JP2007330961A - 平板パネル洗浄装置及びそれに使用されるロールブラシ - Google Patents
平板パネル洗浄装置及びそれに使用されるロールブラシ Download PDFInfo
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- JP2007330961A JP2007330961A JP2007045153A JP2007045153A JP2007330961A JP 2007330961 A JP2007330961 A JP 2007330961A JP 2007045153 A JP2007045153 A JP 2007045153A JP 2007045153 A JP2007045153 A JP 2007045153A JP 2007330961 A JP2007330961 A JP 2007330961A
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- Prior art keywords
- liquid
- flat panel
- hollow cylindrical
- roll brush
- rotating shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims abstract description 61
- 239000007788 liquid Substances 0.000 claims abstract description 68
- 230000002940 repellent Effects 0.000 claims description 12
- 239000005871 repellent Substances 0.000 claims description 12
- 235000012907 honey Nutrition 0.000 claims description 5
- 230000007717 exclusion Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 15
- 239000003595 mist Substances 0.000 abstract description 12
- 230000008569 process Effects 0.000 abstract description 12
- 238000011109 contamination Methods 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 2
- 230000007797 corrosion Effects 0.000 abstract description 2
- 230000000903 blocking effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
- Brushes (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
【解決手段】本発明の一実施形態による平板パネル洗浄装置は、内壁210、内壁210と締結され内部に空間を有する中空円筒形締結部215a及び中空円筒形締結部215aの空間を通過する回転軸230a、回転軸230aと一体型であり、締結部の外径よりさらに大きい内径を有する中空円筒形液除け220a及びロールブラシ250aを含む。
【選択図】図2
Description
210 内壁
215 締結部
216 平板部
217 中空円筒部
220 液除け
240 ブラシ
250 ロールブラシ
255a ファン
255b ファン
260 駆動部
270 ベアリング
M モータ
B 駆動ベルト
Claims (15)
- 内壁、前記内壁と締結され、内部に空間を有する中空円筒形締結部と、
前記中空円筒形締結部の空間を通過する回転軸、前記回転軸と一体でなされ、前記締結部の外径よりさらに大きい内径を有する中空円筒形液除け、および
ブラシを備えたロールブラシを含む平板パネル洗浄装置。 - 前記内壁は、前記回転軸が通過するための貫通口をさらに含む請求項1に記載の平板パネル洗浄装置。
- 前記回転軸の一端に駆動部がさらに含まれる請求項1に記載の平板パネル洗浄装置。
- 前記液除けは前記ロールブラシの外端部に位置する請求項1に記載の平板パネル洗浄装置。
- 前記液除けの外部にファンをさらに含む請求項1に記載の平板パネル洗浄装置。
- 前記ファンは複数のハネを含み、前記ファンは前記液除けに着脱し得る請求項5に記載の平板パネル洗浄装置。
- 前記ロールブラシは対を成して上下に位置し、
前記ロールブラシの対のうち、第1ロールブラシの本体部から液除けの水平方向終端部までの距離が、第2ロールブラシの本体部から液除けの水平方向開始部の距離より短い請求項1に記載の平板パネル洗浄装置。 - 円柱形態の第1回転軸と、
前記第1回転軸が通過する空間を有する第1中空円筒形締結部と、
第1回転軸の第1の位置に位置し、前記第1回転軸と一体化され、
前記第1中空円筒形締結部の外径よりさらに大きい内径を有する第1中空円筒形液除けと、
本体部に位置する第1ブラシを含む第1ロールブラシと、
円柱形態の第2回転軸と、
前記第2回転軸が通過する空間を有する第2中空円筒形締結部と、
第2回転軸の第2位置に位置し、前記第2回転軸と一体化され、前記第2中空円筒形締結部の外径よりさらに大きい内径を有する第2中空円筒形液除けと、
本体部に位置する第2ブラシを含む第2ロールブラシを含む平板パネル洗浄装置。 - 前記第1ロールブラシの本体部から第1液除けの終端部までの距離が前記第2ロールブラシの本体部より第2液除けの開始端部までの距離より短い請求項8に記載の平板パネル洗浄装置。
- 前記液除けの外部にファンをさらに含む請求項8に記載の平板パネル洗浄装置。
- 前記ファンは複数のハネを含み、前記ファンは前記液除けに脱着し得る請求項10に記載の平板パネル洗浄装置。
- 円柱形態の回転軸と、
前記回転軸が通過する空間を有する中空円筒形締結部と、
外端部に位置し、前記回転軸と一体化され、前記締結部の外径よりさらに大きい内径を有する中空円筒形液除け、および
本体部に位置するブラシを含むロールブラシ。 - 前記締結部の外径と前記液除けの内径の間隔は前記ロールブラシの上下移動距離である請求項12に記載のロールブラシ。
- 前記液除けの外部にファンをさらに含む請求項12に記載のロールブラシ。
- 前記ファンは複数のハネを含み、前記ファンは前記液除けに脱着し得る請求項14に記載のロールブラシ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2006-0052501 | 2006-06-12 | ||
KR1020060052501A KR100717373B1 (ko) | 2006-06-12 | 2006-06-12 | 평판 패널 세정 장치 및 그에 사용되는 롤 브러시 |
Publications (2)
Publication Number | Publication Date |
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JP2007330961A true JP2007330961A (ja) | 2007-12-27 |
JP4722869B2 JP4722869B2 (ja) | 2011-07-13 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007045153A Active JP4722869B2 (ja) | 2006-06-12 | 2007-02-26 | 平板パネル洗浄装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7962989B2 (ja) |
JP (1) | JP4722869B2 (ja) |
KR (1) | KR100717373B1 (ja) |
CN (1) | CN100594995C (ja) |
TW (1) | TWI331736B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100851393B1 (ko) | 2007-02-12 | 2008-08-08 | 세메스 주식회사 | 롤 브러쉬 유닛 및 이를 포함하는 기판 세정 장치 |
KR100763807B1 (ko) | 2007-06-28 | 2007-10-05 | (주)다사로봇 | 기판세척롤러 |
KR100900707B1 (ko) * | 2007-08-31 | 2009-06-05 | 세메스 주식회사 | 기판 처리 장치 |
KR100924932B1 (ko) | 2007-12-27 | 2009-11-05 | 세메스 주식회사 | 기판 처리 장치 |
KR100944882B1 (ko) * | 2008-05-29 | 2010-03-03 | 엠.씨.케이 (주) | 플랩형 롤러 및 그 제조방법 |
CN106076923B (zh) * | 2016-06-13 | 2018-11-27 | 广东溢达纺织有限公司 | 钢筘自动清洗方法 |
CN109772767A (zh) * | 2018-12-27 | 2019-05-21 | 中国电子科技集团公司第二研究所 | 带有自清洁刷的晶圆片刷洗方法 |
CN110614239A (zh) * | 2019-09-17 | 2019-12-27 | 苏州晶洲装备科技有限公司 | 一种可调式毛刷清洁机构及具有其的oled基板清洗机 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10335279A (ja) * | 1997-05-30 | 1998-12-18 | Shibaura Eng Works Co Ltd | 洗浄装置 |
JP2002327764A (ja) * | 2001-05-01 | 2002-11-15 | Hitachi Electronics Eng Co Ltd | ベアリング防水機構およびディスク洗浄装置 |
JP2005052834A (ja) * | 2003-08-07 | 2005-03-03 | Dms:Kk | 平板状ディスプレイ用洗浄装置 |
JP2006073938A (ja) * | 2004-09-06 | 2006-03-16 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2006245125A (ja) * | 2005-03-01 | 2006-09-14 | Shibaura Mechatronics Corp | 基板の処理装置及び処理方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US4947029A (en) * | 1985-11-01 | 1990-08-07 | Canon Kabushiki Kaisha | Cleaning device for information recording medium |
US6851151B1 (en) * | 2001-06-29 | 2005-02-08 | Lam Research Corporation | Brush drive assembly in a substrate processing brush box |
KR20030078434A (ko) * | 2002-03-29 | 2003-10-08 | (주)케이.씨.텍 | 기판 세정용 브러시 조립체 |
JP2005056230A (ja) | 2003-08-06 | 2005-03-03 | Matsushita Electric Ind Co Ltd | 情報処理装置、データ出力方法およびプログラム |
JP4523498B2 (ja) | 2005-06-27 | 2010-08-11 | 東京エレクトロン株式会社 | 現像処理装置及び現像処理方法 |
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2006
- 2006-06-12 KR KR1020060052501A patent/KR100717373B1/ko active IP Right Grant
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- 2007-02-26 JP JP2007045153A patent/JP4722869B2/ja active Active
- 2007-04-25 CN CN200710098261A patent/CN100594995C/zh active Active
- 2007-06-07 US US11/810,754 patent/US7962989B2/en active Active
- 2007-06-11 TW TW096121058A patent/TWI331736B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10335279A (ja) * | 1997-05-30 | 1998-12-18 | Shibaura Eng Works Co Ltd | 洗浄装置 |
JP2002327764A (ja) * | 2001-05-01 | 2002-11-15 | Hitachi Electronics Eng Co Ltd | ベアリング防水機構およびディスク洗浄装置 |
JP2005052834A (ja) * | 2003-08-07 | 2005-03-03 | Dms:Kk | 平板状ディスプレイ用洗浄装置 |
JP2006073938A (ja) * | 2004-09-06 | 2006-03-16 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2006245125A (ja) * | 2005-03-01 | 2006-09-14 | Shibaura Mechatronics Corp | 基板の処理装置及び処理方法 |
Also Published As
Publication number | Publication date |
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JP4722869B2 (ja) | 2011-07-13 |
TWI331736B (en) | 2010-10-11 |
CN101088636A (zh) | 2007-12-19 |
US20070283513A1 (en) | 2007-12-13 |
TW200746003A (en) | 2007-12-16 |
CN100594995C (zh) | 2010-03-24 |
KR100717373B1 (ko) | 2007-05-11 |
US7962989B2 (en) | 2011-06-21 |
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