JP2007501517A5 - - Google Patents

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Publication number
JP2007501517A5
JP2007501517A5 JP2006522546A JP2006522546A JP2007501517A5 JP 2007501517 A5 JP2007501517 A5 JP 2007501517A5 JP 2006522546 A JP2006522546 A JP 2006522546A JP 2006522546 A JP2006522546 A JP 2006522546A JP 2007501517 A5 JP2007501517 A5 JP 2007501517A5
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JP
Japan
Prior art keywords
sampling
measurement
rules
weight value
instructing
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006522546A
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English (en)
Japanese (ja)
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JP2007501517A (ja
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Publication date
Priority claimed from US10/634,013 external-priority patent/US6988045B2/en
Application filed filed Critical
Publication of JP2007501517A publication Critical patent/JP2007501517A/ja
Publication of JP2007501517A5 publication Critical patent/JP2007501517A5/ja
Pending legal-status Critical Current

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JP2006522546A 2003-08-04 2004-06-04 動的測定サンプリング方法及びそれを行うシステム Pending JP2007501517A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/634,013 US6988045B2 (en) 2003-08-04 2003-08-04 Dynamic metrology sampling methods, and system for performing same
PCT/US2004/017619 WO2005017981A2 (en) 2003-08-04 2004-06-04 Dynamic metrology sampling methods

Publications (2)

Publication Number Publication Date
JP2007501517A JP2007501517A (ja) 2007-01-25
JP2007501517A5 true JP2007501517A5 (https=) 2009-05-21

Family

ID=34115962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006522546A Pending JP2007501517A (ja) 2003-08-04 2004-06-04 動的測定サンプリング方法及びそれを行うシステム

Country Status (7)

Country Link
US (1) US6988045B2 (https=)
EP (1) EP1654756A2 (https=)
JP (1) JP2007501517A (https=)
KR (1) KR101069932B1 (https=)
CN (1) CN100373572C (https=)
TW (1) TWI352915B (https=)
WO (1) WO2005017981A2 (https=)

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CN102156907A (zh) * 2010-02-11 2011-08-17 中国科学院计算技术研究所 面向qa系统的质检方法
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US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
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US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
US9092846B2 (en) 2013-02-01 2015-07-28 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific and multi-channel information
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
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CN105489520B (zh) * 2014-09-18 2018-06-26 中芯国际集成电路制造(上海)有限公司 一种基于小采样系统的晶圆量测采样方法
US10650508B2 (en) 2014-12-03 2020-05-12 Kla-Tencor Corporation Automatic defect classification without sampling and feature selection
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US10935962B2 (en) * 2015-11-30 2021-03-02 National Cheng Kung University System and method for identifying root causes of yield loss
CN110174865B (zh) * 2019-05-31 2020-07-03 北京宝兰德软件股份有限公司 一种控制目标信息采集率的方法及装置
CN112347197B (zh) * 2019-10-25 2025-01-14 北京京东拓先科技有限公司 用于输出信息的方法和装置
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