CN100373572C - 动态度量采样方法 - Google Patents

动态度量采样方法 Download PDF

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Publication number
CN100373572C
CN100373572C CNB2004800215807A CN200480021580A CN100373572C CN 100373572 C CN100373572 C CN 100373572C CN B2004800215807 A CNB2004800215807 A CN B2004800215807A CN 200480021580 A CN200480021580 A CN 200480021580A CN 100373572 C CN100373572 C CN 100373572C
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CN
China
Prior art keywords
sampling
rule
rules
metric
metrology
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Expired - Fee Related
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CNB2004800215807A
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English (en)
Chinese (zh)
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CN1830075A (zh
Inventor
M·A·珀迪
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GlobalFoundries Inc
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Advanced Micro Devices Inc
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Publication of CN1830075A publication Critical patent/CN1830075A/zh
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Factory Administration (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Complex Calculations (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
CNB2004800215807A 2003-08-04 2004-06-04 动态度量采样方法 Expired - Fee Related CN100373572C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/634,013 2003-08-04
US10/634,013 US6988045B2 (en) 2003-08-04 2003-08-04 Dynamic metrology sampling methods, and system for performing same

Publications (2)

Publication Number Publication Date
CN1830075A CN1830075A (zh) 2006-09-06
CN100373572C true CN100373572C (zh) 2008-03-05

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ID=34115962

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800215807A Expired - Fee Related CN100373572C (zh) 2003-08-04 2004-06-04 动态度量采样方法

Country Status (7)

Country Link
US (1) US6988045B2 (https=)
EP (1) EP1654756A2 (https=)
JP (1) JP2007501517A (https=)
KR (1) KR101069932B1 (https=)
CN (1) CN100373572C (https=)
TW (1) TWI352915B (https=)
WO (1) WO2005017981A2 (https=)

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DE102005032601A1 (de) * 2005-01-07 2006-07-20 Heidelberger Druckmaschinen Ag Druckmaschine
US7769225B2 (en) * 2005-08-02 2010-08-03 Kla-Tencor Technologies Corp. Methods and systems for detecting defects in a reticle design pattern
US7236848B2 (en) * 2005-09-12 2007-06-26 Advanced Micro Devices, Inc. Data representation relating to a non-sampled workpiece
US7460968B1 (en) 2005-09-30 2008-12-02 Advanced Micro Devices, Inc. Method and apparatus for selecting wafers for sampling
US8041103B2 (en) * 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7570796B2 (en) * 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
DE102006051495B4 (de) * 2006-10-31 2017-11-02 Globalfoundries Inc. Verfahren und System zur zufälligen Verteilung von Scheiben in einer komplexen Prozesslinie
US7565254B2 (en) * 2006-12-13 2009-07-21 Advanced Micro Devices, Inc. Method and apparatus for metrology sampling using combination sampling rules
WO2008077100A2 (en) 2006-12-19 2008-06-26 Kla-Tencor Corporation Systems and methods for creating inspection recipes
US8194968B2 (en) * 2007-01-05 2012-06-05 Kla-Tencor Corp. Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
US7738093B2 (en) * 2007-05-07 2010-06-15 Kla-Tencor Corp. Methods for detecting and classifying defects on a reticle
US7962863B2 (en) * 2007-05-07 2011-06-14 Kla-Tencor Corp. Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer
US8213704B2 (en) * 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
US7907770B2 (en) * 2007-06-15 2011-03-15 United Microelectronics Corp. Method for inspecting photomask and real-time online method for inspecting photomask
US7796804B2 (en) * 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US7711514B2 (en) * 2007-08-10 2010-05-04 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan
CN101785009B (zh) * 2007-08-20 2012-10-10 恪纳腾公司 确定实际缺陷是潜在系统性缺陷还是潜在随机缺陷的计算机实现的方法
US7974802B2 (en) * 2008-03-07 2011-07-05 International Business Machines Corporation Photomask image inspection
US8139844B2 (en) * 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
KR101841897B1 (ko) 2008-07-28 2018-03-23 케이엘에이-텐코어 코오포레이션 웨이퍼 상의 메모리 디바이스 영역에서 검출된 결함들을 분류하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들
DE102009046751A1 (de) * 2008-12-31 2010-09-09 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Synchronisieren der Prozesskammerabschaltzeiten durch Steuern der Transportreihenfolge in eine Prozessanlage
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) * 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US8108060B2 (en) * 2009-05-13 2012-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for implementing a wafer acceptance test (“WAT”) advanced process control (“APC”) with novel sampling policy and architecture
CN102156907A (zh) * 2010-02-11 2011-08-17 中国科学院计算技术研究所 面向qa系统的质检方法
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
WO2012165367A1 (ja) * 2011-06-03 2012-12-06 シャープ株式会社 管理装置、管理方法、および管理プログラム
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US9652729B2 (en) * 2011-10-27 2017-05-16 International Business Machines Corporation Metrology management
NL2009853A (en) 2011-12-23 2013-06-26 Asml Netherlands Bv Methods and apparatus for measuring a property of a substrate.
US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
US9092846B2 (en) 2013-02-01 2015-07-28 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific and multi-channel information
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
US10133263B1 (en) 2014-08-18 2018-11-20 Kla-Tencor Corporation Process condition based dynamic defect inspection
CN105489520B (zh) * 2014-09-18 2018-06-26 中芯国际集成电路制造(上海)有限公司 一种基于小采样系统的晶圆量测采样方法
US10650508B2 (en) 2014-12-03 2020-05-12 Kla-Tencor Corporation Automatic defect classification without sampling and feature selection
US10754260B2 (en) 2015-06-18 2020-08-25 Kla-Tencor Corporation Method and system for process control with flexible sampling
WO2017053150A1 (en) * 2015-09-21 2017-03-30 Kla-Tencor Corporation Method and system for process control with flexible sampling
US10935962B2 (en) * 2015-11-30 2021-03-02 National Cheng Kung University System and method for identifying root causes of yield loss
CN110174865B (zh) * 2019-05-31 2020-07-03 北京宝兰德软件股份有限公司 一种控制目标信息采集率的方法及装置
CN112347197B (zh) * 2019-10-25 2025-01-14 北京京东拓先科技有限公司 用于输出信息的方法和装置
US11551954B2 (en) 2019-11-21 2023-01-10 Nanya Technology Corporation Advanced process control system

Citations (3)

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WO2002023289A2 (en) * 2000-09-15 2002-03-21 Advanced Micro Devices, Inc. Adaptive sampling method for improved control in semiconductor manufacturing
US6442496B1 (en) * 2000-08-08 2002-08-27 Advanced Micro Devices, Inc. Method and apparatus for dynamic sampling of a production line
US6477432B1 (en) * 2000-01-11 2002-11-05 Taiwan Semiconductor Manufacturing Company Statistical in-process quality control sampling based on product stability through a systematic operation system and method

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JP2002076087A (ja) * 2000-08-31 2002-03-15 Mitsubishi Electric Corp 抜き取り検査管理システム

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
US6477432B1 (en) * 2000-01-11 2002-11-05 Taiwan Semiconductor Manufacturing Company Statistical in-process quality control sampling based on product stability through a systematic operation system and method
US6442496B1 (en) * 2000-08-08 2002-08-27 Advanced Micro Devices, Inc. Method and apparatus for dynamic sampling of a production line
WO2002023289A2 (en) * 2000-09-15 2002-03-21 Advanced Micro Devices, Inc. Adaptive sampling method for improved control in semiconductor manufacturing

Also Published As

Publication number Publication date
EP1654756A2 (en) 2006-05-10
KR101069932B1 (ko) 2011-10-05
US6988045B2 (en) 2006-01-17
WO2005017981A3 (en) 2005-03-31
TW200516469A (en) 2005-05-16
US20050033467A1 (en) 2005-02-10
CN1830075A (zh) 2006-09-06
WO2005017981A2 (en) 2005-02-24
KR20060063929A (ko) 2006-06-12
TWI352915B (en) 2011-11-21
JP2007501517A (ja) 2007-01-25

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SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
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ASS Succession or assignment of patent right

Owner name: GLOBALFOUNDRIES SEMICONDUCTORS CO., LTD

Free format text: FORMER OWNER: ADVANCED MICRO DEVICES CORPORATION

Effective date: 20100722

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

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Effective date of registration: 20100722

Address after: Grand Cayman, Cayman Islands

Patentee after: Globalfoundries Semiconductor Inc.

Address before: American California

Patentee before: Advanced Micro Devices Inc.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080305

Termination date: 20190604

CF01 Termination of patent right due to non-payment of annual fee