KR102295405B1 - Ultrasonic bonding head, ultrasonic bonding device, and ultrasonic bonding method - Google Patents

Abstract

It is to provide an ultrasonic bonding head, an ultrasonic bonding apparatus, and an ultrasonic bonding method capable of good ultrasonic bonding while reducing the size of the apparatus.
The vibrator unit 50 in which the pressing portion 52a pressed against the joint to be joined portion is formed on the tip side of the longitudinal axis, and the vibrator unit 50 along the longitudinal axis so that the tip of the vibrator unit 50 becomes the free end, the vibrator unit ( The holding part 60 for holding the proximal end in a cantilever beam shape along the longitudinal axis of 50, and the holding part 62 so that the vibrator unit 50 moves along a vertical axis approximately perpendicular to the longitudinal axis, is connected to the pressing part ( 52a) is an ultrasonic bonding head 40 having a pressing shaft 80 that transmits a pressing force against the bonding scheduled portion. Abutting the vibrator unit 50 at a reaction force dispersion position on the way from the main holding position where the holding portion 60 holds the vibrator unit 50 toward the free end of the vibrator unit 50 along the longitudinal axis X A restraining part 90 is provided in the holding part 60 .

Description

Ultrasonic bonding head, ultrasonic bonding apparatus, and ultrasonic bonding method

The present invention relates to an ultrasonic bonding head, an ultrasonic bonding apparatus, and an ultrasonic bonding method.

For example, the ultrasonic bonding apparatus shown in patent document 1 is known. In this ultrasonic bonding apparatus, both sides in the longitudinal direction of the ultrasonic horn are held, and the pressing portions provided in the central portion of the horn are pressed against the joining scheduled portion to perform ultrasonic bonding.

In such a conventional ultrasonic bonding apparatus, in order to increase the ultrasonic vibration of the pressing part, it is necessary to increase the length of the ultrasonic horn, and there is a problem that the entire apparatus becomes large. Further, since the holding portions of the ultrasonic horn are provided on both sides, there is a possibility that ultrasonic vibration is inhibited by these holding portions.

Moreover, although ultrasonic bonding of the wiring of the glass substrate used as a display screen board|substrate to a flexible wiring board (FPC) etc. has been examined, in the conventional ultrasonic bonding apparatus, since both sides of an ultrasonic horn are held, the apparatus becomes too large and is not practical. .

Japanese Patent Laid-Open No. 2002-222834

The present invention is made in view of such a reality, and an object thereof is to provide an ultrasonic bonding head, an ultrasonic bonding apparatus, and an ultrasonic bonding method capable of excellent ultrasonic bonding while reducing the size of the apparatus.

In order to achieve the above object, an ultrasonic bonding head according to a first aspect of the present invention comprises: a vibrator unit in which a pressing portion pressed against a portion to be bonded to be bonded is formed on the tip side of a longitudinal axis;

a holding part for holding the proximal end side of the vibrator unit in a cantilever beam shape along the longitudinal axis of the vibrator unit so that the front end of the vibrator unit becomes a free end along the longitudinal axis;

An ultrasonic bonding head having a pressing shaft connected to the holding portion so that the vibrator unit moves along a vertical axis substantially perpendicular to the longitudinal axis and transmitting a force pressing the pressing portion against the bonding scheduled portion,

The holding part is provided with a restraining part which abuts against the vibrator unit at a reaction force dispersion position on the way from the main holding position where the holding part holds the vibrator unit to the free end of the vibrator unit along the longitudinal axis.

In the ultrasonic bonding head according to the present invention, since the holding part holds the vibrator unit including the ultrasonic horn in the form of a cantilever beam at the proximal end along the longitudinal axis, the ultrasonic vibration in the pressing part can be increased, and the vibrator unit Compared with the case of holding on both sides, it is possible to reduce the size of the device.

Moreover, in the ultrasonic bonding head of this invention, the holding part is provided with the holding|maintenance part which abuts against the vibrator unit at the reaction force dispersion position on the way toward the free end of the vibrator unit along the longitudinal axis. For this reason, it becomes possible for the suppression part to receive a part of the reaction force of the pressing force with which the pressing part provided in the free end of the vibrator unit is pressed against the joining schedule part, and the bending deformation of the vibrator unit is suppressed. As a result, the pressing force by the pressing shaft can be increased, and the pressure from the pressing portion to the bonding scheduled portion is increased, and good ultrasonic bonding is attained. Moreover, it becomes possible to make the width|variety of a joining part wide, and it becomes easy also to ultrasonically join flat members.

Preferably, at the position of the vibration node closest to the free end of the vibrator unit, the restraining portion is attached to the holding portion so that the restraining portion abuts against the vibrator unit. By configuring in this way, the reaction force of the pressing force that can be received by the suppressor increases, and the bending deformation of the vibrator unit is effectively suppressed. As a result, the pressing force by the pressing shaft can be increased, the pressure from the pressing portion to the bonding scheduled portion is increased, and the reliability of ultrasonic bonding is improved. Moreover, it becomes possible to make the width|variety of a joining part wider, and ultrasonic bonding of plate-shaped members also becomes further easy.

Moreover, when the suppression unit abuts against the vibrator unit at the position of the vibration node (the position at which the amplitude of vibration is the smallest), the suppression unit inhibits ultrasonic vibration in the vibrator unit rarely.

Preferably, the position at which the suppressing part abuts against the vibrator unit and the position at which the pressing part abuts against the joint scheduled portion differ along the longitudinal axis and are located on opposite sides of the longitudinal axis. The suppression unit is brought into contact with the vibrator unit within a necessary minimum range so as to suppress the bending of the vibrator unit by receiving a reaction force from the pressing unit, so that the suppression unit inhibits ultrasonic vibration in the vibrator unit is further reduced.

The holding portion preferably holds the entire perimeter of the vibrator unit in the main holding position, but it is preferable that the suppression portion is in contact with only a part of the entire perimeter of the vibrator unit in a small area.

Preferably, the axial center of the pressing shaft is substantially parallel to the vertical axis, and the pressing shaft is connected to the holding portion so as to be located between the main holding position and the reaction force dispersing position. By configuring in this way, the pressing force from the pressing shaft is effectively transmitted to the pressing unit, the pressure applied from the pressing unit to the bonding scheduled portion can be increased, and the reliability of ultrasonic bonding is improved.

Preferably, in the vibrator unit, a vibration source is attached to the vibrator unit so that the pressing unit vibrates ultrasonically in a direction parallel to the longitudinal axis. When the pressing unit ultrasonically vibrates in a direction parallel to the longitudinal axis, ultrasonic bonding of fine metal patterns to each other along the direction parallel to the longitudinal axis is facilitated.

Preferably, the surface of the restraining portion abutting against the vibrator unit is subjected to a low friction treatment for improving the relative movement along the longitudinal axis. By configuring in this way, the case where the suppressor inhibits the ultrasonic vibration in the vibrator unit is further reduced.

The holding unit may further include an auxiliary holding unit that holds a cover covering the vibration source of the vibrator unit at a different holding position along the longitudinal axis from the main holding position.

An ultrasonic bonding head according to a second aspect of the present invention,

a vibrator unit in which a pressing portion pressed against a portion to be joined to be joined is formed on the tip side of the longitudinal axis;

a holding part for holding the proximal end side of the vibrator unit in a cantilever beam shape along the longitudinal axis of the vibrator unit so that the front end of the vibrator unit becomes a free end along the longitudinal axis;

An ultrasonic bonding head having a pressing shaft connected to the holding portion so that the vibrator unit moves along a vertical axis substantially perpendicular to the longitudinal axis and transmitting a force pressing the pressing portion against the bonding scheduled portion,

A position where the holding part mainly holds the vibrator unit is a main holding position,

When the position where the suppression part provided in the holding part abuts against the vibrator unit is a reaction force dispersion position,

Along the longitudinal axis of the vibrator unit, the main holding position and the reaction force dispersion position are arranged in this order from the tip to the base end of the vibrator unit.

Also in the ultrasonic bonding head according to the second aspect of the present invention, since the holding part holds the vibrator unit including the ultrasonic horn in the form of a cantilever beam with the proximal end along the longitudinal axis, it is possible to increase the ultrasonic vibration in the pressing part, and , compared to the case where the vibrator unit is held on both sides, the device can be downsized.

In addition, in the ultrasonic bonding head of the present invention, the holding portion mainly holds the vibrator unit at the main holding position, and the holding unit is provided with the holding unit with the suppression portion abutting against the vibrator unit at the reaction force dispersion position. For this reason, it becomes possible for the suppression part to receive a part of the reaction force of the pressing force with which the pressing part provided in the free end of the vibrator unit is pressed against the joining schedule part, and the bending deformation of the vibrator unit is suppressed. As a result, the pressing force by the pressing shaft can be increased, the pressure from the pressing portion to the bonding scheduled portion is increased, and good ultrasonic bonding is attained. Moreover, it becomes possible to make the width|variety of a joining part wide, and it becomes easy also to ultrasonically join flat members.

The ultrasonic bonding apparatus which concerns on this invention has the ultrasonic head in any one of the above.

Although the ultrasonic bonding apparatus which concerns on this invention does not necessarily require a stage, it may have a general stage, or may further have a special stage in which the 1st planar member and 2nd planar member to be joined are provided.

The stage is

a lower surface on which the first planar member is installed;

a high-side surface on which the second planar member is installed, the high-side surface being elevated by a predetermined step height with respect to the low-side surface;

You may have a stepped wall surface positioned at a boundary between the lower surface and the upper surface.

In order to perform ultrasonic bonding of the first planar member and the second planar member, first, a first planar member is provided on the lower surface such that an end of the first planar member is aligned with the stepped wall surface. Next, a second planar member is installed on the upper surface such that a laminated portion is formed in which at least a portion of the second planar member is laminated on the first planar member. After that, when the pressing portion of the ultrasonic horn is pressed against the laminated portion at a position corresponding to the stepped wall surface, the ultrasonic bonding is completed.

When the stage surface has a stepped wall surface, alignment of the first planar member and the second planar member is facilitated by using the stepped wall surface, and ultrasonic bonding between these wiring patterns becomes possible. Therefore, even when the wiring pitch interval is narrow, for example, about several tens of micrometers or less, it becomes easy to achieve electrical connection between the planar members without causing short circuit failure or the like.

Moreover, in recent years, as a display screen of a smart phone etc. is requested|required, since a wide display screen is requested|required close to the external size of a device, the joining length between wiring patterns cannot but be shortened, and the connection reliability has become a problem. ADVANTAGE OF THE INVENTION According to the apparatus of this invention, solid-state bonding of metals becomes possible by ultrasonic bonding, and the reliability of connection also improves.

Further, when the stage surface has a stepped wall surface, even when the width of the lamination portion of the first planar member and the second planar member is wide, for example, 60 mm or more, the wiring patterns can be reliably bonded by ultrasonic waves.

The stage is

first fixing means for removably fixing said first planar member to said lower surface so that an end of said first planar member is positioned in contact with said stepped wall surface;

You may further have second fixing means for removably fixing the second planar member to the upper surface such that at least a portion of the second planar member is laminated on the first planar member.

Although it does not specifically limit as a 1st fixing means, For example, the some 1st adsorption|suction hole formed in the lower side surface of the stage is illustrated. By introducing a negative pressure into the plurality of first suction holes, the first planar member can be removably fixed to the lower surface. Similarly, the second fixing means is not particularly limited, and for example, a plurality of second suction holes formed on the high-end surface of the stage are exemplified. By introducing a negative pressure into the plurality of second suction holes, the second planar member can be removably fixed to the upper surface.

The height of the step may be equal to or less than the thickness of the first planar member. With this configuration, even if there is a manufacturing error of the stage, the case where the upper surface of the first planar member is lowered with respect to the upper surface is eliminated, and the upper surface of the first planar member is not level with the upper surface or slightly upward. will protrude into Therefore, in the case where the second planar member is provided on the upper surface, the first planar member and the second planar member always come into contact with each other at their lamination portions (overlapping portions). Therefore, it becomes possible to perform ultrasonic bonding reliably, and the reliability of a connection part improves further.

An ultrasonic bonding method according to a first aspect of the present invention is characterized in that a portion to be joined is ultrasonically joined using the ultrasonic bonding head according to any one of the above.

An ultrasonic bonding method according to a second aspect of the present invention,

maintaining the proximal end side of the vibrator unit in a cantilever beam shape along the longitudinal axis of the vibrator unit so that the front end of the vibrator unit becomes a free end along the longitudinal axis;

An ultrasonic bonding method comprising the step of pressing a pressing portion provided at the tip of the vibrator unit against a bonding scheduled portion to be bonded, and causing the pressing portion to ultrasonically vibrate in the longitudinal axis direction, the method comprising:

A position where the holding part mainly holds the vibrator unit is a main holding position,

When the position where the suppression part provided in the holding part abuts against the vibrator unit is a reaction force dispersion position,

In the vibrator unit, there are two or more vibration nodes along the longitudinal axis, and the main holding position and the reaction force distribution position are aligned with different positions of the vibration nodes.

In the ultrasonic bonding method according to the first and second aspects of the present invention, in the vibrator unit including the ultrasonic horn, the holding part holds the proximal end side along the longitudinal axis in a cantilever beam shape, so that the ultrasonic vibration in the pressing part can be increased. In addition, compared to the case where the vibrator unit is held on both sides, it is possible to reduce the size of the device.

Moreover, in the ultrasonic bonding method of this invention, the holding part is provided with the suppression part which abuts against the vibrator unit at the reaction force dispersion position. For this reason, it becomes possible for the suppression part to receive a part of the reaction force of the pressing force with which the pressing part provided in the free end of the vibrator unit is pressed against the joining schedule part, and the bending deformation of the vibrator unit is suppressed. As a result, the pressing force by the pressing shaft can be increased, the pressure from the pressing portion to the bonding scheduled portion is increased, and good ultrasonic bonding is attained. Moreover, it becomes possible to make the width|variety of a joining part wide, and it becomes easy also to ultrasonically join flat members.

In particular, since the main holding position and the reaction force dispersion position are positioned at different positions of the vibration nodes, the possibility that ultrasonic vibration in the vibrator unit is inhibited by the holding of the holding unit in the main holding position is reduced. , the possibility that the suppressor inhibits the ultrasonic vibration in the vibrator unit is reduced.

1A is a schematic perspective view of an ultrasonic bonding head according to an embodiment of the present invention;
It is a schematic diagram which shows the relationship between the front view of the ultrasonic bonding head shown in FIG. 1A, and a vibration node.
Fig. 1C is a rear view of the ultrasonic bonding head shown in Fig. 1B.
Fig. 1D is a plan view of the ultrasonic bonding head shown in Fig. 1B.
Fig. 1E is a bottom view of the ultrasonic bonding head shown in Fig. 1B.
Fig. 1F is a left side view of the ultrasonic bonding head shown in Fig. 1B.
Fig. 1G is a right side view of the ultrasonic bonding head shown in Fig. 1B.
Fig. 1H is a front view of the ultrasonic vibrator unit shown in Fig. 1A.
Fig. 1I is a rear view of the ultrasonic vibrator unit shown in Fig. 1H;
Fig. 1J is a plan view of the ultrasonic vibrator unit shown in Fig. 1H.
Fig. 1K is a bottom view of the ultrasonic vibrator unit shown in Fig. 1H.
Fig. 1L is a left side view of the ultrasonic vibrator unit shown in Fig. 1H.
Fig. 1M is a right side view of the ultrasonic vibrator unit shown in Fig. 1H.
Fig. 2A is an overall configuration diagram of an ultrasonic bonding apparatus including the ultrasonic bonding head shown in Fig. 1A.
It is a schematic diagram which shows one process of the ultrasonic bonding method using the ultrasonic bonding apparatus shown in FIG. 2A.
Fig. 3 is a schematic diagram showing a continuation of Fig. 2;
Fig. 4 is a schematic diagram showing a continuation of Fig. 3;
Fig. 5a is a schematic diagram showing a continuation of Fig. 4;
Fig. 5b is a schematic diagram showing a continuation of Fig. 5a;
It is a schematic diagram which shows the modified example of the ultrasonic bonding head shown to FIG. 1B.

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated based on embodiment shown to drawing.

first embodiment

The ultrasonic bonding head 40 is demonstrated based on FIG. 1A - FIG. 1M. The ultrasonic bonding head 40 of this embodiment is connected to the holding part 60, the ultrasonic vibrator unit 50, the holding part 60 which holds the ultrasonic vibrator unit 50, and the holding part 60 and It has a pressing shaft 80 for moving the ultrasonic vibrator unit 50 in the Z-axis direction.

1H to 1M , the vibrator unit 50 has an ultrasonic horn 52 , a booster 54 , and a vibration source cover 56 , which are connected in this order along the X axis. A vibration source (not shown) is housed inside the vibration source cover 56 . Although it does not specifically limit as a vibration source, For example, a piezoelectric element is illustrated.

Although the vibration source is positioned and fixed inside the vibration source cover 56, it is not directly fixed to the auxiliary holding part 70 (refer FIG. 1A) mentioned later. The vibration source vibrates with electric power, and in order to supply electric power to the vibration source, a cable 58 protrudes from the rear end of the vibration cover 56 in the X-axis direction.

As shown in FIG. 1A , a booster 54 is fixedly connected to the front of the vibration source housed in the vibration source cover 56 in the X-axis direction (the front end direction of the ultrasonic horn 52 ). As the booster 54, a general booster used for an ultrasonic bonding apparatus is used, and extends in the X-axis direction. The vibration source and the booster 54 are connected by screwing, for example.

An ultrasonic horn 52 is fixedly connected to the tip of the booster 54 in the X-axis direction. The connection between the booster 54 and the ultrasonic horn 52 is performed by the same means as the connection between the vibration source and the booster 54 . In this embodiment, the booster 54 has a cylindrical shaft shape whose outer diameter changes along the axial direction.

The ultrasonic horn 52 has a special prismatic shape elongated in the axial direction, and at its tip in the X-axis direction, at the lower end in the Z-axis direction, is a pressing part that protrudes in the Z-axis direction and extends linearly in the Y-axis direction. (52a) is formed. The width of the pressing portion 52a in the Y-axis direction is determined according to the width of the bonding scheduled portion to be ultrasonically joined in the Y-axis direction, and the like. The width X2 in the X-axis direction of the pressing portion 52a shown in Fig. 5A is determined depending on the width of the bonding scheduled portion in the X-axis direction, etc. as described later, and is not particularly limited, but in this embodiment it is 0.2 ~2.0mm.

As shown in FIG. 1B , the vibration source accommodated inside the vibration source cover 56 is configured to vibrate in the X-axis direction, and the vibration is amplified by the booster 54 and the ultrasonic horn 52 ), and is configured to increase the amplitude in the pressing unit 52a. The vibrator unit 50 composed of the ultrasonic horn 52, the booster 54 and the vibration source has their central axis (longitudinal axis) X0, and vibrates along the longitudinal axis X0 (parallel to the X axis), , where the amplitude V of the vibration (standing wave) is large (double the vibration) and where the amplitude V becomes the minimum (0) (vibration node). In this embodiment, as shown in figure, the vibration node has at least two along the longitudinal axis X0.

The vibrator unit 50 is held at the main holding position P3 by the holding part 60 so that the tip (pressing part 52a side) along the longitudinal axis X0 becomes a free end (end capable of free movement). has been maintained The main holding position P3 is in the middle position of the booster 54 in the present embodiment, and is located at a position of a vibration node closer to the vibration source than the tip of the ultrasonic horn 52 .

At the rear end along the longitudinal axis X0 of the holding unit 60, an auxiliary holding unit 70 is connected by a bolt or the like, and the auxiliary holding unit 70 is a vibration source cover 56 at the floating position P4. ) is maintained. The floating position P4 is preferably at the position of the vibration node located closest to the vibration source, but it is not necessarily at the position of the vibration node. This is because, although the auxiliary holding part 70 holds the vibration cover 56 at the floating position P4, it does not hold the vibration source itself.

In this embodiment, the lower end of the tip of the ultrasonic horn 52 serves as the pressing portion 52a. The pressing part 52a is a vibration source in the vibrator unit 50 so as to be located at the tip position P1 of the ship of the vibration where the amplitude V of the vibration vibrating with ultrasonic waves in a direction parallel to X0 is maximized. is fitted

In this embodiment, from the main holding position (load point of the pressing force) P3 at which the holding part 60 holds the booster 54 of the vibrator unit 50, the vibrator unit 50 along the longitudinal axis X0. At the reaction force dispersion position (support point) P2 on the way toward the free end (tip position P1 / action point) of 90) is provided in the holding part (60).

The axial center Z0 of the pressure shaft 80 is substantially parallel to the vertical Z axis, and is positioned between the main holding position P3 and the reaction force distribution position P2. ) is connected to the holding unit 60 through the. The pressing shaft 80 is connected to the holding part 60 so that the vibrator unit 50 moves along the Z-axis, which is a vertical axis approximately perpendicular to the longitudinal axis X0, and connects the pressing part 52a to the bonding scheduled part (FIG. 1B). It is designed to transmit the pressing force to the ).

In the present embodiment, at the reaction force dispersion position P2 of the vibration node closest to the free end of the vibrator unit 50 , the abutting portion 92 of the restraining pin 90 is the ultrasonic horn 52 of the vibrator unit 50 . ), a restraining pin 90 is attached to the holding portion 60 . The position P2 at which the restraining pin 90 abuts against the vibrator unit 50 and the position P1 at which the pressing portion 52a abuts against the joint scheduled portion differ along the longitudinal axis X0 and along the Z axis. Located on opposite sides of the longitudinal axis (X0).

In the present embodiment, on the surface of the abutting portion 92 of the restraining pin 90 abutting against the ultrasonic horn 52 of the vibrator unit, the horn 52 along the longitudinal axis X0 and the abutting portion 92 have A low-friction treatment is applied to improve relative movement. Although it does not specifically limit as a low friction process, For example, it is conceivable to comprise the contact part 92 with low friction members, such as a fluororesin. Further, on the surface of the abutting portion 92, a low-friction member such as paraffin wax or lead may be applied or formed, or a method such as attaching a fluororesin tape may be used.

Although the size of the abutting portion 92 of the restraining pin 90 is not particularly limited, it is a sufficient size to receive a reaction force from the tip position P1 applied to the reaction force dispersion position P2, and to reduce frictional force. It is desirable to be as small as possible for The width of the abutting portion 92 in the Y-axis direction is equal to or smaller than the width of the ultrasonic horn 52 in the Y-axis direction, and is preferably smaller from the viewpoint of not inhibiting the vibration of the horn. In addition, the width in the X-axis direction of the abutting portion 92 is equal to or smaller than the length in the X-axis direction of the ultrasonic horn 52, and is preferably smaller from the viewpoint of not inhibiting vibration of the horn. Although the outer diameter of the restraining pin 90 may be smaller than the outer diameter of the abutting part 92, it is preferable that it is a size enough to receive a reaction force.

As shown in Fig. 1A, the holding unit 60 has an upper holding unit 62 and a lower holding unit 63, and these are connected to each other with bolts or the like at the main holding position P3 shown in Fig. 1B. The booster 54 of the vibrator unit 50 is held around its entire circumference. In addition, the upper holding part 62 and the lower holding part 64 of the holding part 60 are in contact with the booster 54 with a predetermined width in the X-axis direction, but a cover is formed on the outer periphery of the booster 54 , And, since the holding part 60 holds the outer periphery of the cover, the holding part 60 holds the booster 54 substantially at the position of the main holding position P3.

A pressure transmission block 63 extending along the X-axis in the tip direction of the ultrasonic horn 52 and covering the upper Z-axis of the ultrasonic horn 52 is integrally formed on the upper holding part 62 . The pressure transmission block 63 does not come into contact with the ultrasonic horn 52 except for the suppression pin 90 . A fixed plate 82 is fixed to the upper surface of the pressure transmission block 63 , and the pressure shaft 80 is fixed to the holding unit 60 through the fixed plate 82 .

To the upper holding part 62 of the holding part 60, an attachment flange 73 integrally formed with the upper holding part 72 of the auxiliary holding part 70 is fixed with a bolt or the like, and the upper holding part ( 72 is combined with the lower holding part 74 to hold the outer periphery of the vibration source cover 56 at the floating holding position P4 shown in FIG. 1B .

In the ultrasonic bonding head 40 according to the present embodiment, the holder 60 holds the vibrator unit 50 including the ultrasonic horn 52 in the form of a cantilever beam at the proximal end along the longitudinal axis X0. , the ultrasonic vibration in the pressing unit 52a can be increased, and the device including the head 40 can be downsized compared to the case where the vibrator unit 50 is held on both sides.

Moreover, in the ultrasonic bonding head 40 of this embodiment, the suppression pin which abuts against the vibrator unit 50 at the reaction force dispersion position P2 on the way toward the free end of the vibrator unit 50 along the longitudinal axis X0. A 90 is provided in the holding part 60 . For this reason, it becomes possible to receive a part of the reaction force of the pressing force by which the pressing part 52a provided at the free end of the vibrator unit 50 is pressed against the joining scheduled part with the suppression pin 90, and the vibrator unit 50 ) is suppressed. As a result, the pressing force by the pressing shaft 80 can be increased, the pressure to the bonding scheduled portion in the pressing portion 52a is increased, and good ultrasonic bonding is attained. Moreover, it becomes possible to make the width|variety in the Y-axis direction of a joining part wide, and it becomes easy also to ultrasonically join flat members.

Further, at the position P2 of the vibration node closest to the free end of the vibrator unit 50 , the suppression pin 90 is attached to the holding part 60 so that the suppression pin 90 abuts against the vibrator unit 50 . has been By configuring in this way, the reaction force of the pressing force that can be received by the suppression pin 90 increases, and the bending deformation of the vibrator unit 50 is effectively suppressed. As a result, the pressing force by the pressing shaft 80 can be increased, the pressure to the bonding scheduled portion in the pressing portion 52a is increased, and the reliability of ultrasonic bonding is improved. Moreover, it becomes possible to make the width|variety of the Y-axis direction of a joining part wider, and ultrasonic bonding of flat members also becomes further easy.

In addition, at the position of the vibration node (the position where the amplitude of vibration is the smallest) P2, the suppression pin 90 abuts against the vibrator unit 50, thereby suppressing the ultrasonic vibration in the vibrator unit 50. 90) is rarely inhibited.

In addition, the position P2 at which the suppression pin 90 abuts against the vibrator unit 50 and the position P1 at which the pressing part 52a abuts against the joint scheduled portion differ along the longitudinal axis X0, and Z They are located on opposite sides of the longitudinal axis X0 along the axis. The suppression pin 90 is brought into contact with the vibrator unit 50 within a necessary minimum range so as to receive a reaction force from the pressing part 52a and suppress the bending of the vibrator unit 50 , The case where the contact portion 92 of the suppression pin 90 inhibits the ultrasonic vibration is further reduced.

In addition, the axial center Z0 of the pressure shaft 80 is substantially parallel to the Z axis, and the pressure shaft 80 is positioned between the main holding position P3 and the reaction force dispersion position P2. is connected to By configuring in this way, the pressing force from the pressing shaft 80 is effectively transmitted to the pressing portion 52a, the pressure applied from the pressing portion 52a to the bonding scheduled portion can be increased, and the reliability of ultrasonic bonding is improved.

Further, in the vibrator unit 50 , a vibration source is attached to the vibrator unit 50 so that the pressing portion 52a vibrates ultrasonically in a direction parallel to the longitudinal axis X0. When the pressing portion 52a ultrasonically vibrates in a direction parallel to the longitudinal axis X0, ultrasonic bonding between fine metal patterns is facilitated along a direction parallel to the longitudinal axis X0.

Although the ultrasonic bonding head 40 which concerns on this embodiment does not necessarily require a stage, it may have a general stage, or, as shown in 3rd Embodiment mentioned later, the 1st planar member to be joined, and You may further have a special stage in which the 2nd planar member is provided.

The ultrasonic bonding method which concerns on this embodiment uses said ultrasonic bonding head 40 and ultrasonically joins a bonding schedule part. Specifically, in the ultrasonic bonding method of the present embodiment, the proximal end side along the longitudinal axis X0 of the vibrator unit 50 is a cantilever so that the front end of the vibrator unit 50 becomes a free end along the longitudinal axis X0. It has a process of maintaining the beam shape. Next, the pressing part 52a provided at the front-end|tip of the vibrator unit 50 is pressed against the bonding schedule part to be joined, and the said pressing part 52a is made to ultrasonically vibrate in the longitudinal axis X0 direction.

And, the position where the holding part 60 mainly holds the vibrator unit 50 is the main holding position P3, and the suppression pin 90 provided in the holding part 60 is in contact with the vibrator unit 50 . When the position is the reaction force distribution position P2, in the vibrator unit 50, there are two or more vibration nodes along the longitudinal axis X0, and the main holding position P3 and the reaction force distribution position P2 are They are positioned at the positions of different vibration nodes.

In the ultrasonic bonding method according to the present embodiment, since the holding part 60 holds the vibrator unit 50 including the ultrasonic horn 52 in a cantilever beam shape with the proximal end side along the longitudinal axis X0, the pressing part The ultrasonic vibration at (52a) can be increased, and the device can be downsized compared to the case where the vibrator unit 50 is held on both sides.

In addition, since the main holding position P3 and the reaction force dispersion position P2 are positioned at different vibration node positions, the ultrasonic vibration in the vibrator unit 50 is maintained at the main holding position P3. While the possibility of being inhibited by holding the part 60 decreases, the possibility that the suppression pin 90 inhibits the ultrasonic vibration in the vibrator unit 50 decreases.

second embodiment

In the ultrasonic bonding head according to the second embodiment, the main holding position P3 and the reaction force dispersion position P2 shown in FIG. 1B are those shown in FIG. 6 with respect to the ultrasonic bonding head 40 according to the first embodiment. Similarly, it is the same as that of the first embodiment except that it is opposite to each other along the X axis. That is, along the longitudinal axis X0 of the vibrator unit 50, the main holding position P3 and the reaction force dispersion position P2 are arranged in this order from the front end of the vibrator unit 50 toward the base end.

In the main holding position P3 , the holding part 60 holds the vibrator unit 50 , and in the reaction force dispersion position P2 , the restraining pin 90 abuts against a part of the outer periphery of the vibrator unit 50 . . The position where the suppression pin 90 abuts may be the ultrasonic horn 52 or the booster 54 . Moreover, the holding part 60 may hold|maintain the ultrasonic horn 52, and may hold|maintain the booster 54.

Also in the ultrasonic bonding head 50 according to the second embodiment, the holding unit 60 holds the vibrator unit 50 including the ultrasonic horn 52 in the form of a cantilever beam at the proximal end along the longitudinal axis X0. Therefore, the ultrasonic vibration in the pressing part 52a can be increased, and the size of the device can be reduced compared to the case where the vibrator unit 50 is held on both sides.

third embodiment

In the third embodiment, the ultrasonic bonding shown in Fig. 2A with the ultrasonic bonding head 40 according to one embodiment of the present invention shown in Figs. 1A to 1G equipped with the vibrator unit 50 shown in Figs. 1H to 1M is mounted. The method of performing the ultrasonic bonding method shown to FIG. 2B - FIG. 5B using the apparatus 2, and manufacturing the board|substrate bonding body 8 shown to FIG. 5B is demonstrated.

As shown in FIG. 5B , the substrate assembly 8 includes an electronic control substrate 4 as a first planar member and a flexible substrate 6 as a second planar member. The electronic control board 4 may be, for example, a liquid crystal display panel, an organic EL display panel, or another display panel, and may include, for example, a glass substrate.

The flexible substrate 6 is a substrate for supplying certain signals and electric power to the electronic control substrate 4 , and includes a wiring pattern 4a of the electronic control substrate 4 and a wiring pattern 6a of the flexible substrate 6 . ) is electrically connected to each pattern.

In addition, in the substrate bonding body 8 shown in FIG. 5B , after the wiring pattern 4a and the wiring pattern 6a are ultrasonically bonded, the flexible substrate 6 is disposed on the wiring pattern 4a side of the electronic control board 4 . It is bent from the edge part of the back surface side, and is accommodated in the inside of the casing of a smartphone, for example. By configuring in this way, the entire surface close to the external size of the casing can be used as the display screen of the electronic control board 4 .

From this point of view, the overlapping width x1 of the wiring pattern 4a and the wiring pattern 6a in the X-axis direction (see FIG. 5A ) is, for example, 0.5 mm or less, preferably 0.2 mm or less, and is as small as possible. it is required to do Further, with the finer screen display, the wiring pitch interval in the Y-axis direction of the wiring pattern 4a and the wiring pattern 6a has become smaller, for example, by several tens of micrometers or less, preferably about 20 micrometers or less. In addition, in the figure, although the thickness of the board|substrate 6 is drawn with the thickness of about the same thickness as the board|substrate 4, in reality, the thickness of the board|substrate 6 is small compared with the thickness of the board|substrate 4, It is the same even if it is opposite. may be

In this embodiment, in order to electrically connect the wiring pattern 4a of the electronic control board 4 and the wiring pattern 6a of the flexible substrate 6 for each pattern, the ultrasonic bonding apparatus 2 shown to FIG. 2A is shown. is using

As shown in FIG. 2A , the ultrasonic bonding apparatus 2 of the present embodiment includes a stage 10 on which an electronic control substrate 4 to be bonded and a flexible substrate 6 are provided, and an electronic control substrate 4 , An ultrasonic bonding head 40 having an ultrasonic vibrator unit 50 having a pressing portion 52a pressed against the laminated portion of the full flexible substrate 6 is provided. Although the ultrasonic bonding head 40 is the same head 40 as 1st Embodiment, you may use another ultrasonic bonding head.

In the upper part of the Z-axis direction of the stage 10, the conveyance head 20 is arrange|positioned so that relative movement is possible with respect to the stage 10 in the X-axis, Y-axis, and Z-axis directions. Moreover, in the upper part of the Z-axis direction of the stage 10, the camera 30 is relative to the stage 10 at least in the X-axis and Y-axis directions so that the position in the Z-axis direction with the transfer head 20 shifts. It is movably arranged. In addition, similarly to the conveyance head 20, the camera 30 may also be arrange|positioned so that relative movement is possible with respect to the Z-axis direction with respect to the stage 10.

Moreover, the ultrasonic bonding head 40 is a position which does not collide with the conveyance head 20 and the camera 30, and is arrange|positioned so that relative movement is possible with respect to the stage 10 in the X-axis, Y-axis, and Z-axis direction. Relative movement means that one side may move with respect to the other side, the other side may move with respect to the other side, or one side and the other side may move with each other, and the relative position of one side and the other side changes. .

Control of the relative movement mechanism of the stage 10, the ultrasonic bonding head 40, the adsorption|suction head 20, and the camera 30 is performed by the control means which is not shown in figure. The control means may also serve as the control apparatus of the apparatus 2, and may also perform image processing of the image acquired with the camera 30, and negative pressure control of the suction holes 11, 12, 14 mentioned later. The control means may be a dedicated control circuit or may be constituted by a general-purpose computer having a control program.

Also in the drawing, the X axis, the Y axis and the Z axis are substantially perpendicular to each other, the Z axis coincides with the height direction of the device 2 , and the X axis is the longitudinal direction of the electronic control board 4 or the flexible substrate 6 . , and the Y axis coincides with the width direction of the electronic control board 4 or the flexible board 6 . Further, the X axis and the Y axis are substantially parallel to the display surface of the electronic control board 4 .

On the Z-axis upper surface of the stage 10, at least the lower surface 10a on which the electronic control board 4 is installed, and the upper surface 10a at a high position with a predetermined step height z1 with respect to the lower surface 10a. A surface 10b and a stepped wall surface 10c located at the boundary between the lower surface 10a and the upper surface 10b are formed. The lower surface 10a and the upper surface 10b are each approximately parallel to the X-Y axis plane, and the stepped wall surface 10c is approximately parallel to the Z-Y axis plane, respectively.

On the lower surface 10a, the flexible substrate 6 is temporarily installed away from the bonding position 10a1 where the electronic control board 4 is installed and the bonding position 10a1 in the X-axis direction (or the Y-axis direction). A standby position 10a2 is formed. A plurality of first suction holes 12 formed inside the stage 10 are opened in the lower surface 10a located at the bonding position 10a1 . In addition, a plurality of air adsorption holes 11 formed inside the stage 10 are opened in the lower surface 10a located at the standby position 10a2 .

When the negative pressure acts on the first suction hole 12 , the electronic control board 4 mounted at the bonding position 10a1 is detachably attracted to the lower surface 10a at the bonding position 10a1 . can be fixed temporarily. At the bonding position 10a1 , the electronic control board 4 has a wiring pattern of the substrate 4 so that the connection scheduled portion of the wiring pattern 4a formed on the substrate 4 faces upward in the Z-axis direction. It is arrange|positioned so that the edge part on the side of the connection scheduled part of (4a) may collide with (contact) the stepped wall surface 10c. As a means for arranging the electronic control board 4 at the above-mentioned predetermined position on the lower surface 10a at the bonding position 10a1, for example, the suction head 20 shown in Fig. 2A may be used, or , you may use a suction head different from this.

In addition, when the negative pressure acts on the atmospheric suction hole 11, the flexible substrate 6 placed in the standby position 10a2 can be detachably adsorbed and temporarily fixed to the lower surface 10a in the standby position 10a2. . In the standby position 10a2 , the flexible substrate 6 has a wiring pattern ( 6a) is disposed so that the end on the side of the connection scheduled portion faces the opposite side of the electronic control board 4 in the X-axis direction. As a means for arranging the flexible substrate 6 at the above-mentioned predetermined position on the lower surface 10a in the standby position 10a2, for example, the suction head 20 shown in Fig. 2A is used.

In the present embodiment, the step height Z1 of the stepped wall surface 10c is equal to or less than the thickness t0 of the electronic control board 4, and the difference t0-z1 is preferably 0 to It is 20 micrometers, More preferably, it is 10-20 micrometers.

In the upper surface 10b of the stage 10, a plurality of second suction holes 14 formed in the interior of the stage 10 are opened in the vicinity of the stepped wall surface 10c. As a result of negative pressure acting on the second suction hole 14, as shown in FIG. 4, the flexible substrate 6 placed on the high-side surface 10b is moved near the stepped wall surface 10c to the high-side surface 10b. It can be adsorbed and temporarily fixed in a removable manner. As a means for arranging the flexible substrate 6 on the high-side surface 10a near the stepped wall surface 10c, for example, the suction head 20 is used.

Next, the ultrasonic bonding method using the ultrasonic bonding apparatus 2 shown to FIG. 2A is demonstrated. As shown in FIG. 2B , first, the negative pressure of the atmospheric suction hole 11 opened in the lower surface 10a of the standby position 10a2 is released, and the suction head 20 releases the negative pressure in the standby position 10a2. Lift the flexible substrate 6 located in the upper part in the Z-axis direction. The adsorption head 20 has a mechanism for adsorbing and holding the substrate 6 on the lower surface of the head by, for example, a suction force.

Thereafter, as shown in FIG. 3 , the suction head 20 is moved together with the substrate 6 in the X-axis direction with respect to the stage 10 . Further, the stage 10 may be moved in the X-axis direction. The suction head 20 is moved relative to the stage 10 in the X-axis direction so that the substrate 6 held by the suction head 20 is positioned on the high-side surface 10b close to the stepped wall surface 10c. do. The movement control is performed by the control means.

Further, between the wiring pattern 4a and the wiring pattern 6a so that the connection scheduled portion of the wiring pattern 6a of the substrate 6 is accurately aligned with the connection scheduled portion of the wiring pattern 4a of the substrate 4 . The camera 30 enters the , and the positional relationship of these is imaged, and these image processing is performed by a control means. Based on the image processing result, the control means controls the suction head ( 20) relative to the stage 10 in the X-axis and Y-axis directions. Moreover, as needed, a control means may control a movement mechanism, and you may make the adsorption|suction head 20 also rotationally move with respect to the stage 10 about the axial center of an adsorption|suction head.

Next, the camera 30 moves from between the board|substrate 6 and the stage 10 in the X-axis direction, and retracts to the position which does not impair the movement of the Z-axis direction of the suction head 20. As shown in FIG. Thereafter, as shown in FIG. 4 , the suction head 20 approaches the high-side surface 10b of the stage 10 , releases the suction holding onto the substrate 6 , and moves the substrate 6 to the high-side surface 10b. It is placed on the surface 10b. At the same time, a negative pressure acts on the second adsorption hole 14 to adsorb and hold the substrate 6 on the upper surface 10b. In that state, the lower surface of the end portion in the X-axis direction of the substrate 6 and the upper surface of the end portion in the X-axis direction of the substrate 4 overlap, and a laminated portion is formed at a position corresponding to the stepped wall surface 10c. In the laminated portion, the bonding scheduled portion of the wiring pattern 4a and the bonding scheduled portion of the wiring pattern 6a face each other.

Next, as shown in FIG. 5A , the stage 10 is relatively moved in the X-axis direction with respect to the suction head 20 and the camera 30, and the pressing unit 52a of the ultrasonic vibrator unit 50 is The wiring patterns 6a and 4a are placed at a position directly above the Z-axis direction of the stacked portion. In addition, with respect to the stepped wall surface 10c of the stage 10, the pressing portion 52a of the ultrasonic vibrator unit 50 is located on the lower surface 10a within a predetermined range x3 in the X-axis direction, The relative movement of the stage 10 and the ultrasonic vibrator unit 50 on the X-axis is controlled in advance.

That is, the pressing portion 52a of the ultrasonic vibrator unit 50 is controlled by the movement mechanism by the control means so as to press the laminated portion located on the lower surface 10a within a predetermined range x3 from the stepped wall surface 10c. do. In addition, it is preferable that the predetermined range (x3) is larger than 0 and smaller than the X-axis direction length (x1) of a lamination|stacking part. That is, it is controlled so that the pressing portion 52a does not press the surface of the substrate 6 located on the upper surface 10b.

The length (x1) in the X-axis direction of the laminated portion also coincides with the overlapping length of the connection scheduled portions of the wiring patterns 4a and 6a, and is, for example, 0.5 mm or less, preferably 0.2 mm or less, and is required to be as small as possible. is becoming In addition, the length (x2) in the X-axis direction of the pressing portion 52a for pressing the overlapping portion (laminated portion) of the substrates 4 and 6 is preferably equal to or greater than the X-axis direction length (x1) of the laminated portion, The difference in length (x2-x1) is preferably 0 or more and 0.5 mm, more preferably 0.01 to 0.08 mm.

Next, as shown in FIGS. 5A to 5B, the ultrasonic vibrator unit 50 is relatively moved downward in the Z-axis direction with respect to the stage 10, and the pressing part 52a of the ultrasonic vibrator unit 50 is moved, Pressing against the laminated portion of the substrates 4 and 6, a pressing force in the Z-axis direction and ultrasonic vibration in the X-axis direction are applied to the laminated portion. As a result, the metals of the wiring patterns 4a and 6a of the laminated portion which are long in the X-axis direction and are arranged at predetermined pitch intervals in the Y-axis direction are solid-phase bonded by ultrasonic waves.

The metal constituting the wiring patterns 4a and 6a is not particularly limited as long as it is a metal (including an alloy) capable of ultrasonic bonding, but silver, gold, aluminum, or an alloy containing these as a main component, etc. are exemplified. Moreover, the antioxidant film which has titanium etc. as a main component may be formed in the surface of these metals (especially the surface of aluminum).

In the manufacturing method (including the ultrasonic bonding method) of the substrate bonding body 8 which concerns on this embodiment, since there is a stepped wall surface 10c on the surface of the stage 10, this stepped wall surface 10c is used for electron Positioning of the control board 4 and the flexible board 6 becomes easy, and the ultrasonic bonding of these wiring patterns 4a, 6a becomes possible. Therefore, it is easy to achieve electrical connection between the electronic control board 4 and the flexible board 6 without causing a short circuit defect etc. becomes In addition, it is preferable that the direction of the vibration of an ultrasonic wave is not a lamination|stacking direction (Z-axis direction) of a lamination|stacking part, but a direction along the longitudinal direction of the wiring patterns 4a, 6a to be joined.

In recent years, as a display screen of a smartphone or the like, a wide display screen close to the outer casing size of the device is required. Reliability has been an issue. According to the method of this embodiment, solid-state bonding of metals becomes possible by ultrasonic bonding, and the reliability of connection also improves.

In addition, in the method for manufacturing the substrate assembly of the present embodiment, since the stepped wall surface 10c is provided on the surface of the stage 10, the width in the Y-axis direction of the stacked portion of the electronic control substrate 4 and the flexible substrate 6 is , for example, even when the width is 60 mm or more, it is possible to reliably bond the wiring patterns to each other by ultrasonic waves.

Further, in the present embodiment, the pressing portion 52a of the ultrasonic vibrator unit 50 uses the moving mechanism as a control means to press the laminated portion located on the lower surface 10a within a predetermined range from the stepped wall surface 10c. Controlled. It is preferable that the pressing portion 52a of the ultrasonic vibrator unit 50 does not press the flexible substrate 6 positioned on the upper surface 10b, and it is preferable that only the laminated portion is pressed for ultrasonic bonding. By configuring in this way, the reliability of ultrasonic bonding between the wiring patterns 4a and 6a is further improved without causing disconnection or the like of the wiring patterns.

other Variant

In addition, the present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the present invention.

For example, the electronic control substrate 4 may be not only a rigid substrate made of a glass substrate but also a flexible substrate having flexibility.

Moreover, although the flexible board|substrate 6 is used as a 2nd planar member in embodiment mentioned above, it is not specifically limited.

Moreover, in this invention, as a bonding schedule part, it is possible to apply not only to the bonding schedule part between board|substrates but to ultrasonic bonding of bonding schedule parts other than a board|substrate. As bonding other than a board|substrate, it is applicable also to bonding of semiconductor elements, such as a COMS sensor, a CCD sensor, and LED. In addition, the ultrasonic bonding head and ultrasonic bonding apparatus of the present invention are particularly effective when used for bonding substrates to each other. This is because, when bonding substrates, there is a request such as widening the area width to be bonded. Conventionally, the device tends to be large. However, according to the present invention, good ultrasonic bonding can be achieved while reducing the size of the device. Because.

Further, in the above-described embodiment, the stage 10 having the stepped wall surface 10c is used as the stage, but a general stage without the stepped wall surface may be used. Moreover, according to the ultrasonic bonding head of this invention, there is not necessarily a need for a stage.

Moreover, in the above-mentioned embodiment, although the holding|maintenance part 60 holds the booster 54, it may hold|maintain the vibration node part of the ultrasonic horn 52. As shown in FIG. In addition, the suppression pin 60 may be in contact with the booster 54 instead of the ultrasonic horn 52 . Further, the vibrator unit may be other than a combination of the ultrasonic horn 52 , the booster 54 , and the vibration source, for example, a vibrator unit without the booster 54 may be used.

2: Ultrasonic bonding device
4: Electronic control board (first planar member)
4a: wiring pattern
6: flexible substrate (second planar member)
6a: wiring pattern
8: substrate assembly
10 : Stage
10a: lower surface
10a1: junction position
10a2: Standby position
10b: high-side surface
10c: step wall
11: atmosphere adsorption hole
12: first adsorption hole
14: second adsorption hole
20: transfer head
30 : camera
40: ultrasonic bonding head
50: ultrasonic vibrator unit
52: ultrasonic horn
52a: pressing part
54 : booster
56: vibration source cover
58: cable
60: holding part
62: upper holding part
63 pressure transmission block
64: lower holding part
70: auxiliary maintenance part
72: upper holding part
73: flange for attachment
74: lower holding part
80: pressurized shaft
82: fixed board
90: suppression pin (repression part)
92: abutting part

Claims (11)

a vibrator unit in which a pressing portion pressed against a portion to be joined to be joined is formed on the tip side of the longitudinal axis;
a holding part for holding the proximal end side of the vibrator unit in a cantilever shape along the longitudinal axis of the vibrator unit so that the front end of the vibrator unit becomes a free end along the longitudinal axis;
An ultrasonic bonding head having a pressing shaft that is connected to the holding part so that the vibrator unit moves along a vertical axis perpendicular to the longitudinal axis and transmits a force to press the pressing part against the bonding scheduled part,
In a reaction force dispersion position located on the longitudinal axis, a restraining portion in contact with the vibrator unit is provided in the holding unit, and the reaction force dispersion position includes a main holding position in which the holding unit holds the vibrator unit and the vibrator unit. is located between the free ends of
The holding unit further has an auxiliary holding unit for holding a cover covering the vibration source of the vibrator unit at a different holding position along the longitudinal axis than the main holding position,
The reaction force distribution position is disposed at a position of a vibration node closest to the free end of the vibrator unit,
The floating position is disposed at the position of the vibration node located closest to the vibration source,
and the main holding position is disposed at a position of a vibration node located between the reaction force dispersion position and the floating position. The method according to claim 1,
and the suppression portion is attached to the holding portion so that the suppression portion abuts against the vibrator unit at a position of the vibration node closest to the free end of the vibrator unit. The method according to claim 1 or 2,
The position at which the suppression portion abuts against the vibrator unit and the position at which the pressing unit abuts against the joint scheduled portion differ along the longitudinal axis and are located on opposite sides of the longitudinal axis. The method according to claim 1 or 2,
An axial center of the pressure shaft is parallel to the vertical axis, and the pressure shaft is connected to the holding unit so as to be located between the main holding position and the reaction force dispersion position. The method according to claim 1 or 2,
wherein the vibrator unit has a vibration source attached to the vibrator unit so that the pressing unit vibrates ultrasonically in a direction parallel to the longitudinal axis. The method according to claim 1 or 2,
An ultrasonic bonding head, wherein a low friction treatment for improving relative movement along the longitudinal axis is applied to a surface of the restraining portion abutting the vibrator unit. delete a vibrator unit in which a pressing portion pressed against a portion to be joined to be joined is formed on the tip side of the longitudinal axis;
a holding part for holding the proximal end side of the vibrator unit in a cantilever shape along the longitudinal axis of the vibrator unit so that the front end of the vibrator unit becomes a free end along the longitudinal axis;
An ultrasonic bonding head having a pressing shaft that is connected to the holding part so that the vibrator unit moves along a vertical axis perpendicular to the longitudinal axis and transmits a force to press the pressing part against the bonding scheduled part,
A position at which the holding part holds the vibrator unit is a main holding position,
A position where the suppression part provided in the holding part abuts against the vibrator unit is a reaction force dispersion position,
When the holding unit sets the position of the auxiliary holding unit for holding the cover covering the vibration source of the vibrator unit as the holding position,
In the vibrator unit, there are three vibration nodes along the longitudinal axis,
The main holding position, the reaction force distribution position, and the floating position are aligned at different positions of the vibration node,
The ultrasonic bonding head, wherein the main holding position and the reaction force dispersion position are arranged in this order from the tip end to the base end of the vibrator unit along the longitudinal axis of the vibrator unit. An ultrasonic bonding apparatus for performing ultrasonic bonding to a portion to be joined by using an ultrasonic bonding head, comprising:
The said ultrasonic bonding head is the ultrasonic bonding head of Claim 1 or 8, The ultrasonic bonding apparatus characterized by the above-mentioned. An ultrasonic bonding method characterized by performing ultrasonic bonding of a portion to be joined using the ultrasonic bonding head according to claim 1 or 8. maintaining the proximal end of the vibrator unit in a cantilever shape along the longitudinal axis of the vibrator unit so that the front end of the vibrator unit becomes a free end along the longitudinal axis;
An ultrasonic bonding method comprising the step of pressing a pressing portion provided at the tip of the vibrator unit against a bonding scheduled portion to be bonded, and causing the pressing portion to ultrasonically vibrate in the longitudinal axis direction, the method comprising:
A position at which the holding part holds the vibrator unit is a main holding position,
A position where the suppression part provided in the holding part abuts against the vibrator unit is a reaction force dispersion position,
When the holding unit sets the position of the auxiliary holding unit for holding the cover covering the vibration source of the vibrator unit as the holding position,
In the vibrator unit, there are three vibration nodes along the longitudinal axis,
The ultrasonic bonding method according to claim 1, wherein the main holding position, the reaction force dispersion position, and the floating position are positioned at different positions of the vibration node.

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