication number
JP2007501517A
JP2007501517A JP2006522546A JP2006522546A JP2007501517A JP 2007501517 A JP2007501517 A JP 2007501517A JP 2006522546 A JP2006522546 A JP 2006522546A JP 2006522546 A JP2006522546 A JP 2006522546A JP 2007501517 A JP2007501517 A JP 2007501517A
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Japan
Prior art keywords
sampling
measurement
rule
rules
value
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JP2006522546A
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Japanese (ja)
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JP2007501517A5 (https=
Inventor
エイ． パーディ マシュー
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Advanced Micro Devices Inc
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Advanced Micro Devices Inc
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Publication of JP2007501517A publication Critical patent/JP2007501517A/ja
Publication of JP2007501517A5 publication Critical patent/JP2007501517A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Factory Administration (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Complex Calculations (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
JP2006522546A 2003-08-04 2004-06-04 動的測定サンプリング方法及びそれを行うシステム Pending JP2007501517A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/634,013 US6988045B2 (en) 2003-08-04 2003-08-04 Dynamic metrology sampling methods, and system for performing same
PCT/US2004/017619 WO2005017981A2 (en) 2003-08-04 2004-06-04 Dynamic metrology sampling methods

Publications (2)

Publication Number Publication Date
JP2007501517A true JP2007501517A (ja) 2007-01-25
JP2007501517A5 JP2007501517A5 (https=) 2009-05-21

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ID=34115962

Family Applications (1)

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JP2006522546A Pending JP2007501517A (ja) 2003-08-04 2004-06-04 動的測定サンプリング方法及びそれを行うシステム

Country Status (7)

Country Link
US (1) US6988045B2 (https=)
EP (1) EP1654756A2 (https=)
JP (1) JP2007501517A (https=)
KR (1) KR101069932B1 (https=)
CN (1) CN100373572C (https=)
TW (1) TWI352915B (https=)
WO (1) WO2005017981A2 (https=)

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US7236848B2 (en) * 2005-09-12 2007-06-26 Advanced Micro Devices, Inc. Data representation relating to a non-sampled workpiece
US7460968B1 (en) 2005-09-30 2008-12-02 Advanced Micro Devices, Inc. Method and apparatus for selecting wafers for sampling
US8041103B2 (en) * 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7570796B2 (en) * 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
DE102006051495B4 (de) * 2006-10-31 2017-11-02 Globalfoundries Inc. Verfahren und System zur zufälligen Verteilung von Scheiben in einer komplexen Prozesslinie
US7565254B2 (en) * 2006-12-13 2009-07-21 Advanced Micro Devices, Inc. Method and apparatus for metrology sampling using combination sampling rules
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US8194968B2 (en) * 2007-01-05 2012-06-05 Kla-Tencor Corp. Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
US7738093B2 (en) * 2007-05-07 2010-06-15 Kla-Tencor Corp. Methods for detecting and classifying defects on a reticle
US7962863B2 (en) * 2007-05-07 2011-06-14 Kla-Tencor Corp. Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer
US8213704B2 (en) * 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
US7907770B2 (en) * 2007-06-15 2011-03-15 United Microelectronics Corp. Method for inspecting photomask and real-time online method for inspecting photomask
US7796804B2 (en) * 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US7711514B2 (en) * 2007-08-10 2010-05-04 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan
CN101785009B (zh) * 2007-08-20 2012-10-10 恪纳腾公司 确定实际缺陷是潜在系统性缺陷还是潜在随机缺陷的计算机实现的方法
US7974802B2 (en) * 2008-03-07 2011-07-05 International Business Machines Corporation Photomask image inspection
US8139844B2 (en) * 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
KR101841897B1 (ko) 2008-07-28 2018-03-23 케이엘에이-텐코어 코오포레이션 웨이퍼 상의 메모리 디바이스 영역에서 검출된 결함들을 분류하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들
DE102009046751A1 (de) * 2008-12-31 2010-09-09 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Synchronisieren der Prozesskammerabschaltzeiten durch Steuern der Transportreihenfolge in eine Prozessanlage
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US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) * 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US8108060B2 (en) * 2009-05-13 2012-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for implementing a wafer acceptance test (“WAT”) advanced process control (“APC”) with novel sampling policy and architecture
CN102156907A (zh) * 2010-02-11 2011-08-17 中国科学院计算技术研究所 面向qa系统的质检方法
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
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US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US9652729B2 (en) * 2011-10-27 2017-05-16 International Business Machines Corporation Metrology management
NL2009853A (en) 2011-12-23 2013-06-26 Asml Netherlands Bv Methods and apparatus for measuring a property of a substrate.
US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
US9092846B2 (en) 2013-02-01 2015-07-28 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific and multi-channel information
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
US10133263B1 (en) 2014-08-18 2018-11-20 Kla-Tencor Corporation Process condition based dynamic defect inspection
CN105489520B (zh) * 2014-09-18 2018-06-26 中芯国际集成电路制造(上海)有限公司 一种基于小采样系统的晶圆量测采样方法
US10650508B2 (en) 2014-12-03 2020-05-12 Kla-Tencor Corporation Automatic defect classification without sampling and feature selection
US10754260B2 (en) 2015-06-18 2020-08-25 Kla-Tencor Corporation Method and system for process control with flexible sampling
WO2017053150A1 (en) * 2015-09-21 2017-03-30 Kla-Tencor Corporation Method and system for process control with flexible sampling
US10935962B2 (en) * 2015-11-30 2021-03-02 National Cheng Kung University System and method for identifying root causes of yield loss
CN110174865B (zh) * 2019-05-31 2020-07-03 北京宝兰德软件股份有限公司 一种控制目标信息采集率的方法及装置
CN112347197B (zh) * 2019-10-25 2025-01-14 北京京东拓先科技有限公司 用于输出信息的方法和装置
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012165367A1 (ja) * 2011-06-03 2012-12-06 シャープ株式会社 管理装置、管理方法、および管理プログラム

Also Published As

Publication number Publication date
EP1654756A2 (en) 2006-05-10
KR101069932B1 (ko) 2011-10-05
US6988045B2 (en) 2006-01-17
WO2005017981A3 (en) 2005-03-31
TW200516469A (en) 2005-05-16
US20050033467A1 (en) 2005-02-10
CN1830075A (zh) 2006-09-06
WO2005017981A2 (en) 2005-02-24
KR20060063929A (ko) 2006-06-12
TWI352915B (en) 2011-11-21
CN100373572C (zh) 2008-03-05

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