JP2007329812A - Solid-state imaging apparatus and assembling tool, manufacturing method of solid-state imaging apparatus, and assembling method of electronic component - Google Patents

Solid-state imaging apparatus and assembling tool, manufacturing method of solid-state imaging apparatus, and assembling method of electronic component Download PDF

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JP2007329812A
JP2007329812A JP2006160806A JP2006160806A JP2007329812A JP 2007329812 A JP2007329812 A JP 2007329812A JP 2006160806 A JP2006160806 A JP 2006160806A JP 2006160806 A JP2006160806 A JP 2006160806A JP 2007329812 A JP2007329812 A JP 2007329812A
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solid
package
state imaging
imaging device
image sensor
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Hitoshi Shibuya
仁 渋谷
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Sony Corp
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Sony Corp
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technology of easily and stably establishing the connection of electrode pads by solving the problem of difficulty in the position recognition of the electrode pads caused by changes in height positions of the electrode pads when a solid-state imaging device is bent and fitted to a package. <P>SOLUTION: In the manufacturing method of a solid-state imaging apparatus in which the solid-state imaging device 2 is bent and arranged to the bent solid-state imaging device fitting face 3a of the package 3, and a plurality of solid-state imaging device side electrode pads 5 provided at the solid-state imaging device 2 and package side electrodes 7 formed on the package side electrode pad fitting face 6 of the package 3 are bonded by conductor wires 8 with a bonding unit 71, an angle of the package 3 is adjusted so that the solid-state imaging device side electrode pads 5 and the package side electrodes 7 are brought nearly perpendicularly to a capillary 75 of the bonding unit 71 at a position nearly beneath the capillary 75 to bond the solid-state imaging device side electrode pads 5 and the package side electrodes 7 with each other. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、固体撮像装置と、該固体撮像装置のパッケージに固体撮像素子を組付けるのに使用する組付け治具（コレット）及び前記固体撮像装置の製造方法並びに電子部品を部品ホルダに組付ける電子部品の組付け方法に関するものである。   The present invention relates to a solid-state imaging device, an assembly jig (collet) used for assembling a solid-state imaging device to a package of the solid-state imaging device, a manufacturing method of the solid-state imaging device, and an electronic component to a component holder. The present invention relates to a method for assembling electronic components.

一般に固体撮像装置に用いられる固体撮像素子は、幾つもの半導体製造工程を経た半導体ウエハからダイシング法などによりチップ状、即ち個片に切断して分離される。このようにして得られた固体撮像素子は、平板状に形成されると共に、厚さが３００μｍ程度であって、リジットな形状特性（堅くて変形しない特性）を有している。また、固体撮像素子の主面に形成される複数の受光部（撮像画素部）は、この主面に沿って平面状態を有する形で配置されている。   In general, a solid-state imaging device used in a solid-state imaging device is separated from a semiconductor wafer that has undergone several semiconductor manufacturing processes by cutting into chips, that is, individual pieces by a dicing method or the like. The solid-state imaging device thus obtained is formed in a flat plate shape, has a thickness of about 300 μm, and has a rigid shape characteristic (a characteristic that is rigid and does not deform). In addition, a plurality of light receiving portions (imaging pixel portions) formed on the main surface of the solid-state image sensor are arranged in a form having a planar state along the main surface.

一方、固体撮像素子（撮像面）上で被写体を結像させるには、結像光学系が必要となる。結像光学系には結像レンズが組み込まれ、この結像レンズによって固体撮像素子上に被写体が結像される。   On the other hand, an imaging optical system is required to image a subject on a solid-state imaging device (imaging surface). An imaging lens is incorporated in the imaging optical system, and a subject is imaged on the solid-state imaging device by the imaging lens.

一般に、結像レンズで被写体を結像させた場合、像面湾曲と呼ばれるレンズ収差現象によって、撮像面の中心部と周縁部において焦点位置のズレが発生する。   In general, when an object is imaged by an imaging lens, a focal position shift occurs at the center portion and the peripheral portion of the imaging surface due to a lens aberration phenomenon called curvature of field.

そこで、固体撮像素子を湾曲させた形状で固定することによって、結像光学系で発生するレンズ収差を補正する方法が提案されている。（例えば、特許文献１、特許文献２参照）。   Therefore, a method has been proposed in which the lens aberration generated in the imaging optical system is corrected by fixing the solid-state imaging device in a curved shape. (For example, refer to Patent Document 1 and Patent Document 2).

図４０、図４１は従来の固体撮像装置１０１の一例を示す。この固体撮像装置１０１は、所要の円筒面状の底面１０２を有するパッケージ１０３を有し、該パッケージ１０３の底面１０２に沿うように撮像面１０４が上向きとなる湾曲形状に固体撮像素子１０５を配置し、パッケージ１０３の上部に透明ガラスカバー１０６を配置して構成される。固体撮像素子１０５は、平面から見て長方形をなし、長辺側が湾曲され、固体撮像素子１０５の湾曲した長辺側及び短辺側に沿って、例えば複数のＡＬ（アルミニューム）の電極パッド１０７…１０７が配列されている。これらの電極パッド１０７…１０７に対応して、パッケージ１０３側にも電極パッド１０８…１０８が配列されている。そして、互いに対応する固体撮像素子１０５側の電極パッド１０７…１０７とパッケージ１０３側の電極パッド１０８…１０８がＡｕ細線１０９によりワイヤーボンディングされて接続される。なお、図４１に示すように、パッケージ１０３の底面には孔１１０が設けられていて該孔１１０にバキューム装置１１１を接続することにより、固体撮像素子１０５をパッケージ１０３の底面１０２側に吸引し、或いは固体撮像素子１０５の上面側に圧縮空気を吹き付けて湾曲させるようになっている。図４１において、Ｈは、固体撮像素子１０５側の電極パッド１０７…１０７とパッケージ１０３側の電極パッド１０８…１０８の間の段差で、該段差Ｈは、湾曲部の先端側で増大する。なお、図示は省略したがパッケージ１０３の外側に前記電極パッド１０８…１０８と電気的に接続された外部リードが導出される。
特開２００１−１５６２７８号公報 特開２００１−２８４５６４号公報 40 and 41 show an example of a conventional solid-state imaging device 101. FIG. The solid-state imaging device 101 includes a package 103 having a required cylindrical surface bottom 102, and the solid-state imaging device 105 is arranged in a curved shape with the imaging surface 104 facing upward along the bottom 102 of the package 103. The transparent glass cover 106 is disposed on the top of the package 103. The solid-state image sensor 105 has a rectangular shape when viewed from the top, has a long side curved, and, for example, a plurality of AL (aluminum) electrode pads 107 along the curved long side and short side of the solid-state image sensor 105. ... 107 are arranged. Corresponding to these electrode pads 107 ... 107, electrode pads 108 ... 108 are also arranged on the package 103 side. The corresponding electrode pads 107... 107 on the solid-state imaging device 105 side and the electrode pads 108... 108 on the package 103 side are connected by wire bonding with Au thin wires 109. As shown in FIG. 41, a hole 110 is provided on the bottom surface of the package 103. By connecting a vacuum device 111 to the hole 110, the solid-state imaging device 105 is sucked toward the bottom surface 102 of the package 103. Alternatively, compressed air is blown onto the upper surface side of the solid-state image sensor 105 to bend. 41, H is a step between the electrode pads 107... 107 on the solid-state imaging device 105 side and the electrode pads 108... 108 on the package 103 side, and the step H increases on the distal end side of the bending portion. Although not shown, external leads that are electrically connected to the electrode pads 108... 108 are led out of the package 103.
JP 2001-156278 A JP 2001-284564 A

ところで、前記円筒面状または球面形状に湾曲した固体撮像素子を固定した固体撮像装置には次のような問題点があった。   By the way, the solid-state imaging device in which the solid-state imaging element curved in the cylindrical or spherical shape has a problem as described below.

前記固体撮像素子１０５は、例えば、撮像素子を作成した半導体基板（Ｓｉ基板）の裏面を通常、ＢＧＲ（Ｂａｃｋ Ｇｒｉｎｄｅｒ）と呼ばれている機械的研磨法並びに化学的研磨法により、例えば３０μｍ程度の薄さに研磨することで可撓性を持たせて湾曲させる。この湾曲した撮像面をパッケージ面に固定するとき、撮像面に歪み（うねり）が発生し、パッケージ面と固体撮像素子裏面との間にも、前記歪み（うねり）による隙間が発生する。このため超音波圧着法によるワイヤーボンディング時に超音波が拡散されてしまい、ボンディング不着が発生する。また、前記隙間によって、ワイヤーボンディング時の超音波衝撃により電極パッドの剥がれや割れなどが生じる。超音波衝撃が大きい場合には、撮像素子の亀裂（割れ）に発展することもある。   For example, the solid-state image sensor 105 has a back surface of a semiconductor substrate (Si substrate) on which the image sensor is formed, which is usually about 30 μm by a mechanical polishing method and a chemical polishing method called BGR (Back Grinder). It is curved to give flexibility by polishing to a thin thickness. When this curved imaging surface is fixed to the package surface, distortion (swell) occurs on the imaging surface, and a gap due to the distortion (swell) also occurs between the package surface and the back surface of the solid-state imaging device. For this reason, ultrasonic waves are diffused during wire bonding by the ultrasonic pressure bonding method, and bonding failure occurs. Further, due to the gap, the electrode pad is peeled off or cracked by ultrasonic impact during wire bonding. When the ultrasonic impact is large, the image sensor may develop into a crack.

これに対して、通常の平板状の固体撮像素子の電極パッドへのＡｕ細線のワイヤーボンディングは、各電極パッドの高さが位置が一定しているので、略均一な接合強度（シェア強度）を有している。   On the other hand, the wire bonding of the Au thin wire to the electrode pad of a normal flat solid-state imaging device has a substantially uniform bonding strength (shear strength) because the height of each electrode pad is constant. Have.

しかし、湾曲した固体撮像素子の電極パッドのボンディングを、通常の（平板状の固体撮像素子用の）ワイヤーボンディング装置を用いて行った場合に、湾曲した固体撮像素子の長辺側の電極パッドの傾斜角が徐々に変化するのため、特に傾斜角が大きくなる外側の電極パッドとＡｕ細線間のシェア強度は許容値よりも低くなり、接続が不十分になる。また、各電極パッドの高さ位置が変化するので、電極パッドの位置認識が困難になり、安定したワイヤーボンディングを行い難い。また、パッケージ側電極パッドが傾斜或いは円筒面状になっている場合、パッケージ側のボンディングは、所謂ステッチボンドのため接続不能或いは接続が不十分になるという問題点があった。   However, when the bonding of the electrode pad of the curved solid-state imaging device is performed using a normal wire bonding apparatus (for a flat-plate solid-state imaging device), the electrode pad on the long side of the curved solid-state imaging device Since the inclination angle changes gradually, the shear strength between the outer electrode pad and the Au thin wire, in particular, where the inclination angle becomes large is lower than the allowable value, and the connection is insufficient. In addition, since the height position of each electrode pad changes, it is difficult to recognize the position of the electrode pad, and it is difficult to perform stable wire bonding. Further, when the package-side electrode pad is inclined or has a cylindrical surface shape, there is a problem that the bonding on the package side cannot be connected due to a so-called stitch bond or the connection becomes insufficient.

本発明の目的は、上記従来の問題点を解決し、撮像面を円筒面状に湾曲した固体撮像素子の電極パッドの電気的接続を安定した状態で行うことができるようにして、品質の安定化と、歩留まりの向上を図ることの可能な固体撮像装置を提供することにある。   The object of the present invention is to solve the above-mentioned conventional problems and to enable stable electrical connection of the electrode pads of the solid-state imaging device whose imaging surface is curved into a cylindrical surface, thereby stabilizing the quality. It is an object of the present invention to provide a solid-state imaging device capable of realizing the above-mentioned and improving the yield.

また、本発明の他の目的は、パッケージにバキューム装置やコンプレッサー等を接続することなく、平板状の固体撮像素子を湾曲させた状態でパッケージの円筒面状の固体撮像素子取付面に取付けることを可能にしたコレットを提供することにある。   Another object of the present invention is to attach the flat solid-state image sensor to the cylindrical solid-state image sensor mounting surface of the package in a curved state without connecting a vacuum device or a compressor to the package. It is to provide a collet made possible.

また、本発明の他の目的は、前記固体撮像装置において、パッケージの電極パッドと固体撮像素子の電極パッドをボンディング装置により簡単容易且つ確実に接続することのできる固体撮像装置の製造方法を提供することにある。   Another object of the present invention is to provide a method for manufacturing a solid-state imaging device, in which the electrode pad of the package and the electrode pad of the solid-state imaging device can be easily and reliably connected by a bonding device in the solid-state imaging device. There is.

また、本発明の他の目的は、前記固体撮像装置に限らず、広く薄板状の電子部品を部品ホルダの非平面形状の電子部品取付面上に取付けることのできる電子部品の取付け方法を提供することにある。   Another object of the present invention is not limited to the solid-state imaging device, and provides an electronic component mounting method capable of mounting a wide, thin plate-shaped electronic component on a non-planar electronic component mounting surface of a component holder. There is.

本発明の固体撮像装置は、湾曲可能な薄板状の固体撮像素子と、該固体撮像素子を非平面形状の固体撮像素子取付面上に該固体撮像素子取付面に沿って非平面形状に取付けたパッケージと、を備え、前記固体撮像素子に設けた複数の固体撮像素子側電極パッドを、前記パッケージの前記固体撮像素子取付面の外側に位置するパッケージ側電極パッド形成面に形成したパッケージ側電極パッドに、導体ワイヤで接続してなる固体撮像装置において、部品ホルダ側電極パッド形成を、前記電子部品取付面の端部を延長させることにより該電子部品取付面の端部と略平行な非平面形状に形成した。特に、前記非平面形状の固体撮像素子取付面を円筒面状に湾曲形成し、前記パッケージ側電極パッド形成面を前記固体撮像素子取付面に連続する円筒面状に湾曲形成した。また、前記固体撮像素子取付面を、円筒面状に湾曲形成し、前記パッケージ側電極パッド形成面のうち前記固体撮像素子の湾曲した辺の外側に位置する部分を、前記固体撮像素子取付面に取付けられた固体撮像素子の湾曲面の接線に平行となる複数の平面で構成した。前記円筒面状の固体撮像素子取付面のうち、固体撮像素子の撮像画素部に対応する部分を円筒面状に湾曲形成し、他の部分をフラット面に形成した。また、前記円筒面状の固体撮像素子取付面を、前記パッケージの内面に取付けられた台座に設けた。   The solid-state imaging device of the present invention has a thin plate-like solid-state imaging element that can be bent, and the solid-state imaging element is mounted on a non-planar solid-state imaging element mounting surface in a non-planar shape along the solid-state imaging element mounting surface. A package-side electrode pad formed on a package-side electrode pad forming surface located outside the solid-state image sensor mounting surface of the package, the plurality of solid-state image sensor side electrode pads provided on the solid-state image sensor In addition, in the solid-state imaging device connected by the conductor wire, the non-planar shape that is substantially parallel to the end portion of the electronic component mounting surface is formed by extending the end portion of the electronic component mounting surface. Formed. In particular, the non-planar shape solid-state image sensor mounting surface is curved and formed into a cylindrical surface, and the package-side electrode pad forming surface is curved and formed into a cylindrical surface continuous with the solid-state image sensor mounting surface. The solid-state image sensor mounting surface is curved in a cylindrical shape, and a portion of the package-side electrode pad forming surface located outside the curved side of the solid-state image sensor is formed on the solid-state image sensor mounting surface. A plurality of planes parallel to the tangent to the curved surface of the attached solid-state imaging device were used. Of the cylindrical surface-shaped solid-state image sensor mounting surface, a portion corresponding to the imaging pixel portion of the solid-state image sensor is formed in a curved shape in the cylindrical surface, and the other portion is formed in a flat surface. The cylindrical surface-shaped solid-state image sensor mounting surface is provided on a pedestal mounted on the inner surface of the package.

本発明の組付け治具（コレット）は、固体撮像素子を固体撮像素子吸着面に吸着してパッケージに設けた円筒面状の固体撮像素子取付面に組付けるための組付けるものであって、前記固体撮像素子吸着面を、前記パッケージの固体撮像素子取付面に倣う（前記パッケージの固体撮像素子取付面に嵌り合う）円筒面状に膨出形成した。また、前記固体撮像素子吸着面の中央部に前記固体撮像素子の撮像画素部を収容する画素部収納凹部と、該画素部収納凹部内に開口する真空吸引孔を設けるとともに、前記画素部収納凹部の外側部に前記平板状の固体撮像素子を吸着して前記固体撮像素子吸着面に沿わせて湾曲させた状態に維持する真空吸引孔を設けた。   The assembly jig (collet) of the present invention is an assembly for assembling a solid-state imaging device to a solid-state imaging device mounting surface having a cylindrical surface provided on a package by adsorbing the solid-state imaging device to a solid-state imaging device adsorption surface, The solid-state image sensor adsorption surface was formed to bulge in a cylindrical surface shape that fits the solid-state image sensor mounting surface of the package (it fits the solid-state image sensor mounting surface of the package). In addition, a pixel unit storage recess for storing the imaging pixel unit of the solid-state image sensor and a vacuum suction hole that opens in the pixel unit storage recess are provided at the center of the solid-state image sensor suction surface, and the pixel unit storage recess A vacuum suction hole for adsorbing the flat solid-state image pickup device and keeping it curved along the solid-state image pickup device adsorption surface is provided on the outer side.

本発明の固体撮像装置の製造方法は、前記円筒面状の固体撮像素子取付面を有するパッケージに、前記固体撮像素子取付面に沿わせて撮像面を上向きにして固体撮像素子を取付け、該固体撮像素子に設けた複数の固体撮像素子側電極パッドを、前記パッケージの前記パッケージ側電極パッド形成面の外側に位置するパッケージ側電極パッド形成面に形成したパッケージ側電極に、ボンディング装置によって導体ワイヤで接続する固体撮像装置の製造方法において、互いに接続する固体撮像素子側電極パッドとパッケージ側電極パッドを、前記ボンディング装置のキャピラリーに対して略垂直になるように前記パッケージ角度を調整し、前記キャピラリーの略真下位置において、前記対を成す固体撮像素子側電極パッドとパッケージ側電極パッドの接続を行う構成にした。特に、前記パッケージ側電極パッド形成面を、前記固体撮像素子取付面に取付けられた固体撮像素子の湾曲面の接線となる複数の平面で構成して、これら複数の平面を、前記ボンディング装置のキャピラリーに対して順次、略直角になるように前記パッケージ角度を調整し、前記キャピラリーの略真下位置で、前記対を成す固体撮像素子側電極パッドとパッケージ側電極パッドのボンディングを行う構成にした。。   The manufacturing method of the solid-state imaging device of the present invention attaches a solid-state imaging device to the package having the cylindrical solid-state imaging device mounting surface with the imaging surface facing upward along the solid-state imaging device mounting surface. A plurality of solid-state image sensor side electrode pads provided on the image sensor are connected to a package side electrode formed on a package side electrode pad formation surface located outside the package side electrode pad formation surface of the package with a conductor wire by a bonding apparatus. In the manufacturing method of the solid-state imaging device to be connected, the package angle is adjusted so that the solid-state imaging device side electrode pad and the package-side electrode pad to be connected to each other are substantially perpendicular to the capillary of the bonding device. The solid-state image sensor side electrode pad and the package side electrode pad that form the pair at a position almost directly below. It was configured to perform the connection. In particular, the package-side electrode pad forming surface is constituted by a plurality of planes that are tangent to the curved surface of the solid-state image sensor attached to the solid-state image sensor attachment surface, and the plurality of planes are defined by the capillary of the bonding apparatus. The package angle is adjusted so as to be substantially perpendicular to each other, and the pair of the solid-state imaging device side electrode pad and the package side electrode pad are bonded at a position substantially directly below the capillary. .

本発明の電子部品の組付方法は、非平面形状の電子部品取付面を有する部品ホルダに、前記電子部品取付面に沿わせて非平面形状に電子部品を配置し、該電子部品に設けた複数の電子部品側の電極パッドと、前記部品ホルダの前記電子部品取付面の外側に位置する部品ホルダ側電極パッド形成面に形成した部品ホルダ側電極パッドとを、ボンディング装置で導体ワイヤにより接続して部品ホルダに電子部品を組付ける電子部品の組付方法において、互いに接続する電子部品側電極パッドと部品ホルダ側電極パッドをボンディング装置のキャピラリーに対して略垂直のボンディング位置に送り込んでボンディングを行った後に、ボンディングを終了した電子部品側電極パッドと部品ホルダ側電極パッドを前記ボンディング位置から送り出す一方、次に接続する電子部品側電極パッドと部品ホルダ側電極パッドを、前記ボンディング位置に送り込む構成にした。特に、前記ボンディングを終了した電極パッドのボンディング位置からの送り出しと、次にボンディングを行う電極パッドのボンディング位置への送り込み操作を、前記部品ホルダの角度を変化することにより同時に行う構成にした。   In the electronic component assembly method of the present invention, an electronic component is arranged in a non-planar shape along the electronic component mounting surface in a component holder having a non-planar electronic component mounting surface, and the electronic component is provided on the electronic component. A plurality of electronic component side electrode pads and a component holder side electrode pad formed on a component holder side electrode pad forming surface located outside the electronic component mounting surface of the component holder are connected by a conductor wire with a bonding apparatus. In the electronic component assembly method for assembling the electronic component to the component holder, the electronic component side electrode pad and the component holder side electrode pad connected to each other are sent to a bonding position substantially perpendicular to the capillary of the bonding apparatus to perform bonding. After the bonding, the electronic component side electrode pad and the component holder side electrode pad that have been bonded are sent out from the bonding position. The electronic component-side electrode pad and the component holder-side electrode pad to be next connected, and the structure for feeding to the bonding position. In particular, the electrode pad that has been bonded is sent out from the bonding position and the electrode pad to be bonded next is sent to the bonding position at the same time by changing the angle of the component holder.

本発明の固体撮像装置は、パッケージ側電極パッド形成面を、固体撮像取付面の端部を延長させることにより該固体撮像取付面の端部と平行な非平面形状に形成し、固体撮像素子側電極パッドとパッケージ側電極パッドを平行に配置することにより湾曲による固体撮像素子側電極パッドとパッケージ側電極パッドの間の高低差を無くしたので、湾曲量の大きい両端部側に配置されている電極パッドの接続を行う場合でも、湾曲量の少ない中央部の電極パッドの接続を行う場合と同様に確実に行うことができる。また、各電極パッドの高さ（段差）が略一定になっているので、導体ワイヤの先端のボール部の形状が安定して導体ワイヤの電極パッドへの接続が確実なものになる。特に、固体撮像素子の撮像画素エリアに対応する部分のみを湾曲させた場合には、例えば固体撮像素子制御用ＩＣ回路と画像処理用回路が１チップで構成されている固体撮像素子の場合に、固体撮像素子全体を必要以上に湾曲させることがない。さらに、固体撮像素子全体を湾曲させる場合に較べて湾曲時応力を軽減し、ワイヤーボンディングの持続性を安定させることができる。また、前記円筒面状の固体撮像素子取付面を、前記パッケージの内面に取付けられた台座に設けることにより、パッケージそのものに円筒面状の固体撮像素子取付面を形成する必要がなくなり、パッケージのコスト削減を図ることが可能になる。   In the solid-state imaging device of the present invention, the package-side electrode pad forming surface is formed in a non-planar shape parallel to the end of the solid-state imaging mounting surface by extending the end of the solid-state imaging mounting surface. By arranging the electrode pad and the package side electrode pad in parallel, the height difference between the solid-state imaging device side electrode pad and the package side electrode pad due to the bending is eliminated, so the electrodes arranged on both end sides with a large bending amount Even when the pads are connected, the connection can be performed in the same manner as in the case of connecting the electrode pads at the center with a small amount of bending. Further, since the height (step) of each electrode pad is substantially constant, the shape of the ball portion at the tip of the conductor wire is stable, and the connection of the conductor wire to the electrode pad is ensured. In particular, when only the portion corresponding to the imaging pixel area of the solid-state imaging device is curved, for example, in the case of a solid-state imaging device in which the solid-state imaging device control IC circuit and the image processing circuit are configured in one chip, The entire solid-state image sensor is not curved more than necessary. Furthermore, compared with the case where the whole solid-state image sensor is bent, the stress at the time of bending can be reduced and the sustainability of wire bonding can be stabilized. Further, by providing the cylindrical surface-shaped solid-state image sensor mounting surface on a pedestal mounted on the inner surface of the package, it is not necessary to form the cylindrical surface-shaped solid-state image sensor mounting surface on the package itself, and the cost of the package is reduced. Reduction can be achieved.

本発明の組付け治具（コレット）は、前記固体撮像素子吸着面を、前記パッケージの固体撮像素子取付面と略同じ円筒面状に形成したので、平板状の固体撮像素子を前記固体撮像素子吸着面に吸着させることにより平板状の固体撮像素子を湾曲させた状態で前記パッケージの固体撮像素子取付面に取付けることができる。従って従来のようにパッケージにバキューム装置を連結して、パッケージ内において平板状の固体撮像素子を湾曲させて固体撮像素子取付面に取付けるという面倒な作業が不必要になる。また、パッケージにバキューム装置への連結部等を設ける必要がなくなるのでそのぶんパッケージの構造を簡素化できる。また、前記固体撮像素子吸着面の中央部に固体撮像素子の撮像画素部を収容する画素部収納凹部を設けたので、該画素部収納凹部内に固体撮像素子の撮像画素部を収容することにより該撮像画素部を前記固体撮像素子吸着面に接触させないで吸着して前記撮像画素部を保護することができる。   In the assembling jig (collet) of the present invention, the solid-state image pickup device adsorption surface is formed in the same cylindrical surface as the solid-state image pickup device mounting surface of the package. By adsorbing to the adsorption surface, the flat solid-state image sensor can be attached to the solid-state image sensor attachment surface of the package in a curved state. Therefore, the conventional troublesome work of connecting the vacuum device to the package and bending the flat solid-state image pickup device in the package and attaching it to the mounting surface of the solid-state image pickup device is unnecessary. In addition, since it is not necessary to provide a connecting portion to the vacuum device on the package, the structure of the package can be simplified. Moreover, since the pixel part accommodation recessed part which accommodates the imaging pixel part of a solid-state image sensor was provided in the center part of the said solid-state image sensor adsorption | suction surface, by accommodating the imaging pixel part of a solid-state image sensor in this pixel part accommodation recessed part The imaging pixel unit can be protected by adhering without bringing the imaging pixel unit into contact with the adsorption surface of the solid-state imaging device.

本発明の固体撮像装置の製造方法は、前記固体撮像素子側の電極パッドと、該固体撮像素子側の電極パッドと対を成すパッケージ側電極パッドを、前記固体撮像素子側の電極パッドに対応させた湾曲形状に配置し、前記対を成す全ての固体撮像素子側の電極パッドとパッケージ側電極パッドの間の高低差を一定の値に設定したので、一対の固体撮像素子側の電極パッドとパッケージ側の電極パッドのボンディングを終了したら、前記パッケージ（固体撮像装置）の角度を変えて、前記ボンディングを終了した固体撮像素子側の電極パッドとパッケージ側の電極パッドをボンディング位置から送り出すとともに、次にボンディングを行う一対の電子部品側の電極パッドと部品ホルダ側の電極パッドをボンディング位置に送り込むことによって、全ての対を成す固体撮像素子側の電極パッドとパッケージ側の電極パッドのボンディングを同じ最良の条件の下でボンディングすることができる。特に、パッケージ側の電極パッドを前記固体撮像素子取付面に取付けられた固体撮像素子の湾曲面の接線となる複数の平面上に配置した場合には、パッケージ側電極パッド側においても、キャピラリーは平面状のパッケージ側の電極パッドに接地できることから片当たりのない平面基板と同様の接続性の高いボンディングが可能となる。さらに湾曲による高低差が解消されるため、ワイヤーボンディング時の認識不良がなくなり歩留まり向上が可能になる。   In the method for manufacturing a solid-state imaging device according to the present invention, the electrode pad on the solid-state imaging device side and the package-side electrode pad that forms a pair with the electrode pad on the solid-state imaging device side correspond to the electrode pad on the solid-state imaging device side. Since the height difference between all the electrode pads on the side of the solid-state image sensor and the package-side electrode pads that are arranged in a curved shape is set to a constant value, the electrode pads and the package on the pair of solid-state image sensor side When the bonding of the electrode pad on the side is finished, the angle of the package (solid-state imaging device) is changed, and the electrode pad on the solid-state imaging device side and the electrode pad on the package side that have finished the bonding are sent out from the bonding position. By sending the electrode pad on the side of the pair of electronic components and the electrode pad on the component holder side to be bonded to the bonding position, It can be bonded to the bonding of the electrode pads of the electrode pads and the package side of the solid-state imaging device side forming a pair of Te under the same best conditions. In particular, when the electrode pads on the package side are arranged on a plurality of planes that are tangent to the curved surface of the solid-state image sensor attached to the solid-state image sensor mounting surface, the capillaries are flat on the package-side electrode pad side as well. Since it can be grounded to the electrode pad on the side of the package, bonding with high connectivity similar to that of a flat substrate without contact is possible. Furthermore, since the height difference due to bending is eliminated, there is no recognition failure during wire bonding, and the yield can be improved.

本発明の電子部品の組付方法においては、複数対の電子部品側の電極パッドと部品ホルダ側の電極パッドのボンディングを略同一の条件の下で行うことができる。
特に、前記部品ホルダの角度を変化させるという簡単な操作で、前記ボンディングを終了した一対の電子部品側の電極パッドと部品ホルダ側電極パッドをボンディング位置から送り出すとともに、次にボンディングを行う一対の電子部品側の電極パッドと部品ホルダ側電極パッドをボンディング位置に送り込むことにより全ての部品ホルダ側電極パッドと部品ホルダ側電極パッドを略同じ条件の下でボンディングすることができる。 In the electronic component assembling method of the present invention, a plurality of pairs of electrode pads on the electronic component side and electrode pads on the component holder side can be bonded under substantially the same conditions.
In particular, by a simple operation of changing the angle of the component holder, the pair of electronic component-side electrode pads and the component holder-side electrode pads that have finished the bonding are sent out from the bonding position, and the pair of electrons to be bonded next By sending the component side electrode pads and the component holder side electrode pads to the bonding position, all the component holder side electrode pads and the component holder side electrode pads can be bonded under substantially the same conditions.

以下、本発明を、（１）固体撮像装置、（２）固体撮像装置のパッケージに固体撮像素子を取付けるのに使用する組付け治具、（３）固体撮像装置の製造方法、（４）他の実施の形態、の順に説明する。   Hereinafter, the present invention includes (1) a solid-state imaging device, (2) an assembly jig used for mounting a solid-state imaging device on a package of the solid-state imaging device, (3) a method for manufacturing the solid-state imaging device, (4) others The embodiments will be described in this order.

（１）固体撮像装置
図１〜図５は、第１の実施の形態の固体撮像装置１を示す。固体撮像装置１は、薄板状の固体撮像素子２と、該固体撮像素子２を固体撮像素子取付面３ａ上に該固体撮像素子取付面３ａに沿って取付けるパッケージ３と、該パッケージ３の開口部を覆う透明のカバー４と、を備えている。 (1) Solid-state imaging device FIGS. 1-5 shows the solid-state imaging device 1 of 1st Embodiment. The solid-state imaging device 1 includes a thin plate-shaped solid-state imaging device 2, a package 3 for mounting the solid-state imaging device 2 on the solid-state imaging device mounting surface 3a along the solid-state imaging device mounting surface 3a, and an opening of the package 3 And a transparent cover 4 covering the.

前記固体撮像素子２は、湾曲可能な矩形状に形成されている。前記パッケージ３は、矩形の箱型に形成されている。前記固体撮像素子取付面３ａは、円筒面状に湾曲して形成されている。前記固体撮像素子２は、前記固体撮像素子取付面３ａに沿って円筒面状に湾曲させた状態で取付けられている。   The solid-state image sensor 2 is formed in a bendable rectangular shape. The package 3 is formed in a rectangular box shape. The solid-state image sensor mounting surface 3a is formed to be curved in a cylindrical surface shape. The solid-state image sensor 2 is attached in a state of being curved into a cylindrical surface along the solid-state image sensor attachment surface 3a.

前記矩形状の固体撮像素子２には、その周縁部に沿って複数の固体撮像素子側電極パッド５が形成されている。   The rectangular solid-state image sensor 2 has a plurality of solid-state image sensor-side electrode pads 5 formed along the peripheral edge thereof.

前記固体撮像素子側電極パッド５は、前記パッケージ３の前記固体撮像素子取付面３ａの外側に位置するパッケージ側電極パッド形成面（接続ランド形成面）６に形成したパッケージ側電極パッド（接続ランド）７に導体ワイヤ８で接続されている。   The solid-state image sensor side electrode pad 5 is a package-side electrode pad (connection land) formed on a package-side electrode pad formation surface (connection land formation surface) 6 located outside the solid-state image sensor mounting surface 3a of the package 3. 7 is connected by a conductor wire 8.

前記パッケージ側電極パッド形成面６は、前記固体撮像素子取付面３ａの外側に、該固体撮像素子取付面３ａを延長することにより、該固体撮像素子取付面３ａと略面一に、平行に形成されている。そして、前記パッケージ側電極パッド形成面６上には、前記固体撮像素子側電極パッド５に対向させた状態で複数のパッケージ側電極パッド７が形成されている。   The package-side electrode pad forming surface 6 is formed in parallel with the solid-state imaging device mounting surface 3a by extending the solid-state imaging device mounting surface 3a outside the solid-state imaging device mounting surface 3a. Has been. A plurality of package-side electrode pads 7 are formed on the package-side electrode pad forming surface 6 so as to face the solid-state imaging element-side electrode pad 5.

第１の実施の形態の固体撮像装置１は、上述したように、円筒面状のパッケージ３の円筒面状の固体撮像素子取付面３ａを外側に延ばして、該固体撮像素子取付面３ａと略面一のパッケージ側電極パッド形成面６を設け、該パッケージ側電極パッド形成面６上にパッケージ側電極パッド７を形成したので、図４に示すように、前記パッケージ側電極パッド７と前記固体撮像素子側電極パッド５は、互いに平行状態になり、且つ前記パッケージ側電極パッド７から前記固体撮像素子側電極パッド５までの高さＨは、固体撮像素子２が円筒面状に湾曲しているのにも拘わらず、全ての対を成す固体撮像素子側電極パッド５とパッケージ側電極パッド７の間において略一定の値となる。従って、従来のように外側に行く程、パッケージ側電極パッド７から前記固体撮像素子側電極パッド５までの高さＨが増大するということはなくなり、導体ワイヤ８による固体撮像素子側電極パッド５とパッケージ側電極パッド７の接続を簡単容易、且つ確実に行うことが可能になる。   As described above, the solid-state imaging device 1 of the first embodiment extends the cylindrical surface-shaped solid-state image sensor mounting surface 3a of the cylindrical surface-shaped package 3 outward, and is substantially the same as the solid-state image sensor mounting surface 3a. Since the same package-side electrode pad forming surface 6 is provided and the package-side electrode pad 7 is formed on the package-side electrode pad forming surface 6, as shown in FIG. The element-side electrode pads 5 are parallel to each other, and the height H from the package-side electrode pad 7 to the solid-state image sensor-side electrode pad 5 is such that the solid-state image sensor 2 is curved in a cylindrical surface shape. Nevertheless, the value is substantially constant between the solid-state image sensor side electrode pads 5 and the package side electrode pads 7 forming all pairs. Accordingly, the height H from the package-side electrode pad 7 to the solid-state image sensor side electrode pad 5 does not increase as it goes outward as in the prior art, and the solid-state image sensor side electrode pad 5 by the conductor wire 8 does not increase. The package-side electrode pad 7 can be easily and easily connected.

図６〜図１０は、第２の実施の形態の固体撮像装置１０を示す。この実施の形態と前記第１の実施の形態の固体撮像装置１の主たる相違点は、前記矩形状の固体撮像素子２を取り囲む矩形の枠状のパッケージ側電極パッド形成面６のうち、固体撮像素子２の湾曲した辺の外側に位置するパッド形成面６ａを、前記固体撮像素子２の湾曲面の接線と平行をなす第１〜第３の平面１１〜１３で形成した。他の構成は、第１の実施の形態の固体撮像装置１と同じであるので重複する説明は省略する。   6 to 10 show a solid-state imaging device 10 according to the second embodiment. The main difference between the solid-state imaging device 1 of the present embodiment and the first embodiment is that the solid-state imaging of the rectangular frame-shaped package-side electrode pad forming surface 6 surrounding the rectangular solid-state imaging device 2. The pad forming surface 6 a located outside the curved side of the element 2 is formed by first to third planes 11 to 13 that are parallel to the tangent line of the curved surface of the solid-state imaging element 2. Other configurations are the same as those of the solid-state imaging device 1 according to the first embodiment, and thus redundant description is omitted.

第２の実施の形態の固体撮像装置１０は、上述したように、固体撮像素子３のパッド形成面６ａを形成する第１〜第３の平面１１〜１３上にパッケージ側電極パッド７を形成したので、各平面１１〜１３上に形成されているパッケージ側電極パッド７相互間においては、固体撮像素子側電極パッド５との間の高さＨに若干の差が生じるが、図４１に示す従来例のように、単一の面１１２に全てのパッケージ側電極パッドを設けた固体撮像装置に較べて、固体撮像素子側電極パッド５とパッケージ側電極パッド７の高低差の変化を最小限に抑制することができる。なお、この実施の形態においては、３つの平面１１〜１３を設けた場合を示したが、２つの平面で構成してもよい。前記平面の数を増やせば増やすほど第１の実施の形態の固体撮像装置１に近似したものになる。   As described above, in the solid-state imaging device 10 of the second embodiment, the package-side electrode pad 7 is formed on the first to third planes 11 to 13 that form the pad forming surface 6a of the solid-state imaging device 3. Therefore, there is a slight difference in the height H between the package-side electrode pads 7 formed on the respective planes 11 to 13 and the solid-state imaging device-side electrode pads 5, but the conventional technique shown in FIG. As in the example, as compared with the solid-state imaging device in which all the package-side electrode pads are provided on the single surface 112, the change in the height difference between the solid-state imaging element-side electrode pad 5 and the package-side electrode pad 7 is minimized. can do. In addition, in this embodiment, although the case where the three planes 11-13 were provided was shown, you may comprise by two planes. As the number of the planes is increased, the solid-state imaging device 1 of the first embodiment is approximated.

図１１〜図１５は、第３の実施の形態の固体撮像装置２０を示す。この実施の形態において、前記固体撮像素子取付面３ａは、球面状に湾曲形成されている。また、前記パッケージ側電極パッド形成面６は、前記固体撮像素子取付面３ａの外側に、該固体撮像素子取付面３ａを延長することにより、該固体撮像素子取付面３ａと略面一の球面状に形成されている。他の構成は、第１の実施の形態の固体撮像装置１と同じであるので重複する説明は省略する。   FIGS. 11-15 shows the solid-state imaging device 20 of 3rd Embodiment. In this embodiment, the solid-state image sensor mounting surface 3a is curved and formed into a spherical shape. The package-side electrode pad forming surface 6 has a spherical surface that is substantially flush with the solid-state image sensor mounting surface 3a by extending the solid-state image sensor mounting surface 3a outside the solid-state image sensor mounting surface 3a. Is formed. Other configurations are the same as those of the solid-state imaging device 1 according to the first embodiment, and thus redundant description is omitted.

第３の実施の形態の固体撮像装置２０は、上述したように、固体撮像素子３を半球面状に湾曲させたので、第１，第２の実施の形態のように固体撮像素子３を円筒面状に湾曲させた場合よりも、より確実にレンズ収差を補正することができる。   Since the solid-state imaging device 20 of the third embodiment is curved in a hemispherical shape as described above, the solid-state imaging device 3 is cylindrical as in the first and second embodiments. Lens aberration can be corrected more reliably than in the case where the lens is curved in a planar shape.

図１６〜図２０は、第４の実施の形態の固体撮像装置３０を示す。この実施の形態においては、図１８に示すように、前記パッケージ３の固体撮像素子取付面３ａの固体撮像素子２の撮像画素部２ａに対応する中央部分３ｂを円筒面状に形成し、両側部分３ｃ，３ｄをフラット面に形成した。他の構成は第２の実施の形態の場合と同じであるので重複する説明は省略する。   FIGS. 16-20 shows the solid-state imaging device 30 of 4th Embodiment. In this embodiment, as shown in FIG. 18, a central portion 3b corresponding to the imaging pixel portion 2a of the solid-state imaging device 2 on the solid-state imaging device mounting surface 3a of the package 3 is formed into a cylindrical surface, and both side portions are formed. 3c and 3d were formed on a flat surface. Since other configurations are the same as those in the second embodiment, a duplicate description is omitted.

第４の実施の形態の固体撮像装置３０は、上述のような構成であって、例えば固体撮像素子制御用ＩＣ回路と画像処理用回路が１チップで構成されている固体撮像素子を取付ける場合に、固体撮像素子全体を必要以上に湾曲させることがない。さらに、固体撮像素子全体を湾曲させる場合に較べて湾曲時応力を軽減し、ワイヤーボンデリングの持続性を安定させることができる。   The solid-state imaging device 30 according to the fourth embodiment has the above-described configuration. For example, when a solid-state imaging device in which a solid-state imaging device control IC circuit and an image processing circuit are configured in one chip is mounted. The entire solid-state image sensor is not curved more than necessary. Furthermore, compared with the case where the whole solid-state image sensor is curved, the stress at the time of bending can be reduced, and the durability of wire bondering can be stabilized.

図２１〜図２３は、第５の実施の形態の固体撮像装置４０を示す。この実施の形態において、パッケージ３の底面に台座４１に取付け、該台座４１に、固体撮像素子取付面３ａとパッケージ側電極パッド形成面６を設けた場合を示す。他の構成は、第１〜第４の実施の形態と同じであるので重複する説明を省略する。第５の実施の形態の固体撮像装置４０においては、パッケージ３の内面に円筒面状の固体撮像素子取付面３ａを直接、樹脂形成する必要がなくなりコスト低減を図ることができる。   FIGS. 21-23 shows the solid-state imaging device 40 of 5th Embodiment. In this embodiment, a case where the package 3 is attached to the pedestal 41 and the pedestal 41 is provided with a solid-state image sensor attachment surface 3a and a package-side electrode pad forming surface 6 is shown. Other configurations are the same as those of the first to fourth embodiments, and thus redundant description is omitted. In the solid-state imaging device 40 according to the fifth embodiment, it is not necessary to directly form the cylindrical solid-state imaging element mounting surface 3a on the inner surface of the package 3, thereby reducing the cost.

（２）固体撮像装置のパッケージに固体撮像素子を取付けるのに使用する組付け治具（以下、コレットと称する）
コレットは、平板状の固体撮像素子を吸着してパッケージに設けた円筒面状の固体撮像素子取付面に組付けるための治具である。 (2) Assembly jig used to mount the solid-state imaging device on the package of the solid-state imaging device (hereinafter referred to as a collet)
The collet is a jig for attracting a flat solid-state image sensor and assembling it on a cylindrical solid-state image sensor mounting surface provided on the package.

図２４、図２５に示すように、コレット５１は、平板状の固体撮像素子２を吸着する固体撮像素子吸着面５２を備えている。前記固体撮像素子吸着面５２は、図１等に示す前記パッケージ３の固体撮像素子取付面３ａと略同じ形状に形成されている。   As illustrated in FIGS. 24 and 25, the collet 51 includes a solid-state image sensor adsorption surface 52 that adsorbs the flat solid-state image sensor 2. The solid-state image sensor adsorption surface 52 is formed in substantially the same shape as the solid-state image sensor mounting surface 3a of the package 3 shown in FIG.

前記固体撮像素子吸着面５２は、その中央部に前記固体撮像素子２の撮像画素部２ａを収容する画素部収納凹部５３を備えている。該画素部収納凹部５３の内側には、前記平板状の固体撮像素子２を固体撮像素子吸着面５２に吸着する第１の真空吸引孔５４が設けられている。また、該画素部収納凹部５３の外側には、前記固体撮像素子吸着面５２に沿わせて前記平板状の固体撮像素子２を湾曲させた状態に吸着する第２〜第５の真空吸引孔５５〜５８が設けられている。前記第１〜第５の真空吸引孔５４〜５８は、バキュームポンプ（図示省略）に接続されている。   The solid-state image pickup device suction surface 52 includes a pixel portion storage recess 53 that stores the image pickup pixel portion 2a of the solid-state image pickup device 2 at the center thereof. A first vacuum suction hole 54 for adsorbing the flat solid-state imaging device 2 to the solid-state imaging device adsorption surface 52 is provided inside the pixel unit housing recess 53. The second to fifth vacuum suction holes 55 that adsorb the flat solid-state image pickup device 2 in a curved state along the solid-state image pickup device suction surface 52 outside the pixel portion storage recess 53. -58 are provided. The first to fifth vacuum suction holes 54 to 58 are connected to a vacuum pump (not shown).

次に、前記コレット５１を使用して固体撮像素子２をパッケージ３の固体撮像素子取付面３ａに搭載する方法の一例を図２６を参照して説明する。   Next, an example of a method for mounting the solid-state imaging device 2 on the solid-state imaging device mounting surface 3a of the package 3 using the collet 51 will be described with reference to FIG.

先ず、図２６Ａに示すように、固体撮像素子２の撮像画素部２ａを画素部収納凹部５３に収納し、前記第１の真空吸引孔５４に負圧を加えて固体撮像素子２をコレット５１の固体撮像素子吸着面５２に吸着する。   First, as shown in FIG. 26A, the imaging pixel portion 2 a of the solid-state imaging device 2 is stored in the pixel-portion storage recess 53, and negative pressure is applied to the first vacuum suction hole 54 so that the solid-state imaging device 2 is attached to the collet 51. Adsorbed to the solid-state image sensor adsorption surface 52.

次に、図２６Ｂに示すように、コレット５１の固体撮像素子吸着面５２で固体撮像素子２をパッケージ３の固体撮像素子取付面３ａに押し付けて、該固体撮像素子取付面３ａに倣って前記固体撮像素子２を変形させると共に、前記固体撮像素子２の下面に設けられている接着剤５９で接着する。   Next, as shown in FIG. 26B, the solid-state imaging device 2 is pressed against the solid-state imaging device mounting surface 3a of the package 3 by the solid-state imaging device adsorption surface 52 of the collet 51, and the solid imaging device 3a is imprinted along the solid-state imaging device mounting surface 3a. The image pickup device 2 is deformed and bonded with an adhesive 59 provided on the lower surface of the solid-state image pickup device 2.

次に、図２６Ｃに示すように、前記第１の真空吸引孔５４に加えられていた負圧を解除して、コレット５１を前記固体撮像素子２の上面から離すと、固体撮像素子２は、パッケージ３の固体撮像素子取付面３ａに接着された状態になる。   Next, as shown in FIG. 26C, when the negative pressure applied to the first vacuum suction hole 54 is released and the collet 51 is separated from the upper surface of the solid-state image sensor 2, the solid-state image sensor 2 is The package 3 is bonded to the solid-state image sensor mounting surface 3a.

なお、前記接着剤５９には、所謂ホットメルト接着剤等が使用されていて、図２６Ｂに示す固体撮像素子２を変形させる際には、接着効果を有せず、固体撮像素子２を変形させた後に加熱することにより接着効果を発揮して、固体撮像素子２をパッケージ３の固体撮像素子取付面３ａに接着する。   Note that a so-called hot melt adhesive or the like is used for the adhesive 59, and when the solid-state image pickup device 2 shown in FIG. 26B is deformed, the adhesive 59 does not have an adhesive effect, and the solid-state image pickup device 2 is deformed. The solid-state image pickup device 2 is bonded to the solid-state image pickup device mounting surface 3a of the package 3 by exerting an adhesive effect by heating after that.

上記搭載方法は、平板状の固体撮像素子２をパッケージ３の固体撮像素子取付面３ａで変形させて、該固体撮像素子取付面３ａに取付ける場合を示したが、平板状の固体撮像素子２を予め湾曲させた状態で固体撮像素子取付面３ａに取付けてもよい。   In the above mounting method, the flat solid-state image pickup device 2 is deformed by the solid-state image pickup device mounting surface 3a of the package 3 and attached to the solid-state image pickup device mounting surface 3a. You may attach to the solid-state image sensor attachment surface 3a in the state curved beforehand.

図２７は、平板状の固体撮像素子２を予め湾曲させた状態で固体撮像素子取付面３ａに取付ける方法を示す。   FIG. 27 shows a method of attaching the flat solid-state image pickup device 2 to the solid-state image pickup device attachment surface 3a in a state of being curved in advance.

先ず、図２７Ａに示すように、固体撮像素子２の撮像画素部２ａを画素部収納凹部５３に収納し、前記第１の真空吸引孔５４に負圧を加えて固体撮像素子２をコレット５１の固体撮像素子吸着面５２に吸着する。   First, as shown in FIG. 27A, the imaging pixel portion 2 a of the solid-state imaging device 2 is stored in the pixel-portion storage recess 53, and negative pressure is applied to the first vacuum suction hole 54 so that the solid-state imaging device 2 is attached to the collet 51. Adsorbed to the solid-state image sensor adsorption surface 52.

次に、図２７Ｂ，図２７Ｃに示すように、前記固体撮像素子２を仮搭載台座（変形用台座）６１に挿入し、該仮搭載台座６１に設けた変形面６２に押し付けて、前記固体撮像素子２を前記変形面６２および前記コレット５１の固体撮像素子吸着面５２に沿わせて変形させる。前記変形面６２は、パッケージ３の固体撮像素子取付面３ａと略同じ形状に形成されている。   Next, as shown in FIGS. 27B and 27C, the solid-state imaging device 2 is inserted into a temporary mounting base (deformation base) 61 and pressed against a deformation surface 62 provided on the temporary mounting base 61, so that the solid-state imaging is performed. The element 2 is deformed along the deformation surface 62 and the solid-state image sensor adsorption surface 52 of the collet 51. The deformation surface 62 is formed in substantially the same shape as the solid-state image sensor mounting surface 3 a of the package 3.

次に、図２７Ｄに示すように、前記第１〜第５の真空吸引孔５４〜５８に負圧を加えて固体撮像素子２をコレット５１の固体撮像素子吸着面５２に吸着して、変形させた固体撮像素子２を前記仮搭載台座６１から抜き出す。   Next, as shown in FIG. 27D, negative pressure is applied to the first to fifth vacuum suction holes 54 to 58 to attract the solid-state image sensor 2 to the solid-state image sensor adsorption surface 52 of the collet 51 and deform it. The solid-state imaging device 2 is extracted from the temporary mounting base 61.

次に、図２６Ｅ，２７Ｆに示すように、固体撮像素子２をコレット５１の固体撮像素子吸着面５２でパッケージ３の固体撮像素子取付面３ａに押し付け、前記固体撮像素子２の下面に設けられている接着剤５９で接着する。   Next, as shown in FIGS. 26E and 27F, the solid-state imaging device 2 is pressed against the solid-state imaging device mounting surface 3a of the package 3 by the solid-state imaging device adsorption surface 52 of the collet 51, and is provided on the lower surface of the solid-state imaging device 2. Adhesion is performed with the existing adhesive 59.

次に、図２７Ｇに示すように、前記第１〜第５の真空吸引孔５４〜５８に加えられている負圧を解除して、コレット５１を前記固体撮像素子２の上面から離すと、固体撮像素子２は、パッケージ３の固体撮像素子取付面３ａに接着された状態になる。なお、前記接着剤５９には、所謂ホットメルト接着剤等が使用されていて、図２７Ｂ，図２７Ｃに示す仮搭載台座６１で固体撮像素子２を変形させる際には、接着効果を有せず、図２７Ｆに示す固体撮像素子２をパッケージ３の固体撮像素子取付面３ａに接着させる際に加熱することにより接着効果を発揮する。前記仮搭載台座６１の変形面６２の表面にテフロン（登録商標名）等の剥離性のよい素材で表面処理等を施しておけば、前記仮搭載台座６１の変形面６２で固体撮像素子２を変形させた後に、該固体撮像素子２を前記仮搭載台座６１の変形面６２から容易に離間させることができる。   Next, as shown in FIG. 27G, when the negative pressure applied to the first to fifth vacuum suction holes 54 to 58 is released and the collet 51 is separated from the upper surface of the solid-state imaging device 2, a solid is obtained. The image sensor 2 is in a state of being bonded to the solid-state image sensor mounting surface 3 a of the package 3. Note that a so-called hot melt adhesive or the like is used for the adhesive 59, and when the solid-state imaging device 2 is deformed by the temporary mounting base 61 shown in FIGS. 27B and 27C, there is no adhesive effect. When the solid-state imaging device 2 shown in FIG. 27F is bonded to the solid-state imaging device mounting surface 3a of the package 3, the bonding effect is exhibited by heating. If the surface of the deformation surface 62 of the temporary mounting pedestal 61 is subjected to a surface treatment or the like with a material having good peelability such as Teflon (registered trademark), the solid-state image pickup device 2 is mounted on the deformation surface 62 of the temporary mounting pedestal 61. After the deformation, the solid-state imaging device 2 can be easily separated from the deformation surface 62 of the temporary mounting base 61.

なお、図２８Ａ〜図２８Ｄに示すように、コレット５１の固体撮像素子吸着面５２の曲率をＲｃ、仮搭載台座６１の変形面６２の曲率をＲｄ、パッケージ３の固体撮像素子取付面３ａの曲率をＲｐ、固体撮像素子２の撮像画素部２ａのパッケージ３への搭載後の所望曲率をＲｓ、固体撮像素子２の厚みｔｓ、接着剤５９の厚みｔｊとすると、Ｒｄ≧Ｒｃ＋ｔｓ＋ｔｊ、Ｒｐ＝Ｒｓ＋ｔｓ＋ｔｊ、Ｒｓ≧Ｒｃの関係が成立し、加熱固着時に固体撮像素子２の裏面の曲面先端からパッケージ３に接触するので、固体撮像素子２の浮き、ボイド巻き込みの発生しない安定した湾曲実装が可能になる。   28A to 28D, the curvature of the solid-state image pickup device suction surface 52 of the collet 51 is Rc, the curvature of the deformation surface 62 of the temporary mounting base 61 is Rd, and the curvature of the solid-state image pickup device mounting surface 3a of the package 3 is used. Is Rp, Rs is the desired curvature after mounting the imaging pixel unit 2a of the solid-state imaging device 2 on the package 3, Rs, the thickness ts of the solid-state imaging device 2, and the thickness tj of the adhesive 59, Rd ≧ Rc + ts + tj, Rp = Rs + ts + tj, Since the relationship of Rs ≧ Rc is established and the package 3 comes into contact with the package 3 from the front end of the curved surface on the back surface of the solid-state image pickup device 2 at the time of heating and fixing, it is possible to mount the solid-state image pickup device 2 stably and without causing voids.

図２９は、コレット５１の変形例を示す。この変形例においては、コレット５１の固体撮像素子吸着面５２の表面に弾性変形可能な樹脂層６３を設けた。そして、前記樹脂層６３の弾性変形可能な範囲内で固体撮像素子２を前記仮搭載台座６１およびパッケージ３の固体撮像素子取付面３ａに圧接させる構成にした。従って、素子破損および仮搭載台座６１での固体撮像素子２の吸着不良防止と前記パッケージ３の固体撮像素子取付面３ａへの気泡の抱き込みの少ない確実な接着ができる。他の構成は基本となるコレットの構成と同じであるので、重複する説明は省略する。   FIG. 29 shows a modification of the collet 51. In this modification, a resin layer 63 that can be elastically deformed is provided on the surface of the solid-state imaging device adsorption surface 52 of the collet 51. The solid-state imaging device 2 is configured to be in pressure contact with the temporary mounting base 61 and the solid-state imaging device mounting surface 3a of the package 3 within a range in which the resin layer 63 can be elastically deformed. Therefore, it is possible to prevent adhesion of the solid-state image pickup device 2 on the temporary mounting base 61 and to prevent the solid-state image pickup device 2 from being sucked, and to securely adhere the bubbles to the solid-state image pickup device mounting surface 3a of the package 3. Since the other configuration is the same as the basic collet configuration, a duplicate description is omitted.

（３）固体撮像装置の製造方法
本発明の固体撮像装置の製造方法は、湾曲可能な薄板状の固体撮像素子をパッケージの非平面形状の固体撮像素子取付面に沿わせて取付け、前記固体撮像素子の周縁部に沿って配置した複数の固体撮像素子側電極パッドと、前記パッケージの前記固体撮像素子取付面よりも外側に位置するパッケージ側電極パッド形成面上に形成したパッケージ側電極パッドを、導体ワイヤで接続することにより構成される固体撮像装置の製造方法であって、互いに接続する固体撮像素子側電極パッドとパッケージ側電極パッドの位置を前記ボンディング装置のキャピラリーに対して略垂直のボンディング位置に来るように前記パッケージ角度を調整して前記ボンディング装置で前記固体撮像素子側電極パッドとパッケージ側電極パッドを接続することを特徴とする。 (3) Manufacturing method of solid-state imaging device The manufacturing method of the solid-state imaging device according to the present invention includes a bendable thin plate-like solid-state imaging device mounted along a non-planar solid-state imaging device mounting surface of a package, A plurality of solid-state imaging device side electrode pads arranged along the peripheral edge of the device, and a package-side electrode pad formed on a package-side electrode pad forming surface located outside the solid-state imaging device mounting surface of the package, A method of manufacturing a solid-state imaging device configured by connecting with a conductor wire, wherein the positions of the solid-state imaging element side electrode pad and the package side electrode pad to be connected to each other are substantially perpendicular to the capillary of the bonding apparatus The package angle is adjusted so that the solid-state imaging device side electrode pad and the package side power It is characterized by connecting pole pads.

図３０は、固体撮像装置の製造方法に使用するボンディング装置７１の一例を示す。ボンディング装置７１は、ボンディングヘッド部７２と、ボンディングステージ７３と、を備えている。前記ボンディングヘッド部７２は、ツールホーン７４と、キャピラリー７５と、を備えている。   FIG. 30 shows an example of a bonding apparatus 71 used in the method for manufacturing the solid-state imaging device. The bonding apparatus 71 includes a bonding head unit 72 and a bonding stage 73. The bonding head unit 72 includes a tool horn 74 and a capillary 75.

前記ボンディングステージ７３は、Ｘ１−Ｘ２方向に移動自在なＸステージ７６と、Ｘ１−Ｘ２方向と直交するＹ１−Ｙ２方向に移動自在なＹステージ７７と、θ１−θ２方向に前記パッケージ３の固体撮像素子取付面３ａの曲率と略同じ曲率等で円弧移動（煽り移動）自在な第１のθステージ７８と、前記θ１−θ２方向と直交するθ３−θ４方向に前記パッケージ３の固体撮像素子取付面３ａの曲率と略同じ曲率等で円弧移動（煽り移動）自在な第２のθステージ７９と、前記Ｘステージ７６，ステージ７７，第１のθステージ７８，第２のθステージ７９を上下Ｈ−Ｌ方向に移動自在、かつＲ１−Ｒ２方向に回転自在に支持しているＨステージ８０と、を備えていて、前記第２のθステージ７９上にボンディングする固体撮像装置１が載置される。   The bonding stage 73 includes an X stage 76 movable in the X1-X2 direction, a Y stage 77 movable in the Y1-Y2 direction orthogonal to the X1-X2 direction, and a solid-state imaging of the package 3 in the θ1-θ2 direction. A first θ stage 78 that can be moved in a circular arc (turning movement) with substantially the same curvature as the curvature of the element mounting surface 3a, and a solid-state image sensor mounting surface of the package 3 in the θ3-θ4 direction orthogonal to the θ1-θ2 direction. The second θ stage 79 that can move in a circular arc (turning movement) with substantially the same curvature as the curvature of 3a, the X stage 76, the stage 77, the first θ stage 78, and the second θ stage 79 are moved up and down H−. An H stage 80 that is movable in the L direction and rotatably supported in the R1-R2 direction, and the solid-state imaging device 1 for bonding is mounted on the second θ stage 79. The

前記Ｘステージ７６，ステージ７７，第１のθステージ７８，第２のθステージ７９，Ｈステージ８０は、ステッピングモータ等の駆動部８１を備えていて、ドライバ８２により制御される。また、前記第２のθステージ７９上に載置された固体撮像装置１の位置は、複数の位置検出用のカメラ８３で検出され、これらカメラ８３の位置情報は、制御部８４に入力されて、前記Ｘステージ７６，Ｙステージ７７，第１のθステージ７８，第２のθステージ７９，Ｈステージ８０を制御して、前記固体撮像装置１を所望の位置に変位させるようになっている。   The X stage 76, the stage 77, the first θ stage 78, the second θ stage 79, and the H stage 80 are provided with a drive unit 81 such as a stepping motor and are controlled by a driver 82. In addition, the position of the solid-state imaging device 1 placed on the second θ stage 79 is detected by a plurality of position detection cameras 83, and the position information of these cameras 83 is input to the control unit 84. The solid-state imaging device 1 is displaced to a desired position by controlling the X stage 76, the Y stage 77, the first θ stage 78, the second θ stage 79, and the H stage 80.

一般にボンディング装置７１によるボンディングは、以下のようにして行われる。先ず、図３１Ａ、図３１Ｂに示すように、キャピラリー７５から引出された金線等の導体ワイヤ８の先端に形成したボール状の塊部８ａを固体撮像素子側電極パッド５に押し付け、前記ボール状の塊部８ａに前記キャピラリー７５やツールホーン７４を介して振動子（図示省略）により超音波振動を印加してボール状の塊部８ａを溶融させて固体撮像素子側のボンディングを行う。次に、図３１Ｃに示すように、キャピラリー７５を上昇させる。次に、図３１Ｄに示すように、キャピラリー７５をパッケージ側電極パッド７の上方に位置させた後に、キャピラリー７５を下降させて前記導体ワイヤ８の途中部８ｂをパッケージ側電極パッド７に押し付け、超音波振動を印加してパッケージ側のボンディングを行う。次に、図３１Ｅに示すように、キャピラリー７５を上昇させ、前記導体ワイヤ８を切断した後に、前記導体ワイヤ８の先端とトーチ電極８５との間でスパークさせて前記導体ワイヤ８の先端にボール状の塊部８ａを形成して次の電極のボンディングを行う。   In general, bonding by the bonding apparatus 71 is performed as follows. First, as shown in FIG. 31A and FIG. 31B, a ball-shaped lump 8a formed at the tip of a conductor wire 8 such as a gold wire drawn out from a capillary 75 is pressed against the solid-state image sensor side electrode pad 5, and the ball-shaped Ultrasonic vibration is applied to the lump portion 8a by a vibrator (not shown) via the capillary 75 and the tool horn 74 to melt the ball-like lump portion 8a and perform bonding on the solid-state imaging device side. Next, as shown in FIG. 31C, the capillary 75 is raised. Next, as shown in FIG. 31D, after the capillary 75 is positioned above the package-side electrode pad 7, the capillary 75 is lowered and the middle portion 8b of the conductor wire 8 is pressed against the package-side electrode pad 7, Bonding on the package side is performed by applying sonic vibration. Next, as shown in FIG. 31E, after the capillary 75 is raised and the conductor wire 8 is cut, a spark is formed between the tip of the conductor wire 8 and the torch electrode 85, and a ball is formed on the tip of the conductor wire 8. Next, the next electrode is bonded by forming a solid lump portion 8a.

次に、前記ボンディング装置を使用して、前記第１の実施の形態の固体撮像装置１（図１〜図５参照）の製造方法を示す。図３０、図３２に示すように、固体撮像素子２を円筒面状に湾曲させて取付けたパッケージ３を、前記ボンディング装置７１の第２のθステージ７９上にセットする。このとき、前記固体撮像素子２の湾曲している長辺２ｂ側を前記第２のθステージ７９の移動方向、すなわちＹステージ７７の移動方向に揃え、短辺２ｃ側を前記第１のθステージ７８の移動方向、すなわちＸステージ７６の移動方向に揃えた状態にする。そして、図３３Ａに示すように、前記長辺２ｂ側に沿って配置された電極パッドの一端部（最外側部）の電極パッドを前記ボンディング装置７１のキャピラリー７５の略真下のボンディング位置に位置させて、前記最外側の固体撮像素子側電極パッド５とパッケージ側電極パッド７のボンディングを行う。   Next, a manufacturing method of the solid-state imaging device 1 (see FIGS. 1 to 5) of the first embodiment using the bonding apparatus will be described. As shown in FIGS. 30 and 32, the package 3 on which the solid-state imaging device 2 is curved and attached in a cylindrical shape is set on the second θ stage 79 of the bonding apparatus 71. At this time, the curved long side 2b side of the solid-state imaging device 2 is aligned with the moving direction of the second θ stage 79, that is, the moving direction of the Y stage 77, and the short side 2c side is aligned with the first θ stage. The movement direction of 78, that is, the movement direction of the X stage 76 is aligned. Then, as shown in FIG. 33A, the electrode pad at one end portion (outermost portion) of the electrode pad arranged along the long side 2b side is positioned at a bonding position almost directly below the capillary 75 of the bonding apparatus 71. Then, the outermost solid-state imaging element side electrode pad 5 and the package side electrode pad 7 are bonded.

最外側部の電極パッドのボンディングを終了したら、図３３Ｂに示すように、前記第２のθステージ７９を図３０のθ３方向に円弧移動させるなど前記ボンディングステージ７３を操作して、前記ボンディングを終了した電極パッドを前記キャピラリー７５の略真下のボンディング位置から送り出すと共に、隣接する電極パッドを前記ボンディング位置に送り込んでボンディングを行う。このようにして一端部の電極パッドから他端部の電極パッドに向けて順次、ボンディングを行う。図３３Ｃに示すように、中央部の電極パッドをボンディングする際には、前記第２のθステージ７９およびパッケージ３は、前記キャピラリー７５の垂直移動方向に対して略直角の水平状態になる。また、図３３Ｄに示すように、他端部の電極パッドをボンディングする際には、前記第２のθステージ７９およびパッケージ３は、図３３Ａに示す一端部の電極パッドをボンディングする場合とは逆方向に傾斜した状態になる。   When the bonding of the outermost electrode pad is finished, as shown in FIG. 33B, the bonding stage 73 is finished by operating the bonding stage 73, for example, by moving the second θ stage 79 in the θ3 direction of FIG. The electrode pads are sent out from the bonding position almost directly below the capillary 75, and the adjacent electrode pads are sent to the bonding position for bonding. In this way, bonding is sequentially performed from the electrode pad at one end to the electrode pad at the other end. As shown in FIG. 33C, when the center electrode pad is bonded, the second θ stage 79 and the package 3 are in a horizontal state substantially perpendicular to the vertical movement direction of the capillary 75. Also, as shown in FIG. 33D, when bonding the electrode pad at the other end, the second θ stage 79 and the package 3 are opposite to the case where the electrode pad at the one end shown in FIG. 33A is bonded. It becomes a state inclined in the direction.

上述のようにして、固体撮像素子２の長辺２ｂ側のボンディングを終了したら今度は固体撮像素子２の短辺２ｃに沿って配置された固体撮像素子側電極パッド５のボンディングを行う。短辺２ｃに沿って配置された固体撮像素子側電極パッド５のボンディングを行う場合には、前記Ｈステージ８０によって前記Ｘステージ７６，ステージ７７，第１のθステージ７８，第２のθステージ７９およびパッケージ３を９０°回転させる。そして、図３３Ｅに示すように、短辺２ｃ側の一端部の固体撮像素子側電極パッド５とパッケージ側電極パッド７を前記キャピラリー７５の略真下のボンディング位置に位置させてボンディングを行う。   As described above, when the bonding on the long side 2b side of the solid-state imaging device 2 is completed, the bonding of the solid-state imaging device-side electrode pad 5 arranged along the short side 2c of the solid-state imaging device 2 is performed. When bonding the solid-state imaging device side electrode pad 5 arranged along the short side 2c, the X stage 76, the stage 77, the first θ stage 78, and the second θ stage 79 are performed by the H stage 80. And the package 3 is rotated by 90 °. Then, as shown in FIG. 33E, bonding is performed with the solid-state imaging device side electrode pad 5 and the package side electrode pad 7 at one end on the short side 2c side positioned at a bonding position substantially directly below the capillary 75.

前記短辺２ｃ側の一端部の電極パッドのボンディングを終了したら、次に、図３３Ｆに示すように、前記ボンディングステージ７３によって一端部の電極パッドを前記ボンディング位置から送り出すと共に、隣接する電極パッドを前記ボンディング位置に送り込んでボンディングを行う。このようにして順次、固体撮像素子側電極パッド５とパッケージ側電極パッド７のボンディングを行い最終的に、図３３Ｇに示すように、他端部の固体撮像素子側電極パッド５とパッケージ側電極パッド７のボンディングを行う。前記固体撮像素子２の短辺２ｃは、湾曲しておらず、従って前記短辺２ｃに沿って形成された固体撮像素子側電極パッド５およびパッケージ側電極パッド７は、直線状に配置されているので、前記長辺２ｂ側に沿って形成された固体撮像素子側電極パッド５をボンディングする場合のように、前記第２のθステージ７９を図３０のθ３方向に円弧移動させる必要はない。   After the bonding of the electrode pad at one end on the short side 2c side is finished, as shown in FIG. 33F, the electrode pad at one end is sent out from the bonding position by the bonding stage 73, and the adjacent electrode pad is removed. Bonding is performed by feeding to the bonding position. In this way, the solid-state imaging device side electrode pad 5 and the package-side electrode pad 7 are sequentially bonded, and finally, as shown in FIG. 33G, the solid-state imaging device-side electrode pad 5 and the package-side electrode pad at the other end. 7 is bonded. The short side 2c of the solid-state image sensor 2 is not curved, and thus the solid-state image sensor side electrode pad 5 and the package side electrode pad 7 formed along the short side 2c are arranged in a straight line. Therefore, unlike the case of bonding the solid-state imaging device side electrode pad 5 formed along the long side 2b side, it is not necessary to move the second θ stage 79 in an arc in the θ3 direction of FIG.

前記固体撮像素子側電極パッド５とパッケージ側電極パッド７の全てのボンディングを終了したら、図３３Ｈに示すように、パッケージ３の開口部をカバー４で覆って個体撮像装置１が完成する。上述のように、固体撮像素子２の湾曲した長辺２ｂ側の電極パッドのボンディングを行う場合において、パッケージの角度を調整し、キャピラリーの略真下においてボンディングを行うので、ボンディング時の認識不良が無くなり、ボンディング作業を円滑、且つ確実に行うことが可能になる。なお、パッケージの角度を調整等は、制御部８４等によって自動的に行われる。   When all the bonding of the solid-state imaging element side electrode pad 5 and the package side electrode pad 7 is completed, the solid imaging device 1 is completed by covering the opening of the package 3 with the cover 4 as shown in FIG. 33H. As described above, when the electrode pad on the curved long side 2b side of the solid-state imaging device 2 is bonded, the angle of the package is adjusted and bonding is performed almost directly under the capillary, so that there is no recognition failure during bonding. The bonding operation can be performed smoothly and reliably. Note that adjustment of the angle of the package and the like is automatically performed by the control unit 84 and the like.

次に、前記第２の実施の形態の固体撮像装置（図６〜図１０参照）１０の製造方法を示す。図３４、図３５に示すように、固体撮像素子２を取付けたパッケージ３を前記ボンディング装置７１の第２のθステージ７９上に取付ける。このとき、前記固体撮像素子２の長辺２ｂを前記第２のθステージ７９の移動方向およびＹステージ７７の移動方向に揃え、短辺２ｃ側を前記第１のθステージ７８の移動方向およびＸステージ７６の移動方向に揃えた状態にする。そして、図３６Ａに示すように、前記パッケージ側電極パッド７を設けた第１の平面１１を、前記ボンディング装置７１のキャピラリー７５の略真下で、且つ該キャピラリー７５の移動方向に対して略直角のボンディング位置に位置させて、前記第１の平面１１上に設けられている複数のパッケージ側電極パッド７と、これと対を成すの固体撮像素子側電極パッド５のボンディングを行う。   Next, a manufacturing method of the solid-state imaging device (see FIGS. 6 to 10) 10 of the second embodiment will be described. As shown in FIGS. 34 and 35, the package 3 to which the solid-state image sensor 2 is attached is attached on the second θ stage 79 of the bonding apparatus 71. At this time, the long side 2b of the solid-state imaging device 2 is aligned with the moving direction of the second θ stage 79 and the moving direction of the Y stage 77, and the short side 2c side is aligned with the moving direction of the first θ stage 78 and the X direction. The stage 76 is aligned in the moving direction. Then, as shown in FIG. 36A, the first plane 11 provided with the package-side electrode pad 7 is substantially directly below the capillary 75 of the bonding apparatus 71 and substantially perpendicular to the moving direction of the capillary 75. A plurality of package-side electrode pads 7 provided on the first plane 11 and the solid-state image pickup device-side electrode pads 5 that are paired with the package-side electrode pads 7 are bonded to each other at the bonding position.

前記第１の平面１１上に設けられている電極パッドのボンディングを終了したら、図３６Ｂに示すように、前記ボンディングを終了した第１の平面１１を前記ボンディング位置から送り出すと共に、前記前記第１の平面１１に隣接する第２の平面１２を、前記ボンディング位置に送り込む。そして、前記第２の平面１２上に設けられている複数のパッケージ側電極パッド７と、これと対を成す固体撮像素子側電極パッド５のボンディングを行う。   When the bonding of the electrode pads provided on the first plane 11 is finished, as shown in FIG. 36B, the first plane 11 that has finished the bonding is sent out from the bonding position, and the first plane 11 is sent out. A second plane 12 adjacent to the plane 11 is fed to the bonding position. Then, the plurality of package-side electrode pads 7 provided on the second plane 12 are bonded to the solid-state image pickup device-side electrode pads 5 paired therewith.

前記第２の平面１２上に設けられている電極パッドのボンディングを終了したら、図３６Ｃに示すように、前記第２の平面１２を前記ボンディング位置から送り出すと共に、前記第２の平面１２に隣接する第３の平面１３を、前記ボンディング位置に送り込む。そして、前記第３の平面１３上に設けられている複数のパッケージ側電極パッド７と、これと対を成す固体撮像素子側電極パッド５のボンディングを行う。   When the bonding of the electrode pads provided on the second plane 12 is completed, the second plane 12 is sent out from the bonding position and adjacent to the second plane 12 as shown in FIG. 36C. The third plane 13 is sent to the bonding position. Then, the plurality of package-side electrode pads 7 provided on the third plane 13 are bonded to the solid-state image pickup device-side electrode pads 5 paired therewith.

前記長辺２ｂ側の電極パッドのボンディングを終了したら今度は短辺２ｃ側の電極パッドのボンディングを行う。前記短辺２ｃ側の電極パッドのボンディングを行う場合には、前記Ｈステージ８０によって前記Ｘステージ７６，ステージ７７，第１のθステージ７８，第２のθステージ７９およびパッケージ３を９０°回転させる。そして、図３６Ｄに示すように、一端部の固体撮像素子側電極パッド５とパッケージ側電極パッド７のボンディングを行う。次に、前記ボンディングを終了した固体撮像素子側電極パッド５に隣接する固体撮像素子側電極パッド５を前記Ｙステージ７７によって前記キャピラリー７５の略真下に位置させて、ボンディングを行う。このようにして順次、固体撮像素子側電極パッド５とパッケージ側電極パッド７のボンディングを行い最終的に、図３６Ｅに示すように、他端部の固体撮像素子側電極パッド５とパッケージ側電極パッド７のボンディングを行う。   When the bonding of the electrode pad on the long side 2b is completed, the bonding of the electrode pad on the short side 2c is performed. When bonding the electrode pad on the short side 2c side, the X stage 76, the stage 77, the first θ stage 78, the second θ stage 79, and the package 3 are rotated by 90 ° by the H stage 80. . Then, as shown in FIG. 36D, bonding of the solid-state imaging device side electrode pad 5 and the package side electrode pad 7 at one end is performed. Next, the solid-state image pickup device side electrode pad 5 adjacent to the solid-state image pickup device side electrode pad 5 for which the bonding has been completed is positioned by the Y stage 77 substantially directly below the capillary 75 to perform bonding. In this way, the solid-state imaging device side electrode pad 5 and the package-side electrode pad 7 are bonded in sequence, and finally, as shown in FIG. 36E, the solid-state imaging device-side electrode pad 5 and the package-side electrode pad at the other end portion. 7 is bonded.

前記固体撮像素子２の短辺２ｃは、湾曲しておらず、従って前記短辺２ｃに沿って形成された固体撮像素子側電極パッド５は、直線状に配置されているので、前記長辺２ｂ側に沿って形成された固体撮像素子側電極パッド５をボンディングする場合のように、前記第２のθステージ７９を図３０のθ３方向に移動させる必要はない。そして、前記固体撮像素子側電極パッド５とパッケージ側電極パッド６の全てのボンディングを終了したら、図３６Ｆに示すように、パッケージ３の開口部をカバー４で覆って個体撮像装置１０が完成する。特に、第２の実施の形態の個体撮像装置の製造方法においては、パッケージ側電極パッドを、前記固体撮像素子取付面に取付けられた固体撮像素子の湾曲面の接線となる複数の平面上に配置し、これら平面をキャピラリーに対して略垂直に位置させてボンディングを行うので、導体ワイヤの先端を平面状のパッケージ側電極パッドに接地できるので片当たりのない平面基板と同様の接続性の高いボンディングが可能となる。   Since the short side 2c of the solid-state image pickup device 2 is not curved, the solid-state image pickup device side electrode pad 5 formed along the short side 2c is arranged in a straight line. There is no need to move the second θ stage 79 in the θ3 direction of FIG. 30 as in the case of bonding the solid-state imaging device side electrode pad 5 formed along the side. When all the bonding of the solid-state image sensor side electrode pad 5 and the package side electrode pad 6 is completed, the opening of the package 3 is covered with the cover 4 as shown in FIG. In particular, in the method of manufacturing the solid-state imaging device according to the second embodiment, the package-side electrode pads are arranged on a plurality of planes that are tangent to the curved surface of the solid-state imaging device attached to the solid-state imaging device mounting surface. Bonding is performed with these planes positioned substantially perpendicular to the capillary, so that the tip of the conductor wire can be grounded to the planar package-side electrode pad, so that bonding with high connectivity similar to a flat substrate without contact is possible. Is possible.

次に、前記第３の実施の形態の固体撮像装置（図１１〜図１５参照）２０の製造方法を示す。図３７、図３８に示すように、固体撮像素子２を取付けたパッケージ３を前記ボンディング装置７１の第２のθステージ７９上に取付ける。このとき、前記固体撮像素子２の長辺２ｂ側を前記第２のθステージ７９の移動方向およびＹステージ７７の移動方向に揃え、短辺２ｃ側を前記第１のθステージ７８の移動方向およびＸステージ７６の移動方向に揃えた状態にする。そして、図３９Ａに示すように、前記長辺２ｂの一端部の固体撮像素子側電極パッド５を前記ボンディング装置７１のキャピラリー７５の略真下のボンディング位置に位置させて、前記最外側の固体撮像素子側電極パッド５とパッケージ側電極パッド７のボンディングを行う。   Next, a manufacturing method of the solid-state imaging device (see FIGS. 11 to 15) 20 of the third embodiment will be described. As shown in FIGS. 37 and 38, the package 3 to which the solid-state imaging device 2 is attached is attached on the second θ stage 79 of the bonding apparatus 71. At this time, the long side 2b side of the solid-state imaging device 2 is aligned with the moving direction of the second θ stage 79 and the moving direction of the Y stage 77, and the short side 2c side is aligned with the moving direction of the first θ stage 78 and The X stage 76 is aligned in the moving direction. Then, as shown in FIG. 39A, the solid-state image sensor side electrode pad 5 at one end of the long side 2b is positioned at a bonding position almost directly below the capillary 75 of the bonding apparatus 71, and the outermost solid-state image sensor. The side electrode pad 5 and the package side electrode pad 7 are bonded.

一端部の電極パッドのボンディングを終了したら、図３９Ｂに示すように、前記第２のθステージ７９を図３０のθ３方向に円弧移動させるなど前記ボンディングステージ７３を操作して、前記ボンディングを終了した一端部の電極パッドを前記キャピラリー７５の略真下のボンディング位置から送り出すと共に、隣接する電極パッドを前記キャピラリー７５の略真下のボンディング位置に送り込んでボンディングを行う。このようにして一端部の電極パッドから他端部の電極パッドに向けて順次、ボンディングを行う。図３９Ｃに示すように、中央部の電極パッドをボンディングする際には、前記第２のθステージ７９およびパッケージ３は、前記キャピラリー７５の移動方向に対して略直角の水平状態になる。また、図３９Ｄに示すように、他端部の電極パッドをボンディングする際には、前記第２のθステージ７９およびパッケージ３は、図３９Ａに示す一端部の電極パッドをボンディングする場合とは逆方向に傾斜した状態になる。   When the bonding of the electrode pad at one end is finished, as shown in FIG. 39B, the bonding stage 73 is operated by moving the second θ stage 79 in the θ3 direction of FIG. Bonding is performed by feeding the electrode pad at one end from the bonding position almost directly below the capillary 75 and feeding the adjacent electrode pad to the bonding position almost directly below the capillary 75. In this way, bonding is sequentially performed from the electrode pad at one end to the electrode pad at the other end. As shown in FIG. 39C, when the center electrode pad is bonded, the second θ stage 79 and the package 3 are in a horizontal state substantially perpendicular to the moving direction of the capillary 75. Also, as shown in FIG. 39D, when bonding the electrode pad at the other end, the second θ stage 79 and the package 3 are opposite to the case of bonding the electrode pad at one end shown in FIG. 39A. It becomes a state inclined in the direction.

上述のようにして、固体撮像素子２の長辺２ｂ側の電極パッドのボンディングを終了したら、今度は固体撮像素子２の短辺２ｃに沿って形成された固体撮像素子側電極パッド５のボンディングを行う。短辺２ｃに沿って形成された固体撮像素子側電極パッド５のボンディングを行う場合には、前記Ｈステージ８０によって前記Ｘステージ７６，ステージ７７，第１のθステージ７８，第２のθステージ７９およびパッケージ３を９０°回転させる。そして、図３９Ｅに示すように、一端側の最外側の固体撮像素子側電極パッド５とパッケージ側電極パッド７を前記キャピラリー７５の略真下のボンディング位置に位置させてボンディングを行う。短辺２ｃ側の一端部の電極パッドのボンディングを終了したら、図３９Ｆに示すように、前記第１のθステージ７９を図３０のθ２方向に円弧移動させるなどして、前記ボンディングを終了した一端部の電極パッドを前記キャピラリー７５の略真下のボンディング位置から送り出すと共に、隣接する電極パッドを前記キャピラリー７５の略真下のボンディング位置に送り込んでボンディングを行う。このようにして一端部の電極パッドから他端部の電極パッドに向けて順次、ボンディングを行う。図３９Ｇに示すように、中央部の電極パッドをボンディングする際には、前記第２のθステージ７９およびパッケージ３は、前記キャピラリー７５の移動方向に対して略直角の水平状態になる。また、図３９Ｈに示すように、他端部の電極パッドをボンディングする際には、前記第２のθステージ７９およびパッケージ３は、図３９Ａに示す一端部の電極パッドをボンディングする場合とは逆方向に傾斜した状態になる。そして、前記固体撮像素子側電極パッド５とパッケージ側電極パッド７の全てのボンディングを終了したらパッケージ３の開口部をカバー４で覆って個体撮像装置１が完成する。
（４）他の実施の形態、
前記実施の形態においては、固体撮像装置および固体撮像装置の製造方法を例にとって説明したが、本発明は個体撮像装置および固体撮像装置の製造方法に限定されるものではなく、湾曲可能な薄板状の電子部品を、部品ホルダの円筒面状および球面状に沿わせて非平面形状に取付け、前記電子部品の周縁部に配置された電子部品側電極パッドと、前記部品ホルダに設けた部品ホルダ側電極パッドと、を導体ワイヤで接続してなる電子部品組付体、例えば電子部品を搭載したフレキシブルプリント基板をシャーシに設けた円筒面状の電子部品取付面上に取付け、前記フレキシブルプリント基板側の電極パッドと、基板ホルダ側の電極パッドと、を導体ワイヤで接続してなる電子部品組付体や電子部品の取付け方法にも適用される。また、マイクロレンズの形成された半導体イメージセンサを、そのまま撮像装置を構成するプリント基板に取付ける場合等にも本発明は適用される。 When the bonding of the electrode pad on the long side 2b side of the solid-state imaging device 2 is finished as described above, the bonding of the solid-state imaging device-side electrode pad 5 formed along the short side 2c of the solid-state imaging device 2 is now performed. Do. When bonding the solid-state imaging device side electrode pad 5 formed along the short side 2c, the X stage 76, the stage 77, the first θ stage 78, and the second θ stage 79 are performed by the H stage 80. And the package 3 is rotated by 90 °. Then, as shown in FIG. 39E, bonding is performed by positioning the outermost solid-state imaging element side electrode pad 5 and the package side electrode pad 7 on one end side at a bonding position almost directly below the capillary 75. When the bonding of the electrode pad at one end on the short side 2c side is completed, as shown in FIG. 39F, the first θ stage 79 is moved in an arc in the θ2 direction in FIG. Bonding is performed by feeding the electrode pads of the portion from the bonding position almost directly below the capillary 75 and feeding the adjacent electrode pads to the bonding position substantially directly below the capillary 75. In this way, bonding is sequentially performed from the electrode pad at one end to the electrode pad at the other end. As shown in FIG. 39G, when the central electrode pad is bonded, the second θ stage 79 and the package 3 are in a horizontal state substantially perpendicular to the moving direction of the capillary 75. Further, as shown in FIG. 39H, when bonding the electrode pad at the other end, the second θ stage 79 and the package 3 are opposite to the case of bonding the electrode pad at one end shown in FIG. 39A. It becomes a state inclined in the direction. When all the bonding of the solid-state image sensor side electrode pad 5 and the package side electrode pad 7 is completed, the opening of the package 3 is covered with the cover 4 to complete the solid-state imaging device 1.
(4) Other embodiments,
In the above embodiment, the solid-state imaging device and the manufacturing method of the solid-state imaging device have been described as an example. However, the present invention is not limited to the individual imaging device and the manufacturing method of the solid-state imaging device, and is a thin plate that can be bent. Are mounted in a non-planar shape along the cylindrical surface and spherical surface of the component holder, and the electronic component side electrode pads disposed on the peripheral edge of the electronic component, and the component holder side provided in the component holder An electronic component assembly formed by connecting electrode pads to each other with a conductor wire, for example, a flexible printed circuit board on which electronic components are mounted is mounted on a cylindrical electronic component mounting surface provided on a chassis, and the flexible printed circuit board side The present invention is also applicable to an electronic component assembly or an electronic component mounting method in which an electrode pad and an electrode pad on the substrate holder side are connected by a conductor wire. The present invention is also applied to a case where a semiconductor image sensor on which a microlens is formed is directly attached to a printed circuit board constituting an imaging device.

また、前記実施の形態においては、固体撮像素子を円筒面状および球面状に湾曲させる場合を示したが、円筒面状および球面状に湾曲させるものに限らず、広く非平面形状に湾曲させる場合に適用される。   In the above-described embodiment, the solid-state imaging device has been curved into a cylindrical surface and a spherical surface. Applies to

第１の実施の形態の個体撮像装置の斜視図。1 is a perspective view of an individual imaging apparatus according to a first embodiment. 第１の実施の形態の個体撮像装置の平面図。The top view of the individual imaging device of a 1st embodiment. 図２のａ−ａ断面図。FIG. 3 is a sectional view taken along the line aa in FIG. 図２のｂ−ｂ断面図。Bb sectional drawing of FIG. 図２のｃ−ｃ断面図。Cc sectional drawing of FIG. 第２の実施の形態の個体撮像装置の斜視図。The perspective view of the solid imaging device of a 2nd embodiment. 第２の実施の形態の個体撮像装置の平面図。The top view of the solid-state imaging device of 2nd Embodiment. 図７のａ−ａ断面図。Aa sectional drawing of FIG. 図７のｂ−ｂ断面図。Bb sectional drawing of FIG. 図７のｃ−ｃ断面図。Cc sectional drawing of FIG. 第３の実施の形態の個体撮像装置の斜視図。The perspective view of the solid imaging device of a 3rd embodiment. 第３の実施の形態の個体撮像装置の平面図。The top view of the solid-state imaging device of 3rd Embodiment. 図１２のａ−ａ断面図。FIG. 13 is a sectional view taken along line aa in FIG. 12. 図１２のｂ−ｂ断面図。Bb sectional drawing of FIG. 図１２のｃ−ｃ断面図。Cc sectional drawing of FIG. 第４の実施の形態の個体撮像装置の斜視図。The perspective view of the solid imaging device of a 4th embodiment. 第４の実施の形態の個体撮像装置の平面図。The top view of the solid-state imaging device of 4th Embodiment. 図１７のａ−ａ断面図。FIG. 18 is a cross-sectional view taken along the line aa in FIG. 17. 図１７のｂ−ｂ断面図。Bb sectional drawing of FIG. 図１７のｃ−ｃ断面図。Cc sectional drawing of FIG. 第５の実施の形態の個体撮像装置の斜視図。The perspective view of the solid imaging device of a 5th embodiment. 第５の実施の形態の個体撮像装置の平面図。The top view of the solid-state imaging device of 5th Embodiment. 図２２のａ−ａ断面図。FIG. 23 is a cross-sectional view taken along the line aa in FIG. 22. コレットの先端部の斜視図。The perspective view of the front-end | tip part of a collet. コレットの先端部の断面図。Sectional drawing of the front-end | tip part of a collet. Ａ、Ｂ、Ｃは、固体撮像素子の搭載方法の一例を示す工程図。A, B, and C are process drawings showing an example of a mounting method of a solid-state imaging device. Ａ、Ｂ、Ｃ、Ｄ、Ｅ、Ｆ、Ｇは、固体撮像素子の搭載方法の他の例を示す工程図。A, B, C, D, E, F, and G are process drawings showing another example of a method for mounting a solid-state imaging device. Ａ、Ｂ、Ｃ、Ｄは、コレットの固体撮像素子吸着面の曲率Ｒｃ、仮搭載台座の曲率をＲｄ、パッケージの固体撮像素子取付面の曲率Ｒｐ等の値の一例を示す説明図。A, B, C, and D are explanatory diagrams showing examples of values such as the curvature Rc of the solid-state image pickup device adsorption surface of the collet, Rd the curvature of the temporary mounting base, and the curvature Rp of the solid-state image pickup device mounting surface of the package. コレットの変形例を示す断面図。Sectional drawing which shows the modification of a collet. ボンディング装置にボンディングする前の第１の実施の形態の固体撮像装置をパッケージを取付けた状態の斜視図。The perspective view of the state which attached the package to the solid-state imaging device of 1st Embodiment before bonding to a bonding apparatus. Ａ、Ｂ、Ｃ、Ｄ、Ｅは、ボンディング装置によるボンディング工程を示す説明図。A, B, C, D, E is explanatory drawing which shows the bonding process by a bonding apparatus. ボンディングする前の第１の実施の形態の固体撮像装置の斜視図。The perspective view of the solid-state imaging device of 1st Embodiment before bonding. Ａ、Ｂ、Ｃ、Ｄ、Ｅ、Ｆ、Ｇ、Ｈは、固体撮像装置の製造工程図。A, B, C, D, E, F, G, and H are manufacturing process diagrams of the solid-state imaging device. ボンディング装置にボンディングする前の第２の実施の形態の固体撮像装置を取付けた状態の斜視図。The perspective view of the state which attached the solid-state imaging device of 2nd Embodiment before bonding to a bonding apparatus. ボンディングする前の第２の実施の形態の固体撮像装置の斜視図。The perspective view of the solid-state imaging device of 2nd Embodiment before bonding. Ａ、Ｂ、Ｃ、Ｄ、Ｅ、Ｆは、固体撮像装置の製造工程図。A, B, C, D, E, and F are manufacturing process diagrams of a solid-state imaging device. ボンディング装置にボンディングする前の第８の実施の形態の固体撮像装置を取付けた状態の斜視図。The perspective view of the state which attached the solid-state imaging device of 8th Embodiment before bonding to a bonding apparatus. ボンディングする前の第３の実施の形態の固体撮像装置の斜視図。The perspective view of the solid-state imaging device of 3rd Embodiment before bonding. Ａ、Ｂ、Ｃ、Ｄ、Ｅ、Ｆ、Ｈは、固体撮像装置の製造工程図。A, B, C, D, E, F, and H are manufacturing process diagrams of the solid-state imaging device. 従来例の平面図。The top view of a prior art example. 従来例の断面図。Sectional drawing of a prior art example.

符号の説明Explanation of symbols

１、１０、２０、３０、４０…固体撮像装置、２…固体撮像素子、３…パッケージ、３ａ…固体撮像素子取付面、４…透明のカバー、５…固体撮像素子側電極パッド、６…パッケージ側電極パッド形成面、７…パッケージ側電極パッド、８…導体ワイヤ、４１…台座。


DESCRIPTION OF SYMBOLS 1, 10, 20, 30, 40 ... Solid-state imaging device, 2 ... Solid-state image sensor, 3 ... Package, 3a ... Solid-state image sensor mounting surface, 4 ... Transparent cover, 5 ... Solid-state image sensor side electrode pad, 6 ... Package Side electrode pad forming surface, 7... Package side electrode pad, 8... Conductor wire, 41.


Claims (14)

湾曲可能な薄板状の電子部品と、該電子部品を非平面形状の電子部品取付面に沿わせて非平面形状に取付ける部品ホルダと、を備え、前記電子部品の周縁部に配置された電子部品側電極パッドを、前記部品ホルダの前記電子部品取付面よりも外側に位置する部品ホルダ側電極パッド形成面上に形成された部品ホルダ側電極パッドに、導体ワイヤで接続してなる電子部品組付体において、
部品ホルダ側電極パッド形成面は、前記電子部品取付面の端部を延長させることにより該電子部品取付面の端部と略平行な非平面形状に形成されていることを特徴とする電子部品組付体。 A thin plate-shaped electronic component that can be bent, and a component holder that mounts the electronic component in a non-planar shape along a non-planar shape of the electronic component mounting surface, and the electronic component disposed at a peripheral portion of the electronic component Assembling an electronic component by connecting a side electrode pad to a component holder side electrode pad formed on a component holder side electrode pad forming surface located outside the electronic component mounting surface of the component holder with a conductor wire In the body,
The component holder side electrode pad forming surface is formed in a non-planar shape substantially parallel to the end of the electronic component mounting surface by extending the end of the electronic component mounting surface. Incident body. 前記電子部品組付体は、固体撮像装置であり、前記部品ホルダは、パッケージであり、前記薄板状の部品は、固体撮像素子であることを特徴とする請求項１に記載の電子部品組付体。 The electronic component assembly according to claim 1, wherein the electronic component assembly is a solid-state imaging device, the component holder is a package, and the thin plate-shaped component is a solid-state imaging device. body. 湾曲可能な薄板状の固体撮像素子と、該固体撮像素子を非平面形状の固体撮像素子取付面上に該固体撮像素子取付面に沿って非平面形状に取付けるパッケージと、を備え、前記薄板状の固体撮像素子の周縁部に沿って設けた複数の固体撮像素子側の電極パッドを、前記パッケージの前記固体撮像素子取付面の外側に位置する電極パッド取付面に形成したパッケージ側電極パッドに、導体ワイヤで接続してなる固体撮像装置において、
前記パッケージの電極パッド取付面は、前記固体撮像素子取付面を外側に延ばすことにより該固体撮像素子取付面と略面一に形成されていることを特徴とする固体撮像装置。 A thin plate-shaped solid-state image sensor that can be bent, and a package for mounting the solid-state image sensor on a non-planar solid-state image sensor mounting surface in a non-planar shape along the solid-state image sensor mounting surface. A plurality of solid-state image sensor side electrode pads provided along the peripheral edge of the solid-state image sensor on a package-side electrode pad formed on an electrode pad mounting surface located outside the solid-state image sensor mounting surface of the package; In a solid-state imaging device formed by connecting with a conductor wire,
An electrode pad mounting surface of the package is formed to be substantially flush with the solid-state image sensor mounting surface by extending the solid-state image sensor mounting surface to the outside. 前記パッケージの固体撮像素子取付面は、円筒面状に湾曲形成され、前記パッケージ側電極パッド形成面は、前記円筒面状に湾曲形成された固体撮像素子取付面の外側に連続する円筒面状に湾曲形成されていることを特徴とする請求項３に記載の固体撮像装置。 The solid-state image sensor mounting surface of the package is curved and formed into a cylindrical surface, and the package-side electrode pad forming surface is formed into a cylindrical surface continuous to the outside of the solid-state image sensor mounting surface curved and formed into the cylindrical surface. The solid-state imaging device according to claim 3, wherein the solid-state imaging device is curved. 前記パッケージの固体撮像素子取付面は、円筒面状に湾曲形成され、前記パッケージ側電極パッド形成面のうち前記固体撮像素子の湾曲した辺の外側に位置する部分が前記固体撮像素子取付面に取付けられた固体撮像素子の湾曲面の接線と平行となる複数の平面で構成されていることを特徴とする請求項３に記載の固体撮像装置。 The solid-state image sensor mounting surface of the package is curved and formed into a cylindrical surface, and a portion of the package-side electrode pad forming surface located outside the curved side of the solid-state image sensor is mounted on the solid-state image sensor mounting surface. The solid-state imaging device according to claim 3, wherein the solid-state imaging device includes a plurality of planes parallel to a tangent to a curved surface of the solid-state imaging device. 前記パッケージの固体撮像素子取付面は、球面状に湾曲形成され、前記パッケージ側電極パッド形成面は、前記球面状に湾曲形成されている固体撮像素子取付面の外側に連続する球面状に湾曲形成されていることを特徴とする請求項３に記載の固体撮像装置。 The solid-state image sensor mounting surface of the package is curved and formed into a spherical shape, and the package-side electrode pad forming surface is curved into a spherical shape that is continuous with the outside of the solid-state image sensor mounting surface that is curved into the spherical shape. The solid-state imaging device according to claim 3, wherein the solid-state imaging device is provided. 前記パッケージの固体撮像素子取付面は、固体撮像素子の撮像画素エリアに対応する部分が円筒面状に湾曲形成され、他の部分はフラット面に形成されていることを特徴とする請求項３に記載の固体撮像装置。 4. The solid-state image sensor mounting surface of the package is formed such that a portion corresponding to the imaging pixel area of the solid-state image sensor is curved in a cylindrical surface, and the other portion is formed in a flat surface. The solid-state imaging device described. 前記パッケージの固体撮像素子取付面および前記パッケージ側電極パッド形成面は、前記パッケージの内面に取付けられた台座に設けられていることを特徴とする請求項３に記載の固体撮像装置。 The solid-state imaging device according to claim 3, wherein the solid-state imaging device mounting surface and the package-side electrode pad forming surface of the package are provided on a pedestal attached to the inner surface of the package. 固体撮像素子を固体撮像素子吸着面に吸着してパッケージの円筒面状に湾曲した固体撮像素子取付面に組付ける組付け治具であって、
前記固体撮像素子吸着面は、前記パッケージの固体撮像素子取付面に倣う円筒面状に膨出形成されていることを特徴とする組付け治具。 An assembly jig for assembling the solid-state image sensor on the solid-state image sensor attachment surface curved to the cylindrical surface of the package by adsorbing the solid-state image sensor to the solid-state image sensor adsorption surface,
The assembly jig according to claim 1, wherein the solid-state image pickup device suction surface is formed to bulge in a cylindrical shape following the solid-state image pickup device mounting surface of the package. 前記固体撮像素子吸着面は、その中央部に前記固体撮像素子の撮像画素部を収容する画素部収納凹部と、該画素部収納凹部内に開口して前記平板状の固体撮像素子を吸着する真空吸引孔と、を備え、該画素部収納凹部の外側部に前記平板状の固体撮像素子を吸着して前記固体撮像素子吸着面に沿わせて前記平板状の固体撮像素子を湾曲させた状態に吸着維持する真空吸引孔と、を備えていることを特徴とする請求項９に記載の組付け治具。 The solid-state image pickup device suction surface has a pixel portion storage recess for storing the image pickup pixel portion of the solid-state image pickup device at a central portion thereof, and a vacuum that opens into the pixel portion storage recess and sucks the flat solid-state image pickup device. A suction hole, and the flat solid-state image sensor is adsorbed on the outer side of the pixel unit storage recess and the flat solid-state image sensor is curved along the solid-state image sensor adsorbing surface. The assembly jig according to claim 9, further comprising a vacuum suction hole for maintaining adsorption. 湾曲可能な薄板状の固体撮像素子をパッケージの非平面形状の固体撮像素子取付面に沿わせて取付け、前記固体撮像素子の周縁部に沿って配置した複数の固体撮像素子側電極パッドを、前記パッケージの前記固体撮像素子取付面よりも外側に位置するパッケージ側電極パッド形成面上に形成したパッケージ側電極パッドに、導体ワイヤで接続することにより構成される固体撮像装置の製造方法であって、
互いに接続する固体撮像素子側電極パッドとパッケージ側電極パッドの位置を前記ボンディング装置のキャピラリーに対して略垂直のボンディング位置に来るように前記パッケージ角度を調整して前記ボンディング装置で前記固体撮像素子側電極パッドとパッケージ側電極パッドを接続することを特徴とする固体撮像装置の製造方法。 A plurality of solid-state image sensor side electrode pads arranged along a peripheral edge of the solid-state image sensor, wherein a bendable thin plate-shaped solid-state image sensor is attached along a non-planar solid-state image sensor attachment surface of the package, A manufacturing method of a solid-state imaging device configured by connecting with a conductor-side wire to a package-side electrode pad formed on a package-side electrode pad forming surface located outside the solid-state imaging element mounting surface of the package,
The package angle is adjusted so that the positions of the solid-state imaging element side electrode pad and the package-side electrode pad connected to each other are at a bonding position substantially perpendicular to the capillary of the bonding apparatus, and the solid-state imaging element side is adjusted by the bonding apparatus. A method of manufacturing a solid-state imaging device, comprising connecting an electrode pad and a package-side electrode pad. 前記パッケージの固体撮像素子取付面を、円筒面状に湾曲形成すると共に、前記パッケージ側電極パッド形成面を、前記円筒面状に湾曲形成された固体撮像素子取付面の外側に連続させて円筒面状に湾曲形成し、前記パッケージを前記湾曲面の曲率に沿って回動変位させて、互いに接続する固体撮像素子側電極パッドとパッケージ側電極パッドを前記ボンディング装置のキャピラリーに対して略垂直のボンディング位置に送り込むことを特徴とする請求項１１に記載の固体撮像装置の製造方法。 The solid-state image sensor mounting surface of the package is curved and formed into a cylindrical surface, and the package-side electrode pad forming surface is continuously formed outside the solid-state image sensor mounting surface that is curved and formed into a cylindrical surface. The solid-state imaging element side electrode pad and the package side electrode pad that are connected to each other are bonded substantially perpendicularly to the capillary of the bonding apparatus by bending the package along the curvature of the curved surface. The solid-state imaging device manufacturing method according to claim 11, wherein the solid-state imaging device is fed to a position. 前記固体撮像素子取付面を、円筒面状に湾曲形成し、前記パッケージ側電極パッド形成面のうちの前記円筒面状の固体撮像素子取付面のうちの湾曲した長辺の外側に位置する長辺側の電極パッド形成面を、前記固体撮像素子取付面に取付けられた固体撮像素子の湾曲面の接線となる複数の平面で構成し、これら複数の平面を、前記ボンディング装置のキャピラリーに対して略垂直のボンディング位置に送り込むことを特徴とする請求項１１に記載の固体撮像装置の製造方法。 The solid-state image sensor mounting surface is curvedly formed into a cylindrical surface, and the long side located outside the curved long side of the cylindrical surface-shaped solid-state image sensor mounting surface of the package-side electrode pad forming surface The electrode pad forming surface on the side is composed of a plurality of planes that are tangent to the curved surface of the solid-state image sensor attached to the solid-state image sensor mounting surface, and the plurality of planes are approximately with respect to the capillary of the bonding apparatus. 12. The method of manufacturing a solid-state imaging device according to claim 11, wherein the solid-state imaging device is fed to a vertical bonding position. 湾曲可能な薄板状の電子部品を部品ホルダの非平面形状の電子部品取付面に沿わせて取付け、前記電子部品の周縁部に沿って形成した複数の電子部品側電極パッドを、前記部品ホルダの前記電子部品取付面よりも外側に位置する部品ホルダ側電極パッド形成面上に形成した部品ホルダ側電極パッドに、導体ワイヤで接続することにより構成される電子部品の組立て方法において、
互いに接続する電子部品側電極パッドと部品ホルダ側電極パッドを前記ボンディング装置のキャピラリーに対して略垂直のボンディング位置に送り込むことを特徴とする電子部品の組立て方法。

A bendable thin plate-shaped electronic component is mounted along the non-planar shape electronic component mounting surface of the component holder, and a plurality of electronic component side electrode pads formed along the peripheral edge of the electronic component are attached to the component holder. In the method of assembling an electronic component configured by connecting with a conductor wire to a component holder side electrode pad formed on a component holder side electrode pad forming surface located outside the electronic component mounting surface,
An electronic component assembling method, wherein the electronic component side electrode pad and the component holder side electrode pad connected to each other are sent to a bonding position substantially perpendicular to the capillary of the bonding apparatus.

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