JP2007333745A - パターン形状評価方法、評価装置、及び半導体装置の製造方法 - Google Patents

パターン形状評価方法、評価装置、及び半導体装置の製造方法 Download PDF

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JP2007333745A
JP2007333745A JP2007196889A JP2007196889A JP2007333745A JP 2007333745 A JP2007333745 A JP 2007333745A JP 2007196889 A JP2007196889 A JP 2007196889A JP 2007196889 A JP2007196889 A JP 2007196889A JP 2007333745 A JP2007333745 A JP 2007333745A
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pattern
value
series data
roughness
calculating
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JP2007196889A
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JP2007333745A5 (enExample
Inventor
Atsuko Yamaguchi
敦子 山口
Hiroshi Fukuda
宏 福田
Hiroki Kawada
洋揮 川田
Tatsuya Maeda
達哉 前田
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
Hitachi High Tech Corp
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Priority to JP2007196889A priority Critical patent/JP2007333745A/ja
Publication of JP2007333745A publication Critical patent/JP2007333745A/ja
Publication of JP2007333745A5 publication Critical patent/JP2007333745A5/ja
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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2007196889A 2007-07-30 2007-07-30 パターン形状評価方法、評価装置、及び半導体装置の製造方法 Pending JP2007333745A (ja)

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JP2007196889A JP2007333745A (ja) 2007-07-30 2007-07-30 パターン形状評価方法、評価装置、及び半導体装置の製造方法

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JP2007196889A JP2007333745A (ja) 2007-07-30 2007-07-30 パターン形状評価方法、評価装置、及び半導体装置の製造方法

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JP2004222737A Division JP2006038779A (ja) 2004-07-30 2004-07-30 パターン形状評価方法、評価装置、及び半導体装置の製造方法

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JP2007333745A true JP2007333745A (ja) 2007-12-27
JP2007333745A5 JP2007333745A5 (enExample) 2009-01-08

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011007581A (ja) * 2009-06-25 2011-01-13 Hitachi High-Technologies Corp 寸法計測装置およびこれを用いた半導体装置の製造方法
JP2011163991A (ja) * 2010-02-12 2011-08-25 Hitachi High-Technologies Corp 寸法計測装置およびこれを用いた半導体装置の製造方法
JP2019502161A (ja) * 2015-12-18 2019-01-24 エーエスエムエル ネザーランズ ビー．ブイ． 光学システムおよび方法
CN115023584A (zh) * 2020-03-30 2022-09-06 株式会社日立高新技术 带电粒子束装置以及粗糙度指标计算方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62135710A (ja) * 1985-12-10 1987-06-18 Nec Corp 微細パタ−ンの検査方法
JPS62195512A (ja) * 1986-02-21 1987-08-28 Kobe Steel Ltd 表面粗さ測定方法
JPH06129849A (ja) * 1992-10-20 1994-05-13 Mitsutoyo Corp 表面粗さ測定装置
JPH07332920A (ja) * 1994-04-14 1995-12-22 Toyota Motor Corp ワーク表面の凹凸測定装置及び凹凸測定方法
JPH10253750A (ja) * 1997-03-13 1998-09-25 Mitsubishi Electric Corp Ｆｍ−ｃｗレーダ装置
JPH11257940A (ja) * 1998-03-16 1999-09-24 Toshiba Corp パターン評価方法及びパターン評価装置
JP2002243428A (ja) * 2001-02-13 2002-08-28 Hitachi Ltd パターン検査方法およびその装置
JP2004251743A (ja) * 2003-02-20 2004-09-09 Hitachi Ltd パターン検査方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62135710A (ja) * 1985-12-10 1987-06-18 Nec Corp 微細パタ−ンの検査方法
JPS62195512A (ja) * 1986-02-21 1987-08-28 Kobe Steel Ltd 表面粗さ測定方法
JPH06129849A (ja) * 1992-10-20 1994-05-13 Mitsutoyo Corp 表面粗さ測定装置
JPH07332920A (ja) * 1994-04-14 1995-12-22 Toyota Motor Corp ワーク表面の凹凸測定装置及び凹凸測定方法
JPH10253750A (ja) * 1997-03-13 1998-09-25 Mitsubishi Electric Corp Ｆｍ−ｃｗレーダ装置
JPH11257940A (ja) * 1998-03-16 1999-09-24 Toshiba Corp パターン評価方法及びパターン評価装置
JP2002243428A (ja) * 2001-02-13 2002-08-28 Hitachi Ltd パターン検査方法およびその装置
JP2004251743A (ja) * 2003-02-20 2004-09-09 Hitachi Ltd パターン検査方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011007581A (ja) * 2009-06-25 2011-01-13 Hitachi High-Technologies Corp 寸法計測装置およびこれを用いた半導体装置の製造方法
JP2011163991A (ja) * 2010-02-12 2011-08-25 Hitachi High-Technologies Corp 寸法計測装置およびこれを用いた半導体装置の製造方法
JP2019502161A (ja) * 2015-12-18 2019-01-24 エーエスエムエル ネザーランズ ビー．ブイ． 光学システムおよび方法
US10444637B2 (en) 2015-12-18 2019-10-15 Asml Netherlands B.V. Optical system and method
US10845712B2 (en) 2015-12-18 2020-11-24 Asml Netherlands B.V. Optical system and method
CN115023584A (zh) * 2020-03-30 2022-09-06 株式会社日立高新技术 带电粒子束装置以及粗糙度指标计算方法

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