JP4675728B2 - Electronic component joining head and electronic component joining apparatus - Google Patents

Description

  The present invention relates to an electronic component bonding head for bonding a substrate and an electronic component, and an electronic component bonding apparatus including the electronic component bonding head.

  Conventionally, as a method of joining a substrate and an electronic component in a state where the terminal portion formed on the substrate and the electrode portion formed on the electronic component are electrically connected, vibration such as ultrasonic vibration is applied to the electronic component. There is known a bonding method in which an electronic component is pressed and bonded to a substrate while being applied to the substrate. An electronic component bonding apparatus for bonding a substrate and an electronic component by such a bonding method includes a vibration generating unit that generates a predetermined vibration, a vibration amplifying unit that amplifies vibration generated by the vibration generating unit, and a vibration amplifying unit. A joining head having a pressure contact portion that presses the electronic component against the substrate while applying the amplified vibration to the electronic component is provided. Moreover, the vibration part is comprised by the vibration generation part and the vibration amplification part.

  In this type of joining head, when the substrate and the electronic component are joined, a load and vibration are applied to the suction surface (pressure contact surface) of the press contact portion that sucks the electronic component and presses the electronic component against the substrate. For this reason, if the bonding between the substrate and the electronic component is repeated, the suction surface is worn. If the adsorption surface becomes extremely worn, the substrate and the electronic component cannot be joined appropriately, and the pressure contact portion needs to be replaced. Therefore, as this type of joining head, a joining head is proposed in which the press contact portion is configured to be attachable to and detachable from the vibration amplifying portion, and only the press contact portion can be replaced instead of the entire vibration amplifying portion (for example, Patent Documents). 1).

  This patent document 1 discloses a joining head in which a pressure contact portion is detachably attached to a vibration amplification portion by coupling a pressure contact portion to a vibration amplification portion using a screw. That is, Patent Document 1 is configured such that the pressure contact portion can be attached to and detached from the vibration amplification portion by screwing the male screw portion of the bolt inserted into the vibration amplification portion into the female screw portion formed in the block-shaped pressure contact portion. An improved joining head is disclosed.

  Moreover, the joining head disclosed in Patent Document 1 is configured to suck and hold an electronic component before being joined to a substrate. More specifically, first, a suction hole for sucking an electronic component is formed in the pressure contact portion, and a hole portion communicating with the suction hole is formed in the male screw portion of the bolt that attaches the pressure contact portion to the vibration amplifying portion. Yes. The hole is formed in a bowl shape that penetrates from the tip of the male screw portion in the radial direction of the male screw portion. That is, a hole formed from the tip of the male screw part to a predetermined position in the longitudinal direction of the male screw part toward the head of the bolt, and a hole formed in a radial direction at a predetermined position in the longitudinal direction of the male screw part The hole part is formed by communicating. Further, a suction hole communicating with the hole portion in the radial direction of the male screw portion is formed in the vibration amplifying portion, and a suction device is connected to the suction hole via a predetermined pipe. And an electronic component is attracted | sucked to a press-contact part because a suction device attracts | sucks air.

JP 2004-14775 A

  In the configuration in which the electronic component before being bonded to the substrate is sucked and held by the pressure contact portion of the bonding head, the pressure contact portion reliably sucks the electronic component with a predetermined suction force in order to properly bond the substrate and the electronic component. There is a need to. Therefore, it is necessary to appropriately transmit the suction force generated by the suction device to the suction surface on which the electronic component is sucked. In other words, in the case of a configuration in which the electronic component before being bonded to the substrate is sucked and held by the pressure contact portion of the bonding head, the pressure contact portion is formed separately from the vibration amplification portion, and the pressure contact portion is configured to be detachable from the vibration amplification portion. Even in the bonded head, it is necessary to appropriately transmit the suction force generated by the suction device to the suction surface.

  However, in the joining head disclosed in Patent Document 1, a bowl-shaped hole is formed in the male screw portion of the rotating bolt. Further, the suction hole formed in the vibration amplifying part and the hole part formed in the male screw part communicate with each other in the radial direction of the male screw part. For this reason, it is difficult to align the hole and the suction hole, and positional deviation is likely to occur between the hole and the suction hole. Therefore, the problem that a hole and a suction hole cannot be made to communicate appropriately arises. As a result, the suction force generated by the suction device connected to the vibration amplification unit cannot be properly transmitted to the suction surface, and there is a problem that the pressure contact part of the joining head cannot reliably suck the electronic component.

  Therefore, the problem of the present invention is that the suction force generated by the suction device can be appropriately transmitted to the suction surface even if the pressure contact portion can be attached to and detached from the vibration amplification portion (or the vibration portion). It is an object of the present invention to provide an electronic component joining head having a configuration and an electronic component joining apparatus including the electronic component joining head.

In order to solve the above-described problems, the present invention provides a vibration generating unit that generates a predetermined vibration, a vibration amplifying unit that amplifies vibration generated by the vibration generating unit, and an electronic component that amplifies the vibration amplified by the vibration amplifying unit. A male screw part and a female screw part that detachably couple the pressure contact part to the vibration amplifying part in a joining head of the electronic part that joins the board and the electronic part. A suction surface that is formed in the pressure contact portion and sucks the electronic component, and the male screw portion is formed with a suction hole penetrating the male screw portion in the longitudinal direction of the male screw portion in order to suck the electronic component to the suction surface. It is characterized by being. The present invention also provides a vibration generating unit that generates a predetermined vibration, a vibration amplifying unit that amplifies the vibration generated by the vibration generating unit, and a substrate while applying the vibration amplified by the vibration amplifying unit to an electronic component. The electronic component joining head for joining the substrate and the electronic component to each other, and the vibration amplifying unit includes a female screw part detachably coupled to the vibration amplifying unit. The part has a male screw part coupled to the female screw part, an adsorption surface for adsorbing the electronic component, and an adsorption hole penetrating the pressure contact part in the longitudinal direction of the male screw part to adsorb the electronic component to the adsorption surface. Also good.

  In the joining device of the present invention, the male screw part that detachably couples the pressure contact part to the vibration amplification part is formed with an adsorption hole penetrating the male screw part in the longitudinal direction of the male screw part in order to adsorb electronic parts on the adsorption surface. ing. Therefore, even if the suction hole is formed in the male screw part and the male screw part rotates when the pressure contact part is coupled to the vibration amplification part, the positional deviation of the suction hole formed in the male screw part is suppressed. Can do. Therefore, the predetermined piping can be appropriately communicated (connected) to the suction hole. As a result, even if the pressure contact part can be attached to and detached from the vibration amplification part, the suction force generated by the suction device can be appropriately transmitted to the suction surface.

  In the present invention, the press contact portion is composed of a bolt having a head with a suction surface formed at one end and a male screw portion, and the suction hole extends in the longitudinal direction of the male screw portion so that the head also penetrates. Preferably it is formed. In this case, it is preferable that a female screw part is formed in the vibration amplifying part. If comprised in this way, the structure of a press-contact part and the structure of a joining head can be simplified.

  In the present invention, the press contact portion is constituted by a nut in which a female thread portion is formed, and the nut is preferably formed with a nut-side suction hole communicating with the suction hole. If comprised in this way, the structure of a press-contact part can be simplified.

  In order to solve the above-described problems, the present invention includes a vibration part and a pressure contact part to which vibration of the vibration part is transmitted, and presses the electronic component against the substrate while applying the vibration of the pressure contact part to the electronic component. The electronic component joining head for joining the substrate and the electronic component includes a male screw portion and a female screw portion that detachably couple the press contact portion to the vibration portion, and a suction surface that is formed in the press contact portion and sucks the electronic component. The male screw part is characterized in that a suction hole penetrating the male screw part is formed in the longitudinal direction of the male screw part in order to suck the electronic component on the suction surface.

  In the joining device of the present invention, the male screw part that detachably couples the pressure contact part to the vibration part is formed with an adsorption hole penetrating the male screw part in the longitudinal direction of the male screw part in order to adsorb electronic parts to the adsorption surface. Yes. Therefore, even if the suction hole is formed in the male screw part and the male screw part rotates when the pressure contact part is coupled to the vibration part, the positional deviation of the suction hole formed in the male screw part can be suppressed. it can. Therefore, the predetermined piping can be appropriately communicated (connected) to the suction hole. As a result, the suction force generated by the suction device can be appropriately transmitted to the suction surface even if the pressure contact part can be attached to and detached from the vibration part.

The electronic component bonding head of the present invention can be used in an electronic component bonding apparatus including a suction device that is connected to a suction hole and sucks the electronic component. The electronic component bonding apparatus using the electronic component bonding head of the present invention absorbs the suction force generated by the suction device even if the pressure contact portion can be attached to and detached from the vibration amplifying portion (or vibration portion). It is possible to properly transmit to the surface. The present invention also provides a vibration generating unit that generates a predetermined vibration, a vibration amplifying unit that amplifies the vibration generated by the vibration generating unit, and a substrate while applying the vibration amplified by the vibration amplifying unit to an electronic component. The electronic component joining head for joining the substrate and the electronic component to each other, and the vibration amplifying unit includes a male screw portion detachably coupled to the vibration amplifying unit. The portion includes a female screw portion coupled to the male screw portion and a suction surface that sucks an electronic component. The male screw portion includes a first suction hole penetrating the male screw portion in the longitudinal direction of the male screw portion. May have a second suction hole communicating with the first suction hole in order to suck the electronic component on the suction surface. The present invention also provides a vibration generating unit that generates a predetermined vibration, a vibration amplifying unit that amplifies the vibration generated by the vibration generating unit, and a substrate while applying the vibration amplified by the vibration amplifying unit to an electronic component. In the electronic component joining head for joining the substrate and the electronic component, the pressure contacting portion has a head having an adsorption surface formed at one end and a male screw portion. Constructed with bolts, suction holes that penetrate the pressure contact part in the longitudinal direction of the male screw part are formed to adsorb electronic components to the suction surface, and through holes through which the male screw part of the bolt is inserted are formed in the vibration amplification part The pressure contact portion is coupled to a female screw portion formed on an inner peripheral surface of a nut disposed on the upper surface side of the vibration amplifying portion at a tip portion of the male screw portion, with the male screw portion being passed through the through hole from below to above. It is good to be. The present invention also provides a vibration generating unit that generates a predetermined vibration, a vibration amplifying unit that amplifies the vibration generated by the vibration generating unit, and a substrate while applying the vibration amplified by the vibration amplifying unit to an electronic component. In the electronic component joining head for joining the substrate and the electronic component to each other, a through-hole penetrating in the vertical direction is formed in the vibration amplifying portion. The male screw part of the bolt in which the first suction hole penetrating in the longitudinal direction of the male screw part is formed is inserted from the upper side to the lower part, and the press contact part includes the female screw part coupled to the male screw part and the electronic component. A suction surface for suction may be provided, and the suction surface may include a second suction hole communicating with the first suction hole in order to suck the electronic component on the suction surface.

  As described above, in the electronic component bonding head and the electronic component bonding apparatus according to the present invention, even if the pressure contact portion can be attached to and detached from the vibration amplifying portion (or the vibration portion), it is generated by the suction device. It is possible to properly transmit the suction force to the suction surface.

  Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings.

(Schematic configuration of electronic component joining device)
FIG. 1 is a plan view showing a schematic configuration of a main part of an electronic component bonding apparatus 1 according to an embodiment of the present invention. FIG. 2 is a diagram illustrating a schematic configuration of a main part of the bonding apparatus 1 from the EE direction in FIG. 1. FIG. 3 is a diagram illustrating a schematic configuration of a main part of the bonding apparatus 1 from the FF direction in FIG. 1.

  An electronic component bonding apparatus 1 (hereinafter referred to as “bonding apparatus 1”) of this embodiment includes a terminal portion 3 (see FIG. 1) formed on a substrate 2 and an electrode portion formed on the electronic component 4. The electronic component 4 is configured to be pressed and joined to the substrate 2 while applying ultrasonic vibration to the electronic component 4 in a state where the electronic component 4 is in contact with the electronic component 4 (not shown). As shown in FIGS. 1 to 3, the bonding apparatus 1 includes a bonding mechanism unit 6 having a bonding head 5 for bonding the substrate 2 and the electronic component 4, and a conveyance mechanism unit 7 for conveying the substrate 2 in a predetermined direction. And a mounting mechanism portion 9 for mounting a plurality of semiconductor wafers 8 formed in a state where the electronic components 4 before bonding are divided into a mesh shape, and the electronic components 4 are taken out from the semiconductor wafer 8 and transferred to the bonding head 5. Positioning of the component supply mechanism 10 for supplying the component 4, the mounting table 11 on which the substrate 2 is placed when the electronic component 4 is bonded to the substrate 2, and the positioning of the terminal 3 and the electronic component 4 on the substrate 2 An imaging mechanism unit (not shown). Further, the bonding apparatus 1 includes a suction device 35 for sucking the electronic component 4 to the bonding head 5.

  In the following, the left-right direction in FIG. 1 is denoted as the X direction, the up-down direction is denoted as the Y direction, and a plane composed of the X direction and the Y direction is denoted as the XY plane. Further, the direction perpendicular to the paper surface of FIG.

  The substrate 2 in this embodiment is, for example, a COF (Chip On Film or Chip On Flexible Circuit Board) tape that is a flexible resin substrate. Moreover, the electronic component 4 in this embodiment is a small IC chip, for example. More specifically, the electronic component 4 is a small IC chip formed in a square of 5.8 mm square or less, for example. The substrate 2 may be a flexible resin substrate other than the COF tape or a substrate with high hardness such as ceramics. The electronic component 4 connected and fixed to the substrate 2 is not limited to an IC chip, and may be another electronic component such as a surface acoustic wave element or a resistance element.

  As shown in FIG. 1, the board | substrate 2 is formed in elongate shape, and the terminal part 3 is arrange | positioned by the predetermined space | interval on the surface. For joining the electronic component 4 and the substrate 2 (more specifically, joining the electrode portion of the electronic component 4 and the terminal portion 3), the substrate 2 is predetermined in the X direction (the right direction in FIG. 1 in this embodiment). It is performed in a state in which it is transported for an interval and stopped. Specifically, the conveyance and stop of the substrate 2 are repeatedly performed, and the substrate 2 and the electronic component 4 are joined one after another. The substrate 2 is divided at a predetermined position through a predetermined process after the electronic component 4 is bonded.

  The joining mechanism unit 6 is configured such that the joining head 5 can move in the height direction, the X direction, and the Y direction. More specifically, the joining mechanism unit 6 includes an elevating mechanism unit 13 (see FIG. 3) that raises and lowers the joining head 5 in the height direction, and a moving mechanism unit that moves the elevating mechanism unit 13 in the X direction and the Y direction ( (Not shown). As shown in FIG. 3, the elevating mechanism unit 13 includes a motor 14, a ball screw (not shown), a linear guide (not shown), and a frame 15 to which these are fixed. The elevating mechanism unit 13 includes a head fixing unit 16 that moves up and down together with the bonding head 5. Similarly, the moving mechanism unit not shown includes a motor, a ball screw, a linear guide, and a frame to which these are fixed. In FIG. 1 and FIG. 2, the lifting mechanism unit 13 is not shown for convenience. The detailed configuration of the bonding head 5 will be described later.

  The transport mechanism unit 7 includes a transport guide 17 (see FIGS. 1 and 3) that guides both ends of the substrate 2 in the Y direction in the transport direction (X direction), and a substrate transport mechanism (not shown) that transports the substrate 2. ing. The substrate transport mechanism is engaged with engagement holes (not shown) formed on both ends of the substrate 2 in the Y direction and drives the engagement protrusions (not shown) for transporting the substrate 2 in the X direction and the engagement protrusions. Motor (not shown) and the like, and is configured to transport the substrate 2 at predetermined intervals in the X direction.

  The mounting mechanism unit 9 is configured so that the semiconductor wafer 8 can move in the X direction and the Y direction. More specifically, the mounting mechanism unit 9 includes a moving mechanism unit (not shown). The moving mechanism unit allows the semiconductor wafer 8 to move in the X direction and the Y direction.

  As shown in FIGS. 1 to 3, the component supply mechanism unit 10 includes a suction unit 18 that sucks the electronic component 4, and a moving mechanism that moves the suction unit 18 between the joining mechanism unit 6 and the mounting mechanism unit 9. Part 19 and an elevating mechanism part 20 for elevating and lowering the moving mechanism part 19 in the height direction.

  The suction portion 18 is formed with a suction hole (not shown) communicating with a suction device (not shown), and one electronic component 4 is sucked into the suction hole.

  The moving mechanism unit 19 includes a long arm 21 with the suction unit 18 fixed to the distal end side, a motor 22 that drives the arm 21, and a gear that transmits the driving force of the motor 22 to the base end side of the arm 21 ( And a frame 23 on which is omitted). As shown in FIG. 1, in the arm 21, the suction portion 18 swings about 90 ° in parallel with the XY plane between the joining mechanism portion 6 and the mounting mechanism portion 9 with the rotation axis of the motor 22 as the swing center. Is configured to do. Further, the arm 21 is configured to rotate 180 degrees around the rotation center of the arm 21 while rotating so as to turn the suction portion 18 upside down. That is, the arm 21 is configured to reverse the front and back of the electronic component 4 sucked by the suction portion 18 while rotating. A gear disposed on the frame 23 is configured so that the swinging operation and the reversing operation of the arm 21 are performed by a single motor 22.

  The elevating mechanism unit 20 includes a motor 25, a ball screw (not shown), a linear guide (not shown), and a frame 26 to which these are fixed. Moreover, the moving mechanism fixing | fixed part 27 which goes up and down with the moving mechanism part 19 is provided.

  The imaging mechanism unit (not shown) includes a camera unit having a predetermined optical system and imaging unit, an image processing device that processes an image captured by the camera unit, and the like. Then, the bonding mechanism unit 6 finely adjusts the position of the bonding head 5 holding the electronic component 4 based on the processing result in the image processing apparatus, so that the terminal unit 3 and the electronic component 4 on the substrate 2 The position is adjusted.

  The suction device 35 is, for example, a vacuum pump, and is connected to the joining head 5 (more specifically, the head fixing portion 16 as shown in FIG. 3) via a predetermined pipe 36.

(Configuration of electronic component joining head)
FIG. 4 is a partial sectional side view showing the bonding head 5 of the electronic component shown in FIG. FIG. 5 is a bottom view showing the joining head 5 of the electronic component from the GG direction of FIG. FIG. 6 is an enlarged side view showing a state when the pressure contact portion 32 is attached to the vibration amplifying portion 31 shown in FIG.

  The bonding head 5 is configured to bond the substrate 2 and the electronic component 4 by generating ultrasonic vibration. The bonding head 5 includes a vibration generating unit 30 composed of a vibrator such as a piezoelectric element serving as a generation source of ultrasonic vibrations, and a vibration amplifying unit 31 composed of a vibration horn that amplifies ultrasonic vibrations generated by the vibration generating unit 30. The vibration generating section 30 is connected to the pressure contact section 32 that presses the electronic component 4 against the substrate 2 while applying the vibration amplified by the vibration amplifying section 31 to the electronic component 4, and the vibration generating section 30 and the vibration amplifying section 31. And a vibration transmission unit 33 formed of a vibration cone for transmitting the vibration generated in (1) to the vibration amplification unit 31. Further, the joining head 5 includes a washer 34 as an interposed member interposed between a later-described head 32 a constituting the press contact portion 32 and the vibration amplifying portion 31. In this embodiment, the vibration generating unit 30 and the vibration amplifying unit 31 constitute a vibration unit.

  As shown in FIG. 4 and the like, both the vibration generating unit 30 and the vibration transmitting unit 33 are formed in a substantially rectangular parallelepiped shape, and the vibration transmitting unit 33 is fixed to the right side of the vibration generating unit 30 in the figure.

  The vibration amplifying unit 31 is made of a material such as powder high speed steel, alloy tool steel, or beryllium copper. As shown in FIGS. 4 and 5, the vibration amplifying unit 31 includes a substantially rectangular parallelepiped first vibration amplifying unit 31a fixed to the right side of the vibration transmitting unit 33 and a right side of the first vibration amplifying unit 31a. A substantially rectangular parallelepiped second vibration amplifying portion 31b extending in the right direction in the figure from the surface is configured. The first vibration amplifying unit 31a and the second vibration amplifying unit 31b are integrally formed.

  As shown in FIG. 4, the height of the first vibration amplification unit 31a is higher than the height of the second vibration amplification unit 31b. As shown in FIG. 5, the width of the first vibration amplification unit 31a in the Y direction is wider than the width of the second vibration amplification unit 31b in the Y direction. For example, the height or Y-direction width of the first vibration amplification unit 31a is 1.2 times the height or Y-direction width of the second vibration amplification unit 31b.

  A through hole 31c penetrating in the height direction is formed at a substantially central position of the first vibration amplifying portion 31a. Female threads are formed on the inner peripheral surface of the through hole 31c in the entire height direction, and the inner peripheral surface of the through hole 31c is a female thread portion 31d. Moreover, the upper end of FIG. 4 of the through-hole 31c is connected to the suction device 35 through the piping 36 as shown in FIG.

  The press contact portion 32 of this embodiment is a bolt formed of a heat-treated stainless steel, chrome molybdenum steel, or the like, and, as shown in FIG. 4, a head 32a and a male screw portion 32b. More specifically, as shown in FIG. 5, the press contact portion 32 is a hexagonal bolt having a head portion 32 a formed in a hexagonal shape. In this embodiment, the distance H between two parallel side surfaces of the head portion 32a is, for example, 5.5 mm (see FIG. 5).

  A suction hole 32c, which is a circular hole penetrating in the height direction (longitudinal direction of the pressure contact portion 32), is formed at a substantially central position of the pressure contact portion 32 in order to suck the electronic component 4. That is, in order to suck the electronic component 4 in the male screw portion 32b, a suction hole 32c penetrating the male screw portion 32b is formed in the longitudinal direction (height direction) of the male screw portion 32b. The suction hole 32c is formed of the male screw portion 32b. The head 32a also penetrates in the longitudinal direction. And the lower surface of the head part 32a in FIG. 4 becomes the adsorption | suction surface 32d which adsorb | sucks the electronic component 4. FIG. Further, as shown in FIG. 4, the suction hole 32c communicates with the through hole 31c. That is, the suction hole 32c is connected to the suction device 35 via the through hole 31c and the pipe 36, and the suction device 35 holds the electronic component 4 to the suction surface via the pipe 36, the through hole 31c and the suction hole 32c. Suction is performed toward 32d.

  In the present embodiment, the male screw portion 32b is screwed into the female screw portion 31d from the lower side of FIG. 4, so that the press contact portion 32 can be attached to and detached from the first vibration amplifying portion 31a. That is, the pressure contact portion 32 is detachably coupled to the first vibration amplifying portion 31a by screw coupling between the female screw portion 31d and the male screw portion 32b. As shown in FIG. 4, the coupling length L between the female screw portion 31d and the male screw portion 32b is, for example, 8 mm.

  The washer 34 is formed of a metal material whose hardness is lower than that of the press contact portion 32. More specifically, the washer 34 is made of brass, for example. The washer 34 is formed in a thin flat ring shape. The thickness of the washer 34 is, for example, 0.1 mm to 0.5 mm. Then, as shown in FIG. 6, the female screw portion 31 d and the male screw portion 32 b are screw-coupled in a state where the male screw portion 32 b of the press contact portion 32 is inserted into the inner peripheral side of the washer 34. Further, it is deformed (plastic deformation and / or elastic deformation) when the female screw portion 31d and the male screw portion 32b are coupled to each other, and is in close contact with the lower surface of the first vibration amplifying portion 31a and the upper surface of the pressure contact portion 32.

  The diameter of the washer 34 may be smaller than the outer shape of the head portion 32a as shown in FIG. 4, or may be larger than the outer shape of the head portion 32a as shown in FIG. Further, the diameter of the washer 34 may be the same as the outer shape of the head portion 32a.

(Schematic operation of electronic device joining device)
The joining apparatus 1 configured as described above joins the substrate 2 and the electronic component 4 as follows.

  First, the component supply mechanism unit 10 takes out one electronic component 4 from the semiconductor wafer 8 on which a plurality of electronic components 4 in a state of being divided into a mesh are formed, and supplies the taken electronic component 4 to the bonding head 5. . More specifically, first, the suction unit 18 lowered to the top of the semiconductor wafer 8 by the elevating mechanism unit 20 sucks one electronic component 4. Thereafter, the suction unit 18 is lifted by the elevating mechanism unit 20, and is turned upside down by the moving mechanism unit 19 while rotating in parallel with the XY plane, and moves to the lower side of the bonding head 5.

  In this state, the suction unit 18 is further raised by the lifting mechanism unit 20, and the suction surface 32 d of the press contact part 32 sucks the electronic component 4, so that the joining head 5 receives the electronic component 4 from the suction unit 18 and sucks it. The electronic component 4 is held on the surface 32d. More specifically, the suction device 35 sucks the electronic component 4 toward the suction surface 32d through the pipe 36, the through hole 31c, and the suction hole 32c, so that the joining head 5 is moved from the suction portion 18 to the electronic component. 4 is received, and the electronic component 4 is held on the suction surface 32d.

  On the other hand, the transport mechanism unit 7 transports the substrate 2 to a predetermined position. That is, the transport mechanism unit 7 is arranged so that the position of the electrode part (not shown) of the electronic component 4 sucked and held on the suction surface 32d of the bonding head 5 and the terminal part 3 on the substrate 2 substantially coincide with each other. 2 is transported. In this state, the imaging mechanism unit performs shooting and image processing. Based on the imaging result of the imaging mechanism unit, the joining mechanism unit 6 finely adjusts the position of the electronic component 4 to position the electrode unit (not shown) of the electronic component 4 and the terminal unit 3 on the substrate 2. Match.

  When the alignment between the electronic component 4 and the terminal unit 3 is completed, the camera unit constituting the imaging mechanism unit is retracted. Thereafter, the joining head 5 is lowered by the elevating mechanism 13 and the electronic component 4 held by the suction surface 32d is pressed against the terminal portion 3 while being pressed (pressing), and ultrasonic vibration is applied to the electronic component 4. Then, the substrate 2 and the electronic component 4 are joined. At the time of this joining, for example, ultrasonic vibration having a frequency of 10 kHz to 60 kHz is applied to the electronic component 4. At the time of bonding the substrate 2 and the electronic component 4, the substrate 2 is mounted on the mounting table 11, and the mounting table 11 receives the pressure of the bonding head 5.

  When the joining of the substrate 2 and the electronic component 4 is completed, the joining head 5 is raised, and the transport mechanism unit 7 transports the substrate 2 by a predetermined interval. Further, the component supply mechanism section 10 supplies the next electronic component 4 to the bonding head 5, and the bonding mechanism section 6 bonds the substrate 2 and the next electronic component 4 in the same manner as described above. Before the component supply mechanism unit 10 takes out the next electronic component 4 from the semiconductor wafer 8, the mounting mechanism unit 9 moves the semiconductor wafer 8 in the X direction and / or the Y direction, and the suction unit 18 moves to the next. The electronic component 4 can be sucked.

(Main effects of this form)
As described above, in the bonding apparatus 1 according to the present embodiment, the male screw portion 32b that detachably couples the press contact portion 32 to the first vibration amplification portion 31a has the male screw portion for adsorbing the electronic component 4 to the adsorption surface 32d. A suction hole 32c is formed through the male screw portion 32b in the longitudinal direction of 32b. Therefore, even if the male screw portion 32b rotates when the pressure contact portion 32 is coupled to the first vibration amplification portion 31a, the position of the suction hole 32c does not shift in the X direction and the Y direction. Therefore, the suction hole 32c can be appropriately communicated with the through hole 31c. That is, the suction hole 32 c can be appropriately connected to the suction device 35 through the through hole 31 c and the pipe 36. As a result, even if the pressure contact portion 32 can be attached to and detached from the first vibration amplifying portion 31a, the suction force generated by the suction device 35 can be appropriately transmitted to the suction surface 32d.

  In this embodiment, the pressure contact portion 32 is constituted by a bolt having a head portion 32a having a suction surface 32d formed at one end and a male screw portion 32b, and the suction hole 32c is a longitudinal direction of the male screw portion 32b. The part 32a is also formed so as to penetrate therethrough. Therefore, it is possible to appropriately transmit the suction force generated by the suction device 35 to the suction surface 32d while simplifying the configuration of the press contact portion 32.

  In this embodiment, a female screw part 31d is formed in the first vibration amplification part 31a. Therefore, the pressure contact portion 32 can be detachably coupled to the first vibration amplification portion 31a by the two parts of the first vibration amplification portion 31a and the pressure contact portion 32. As a result, the configuration of the bonding head 5 can be simplified.

(Other embodiments)
The above-described embodiment is an example of a preferred embodiment of the present invention, but is not limited thereto, and various modifications can be made without departing from the scope of the present invention. For example, in the form mentioned above, the internal peripheral surface of the through-hole 31c formed in the 1st vibration amplification part 31a is the internal thread part 31d. In addition to this, for example, as shown in FIG. 7, a nut 41 is disposed on the upper surface side of the first vibration amplifying portion 31a without forming an internal thread on the inner peripheral surface of the through hole 31c, and is inserted into the through hole 31c. The pressure contact portion 32 is detachably coupled to the first vibration amplifying portion 31a by screw coupling of the distal end portion of the male screw portion 32b of the pressure contact portion 32 and the female screw portion 41d formed on the inner peripheral surface of the nut 41. May be. In this case, the nut 41 may be configured to be connected to the suction device 35 via the pipe 36. Even in such a configuration, the suction hole 32c can be appropriately connected to the suction device 35 via the pipe 36, and the suction force generated by the suction device 35 is appropriately transmitted to the suction surface 32d. be able to.

  Moreover, in the form mentioned above, although the press-contact part 32 is a hexagon bolt, as shown in FIG. 8, you may comprise the press-contact part 42 with a hexagon nut, for example. On the inner peripheral side of the press contact portion 42, a female screw is formed on the wall surface of the recess formed at a predetermined depth from the upper end of FIG. 8, and the portion where the female screw is formed is a female screw portion 42d. Further, a nut-side suction hole 42c that communicates from the lower end to the recess in FIG. 8 is formed in the press contact portion 42, and the illustrated lower surface of the press contact portion 42 serves as a suction surface 42b. In this case, the bolt 43 having the head 43a and the male screw 43b as well as the hexagonal bolt constituting the press contact portion 32 in the above-described form and having the suction hole 43c formed thereon is connected to the upper surface of the first vibration amplifying unit 31a. The pressure contact portion 42 is inserted into the through-hole 31c where no female screw is formed from the side, and the pressure contact portion 42 is connected to the first vibration amplifying portion 31a by screw coupling between the tip side portion of the male screw portion 43b of the bolt 43 and the female screw portion 42d of the pressure contact portion 42. It suffices to detachably connect to. In this case, the suction hole 43c of the bolt 43 may be configured to be connected to the suction device 35 via the pipe 36. Even in such a configuration, the suction hole 43c can be appropriately connected to the suction device 35 via the pipe 36, and the suction force generated by the suction device 35 is supplied to the pipe 36, the suction hole 43c, and It can be appropriately transmitted to the suction surface 42b via the nut side suction hole 42c.

  Further, as shown in FIG. 9, a male screw part 31e is formed so as to protrude downward from the lower surface of the first vibration amplifying part 31a, and the screw coupling between the female screw part 42d and the male screw part 31e of the pressure contact part 42 described above is performed. Accordingly, the pressure contact portion 42 may be detachably coupled to the first vibration amplifying portion 31a. In this case, as shown in FIG. 9, in order to adsorb the electronic component 4 to the adsorption surface 42c, an adsorption hole 31f penetrating in the height direction may be formed in the first vibration amplifying part 31a and the male screw part 31e. In this case, the suction hole 31f may be configured to be connected to the suction device 35 via the pipe 36. Even in such a configuration, the suction hole 31f can be appropriately connected to the suction device 35 via the pipe 36, and the suction force generated by the suction device 35 is supplied to the pipe 36, the suction hole 31f, and It can be appropriately transmitted to the suction surface 42b via the nut side suction hole 42c.

  Further, as shown in FIGS. 8 and 9, when the press contact portion 42 is configured by a nut in which the female screw portion 42d and the nut side suction hole 42c are formed, the configuration of the press contact portion 42 can be simplified.

  Furthermore, the shape of the vibration amplifying unit 31 is not limited to the shape described in the above-described embodiment, and may be, for example, a shape as shown in FIG. That is, the vibration amplifying unit includes the first vibration amplifying unit 31a described above, and two substantially rectangular parallelepiped second vibration amplifying units 51b and 51b extending from both side surfaces in the X direction of the first vibration amplifying unit 31a to the outside in the X direction. May be a vibration amplifying part 51 formed integrally.

  Moreover, with the form mentioned above, the head part 32a of the press-contact part 32 is formed in the hexagon. In addition, for example, the head portion of the press contact portion 32 may be an octagonal head portion 52a as shown in FIG. The head 52a is formed with a suction hole 52c for sucking the electronic component 4, and one end surface of the head 52a is a suction surface 52d. Furthermore, the head of the press contact part 32 may be formed in a polygon other than a hexagon or an octagon. Furthermore, as shown in FIG. 11 (B), the head portion of the press contact portion 32 has a shape having two parallel torque transmission surfaces 62b and 62b formed by cutting out a flat cylinder by two parallel surfaces. The head 62a may be used. The head 62a is formed with a suction hole 62c for sucking the electronic component 4, and one end surface of the head 62a is a suction surface 62d. Similarly, the shape of the press contact portion 42 shown in FIGS. 8 and 9 may be an octagon or other polygons, or may be a shape shown in FIG.

  Furthermore, the configuration of the present invention can also be applied to a joining head that does not have the vibration amplifying unit 31 and in which the press contact portion 32 is detachably attached to the vibration generating unit 30.

It is a top view which shows schematic structure of the principal part of the joining apparatus of the electronic component concerning embodiment of this invention. It is a figure which shows schematic structure of the principal part of a joining apparatus from the EE direction of FIG. It is a figure which shows schematic structure of the principal part of a joining apparatus from the FF direction of FIG. FIG. 2 is a partial cross-sectional side view showing a joining head of the electronic component shown in FIG. 1. It is a bottom view which shows the joining head of an electronic component from the GG direction of FIG. It is an enlarged side view which shows the state at the time of attachment of the press-contact part to the vibration amplification part shown in FIG. It is a fragmentary sectional side view which shows the joining head concerning other embodiment of this invention. It is a fragmentary sectional side view which shows the joining head concerning other embodiment of this invention. It is a fragmentary sectional side view which shows the joining head concerning other embodiment of this invention. It is a fragmentary sectional side view which shows the joining head concerning other embodiment of this invention. It is a top view which shows the other shape of the head of the press-contact part in the joining head used with the joining apparatus shown in FIG.

Explanation of symbols

1 Joining device (Electronic component joining device)
2 Substrate 4 Electronic component 5 Bonding head (Electronic component bonding head)
30 Vibration generation part (part of vibration part)
31, 51 Vibration amplification part (part of vibration part)
31d, 41d, 42d Female thread part 32, 42 Pressure contact part 32a, 52a Head part 32b, 43b, 31e Male thread part 32c, 43c, 31f Suction hole 32d, 42b, 52d, 62d Suction surface 35 Suction device 42c Nut side suction hole

Claims (6)

A vibration generating unit that generates a predetermined vibration, a vibration amplifying unit that amplifies the vibration generated by the vibration generating unit, and press-contacting the electronic component against the substrate while applying the vibration amplified by the vibration amplifying unit to the electronic component An electronic component joining head for joining the substrate and the electronic component.
The vibration amplifying unit includes a female screw part that removably couples the pressure contact part to the vibration amplifying part,
The pressure contact portion penetrates the pressure contact portion in a longitudinal direction of the male screw portion in order to adsorb the electronic component to the suction surface, and a suction surface for sucking the electronic component, and a male screw portion coupled to the female screw portion. With suction holes,
An electronic component joining head characterized by the above.   The pressure contact portion includes a head on which the suction surface is formed at one end and a bolt on which the male screw portion is formed. The suction hole penetrates the head in the longitudinal direction of the male screw portion. The electronic component joining head according to claim 1, wherein the electronic component joining head is formed as described above.   A vibration generating unit that generates a predetermined vibration, a vibration amplifying unit that amplifies the vibration generated by the vibration generating unit, and press-contacting the electronic component against the substrate while applying the vibration amplified by the vibration amplifying unit to the electronic component An electronic component joining head for joining the substrate and the electronic component.
  The vibration amplifying part includes a male thread part that removably couples the pressure contact part to the vibration amplifying part,
  The press contact portion includes a female screw portion coupled to the male screw portion and a suction surface that sucks the electronic component,
  The male screw part includes a first suction hole penetrating the male screw part in a longitudinal direction of the male screw part,
  The suction surface includes a second suction hole that communicates with the first suction hole to suck the electronic component onto the suction surface.
  An electronic component joining head characterized by the above.   A vibration generating unit that generates a predetermined vibration, a vibration amplifying unit that amplifies the vibration generated by the vibration generating unit, and press-contacting the electronic component against the substrate while applying the vibration amplified by the vibration amplifying unit to the electronic component An electronic component joining head for joining the substrate and the electronic component.
  The pressure contact portion includes a head having a suction surface formed at one end and a bolt on which a male screw portion is formed. The pressure contact portion is disposed in the longitudinal direction of the male screw portion in order to suck the electronic component onto the suction surface. An adsorption hole penetrating the part is formed,
  The vibration amplification part is formed with a through hole through which the male screw part of the bolt is inserted,
  The pressure contact portion is a female screw portion formed on the inner peripheral surface of a nut disposed on the upper surface side of the vibration amplifying portion at a tip portion of the male screw portion, with the male screw portion being passed through the through hole from below to above. Bound to the
  An electronic component joining head characterized by the above.   A vibration generating unit that generates a predetermined vibration, a vibration amplifying unit that amplifies the vibration generated by the vibration generating unit, and press-contacting the electronic component against the substrate while applying the vibration amplified by the vibration amplifying unit to the electronic component An electronic component joining head for joining the substrate and the electronic component.
  The vibration amplification part is formed with a through-hole penetrating in the vertical direction,
  In the through hole, the male screw part of the bolt in which the first suction hole that has a head at one end and penetrates in the longitudinal direction of the male screw part is formed is inserted from above to below,
  The pressure contact portion includes a female screw portion coupled to the male screw portion and a suction surface that sucks the electronic component, and the suction surface has the first suction hole for sucking the electronic component to the suction surface. A second suction hole communicating with the
  An electronic component joining head characterized by the above. 6. An electronic component bonding apparatus comprising: the electronic component bonding head according to claim 1; and a suction device that is connected to the suction hole and sucks the electronic component.

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